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bq27421-G1
SLUSB85B MAY 2013 REVISED NOVEMBER 2014
bq27421-G1 System-Side Impedance Track Fuel Gauge With Integrated Sense Resistor
1 Features
3 Description
PACKAGE
bq27421-G1
DSBGA (9)
1.62 mm 1.58 mm
2 Applications
4 Simplified Schematic
I 2C
Bus
SRX
SCL
Coulomb
Counter
SDA
Integrated
Sense
Resistor
CPU
GPOUT
BIN
VSYS
Battery Pack
BAT
ADC
PACKP
T
VDD
1.8 V
LDO
VSS
0.47F
PACKN
Li-Ion
Cell
Protection
IC
NFET NFET
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
bq27421-G1
SLUSB85B MAY 2013 REVISED NOVEMBER 2014
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Simplified Schematic.............................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
1
2
3
3
4
8.1
8.2
8.3
8.4
8.5
8.6
8.7
4
4
4
5
5
5
5
6
6
6
7
Overview ................................................................... 9
Functional Block Diagram ......................................... 9
Feature Description................................................... 9
Device Functional Modes........................................ 10
Programming........................................................... 10
12 Layout................................................................... 19
12.1 Layout Guidelines ................................................. 19
12.2 Layout Example .................................................... 19
20
20
20
20
5 Revision History
Changes from Revision A (August 2014) to Revision B
Page
Added Typical Characteristics, Application Information, Design Requirements, and Application Curves ............................ 1
Deleted holding lines low enters low power sleep mode ..................................................................................................... 12
Page
bq27421-G1
www.ti.com
BATTERY TYPE
bq27421YZFR-G1A
LiCoO2
(4.2 V maximum charge)
0x128
LiCoO2
(4.3 to 4.35 V maximum charge)
0x312
LiCoO2
(4.3 to 4.4 V maximum charge)
0x3142
bq27421YZFT-G1A
bq27421YZFR-G1B
bq27421YZFT-G1B
bq27421YZFR-G1D
bq27421YZFT-G1D
(1)
(2)
CHEM_ID
(1)
PACKAGE
(2)
COMMUNICATION FORMAT
I2C
CSP-9
C3
C2
C1
C1
C2
C3
B3
B2
B1
B1
B2
B3
A3
A2
A1
A1
A2
A3
Pin A1
Index Area
DIM
MIN
TYP
MAX
1590
1620
1650
1550
1580
1610
UNITS
m
Pin Functions
PIN
NAME
BAT
BIN
C3
B1
GPOUT
(1)
NUMBER
A1
TYPE (1)
PI, AI
DESCRIPTION
LDO regulator input, battery voltage input, and coulomb counter input typically connected to the
PACK+ terminal.
DI
Battery insertion detection input. If Operation Configuration bit [BIE] = 1 (default), a logic low on
the pin is detected as battery insertion. For a removable pack, the BIN pin can be connected to VSS
through a pulldown resistor on the pack, typically the 10-k thermistor; the system board should use
a 1.8-M pullup resistor to VDD to ensure the BIN pin is high when a battery is removed. If the
battery is embedded in the system, it is recommended to leave [BIE] = 1 and use a 10-k pulldown
resistor from BIN to VSS. If [BIE] = 0, then the host must inform the gauge of battery insertion and
removal with the BAT_INSERT and BAT_REMOVE subcommands. A 10-k pulldown resistor
should be placed between BIN and VSS, even if this pin is unused.
NOTE: The BIN pin must not be shorted directly to VCC or VSS and any pullup resistor on the BIN
pin must be connected only to VDD and not an external voltage rail.
DO
This open-drain output can be configured to indicate BAT_LOW when the Operation Configuration
[BATLOWEN] bit is set. By default [BATLOWEN] is cleared and this pin performs an interrupt
function (SOC_INT) by pulsing for specific events, such as a change in State of Charge. Signal
polarity for these functions is controlled by the [GPIOPOL] configuration bit. This pin should not be
left floating, even if unused, so a 10-k pullup resistor is recommended.
bq27421-G1
SLUSB85B MAY 2013 REVISED NOVEMBER 2014
www.ti.com
NUMBER
TYPE (1)
DESCRIPTION
Slave I2C serial bus for communication with system (Master). Open-drain pins. Use with external
10-k pullup resistors (typical) for each pin. If the external pullup resistors will be disconnected from
these pins during normal operation, recommend using external 1-M pulldown resistors to VSS at
each pin to avoid floating inputs.
