Basic PWB Fabrication 2006

T H E P R E M I E R E M S C O M P A N Y
S
a
n
m
i
n
a
-
S
C
I

C
o
n
f
i
d
e
n
t
i
a
l

C
o
p
y
r
i
g
h
t

2
0
0
4

S
a
n
m
i
n
a
-
S
C
I

A
l
l

R
i
g
h
t
s

R
e
s
e
r
v
e
d
Basic PWB Manufacturing Basic PWB Manufacturing
How a Printed Circuit How a Printed Circuit
Board is Built Board is Built
PCB Operations PCB Operations
Basic PWB Manufacturing
Basic PWB Manufacturing
PWB Fabrication Process Flow
Pre-Engineering
Inner Layers
Outer Layers
Tools Created
Key:
Central Modem
Retrieve Data
Document Control
Product Engineering
Panelization
CAM Tool I/Ls
Plot/Insp/Rel I/Ls
CAM Tools O/Ls & SMs
Plot/Insp/Rel O/Ls
Plot/Insp/Rel SMs
Plot/Insp/Rel Legend
Customer Data
Drill / Deburr
Desmear / Cu Deposition
Resist Coat / Image O/Ls
Cu & Pb/Sn Plate
Strip / Etch / Strip
LPI Soldermask
Final Metal Finish
Print Legend
Depanelize
E.T. / Final Insp.
Cut / Preclean Cores
A.O.I Cores
D/E/S Cores
Oxide Coat Cores
Kit/Laminate/Fab Blanks
Resist Coat / Image Cores
N/C Drill Programming
First Piece Drill
Insp/Rel Drill
N/C Rout Program
First Piece Rout
Insp/Rel Rout
E.T. Program
Build E.T. Fixture
Insp / Rel. E.T. Fixture
Pack / SHIP
Front-End Engineering
Engineering
Gerber-Created Details:
Copper Layer Artwork
Mask and Legend Artwork
Drill Files
Rout Files
AOI Comparative Files
Electrical Test
Fixture (if dedicated type)
Netlist Comparative Files
Floor Traveler
Other Input Sources:
Customer Acceptance Specification
Telcordia (formerly Bellcore)
UL (1950, 60950, etc.)
IPC (as cited or required by
Customer Specification)
RoHS (EU Leadfree Initiative)
SSCI Fab Plant Specification
CAM (Computer-Aided
Manufacturing)
Work station
Central Modem
Retrieve Data
Document Control
Product Engineering
Panelization
CAM Tool I/Ls
Plot/Insp/Rel I/Ls
CAM Tools O/Ls & SMs
Plot/Insp/Rel O/Ls
Plot/Insp/Rel SMs
Plot/Insp/Rel Legend
Customer Data
Laminate
Laminate
Laminate
(dielectric)
Copper Foil
Core (C-stage) is fully cured and copper clad laminate
Dielectric thickness and copper weights per print/stackup
Copper cladding becomes the innerlayers in standard process
Cores available from 0.001to 0.125thick
Core layers are cut from laminators larger master sheet
A.O.I Cores
D/E/S Cores
Oxide Coat Cores
Resist Coat
Resist Coat
Photoresist
Cores are chemically cleaned
Photosensitive dry film is applied to
both sides with heated rollers
Dry film acts as etch resist in imaging process
A.O.I Cores
D/E/S Cores
Oxide Coat Cores
Image & Develop
Image & Develop
Artwork
Both sides are exposed to high intensity UV light
through silver halide circuit artwork
Dry film polymerizes (hardens) where UV light hits
Unexposed areas are developed away
A.O.I Cores
D/E/S Cores
Oxide Coat Cores
Image & Develop
Image & Develop
Ultraviolet photographic
exposure units
DES line (Develop-Etch-Strip)
A.O.I Cores
D/E/S Cores
Oxide Coat Cores
Etch
Etch
Cores pass through cupric
chloride etch
Unprotected copper is attacked and
removed by the etchant
Conveyor speed is determined by
copper weights being etched
A.O.I Cores
D/E/S Cores
Oxide Coat Cores
Strip Resist
Strip Resist
Dry film is chemically stripped off of etched
features
Circuitry now appears in copper
Multilayer tooling slots are now punched into
cores using Post-Etch Punch
Camera targeted for accuracy
Compensates for layer movement by
positioning holes relative to true layer center
A.O.I Cores
D/E/S Cores
Oxide Coat Cores
AOI
AOI
Automatic Optical Inspection

