h

November

28, 1995

ELECTRONIC

COMPONE
SHARP CORPORATION

GROUP

OPTO-ELECTS
DEVICES DIV.

SPECIFICATION
F

DEVICE SPECIFICATION

Business dealing name

FOR

PHOTOCOUPLER
MODEL No.

PC817

1. These specification
sheets include the contents under the copyright of Sharp Corporation
Please keep them with reasonable
care as important
information.
Please dont reproduce
or cause anyone reproduce
them without Sharps consent.

(Sharp].

2. Please obey the instructions

mentioned below for actual use of this device.
SHARP takes no responsibility
for damage caused by improper use of the devices.
(I)

This device is designed for general electronic

Main uses of this device are as follows;
- OA equipment

* Computer
[

- Measuring

equipment

equipment.

- Telecommunication

Tooling

machine

equipment

- AV equipment

(Terminal)
l

Home appliance,

etc.

(2) Please take proper steps in order to maintain reliability and safety, in case this device
is used for the uses mentioned
below which require high reliability.
- Unit concerning
- Traffic signal
[

control

and safety of a vehicle

* Gas leak detection

* Other safety equipment,

[ * Nuclear

control

* Telecommunication
equipment

DATE

BY

automobile

* Medical

below which

require

extremely

equipment

(Trunk)

equipment

Contact a SHARP representative

of sales office in advance
devices for any applications
other than those applications
recommend
by SHARP at (1).

CUSTOMERS APPROVAL

train,

* Fire box and burglar

alarm

etc.)
box

etc.

(3) Please do not use for the uses mentioned

- Space equipment

(air plane,

breaker

etc.

high reliability.

when you intend to use S?%4.RP

for general electronic
equipment

DATE
PRESENTED
BY
T. Matsumura,
Department General Manager of
Engineering Dept.,11
Opto-Electronic Devices Div.
ELECOM Group
SHARP CORPORATION

SHARP CORPORATION

November

1. Application
This specification
applies to the outline
Model No. PC8 17series.

and characteristics

of photocoupler

2. Outline
Refer to the attached

3. Ratings

drawing

No. CY7073K02.

and characteristics

Refer to the attached

sheet, page 3 to 6.

4. Reliability
Refer to the attached

5. Incoming

sheet, page 7.

inspection

Refer to the attached

sheet, page 8.

6. Supplement
6.1 Isolation

voltage shall be measured

in the following

(11 Short between anode to cathode on the primary

to emitter on the secondary side.
(21 The dielectric

withstand

tester with

zero-cross

method.

side and between

circuit

collector

shall be used.

(3) The wave form of applied voltage shall be a sine wave.

(It is recommended
that the isolation voltage be measured

in insulation

oil.)

28. 1995

SHARP CORPORATION

6.2 Business
dealing name
( 0 mark indicates business

Ordered
nroduct

Test
conditions

Ic (mA)

A, B, C, D or no mark

2.5 to 30

PC817XIl

1,=5mA

PC8 17XI2
PC8 17XI3
PC8 17XI4

4.0 to 8.0
6.5 to 13
10to20
15 to 30

vc,=5v

4.0to 13 :
6.5 to 20
10 to 30

Ta=25C

PC817XI5
PC8 17Xi6

1 PC817XI7
PC8 172U8
I PC8 17XI9
1 PC817XIO

C
D

AorB
B or C
C or D

A, B or C
B, CorD

A, B, C or D

6.3 This Model is approved

Approved

product)

Rank mark

Business
dealingname
PC817Xl

dealing name of ordered

4.0 to 20
6.5 to 30
1

4.oto30

by UL.

Model No. : PC8 17

UL file No. : E64380

6.4 This product

is not designed

against

irradiation.

This product

is assembled

with electrical

This product

incorporates

non-coherent

7. Notes
Refer to the attached

sheet- 1- 1, 2.

input

and output.

light emitting

diode.

Ta=25C

l 1 Forward

Collector

current

current

Ic

50

mA

PC

150

mW

Ptot

200

mW

voltage

viso

kVrms

temperature

Topr

-30 to +lOO

Tstg

-55 to +125

Tsol

260

*l

Collector

power

*l

Total power

*3 Isolation
Operating
Storage

dissipation

dissipation

temperature

*4 Soldering

temperature

1 The derating factors of absolute

are shown in Fig. 1 to 4.
*2 Pulse width_IlOO

,us, Duty ratio : 0.001

*3 AC for 1 min, 40 to 6O%RH

l 4 For 10s

maximum

ratings

due to ambient

(Refer to Fig. 5)

temperature

SHARP CORPORATION

3.2 Electra-optical

characteristics

Parameter
Forward

Syllhl
voltage

Peak forward

voltage

VF
vFM

Condition

MIN.

TYP.

MAX.

Unit

1.2

1.4

3.0

10

PA

30

250

pF

:-

100

nA

35

I,=10 /LA, I,=0

I,=5mA.VcE=5V

2.5

30

mA

0.1

0.2

1ol

0.6

1.0

pF

80

kHz

18

pus

18

pus

IFI,=20mA
Im=0.5A

Input
Reverse current

1,

v,=4v

Terminal

Ct

v=o, f=lkHz

Dark

output

capacitance

current

Collector-emitter
breakdown
voltage

BvCEO

Emitter-collector
breakdown
voltage

BvECO

Collector

current

Collector-emitter
saturation
voltage

Transfer
characteristics

kE0

Ic
V CEfsat)

vc,=20v,

IF=0

Ic=O. 1mA
IF.=0

1,=2omA
Ic=lmA

Isolation

resistance

RIS0

Floating

capacitance

cf

v=o, f=lMHz

fc

vc,=5v,
Ic=2mA
R,=lOO R, -3dB

Rise time

tr

Fall time

lf

vc,=2v
Ic=2mA
R,=lOO R

Cut-off

frequency

DC500V
40 to 6O%FW

5XlOO

Rank mark
mark

6. 50.5

7. 62ro-3

l2

Pin Nos. and internal

cdnnection diagram

d
2
d
T
1. oy

10. oz. 5

1.

l-J

2. 54$0.25

UNIT:

l 2) Factory identification

l/l

mark shall be or shall not be marked.