SCL
A3
DIO
SDA
A2
DIO
SRX
C2
AI
Integrated high-side sense resistor and coulomb counter input typically connected to system power
rail VSYS.
VDD
B3
PO
1.8-V Regulator Output. Decouple with 0.47-F ceramic capacitor to VSS. This pin is not intended to
provide power for other devices in the system.
VSS
B2, C1
PI
Ground pins. The center pin B2 is the actual device ground pin while pin C1 is floating internally and
therefore C1 may be used as a bridge to connect to the board ground plane without requiring a via
under the device package. Recommend routing the center pin B2 to the corner pin C1 using a toplayer metal trace on the board. Then route the corner pin C1 to the board ground plane.
8 Specifications
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
UNIT
VBAT
0.3
VSRX
VBAT 0.3
VBAT + 0.3
VDD
0.3
VIOD
0.3
VIOPP
0.3
VDD + 0.3
TA
40
85
(1)
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
V(ESD)
(1)
(2)
MIN
MAX
UNIT
65
150
1.5
1.5
250
250
Electrostatic discharge
kV
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
CLDO18 (1)
VPU (1)
(1)
TYP
MAX
UNIT
0.1
0.47
F
3.6
bq27421-G1
www.ti.com
RJCtop
0.7
RJB
60.4
JT
3.5
JB
60.4
RJCbot
NA
(1)
UNIT
YZF (9 PINS)
107.8
C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(1)
IHIB (1)
ISD (1)
(1)
(2)
TEST CONDITIONS
ILOAD > Sleep Current
(2)
(2)
MIN
(2)
TYP
MAX
UNIT
93
21
0.6
VOL
IOH
CIN
(1)
MIN
TYP
0.6
(3)
(2) (3)
Ilkg
0.6
0.5
mA
mA
pF
0.1
UNIT
V
MAX
VPU 0.7
(2) (3)
VIL
IOL(OD)
TEST CONDITIONS
VDD
UVLOIT+
UVLOIT
(1)
TEST CONDITIONS
MIN
TYP
2.45
MAX
UNIT
4.5
1.8
1.95
bq27421-G1
SLUSB85B MAY 2013 REVISED NOVEMBER 2014
www.ti.com
VIN(BAT)
tADC_CONV
(1)
TEST CONDITIONS
Voltage divider enabled.
MIN
TYP
2.45
MAX
4.5
Conversion time
Effective resolution
UNIT
V
125
ms
15
bits
TEST CONDITIONS
MIN
TYP
MAX
tSR_CONV
Conversion time
Single conversion
Effective Resolution
Single conversion
16
bits
(1)
BAT 25
UNIT
VSR
mV
TEST CONDITIONS
MIN
TA = 30C
(1)
(2)
(3)
MAX
TYP
UNIT
m
2000
mA
2500
mA
3500
mA
bq27421-G1
www.ti.com
TYP
MAX
UNIT
4.7
4.7
250
ns
td(STA)
tw(L)
tw(H)
tsu(STA)
tsu(DAT)
th(DAT)
ns
tsu(STOP)
t(BUF)
Bus free time between stop and start Includes Command Waiting Time
tf
tr
fSCL
66
(1)
300
(1)
ns
300
ns
100
kHz
600
ns
tw(L)
tw(H)
1300
ns
600
ns
tsu(STA)
600
ns
tsu(DAT)
100
ns
th(DAT)
ns
tsu(STOP)
600
ns
t(BUF)
Bus free time between stop and start Includes Command Waiting Time
tf
tr
fSCL
(1)
(2)
66
(1)
300
(1)
ns
300
ns
400
kHz
tw(H)
tf
tw(L)
tr
t(BUF)
SCL
SDA
td(STA)
tsu(STOP)
tf
tr
th(DAT)
tsu(DAT)
REPEATED
START
STOP
START
bq27421-G1
SLUSB85B MAY 2013 REVISED NOVEMBER 2014
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10
0.12
5
0.1
0.08
0.06
-5
-10
0.04
0.02
-40
-20
20
40
Temperature (C)
60
80
100
-15
-40
-20
20
40
Temperature (C)
60
80
100
-0.1
-0.2
-0.3
-0.4
-0.5
-0.6
-40
-20
20
40
Temperature (C)
60
80
100
bq27421-G1
www.ti.com
9 Detailed Description
9.1 Overview
The fuel gauge accurately predicts the battery capacity and other operational characteristics of a single Li-based
rechargeable cell. It can be interrogated by a system processor to provide cell information, such as state-ofcharge (SOC).
