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LCD TV

SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LP91T
MODEL : 32SL80YR 32SL80YR-MA
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
Internal Use Only
Printed in Korea P/NO : MFL60021574 (0909-REV00)
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 2 -
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ................................................................................. 3
SPECIFICATION ...................................................................................... 6
ADJUSTMENT INSTRUCTION ............................................................... 9
BLOCK DIAGRAM ................................................................................. 14
EXPLODED VIEW .................................................................................. 15
SVC. SHEET ...............................................................................................
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by acci dental shorts of the ci rcui try that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1M and 5.2M.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instruments
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
IMPORTANT SAFETY NOTICE
0.15uF

Copyright LG Electronics. Inc. All right reserved.


Only for training and service purposes
LGE Internal Use Only
- 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Al ternati vel y, obtai n and wear a commerci al l y avai l abl e
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Mi ni mi ze bodi l y mot i ons when handl i ng unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500F to 600F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500F to 600F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500F to 600F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
onl y unti l the sol der fl ows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
si de of t he ci rcui t board. (Use t hi s t echni que onl y on I C
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
4. Electrical specification
- General Specification
1. Application range
This spec sheet is applied to LCD TV used LP91T chassis.
2. Specification
Each part is tested as below without special appointment.
1) Temperature : 255C (779F), CST : 405C
2) Relative Humidity : 6510%
3) Power Voltage : Standard input voltage(100~240V@50/60Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawi ng and speci f i cat i on by part number i n
accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety: CE, IEC specification
- EMC : CE, IEC
No Item Specification Measurement Remark
1 Screen Size 32 wide Color Display Module Resolution : 1920*1080
2 Aspect Ratio 16:9
3 LCD Module 32 TFT WUXGA LCD
4 Operating Environment Temp.: 0 ~ 40 deg
Humidity : 0 ~ 85 %
5 Storage Environment Temp.: -20 ~ 60 deg
Humidity : 0~ 85 %
6 Input Voltage AC100-240V~, 50/60Hz
116.7W FHD, 200/240Hz(SBL)
7 LDC Module FHD 731.8(H) x 426.4(V) x 39.0(D) [with inverter]
(Maker : LGD) 0.36375 x 0.36375 Unit : mm
Coating 3H, Anti-Glare
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 7 -
LGE Internal Use Only
No. Item Min. Typ. Max. Unit Maker Remark
1. Luminance 480 540 cd/m
2
(W/O PC mode)
2. VIew angle (R/L, U/D) 178 / 178 degree LGD
3. Color Coordinates White X Typ 0.279 Typ LGD 32(FHD)
Y -0.03 0.292 +0.03
RED X 0.638
Y 0.334
Green X 0.288
Y 0.607
Blue X 0.145
0.062
4. Contrast ratio 8000:1 1200:1
5. Luminance Variation 1.3
5. Chroma& Brightness (Optical)
(1) LCD Module
The Color Coordinates check condition
- 50cm from the surface, Full White Pattern
- Picture mode Vivid
6. Component Video Input (Y, PB, PR)
No
Specification
Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720* 480 15.73 59.94 13.500 SDTV, DVD 480I( 525I)
2 720* 480 15.75 60.00 13.514 SDTV, DVD 480I( 525I)
3 720* 576 15.625 50.00 13.500 SDTV, DVD 576I( 625I) 50Hz
4 720* 480 31.47 59.94 27.000 SDTV 480P
5 720* 480 31.50 60.00 27.027 SDTV 480P
6 720* 576 31.25 50.00 27.000 SDTV 576P 50Hz
7 1280* 720 44.96 59.94 74.176 HDTV 720P
8 1280* 720 45.00 60.00 74.250 HDTV 720P
9 1280* 720 37.50 50.00 74.25 HDTV 720P 50Hz
10 1920* 1080 28.125 50.00 74.250 HDTV 1080I 50Hz,
11 1920* 1080 33.72 59.94 74.176 HDTV 1080I
12 1920* 1080 33.75 60.00 74.25 HDTV 1080I
13 1920* 1080 56.25 50 148.5 HDTV 1080P
14 1920* 1080 67.432 59.94 148.350 HDTV 1080P
15 1920* 1080 67.5 60.00 148.5 HDTV 1080P
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 8 -
LGE Internal Use Only
No
Specification Proposed
Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 640* 350 31.468 70.09 25.17 EGA
2 720* 400 31.469 70.09 28.32 DOS
3 640* 480 31.469 59.94 25.17 VESA( VGA)
4 800* 600 37.879 60.317 40 VESA( SVGA)
5 1024* 768 48.363 60.004 65 VESA( XGA)
6 1280* 768 47.776 59.87 79.5 VESA( WXGA)
7 1360* 768 47.72 59.799 84.75 VESA( WXGA)
8 1280* 1024 63.668 59.895 109.00 XGA Only FHD Model
9 1920* 1080 66.587 59.934 138.50 WUXGA(Reduced Blanking) Only FHD Model
7. RGB
- Analog PC, RGB- DTV NOT SUPPORT
8. HDMI Input
(1) PC - Spec. out but it can be shown the picture at only HDMI/ DVI IN 1 via DVI to HDMI Cable)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1 640 x 480 31.469 59.94 25.17 VESA( VGA)
2 800 x 600 37.879 60.317 40.00 VESA( SVGA)
3 1024 x 768 48.363 60.004 65.00 VESA( XGA)
4 1280 x 768 47.776 59.87 79.5 VESA( WXGA)
5 1360 x 768 47.72 59.799 84.62 VESA( WXGA)
6 1366 x 768 47.7 60.00 84.62 WXGA
7 1280 x 1024 63.595 60.00 108.875 SXGA
8 1920 x 1080 66.647 59.988 138.625 WUXGA
(2) DTV Mode
No
Specification
Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720 x 480 15.73 59.94 13.500 SDTV, DVD 480I(525I) Spec. out
2 720 x 480 15.75 60.00 13.514 SDTV, DVD 480I(525I) but display.
3 720 x 576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4 720 x 480 31.47 59.94 27 SDTV 480P
5 720 x 480 31.5 60.00 27.027 SDTV 480P
6 720 x 576 31.25 50.00 27 SDTV 576P
7 1280 x 720 44.96 59.94 74.176 HDTV 720P
8 1280 x 720 45 60.00 74.25 HDTV 720P
9 1280 x 720 37.5 50.00 74.25 HDTV 720P
10 1920 x 1080 28.125 50.00 74.25 HDTV 1080I
11 1920 x 1080 33.72 59.94 74.176 HDTV 1080I
12 1920 x 1080 33.75 60.00 74.25 HDTV 1080I
13 1920 x 1080 56.25 50.00 148.5 HDTV 1080P
14 1920 x 1080 67.432 59.94 148.350 HDTV 1080P
15 1920 x 1080 67.5 60.00 148.5 HDTV 1080P
16 1920 x 1080 27 24.00 74.25 HDTV 1080P
17 1920 x 1080 33.75 30.00 74.25 HDTV 1080P
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 9 -
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LCD TV, LP91T
chassis.
2. Specification
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 5C of temperature and 6510% of relative humidity if
there is no specific designation.
(4) The input voltage of the receiver must keep 100-220V,
50/60Hz.
(5) Before adjustment, execute Heat-Run for 5 minutes at RF
no signal.
3. Adjustment items
3.1. PCB assembly adjustment items
(1) Download the MSTAR main software (IC800, Mstar ISP
Utility)
1) Using D/L Jig
2) Using USB Memory Stick.
(2) Input Tool-Option/Area option.
(3) Download the EDID
- EDID datas are automatically download when adjusting
the Tool Option2
(4) ADC Calibration RGB / Component
(4) Check SW Version.
3.2. SET assembly adjustment items
(1) Input Area option
(2) Adjustment of White Balance : Auto & Manual
(3) Input Tool-Option/Area option
(4) Intelligent Sensor Inspection Guide
(5) Preset CH information
(6) Factoring Option Data input
4. PCB assembly adjustment method
4.1. Mstar Main S/W program download
4.1.1. Using D/L Jig
(1) Preliminary steps
1) Connect the download jig to D-sub(RGB) jack
(2) Download steps
1) Execute ISP Tool program, the main window(Mstar ISP
utility Vx.x.x) will be opened
2) Click the Connect button and confirm Dialog Box
3) Click the Config. button and Change speed I2C Speed
setting : 350Khz~400Khz
4) Read and write bin file.
Cl i ck (1)Read t ab, and t hen l oad downl oad
file(XXXX.bin) by clicking Read.
1
Filexxx.bin
5) Click (2)Auto tab and set as below
6) Click (3)Run.
7) After downloading, you can see the (4)Pass message.
4.1.2. Using the Memory Stick
* USB download : Service Mode
1) Insert the USB memory stick to the ISB port.
2) Automatically detect the SW Version.
-> S/W download process is executed automatically.
3) Show the message Copy the file from the Memory
4) After Finished the Download, Automatically DC Off -> On
5) Check The update SW Version.
4.2. Input tool option.
Adjust tool option refer to the BOM.
- Tool Option Input : PCBA Check Process
- Area Option Input : Set Assembly Process
After Input Tool Option and AC off
Before PCBA check, you have to change the Tool option and
have to AC off/on (Plug out and in)
(If missing this process, set can operate abnormally)
(1) Profile : Must be changed the option value because being
different with some setting value depend on
module maker, inch and market
(2) Equipment : adjustment remote control.
(3) Adjustment method
- The input methods are same as other chassis.(Use IN-
START Key on the Adjust Remocon.)
(If not changed the option, the input menu can differ the
model spec.)
Refer to Job Expression of each main chassis assy
(EBTxxxxxxxx) for Option value
Caution : Dont Press IN-STOP key after completing the
function inspection.
4.3. EDID D/L method
Recommend that dont connect HDMI and RGB(D-SUB) cable
when downloading the EDID.
If not possible, recommend that connect the MSPG equipment.
There are two methods of downloading the edid data
4.3.1. 1st Method
EDID datas are automatically downloaded when adjusting the
Tool Option2.
Automatically downloaded when pushing the enter key after
adjusting the tool option2.
It takes about 2seconds.
4.3.2. 2nd Method
* Caution : Must be checked that the tool option is right or not.
If tool option is wrong, hdmi edid data could not be
downloaded well.
1) Press the ADJ key
2) Move to the EDID D/L and Press the right direction key(G)
3) Press the right direction key(G) at Start.
4) After about a few seconds, appear OK, then compele.
4.3.3. RS-232C command Method
(1) Command : AE 00 10
* Caution
Don t connect HDMI and RGB(D-SUB) cabl e when
downloading the EDID.
If the cables are connected, Downloading of edid could be
failed.
- 10 -
LGE Internal Use Only Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes


Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 11 -
LGE Internal Use Only
4.3.4. EDID data
(1) Analog(RGB): 128bytes>
(2) HDMI 1 : 256Bytes
(3) HDMI 2 : 256Bytes
(4) HDMI 3 : 256Bytes
4.4. ADC Calibration
4.4.1. ADC Calibration - Component (Using External pattern)
(1) Required Equipments
- Remote controller for adjustment
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process
1) Change the Input to Component1 or 2 mode.
2) Input the Component 480i@60Hz 100% Color Bar
YPbPr signal into Component1 or 2.
(MSPG-925F Model: 209 / Pattern: 65 )
3) Press ADJ key on R/C for adjustment.
4) Enter Password number. Password is 0 0 0 0.
5) Select 0. ADC calibration : Component by using D/E
(CH +/-) and press ENTER(A ).
6) ADC adjustment is executed automatically .
7) When ADC adjustment is finished, this OSD appear
4.4.2. ADC Calibration - RGB (Using External pattern)
(1) Required Equipments
- Remote controller for adjustment
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process
1) Change the Input to RGB mode..
2) Input the PC 1024x768@60Hz Horizontal Color Bar
signal into RGB.
(MSPG-925F Model: 60 / Pattern: 65 )
3) Press ADJ key on R/C for adjustment.
4) Enter Password number. Password is 0 0 0 0.
5) Select 0. ADC calibration : RGB by using D/E (CH +/-)
and press ENTER(A ).
6) ADC adjustment is executed automatically .
7) When ADC adjustment is finished, this OSD appear
OK
OK
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 12 -
LGE Internal Use Only
4.5. Check SW Version
(1) Method
1) Push In-star key on Adjust remote-controller.
2) SW Version check
Check SW VER : V3.xx
5. PCB assembly adjustment method
5.1. Input Area-Option
(1) Profile : Must be changed the Area option value because
being different of each Countrys Language and
signal Condition.
(2) Equipment : adjustment remote control.
(3) Adjustment method
- The input methods are same as other chassis.(Use IN-
START Key on the Adjust Remocon.)
Refer to Job Expression of each main chassis assy
(EBTxxxxxxxx) for Option value.
* White Balance Adjustment
- Purpose : Adj ust the col or temperature to reduce the
deviation of the module color temperature.
- Principle : To adjust the white balance without the saturation,
Fix the one of R/G/B gain to 192 (default data)
and decrease the others.
- Adjustment mode : Three modes - Cool / Medium / Warm
- Required Equipment
1) Remote controller for adjustment
2) Color Analyzer : CA100+ or CA-210 or same product -
LCD TV( ch : 9 ),
(should be used in the calibrated ch by CS-1000)
3) Auto W/B adjustment instrument(only for auto adjustment)
5.2. Adjustment of White Balance
: (For automatic adjustment)
* LP91S/T Chassis Support Only I2C Interface.
(1) Enter the adjustment mode of DDC
- Set command delay time : 50ms
- Enter the DDC adjustment mode at the same time heat-
run mode when pushing the power on by power only key
- Maintain the DDC adjustment mode with same condition
of Heat-run => Maintain after AC off/on in status of Heat-
run pattern display)
(2) Release the DDC adjustment mode
- Release the adjust mode after AC off/on or std-by off/on
in status of finishing the Hear-run mode
- Release the Adjust mode when receiving the aging off
command(F3 00 00) from adjustment equipment.
- Need to transmit the aging off command to TV set after
finishing the adjustment.
- Check DDC adjust mode release by exit key and release
DDC adjust mode)
(3) Enter the adjust mode of white balance)
- Enter the white balance adjustment mode with aging
command (F3, 00, FF)
* Luminance min value is 150cd in the Cool/Medium/Warm
mode(For LCD)
5.3. Adjustment of White Balance
(for Manual adjustment)
(1) Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000
(2) Operate the zero-calibration of the CA100+ or CA-210,
then stick sensor to the module when adjusting.
