IPC A 600 Revision E

2005/11/22 PAGE 1
Nan Ya PCB
IPC-A-600 Revision E
Acceptablility of Printed Boards
!"#$%&'(
!"#Teaching Material
PDF created with FinePrint pdfFactory trial version http://www.pdffactory.com
2005/11/22 PAGE 2
Nan Ya PCB
!"#: I PC- A- 600E PCB$%&'()*+
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(
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)
1.
%&
'()*+,-./012
IPC-A-600
34567897:;<
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=>89?@"=ABCDE?@FDGH
2.
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90
2.1 IPC-600E
7:LMNO
2.2 IPC-600E
P)QR
2.3 IPC-600E
ST7:;<U2
2.3.1
5V7:
2.3.2
PW
2.3.3
XYZ[7:;<
2.3.4
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2.3.5
Z[\_
2.3.6
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2.3.7
cde7:;<
2.3.8
fghi
2.3.9
jk7:;
3.
lmno
5
4..
.IpqrsZtu
20
2005/11/22 PAGE 3
Nan Ya PCB
!"#
IPC(The Institute For Interconnecting And Packaging
Electronic Circuits)!"#$
%&'()*+&IPC-RB-276(IPC-6012)IPC-FC-
250MIL-P-55110MIL-P-50884ANSI/J-STD-003!..
#$,-
IPC-A-600 1964
IPC-A-600A 1970
IPC-A-600B 1974
IPC-A-600C 1978
IPC-A-600D 1989
IPC-A-600E 1995
2005/11/22 PAGE 4
Nan Ya PCB
IPC-A-600 E ./
1.001
1.1*2
1.234
1.356./78
1.489
1.5:;<=
1.6>?
1.7@ABCD
1.8EFB$G
1.9HIJ=
2.0KLMNOP
3.0.LMNOP
4.0QRST
5.0UVWX
2005/11/22 PAGE 5
Nan Ya PCB
1.4 Classification 89
YZ[8\
]^_à78bClass 1c2c3
Class 1 dePYfghcijPghcYk
lm
Class 2 nopYfghcqrstcuvs
t
Class 3 nwxPghyz_{
2005/11/22 PAGE 6
Nan Ya PCB
1.5 Acceptance Criteria:;<=
Target Condition |h
h}~!"
Acceptable :;
h}#$~!"%&'()*+,PB(
-.
Nonconforming /;
01h}234&h}56
2005/11/22 PAGE 7
Nan Ya PCB
1.6 Reference >?56
78149>?56
J-STD-003 PCB:;PWX<=
IPC-T-50 <=EFB$G
IPC-PC-90 >?@<ABC_56
IPC-FC-250 D[h}56(EFBGF)
IPC-D-275 PCBH[s?<=
IPC-RB-276 PCBH[h}56(IJKLbIPC-6012)
IPC-D-325 PCB5656
IPC-QE/SS-605 PCBh}MNOP
IPC-AI-642 PCBQRSTUV
IPC-SM-782 0FWNXZ
IPC-TM-650 PCBYTWXZ3
IPC-SM-840 PCB[:\h}<=
MIL-P-50884 PCBD[H[yZ)*
MIL P-55110 dePCBD[H[yZ)*
2005/11/22 PAGE 8
Nan Ya PCB
1.7 Dimensions And Tolerance@ABCD
]56.^_@ABCD_Ugh`@ABC
D
1.8 Terms And Definitions EFa$G
^_IPC-T-50
1.9 WorkmanshipHI
HI`<=bc)*def$G%]<=(
ghiajû!klm
2005/11/22 PAGE 9
Nan Ya PCB
no./pq
rs)*]IPC-A-600E./tu
YTh}T3vswClass 2BClass 3`h}<
=
L9T3xClass 2BClass 3:;<=yz%x
{8swClass 2aClass 3`:;J=%|fs
w}%~01iz
!"#$.%sbcC&'(Cause Code
2005/11/22 PAGE 10
Nan Ya PCB
2.0 Externally Observable Characteristics KLMNOP
2.1 Board Edge [m
$% &'() *+ ,& -. /.
vwxyzV {|=}~!
5V
5V-"
2.1.1 Burrs
zV
79
vwxy#$ #$%p#&'(
~)*5V+,
-&.
