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PURE COPPER
Pure copper and some selected copper alloys are widely used in experimental plasma conIinement devices and have also been proposed Ior
various Iusion power plant applications where a high thermal or electrical conductivity material is required.
Copper based alloys have been considered as possible candidate materials Ior Iirst wall, limiter and divertor components and as Iield coils and
stabilisers Ior coils in magnetic conIinement Iusion devices. Their use as a Iirst wall material has been proposed in designs where high thermal
loads are expected on the Iirst wall or where a shell oI high electrical-conductivity material is required. Copper alloys have also been considered
Ior the electrically-conducting central column oI the tight aspect ratio tokamaks.
The main advantage oI copper alloys lies in their high thermal conductivities, which allows Ior higher heat Iluxes.
GENERAL PROPERTIES - PURE COPPER [1
Phsical properties
Boiling Point : 2567 C
Density 20 C : 8.96 g/cm
3
Melting Point : 1083 C
Electrical properties
Electrical Resistivity 20 C : 1.69 u ||Omega|| cm
Cold junction 0 C,
Hot junction 100 C : 76 mV
Temperature CoeIIicient 0 - 100 C : 0.0043/K
Mechanical properties
Material Condition Soft Hard Polcrstalline
Bulk Modulus (GPa) 137.8
Hardness-Vickers 49 87
Iod Toughness 58 68
(J/m)
Poisson's Ratio 0.343
Tensile Strength 224 314
(MPa)
[[sigma]] (MPa) 54 270
E (GPa) 129.8
Thermal properties
Latent Heat oI Evaporation : 4796 J/g
Latent Heat oI Fusion : 205 J/g
Linear Expansion CoeIIicient
0 - 100 C : 17.0x10
-6
m/m-K
SpeciIic Heat 25 C : 385 J/kg-K
Thermal Conductivity, 0 - 100 C : 401 W/m-K
DATA AND CORRELATIONS
The thermal and structural properties as a Iunction oI temperature are presented in Table 1, reIs |2, 3, 4, 5|. Polynomial correlations oI the
thermal and structural properties as Iunctions oI temperature, using the data oI Table 1, are as Iollows:
(1)
(2)
(3)
(4)
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(5)
with T in degrees Kelvin and Eqs (1), (2) and (4) are valid in the temperature range 293-1300 K, Eq (3) in the range 293-873 K and Eq (5) in
the range 293-1000 K.
Figures 1-3 show the variation of properties with temperature.
TABLE 1 Thermal and structural properties of pure copper
T K [[rho] E GPa [[nu]] k W/m-K c J/kg-K [[sigma]] [[alpha]] [[sigma]]
] MPa (10-6) u MPa
kg/m3 m/m-K
293 8933 129.80 0.34 400.68 383.48 210.74 15.40 250.42
300 401.00 385.00 210.00 15.40 250.00
350 396.78 392.00 20.652 15.77 238.07
373 395.20 394.73 205.00 15.94 230.00
400 393.00 398.44 205.00 16.15 223.03
450 389.93 403.00 197.81 16.53 204.85
473 388.35 405.90 195.00 16.60 200.00
500 386.50 408.00 181.50 16.92 184.29
550 383.08 412.00 156.74 17.31 162.12
573 381.50 414.80 140.00 17.49 150.00
600 379.00 417.00 126.48 17.70 139.11
650 376.23 421.00 94.83 18.10 116.00
673 374.65 422.42 85.00 18.30 100.00
700 372.80 425.00 65.93 18.50 93.59
773 367.80 429.76 35.00 19.10 70.00
800 366.00 432.00 26.32 19.32 53.85
873 360.96 437.82 10.00 20.00 30.00
900 359.11 441.00 20.15 26.00
1000 352.00 451.00 21.00 16.15
1073 347.26 460.07 21.60
1100 345.41 464.00 21.88
1200 339.00 480.00 22.76
1250 335.13 490.00 23.21
1300 331.71 506.00 23.67
k (W/m-K) c (J/kg-K)
Temperature (K)
Figure 1 : Thermal conductivit and specific heat of pure copper.
[[sigma]] (MPa) [[sigma]]u (MPa)
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Tempeae (K)
Fige 2 : Yield e and limae enile engh of pe coppe.
[[alpha]] (10
-6
m/m-K)
Tempeae (K)
Fige 3 : The hemal epanion coefficien of pe coppe.
Refeence
1. Goodfello. Meal, Allo, Compond, Ceamic, Polme, Compoie. Caaloge 1993/94.
2. J. Ph. Chem. Ref. Daa, Vol. 13, No. 4, (1984) pg 1252
3. Fank P. Incopea, Daid P Dei. Fndamenal of Hea and Ma Tanfe. Second Ediion
4. T J. Mille, S J. Zinkle and B A. Chin. Sengh and Faige of Dipeion-Senghened Coppe. Jonal of Nclea Maeial, 179 - 181,
pg 263 - 266, Noh-Holland.
5. Handbook of Chemi and Phic, Fi Ediion, CRC Pe, pg 12 - 108.
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