(3) For manual adjustment, it is also possible by the following
sequence.
1) Select white pattern of heat-run by pressing POWER
ON key on remote control for adjustment then operate
heat run longer than 15 minutes. (If not executed this
step, the condition for W/B may be different.)
2) Push Exit key.
3) Change to the AV mode by remote control.
4) Input external pattern (85% white pattern)
5) Push the ADJ key -> Enter 0000 (Password)
6) Select 3. W/B ADJUST
7) Enter the W/B ADJUST Mode
8) Stick the sensor to the center of the screen and select
each items (Red/Green/Blue Gain and Offset) using
D/E (CH +/-) key on R/C..
9) Adjust R/ G/ B Gain using F /G(VOL +/-) key on R/C.
10) Adjust three modes all (Cool / Medium / Warm) : Fix
the one of R/G/B gain and change the others
11) When adjustment is completed, Enter COPY ALL.
12) Exit adjustment mode using EXIT key on R/C.
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 13 -
BLOCK DIAGRAM
R
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F U L L H D L V D S c o n n e c t o r
F R C L V D S c o n n e c t o r
*

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.
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 14 -
LGE Internal Use Only
3
0
0
2
0
0
L
V
1
L
V
2
2
0
0
T
2
0
0
N
5
0
0
5
1
0
A
2
A
1
0
3
1
0
1
2
0
1
2
1
6
0
0
6
1
0
8
0
1
8
0
4
8
0
5
5
3
0
5
4
0
8
0
6
8
0
3
8
0
7
8
0
2
5
5
0
9
1
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7
4
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8
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5
2
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8
0
9
0
0
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
CAT24C02WI-GT3
IC100
CATALYST
3
A2
2
A1
4
VSS
1
A0
5
SDA
6
SCL
7
WP
8
VCC
DDC_WP
DSUB_SCL
4.7K
R129
100
R119
4.7K
R128
100
R123
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
4.7K
R154
R
E
A
D
Y
+5VST_MST
DSUB_SDA
0. 01uF
C113
100
R120
10K R133
0 R124
30V
D114
PC_R
PC_AUD_L
220K
R100
75
R107
75
R126
30V
D104
75
R127
75
R108
12K
R137
COMP2_R
MNT_LOUT
10K R132
220K
R121
CVBS_RIN
SD05
ZD201
10uF 16V C106
SD05
ZD108
PC_B
100uF 16V C103
E
N
K
M
C
2
8
3
7
-T
1
1
2
D
1
2
7 A
A
C
C
COMP1_PR
MNT_VOUT
MNT_ROUT
CDS3C30GTH
30V
D120
SD05
ZD109
CVBS_VIN
PC_G
SD05
ZD100
12K
R136
CVBS_LIN
30V
D101
E
N
K
M
C
2
8
3
7
-T
1
1
2
D
1
2
8 A
A
C
C
DSUB_SDA
COMP2_L
SD05
ZD106
30V
D115
75
R125
SD05
ZD200
30V
D203
220K
R122
COMP2_Y
10K R113
SD05
ZD105
SD05
ZD102
75
R210
SD05
ZD103
75
R109
CDS3C30GTH
30V
D110
COMP1_Y
10uF 16V C105
RT1C3904-T112
Q201
E
B
C
SD05
ZD104
COMP2_PB
30V
CDS3C30GTH
D100
RT1C3904-T112
Q200
E
B
C
MUTE_LINE
SD05
ZD107
CDS3C30GTH
30V
D107
SD05
ZD101
E
N
K
M
C
2
8
3
7
-T
1
1
2
D
1
2
6 A
A
C
C
PC_AUD_R
30V
D201
COMP1_L
12K
R118
COMP1_PB
10K R114
12K
R117
30V
D204
220K
R104
+5V_MULTI
COMP1_R
COMP2_PR
DSUB_SCL
CDS3C30GTH
30V
D119
220K
R130
220K
R131
10K
R138
10K
R139
12K
R141
12K
R140
0. 1uF
C117
0. 1uF
C119
0. 1uF
C118
4.7K
R111
4.7K
R112
10K R215
10K R217
12K
R219
12K
R218
220K
R211
220K
R214
75 R212
68pF
C100
68pF
C102
PC_VS
68
R110
PC_HS
68
R116
JP105
JP106
JP104
10uF
16V
C10000
READY
0
R142
RT1C3904-T112
Q100 E
B
C
0
R143
RT1C3904-T112
Q101 E
B
C
75
R101
75
R103
75
R102
1K
R134
1K
R135
6800pF
C10001
6800pF
C104
M24C02-RMN6T
IC100-*1
STM_replace
3
E2
2
E1
4
VSS
1
E0
5
SDA
6
SCL
7
WC
8
VCC
SPG09-DB-010
JK105
1
RED
2
GREEN
3
BLUE
4
GND_1
5
DDC_GND
6
RED_GND
7
GREEN_GND
8
BLUE_GND
9
NC
10
SYNC_GND
11
GND_2
12
DDC_DATA
13
H_SYNC
14
V_SYNC
15
DDC_CLOCK
16
SHILED
PEJ027-01
JK106
6B
T_TERMINAL2
8
SHIELD_PLATE
7B
B_TERMINAL2
5
T_SPRING
4
R_SPRING
7A
B_TERMINAL1
6A
T_TERMINAL1
3
E_SPRING
PPJ231-01
JK101
8
6
7
5
4
PPJ-230-01
JK103
9 [GN]G
10 [GN]GND
8 [GN]C_DET
7 [BL]B
6 [RD]R
5 [WH]L_IN
4 [RD]R_IN
11
FIX-TER
13 [RD]MONO PPJ-230-01
JK104
9 [GN]G
10 [GN]GND
8 [GN]C_DET
7 [BL]B
6 [RD]R
5 [WH]L_IN
4 [RD]R_IN
11
FIX-TER
13 [RD]MONO
PPJ233-01
JK102
4A
[YL]O-SPRING
5A
[YL]E-LUG
3A
[YL]CONTACT
4B
[WH]C-LUG
5C
[RD]E-LUG
4C
[RD]O-SPRING
3C
[RD]CONTACT
EAX61181901
Mstar LCD SL80
PC EDID
A
V
1
C
O
M
P
O
N
E
N
T
2
PC
**MULTI ITEM
1.24C02-SUB:0IMMRAL014D
2.ENKMC2837-SUB:0DS226009AA
[KDS226]
POP NOISE
PC SOUND
POP NOISE
COMPONENT1/2, AV1, MNT_OUT
C
O
M
P
O
N
E
N
T
1
M
N
T
_
O
U
T
INPUT-ANALOG/PC
H6 SL80
9 1 2
2009/ 04/ 02
Copyright 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SIDE_RIN
SIDE_LIN
5. 6B
ZD202
SIDE_V
5. 6B
ZD203
U
S
B
D
O
W
N
S
T
R
E
A
M
KJA-UB-4-0004
JK200
1
2
3
4
5
USB_DP
USB_DN
30V
D205
30V
D206 0 R200
0 R201
0
Non_OCP
R202
+5V_USB
500
L200
10uF 6.3V C201
120OHM
OCP
L202
4.7K
OCP
R205
1KOCP
R204
MIC2009YM6-TR
OCP IC201
3 ENABLE
2 GND
4 FAULT/
1 VIN 6 VOUT
5 ILIMIT
0. 1uF
OCP
C203
10uF
OCP
C204
30V
D208
READY
30V
D207
READY
KDS226
OCP
D200
A AC
C
510
OCP
R208
160 OCP
R203
75
R227
220K
R223
220K
R222
10K R224
10K R225
12K
R226
12K
R228
12507WS-08L
P201
1
2
3
4
5
6
7
8
9
MDS61887702
GASKET
M1
6T_GASKET(32/42/55)
MDS61887702
GASKET
M2
6T_GASKET(55)
MDS61887702
GASKET
M3
6T_GASKET(55)
MDS61887702
GASKET
M4
6T_GASKET(55)
MDS61887702
GASKET
M5
READY
MDS61887702
GASKET
M6
6T_GASKET(32/42/55)
JP201
JP202
JP203
220uF
16V C200
100uF
16V C202
MDS61887702
GASKET
6T_GASKET(55)
M7
MDS61887702
GASKET
6T_GASKET(55)
M8
MDS61887703
GASKET
7T_GASKET(47)
M1-*1
MDS61887703
GASKET
7T_GASKET(47)
M4-*1
MDS61887703
GASKET
7T_GASKET(47)
M3-*1
MDS61887703
GASKET
7T_GASKET(47)
M6-*1
**1A Desi gn
SIDE AV USB
EAX61181901
Mstar LCD SL80
SIDE AV/USB
H6 SL80
2 1 2
2009/ 04/ 02
EAN43439401
Pi n t o Pi n wi t h
Close to SIDE_USB
==6T==
32" : MDS61887702, M1, M6
42" : MDS61887702, M1, M6
55" : MDS61887702, M1, M2, M3 M3, M4, M6, M7, M8
==7T==
47" : MDS61887703, M1, M3, M4, M6
Copyright 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TMDS3_RXC+
+5V_HDMI_1
TMDS3_RX2+
100 R304
HPD_MST_1
KDS184S
D300
A
1
C
A
2
TMDS3_RX0+
100 R327
DDC_SDA1
1K
R303
+5V_HDMI_3
CAT24C02WI-GT3
IC300
3
A2
2
A1
4
VSS
1
A0
5
SDA
6
SCL
7
WP
8
VCC
TMDS1_RX2+
TMDS2_RX1+
DDC_WP
TMDS3_RX1-
1K
R302
2SC3875S
RT1C3904-T112
Q300
E
B
C
10K
R312
SIDE_HDMI
+5V_HDMI_1
TMDS3_RX2-
2SC3875S
RT1C3904-T112
Q302
SIDE_HDMI
E
B
C
CEC
100 R318
TMDS2_RXC+
0. 01uF
C300
KDS184S
D301
A
1
C
A
2
HPD_MST_3
2SC3875S
RT1C3904-T112
Q301
E
B
C
JP301
0. 01uF
C302
J
P
3
0
4
DDC_SDA3
+5V_HDMI_3
DDC_WP
100 R307
J
P
3
0
5
1K
R314
SIDE_HDMI
TMDS2_RXC-
TMDS1_RX0-
0. 01uF
C301
100 R329
DDC_WP
10K
R301
TMDS1_RX2-
TMDS2_RX1-
JP302
TMDS1_RXC+
DDC_SCL2
TMDS1_RX0+
TMDS3_RXC-
+5V_HDMI_2
100 R306
TMDS3_RX0-
100 R331
CEC
+5V_MULTI
DDC_SCL1
+5V_MULTI
HPD_MST_2
TMDS2_RX2-
10K
R300
CAT24C02WI-GT3
IC301
3
A2
2
A1
4
VSS
1
A0
5
SDA
6
SCL
7
WP
8
VCC
DDC_SCL3
DDC_SDA2
KDS184S
D302
A
1
C
A
2
CEC
TMDS3_RX1+
JP300
TMDS1_RXC-
TMDS2_RX0-
+5V_MULTI
+5V_HDMI_2
100 R317
100 R305
CAT24C02WI-GT3
IC302
3
A2
2
A1
4
VSS
1
A0
5
SDA
6
SCL
7
WP
8
VCC
TMDS1_RX1+
JP303
TMDS1_RX1-
TMDS2_RX2+
TMDS2_RX0+
CEC
0
R313
68K
CEC_READY
R315
CEC_C
MMBD301LT1G
30VCEC_READY
D303
CDS3C30GTH
30VCEC_READY
D304
+3.3V_MST
BSS83
Q303
CEC_READY
S
B
D
G
10K
R311
10K