50%
/0(
100mil
~1234D
2.1.2 Nicks
5V#$
7A
2005/11/22 PAGE 11
Nan Ya PCB
2.1 Board Edge [m
$% &'() *+ ,& -. /.
y56 56%p#&'(
~)*5V+,
-&.
50%
/0(
100mil
~1234D=5
V-"
2.1.3 Haloing
5V56
7V
79
2005/11/22 PAGE 12
Nan Ya PCB
2.2 Base Material Surface and Subsurface )*0FB.L
$% &'() *+ ,& -. /.
y89:;
89:<+89=
8>'(jk?@
Class 2
23
Class 3
?3
2.2.1 Weave
Exposure
89:;
Weave
Texture
89
=8
y@Â 2B}[C~J
>
3mil
=>
125mil
DE~)*
3
F
~1234D
GH[C)*I[
1%
2.2.2 Pits and
Microvoids
5[@Ê
JA
1F
2005/11/22 PAGE 13
Nan Ya PCB
2.3 Base Material Surface and Subsurface )*0FB.L
$% &'() *+ ,& -. /.
7F~KL?3F
;M
BNOPQ~?3
}R*S~)*5
[C
5%
2.3.1 Measing/
Crazin
7F
/
7T
y$_UV
_#W.
XYZ[J>5[
CI[
1%
~J>,-#&
25%
=~\]
$_xUVx_#
W.GH>,-#
2.3.2
Delamination/
Blister
$_
/
UV
14
1F
2005/11/22 PAGE 14
Nan Ya PCB
2.3 Base Material Surface )*0F
$% &'() *+ ,& -. /.
yY^ _`Y^23
&.ab,-
5mi
Sc
deaf#&
gh3ijkhi
~134D
[CJ>
32mil
2.3.3 Foreign
Inclusions
lY^
2005/11/22 PAGE 15
Nan Ya PCB
2.4 Solder Coating and Fused Tin Lead 0F+,;-
$% &'() *+ ,& -. /.
X[mn X[mn
SMD
;o
2.4.1
Nonwetting
?X
73
X[mn pXqr~)*
5%
pX~sqr)*
5%
2.4.2 Dewetting
dX~s
73
2005/11/22 PAGE 16
Nan Ya PCB
2.5 Hole Plated Through General .q/
$% &'() *+ ,& -. /.
ytuzV 1vafÊ;< Ê~1;<
2.5.1 Nodules
/Burrs
^tuz
V
27
37
%wyxy:z
Pink Ring
+{|
A}~
%wK!"#$v
Ftv7:
~1234D
2.5.2 Pink Ring
5%
20
2005/11/22 PAGE 17
Nan Ya PCB
2.5 Holes- Plated Through General
$% &'() *+ ,& -. /.
y^
Class 2
2BB^
}~2B)*
5%
Class 2
)*B&^
Class 3
m~2B
'(^~2B
2.5.3 Plating Void
Copper
Plating
^\o
26
y^
Class 2
2B)^
}~2B)*
5%
Class 3
2BB^
}~2B)*
5%
Class 2
2B*^}
~2B)*
5%
Class 3
2B)^}
~2B)*
5%
'(^~2B
2.5.4 Plating Void
Finished
Coating
^
+p^
26
2005/11/22 PAGE 18
Nan Ya PCB
2.6 Hole Unsupported 0m
$% &'() *+ ,& -. /.
y7V {|=}~!
5V
5V-"
2.6.1 Haoling
7V
2005/11/22 PAGE 19
Nan Ya PCB
2.7 Printed Contacts ~12
$% &'() *+ ,& -. /.
,-.y/0@^
Etu
,-.+
S/M
#
y;o
Class 2
;*1_~
)*
5mil
s723CD)*L
M23;qrA)
*LQ45=]Fq
678V
Class 2
;*1_)*
5mil
H
Class3
;1_
2.7.1 Surface
Plating
\_Z[
6A
,-.9Vvwx
yzV
:J~mnxy\
_W.
,-.5V{|x
;*,;V
2.7.2 Burrs on
Edge- Board
Contact
,-.zV
78
2005/11/22 PAGE 20
Nan Ya PCB
2.7 Printed Contacts
$% &'() *+ ,& -. /.
<=is>xyW
.
<=is>xyW
.
3M Tape
jk?W
.