Automatic Optical Inspection
AOI faults detected include:
Extra copper
Missing copper
Linewidth reductions
Debris
Mechanical damage
Unstripped dryfilm resist
A.O.I Cores
D/E/S Cores
Oxide Coat Cores
AOI
AOI
Verification Station
Verification Station
Cores with faults detected
are moved along with error
file data to a Verification
Station to confirm genuine
faults vs. false errors and
evaluate if repairable
A.O.I Cores
D/E/S Cores
Oxide Coat Cores
Oxide Coat Surface Treatment
Oxide Coat Surface Treatment
Cores are oxide-coated on hoist-
driven wet process line
Oxide forms jagged crystalline
surface topography for better bond
Residual moisture must be baked
out of cores before laminating
A.O.I Cores
D/E/S Cores
Oxide Coat Cores
Stackup & Lamination
Prepreg
Prepreg
Prepreg
Core
Layers 2/3
2
3
Core
Layers 4/5
4
5
Cu Foil
Layer 1
1
Cu Foil
Layer 6
6
4
BLANK
Etched cores move to kitting (lay up)
Outerlayers are typically applied as bare copper foil sheet
Prepreg ( B-stage ) are bonding plies placed between cores and
under outerlayer copper foils
Cores and prepregs are stacked on metal pins at the post-etch
punched slot positions
Several boards go into typical book
Heavy steel press plates go on top & bottom of book
Pressed item is referred to as blank
A.O.I Cores
D/E/S Cores
Oxide Coat Cores
Kitting or lay up
rooms
Vacuum-assisted lamination press
Books go into vacuum-assisted presses
Air is removed and book is pressed
together under heat and pressure
After pressing, books are broken down
into individual board blanks
Edge flow (Flash) is trimmed away
A.O.I Cores
D/E/S Cores
Oxide Coat Cores
Copper Foil
Laminate
Innerlayer
Drill & Deburr
Drill & Deburr
Blanks are stackup on pins located in drill machine table
Stacks are drilled with carbide bits on N/C drill machines
Machines automatically change drill sizes per program
Drills are available from 0.006to 0.250diameter
X-ray is used to determine that holes are aligned in pads
Panels are deburred and cleaned after drilling
Drill / Deburr
Cu & Pb/Sn Plate
LPI Soldermask
Final Metal Finish
Print Legend
Depanelize
E.T. / Final Insp.
Drill, Deburr, & Hole Inspection
Drill, Deburr, & Hole Inspection
Desmear & Copper Deposition
Desmear & Copper Deposition
Electroless
Copper Plate
Heat of drilling can melt & smear resin on hole walls
Smear is chemically removed to assure circuit to hole
plated connection
Desmear also lightly roughens hole wall for better plating
adhesion
Initial copper plated deposition is thin electroless (cuposit)
Electroless provides conductive path for subsequent
electrolytic copper plating
Drill / Deburr
Cu & Pb/Sn Plate
LPI Soldermask
Final Metal Finish
Print Legend
Depanelize
E.T. / Final Insp.
Coat, Image & Develop
Coat, Image & Develop
Photoresist
Artwork
Photosensitive dry film is applied to both sides of blank
with heated rollers similar to inner layer cores
Both sides are exposed to high intensity UV light
through silver halide circuit artwork
Dry film polymerizes (hardens) where UV light hits film
is opposite polarity from inner layer process
Drill / Deburr
Cu & Pb/Sn Plate
LPI Soldermask
Final Metal Finish
Print Legend
Depanelize
E.T. / Final Insp.
Copper & Solder Plate
Etch Resist Metal
(Tin/Lead - Solder)
Electroplated
Copper
Electrolytic copper is plated in holes and on all artwork-
defined outer circuit features
Copper deposition is typically 0.001thick on hole wall
Tin-lead solder is plated on top of copper in hole and on
outer features to act as etch-barrier (all boards have tin-
lead on them at this point in process)
Copper and solder plating is done with computer-
controlled hoist-driven plating line
Drill / Deburr
Cu & Pb/Sn Plate
LPI Soldermask
Final Metal Finish
Print Legend
Depanelize
E.T. / Final Insp.
Drill / Deburr
Cu & Pb/Sn Plate
LPI Soldermask
Final Metal Finish
Print Legend
Depanelize
E.T. / Final Insp.
Etch Resist Metal
(Tin/Lead - Solder)
Electroplated
Copper
Strip
Strip
Photoresist
Photoresist
Dry film resist is now chemically stripped away
in DES line exposing unwanted copper areas
Needed circuitry remains coated with tin-lead
Drill / Deburr
Cu & Pb/Sn Plate
LPI Soldermask
Final Metal Finish
Print Legend
Depanelize
E.T. / Final Insp.
Etch
Etch
The unwanted and exposed copper areas