R309
10K
R320
10K
R319
10K
R310
10K
R308
56000
R332
READY
JP306
JP307 JP308
YKF45-7058V
JK301
14
13
5 DATA1_SHIELD
20
20
12
11
2 DATA2_SHIELD
19
18
10 CLK+
4 DATA1+
1 DATA2+
17
9 DATA0-
8 DATA0_SHIELD
3 DATA2-
16
7 DATA0+
6 DATA1-
15
YKF45-7054V
JK302
14
13
5 DATA1_SHIELD
20
20
12
11
2 DATA2_SHIELD
19
18
10 CLK+
4 DATA1+
1 DATA2+
17
9 DATA0-
8 DATA0_SHIELD
3 DATA2-
16
7 DATA0+
6 DATA1-
15
DC1R019NBH
JK303
SIDE_HDMI
14 NC
13 CEC
5 DATA1_SHIELD
20
JACK_GND
12 CLK-
11 CLK_SHIELD
2 DATA2_SHIELD
19 HPD
18+5V_POWER
10 CLK+
4 DATA1+
1 DATA2+
17DDC/CEC_GND
9 DATA0-
8 DATA0_SHIELD
3 DATA2-
16 SDA
7 DATA0+
6 DATA1-
15 SCL
MST_HPD : USE MST HPD
SW_HPD : USE SW HPD (Default)
OPTION
EAX61181901
Mstar LCD SL80
INPUT-HDMI
H6 SL80
3 1 2
2009/ 04/ 02
Copyright 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
4.7K
R421 READY
2SC3052
Q405
IR-OUT
E
B
C
ZD402
SUB_SDA
+5VST_MST
10K
IR-OUT
R427
KEY2
120ohm L406
+3.3V_MULTI_MST
120ohm L403
IR
2SC3052
Q404
IR-OUT E
B
C
22
IR-OUT
R430
0. 1uF
C408
ZD400
10K
IR-OUT
R429
470pF
C412
+5VST_MST
10K
IR-OUT
R428
SUB_SCL
KEY1
0. 1uF
C407
READY
500-ohm L410
120ohm L402
+5VST_MST
470pF
C404
47K
IR-OUT
R426
+3.3V_MST
500-ohm L411
4.7K
R420 READY
0
R417
0. 1uF
C411
+3.3V_MST
0
R400
READY
0. 1uF
C414
ZD401
47pF
C403
+3.3V_MST
MLB-201209-0120P-N2
L404
MLB-201209-0120P-N2
L407
0
R401
0
R403
BLT_DN
BLT_DP
+3.3V_MULTI_MST
0
R402
0. 1uF
C400
12507WS-12L
P400
1
2
3
4
5
6
7
8
9
10
11
12
13
12507WS-06L
P401
1
2
3
4
5
6
7
47uF
C406
CONTROL KEY/IR
EAX61181901
Mstar LCD SL80
KEY/IR/BLUETOOTH
H6 SL80
4 1 2
2009/ 04/ 02
c l os e t o R401
BLUETOOTH
Copyright 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
0
. 1
u
F
C
5
1
6
0
. 1
u
F
C
5
2
0+1.8V_TUNER_A
820nH L504
1uH
OPT
L500
0
. 1
u
F
C
5
1
5
56pF C500
M_SCL
0
. 1
u
F
C
5
2
2
1
0
0
0
p
F
C
5
1
0
0. 1uF C504
0
.1
u
F
C
5
2
3
0
.1
u
F
C
5
1
2
1000pF C503
270nH
L501
0
. 1
u
F
C
5
1
8
+
1
. 8
V
_
T
U
N
E
R
_
A
18pF
C536
10 R504
390nH
L503
100 R509 39pF C502
15pF
C533
0
. 1
u
F
C
5
1
7
0. 1uF C506
0
. 1
u
F
C
5
2
1
0
. 1
u
F
C
5
1
3
18pF
C535
0
. 1
u
F
C
5
1
9
0. 1uF C524
0. 1uF
C529
0 R502
0
. 1
u
F
C
5
1
4
0. 1uF
C526
0
. 1
u
F
C
5
1
1
KCN-ET-0-0094
JK500
PAL
1
2
+3.3V_TUNER
0. 1uF C525
TU_RESET
0. 1uF C507
120pF
C501
M_SDA
0
. 1
u
F
C
5
0
9
100 R510
+5V_TUNER
0. 1uF C505
D500
6.8nH L502
+3.3V_TUNER
4
.9
9
K
R
5
0
0
0. 1uF C508
0. 1uF
C530
15pF
C532
+5V_TUNER
10pF
C527
680 R501 2.7uH L505
390
R507
0. 1uF
C534
ISA1530AC1
Q501
E
B
C
MAIN_SIF
270pF
READY
C537
390
R505
680 R503
ISA1530AC1
Q500
E
B
C
0. 1uF
C531
+5V_TUNER
10pF
C528
2.7uH L506
0
R506
0 R508 TV_MAIN
22uF
C545
+3.3V_TUNER
+1.8V_TUNER_A
0. 1uF
C538
0 R511
22uF
C546
22uF
C541
0. 1uF
C539
120-ohm
L508
0. 1uF
C543
GND
0. 1uF
C544
0. 1uF
C540
0. 1uF
C542
XC5000
IC500
1 VDDA_1
2 IN1
3 GND_1
4 IN2
5 GND_2
6 EXTCHOKE
7 GND_3
8 VDDA_2
9 VDDA_3
10 VDDC_1
11 GND_4
12 VDDC_2
1
3
V
D
D
C
_
3
1
4
V
D
D
A
_
4
1
5
V
A
G
C
1
6
V
I
F
1
7
V
D
D
A
_
5
1
8
S
I
F
1
9
G
N
D
_
5
2
0
V
D
D
C
_
4
2
1
V
D
D
A
_
6
2
2
G
N
D
_
6
2
3
V
D
D
D
_
1
2
4
T
E
S
T
M
O
D
E
25 DDI1
26 VDDC_5
27 DDI2
28 ADDRSEL
29 X2
30 GND_7
31 X1
32 EXTREF
33 VDDD_2
34 SCL
35 SDA
36 GND_8
3
7
R
E
S
E
T
3
8
V
I
2
C
3
9
V
D
D
C
_
6
4
0
V
R
E
F
_
N
4
1
V
R
E
F
_
P
4
2
V
D
D
C
_
7
4
3
V
D
D
C
_
8
4
4
R
E
X
T
4
5
V
D
D
A
_
7
4
6
G
N
D
_
9
4
7
V
D
D
C
_
9
4
8
V
D
D
A
_
8
+3.3V_TUNER
+1.8V_TUNER_D
+1.8V_TUNER_D
31.875MHz
X501
4 GND_2 1X-TAL_1
2GND_1 3 X-TAL_2
AZ1117H-3.3
IC501
2
OUTPUT
3 INPUT 1 ADJ/GND
+5V_TUNER
2.2uH
L507
AZ1117H-1.8TRE1(EH13A)
IC502
2
OUTPUT
3 INPUT 1 ADJ/GND
KCN-BT-2-0082
JK501
NTSC
1
2
EAX61181901
Mstar LCD SL80
TUNER
H6 SL80
5 1 2
2009/ 04/ 02
$0.085
$2.25
$0.088
$0.051
$0.051
Copyright 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
22000pF C623
22000pF
C625
SPK_R-
I
2
S
_
W
S
4.7K
R667
3. 3
R604
+3.3V_MULTI_AUD
0. 1uF
C637
100pF
C601
3. 3
R625
0
R
6
5
6
R
E
A
D
Y
0. 01uF
C671
0. 1uF
C644
+1.8V_DVDD
390pF
C630
SPK_L-
+16V_NTP
3.3K
R600
3. 3
R626
SPK_R+
22000pF C611
1uF
C618
0. 1uF
C610
0
R
6
7
7
+1.8V
SPK_L-
0. 1uF
C602
4.7K
R663
1
0
0
0
p
F
C
6
5
1
0. 47uF
C632
390pF
C634
+16V_NTP
0
R
6
7
3
0. 01uF
C648
SPK_R-
+1.8V_DVDD
1
0
0
R
6
0
3
SPK_R+
+1.8V_DVDD
M
U
L
T
I_
P
W
_
S
W
0. 1uF
C626
M
_
S
C
L
0. 01uF
C672
3. 3
R635
0. 1uF
C643
0. 1uF
C669
4.7K
R623
I
2
S
_
S
C
K
0. 01uF
C647
I2S_MCLK
0
R
6
7
6
4.7K
R628
0. 47uF
C673
22000pF
C616
390pF
C621
+3.3V_MULTI_AUD
1000pF
C606
1000pF
C603
+3.3V_MULTI_MST
+1.8V_AVDD
SPK_L+
SPK_L+
0. 1uF
C617
1
0
0
R
6
0
2
3. 3
R671
M
_
S
D
A
SW_RESET
+1.8V_AVDD
0. 1uF
C605
I
2
S
_
S
D
O
0. 1uF
C629
1uF
C608
0. 1uF
C607
0. 1uF
C615
+1.8V_AVDD
0
R
6
7
8
0. 01uF
C613
1
u
F
C
6
1
4
1uF
C624
100 R601
390pF
C619
10uF16V
C604
10uF16V
C600
12
R608
12
R658
12
R610
12
R621
12
R605
12
R606
12
R622
12
R624
10uF 16V
C609
NTP-3100L
IC600
1 BST1A
2 VDR1A
3 RESET
4 AD
5 DVSS_1
6 VSS_IO
7 CLK_I
8 VDD_IO
9 DGND_PLL
10 AGND_PLL
11 LFM
12 AVDD_PLL
13 DVDD_PLL
14 TEST0
1
5
D
V
S
S
_
2
1
6
D
V
D
D
1
7
S
D
A
T
A
1
8
W
C
K
1
9
B
C
K
2
0
S
D
A
2
1
S
C
L
2
2
M
O
N
IT
O
R
_0
2
3
M
O
N
IT
O
R
_1
2
4
M
O
N
IT
O
R
_2
2
5
F
A
U
L
T
2
6
V
D
R
2B
2
7
B
S
T
2
B
2
8
P
G
N
D
2
B
_
1
29 PGND2B_2
30 OUT2B_1
31 OUT2B_2
32 PVDD2B_1
33 PVDD2B_2
34 PVDD2A_1
35 PVDD2A_2
36 OUT2A_1
37 OUT2A_2
38 PGND2A_1
39 PGND2A_2
40 BST2A
41 VDR2A
42 NC
4
3
V
D
R
1B
4
4
B
S
T
1
B
4
5
P
G
N
D
1
B
_
1
4
6
P
G
N
D
1
B
_
2
4
7
O
U
T
1
B
_
1
4
8
O
U
T
1
B
_
2
4
9
P
V
D
D
1
B
_
1
5
0
P
V
D
D
1
B
_
2
5
1
P
V
D
D
1
A
_
1
5
2
P
V
D
D
1
A
_
2
5
3
O
U
T
1
A
_
1
5
4
O
U
T
1
A
_
2
5
5
P
G
N
D
1
A
_
1
5
6
P
G
N
D
1
A
_
2
10uF35V
C620
READY
0 R682
READY
MULTI_PW_SW
0 R609
READY
+3.3V_MST
RT1C3904-T112
Q601
E
B
C
10K
R611
10K R607
33pF
50V
READY
C638
33pF
50V
READY
C639
M
L
B
-2
0
1
2
0
9
-0
1
2
0
P
-N
2
L
6
0
1
MLB-201209-0120P-N2
L605
MLB-201209-0120P-N2
L606
22K
READY R612
SMAW250-04Q
P600
1
2
3
4
5
MLB-201209-0120P-N2
L600
MLB-201209-0120P-N2
L602
MLB-201209-0120P-N2
L604
MLB-201209-0120P-N2
L608
68uF
35V
C674
68uF
35V
C675
68uF
35V
C676
68uF
35V
C677
M
L
B
-2
0
1
2
0
9
-0
1
2
0
P
-N
2
R
E
A
D
Y
L
6
0
9
+3.3V_MST
AD-8770
EAP60684501
L603
2S
1S 1F
2F
AD-8770
EAP60684501
L607
2S
1S 1F
2F
EAX61181901
Mstar LCD SL80
AUDIO
H6 SL80
6 1 2
2009/ 04/ 02
AUDIO MAIN AMP
Copyright 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+12V_AUDIO
6800pF
C701
MNT_LOUT
RT1C3904-T112
Q701
E
B
C
MNT_L_AMP
RT1C3904-T112
Q700
E
B
C
MNT_R_AMP
+12V_AUDIO
6800pF
C700
LM324D
IC701
3 INPUT1+
2 INPUT1-
4 VCC
1 OUT1
6 INPUT2-
5 INPUT2+
7 OUT2 8 OUT3
9 INPUT3-
10 INPUT3+
11 GND
12 INPUT4+
13 INPUT4-
14 OUT4
MNT_ROUT
+12V_AUDIO
33pF C702
33pF C703
0. 01uF
C704
1K R703
1K R702
4.7K
R700
4.7K
R701
10K R707
10K R704
6.8K
R709
6.8K
R708
5.6K R706
5.6K R705
0. 1uF
C707
0. 1uF
C709
EAX61181901
Mstar LCD SL80
AUDIOOUT
H6 SL80
7 1 2
2009/ 04/ 02
AMP :GAIN X 4
Copyright 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SIDE_V
10 R879
TMDS1_RX0-
0. 01uF
C862
C
V
B
S
_
L
IN
M
E
M
C
_R
X
E
4-
+1.8V_DDR
M
E
M
C
_R
X
E
3-
100
R
8026
