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Composites: Part A
journal homepage: www.elsevier.com/locate/compositesa
School of Energy and Power Engineering, Nanjing University of Science & Technology, Nanjing 210094, China
Electromechanical Engineering College, Guilin University of Electronic Technology, Guilin 541004, China
a r t i c l e
i n f o
Article history:
Received 17 August 2013
Received in revised form 5 October 2013
Accepted 25 October 2013
Available online 6 November 2013
Keywords:
Interface
Physical properties
Polymer-matrix composites (PMCs)
Microstructures
a b s t r a c t
To enhance heat transfer performance of epoxy resin as a thermal interface material (TIM), multi-walled
carbon nanotubes (MWCNTs) and nano-copper particles are incorporated into an epoxy resin to form
hybrid composites. The total thermal contact resistance (TCR) between the heated and cooled surfaces
as well as its components such as the bulk resistance (RBLT) of the TIM, and the boundary resistance
(RB) between the TIM and the joint surfaces above and below the TIM of the composites are measured.
The inuence of the compound in different proportions of MWCNTs and nano-copper particles on RBLT
and RB is discussed in detail. The results indicate that the total TCR is related not only to the thermal conductivity of the TIM, but also to the other factors such as the property of the ller, the microstructural
characterization, and the surface morphology of the TIM.
2013 Elsevier Ltd. All rights reserved.
1. Introduction
High-performance thermal interface materials (TIMs) are in urgent needs to suppress the thermal contact resistance (TCR) between solidsolid contact interfaces for efcient thermal
management in a variety of applications. The commonly-used TIMs
such as thermal conductive grease and thermal pads, which uses
silica as ller, may not meet the requirements of high power density electronic performance due to low thermal conductivities both
of mineral oil or silicone and silica (mineral oil 0.13 W/m K, silicone 0.18 W/m K and silica 1.314 W/m K) [1]. Because of their
superior thermal, mechanical and electrical properties and excellent process capabilities, the epoxy resins have been widely used
as the matrix material in electronics industry [2]. Therefore, current investigation efforts focus on improving the thermal conductivity of the epoxy composites by incorporating with some new
reinforced solid ller of high intrinsic thermal conductivity [3],
including carbon nanotubes (CNTs) [4], CNTs array [5], graphene
[6,7], carbon ber [8], graphite [9,10] and diamond [11], etc. With
respect to the fact that the thermal conductivity of single multiwalled carbon nanotube (MWCNT) reaches to 1000 W/m K or even
higher [3,12], MWCNTs have been widely applied to be incorporated into the epoxy resin to improve the thermal conductivity of
the composites. For example, Yang et al. doped 30 vol% MWCNT
SiC hybrid ller into epoxy resin and the thermal conductivity of
epoxy composite reached about 2 W/m K [13]. Thostenson et al.
Corresponding author. Tel.: +86 025 84315837.
E-mail address: ymxuan@mail.njust.edu.cn (Y. Xuan).
1359-835X/$ - see front matter 2013 Elsevier Ltd. All rights reserved.
http://dx.doi.org/10.1016/j.compositesa.2013.10.022
doped 5 wt% MWCNTs into epoxy resin and the thermal conductivity increases 60% over that of the unreinforced epoxy [14]. Cui et al.
have fabricated an epoxy/MWCNT@SiO2 composite and the
thermal conductivity increases by 67% [15]. However, there is little
report on the quantitative study about doping of MWCNTs,
nano-copper particles and their hybrid composites into epoxy
resins to minimize the total TCR [1,16].
The total TCR at the interface after inserting a TIM between the
rough solid surfaces has two components, i.e., the bulk resistance
(RBLT) of the TIM arising from its thermal conductivity and the
boundary resistance (RB) between the TIM and the joint surfaces
above and below TIM [17,18], as shown in Fig. 1. The effectiveness
of a TIM is enhanced by high thermal conductivity and low BLT and
low RB [19]. Although RBLT can be decreased by increasing the thermal conductivity of TIMs, it is still unclear whether RB is decreased
by improving the thermal conductivity of TIMs for the total TCR.
The inuencing factors on RB are complicated, which include not
only the thermal conductivity of TIMs, but also the surface morphology, the hardness of the contact substrates, applied pressure,
the viscosity, and the uidity of the TIMs [18,19]. Therefore, by setting the same contact substrates, the applied pressure and the
bond line thickness, one can study whether RB can be decreased
by improving the thermal conductivity and changing the viscosity
of TIMs.