NOTE
The following formatting conventions are used in this document:
Commands: italics with parentheses() and no breaking spaces, for example, Control()
Data Flash: italics, bold, and breaking spaces, for example, Design Capacity
Register bits and flags: italics with brackets [ ], for example, [TDA]
Data Flash bits: italics, bold, and brackets [ ], for example, [LED1]
Modes and states: ALL CAPITALS, for example, UNSEALED mode
SCL
I2C
Bus
Coulomb
Counter
SDA
Integrated
Sense
Resistor
CPU
GPOUT
VDD
bq27421
Battery Pack
PACKP
BAT
ADC
BIN
VSYS
1.8V
LDO
Li-Ion
Cell
Protection
IC
PACKN
NFET NFET
0.47uF
VSS
bq27421-G1
SLUSB85B MAY 2013 REVISED NOVEMBER 2014
www.ti.com
9.5 Programming
9.5.1 Standard Data Commands
The fuel gauge uses a series of 2-byte standard commands to enable system reading and writing of battery
information. Each standard command has an associated command-code pair, as indicated in Table 1. Because
each command consists of two bytes of data, two consecutive I2C transmissions must be executed both to
initiate the command function, and to read or write the corresponding two bytes of data. Additional details are
found in the bq27421-G1 Technical Reference Manual (SLUUAC5).
Table 1. Standard Commands
COMMAND
CODE
NAME
UNIT
SEALED ACCESS
Control()
CNTL
NA
RW
Temperature()
TEMP
0.1K
RW
VOLT
mV
FLAGS
NA
mAh
Voltage()
Flags()
NominalAvailableCapacity()
FullAvailableCapacity()
mAh
RemainingCapacity()
RM
mAh
FullChargeCapacity()
FCC
mAh
AverageCurrent()
mA
StandbyCurrent()
mA
MaxLoadCurrent()
mA
AveragePower()
mW
0.1K
num / %
RemainingCapacityUnfiltered()
mAh
RemainingCapacityFiltered()
mAh
FullChargeCapacityUnfiltered()
mAh
FullChargeCapacityFlitered()
mAh
StateOfChargeUnfiltered()
StateOfCharge()
SOC
InternalTemperature()
StateOfHealth()
10
SOH
bq27421-G1
www.ti.com
SEALED
ACCESS
CONTROL_STATUS
0x0000
Yes
DEVICE_TYPE
0x0001
Yes
FW_VERSION
0x0002
Yes
DM_CODE
0x0004
Yes
PREV_MACWRITE
0x0007
Yes
CHEM_ID
0x0008
Yes
Reports the chemical identifier of the battery profile used by the fuel gauge
BAT_INSERT
0x000C
Yes
Forces the Flags() [BAT_DET] bit set when the OpConfig [BIE] bit is 0
BAT_REMOVE
0x000D
Yes
Forces the Flags() [BAT_DET] bit clear when the OpConfig [BIE] bit is 0
SET_HIBERNATE
0x0011
Yes
CLEAR_HIBERNATE
0x0012
Yes
SET_CFGUPDATE
0x0013
No
SHUTDOWN_ENABLE
0x001B
No
SHUTDOWN
0x001C
No
SEALED
0x0020
No
TOGGLE_GPOUT
0x0023
Yes
RESET
0x0041
No
SOFT_RESET
0x0042
No
EXIT_CFGUPDATE
0x0043
No
EXIT_RESIM
0x0044
No
CNTL FUNCTION
DESCRIPTION
Command Code
Unit
SEALED
Access (1) (2)
UNSEALED
Access (1) (2)
R
OpConfig()
NA
DesignCapacity()
mAh
0x3E
NA
NA
RW
DataClass()
(2)
DataBlock()
(2)
0x3F
NA
RW
RW
NA
RW
BlockDataCheckSum()
0x60
NA
RW
RW
BlockDataControl()
0x61
NA
NA
RW
NA
BlockData()
Reserved
(1)
(2)
SEALED and UNSEALED states are entered via commands to Control() 0x00 and 0x01
In SEALED mode, data cannot be accessed through commands 0x3E and 0x3F.