MAIN_SIF
MNT_VOUT_T
100
R
8025
P
C
_
A
U
D
_
L
0.01uF C839
+1.2V_VDDC_MST
PANEL_ON
KDS181
D801
DDR2_DQM0
33 A
R
818
D
S
U
B
_S
D
A
DDR2_DQM1
D
D
R
2
_
B
A
1
MEMC_RXOC-
PC_R
10
R
801
33 R844
D
D
C
_
S
C
L
3
+3.3V_MULTI_MST
T
M
D
S
3
_
R
X
1
+
100
R
895
MEMC_RXO1+
4
.7
u
F
C
820
100 R881
DDR2_MCLKZ
D
S
U
B
_S
D
A
100
R
826
COMP2_Y
10
R
821
M
_S
D
A
KDS181
D803
DDC_WP
I2
S
_
S
D
O
M
E
M
C
_R
X
E
2+
56 A
R
814
I2
S
_
S
C
K
S
P
I_
D
I
TMDS1_RX1+
100 R888
+
3
.3
V
_
M
S
T
SYS_RESET
0
R
8035
2. 2uF C856
2
.2
u
F
C
822
+1.2V_VDDC_MST
EEP_SDA
100
R
8012
T
M
D
S
3
_
R
X
2
+
DDC_WP
TMDS2_RX1-
TV_MAIN
100 R8015
READY
SIDE_LIN
100 R846
0. 01uF
C879
C
V
B
S
_
R
IN
SPI_DO
P
A
N
E
L
_
S
T
A
T
U
S
0 R8008
100
R
8023
10 R851
0
R800
P
C
_A
U
D
_R
E
E
P
_
S
C
L
2
.2
u
F
C
872
10 R854
DDR2_DQS0P
10 R880
100
R
8022
D
D
C
_
S
C
L
1
M
E
M
C
_R
X
E
1-
D
D
R
2_W
E
Z
1000pF C835
MEMC_RXO3+
10 R856
4.7K R866
0 R812
+5VST_MST
T
M
D
S
3
_
R
X
2
-
MEMC_RXO4-
CAT24WC08W-T
IC803
3
A2
2
A1
4
VSS
1
A0
5
SDA
6
SCL
7
WP
8
VCC
4.7K
R8004
HDCP_READY
+3.3V_MULTI_MST
DDR2_MCLK
R
X
D
2
.2
u
F
C
821
COMP2_PR
100
R
849
P
O
W
E
R
_S
W
SW_RESET
10 R871
R
L
_O
N
+3.3V_MULTI_MST
TMDS2_RXC+
TMDS2_RXC-
0
.1
u
F
C
813
RT1C3904-T112
Q804
E
B C
+3.3V_MULTI_MST
10K
R855
S
P
I_
D
O
C
O
M
P
1_R
+1.2V_VDDC_MST
1K
R
867
T
M
D
S
3
_
R
X
C
-
SPI_CLK
100
R
825
10
R
823
0. 1uF C853
1K R860
0 R813
2
.2
u
F
C
823
TMDS2_RX1+
H
P
D
_
M
S
T
_
3
56 A
R
815
0. 01uF
C803
100
R
8024
0. 01uF
C858
SIDE_RIN
C
O
M
P
1_L
+3.3V_MULTI_MST
EEP_SCL
KDS181
D802
M
E
M
C
_R
X
E
0+
0.01uF
C
863
COMP1_PB
MULTI_PW_SW
100 R882
10 R892
DDR2_DQS0M
100
R
828
E
-D
IM
D
D
R
2_C
K
E
22K R842
SUB_SDA
MEMC_RXO0-
MEMC_RXO0+
JTP-1127WEM
SW800
1
2
4 3
HPD_MST_1
RT1C3904-T112
Q802
E
B
C
D
D
C
_S
D
A
1
2
.2
u
F
C
873
+3.3V_MULTI_MST
2
.2
u
F
C
801
4.7K
R878
10
R
820
MNT_R_AMP
1M R
839
D
D
R
2_O
D
T
DDR2_D[0-15]
ISA1530AC1
Q800
E
B
C
0. 01uF
C807
TMDS1_RX2-
56 A
R
813
10 R874
2
.2
u
F
C
824
IRT
X
D
100
R
850
+5VST_MST
TMDS2_RX0-
0. 01uF
C860
MEMC_RXO1-
M
E
M
C
_R
X
E
2-
RL_ON
MNT_VOUT
+12V_AUDIO
100
R
829
C
O
M
P
2_L
390 R840
EEP_SDA
1K
R
868
0. 1uF C848
2
.2
u
F
C
802
100
R
827
T
M
D
S
3_R
X
C
+
+3.3V_MULTI_MST
10
R
805
MEMC_RXO4+
10 R862
12M
H
z
X
801
TMDS2_RX2-
24LC256-I/SM
IC801
24C64_Normal
3
A2
2
A1
4
VSS
1
A0
5
SDA
6
SCL
7
WP
8
VCC
U
S
B
_D
N
POWER_DET
402 R807
READY
56 A
R
800
100
R
824
TMDS1_RXC- 10 R872
MEMC_RESET
I-D
IM
56
AR810
56
AR805
COMP1_Y
RT1C3904-T112
Q803
E
B
C
10 R869
S
P
I_
C
Z
+5VST_MST
0. 01uF
C864
10 R859
0
R
870
10 R858
K
E
Y
2
2
.2
u
F
C
874
0
.1
u
F
C
844
0. 1uF
C814
0
R8001
READY
10
R
841
DDR2_DQS1P
DDR2_A[0-12]
S
Y
S
_
R
E
S
E
T
10uF
16V
C
809
M
E
M
C
_R
X
E
1+
SUB_SCL
D
D
R
2_C
A
S
Z
MEMC_RXO3-
MEMC_RXO2-
100
R
8021
PC_B
+1.8V
D
D
C
_
S
C
L
2
P_12V
T
M
D
S
3
_
R
X
0
+
M
E
M
C
_R
X
E
C
-
4. 7uF
C812
2
.2
u
F
C
875
D
D
C
_S
D
A
3
0
R
8034
MNT_L_AMP
D
D
R
2_R
A
S
Z
P
C
_
H
S
+3.3V_MULTI_MST
TMDS1_RX2+
100 R8014 READY
0. 1uF C849
T
X
D
56 A
R
812
E
E
P
_
S
D
A
33K R8007
TMDS2_RX0+
M
E
M
C
_R
X
E
3+
4.7K
R8028
I2
S
_
M
C
L
K
C
O
M
P
2_R
U
S
B
_
D
P
2. 2uF C861
0.01uF C841
TMDS1_RX0+
T
M
D
S
3
_
R
X
0
-
0. 01uF
C865
22 R8005
HDCP_READY
SPI_DI
TMDS2_RX2+
10K R8020
EEP_SCL
CVBS_VIN
10
R
822
10 R873 TMDS1_RXC+
10K
R8000
2. 2uF
C8000
READY
MNT_VOUT_T
22 R8006
HDCP_READY
M
E
M
C
_R
X
E
4+
COMP1_PR
M
E
M
C
_R
X
E
C
+
K
E
Y
1
DISP_EN/VAVS_ON
4.7K R865
1000pF C846
C
E
C
_
C
P_16V
10 R890
D
D
C
_S
D
A
2
MUTE_LINE
D
D
R
2
_
B
A
0
MEMC_RXOC+
PC_G
100 R847
4.7K
R877
10K
R
8003
D
S
U
B
_
S
C
L
1K R8038
T
M
D
S
3
_
R
X
1
-
SPI_CZ
+3.3V_MST
MEMC_RXO2+
4.7K
R8027
22K R845
P
C
_
V
S
HPD_MST_2
1000pF C854
M
_S
C
L
COMP2_PB
R
X
D
56
R
852
10
R
848
DDR2_DQS1M
+
5
V
S
T
_
M
S
T
33 R843
150 R885
56
AR806
M
E
M
C
_R
X
E
0-
I2
S
_
W
S
1K R8018
47 R8041
33K
R887
S
P
I_
C
L
K
TMDS1_RX1-
56
AR809
ISA1530AC1
Q801
E
B
C
0
.1
u
F
C
883
0
R
894
100
R
893
10 R891
MX25L6405DMI-12G
IC802
IC802_MSTAR
3 NC_1
2 VCC
4 NC_2
1 HOLD
6 NC_4
5 NC_3
7 CS
8 SO/SIO1 9 WP/ACC
10 GND
11 NC_5
12 NC_6
13 NC_7
14 NC_8
15 SI. SIO0
16 SCLK
+1.8V
47uF 25V
C870
0
R
806
MODEL_OPT1
+3.3V_MULTI_MST +3.3V_MULTI_MST
MODEL_OPT2
M
O
D
E
L
_O
P
T
2
M
O
D
E
L
_O
P
T
1
OPC_EN
P
O
W
E
R
_D
E
T
0
R
8033
READY
0. 1uF C833
0. 1uF C869
0. 1uF C868
0.01uF
C
840
0. 01uF
C859
0. 1uF C838
0. 1uF C806
0. 1uF C805
0. 1uF C804
0.047uF C852
0.047uF C827
0.047uF C825
0.047uF C845
0.047uF C828
0.047uF C832
0.047uF C855
0.047uF C8002
0.047uF C826
0.047uF C834
0.047uF C847
0.047uF C831
0.047uF C829
0.047uF C830
0.047uF C836
0.047uF C837
0.047uF C851
0.047uF C843
0.047uF C8001
0. 1uF C815
0. 1uF C819
0. 01uF
C880
0
.1
u
F
C
882
0.01uF
C
876
0. 01uF
C881
0. 1uF C842
0.01uF C850
47 R838
47 R8042
47 R832
47 R875
47 R8019
47 R817
47 R833
47 R834
47 R815
47 R816
47 R804
47 R818
47 R876
47 R836
47 R837
47 R814
470 R835
470 R819
470 R803
100
R
8017
100
R
8016
4.7K
R8010
READY
4.7K
R8011
100
R
8039
100
R
8040
1K
R884
READY
1K
R811
READY
1K
R889
1K
R883
220 R808
470
R809
68
R810
0
.1
u
F
C
808
1000pF
C
818
0. 01uF
C857
4.7K
R898
4.7K
READY
R896
4.7K R864
4.7K R863
1K
R853
+3.3V_MULTI_MST
10uF 16V
C866
0. 1uF
C867
+3.3V_AVDD_33_DM
+3.3V_LPLL_VDDP
+3.3V_AVDD_33_DM
+3.3V_AVDD_AU
+
3
.3
V
_
A
V
D
D
_
A
U
+
3
.3
V
_
A
V
D
D
_
3
3
_
D
M
+3.3V_LPLL_VDDP
IC800
1 RXBCKN
2 RXBCKP
3 RXB0N
4 RXB0P
5 HOTPLUGB
6 RXB1N
7 RXB1P
8 AVDD_33_1
9 RXB2N
10 RXB2P
11 RXACKN
12 RXACKP
13 RXA0N
14 RXA0P
15 AVDD_33_2
16 RXA1N
17 RXA1P
18 GND_1
19 RXA2N
20 RXA2P
21 HOTPLUGA
22 REXT
23 VCLAMP
24 REFP
25 REFM
26 BIN1P
27 SOGIN1
28 GIN1P
29 RIN1P
30 BINM
31 BIN0P
32 GINM
33 GIN0P
34 SOGIN0
35 RINM
36 RIN0P
37 AVDD_33_3
38 GND_2
39 BIN2P
40 GIN2P
41 SOGIN2
42 RIN2P
43 CVBS6
44 CVBS5
45 CVBS4
46 CVBS3
47 CVBS2
48 CVBS1
49 VCOM1
50 CVBS0
51 VCOM0
52 AVDD_33_4
53 CVBSOUT
54 GND_3
55 SIF0P
56 SIF0M
57 VDDC_1
58 AUL5
59 AUR5
60 AUVRM
61 AUOUTL2
62 AUOUTR2
63 AUOUTL1
64 AUOUTR1
6
5
A
U
L
0
6
6
A
U
R
0
6
7
A
U
L
1
6
8
A
U
R
1
6
9
A
U
L
2
7
0
A
U
R
2
7
1
A
U
L
3
7
2
A
U
R
3
7
3
A
U
C
O
M
7
4
A
U
L
4
7
5
A
U
R
4
7
6
G
N
D
_4
7
7
A
U
V
R
P
7
8
A
U
V
A
G
7
9
A
V
D
D
_A
U
8
0
G
N
D
_5
8
1
V
D
D
C
_2
8
2
D
D
C
A
_C
K
8
3
D
D
C
A
_D
A
8
4
D
D
C
D
A
_C
K
8
5
D
D
C
D
A
_D
A
8
6
D
D
C
D
B
_C
K
8
7
D
D
C
D
B
_D
A
8
8
G
P
IO
2
0
8
9
V
D
D
P
_
1
9
0
V
D
D
C
_3
9
1
U
A
R
T
2_R
X
9
2
U
A
R
T
2_T
X
9
3
D
D
C
D
C
_C
K
9
4
R
X
C
C
K
N
9
5
R
X
C
C
K
P
9
6
D
D
C
D
C
_D
A
9
7
R
X
C
0N
9
8
R
X
C
0
P
9
9
G
N
D
_6
1
0
0
R
X
C
1N
1
0
1
R
X
C
1
P
1
0
2
A
V
D
D
_D
M
1
0
3
R
X
C
2N
1
0
4
R
X
C
2
P
1
0
5
H
O
T
P
L
U
G
C
1
0
6
U
S
B
1_D
M
1
0
7
U
S
B
1
_
D
P
1
0
8
S
C
K
1
0
9
S
D
I
1
1
0
S
D
O
1
1
1
S
C
Z
1
1
2
P
W
M
0
1
1
3
P
W
M
1
1
1
4
P
W
M
2
1
1
5
P
W
M
3
1
1
6
L
V
A
4
P
1
1
7
L
V
A
4M
1
1
8
L
V
A
3
P
1
1
9
L
V
A
3M
1
2
0
L
V
A
C
K
P
1
2
1
L
V
A
C
K
M
1
2
2
L
V
A
2
P
1
2
3
L
V
A
2M
1
2
4
L
V
A
1
P
1
2
5
L
V
A
1M
1
2
6
L
V
A
0
P
1
2
7
L
V
A
0M
1
2
8
V
D
D
P
_
2
129 LVB4P
130 LVB4M
131 LVB3P
132 LVB3M
133 LVBCKP
134 LVBCKM
135 LVB2P
136 LVB2M
137 LVB1P
138 LVB1M
