Institute / School Name School of Electronics and Electrical Engineering
Program Name B.E. (ECE)
Course Code ECL4303 Course Name Microelectronics Circuit Design Lecture (per week) 5 Course Credits 4 Course Coordinator Name Dr. Sheifali Gupta
1. Scope and Objectives of the Course Digital and Analog Circuit implementation with CMOS logic. To understand the Ideal and Non Ideal effects of MOS. Learning the MOS Fabrication basics. To understand the concept power dissipation in MOS.
2. Textbooks TB1: Sung-Mo Kang and Yusuf Leblebici, CMOS Digital Integrated Circuits Analysis and Design, Tata McGraw Hill, 3 rd Edition, 2005. TB2: Richard C. Jaeger, Travis N. Blalock, MICROELECTRONIC CIRCUIT DESIGN, McGraw-Hill, 4 th
edition, 2011.
3. Reference Books RB1: Neil H. E. Weste and Kamran Eshraghian ,Principles of CMOS VLSI design , Pearson, 3 rd edition, 2005. RB2: Jacob Millman, Arvin Grabel, MICROELECTRONICS, Tata McGraw-Hill, 2 nd edition, 1987.
4. Other readings and relevant websites
S. No. Link of Journals, Magazines, websites and Research Papers 1 http://users.wfu.edu/matthews/courses/p230/lectures/CMOS/CMOSLogic.html 2 http://www.vlsi.wpi.edu/cds/index.htm 3. http://www.wiziq.com/tutorial/460146-CMOS-VLSI-Design-Tutorial-1 4. http://cmosedu.com/cmos1/electric/electric.htm 5. https://www.youtube.com/watch?v=35jWSQXku74 6. https://www.youtube.com/watch?v=JDROPMoNZpk
5. Course Plan
Lect. No. (1 Hr) Topics Text Book Section No., Page No. UNIT 1:MOS Theory 1-2 Evolution of MOS, Historical Perspectives, A circuit Design Example TB1
sec 8.4 (pp.336-338) sec 8.5 (pp. 343-346) UNIT3: MOS Memory Design and Power Estimation 21-22 Introduction to Memory Design, 1T-DRAM cell working, Read/Write Operation TB1
sec 10.1(pp.405-407) sec 10.2 (pp. 419-420)
23-24 6T-SRAM Cell Working, Read/Write Operation TB1 sec 10.3 (pp.440, 443- 444) 25 Overview of Power Consumption TB1
sec 11.2 (pp.482-484, 486, 490-491) UNIT 4: Layout designing 26-27 Introduction, Fabrication Process Flow TB1
Sec 2.1 (48) sec 2.2 (pp.49-55)
28-30 Layout design rules (Lambda and Micron rules), Full Custom Mask Layout Design TB1 sec 2.4 (pp.66) sec 2.5 (pp. 66-73) UNIT 5: Analog Integrated Circuit Design Techniques 31-32 Small signal model for the MOS Transistor, TB2 sec 13.8.1 (pp.815-816)
33-35 Common source, Common drain and Common Gate Amplifiers TB2
sec 14.1.3- 14.1.5 (pp. 858-864) 36 Introduction to Current mirror circuit , DC Analysis Of MOS Transistor Current Mirror, Changing MOS MIRROR Ratio
TB2 sec 16.1(pp.1047-1049) sec 16.2.1 (pp.1049- 1051) sec 16.2.2 (pp. 1051- 1052) ST-2 ST-3 6. Evaluation Scheme: Component 1 Two Subjective Test 40% Component 2 End Term Examination 60%
Total 100
Details of Component-1: There will be three sessional tests (STs) for all the theory papers as per below stated guidelines: (i) 1 st sessional test will be from 0- 50% syllabus of the subject (ii) 2 nd sessional test will be from 51-100% syllabus of the subject. (iii) 3 rd sessional test will be from 0-100% syllabus of the subject. (iv) The best two sessional tests will be considered for finalizing the internal of the subject.
Details of Component-2: The End Term Examination will be held at the end of semester. As per academic guidelines minimum 75% attendance is required to become eligible for appearing in the end term examination. The syllabus for end term will be from 0-100%. This Document is approved by: Designation Name Signature Course Coordinator Dr. Sheifali Gupta
H.O.D Ms. Shivani Malhotra
Dean (Academics)
Date
S. No. Syllabus No. of Lectures Weight age 1. Unit 1 MOS Theory Evolution of MOS, Historical Perspectives, VLSI Design Flow, VLSI Design Styles, Design Quality, The metal Oxide Semiconductor (MOS) structure, The MOS system under External Bias, Structure and Operation of MOS Transistor, Gradual channel approximation, channel length modulation, MOSFET Capacitances 10 25% 2. Unit 2- Circuit Designing and simulation CMOS Inverter: representation, working, DC-characteristics, CMOS Logic Circuits, Complex Logic Circuits, Clocked SR Latch, CMOS D Latch 10 25%
3. Unit 3 MOS Memory and Power Estimation Overview of semiconductor memory types, Operation of one Transistor DRAM Cell, Full CMOS SRAM 6T Cell Design, Read/Write Operation of SRAM, Dynamic and static power estimation 05 15% 4. Unit 4- Layout Designing Fabrication Process Flow, CMOS n-Well Process, Layout Design Rules
05 15% 5. Unit 5 Analog Integrated Circuit Design Techniques Small signal model for the MOS Transistor, Common source, Common drain and Common Gate Amplifiers, Introduction to Current mirror circuit , DC Analysis Of MOS Transistor Current Mirror, Changing MOS MIRROR Ratio 06 20%