High-Speed

Photonics
Interconnects

Devices, Circuits, and Systems

Series Editor
Krzysztof Iniewski
CMOS Emerging Technologies Inc., Vancouver, British Columbia, Canada

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PUBLISHED TITLES:
Atomic Nanoscale Technology in the Nuclear Industry
Taeho Woo
Biological and Medical Sensor Technologies
Krzysztof Iniewski
Electrical Solitons: Theory, Design, and Applications
David Ricketts and Donhee Ham
Electronics for Radiation Detection
Krzysztof Iniewski
Graphene, Carbon Nanotubes, and Nanostuctures:
Techniques and Applications
James E. Morris and Krzysztof Iniewski
High-Speed Photonics Interconnects
Lukas Chrostowski and Krzysztof Iniewski
Integrated Microsystems: Electronics, Photonics, and Biotechnology
Krzysztof Iniewski
Internet Networks: Wired, Wireless, and Optical Technologies
Krzysztof Iniewski
Low Power Emerging Wireless Technologies
Lukas Chrostowski and Krzysztof Iniewski
MEMS: Packaging and Technology
Lukas Chrostowski and Krzysztof Iniewski
Nano-Semiconductors: Devices and Technology
Krzysztof Iniewski
Optical, Acoustic, Magnetic, and Mechanical Sensor Technologies
Krzysztof Iniewski
Radiation Effects in Semiconductors
Krzysztof Iniewski
Semiconductor Radiation Detection Systems
Krzysztof Iniewski
Smart Sensors for Industrial Applications
Krzysztof Iniewski
Telecommunication Networks
Eugenio Iannone

FORTHCOMING TITLES:
Novel Advances in Microsystems Technologies and Their Applications
Laurent A. Francis and Krzysztof Iniewski
Nanoelectronic Device Applications Handbook
James E. Morris and Krzysztof Iniewski

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Nanoscale Semiconductor Memories: Technology and Applications

Santosh K. Kurinec and Krzysztof Iniewski
Radio Frequency Integrated Circuit Design
Sebastian Magierowski
Nanoelectronics: Devices, Circuits, and Systems
Nikos Konofaos
Medical Imaging: Technology and Applications
Troy Farncombe and Krzysztof Iniewski
Wireless Sensors Technologies
Ioanis Nikolaidis and Krzysztof Iniewski
Energy Harvesting with Functional Materials and Microsystems
Madhu Bhaskaran, Sharath Sriram, and Krzysztof Iniewski
Nanoplasmonics: Advanced Device Applications
James W. M. Chon and Krzysztof Iniewski
CMOS: Front-End Electronics for Radiation Sensors
Angelo Rivetti
Embedded and Networking Systems: Design, Software, and Implementation
Gul N. Khan and Krzysztof Iniewski
MIMO and Multi-User Power Line Communications
Lars Torsten Berger

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High-Speed
Photonics
Interconnects
EDITED BY

Lukas Chrostowski
Krzysztof Iniewski

Boca Raton London New York

CRC Press is an imprint of the

Taylor & Francis Group, an informa business

K15063.fm Page 1 Wednesday, September 25, 2013 12:17 PM

CRC Press
Taylor & Francis Group
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Boca Raton, FL 33487-2742

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2013 by Taylor & Francis Group, LLC

CRC Press is an imprint of Taylor & Francis Group, an Informa business
Cover: The figure on the cover is adapted from W. Hofmann, P. Moser, P. Wolf, G. Larisch, W. Unrau and D.
Bimberg, 2012, 980-nm VCSELs for optical interconnects at bandwidths beyond 40 Gb/s, Proc. SPIE, vol. 8276,
827605.
No claim to original U.S. Government work. Printed on acid-free paper
International Standard Book Number-13: 978-1-4665-1603-8 (Hardback)
Version Date: 20130204
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Library of Congress Cataloging-in-Publication Data