139 LVB0P
140 LVB0M
141 AVDD_LPLL
142 GND_7
143 VDDC_4
144 GPIO150/I2C_OUT_MUTE
145 GPIO151/I2C_OUT_SD2
146 GPIO152/I2C_OUT_SD3
147 GND_8
148 GPIO51
149 GPIO52
150 GPIO53
151 GPIO54
152 GPIO55
153 GPIO56
154 GPIO57
155 GPIO58
156 VDDP_3
157 VDDC_5
158 B_MDATA[4]
159 B_MDATA[3]
160 GND_9
161 B_MDATA[1]
162 B_MDATA[6]
163 AVDD_DDR_1
164 B_MDATA[11]
165 B_MDATA[12]
166 GND_10
167 B_MDATA[9]
168 B_MDATA[14]
169 AVDD_DDR_2
170 B_DDR2_DQM[1]
171 B_DDR2_DQM[0]
172 GND_11
173 B_DDR2_DQS[0]
174 B_DDR2_DQSB[0]
175 AVDD_DDR_3
176 VDDP_4
177 GND_12
178 B_DDR2_DQS[1]
179 B_DDR2_DQSB[1]
180 AVDD_DDR_4
181 B_MDATA[15]
182 B_MDATA[8]
183 GND_13
184 B_MDATA[10]
185 B_MDATA[13]
186 AVDD_DDR_5
187 B_MDATA[7]
188 B_MDATA[0]
189 B_MDATA[2]
190 B_MDATA[5]
191 B_MCLK
192 B_MCLKZ 1
9
3
G
N
D
_
1
4
1
9
4
A
V
D
D
_M
E
M
P
L
L
1
9
5
M
V
R
E
F
1
9
6
A
_O
D
T
1
9
7
A
_R
A
S
Z
1
9
8
A
_C
A
S
Z
1
9
9
A
_
M
A
D
R
[0
]
2
0
0
A
_
M
A
D
R
[2
]
2
0
1
A
_
M
A
D
R
[4
]
2
0
2
G
N
D
_
1
5
2
0
3
A
_
M
A
D
R
[6
]
2
0
4
A
_
M
A
D
R
[8
]
2
0
5
A
_
M
A
D
R
[1
1
]
2
0
6
A
_W
E
Z
2
0
7
A
_
B
A
D
R
[1
]
2
0
8
A
_
B
A
D
R
[0
]
2
0
9
A
_
M
A
D
R
[1
]
2
1
0
A
_
M
A
D
R
[1
0
]
2
1
1
A
V
D
D
_D
D
R
_6
2
1
2
A
_
M
A
D
R
[5
]
2
1
3
A
_
M
A
D
R
[9
]
2
1
4
A
_
M
A
D
R
[1
2
]
2
1
5
A
_
M
A
D
R
[7
]
2
1
6
A
_
M
A
D
R
[3
]
2
1
7
A
_M
C
L
K
E
2
1
8
V
D
D
C
_6
2
1
9
I2
S
_
IN
_
W
S
/G
P
IO
6
7
2
2
0
I2
S
_
IN
_
B
C
K
/G
P
IO
6
8
2
2
1
I2
S
_
IN
_
S
D
2
2
2
I2
S
_
O
U
T
_
M
C
K
2
2
3
I2
S
_
O
U
T
_
W
S
2
2
4
V
D
D
P
_
5
2
2
5
G
N
D
_
1
6
2
2
6
V
D
D
C
_7
2
2
7
I2
S
_
O
U
T
_
B
C
K
2
2
8
I2
S
_
O
U
T
_
S
D
2
2
9
S
P
D
IF
O
2
3
0
U
A
R
T
2
_
R
X
/I2
C
M
_
S
D
A
2
3
1
U
A
R
T
2
_
T
X
/I2
C
M
_
S
C
K
2
3
2
U
A
R
T
1
_
R
X
/G
P
IO
8
6
2
3
3
U
A
R
T
1
_
T
X
/G
P
IO
8
7
2
3
4
G
N
D
_
1
7
2
3
5
G
N
D
_
1
8
2
3
6
U
S
B
0_D
M
2
3
7
U
S
B
0
_
D
P
2
3
8
S
A
R
0
2
3
9
S
A
R
1
2
4
0
S
A
R
2
2
4
1
S
A
R
3
2
4
2
A
V
D
D
_M
P
L
L
2
4
3
X
O
U
T
2
4
4
X
IN
2
4
5
G
P
IO
1
3
4
2
4
6
G
P
IO
1
3
5
2
4
7
G
P
IO
1
3
8
2
4
8
G
P
IO
1
3
9
2
4
9
G
P
IO
1
4
0
2
5
0
IR
IN
2
5
1
H
S
Y
N
C
0
2
5
2
V
S
Y
N
C
0
2
5
3
H
S
Y
N
C
1
2
5
4
V
S
Y
N
C
1
2
5
5
C
E
C
2
5
6
H
W
R
E
S
E
T
10K
R8031
DDC_WP
RT1C3904-T112
Q805
E
B
C
2K
R886
3.3K R8029
4.7K R8032
0
R8037
4. 7uF
10V
READY
C871
1K
R861
0
R8002
MEMC_RESET
MLB-201209-0120P-N2
L801READY
MLB-201209-0120P-N2
L802
4.7K
READY
R899 +3.3V_MST
20pF
C
817
20pF
C
816
47 R831
47 R857
47 R830
47 R897
47 R802
20K
R8036
MLB-201209-0120P-N2
L803
1uF C810
B
L
T
_
D
P
B
L
T
_D
N
T
U
_
R
E
S
E
T
4.7K R8009
+3.3V_MST
MLB-201209-0120P-N2
L800
+3.3V_AVDD_AU
1uF
C878
0. 1uF
C877
0. 1uF
C811
DDR2_D[4]
DDR2_D[1]
DDR2_D[0]
DDR2_D[8]
DDR2_D[5]
D
D
R
2_A
[5]
DDR2_D[9]
DDR2_D[13]
D
D
R
2_A
[11]
D
D
R
2_A
[2]
D
D
R
2_A
[8]
DDR2_D[14]
D
D
R
2_A
[7]
DDR2_D[12]
D
D
R
2_A
[0]
DDR2_D[15]
DDR2_D[6]
DDR2_D[3]
D
D
R
2_A
[6]
D
D
R
2_A
[12]
D
D
R
2_A
[1]
DDR2_D[10]
D
D
R
2_A
[3]
DDR2_D[11]
D
D
R
2_A
[4]
DDR2_D[7]
D
D
R
2_A
[10]
D
D
R
2_A
[9]
DDR2_D[2]
EAX61181901
Mstar LCD SL80
H6 SL80
MAIN Mstar 8 1 2
2009/ 04/ 02
HDMI_3
R8014:M_SCL_REAR
R8015:M_SDA_REAR
C
lo
s
e
to
I
C
w
ith
w
id
th
tr
a
c
e
C804/ C805/ C806: Cl ose t o I C
a s c l o s e a s p o s s i b l e
H
D
M
I_
1
EEPROM
GAIN X 4
H
D
M
I_
2
Cl o s e t o I C a s c l o s e a s p o s s i b l e
U
S
B
P
A
R
T
[MODE SELECTION]
I2S_OUT
RESET
HDCPEEPROMREADY
SERIAL FLASH 8M
R
8
9
3
:A
U
D
IO
_
S
W
R898
4.7K 100HZ
4.7K
R8010
X
X
4.7K
4.7K
X 4.7K
X
**H/W OPTION
X
4.7K
4.7K
Non Small FHD
4.7K
X
X
X 4.7K
4.7K
R896
X
4.7K
R8011
Apol l o
4.7K
Smal l HD(19/ 22)
X
Smal l FHD (27)
Non Small HD
4.7K
4.7K
Cl o s e t o I C Pi n
LGE3767A
MST99A88ML
(MATRIX ONLY SD DIVX_ NON RM)
Copyright 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
56 R904
1
K
R
9
0
8
0. 01uF C916
0. 01uF C914
0. 01uF C906
0. 01uF C908
0. 01uF C910
0. 01uF C903
150 R906
READY
0. 01uF C909
0. 01uF C915
56 R901
0. 01uF C911
0. 01uF
C904
0. 01uF C901
56 R905
0. 01uF C912
56 R903
0. 01uF C907
0. 01uF C913
0. 01uF C902
+1.8V_DDR
0. 01uF C917
56 R900
1
K
R
9
0
7
56 R902
0. 1uF
50V
C918
1000pF
C905
DDR2_A[0-12]
DDR2_BA0
DDR2_BA1
DDR2_MCLK
DDR2_MCLKZ
DDR2_CKE
DDR2_ODT
DDR2_RASZ
DDR2_CASZ
DDR2_WEZ
DDR2_DQS0P
DDR2_DQS1P
DDR2_DQM0
DDR2_DQM1
DDR2_DQS0M
DDR2_DQS1M
DDR2_D[0-15]
0. 01uF
C900
+1.8V_DDR
+1.8V_DDR
10uF 10V
C919
H5PS5162FFR-S6C
IC900-*1
DDR2_HYNIX J 2 VREF
J 8 CK
H2 VSSQ2
B7 UDQS
N8 A4
P8 A8
L1 NC4
L2 BA0
R8 NC3
K7 RAS
F8 VSSQ3
F3 LDM
P3 A9
M3 A1
N3 A5
K8 CK
R3 NC5
L3 BA1
J 7 VSSDL
L7 CAS
F2 VSSQ4
B3 UDM
M2 A10/AP
K2 CKE
R7 NC6
M7 A2
N7 A6
M8 A0
J 1 VDDL
K3 WE
E8 LDQS
P7 A11
K9 ODT
A2 NC1
N2 A3
P2 A7
H8 VSSQ1
F7 LDQS
A8 UDQS
R2 A12
L8 CS
E2 NC2
E7 VSSQ5
D8 VSSQ6
D2 VSSQ7
A7 VSSQ8
B8 VSSQ9
B2 VSSQ10
P9 VSS1
N1 VSS2
J 3 VSS3
E3 VSS4
A3 VSS5
G9 VDDQ1
G7 VDDQ2
G3 VDDQ3
G1 VDDQ4
E9 VDDQ5
C9 VDDQ6
C7 VDDQ7
C3 VDDQ8
C1 VDDQ9
A9 VDDQ10
R1 VDD1
M9 VDD2
J 9 VDD3
E1 VDD4
A1 VDD5
B9 DQ15
B1 DQ14
D9 DQ13
D1 DQ12
D3 DQ11
D7 DQ10
C2 DQ9
C8 DQ8
F9 DQ7
F1 DQ6
H9 DQ5
H1 DQ4
H3 DQ3
H7 DQ2
G2 DQ1
G8 DQ0 HYB18TC512160CF-2.5
IC900
DDR2_400Mhz_QIMONDA J2 VREF
J8 CK
H2 VSSQ2
B7 UDQS
N8 A4
P8 A8
L1 NC4
L2 BA0
R8 NC3
K7 RAS
F8 VSSQ3
F3 LDM
P3 A9
M3 A1
N3 A5
K8 CK
R3 NC5
L3 BA1
J7 VSSDL
L7 CAS
F2 VSSQ4
B3 UDM
M2 A10/AP
K2 CKE
R7 NC6
M7 A2
N7 A6
M8 A0
J1 VDDL
K3 WE
E8 LDQS
P7 A11
K9 ODT
A2 NC1
N2 A3
P2 A7
H8 VSSQ1
F7 LDQS
A8 UDQS
R2 A12
L8 CS
E2 NC2
E7 VSSQ5
D8 VSSQ6
D2 VSSQ7
A7 VSSQ8
B8 VSSQ9
B2 VSSQ10
P9 VSS1
N1 VSS2
J3 VSS3
E3 VSS4
A3 VSS5
G9 VDDQ1
G7 VDDQ2
G3 VDDQ3
G1 VDDQ4
E9 VDDQ5
C9 VDDQ6
C7 VDDQ7
C3 VDDQ8
C1 VDDQ9
A9 VDDQ10
R1 VDD1
M9 VDD2
J9 VDD3
E1 VDD4
A1 VDD5
B9 DQ15
B1 DQ14
D9 DQ13
D1 DQ12
D3 DQ11
D7 DQ10
C2 DQ9
C8 DQ8
F9 DQ7
F1 DQ6
H9 DQ5
H1 DQ4
H3 DQ3
H7 DQ2
G2 DQ1
G8 DQ0
EDE5116AJBG-8E-E
IC900-*2
DDR2_ELPIDA J 2 VREF
J 8 CK
H2 VSSQ_2
B7 UDQS
N8 A4
P8 A8
L1 NC_4
L2 BA0
R8 NC_3
K7 RAS
F8 VSSQ_3
F3 LDM
P3 A9
M3 A1
N3 A5
K8 CK
R3 NC_5
L3 BA1
J 7 VSSDL
L7 CAS
F2 VSSQ_4
B3 UDM
M2 A10
K2 CKE
R7 NC_6
M7 A2
N7 A6
M8 A0
J 1 VDDL
K3 WE
E8 LDQS
P7 A11
K9 ODT
A2 NC_1
N2 A3
P2 A7
H8 VSSQ_1
F7 LDQS
A8 UDQS
R2 A12
L8 CS
E2 NC_2
E7 VSSQ_5
D8 VSSQ_6
D2 VSSQ_7
A7 VSSQ_8
B8 VSSQ_9
B2 VSSQ_10
P9 VSS_1
N1 VSS_2
J 3 VSS_3
E3 VSS_4
A3 VSS_5
G9 VDDQ_1
G7 VDDQ_2
G3 VDDQ_3
G1 VDDQ_4
E9 VDDQ_5
C9 VDDQ_6
C7 VDDQ_7
C3 VDDQ_8
C1 VDDQ_9
A9 VDDQ_10
R1 VDD_1
M9 VDD_2
J 9 VDD_3
E1 VDD_4
A1 VDD_5
B9 DQ15
B1 DQ14
D9 DQ13
D1 DQ12
D3 DQ11
D7 DQ10
C2 DQ9
C8 DQ8
F9 DQ7
F1 DQ6
H9 DQ5
H1 DQ4
H3 DQ3
H7 DQ2
G2 DQ1
G8 DQ0
DDR2_A[0]
DDR2_A[1]
DDR2_A[2]
DDR2_A[3]
DDR2_A[4]
DDR2_A[5]
DDR2_A[6]
DDR2_A[7]
DDR2_A[8]
DDR2_A[9]
DDR2_A[10]
DDR2_A[11]
DDR2_A[12]
DDR2_D[0]
DDR2_D[1]
DDR2_D[2]
DDR2_D[3]
DDR2_D[4]
DDR2_D[5]
DDR2_D[6]
DDR2_D[7]
DDR2_D[8]
DDR2_D[9]
DDR2_D[10]
DDR2_D[11]
DDR2_D[12]
DDR2_D[14]
DDR2_D[15]
DDR2_D[13]
#9.DDR2
DDR2 MEMORY
C
l
o
s
e

t
o

D
D
R
2

I
C
Cl ose t o DDR2 I C
EAX61181901
Mstar LCD SL80
H6 SL80
9 1 2 MAIN_DDR
2009/ 04/ 02
Copyright 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
RT1C3904-T112
Q1004
E
B
C
+1.8V
AZ1085S-3.3TR/E1
IC1003
1
ADJ/GND