2.7.3 Adhesion of
Overplate
\_<=@
68
2005/11/22 PAGE 21
Nan Ya PCB
2.8 Marking <3
$% &'() *+ ,& -. /.
IBàm+A=
IBCbB`:C
DEF
vwxyzV
deàF
G
069..
H7qr
IJK
~1234D
àLM
2.8.1 General
àBN;
<
62
1v
2.8.1
;<
OP#&1v;<
QRà:J~
LG
Class 2
OP(>
50%
}IF
QRàySJK
QRàLxTM
QRàpXyS
JK~1234D
2.8.2 Etched
Marking
QRà
39
89
8A
2005/11/22 PAGE 22
Nan Ya PCB
2.8 Marking
$% &'() *+ ,& -. /.
1v
2.8.1
;<`
aUVmnBW
à[+
Pad
Xj
àUVYZ>d
[c}[\]^
{|=}~!
5V
àLMx"x
^_~Cxà~
CxyS?F
2.8.3 Screened or
Ink Stamped
Marking
bYà
63
2005/11/22 PAGE 23
Nan Ya PCB
2.9 Solder Resist [:\
$% &'() *+ ,& -. /.
Z[ycYx
AxUVxde~
s/;o
*fFUV~%
p;oE\]
vg,-Eh],
-~;*
>;ijkeqr[
lij
>ijqrmUV%
p\]
>ijFvg,-E
h],-;*
2.9.1 Coverage
Over
Conductors
cde,-
ij
55
56
57
5B
5C
5E
5L
5N
5O
denZ
cdede~s[%
pafd]';<
Pad
'+cdkea
(>AF
5mil
#&
y^ke
~123CD
de~s%p^
ke
2.9.2 Registration
Land
54
5B
5N
2005/11/22 PAGE 24
Nan Ya PCB
2.9 Solder Resist
$% &'() *+ ,& -. /.
denZ
ke~ij5V]
o/jkF
J>
50mil SMD Pitch
~)*
2mil
f>
50mil SMD Pitch
~)*
1mil
~1234D
2.9.3 Registration
to Features
other than
PTH Lands
SMD
de
54
5B
5N
yUVx$_>c
de+,-#
I[pF~)*
10mil
%p,-\]
~1234D
2.9.4 Blister/
Delamination
UV
$_
2005/11/22 PAGE 25
Nan Ya PCB
2.9 Solder Resist
$% &'() *+ ,& -. /.
LM[Cc5
%
1o
5 0
q,
10 5
cdeZ[vwB
WE<=s>
3M Tape
jk?G
fcdeLM
h],-[ALM
fr
PW
5 0
2.9.5 Adhesion
(Flaking
/Peeling)
ke<=
58
5F
5P
>,-EVscd
eBWEvwF8
9
yUVcYYZ
ycY *fcY+,-+
cde#
2.9.6 Skip
Coverage
cY
55
5C
5M
2005/11/22 PAGE 26
Nan Ya PCB
2.9 Solder Resist
$% &'() *+ ,& -. /.
ijFcdeyt
uxv9x94
ijFcdeFyt
uxv9x94[%
pwP'(
v9[%p\]E1
v<=@jk;<
)*234D
v9%px4y\
,#&#'(=)
*LM45
2.9.7 Weave/
Wrinkles/
Ripples
tu
v9
94
>ijkeF
Via
Holes
m>+Ai
jke
>ijkeF
Via
Holes
>ijke
/AXYij
>ijkeF
Via
Holes
[ijke
2.9.8 Tenting(Via
Holes)
Via Holes
i
jke
50
51
2005/11/22 PAGE 27
Nan Ya PCB
2.9 Solder Resist
$% &'() *+ ,& -. /.
,-+ke#y%
#zUV
Class2
cdeyH
%p#&'(I{
#&afLM
~1234D
Class3
~2BGH
2.9.9 Soda
Strawing
|}key
H
1vafwP;<
Class2: 0.4mil
Class3: 0.7mil
~1234D
2.9.10 Thickness
kewP
2005/11/22 PAGE 28
Nan Ya PCB
2.10 Dimension Characteristics @AOP
$% &'() *+ ,& -. /.
1v~LM;< m{|x#$%
p#&6f~!)
