Polyamide-imides may be thermosetting or thermoplastic amorphous polymers that have

exceptional mechanical, thermal and chemical resistant properties. These properties put
polyamide-imides at the top of the price and performance pyramid. Polyamide-imides are
produced by Solvay Advanced Polymers under the trademark Torlon. Other high-performance
polymers in this same realm are polyetheretherketones and polyimides. Polyamide-imides are
used extensively as wire coatings in making magnet wire. They are easily made from
isocyanates and TMA (trimellic acid-anhydride) in NMP.
Polyamide-imides hold, as the name suggests, a positive synergy of properties from
both polyamides and polyimides, such as high strength, melt processibility, exceptional high heat
capability, and broad chemical resistance. Polyamide-imide polymers can be processed into a
wide variety of forms from injection or compression molded parts and ingots to coatings,
films, fibers and adhesives. Generally these articles reach their maximum properties with a
subsequent thermal cure process.
Contents
[hide]
1 Chemistry
o 1.1 Acid chloride route
o 1.2 Diisocyanate route
2 Fabrication
o 2.1 Coatings
o 2.2 Molded or machined articles
3 Properties of molded PAI
o 3.1 High-strength grades
o 3.2 Wear-resistant PAI grades
4 Injection molding polyamide-imide
o 4.1 Pre-drying the resin
o 4.2 Injection molding equipment
o 4.3 Starting point temperatures
5 Other applications
6 See also
7 References
Chemistry[edit]
The currently popular commercial methods to synthesize polyamide-imides are the acid chloride
route and the isocyanate route.
Acid chloride route[edit]


Trimelletic acid chloride


Methylene dianiline
The earliest route to polyamide-imides is the condensation of an aromatic diamine, such as
methylene dianiline (MDA) and trimellitic acid chloride (TMAC). Reaction of the anhydride with
the diamine produces an intermediate amic acid. The acid chloride functionality reacts with the
aromatic amine to give the amide bond and hydrochloric acid (HCl) as a by-product. In the
commercial preparation of polyamideimides, the polymerization is carried out in a dipolar, aprotic
solvent such as N-
methylpyrrolidone (NMP), dimethylacetamide (DMAC),dimethylformamide (DMF),
or dimethylsulfoxide (DMSO) at temperatures between 20-60C. The byproduct HCl must be
neutralized in situ or removed by washing it from the precipitated polymer. Further thermal
treatment of the polyamideimide polymer increases molecular weight and causes the amic acid
groups to form imides with the evolution of water.
Diisocyanate route[edit]
This is the primary route to polyamide-imides which are used as wire enamels. A diisocyanate,
often 4,4- methylenediphenyldiisocyanate (MDI), is reacted with trimellitic anhydride (TMA). The
product achieved at the end of this process is a high molecular weight, fully imidized polymer
solution with no condensation byproducts, since the carbon dioxide gas byproduct is easily
removed. This form is convenient for the manufacture of wire enamel or coatings. The solution
viscosity is controlled by stoichiometry, monofunctional reagents, and polymer solids. The typical
polymer solids level is 35-45% and it may be diluted further by the supplier or user with diluents.
Fabrication[edit]
Polyamide-imides are commercially used for coatings and molded articles.
Coatings[edit]
The product used mainly for coatings is sold in a powdered form and is roughly 50% imidized.
One of the major uses is as a magnet wire enamel. The magnet wire enamel is made by
dissolving the PAI powder in a strong, aprotic solvent such as N-methyl pyrrolidone. Diluents and
other additives can be added to provide the correct viscosity for application to the copper or
aluminum conductor. Application is typically done by drawing the conductor through a bath of
enamel and then through a die to control coating thickness. The wire is then passed through an
oven to drive off the solvent and cure the coating. The wire usually is passed through the process
several times to achieve the desired coating thickness.
The PAI enamel is very thermally stable as well as abrasion and chemical resistant. PAI is often
used over polyester wire enamels to achieve higher thermal ratings.
PAI is also used in decorative, corrosion resistant coatings for industrial uses, often in
conjunction with fluoropolymers. The PAI aids in adhering the fluoropolymer to the metal
substrate. They also find usage in non-stick cookware coatings. While solvents can be used,
some water-borne systems are used. These are possible because the amide-imide contains acid
functionality.
Molded or machined articles[edit]
The polyamide-imides used for molded articles are also based on aromatic diamines and
trimellitic acid chloride, but the diamines are different from those used in the products used for
coatings and the polymer is more fully imidized prior to compounding and pellitizing. Resins for
injection molding include unreinforced, glass-fiber reinforced, carbon fiber reinforced, and wear
resistant grades. These resins are sold at a relatively low molecular weight so they can be melt
processed by extrusion or injection-molding. The molded articles are then thermally treated for
several days at temperatures up to 260C (500F). During this treatment, commonly referred to a
postcure, the molecular weight increases through change extension and the polymer get much
stronger and more chemically resistant. Prior to postcure, parts can be reground and
reprocessed. After postcure, reprocessing is not practical.
Properties of molded PAI[edit]
High-strength grades[edit]
Property
Test
method
units neat PAI
30% GF
PAI
30% CF
PAI
Tensile Strength
ASTM D
638
MPa (kpsi)
152
(22.0)
221 (32.1) 221 (32.0)
Tensile Modulus
ASTM D
GPa (kpsi) 4.5 (650)
14.5 16.5
638 (2,110) (2,400)
Tensile Elongation
ASTM D
638
% 7.6 2.3 1.5
Flexural Strength
ASTM D
790
MPa (kpsi)
241
(34.9)
333 (48.3) 350 (50.7)
Flexural Modulus
ASTM D
638
GPa (kpsi) 5.0 (730)
11.7
(1,700)
16.5
(2,400)
Compressive Strength
ASTM D
695
MPa (kpsi)
221
(32.1)
264 (38.3) 254 (36.9)
Shear Strength
ASTM D
732
MPa (kpsi)
128
(18.5)
139 (20.1) 119 (17.3)
Izod Impact Strength
ASTM D
256
J/m (ftlb/in) 144 (2.7) 80 (1.5) 48 (0.9)
Izod Impact Strength-Unnotched
ASTM D
4812
J/m (ftlb/in)
1070
(20)
530 (10) 320 (6)
Heat Deflection Temperature @
264 psi
ASTM D
648
C (F)
278
(532)
282 (540) 282 (540)
Coefficient Linear Thermal
Expansion
ASTM D
696
ppm/C
(ppm/F)
31 (17) 16 (9) 9 (5)
Volume Resistivity
ASTM D
257
ohm-cm 2e17 2e17

Specific Gravity
ASTM D
792

1.42 1.61 1.48
Water Absorption, 24 hr
ASTM D
570
% 0.33 0.24 0.26