2 OUTPUT 3 INPUT
33K
R1049
0 R1073
100uF16V
C1009
33K
R1065
560pF
C1012
RT1C3904-T112
Q1001
E
B
C
0. 1uF
C1054
2.2K
R1050
+1.8V_DDR
POWER_SW
BD9130EFJ-E2
IC1001
3
ITH
2
VCC
4
GND
1
ADJ
5
PGND
6
SW
7
PVCC
8
EN
1uF
C1048 1UF
SI4925BDY
EBK32753101
Q1003
3
S2
2
G1
4
G2
1
S1
5
D2_1
6
D2_2
7
D1_1
8
D1_2
P_12V
AP1117EG-13
IC1002
1
ADJ/GND
2 OUT 3 IN
3.3K
R1010
+3.3V_MULTI_MST
+12V_LCD
+5V_MULTI
+1.2V_VDDC_MST
0. 1uF
C1014
10K R1068
10K R1006
22K
R1070
12K R1008
1.6K
R1069
PANEL_ON
2.2K
R1051
0. 01uF
C1010
+5V_MULTI P_5V
0. 1uF
C1015
10uF
C1022
10K R1048
10uF 16V
C1019
0. 1uF
C1005
10uF
C1016
+5V_MULTI
0. 1uF
C1023
2.2K
R1052
100uF 16V
C1028
0. 01uF
C1021
1uF 25V
C1047
2K
R1009
10uF 16V
C1004
10uF 16V
C1013
10uF 16V
C1018
10uF 16V
C1025
300
R1004
150
R1007
+12V_AUDIO
2SC3875S
Q1002 1
2
3
0. 1uF
READY
C1024
PANEL_STATUS
P_16V
+3.3V_MST
10K R1003
I-DIM
10K
R1002
0. 01uF
C1007
+16V_NTP
FM20020-24
P1000
19 NC
14 12V
9 5.2V
4 GND
18 24V
13 12V
8 5.2V
3 GND
17 24V
12 GND
7 5.2V
2 Power_On
16 GND
11 GND
6 GND
1 NC
20 INV_ON
15 GND
10 5.2V
5 GND
21 A.DIM 22 Err_Out
23 NC 24 PWM_DIM
25
+5VST_MST
READY
C1020
P_16V
0 R1067
+5VST_MST
0 NON_LGD
R1053
RL_ON
10uF 16V
C1052
2. 2uF
C1044
+5VST_MST
10K R1001
P_5V
0. 01uF
C1008
AP2121N-3.3TRE1
IC1007
1
GND
2 VOUT 3 VIN
+5V_MULTI 0. 01uF
C1046
2. 2uF 16V
C1045
READY
0. 01uF
C1053
10uF16V
C1003
OPC_OUT1
P_5V
P_12V
DISP_EN/VAVS_ON
10K R1047
P_12V
47uF 25V
C1002
2SC3875S
Q1000
1
2
3
0
READY
R1066
SAM2333
LD1002
P_5V
68uF35V
C1006
P_16V
P_12V
+5V_MULTI
0. 1uF
C1001
1.2K
R1005
0. 01uF
C1011
P_5V
OPC_OUT2
500 L1000
2.2uH
L1002
68uF
35V
READY
C1027
3K
R1046
0. 1uF
C1036
0. 1uF
C1032
1uF 25V
READY
C1041
0. 1uF
C1034
1uF 25V
READY
C1037
1uF 25V
READY
C1039
2.2K
R1000
1K R1012
L1001
MLB-201209-0120P-N2
MLB-201209-0120P-N2
L1004
READY
MLB-201209-0120P-N2
L1005
MLB-201209-0120P-N2
L1006
MLB-201209-0120P-N2
L1007
MLB-201209-0120P-N2
L1012
MLB-201209-0120P-N2
L1013
10K
R1017
0
R1074
2. 2uF
16V
2.2UF
C1048-*1
6.2K
R1011
10uF 16V
C1000
P_12V
0
R1056
MP2212DN
IC1006
3 IN
2 GND
4 BS
1 FB
5 VCC
6 SW_1
7 SW_2
8 EN/SYNC
10uF 16V
C1029
1
1
0
R
1
0
1
5
0. 1uF
C1026
+5V_TUNER
100uF 16V
C1043
0
.4
7
u
F
C
1
0
3
3
0. 1uF
C1040 3.6uH
L1009
10uF 25V
C1031
330
R1014
1uF 25V
READY
C1038
10uF 25V
C1030
43K
R1057
5.6K
R1058
500 L1010
0 R1055
AP1117EG-13
IC1004
1
ADJ/GND
2 OUT 3 IN
1
1
0
R
1
0
1
3
330
R1016
100uF 16V
C1049
100uF16V
C1017
10K R1059
READY
500 L1008
0. 1uF
C1042
1uF 25V
C1035
AP1117EG-13
IC1000
1
ADJ/GND
2OUT 3 IN
2
K
R
1
0
1
8
R
E
A
D
Y
+5V_MULTI
+5V_USB
10
R1019
EAX61181901
Mstar LCD SL80
POWER
H6 SL80
1 0 1 2
2009/ 04/ 02
DDR2, Vref
MAX3A
**Switch 12V:P12V
**Switch 5V:5V_MULTI -> 1.8V
OUT:3.3V
**5V_MULTI-->1.2V
V0 = 1. 25*( 1+( R2/ R1) )
R1
R2
OUT:1.27V
MAX1A
NTP,AUDIO DSP
R1 MAX2A
R2
**5V_MULTI->3.3V->1.8V
V0 = 0. 8*( 1+( R2/ R1) )
*ST 5V->3.3V
LED Block
Cl ose t o Q1003
**DC-DC CONVERTER_READY
12V->5V_TUNER/USB
OUT:6.8V
R1=R2*((Vo/ 0. 8)-1)
R1
MAX3A R2
MAX1A
MAX1A
Copyright 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
URSA_D0P
MEMC_DQSB2
100
R1146
URSA_D1M
URSA_C4M
0. 1uF C1123
MEMC_MCLKZ
U
R
S
A
_A
2M
+1.8V_MEMC
0 R1130
READY
URSA_D3M
0
READY
R1132
M
E
M
C
_R
X
O
4+
1
0
u
F
1
6
V
C
1
1
5
0
4.7K
READY
R1129
URSA_C3P
OPC_EN
URSA_C0M
M
E
M
C
_M
C
L
K
1
M_SPI_CK
URSA_D1M
OPC_OUT2
URSA_D4M
120-ohm L1103
120-ohm
L1105
OPC_OUT1
URSA_A3P
E-DIM
0 . 0 1 u F
C
1 1 3 3
M
E
M
C
_R
X
E
C
+
URSA_B3P
M
E
M
C
_D
Q
M
0
URSA_B4P
0
. 1
u
F
C
1 1 3 4
URSA_D2P
URSA_DCKM
U
R
S
A
_A
0M
URSA_C1P
820 R1110
10uF C1140
URSA_C2P
U
R
S
A
_B
1M
URSA_B1M
URSA_D4P
+3.3V_MEMC
M_XTALI
1M R1124
M_SPI_CK
MEMC_DQM3
URSA_CCKP
M
E
M
C
_R
X
E
2-
MEMC_DQM2
URSA_D3P
URSA_B2P
0. 1uF C1143
M
E
M
C
_D
Q
S
B
1
M
E
M
C
_R
X
O
2+
M_SPI_DO
MEMC_DQS2
0. 1uF C1107
M_XTALO
+3.3V_MEMC
0
.1
u
F
C
1
1
5
2
MEMC_DQS3
URSA_B2M
MEMC_DQSB3
URSA_D1P
M
E
M
C
_R
X
E
4-
URSA_C0P
M_SDA
M
E
M
C
_D
Q
M
1
0. 1uF C1119
BLM18PG121SN1D
L1106
MEMC_DQ[0-15]
ISP_RXD_TR
URSA_B0P
56 R1121
URSA_B3M
100
R1153
URSA_D3P
0
R
1109
100
R1154
M
E
M
C
_R
X
E
1-
0
. 1
u
F
C
1 1 0 1
0. 1uF C1142
100
R1157
U
R
S
A
_
A
1
P
URSA_BCKM
100
R1152
U
R
S
A
_
A
4
P
M
E
M
C
_R
X
O
1-
M_SPI_DI
100
R1155
M
E
M
C
_R
X
O
0+
U
R
S
A
_
B
1
P
URSA_C3P
100
R1156
URSA_A4M
MEMC_DQ[16-31]
56 R1125
1K
READY
R1115
22uF 16V C1115
URSA_C2P
URSA_B3M
0
. 1
u
F
C
1 1 3 6
URSA_C1M
URSA_DCKP
URSA_BCKP
+3.3V_MEMC
22uF C1139
LVDS_SEL
+3.3V_MEMC
M
E
M
C
_R
X
O
C
-
+1.26V_MEMC
URSA_C3M
+3.3V_MEMC
M
E
M
C
_R
X
E
3+
120-ohm L1104
URSA_D2M
URSA_C0P
URSA_ACKM
U
R
S
A
_A
3M
URSA_D0M
10K
R1104
10K
R1103
ISP_RXD_TR
M
E
M
C
_R
X
O
3+
10uF
10V
C
1126
M
E
M
C
_R
X
E
1+
URSA_BCKM
URSA_D2M
0. 1uF C1109
1K
READY
R1102
U
R
S
A
_
A
2
P
0. 1uF
C1149
URSA_C2M
URSA_B2P
URSA_B1P
U
R
S
A
_A
1M
URSA_D2P
1uF
C1103
10uF C1116
0
. 1
u
F
C
1 1 3 0
1K R1101
+3.3V_MEMC
URSA_D4P
URSA_A0P
URSA_C4P
U
R
S
A
_A
C
K
P
LED_DEMO
0. 1uF C1110
M
E
M
C
_R
X
E
0-
0
. 1
u
F
C
1 1 3 7
0. 1uF C1124
URSA_CCKM
ISP_TXD_TR
0. 1uF C1105
URSA_C4M
0. 1uF C1108
URSA_C4P
0. 1uF C1144
0
.1
u
F
C
1114
URSA_B0M
120-ohm L1101
0. 1uF C1122
URSA_A4P
AFLC_EN
15pF
C1147
MEMC_ODT
U
R
S
A
_
A
0
P
U
R
S
A
_B
0M
LED_DEMO
URSA_B3P
M
E
M
C
_R
X
O
C
+
LVDS_SEL
1K
R1116
MEMC_MCLK
0
.1
u
F
C
1113
URSA_A1P
URSA_C0M
M
E
M
C
_R
A
S
Z
URSA_C1P
U
R
S
A
_
B
0
P
0. 1uF C1141
M
E
M
C
_R
X
E
3-
15pF
C1148
M
E
M
C
_W
E
Z
0. 1uF C1125
M
E
M
C
_R
X
O
3-
M
E
M
C
_R
X
E
4+
120-ohm L1102
M
E
M
C
_R
X
O
4-
M
E
M
C
_D
Q
S
B
0
0. 1uF
C1102
M
E
M
C
_B
A
1
AFLC_EN
0
. 1
u
F
C
1 1 2 8
URSA_D0P
1K
READY
R1117
URSA_D0M
ISP_TXD_TR
M
E
M
C
_R
X
E
2+
URSA_C3M
URSA_BCKP
10uF C1121
M_SPI_CZ
0
. 1
u
F
C
1 1 3 8
URSA_C2M
10K R1122
URSA_A3M
M
E
M
C
_D
Q
S
0
1K
R1114
M
E
M
C
_C
A
S
Z
M_SPI_CZ
+3.3V_MEMC
M
E
M
C
_M
C
L
K
E
M
E
M
C
_R
X
O
1+
URSA_B4M
U
R
S
A
_A
C
K
M
URSA_D1P
URSA_A2M
0
. 1
u
F
C
1 1 3 1
56 R1120
0
. 1
u
F
C
1 1 2 9
U
R
S
A
_A
4M
U
R
S
A
_
A
3
P
URSA_D4M
10K
R1111
W25X20AVSNIG
IC1101
IC1101_URSA_winbond
3 WP
2 DO
4 GND
1 CS
5 DIO
6 CLK
7 HOLD
8 VCC
+12V_LCD
MEMC_A[0-12]
10uF C1117
0. 1uF C1145
M
E
M
C
_B
A
0
M
E
M
C
_D
Q
S
1
56 R1126
M_SPI_DI
M_SCL
M
_
X
T
A
L
I
0
. 1
u
F
C
1 1 3 2
0. 1uF C1118
10uF 10V C1120
URSA_ACKP
URSA_A2P
0. 1uF C1111
1uF
C
1135
0. 1uF C1112
URSA_A1M
MEMC_RESET
M
E
M
C
_R
X
O
0-
URSA_CCKP
12MHz X1101
URSA_B2M
10uF
C
1127
0. 1uF C1106
URSA_B4M
M
E
M
C
_M
C
L
K
Z
1
M
E
M
C
_R
X
E
0+
22uF 16V C1104
URSA_A0M
0. 1uF C1146
+3.3V_MEMC
URSA_DCKM
URSA_B4P
M
E
M
C
_R
X
O
2-
URSA_DCKP
+3.3V_MEMC
100
R1151
M_SPI_DO
+3.3V_MEMC
100
R1150
M
E
M
C
_R
X
E
C
-
M
_X
T
A
L
O
100
R1149
URSA_C1M
100
R1148
1
0
0
0
p
F
C
1
1
5
1
URSA_CCKM
URSA_D3M
100
R1147
0 READY R1141
0 R1113 VESA
0 R1145
READY
0 READY R1143
0 READY R1140
0 R1119 READY
0 R1136 READY
0
READY
R1144
0 READY
R1137
0 READY R1142
22 R1138
22
OPC_EN
R1128
22 R1123
READY
22 R1139
4.7K
READY
R1134
4.7K
READY
R1133
4.7K
READY
R1135
4.7K R1112
JEIDA
4.7K READYR1131
4.7K
READY
R1118
470
R1127
[ E1]
[D1]
[ L9]
[N5]
[N4]
[N12]
[N13]
LGE7329A
IC1100
E1 SDAS
D1 SCLS
