Plasma vs.

Permanganate
Plasma
One plasma treatment system with a small footprint
Permanganate
A series of tanks for etching and rinsing. Much larger footprint
Equipment
Plasma Advantages
Plasma
Environmentally benign.
Permanganate
Require hazardous waste disposal process.
Environmental impact
Plasma Advantages
Plasma vs. Permanganate
Plasma
Can perform high-aspect ratio specifications
Processes can be complementary
Environmentally friendly (no waste)
Monitoring of critical process parameters
Permanganate
Does not flow well in small vias found in multi-layer PCBs
(very high layer count)
Does not well clean the very small via holes usually
found at the inner layer level (laser-drilled via holes)
Acid etching is difficult to etch polyimide dielectrics
Plasma Advantages
Plasma Advantages
Plasma
Plasma has the flexibility to adjust process parameters for
desmearing small diameter holes in thick panels. Lowering the
pressure and increasing the gas flow create a ion direction to
the center of the hole. Hole sizes down to 0.004 @ 44:1
aspect ratio have been successful
Permanganate
As the via size decreases the ability for success in a wet
process is reduced. Liquid flow is restricted causing air
bubbles. These areas will not yield resin smear removal.
Backplane boards or boards .250 in.
thick with 8:1 aspect ratio or higher
Limitations
Backplane boards or boards .250 in.
thick with 8:1 aspect ratio or higher
Through hole vias less then 0.010 in panels that create a
10:1 or greater aspect ratio begin to restrict wet chemistry
flow.
Plasma has the advantage in creating gas penetration
in these small vias by utilizing vacuum to move process gas
through the hole.
Plasma Advantages
Laser formation
Most blind vias today are drilled using laser oblation. The laser
process typically leaves 3-10 of resin on the capture pad
along with traces of carbon. Both must be removed for
successful electroless Cu deposition.
Blind vias
Plasma Advantages
Plasma treating laser formed vias
Plasma desmears resin from laser formed vias with a similar
process as through holes. The blind aspect of the hole does
not cause limitations. Plasma is not restricted by via diameter.
Permanganate
Typically under 70, Wet processing causes 3 problems with Laser
BVH.
1. The via diameter (as with a through hole) will not allow good
flow.
2. The remaining carbon is chemically resistant.
3. I f the resin has reinforcement, wet processing causes wicking
and aggressive undercut.
Blind vias
Plasma Advantages
Hybrids
Hybrid panels consist of several types of material. Mixing flex
with rigid epoxy or polyimide resins are the most common
types. However today PTFE is mixed with epoxy, LCP with
polyamides and non woven Aramids with modified blends of
epoxy. The materials in these type panels etch or activate
differently
Mixed-material PCBs
Plasma Advantages
Plasma
Plasma has the capability to mix gasses in the same process to
treat different materials. For example when PTFE and epoxy
are mixed two steps are used. First step for desmear and the
second for activation in the run
Permanganate
Wet processing Hybrid panels is not successful due the
chemistries inability to treat different materials. For example
PTFE and epoxy mixed panels would require 2 separate
chemistry lines. One to desmear and one to activate.
Mixed-material PCBs
Plasma Advantages
Plasma vs. Permanganate
Thank You