are now etched away with an alkaline-based
etch
Needed circuitry remains, protected by tin-
lead
The board circuitry is now complete all
electrical connections now defined and
integrated
Drill / Deburr
Cu & Pb/Sn Plate
LPI Soldermask
Final Metal Finish
Print Legend
Depanelize
E.T. / Final Insp.
Solder Strip
Solder Strip
The tin/lead that was protecting the traces, pads, and hole
barrels from being etched is chemically stripped away at
the end of the D/E/S line, leaving bare copper circuitry
Drill / Deburr
Cu & Pb/Sn Plate
LPI Soldermask
Final Metal Finish
Print Legend
Depanelize
E.T. / Final Insp.
Soldermask
Soldermask
Soldermask
LPI (Liquid Photo-Imageable) soldermask is applied to
protect and insulate the outer circuitry
Stages of pre-curing in tunnel ovens set up the mask (tack-
cure) forming an imageable coating similar to dry film
Soldermask artwork is used to expose both sides by UV
The uncured parts of the mask are developed off
The panel is then baked for final curing of the mask
Unlike dry film, the cured mask remains permanently on the
board
Drill / Deburr
Cu & Pb/Sn Plate
LPI Soldermask
Final Metal Finish
Print Legend
Depanelize
E.T. / Final Insp.
Soldermask
Soldermask
Final Surface Finish
Final Surface Finish
Solder, NiAu,
OSP, ENIG, etc.
The Final metal finish is applied wherever copper is left
exposed on exterior features and in the holes
Available final finishes include tin-lead solder, hard
electrolytic gold over nickel, immersion tin, immersion
silver, immersion nickel-gold (ENIG), and OSP
(a temporary anti-tarnish coating)
Choice is specified by the customer and purpose is to
protect the outer copper from corroding while providing a
suitable surface for soldering on parts
Drill / Deburr
Cu & Pb/Sn Plate
LPI Soldermask
Final Metal Finish
Print Legend
Depanelize
E.T. / Final Insp.
Silk Screen (Legend Ink)
S
A
N
M
I
N
A
0
6
9
6
Nomenclature
Legend information is needed for assembly and for
trouble-shooting boards in the field
Nomenclature is screen-printed onto board in epoxy-
based ink using a standard squeegee/fabric screen method
Once screened on, the ink is thermally cured by baking
and cannot be removed
Drill / Deburr
Cu & Pb/Sn Plate
LPI Soldermask
Final Metal Finish
Print Legend
Depanelize
E.T. / Final Insp.
S
A
N
M
I
N
A
0
6
9
6
Nomenclature
S
A
N
M
I
N
A
0
6
9
6
NC Routing
NC Routing
Individual boards are cut out of
production panels using NC (numerical
coefficient) controlled routing machines
Routing machines visually look very
much like drilling machines but with the
table moving around under a constantly
spinning tool
Depending on board thickness, panels
may be stacked 2 or more high for rout
Drill / Deburr
Cu & Pb/Sn Plate
LPI Soldermask
Final Metal Finish
Print Legend
Depanelize
E.T. / Final Insp.
Electrical Test
Electrical Test
The finished boards are electrical tested to identify any
shorts, opens, or leakages (high resistance shorts)
Some faults can be repaired where others cannot and
warrant scrapping that board
Tests are run against customer-provided netlist files that
exactly define what should be and shouldnt be connected in
their design
Tests can be fixtureless using Flying Probe whereby moving
arms make contact with the circuits one net at a time or by
dedicated fixturing that can test all circuits at one time
Due to the cost of building dedicated fixtures, this type is
normally relegated to production-level orders only
S
A
N
M
I
N
A
0
6
9
6
Drill / Deburr
Cu & Pb/Sn Plate
LPI Soldermask
Final Metal Finish
Print Legend
Depanelize
E.T. / Final Insp.
Electrical Test
Electrical Test
S
A
N
M
I
N
A
0
6
9
6
Flying Probe
Fixtureless Tester
Topside Access Bed-of-Nails
Dedicated Fixture Tester
Pack & Ship
Pack & Ship
LPI Soldermask
Final Metal Finish
Print Legend
Depanelize
E.T. / Final Insp.
Pack / SHIP
Other BBB
Other BBB
s*
s* ( *big beige boxes )
Laser Drill Thick Film Resistor Via Fill
Plasma Desmear Planarizer In House Lab

Basic PWB Fabrication 2006

Uploaded by

Document Information

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

Basic PWB Fabrication 2006

Uploaded by

Copyright:

Available Formats

T H E P R E M I E R E M S C O M P A N Y

Automatic Optical Inspection

You might also like