How the silicon substrate is used for MEMS devices.

Discuss the how ANSYS tool is used for transient and static analyses of MEMS devices.



Describe the steps involving in the MEMS process.

Explain the working and features of the MEMS accelerometer.



What is a Microsystems? Explain the working of sensors and actuators in the Microsystems.

Discuss the main building blocks of the MEMS technology





Analysis Types

Static Analysis
Dynamic Analysis
Transient Analysis
Modal Analysis
Harmonic Response Analysis
etc.
Buckling Analysis
Structural Analysis
Static, Transient, Modal, Harmonic, Buckling, etc.
Thermal Analysis
Steady-state, Transient
Electric Field Analysis
Static, Transient, Modal, Harmonic etc.

Transient Analysis

Inertia forces
Damping forces
Elastic forces
External forces

Static Analysis
When dynamic effects can be neglected, a problem can be solved statically.
Dynamic effects can be neglected only when the deformation velocity and acceleration are
small.
Two cases:
Steady-state solution
approximation solution for a real-world problem


MEMS Accelerometer
MEMS are quietly changing the way you live, in ways that you might never imagine. The device that
senses your car has been in an accident, and fires the airbag is a MEMS device. Most new cars have over
a dozen MEMS devices, making your car safer, more energy efficient, and more environmentally friendly.
MEMS are finding their way into a variety of medical devices, and everyday consumer products. (From
MEMX http://www.memx.com/ )
MEMS Advantages
Significantly lower manufacturing costs (semiconductor process)
Small inertial mass
Particularly realized in the area of:
sensors signal switching
F KD D C D M

Materials for MEMS
Materials are the foundation required to develop microsensors. MEMS are made of:
Metals
Polymers
Ceramic materials
Semiconductors
Composite materials
MEMS Process
Same as the process steps used for making conventional electronic circuits

Fabrication Process



Fabrication Process


MEMS Building Blocks
Major components in MEMS systems include
Design
Much more difficult than IC designs due to the interdisciplinary character of
MEMS
Design includes packaging
Packaging is one of the most challenging step both in design and
realization
Transducers must be integrated with electronics
Integration with ICs is another challenge for MEMS due to difficult
issues of process compatibility






Fabrication
Silicon technology is widely used in MEMS with new step added
Dimensions are usually much larger than those in ICs even for nano-
transducers. To feel NANO you do not need to be in the nano-scale size!
Other materials are included to perform required functions of
transducers
MEMS are frequently integrated with fluidics (polymers, glass)
Materials
Materials that can perform required functions (thermo, piezo-, magneto-
resististance)
Interaction with fluidics (half-cell potential, corrosion)
Microsystems
Microsystems are miniaturized (silicon or polymer) devices which perform non-electronic functions: typically sensing and actuation.
Typical microsystems have mechanical parts, like microbridges in RF switches or bending cantilevers in atomic
force microscopes (AFMs); electrical parts like piezoresistors in airbag sensors or capacitors in pressure sensors;
or thermal, optical and fluidic structures like heaters and nozzles in inkjet printer or flow sensors. In biomicrosystems
(BioMEMS) cells or microbeads are handled by fluidic streams, magnetic and electric fields, thermal gradients etc. In
chemical microsystems operations like sample pretreatment, separation and detection are built on microchips
Sensors
Fall into two categories:
Physical: force, acceleration, pressure, temperaure, magnetic/electric field strength
etc.
Chemical/biological: pH, reactions, binding between molecules etc.
Characteristics:
Sensitivity
Linearity
Responsivity (large signal-to-noise ratio SNR required)
Johnson noise, a with noise , thermal fluctuation,
(k=Boltzmanns constant, R=resistance, B=bandwidth), Gaussian distribution
Shot noise (quantum fluctuation)
1/f noise or flicker (pink) noise,(conductance fluctuation when currents flow)
Thermal-mechanical noise floor (mechanical motion of elements)
SNR
Dynamic range (highest to lowest signals)
Bandwidth (bandpass)
Drift (degradation and change of operational points)
Sensor reliability (related to stability of operation independently of conditions)
Cross talk or interference (individually tested parameters should not be affected by
other measurements/signals)
Development cost and time (vary depending on designs and technology, simulations
are very important in shortening the time-to market)

Actuators
Transform energy from/to the mechanical domain into/from others: electrical
(piezoelectricity, electrostatic), thermal, magnetic etc.