PC817

mm

SHARP CORPORRTION

(Fig. 1) Forward
ambient

(Fig. 2) Diode power diss&iok<->,

vs. ambient temperature

current vs.
temperature

5
2
.+
i
P
t;

-..

80
70
60
40

&
4

-30

0
Ambient

25

55

75

temperature

100

-30

125

0
Ambient

z
.5

25

50

temperature

75

100

25

55

125

-30

0
Ambient

Ta ( C )

75

temperature

(Fig. 4) Total power

vs. ambient

25

100

125

Ta ( C )

dissipation
temperature

50

temperature

75

100

125

Ta (C )

(Fig. 5) Peak forward current

vs. duty ratio
PulsewidthS
Ta=25C

2 2000
1000
i
500
2

0
Ambient

Ta ( C )

(Fig. 3) Collector power dissipation

vs. ambient temperature

-30

20

ps

200

;
100
m 50
2z
20
Y
10
2
5 lo-2 5 lo2 5 lo-2
e
Duty ratio

5 10
J

SHARP CORPORATION

4. Reliability
of products

The reliability

shall be satisfied

with

items listed below.

Confidence level : 90%
LTPD: 10%/20%

Test Conditions

Test Items

Failure
$1

Solderability

Judgement
Criteria

Samples (nl
Defective(C)

23OC, 5 s

n=ll,

C=O

n=ll,

C=O

n=ll,

C=O

n=ll,

C=O

n=ll,

C=O

n=ll,

C=O

Soldering

heat

260C. 10 s

Terminal
(Tension)

strength

Weight : 5N
5 s/each terminal

Terminal strength
(Bending)
*3

Weight : 2.5N
2 times /each terminal

Mechanical

15000m/s2,
0.5ms
3 times/ tX, +Y, fZ

v,>ux

1.2

I,>UXZ
Icso >ux2

Variable
vibration

shock

frequency

direction

rc<LX0.7

100 to 2000 to 1ooHz/4min

200m/s2
4 times/ X, Y, 2 direction

Temperature
cycling

1 cycle -55 C to t 125C

(30mir-i)
(30mi.n)
20 cycles test

High temp. and high

humidity storage

+6OC, 9O%RH,

High temp. storage

+125C,

Low temp. storage

-55C, 1 OOOh

Operation

I,=SOmA, Ptot=200mW
Ta=25C, 1OOOh

V CE(sat)

*l

life

Test method,

conforms

lOOOh

O2

n=22,C=O

U
lOOOh

>

Upper
specification
limit

L : Lower
specification
limit

to JIS C 7021.

2 Solder shall adhere at the area of 95% or more of immersed portion of

lead and pin hole or other holes shall not be concentrated
on one portion.
*3 Terminal

bending

direction

is shown

below.

n=22,C=O

n=22 ,C=O
i-i=22 ,C=O
n=22.C=0

SHARP CORPORATION

5. Incoming

inspection

5.1 Inspection

items

(11 Electrical

characteristics

V,, I,, I,,,

VCE:(satj,Ic, R,,,

Visa

(2) Appearance
5.2 Sampling

method

and Inspection

level

A single sampling plan, normal inspection level II based on

IS0 2859 is applied. The AQL according to the inspection
items axe shown below.

Defect

Inspection

item

AQL (%)

SHflRP CORPORATION

Precautions

for Photocouplers

1 For cleaning
(1) Solvent cleaning

(2) Ultrasonic

Applicable

: Solvent temperature
45C or less
Immersion
for 3 min or less

cleaning

solvent

: The affect to device by ultrasonic

cleaning is different
by cleaning bath size, ultrasonic
power
output, cleaning time, PWB size or device mounting
condition etc. Please test it in actual using condition
and con&m that doesnt occur any defect before starting
the ultrasonic
cleaning.
: Ethyl alcohol, Methyl alcohol
Freon TE * TF. DifIon-solvent

Please refrain form using Chloro

device as much as possible since
the ozonosphere.
Before you use
to confirm that it does not attack

S3-E

Fluoro Carbon type solvent to clean

it is internationally
restricted
to protect
alternative solvent you are requested
package resin.

2. The LED used in the Photocoupler

generally decreases the light emission power
by operation.
In case of long operation time, please design the circuit with considering
the degradation of the light emission power of the LED. (50% / 5years)

SHflRP CORPORRTION

3. Precaution
( 11 If solder refIow

for Soldering

Photocoupler

It is recommended
that only one soldering be done at the temperature
and the time within the temperature
profile as shown in the figure.

230t

200C
180C

25C

(2) Other precautions

An infbared Iamp used to heat up for soldering may cause a localized
temperature
rise in the resin. So keep the package temperature
within
that specified in Item (1). Also avoid immersing
the resin part in the solder.

This datasheet has been download from:

www.datasheetcatalog.com
Datasheets for electronics components.