*xO
20%
"P~)*
500mil
/x4"P
10%
~1234D
2.10.1.1
Conductor
Width
,-OP
39
1v~LM;< m{|xo#$
%p#&6f~!
)*x&
20%
~1234D
2.10.1.2
Conductor
Spacing
,-#&
42
2005/11/22 PAGE 29
Nan Ya PCB
2.10 Dimension Characteristics
$% &'() *+ ,& -. /.
2.10.2
Annual Ring
d]'OP
32
%jz
ê>
Pad
&'
^[('I1va)
;<
Calss2 1/4
'=+
x4*]+xO'(
~)*
20%
Class 3
a(
2mil
~1234D
2.10.3 Annual Ring
Support
Holes
d]'OP
32
2005/11/22 PAGE 30
Nan Ya PCB
$% &'() *+ ,& -. /.
ê>
Pad
&'
Calss2
~2B'
Class 3
a(
6mil
~1234D
2.10.4 Annual Ring
Unsupport
Holes
d]'OP
32
Âe>
Pad
&#
Class2
+x4*]0
(de
1mil
OP
2B
1/4
'
Class3
0(
2mil
Class2
OPf>
1mil
+]x+'
Class3
OP~,
2mil
2.10.5 Annual Ring
Irregular
Shaped
Lands
d]'OP
32
2005/11/22 PAGE 31
Nan Ya PCB
$% &'() *+ ,& -. /.
aJ~)*
1.5%
2.10.6 Flatness
v-P
5.5/
86
2005/11/22 PAGE 32
Nan Ya PCB
3.0 Internally Observable Characteristic.LMNOP
3.1 Dielectric Material 1Y4*5
$% &'() *+ ,& -. /.
3.1
r0qr
mnBWyUV PW^f>
3mil
E~!af13
_;<
PW^J>
3mil
/)*af13_
;<
3.1.1 Laminate
Void
$2UV
2005/11/22 PAGE 33
Nan Ya PCB
3.1 Dielectric Material
$% &'() *+ ,& 01
/
-. 01
/
/.
3.1.2 Registration
Conductor to
Holes
de
09
15
84
%j3SGz
1v45~;< 1v45~;< _
Clearance
d
[6s)*LM
3.1.3 Clearance
Holes
Unsupport to
P/G Planes
Clearance
#
&;<
09
15
84
2005/11/22 PAGE 34
Nan Ya PCB
$% &'() *+ ,& -. /.
y_#W. y_#W. Gf_#W.
3.1.4
Delamination
/Blister
_#W.
UV
mnBW78Q
0.1mil
Class2
f>
1mil
Class3
f>
0.5mil
~1234D
3.1.5
3.1.5.1
3.1.5.2
Etchback
Positive
Negative
n8Q
78Q
2005/11/22 PAGE 35
Nan Ya PCB
$% &'() *+ ,& -. /.
1v~;< #&0(
4mil
~1234D
3.1.6 Dielectric
Material
Clearance
Metal Planes
,;_
Clearance
#
&
1v~;< 1v~;<
/af
3.5mil
~1234D
3.1.7 Layer to
Layer
Spacing
_#&.
2005/11/22 PAGE 36
Nan Ya PCB
$% &'() *+ ,& -. /.
Thermal Stress
?9:;2B=<=
45>A;<
3.1.8 Resin
Recession
9:;
2005/11/22 PAGE 37
Nan Ya PCB
3.2 Conductive Patterns
$% &'() *+ 2345 6787 97:;
<=
(
>?
)
3.2.1 Etching
Characteristic
QRhi
2005/11/22 PAGE 38
Nan Ya PCB
$% &'() *+ ,& -. /.
,-OP1v;< ,-OP1va)
;<
,-OP)*a)
;<
3.2.2 Standard
Print & Etch
xO
39
42
yo?@@ 2BB&^B&A
AV@@}~B
Co?
