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Pulsonix
Our Pulsonix technology files have a layer class named "PADS layer 25" which equates to layer
"25" in the PADS PCB CAD system. In PADS this layer is used for component mechanical
outlines. There are two layers of this class in each PCB file, "3D Model Outline Top" for the top
side and "3D Model Outline Bottom" for the bottom side. The component outline on this layer can
be automatically imported from a PADS ASCII footprint created by the PCB Libraries IPC Land
Pattern Wizard for PADS.
The mechanical outline of the component body is drawn on layer "3D Model Outline Top" using
the line style "Mechanical Part Outline", a solid line of 0.001 mm width.
Our Pulsonix parts library has an attribute named <Component Height> for recording the
component height. This is entered in millimetres.
Exporting IDF from Pulsonix
Pulsonix has an "IDF" export facility for exporting PCB 3D data to 3D mechanical CAD systems.
This is available in the PCB editor through OUTPUT → IDF… which brings up the IDF export
dialogue window.
Figure 1 Pulsonix IDF Output dialogue
Filenames for the "Board Filename" and "Library Filename" must not contain spaces or dashes for
them to be viewable in ProEngineer.
Enter value for board thickness; 0.8 mm, 1.6 mm and 2 mm are the most common standard board
thicknesses.
Select PADS layer 25 for the Component Outlines Layer Class.
Select <Component Height> for the component heights.
Press OK.
If you want all holes in the PCB to appear in the Solidworks model then the option “Add board
drilled holes” should be selected. This will usually be the case.
If there are components on bottomside of the PCB that have footprint symbol origins not centroid
(i.e. pin 1) then the option “Reverse underside components” may have to be selected.
After selecting the required options press OK to return to the File Open dialogue, then press OK to
load in the IDF data into Solidworks.
The PCB will now be loaded in to Solidworks as a single part. The component outline is for the
two-dimensional component body so doesn't take account of cut-outs in the 3D profile.