Professional Documents
Culture Documents
Patrick Chiang
School of Electrical Engineering and Computer Science
Oregon State University
Corvallis, OR, USA
pchiang@eecs.oregonstate.edu
I. INTRODUCTION
While continual scaling of transistor dimensions has
improved the performance and density of digital circuits,
analog and more specifically RF circuits have not found
similar benefit. For a number of reasons, RF circuit design
has become harder to design in deep submicron CMOS. The
major difficulty in these technologies is the issue of process
variability and modeling inaccuracy. As technologies
become more advanced, the ability to model and accurately
predict how the circuit will behave becomes increasingly
difficult. For example, transistor length variation and
threshold voltage mismatch are expected to be more
unpredictable below 130nm CMOS [4]. In addition,
manufacturing foundries currently have a difficult time
predicting the process skew and variation of the devices, as
typically the process needs time to mature. This leads to an
unstable and constantly updating design kit for RF circuit
designers to use, making accurate design simulation
extremely difficult.
The situation is considerably worse if we also consider
the difficulty RF designers have in extracting, estimating and
simulating the passive devices and the associated parasitics.
For example, characterizing on-chip spiral inductors requires
special 3D field solvers to estimate parasitics.
RFin
Pad
Bandpass
filter
Pad
Mixer
Vdd1
Vdd2
Pad
LNAin
LNA
LNAout
Gnd2
Gnd1
Pad
Pad
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g
1
+ m1 Ls wT Ls
sCgs Cgs
(1)
SWITCHABLE CAPACITORS
Rb =
Lb =
W K (Vgs VT )
T2
Rb
(5)
2 Rb Cgs
2 ( Rb + Rin )2
2
(6)
NF 1 + ( o ) 2 g m Rb + ( o )2
+
T
T g m Rb
Qin =
(4)
PCC = 4
III.
[2]
[3]
[4]
Process
S11(dB)
S22(dB)
S21(dB)
NF
Calibrate
Classic
LNA
Worst
-9.9
-12.5
18.4
2.8
[5]
-11.0
-13.0
20.2
2.6
before
Max
-18.2
-16.0
22.6
2.0
after
Min
-9.5
-11.0
17.9
3.0
before
-13.2
-12.0
17.8
3.1
after
[6]
Table (1)
2565