F1 GPIO[8]
G1 GPIO[9]
K8 GND_14
E5 VDDC_1
E2 GPIO[10]
F2 GPIO[11]
F3 GPIO[12]
G2 GPIO[13]
M4 GPIO[22]
M5 GPIO[23]
G3 GPIO[14]
E4 GPIO[15]
F4 GPIO[16]
G4 GPIO[17]
H4 GPIO[18]
J4 GPIO[19]
K4 GPIO[20]
L4 GPIO[21]
J6 VDDP_2
H9 GND_7
F6 VDDC_2
H1 MDATA[20]
H2 MDATA[19]
H3 MDATA[17]
J1 MDATA[22]
J2 MDATA[27]
J3 MDATA[28]
K1 MDATA[25]
K2 MDATA[30]
K6 AVDD_DDR_2
K3 DQM[3]
L1 DQM[2]
J8 GND_10
L2 DQS[2]
L3 DQSB[2]
L6 AVDD_DDR_4
L8 VDDP_3
H10 GND_8
M1 DQS[3]
M2 DQSB[3]
L7 AVDD_DDR_5
M3 MDATA[31]
N1 MDATA[24]
J9 GND_11
N2 MDATA[26]
N3 MDATA[29]
L10 AVDD_DDR_6
P1 MDATA[23]
R1 MDATA[16]
T1 MDATA[18]
T2 MDATA[21]
R2 MCLK[0]
P2 MCLKZ[0]
G7 GND_1
L9 AVDD_MEMPLL
N5 MVREF
N4 ODT
T
3
RA
SZ
R
3
CA
SZ
P3
M
A
D
R
[0]
T
4
M
A
D
R
[2]
R
4
M
A
D
R
[4]
J10
G
N
D
_12
P4
M
A
D
R
[6]
T
5
M
A
D
R
[8]
R
5
M
A
D
R
[11]
P5
W
EZ
T
6
B
A
D
R
[1]
R
6
B
A
D
R
[0]
P6
M
A
D
R
[1]
T
7
M
A
D
R
[10]
L
11
A
V
D
D
_D
D
R_7
R
7
M
A
D
R
[5]
P7
M
A
D
R
[9]
T
8
M
A
D
R
[12]
R
8
M
A
D
R
[7]
P8
M
A
D
R
[3]
N
8
M
CLKE
K
10
G
N
D
_16
F7
V
D
D
C_3
T
9
M
D
A
TA
[4]
R
9
M
D
A
TA
[3]
K
7
G
N
D
_13
P9
M
D
A
TA
[1]
T
10
M
D
A
TA
[6]
K
11
A
V
D
D
_D
D
R_3
R
10
M
D
A
TA
[11]
P10
M
D
A
TA
[12]
T
11
M
D
A
TA
[9]
R
11
M
D
A
TA
[14]
J11
A
V
D
D
_D
D
R_1
P11
D
Q
M
[1]
T
12
D
Q
M
[0]
R
12
D
Q
S[0]
P12
D
Q
SB
[0]
H
11
V
D
D
P_1
T
13
D
Q
S[1]
R
13
D
Q
SB
[1]
P13
M
D
A
TA
[15]
T
14
M
D
A
TA
[8]
R
14
M
D
A
TA
[10]
P14
M
D
A
TA
[13]
T
15
M
D
A
TA
[7]
R
15
M
D
A
TA
[0]
P15
M
D
A
TA
[2]
T
16
M
D
A
TA
[5]
R
16
M
C
LK
[1]
P16
M
C
LK
Z[1]
N
9
G
P
IO
[26]
N
10
G
P
IO
[27]
N
11
G
N
D
_17
M
11
R
ESET
G
6
V
D
D
C_4
N12 GPIO[28]
N13 GPIO[29]
N14 GPIO[30]
L13 SCK
M13 SDI
M12 SDO
K13 CSZ
L12 PWM1
K12 PWM0
J13 GPIO[0]
H13 GPIO[1]
G13 GPIO[2]
F13 GPIO[3]
E13 GPIO[4]
F12 GPIO[5]
D14 GPIO[6]
E12 GPIO[7]
N6 GPIO[24]
H6 VDDC_5
N15 LVD4M
N16 LVD4P
M14 LVD3M
M15 LVD3P
F8 AVDD_33_1
M16 LVDCKM
L16 LVDCKP
L15 LVD2M
L14 LVD2P
G9 GND_3
K14 LVD1M
J14 LVD1P
J16 LVD0M
J15 LVD0P
H15 LVC4M
H16 LVC4P
H14 LVC3M
G14 LVC3P
G16 LVCCKM
G15 LVCCKP
F15 LVC2M
F16 LVC2P
F14 LVC1M
E14 LVC1P
E16 LVC0M
E15 LVC0P
G10 GND_4
F9 AVDD_33_2
D16 LVB4M
D15 LVB4P
C16 LVB3M
B16 LVB3P
A16 LVBCKM
A15 LVBCKP
B15 LVB2M
C15 LVB2P
D2 GPIO_3
E3 GPIO_10
E10 GPIO_11
D10 GPIO_7
D8 GPIO_5
D
12
REX
T
C
14
LV
B1M
C
13
LV
B
1P
A
13
LV
B0M
B
13
LV
B
0P
D
7
G
PIO
_4
D
9
G
PIO
_6
B
12
LVA4M
A
12
LV
A
4P
C
12
LVA3M
C
11
LV
A
3P
A
11
LVACKM
B
11
LV
A
CK
P
B
10
LVA2M
A
10
LV
A
2P
C
10
LVA1M
C
9
LV
A
1P
A
9
LVA0M
B
9
LV
A
0P
F10
A
V
D
D
_PLL
G
8
G
N
D
_2
D
11
G
PIO
_8
D
13
G
PIO
_9
E
11
G
PIO
_12
N
7
G
P
IO
[25]
D
6
SCLM
D
5
SDAM
A
14
G
PIO
_1
B
14
G
PIO
_2
D
3
X
IN
D
4
XOUT
K
16
G
PIO
_14
K
15
G
PIO
_13
H
7
G
N
D
_5
G
11
A
V
D
D
_LV
D
S_2
B
8
RO
0N
A
8
R
O
0P
C
8
RO
1N
C
7
R
O
1P
A
7
RO
2N
B
7
R
O
2P
B
6
ROCKN
A
6
RO
CK
P
C
6
RO
3N
C
5
R
O
3P
A
5
RO
4N
B
5
R
O
4P
H
8
G
N
D
_6
F11
A
V
D
D
_LV
D
S_1
B
4
R
E0N
A
4
R
E0P
C
4
R
E1N
C
3
R
E1P
A
3
R
E2N
B
3
R
E2P
B
2
RECK
N
A
2
RECK
P
C
2
R
E3N
C
1
R
E3P
A
1
R
E4N
B
1
R
E4P
G
N
D
_9
J7
GND_15 K9
0 R1106
0 R1105
100 R1107
100 R1108
CIC21J501NE
L1107
TF05-51S
P1101
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
TF05-41S
P1102
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
1K
READY
R1159
1K
R1160
1K
READY
R1100
1K
R1158
+
3
.3
V
_
M
E
M
C
0 READY R1161
RT1C3904-T112
Q1101
E
B
C
+3.3V_MULTI_MST
JP1100
JP1102
JP1101
0 READY R1162
MX25L2005MC-12G
IC1101-*1
IC1101_URSA_Replace_macronix
3
WP
2
SO
4
GND
1
CS
5
SI
6
SCLK
7
HOLD
8
VCC
SMAW250-04Q
P1103
DEBUG
1
2
3
4
5
MEMC_DQ[25]
M
E
M
C
_
D
Q
[8
]
M
E
M
C
_
A
[7
]
M
E
M
C
_
D
Q
[0
]
M
E
M
C
_
D
Q
[1
0
]
M
E
M
C
_
D
Q
[1
1
]
MEMC_DQ[24]
MEMC_DQ[17]
MEMC_DQ[29]
M
E
M
C
_
D
Q
[1
]
M
E
M
C
_
D
Q
[7
]
M
E
M
C
_
D
Q
[6
]
M
E
M
C
_
D
Q
[1
5
]
MEMC_DQ[28]
M
E
M
C
_
D
Q
[3
]
M
E
M
C
_
D
Q
[4
]
MEMC_DQ[30]
MEMC_DQ[31]
M
E
M
C
_
A
[2
]
MVREF
M
E
M
C
_
A
[4
]
M
E
M
C
_
A
[1
2
]
M
E
M
C
_
D
Q
[9
]
M
E
M
C
_
A
[1
1
]
MEMC_DQ[18]
M
E
M
C
_
D
Q
[1
2
]
M
E
M
C
_
A
[1
0
]
M
E
M
C
_
D
Q
[5
]
M
E
M
C
_
A
[0
]
MEMC_DQ[19]
M
E
M
C
_
D
Q
[1
3
]
M
E
M
C
_
D
Q
[1
4
]
M
E
M
C
_
A
[3
]
MEMC_DQ[27]
MEMC_DQ[21]
M
E
M
C
_
A
[1
]
M
E
M
C
_
A
[6
]
M
E
M
C
_
D
Q
[2
]
MEMC_DQ[20]
MEMC_DQ[23]
MEMC_DQ[16]
M
E
M
C
_
A
[8
]
M
E
M
C
_
A
[9
]
MEMC_DQ[26]
MEMC_DQ[22]
M
E
M
C
_
A
[5
]
EAX61181901
Mstar LCD SL80
1 1 1 2
H6 SL80 2009/ 04/ 02
MEMC & LVDS Out
LOW
HIGH
SPI FLASH
I2C
SPI
HIGH
PWM0
HIGH LOW
PWM1
EEPROM
HIGH
HIGH
HIGH
Cl os ed t o I C1100
HIGH
XTAL
GPIO8
Copyright 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MEMC_BA0
0. 1uF C1211
+1.8V_MEMC
22uF
C1247
MEMC_MCLKE
0. 1uF C1213
56 AR1204
0. 1uF C1215
MEMC_DQM0
56 R1216
1K 1%
R1223
0 R1233
0. 1uF
C1246
MEMC_BA1
56 R1205
10uF 25V
C1253
0. 1uF
C1240
MEMC_DQSB3
0. 1uF C1236
22 AR1205
1000pF
C1239
+1.8V_MEMC_DDR
MEMC_DQ[16-31]
0. 1uF C1230
100uF16V
C1251
MEMC_BA1
MEMC_BA0
A_URSA_WEZ
MEMC_MCLKZ
22 AR1206
0. 1uF C1209
56 AR1202
0. 1uF C1225
MEMC_DQ[0-15]
56 R1219
BD9130EFJ-E2
IC1203
3
ITH
2
VCC
4
GND
1
ADJ
5
PGND
6
SW
7
PVCC
8
EN
+1.8V_MEMC_DDR
MEMC_MCLKZ1
+1.8V_MEMC_DDR
0. 1uF
C1250
0. 1uF C1207
150
READY
R1201
BLM18PG121SN1D
L1201
B_URSA_WEZ
MEMC_DQS1
+1.8V_MEMC
22 AR1207
MEMC_MCLKE
0. 1uF
C1261
B_URSA_MCLKE
B_URSA_WEZ
56 R1210
10K R1227
10K1%
R1231
22 R1213
A_URSA_BA1
MEMC_A[0-12]
A_URSA_CASZ
0. 1uF C1232
A_URSA_BA1
P_12V
22 R1202
22 AR1210
17.4K 1% R1232
B_URSA_BA1
39K
R1236
18nF 16V
C1259
MEMC_DQSB1
0. 1uF
C1252
30K 1%
R1229
+1.8V_MEMC
DDRA_A[0-12]
MEMC_CASZ
0. 1uF C1218
0. 1uF
C1241
0. 1uF C1229
0. 1uF C1206
MEMC_CASZ
56 R1209
330pF
C1245
B_URSA_BA0
0. 1uF C1238
0. 1uF C1210
BLM18PG121SN1D
L1202
22 AR1211
10uF 25V
C1254
56 AR1214
56 AR1203
A_URSA_BA0
MEMC_RASZ
22 AR1209
0. 1uF
C1262
100uF
C1243
12K
R1237
0
.1
u
F
1
6
V
C
1
2
2
1
A_URSA_CASZ 0. 1uF C1231
0. 1uF C1214
10uF 16V
C1257
MEMC_DQS2 0. 1uF C1234
56 R1215
150READY
R1220
MEMC_ODT
A_URSA_RASZ
DDR_DQ[0-15]
22 R1212
MEMC_MCLK1
0
.1
u
F
C
1
2
2
0
0. 1uF
C1267
A_URSA_BA0
0. 1uF C1235
22 AR1217
56 R1208
MEMC_DQM1
0. 1uF C1217
0. 1uF C1226
1
0
u
F
1
0
V
C
1
2
0
2
22 R1211
10uF C1227
+1.8V_MEMC
+1.8V_MEMC_DDR
B_URSA_CASZ
22 AR1218
MEMC_DQSB2
0. 1uF C1208
A_URSA_MCLKE
10uF 16V
C1258
MEMC_RASZ
56 AR1216
B_URSA_RASZ
MEMC_WEZ
10uF C1222
B_URSA_CASZ
0. 1uF C1223
MEMC_DQM3
MP2212DN
IC1205
3 IN
2 GND
4 BS
1 FB
5 VCC
6 SW_1
7 SW_2
8 EN/SYNC
0. 1uF C1228
0. 1uF C1216
MEMC_DQM2
A_URSA_MCLKE
56 AR1201
0. 1uF C1219
22 AR1208
18K R1225
10
R1234
0
.1
u
F
C
1
2
0
1
B_URSA_BA1
1uF
C1264
10uF 16V
C1260
DDR_DQ[0-15]
A_URSA_RASZ
0. 1uF C1224
+3.3V_MEMC
39K1%
R1228
22uF
C1244
10uF C1212
1K R1230
A_URSA_WEZ
1K 1%
R1222
+1.8V_MEMC_DDR
22 AR1212
+1.8V_MEMC_DDR
22 R1204
10K R1235
+1.8V_MEMC_DDR
0. 1uF C1204
B_URSA_MCLKE
MEMC_DQS3
DDR_DQ[16-31]
56 R1207
+1.8V_MEMC_DDR
DDRB_A[0-12]
10uF C1203
0. 1uF C1237
DDRB_A[0-12]
22 R1203
+1.26V_MEMC
10uF 10V
C1249
1000pF
C1242
DDR_DQ[16-31]
56 R1217
56 AR1215
56 R1218
B_URSA_RASZ
0. 1uF C1233
0. 1uF
C1248
56 AR1213
MEMC_DQSB0
56 R1206
1K 1%
R1221
56 R1214
MEMC_DQS0
MEMC_ODT
1K 1%
R1224
MEMC_MCLK