In this paper, we dope nano-copper particles and MWCNTs into
an epoxy in different proportions to enhance the effective heat
transfer of the epoxy. A high-precision TCR testing system, a steady-state method similar to ASTM D5470, is established to measure
RB. The thermal conductivities, the viscosity and the total TCR of
2.3. Characterization
the compound TIMs with the different doping proportions of nanocopper particles and MWCNTs are measured. With the TCR testing
system and the in situ measurement, RBLT and RB of the epoxy resin
composites which are doped with MWCNTs, with copper nanoparticles, and with both two composites are also studied.
2. Experimental
2.1. Materials
Raw MWCNT (r-MWNCT; purity > 98%) with the outer diameter
of 3050 nm, the inner diameter of 710 nm and length between
510 lm is supplied by Suzhou Creative-carbon Nanotechnology
Co. Ltd. (China). They are produced by the chemical vapor deposition method. The epoxy resin used is diglycidyl ether of bisphenol
A- based E-51 epoxy and provided by Hangzhou Resin Factory Co.
(China). An imidazole type curing agent of low molecular weight
polyamide 650 is also purchased from Hangzhou Resin Factory
Co. (China). Copper nano-particles (purity > 99.99%) with an particle diameter range of 200 nm1 lm are supplied by Suzhou Canfuo
Nanotech Co. Ltd. (China). All other chemical reagents are of analytical grade available from Shanghai Reagents Co. (China) and
used as-received without further purication.
Fig. 2. The measuring principle of TCR after the insertion of a TIM. (For interpretation of the references to colour in this gure legend, the reader is referred to the web version
of this article.)
Table 1
Uncertainty in measured quantities.
Measured quantity
Uncertainty
Temperature
Temperature sensor location
Force
Meter-bar area
TIM thickness
0.003 K
5 lm
0.2% of rated load
0.05%
0.5 lm
s
Pn h @z i2
di
.
1 @xi
keff km
1 AB/
;
1 uB/
where
kp =km 1
kp =km A
and u 1
1 /max /
/2max
keff km
kp 2km 2/km kp
;
kp 2km /km kp
keff
/p kc =km
1
3 p 2aK kc
km
dkm
Fig. 4. RBLT and RB1 + RB2 of the epoxy composites lled with different nano-copper
proportions in weight at 1 MPa pressure loading (the BLT is about 6 lm). (For
interpretation of the references to colour in this gure legend, the reader is referred
to the web version of this article.)
Fig. 5. ESEM micrograph of the epoxy composites containing 5 wt% MWCNTs (a), 10 wt% MWCNTs (b), 15 wt% MWCNTs (c). (d) FE-SEM micrograph of the epoxy composites
containing 25 wt% MWCNTs.
Fig. 6. (a) Thermal conductivity and viscosity of MWCNT/epoxy composite at room temperature. (b) The two components of the MWCNT/epoxy composite TCR at room
temperature (the BLT is about 6 lm). (For interpretation of the references to colour in this gure legend, the reader is referred to the web version of this article.)
eff
a eff
1 fc kCNT =km =3 2fcu 0:001 kcu =km =3
k
km
1 2f c fcu =3
eff
kCNT
2RK
eff
kcu
2RK
kCNT
CNT kCNT =lc 1
kcu
k
cu cu =dcu 1
where k is the resultant effective thermal conductivity of the composites, subscripts CNT, cu, and eff represent the CNT, nano-copper,
Fig. 7. (a) Surface SEM micrographs of the matrix composite lled with 0.1 wt% MWCNTs. (b) Surface SEM micrographs of the matrix composite lled with 10 wt% MWCNTs.
(c) Surface SEM micrographs of the matrix composite lled with 2.5 wt% MWCNTs. (d) The partial magnication of the read areas of (c). (For interpretation of the references to
colour in this gure legend, the reader is referred to the web version of this article.)
Fig. 8. Thermal conductivity and viscosity of MWCNT/nano-copper/epoxy composite at room temperature (nano-copper/epoxy composite matrix material lled
with 40 wt% nano-copper particles). (For interpretation of the references to colour
in this gure legend, the reader is referred to the web version of this article.)
Fig. 9. (a) FE-SEM micrograph of the epoxy composite containing 15 wt% MWCNTs + 34 wt% nano-copper. (b) The partial magnication of the red areas of (a). Note that
MWCNTs (solid arrows) are agglomerating adjacent nano-copper (dotted arrows), the blue areas are glomeration. (c and d) FE-SEM micrograph of the epoxy composite
containing 20 wt% MWCNTs + 34 wt% nano-copper. (For interpretation of the references to colour in this gure legend, the reader is referred to the web version of this article.)
Fig. 10. RBLT and RB1 + RB2 of the nano-copper/epoxy resin composites lled with
different MWCNT proportions in weight at 1 MPa pressure loading (the BLT is about
5 lm). (For interpretation of the references to colour in this gure legend, the
reader is referred to the web version of this article.)
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