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Description
Package Types
DFN-8, PDIP-8, SOIC-8
2
3
4
8
7
6
5
FAULT/TXE
VBB
LBUS
VSS
14
13
VREG
TXD
NC
4
5
6
7
MCP202X
RXD
CS/LWAKE
RESET
NC
MCP202X
RXD
CS/LWAKE
VREG
TXD
12
11
10
9
8
FAULT/TXE
VBB
LBUS
VSS
NC
NC
NC
DS22018D-page 1
MCP202X
Block Diagram
Short Circuit
Protection
Thermal
Protection
RESET
Voltage
Regulator
VREG
Internal Circuits
VBB
Ratiometric
Reference
Wake-Up
Logic and
Power Control
RXD
~30 k
CS/LWAKE
TXD
LBUS
OC
FAULT/TXE
VSS
Thermal
Protection
DS22018D-page 2
Short Circuit
Protection
MCP202X
1.0
DEVICE OVERVIEW
1.2
1.2.1
1.2.2
1.1
1.1.1
Internal Protection
ESD PROTECTION
The LIN Bus specification states that the LIN pin must
transition to the recessive state when ground is
disconnected. Therefore, a loss of ground effectively
forces the LIN line to a hi-impedance level.
1.2.3
THERMAL PROTECTION
FIGURE 1-1:
1.1.2
TRANSIENT VOLTAGE
PROTECTION (LOAD DUMP)
THERMAL SHUTDOWN
STATE DIAGRAMS
LIN bus
shorted
to VBB
Output
Overload
Voltage
Regulator
Shutdown
Operation
Mode
Transmitter
Shutdown
EQUATION 1-1:
RTP <= (VBBmin - 5.5) / 250 mA.
5.5V = VUVLO + 1.0V,
250 mA is the peak current at power-on when
VBB = 5.5V
DS22018D-page 3
MCP202X
1.3
Modes of Operation
1.3.1
POWER-ON-RESET MODE
Upon application of VBB, the device enters Power-OnReset mode (POR). During this mode, the part
maintains the digital section in a reset mode and waits
until the voltage on pin VBB rises above the ON
threshold (Typ. 5.75V) to enter to the Ready mode. If
during the operation, the voltage on pin VBB falls below
the OFF threshold (Typ. 4.25V), the part comes back
to the Power-On-Reset mode.
1.3.2
POWER-DOWN MODE
1.3.4
OPERATION MODE
1.3.5
1.3.5.1
Wake-up
FIGURE 1-2:
CS/LWAKE
= false
Power-down
Mode
1.3.3
READY MODE
OPERATIONAL MODES
STATE DIAGRAMS
Transmitter
Off
Mode
Bus Activity
OR
CS/LWAKE = true
CS/LWAKE
= false
Operation
Mode
Ready
Mode
VBBOK = true
FAULT/TXE
= false
FAULT/TXE = true
VREGOK = true
AND
CS/LWAKE = true
POR
Start
Note:
DS22018D-page 4
MCP202X
TABLE 1-1:
Receiver
Voltage
Regulator
POR
OFF
OFF
OFF
READY
OFF
Activity
Detect
ON
OPERATION
ON
ON
ON
POWERDOWN
OFF
Activity
Detect
OFF
TRANSMITTEROFF
OFF
ON
ON
State
1.4
Operation
Comments
Low Power
mode
Typical Applications
EXAMPLE 1-1:
+12
RTP(5)
WAKE-UP
43V(5)
CG
220 k
VDD
VREG
TXD
TXD
CF
VBB
1 k
RXD
RXD
I/O
CS/LWAKE
(3)
LIN Bus
LBUS
27V
(4)
FAULT/TXE
I/O
100nF
VSS
Note 1: CG is the load capacitor should be ceramic or tantalum rated for extended temperatures, 1.0-22 F
with ESR 0.4 - 5..
2: CF is the filter capacitor for the external voltage supply.
3: This diode is only needed if CS/LWAKE is connected to 12V supply.