~1234D
3.2.3 Conductor
Crack
Internal Foil
o?@@
_
2005/11/22 PAGE 39
Nan Ya PCB
$% &'() *+ ,& -. /.
y@@GH
Class2
o?DE@
@
Class2,3
o?+F
@@
o?E\_m@@
3.2.4 Conductor
Crack
External Foil
,-@@
8_
o?wP +pwP o?wP +pwP
0.25oz 1.2mil 1oz 1.8mil
0.375oz 1.2mil 2oz 3mil
3.2.5 Surface
Conductor
Thickness
+pwP
34
o?wP XdwP o?wP XdwP
0.375oz 0.32mil 2oz 2.2mil
3.2.6 Foil
Thickness
o?wP
05
1oz 1mil 4oz 4.8mil
2005/11/22 PAGE 40
Nan Ya PCB
3.3 Plated Through Holes General
$% &'() *+ ,& -. /.
des>e>_
Pad
&'
Class2
'f>
25%
/
90
P
Class2,3
afd]
'OP
1mil
Class3
afd]'
f>
1mil
Calss2,3
')*
25%
3.3.1 Annual Ring
Internal
Layers
_'
yd[y. LGjkwHGH
d[y.
3.3.2 Lifted Land
d[y.
2005/11/22 PAGE 41
Nan Ya PCB
$% &'() *+ ,& -. /.
y\_@@ y\_@@ \_@@ 3.3.3 Plating
Crack
(Barrel)
Î\_@
@
y\_@@ y\_@@ \_@@ 3.3.4 Plating
Crack
(Coner)
2005/11/22 PAGE 42
Nan Ya PCB
$% &'() *+ ,& -. /.
^\_mn
y{|xuJ
^\_{|xu
J}~%p^f
\_1v;<
^\_{|xu
J%p^f
^\_wP~1
;<
3.3.5 Plating
Nodules
\_uJ
27
37
ôwmn
1v;<
ôw1vaf
ow;<
~1234D
3.3.6 Copper
Plating
Thickness
ôw
34
2005/11/22 PAGE 43
Nan Ya PCB
$% &'() *+ ,& -. /.
y^YZ GH^
3.3.7 Plating Void
^
26
^XYijm
n=y;o
^XYij=y
;o
A;oH~2B
3.3.8 Solder
Coating
Thickness
^XYi
j
72
2005/11/22 PAGE 44
Nan Ya PCB
$% &'() *+ ,& -. /.
yKLMK
Class 2
~)*
4mil
Class 3
~)*
3mil
NGH>
Clearance
"%paf#&>1
v;<
Class 2
)*
4mil
Class 3
)*
3mil
GH>
Clearance
"
af#&)*;<
3.3.9 Wicking
KLMK
yOP#$>^Q
>\o_#
+P:JR3m~2
B
}BVGHm~2B
~2B
3.3.10 Inter Plane
Separation
Vertical
_+\_
$.
25
2005/11/22 PAGE 45
Nan Ya PCB
$% &'() *+ ,& -. /.
yOP#$>^Q
>\o_#
+P:JR3m~
2B
~2B 3.3.11 Inter Plane
Separation
Horizontal
_+\_
$.
25
2005/11/22 PAGE 46
Nan Ya PCB
3.4 Plated Through Holes Drill .q/ 6/
$% &'() *+ ,& -. /.
yzV AzV}Ê1v
;<
AzV}Ê1v
;<
3.4.1 Burrs
S^zV
3.4.2 Nailheading
TU
yTU A:JTU=BN
;<VW)>
1.5
ATU}~Ao
_W.
S^Î7:M%X
3\{|xuJx3\^x\owP~,x\_@xKLMKx^fx5%xdX
?Y^
2005/11/22 PAGE 47
Nan Ya PCB
5.0 Cleanliness Testing UV.WX
IPC-TM-650 Method 2.3.25E2.3.26
<=78"1.56mg/cm
2
6.4unNacl/sqin
9Alpha 600SMD:;WX
2005/11/22 PAGE 48
Nan Ya PCB
ZANSI-J-STD-003q$[\
5.1 Solderability Testing :;PWX
WX9< =_gh9<
A. Edge Dip Test
[m>?3
SMD
B. Rotary Dip Test
@A>?3
PTH
B
SMD
C. Solder Float Test
B;3
PTH
B
SMD
D. Wave Solder Test
C:3
PTH
B
SMD
2005/11/22 PAGE 49
Nan Ya PCB
5.1 Solderability Testing :;PWX
$% &'() *+ ,& -. /.
^dXs>x]
^
^dXs> ^cX~s
5.1.1 Plated
Through
Hole
\]^
73

IPC A 600 Revision E

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IPC A 600 Revision E

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2005/11/22 PAGE 1

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