High-speed photonics interconnects / editors, Lukas Chrostowski, Krzysztof Iniewski.
pages cm. (Devices, circuits, and systems)
Includes bibliographical references and index.
ISBN 1-4665-1603-8 (hardback)
1. Interconnects (Integrated circuit technology). 2. Optical interconnects. 3. Photonics. I.
Chrostowski, Lukas.
TK7874.53.H54 2013
621.365dc23
2012050914

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Contents

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Preface.......................................................................................................................ix
Editors........................................................................................................................xi
Contributors............................................................................................................ xiii
Chapter 1 Energy-Efficient Photonic Interconnects for Computing Platforms......... 1
Odile Liboiron-Ladouceur, NicolaAndriolli, IsabellaCerutti,
PieroCastoldi,and Pier Giorgio Raponi
Chapter 2 Low-Loss, High-Performance Chip-to-Chip Electrical
Connectivity Using Air-Clad Copper Interconnects........................... 27
Rohit Sharma, Rajarshi Saha, and Paul A. Kohl
Chapter 3 Silicon Photonic Bragg Gratings......................................................... 51
Xu Wang, Wei Shi, and Lukas Chrostwoski
Chapter 4 Lasers for Optical Interconnects......................................................... 85
Brian Koch
Chapter 5 Vertical-Cavity Surface-Emitting Lasers for Interconnects............. 111
Werner H. E. Hofmann
Chapter 6 High-Speed Photodiodes and Laser PowerConverters
fortheApplications of Green Optical Interconnect.......................... 131
Jin-Wei Shi
Chapter 7 Quantum-Dot Nanophotonics for Photodetection............................. 157
Ludan Huang and Lih Y. Lin
Chapter 8 Rolled-Up Semiconductor Tube Optical Cavities............................. 183
Pablo Bianucci, M. Hadi Tavakoli Dastjerdi, Mehrdad Djavid,
and Zetian Mi
Index....................................................................................................................... 201

vii

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Preface
Dramatic increases in processing power, fueled by a combination of integrated c ircuit
scaling and shifts in computer architectures from single-core to future m
any-core
systems, has rapidly scaled on-chip aggregate bandwidths into the Tb/s range,
necessitating a corresponding increase in the amount of data communicated between
chips to not limit overall system performance. The two conventional methods to
increase interchip communication bandwidth include raising both the per-channel
data rate and the I/O number. This book discusses these challenges associated with
scaling I/O data rates and current design techniques. It describes the major highspeed components, channel properties, and performance metrics.
Increasing interchip communication bandwidth demand has motivated investigation into using optical interconnect architectures over channel limited electrical
counterparts. Optical interconnects with negligible frequency-dependent loss and
high bandwidth provide viable alternatives to achieving dramatic power efficiency
improvements at per-channel data rates exceeding 10 Gb/s. This has motivated
extensive research into optical interconnect technologies suitable for high density
integration with CMOS chips. This book details how optical interchip communication links have the potential to fully leverage increased data rates provided through
CMOS technology scaling at suitable power efficiency levels.
Lukas Chrostowski
UBC
Kris Iniewski
CMOS ET