11
bq27421-G1
SLUSB85B MAY 2013 REVISED NOVEMBER 2014
www.ti.com
9.5.4 Communications
9.5.4.1 I2C Interface
The fuel gauge supports the standard I2C read, incremental read, quick read, one-byte write, and incremental
write functions. The 7-bit device address (ADDR) is the most significant 7 bits of the hex address and is fixed as
1010101. The first 8 bits of the I2C protocol are, therefore, 0xAA or 0xAB for write or read, respectively.
Host generated
S
ADDR[6:0]
0 A
Gauge generated
CMD [7:0]
DATA [7:0]
A P
ADDR[6:0]
ADDR[6:0]
0 A
1 A
DATA [7:0]
N P
A Sr
ADDR[6:0]
1 A
DATA [7:0]
N P
ADDR[6:0]
0 A
CMD [7:0]
A Sr
ADDR[6:0]
1 A
DATA [7:0]
A ...
DATA [7:0]
N P
ADDR[6:0]
0 A
CMD[7:0]
DATA [7:0]
DATA [7:0]
...
A P
The quick read returns data at the address indicated by the address pointer. The address pointer, a register
internal to the I2C communication engine, increments whenever data is acknowledged by the fuel gauge or the
I2C master. Quick writes function in the same manner and are a convenient means of sending multiple bytes to
consecutive command locations (such as two-byte commands that require two bytes of data).
The following command sequences are not supported:
Attempt to write a read-only address (NACK after data sent by master):
12
bq27421-G1
www.ti.com
ADDR [6:0]
0 A
CMD [7:0]
DATA [7:0]
A P
66ms
ADDR [6:0]
0 A
CMD [7:0]
DATA [7:0]
A P
66ms
ADDR [6:0]
0 A
CMD [7:0]
A Sr
ADDR [6:0]
1 A
DATA [7:0]
DATA [7:0]
N P
66ms
N P
66ms
Waiting time inserted between two 1-byte write packets for a subcommand and reading results
(required for 100 kHz < fSCL 400 kHz)
ADDR [6:0]
0 A
CMD [7:0]
DATA [7:0]
ADDR [6:0]
0 A
CMD [7:0]
A Sr
ADDR [6:0]
A
1 A
DATA [7:0]
DATA [7:0]
A P
A
66ms
DATA [7:0]
Waiting time inserted between incremental 2-byte write packet for a subcommand and reading results
(acceptable for fSCL 100 kHz)
ADDR [6:0]
DATA [7:0]
0 A
A
CMD [7:0]
DATA [7:0]
A Sr
N P
ADDR [6:0]
1 A
DATA [7:0]
DATA [7:0]
66ms
13
bq27421-G1
SLUSB85B MAY 2013 REVISED NOVEMBER 2014
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14
bq27421-G1
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15
bq27421-G1
SLUSB85B MAY 2013 REVISED NOVEMBER 2014
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16
bq27421-G1
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10
0.12
5
0.1
0.08
0.06
-5
-10
0.04
0.02
-40
-20
20
40
Temperature (C)
60
80
100
-15
-40
-20
20
40
Temperature (C)
60
80
100
-0.1
-0.2
-0.3
-0.4
-0.5
-0.6
-40
-20
20
40
Temperature (C)
60
80
100
17
bq27421-G1
SLUSB85B MAY 2013 REVISED NOVEMBER 2014
www.ti.com
18
bq27421-G1
www.ti.com
12 Layout
12.1 Layout Guidelines
A capacitor, of value at least 0.47 F, is connected between the VDD pin and VSS. The capacitor should be
placed close to the gauge IC and have short traces to both the VDD pin and VSS.