MEMC_WEZ
1uF 25V
C1255
B_URSA_BA0
+3.3V_MEMC
0. 1uF C1205
DDRA_A[0-12]
3.6uH L1204
APE8953MP
IC1204
3 VOUT_1
2 FB
4 VOUT_2
1 GND
5 VIN
6 VCNTL
7 POK
8 EN
500
L1206
500
L1205
2.2uH
L1203
+5V_MULTI
+5V_MULTI
HYB18TC512160CF-2.5
IC1202
QIMONDA
J 2 VREF
J 8 CK
H2 VSSQ2
B7 UDQS
N8 A4
P8 A8
L1 NC4
L2 BA0
R8 NC3
K7 RAS
F8 VSSQ3
F3 LDM
P3 A9
M3 A1
N3 A5
K8 CK
R3 NC5
L3 BA1
J 7 VSSDL
L7 CAS
F2 VSSQ4
B3 UDM
M2 A10/AP
K2 CKE
R7 NC6
M7 A2
N7 A6
M8 A0
J 1 VDDL
K3 WE
E8 LDQS
P7 A11
K9 ODT
A2 NC1
N2 A3
P2 A7
H8 VSSQ1
F7 LDQS
A8 UDQS
R2 A12
L8 CS
E2 NC2
E7 VSSQ5
D8 VSSQ6
D2 VSSQ7
A7 VSSQ8
B8 VSSQ9
B2 VSSQ10
P9 VSS1
N1 VSS2
J 3 VSS3
E3 VSS4
A3 VSS5
G9 VDDQ1
G7 VDDQ2
G3 VDDQ3
G1 VDDQ4
E9 VDDQ5
C9 VDDQ6
C7 VDDQ7
C3 VDDQ8
C1 VDDQ9
A9 VDDQ10
R1 VDD1
M9 VDD2
J 9 VDD3
E1 VDD4
A1 VDD5
B9 DQ15
B1 DQ14
D9 DQ13
D1 DQ12
D3 DQ11
D7 DQ10
C2 DQ9
C8 DQ8
F9 DQ7
F1 DQ6
H9 DQ5
H1 DQ4
H3 DQ3
H7 DQ2
G2 DQ1
G8 DQ0
HYB18TC512160CF-2.5
IC1201
QIMONDA
J 2 VREF
J 8 CK
H2 VSSQ2
B7 UDQS
N8 A4
P8 A8
L1 NC4
L2 BA0
R8 NC3
K7 RAS
F8 VSSQ3
F3 LDM
P3 A9
M3 A1
N3 A5
K8 CK
R3 NC5
L3 BA1
J 7 VSSDL
L7 CAS
F2 VSSQ4
B3 UDM
M2 A10/AP
K2 CKE
R7 NC6
M7 A2
N7 A6
M8 A0
J 1 VDDL
K3 WE
E8 LDQS
P7 A11
K9 ODT
A2 NC1
N2 A3
P2 A7
H8 VSSQ1
F7 LDQS
A8 UDQS
R2 A12
L8 CS
E2 NC2
E7 VSSQ5
D8 VSSQ6
D2 VSSQ7
A7 VSSQ8
B8 VSSQ9
B2 VSSQ10
P9 VSS1
N1 VSS2
J 3 VSS3
E3 VSS4
A3 VSS5
G9 VDDQ1
G7 VDDQ2
G3 VDDQ3
G1 VDDQ4
E9 VDDQ5
C9 VDDQ6
C7 VDDQ7
C3 VDDQ8
C1 VDDQ9
A9 VDDQ10
R1 VDD1
M9 VDD2
J 9 VDD3
E1 VDD4
A1 VDD5
B9 DQ15
B1 DQ14
D9 DQ13
D1 DQ12
D3 DQ11
D7 DQ10
C2 DQ9
C8 DQ8
F9 DQ7
F1 DQ6
H9 DQ5
H1 DQ4
H3 DQ3
H7 DQ2
G2 DQ1
G8 DQ0
0 R1226
0. 47uF
C1256
H5PS5162FFR-S6C
Hynix
IC1201-*1
J 2 VREF
J 8 CK
H2 VSSQ2
B7 UDQS
N8 A4
P8 A8
L1 NC4
L2 BA0
R8 NC3
K7 RAS
F8 VSSQ3
F3 LDM
P3 A9
M3 A1
N3 A5
K8 CK
R3 NC5
L3 BA1
J 7 VSSDL
L7 CAS
F2 VSSQ4
B3 UDM
M2 A10/AP
K2 CKE
R7 NC6
M7 A2
N7 A6
M8 A0
J 1 VDDL
K3 WE
E8 LDQS
P7 A11
K9 ODT
A2 NC1
N2 A3
P2 A7
H8 VSSQ1
F7 LDQS
A8 UDQS
R2 A12
L8 CS
E2 NC2
E7 VSSQ5
D8 VSSQ6
D2 VSSQ7
A7 VSSQ8
B8 VSSQ9
B2 VSSQ10
P9 VSS1
N1 VSS2
J 3 VSS3
E3 VSS4
A3 VSS5
G9 VDDQ1
G7 VDDQ2
G3 VDDQ3
G1 VDDQ4
E9 VDDQ5
C9 VDDQ6
C7 VDDQ7
C3 VDDQ8
C1 VDDQ9
A9 VDDQ10
R1 VDD1
M9 VDD2
J 9 VDD3
E1 VDD4
A1 VDD5
B9 DQ15
B1 DQ14
D9 DQ13
D1 DQ12
D3 DQ11
D7 DQ10
C2 DQ9
C8 DQ8
F9 DQ7
F1 DQ6
H9 DQ5
H1 DQ4
H3 DQ3
H7 DQ2
G2 DQ1
G8 DQ0
H5PS5162FFR-S6C
Hynix
IC1202-*1
J 2 VREF
J 8 CK
H2 VSSQ2
B7 UDQS
N8 A4
P8 A8
L1 NC4
L2 BA0
R8 NC3
K7 RAS
F8 VSSQ3
F3 LDM
P3 A9
M3 A1
N3 A5
K8 CK
R3 NC5
L3 BA1
J 7 VSSDL
L7 CAS
F2 VSSQ4
B3 UDM
M2 A10/AP
K2 CKE
R7 NC6
M7 A2
N7 A6
M8 A0
J 1 VDDL
K3 WE
E8 LDQS
P7 A11
K9 ODT
A2 NC1
N2 A3
P2 A7
H8 VSSQ1
F7 LDQS
A8 UDQS
R2 A12
L8 CS
E2 NC2
E7 VSSQ5
D8 VSSQ6
D2 VSSQ7
A7 VSSQ8
B8 VSSQ9
B2 VSSQ10
P9 VSS1
N1 VSS2
J 3 VSS3
E3 VSS4
A3 VSS5
G9 VDDQ1
G7 VDDQ2
G3 VDDQ3
G1 VDDQ4
E9 VDDQ5
C9 VDDQ6
C7 VDDQ7
C3 VDDQ8
C1 VDDQ9
A9 VDDQ10
R1 VDD1
M9 VDD2
J 9 VDD3
E1 VDD4
A1 VDD5
B9 DQ15
B1 DQ14
D9 DQ13
D1 DQ12
D3 DQ11
D7 DQ10
C2 DQ9
C8 DQ8
F9 DQ7
F1 DQ6
H9 DQ5
H1 DQ4
H3 DQ3
H7 DQ2
G2 DQ1
G8 DQ0
EDE5116AJBG-8E-E
IC1201-*2
ELPIDA J 2 VREF
J 8 CK
H2 VSSQ_2
B7 UDQS
N8 A4
P8 A8
L1 NC_4
L2 BA0
R8 NC_3
K7 RAS
F8 VSSQ_3
F3 LDM
P3 A9
M3 A1
N3 A5
K8 CK
R3 NC_5
L3 BA1
J 7 VSSDL
L7 CAS
F2 VSSQ_4
B3 UDM
M2 A10
K2 CKE
R7 NC_6
M7 A2
N7 A6
M8 A0
J 1 VDDL
K3 WE
E8 LDQS
P7 A11
K9 ODT
A2 NC_1
N2 A3
P2 A7
H8 VSSQ_1
F7 LDQS
A8 UDQS
R2 A12
L8 CS
E2 NC_2
E7 VSSQ_5
D8 VSSQ_6
D2 VSSQ_7
A7 VSSQ_8
B8 VSSQ_9
B2 VSSQ_10
P9 VSS_1
N1 VSS_2
J 3 VSS_3
E3 VSS_4
A3 VSS_5
G9 VDDQ_1
G7 VDDQ_2
G3 VDDQ_3
G1 VDDQ_4
E9 VDDQ_5
C9 VDDQ_6
C7 VDDQ_7
C3 VDDQ_8
C1 VDDQ_9
A9 VDDQ_10
R1 VDD_1
M9 VDD_2
J 9 VDD_3
E1 VDD_4
A1 VDD_5
B9 DQ15
B1 DQ14
D9 DQ13
D1 DQ12
D3 DQ11
D7 DQ10
C2 DQ9
C8 DQ8
F9 DQ7
F1 DQ6
H9 DQ5
H1 DQ4
H3 DQ3
H7 DQ2
G2 DQ1
G8 DQ0
EDE5116AJBG-8E-E
ELPIDA
IC1202-*2
J 2 VREF
J 8 CK
H2 VSSQ_2
B7 UDQS
N8 A4
P8 A8
L1 NC_4
L2 BA0
R8 NC_3
K7 RAS
F8 VSSQ_3
F3 LDM
P3 A9
M3 A1
N3 A5
K8 CK
R3 NC_5
L3 BA1
J 7 VSSDL
L7 CAS
F2 VSSQ_4
B3 UDM
M2 A10
K2 CKE
R7 NC_6
M7 A2
N7 A6
M8 A0
J 1 VDDL
K3 WE
E8 LDQS
P7 A11
K9 ODT
A2 NC_1
N2 A3
P2 A7
H8 VSSQ_1
F7 LDQS
A8 UDQS
R2 A12
L8 CS
E2 NC_2
E7 VSSQ_5
D8 VSSQ_6
D2 VSSQ_7
A7 VSSQ_8
B8 VSSQ_9
B2 VSSQ_10
P9 VSS_1
N1 VSS_2
J 3 VSS_3
E3 VSS_4
A3 VSS_5
G9 VDDQ_1
G7 VDDQ_2
G3 VDDQ_3
G1 VDDQ_4
E9 VDDQ_5
C9 VDDQ_6
C7 VDDQ_7
C3 VDDQ_8
C1 VDDQ_9
A9 VDDQ_10
R1 VDD_1
M9 VDD_2
J 9 VDD_3
E1 VDD_4
A1 VDD_5
B9 DQ15
B1 DQ14
D9 DQ13
D1 DQ12
D3 DQ11
D7 DQ10
C2 DQ9
C8 DQ8
F9 DQ7
F1 DQ6
H9 DQ5
H1 DQ4
H3 DQ3
H7 DQ2
G2 DQ1
G8 DQ0
100pF
READY
C1200
DDR_DQ[24] MEMC_A[2]
DDR_DQ[28]
DDR_DQ[5]
DDRB_A[7]
DDR_DQ[9]
MEMC_DQ[21]
DDRA_A[4]
DDRB_A[6]
MEMC_A[11]
DDR_DQ[31]
MEMC_A[1]
DDRA_A[6]
DDRB_A[8]
MEMC_DQ[25]
DDR_DQ[13]
MEMC_DQ[12]
DDRA_A[1]
MEMC_A[7]
DDR_DQ[20]
MEMC_DQ[23]
DDRA_A[3]
MEMC_A[11]
MEMC_DQ[30]
MEMC_DQ[24]
MEMC_A[12] DDRA_A[12]
DDRA_A[11]
DDR_DQ[10]
MEMC_A[4]
MEMC_DQ[6]
DDR_DQ[21]
DDRB_A[0]
MEMC_DQ[22]
MEMC_A[10]
MEMC_DQ[5]
DDRA_A[7]
DDRB_A[9]
DDRA_A[12]
DDR_DQ[26] MEMC_A[6]
DDRB_A[5]
DDRA_A[9]
DDRA_A[2] DDR_DQ[26]
DDRB_A[11]
DDR_DQ[9]
MEMC_A[1]
DDR_DQ[8]
DDR_DQ[2] MEMC_DQ[19]
MEMC_A[3]
MEMC_DQ[18]
MEMC_DQ[16]
DDRA_A[8]
MEMC_DQ[26]
DDR_DQ[23]
MEMC_A[7]
DDR_DQ[21]
DDR_DQ[28]
DDR_DQ[12]
DDR_DQ[30]
DDR_DQ[7]
MEMC_A[8]
MEMC_DQ[0]
DDR_DQ[30]
DDRB_A[4]
MEMC_A[0]
DDRA_A[9]
DDR_DQ[25]
DDR_DQ[20]
DDR_DQ[17]
MEMC_DQ[14] DDR_DQ[14]
MEMC_A[12]
DDRB_A[5]
DDR_DQ[25]
DDR_DQ[7]
MEMC_A[4]
DDR_DQ[1]
MEMC_A[9]
DDRA_A[10]
DDR_DQ[27]
DDR_DQ[8]
DDR_DQ[29]
MEMC_DQ[3]
DDRB_A[12]
DDRA_A[1]
DDR_DQ[3]
DDR_DQ[27]
MEMC_DQ[15]
MEMC_A[10]
MEMC_DQ[4]
MEMC_A[2]
DDR_DQ[2]
MEMC_DQ[11]
MEMC_DQ[29]
DDR_DQ[4]
DDR_DQ[17]
DDRB_A[4]
MEMC_A[5]
DDRA_A[4] DDR_DQ[29]
DDRA_A[0]
DDRB_A[6]
DDR_DQ[22]
DDR_DQ[19]
DDR_DQ[15]
DDR_DQ[11]
MEMC_DQ[8]
DDR_DQ[15] DDR_DQ[16]
DDR_DQ[5] DDR_DQ[22]
DDRB_A[1]
DDRA_A[11]
MEMC_A[3]
DDR_DQ[23]
DDRA_A[3]
DDRA_A[6]
DDR_DQ[24] MEMC_A[5]
DDR_DQ[10]
MEMC_DQ[13]
DDR_DQ[11]
MEMC_A[0]
DDRB_A[11]
DDR_DQ[1]
DDRB_A[12]
DDRB_A[3]
DDR_DQ[0]
MEMC_DQ[1]
MEMC_DQ[9]
MEMC_DQ[27]
MEMC_DQ[17]
DDRB_A[7]
MEMC_DQ[28]
MEMC_DQ[20]
DDR_DQ[14]
DDRA_A[5]
DDRB_A[2]
DDR_DQ[18]
MEMC_A[6]
DDR_DQ[4]
DDRB_A[3]
DDRA_A[2]
DDR_DQ[6]
DDRB_A[2]
DDRB_A[8]
MEMC_DQ[7]
DDRA_A[0]
MEMC_DQ[10]
MEMC_DQ[31]
MEMC_DQ[2]
DDRB_A[10]
DDRB_A[0]
MEMC_A[9]
DDRA_A[7]
DDR_DQ[18]
DDR_DQ[31]
DDR_DQ[16]
DDRB_A[9]
DDRA_A[5]
DDR_DQ[3]
DDRB_A[1]
DDR_DQ[12]
DDR_DQ[19]
DDRA_A[10]
MEMC_A[8]
DDR_DQ[6]
DDRB_A[10]
DDR_DQ[0]
DDR_DQ[13]
DDRA_A[8]
EAX61181901
Mstar LCD SL80
H6 SL80
1 2 1 2 MEMC_DDR&POWER
2009/ 04/ 02
R2
Vo=0. 8(1+R1/R2)
V0 = 0. 8( 1+R1/ R2)
R2
1000 mA @85% ef f i ci ency
233 mA+400mA+600mA
2A
V0 = 0. 8( 1+R1/ R2)
D
D
R
2
1
.8
V
B
y
C
A
P
-
P
l
a
c
e
t
h
e
s
e
C
a
p
s
n
e
a
r
M
e
m
o
r
y
+1.8V_MEMC for DDR
R1
R1
+1.26V Core for MEMC
MAX3A
600 mA
400mA + 600mA
+3.3V_MEMC
MAX2A
R1
R2
1300 mA @85% ef f i ci ency
D
D
R
2
1
.8
V
B
y
C
A
P
-
P
l
a
c
e
t
h
e
s
e
C
a
p
s
n
e
a
r
M
e
m
o
r
y
Cl ose t o I C1204
Copyright 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only

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