ix

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Editors
Lukas Chrostowski, Ph.D., is an associate professor in the Electrical and Computer
Engineering Department at the University of British Columbia (Vancouver) (www.
ece.ubc.ca). Born in Poland, Dr. Chrostowski earned a B.Eng. in electrical engineering from McGill University (Montreal, Canada) and a Ph.D. in electrical engineering and computer science from the University of California at Berkeley. With
current research interests in silicon photonics, optoelectronics, high-speed verticalcavity surface emitting lasers (VCSELs) design, fabrication and testing, optical
communication systems, and biophotonics, he has published more than 100journal
and conference publications. Dr. Chrostowski has been serving since 2008 as the
codirector of the University of British Columbia AMPEL Nanofabrication Facility.
He spent his 20112012 sabbatical at the University of Washington, Seattle, with
Professor Michael Hochberg and the Institute for Photonic Integration/OpSIS
foundry service. Dr. Chrostowski is the Program Director of the NSERC CREATE
Silicon ElectronicPhotonic Integrated Circuits (Si-EPIC) training program (www.
siepic.ubc.ca).
Krzysztof (Kris) Iniewski, Ph.D., is managing R&D at Redlen TechnologiesInc.,
astart-up company in Vancouver, Canada. Redlens revolutionary production process
for advanced semiconductor materials enables a new generation of more a ccurate,
all-digital, radiation-based imaging solutions. Dr. Iniewski is also a President of
CMOS Emerging Technologies (www.cmoset.com), an organization of high-tech
events covering communications, microsystems, optoelectronics, and sensors. During
his career, he has held numerous faculty and management positions at the University
of Toronto, University of Alberta, SFU, and PMC-Sierra Inc. He has published over
100 research papers in international journals and conferences. Dr. Iniewski holds
18international patents granted in the United States, Canada, France, Germany, and
Japan. He is a frequently invited speaker and has consulted for multiple organizations internationally. Dr. Iniewski has written and edited several books for Wiley,
IEEE Press, CRC Press, McGraw-Hill, Artech House, and Springer. His personal
goal is to contribute to healthy living and sustainability through innovative engineering solutions. In his leisure time he can be found hiking, sailing, skiing, or biking in
beautiful British Columbia. He can be reached at kris.iniewski@gmail.com.

xi

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Contributors
Nicola Andriolli
Institute of Communication, Information
and Perception Technologies (TeCIP)
Scuola Superiore SantAnna
Pisa, Italy
Pablo Bianucci
Department of Physics
Concordia University
Montreal, Quebec, Canada
Piero Castoldi
Institute of Communication, Information
and Perception Technologies (TeCIP)
Scuola Superiore SantAnna
Pisa, Italy
Isabella Cerutti
Institute of Communication,
Information and Perception
Technologies (TeCIP)
Scuola Superiore SantAnna
Pisa, Italy
M. Hadi Tavakoli Dastjerdi
Department of Electrical and
ComputerEngineering
McGill University
Montreal, Quebec, Canada
Mehrdad Djavid
Department of Electrical and
ComputerEngineering
McGill University
Montreal, Quebec, Canada
Werner H. E. Hofmann
Institute of Solid State Physics and
Center of Nanophotonics
Technical University of Berlin
Berlin, Germany

Ludan Huang
Department of Physics and
Departmentof Electrical
Engineering
University of Washington
Seattle, Washington
Brian Koch
Aurrion Inc.
Goleta, California
Paul Kohl
Interconnect Focus Center
Georgia Institute of Technology
Atlanta, Georgia
Odile Liboiron-Ladouceur
Department of Computer and
ElectricalEngineering
McGill University
Montreal, Quebec, Canada
Lih Y. Lin
Department of Physics and
Departmentof Electrical Engineering
University of Washington
Seattle, Washington
Zetian Mi
Department of Electrical and
ComputerEngineering
McGill University
Montreal, Quebec, Canada
Pier Giorgio Raponi
Institute of Communication,
Information and Perception
Technologies (TeCIP)
Scuola Superiore SantAnna
Pisa, Italy
xiii

xiv

Rajarshi Saha
Interconnect Focus Center
Georgia Institute of Technology
Atlanta, Georgia

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Rohit Sharma
Department of Electrical Engineering
Indian Institute of Technology Ropar
Rupnagar, India
Wei Shi
Department of Electrical and
ComputerEngineering
University of British Columbia
Vancouver, British Columbia, Canada

Contributors

Xu Wang
Department of Electrical and
ComputerEngineering
University of British Columbia
Vancouver, British Columbia, Canada
Jin-Wei Shi
Department of Electrical Engineering
National Central University
Jhongli City, Taiwan