It is recommend to have a capacitor, at least 1.0 F, connect between the BAT pin and VSS if the connection
between the battery pack and the gauge BAT pin has the potential to pick up noise. The capacitor should be
placed close to the gauge IC and have short traces to both the VDD pin and VSS.
If the external pullup resistors on the SCL and SDA lines will be disconnected from the host during low-power
operation, it is recommend to use external 1-M pulldown resistors to VSS to avoid floating inputs to the I2C
engine.
The value of the SCL and SDA pullup resistors should take into consideration the pullup voltage and the bus
capacitance. Some recommended values, assuming a bus capacitance of 10 pF, can be seen in Table 4.
Table 4. Recommended Values for SCL and SDA Pullup Resistors
VPU
RPU
1.8 V
3.3 V
Range
Typical
Range
Typical
10 k
5.1 k
If the GPOUT pin is not used by the host, the pin should still be pulled up to VDD with a 4.7-k or 10-k
resistor.
If the battery pack thermistor is not connected to the BIN pin, the BIN pin should be pulled down to VSS with a
10-k resistor.
The BIN pin should not be shorted directly to VDD or VSS.
The actual device ground is the center pin (B2). The C1 pin is floating internally and can be used as a bridge
to connect the board ground plane to the device ground (B2).
19
bq27421-G1
SLUSB85B MAY 2013 REVISED NOVEMBER 2014
www.ti.com
13.2 Trademarks
Impedance Track, NanoFree are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
13.4 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
20
www.ti.com
4-Nov-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
BQ27421YZFR-G1A
ACTIVE
DSBGA
YZF
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
BQ27421
G1A
BQ27421YZFR-G1B
ACTIVE
DSBGA
YZF
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
BQ27421
G1B
BQ27421YZFR-G1D
ACTIVE
DSBGA
YZF
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
BQ27421
G1D
BQ27421YZFT-G1A
ACTIVE
DSBGA
YZF
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
BQ27421
G1A
BQ27421YZFT-G1B
ACTIVE
DSBGA
YZF
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
BQ27421
G1B
BQ27421YZFT-G1D
ACTIVE
DSBGA
YZF
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
BQ27421
G1D
(1)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
www.ti.com
4-Nov-2014
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
4-Nov-2014
Device
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
BQ27421YZFR-G1A
DSBGA
YZF
3000
180.0
8.4
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
1.78
1.78
0.69
4.0
8.0
Q1
BQ27421YZFR-G1B
DSBGA
YZF
3000
180.0
8.4
1.78
1.78
0.69
4.0
8.0
Q1
BQ27421YZFR-G1D
DSBGA
YZF
3000
180.0
8.4
1.78
1.78
0.69
4.0
8.0
Q1
BQ27421YZFT-G1A
DSBGA
YZF
250
180.0
8.4
1.78
1.78
0.69
4.0
8.0
Q1
BQ27421YZFT-G1B
DSBGA
YZF
250
180.0
8.4
1.78
1.78
0.69
4.0
8.0
Q1
Pack Materials-Page 1
4-Nov-2014
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
BQ27421YZFR-G1A
DSBGA
YZF
3000
182.0
182.0
17.0
BQ27421YZFR-G1B
DSBGA
YZF
3000
182.0
182.0
17.0
BQ27421YZFR-G1D
DSBGA
YZF
3000
182.0
182.0
17.0
BQ27421YZFT-G1A
DSBGA
YZF
250
182.0
182.0
17.0
BQ27421YZFT-G1B
DSBGA
YZF
250
182.0
182.0
17.0
Pack Materials-Page 2
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