4: Transient suppressor diode. Vclamp L = 43V.
5: These components are required for additional load dump protection above 43V..
DS22018D-page 5
MCP202X
FIGURE 1-3:
1 k
VBB
LIN bus
MCP202X
LIN bus
MCP202X
Slave 1
C
LIN bus
MCP202X
LIN bus
MCP202X
Slave 2
C
Slave n <16
C
Master
C
DS22018D-page 6
MCP202X
1.5
Pin Descriptions
TABLE 1-1:
PINOUT DESCRIPTIONS
Devices
Function
Pin
Name
8-Pin
DFN,
PDIP,
SOIC
14-Pin
PDIP,
SOIC,
TSSOP
Pin
Type
VREG
Power Output
VSS
11
Ground
VBB
13
Battery Supply
TXD
RXD
LBUS
12
I/O
CS/LWAKE
TTL
FAULT/TXE
14
OD
RESET
OD
Normal Operation
Legend: TTL = TTL input buffer, ST = Schmitt Trigger input buffer, OD = Open-Drain output,
P = Power, O = Output, I = Input
1.5.1
1.5.2
GROUND (VSS)
Ground pin.
1.5.3
BATTERY (VBB)
1.5.4
1.5.5
1.5.6
LIN BUS
1.5.7
CS/LWAKE
DS22018D-page 7
MCP202X
1.5.8
FAULT/TXE
pull-up
resistor
of
TABLE 1-2:
TXD
In
RXD
Out
LINBUS
I/O
Thermal
Override
VBB
Definition
External
Input
Driven
Output
OFF
VBB
OFF
OK
GND
OFF
OK
GND
OFF
VBB
ON
VBB
1.5.9
RESET
DS22018D-page 8
MCP202X
1.6
1.6.1
When the input voltage (VBB) drops below the differential needed to provide stable regulation, the output
VREG) will track the input down to approximately
+4.25V. The regulator will turn off the output at this
point. This will allow PIC microcontrollers, with
internal POR circuits, to generate a clean arming of the
Power-on Reset trip point. The regulator output will
stay off until VBB is above +5.75 VDC.
In the start phase, the device must see at least 6.0V to
initiate operation during power up. In the Power-down
mode, the VBB monitor will be turned off.
Note:
FIGURE 1-4:
Pass
Element
VREG
VBB
Sampling
Network
Fast
Transient
Loop
Buffer
VSS
VREF
DS22018D-page 9
MCP202X
1.6.2
3.3V REGULATOR
Note:
FIGURE 1-5:
t
VREG
V
5.0
3.5
3
t
(1)
Note 1:
2:
3:
4:
DS22018D-page 10
(2)
(3)
MCP202X
FIGURE 1-6:
t
VREG
V
5
4
3.5
3
t
(1)
Note 1:
2:
3:
4:
DS22018D-page 11
MCP202X
FIGURE 1-7:
50
t
VREG
V
5.0
3.5
3
t
(1)
Note 1:
2:
1.7
(2)
ICSP Considerations
DS22018D-page 12
MCP202X
2.0
ELECTRICAL CHARACTERISTICS
2.1
DS22018D-page 13
MCP202X
2.2
DC Specifications
DC Specifications
Electrical Characteristics:
Unless otherwise indicated, all limits are specified for:
VBB = 6.0V to 18.0V
TA = -40C to +125C
CLOADREG = 10 F
Parameter
Sym
IBBQ
Min.
Typ.
Max.
Units
Conditions
115
210
IOUT = 0 mA,
LBUS recessive
120
215
VOUT = 3.3V
90
190
Power
VBB Transmitter-off
Current
IBBTO
95
210
VOUT = 3.3V
IBBPD
16
26
IBBNOGND
-1
mA
VIH
2.0 or
(0.25VREG
+0.8)
VREG
+0.3
VIL
-0.3
0.15 VREG
IIH
-2.5
IIL
-10
IPUTXD
-3.0
VIH
0.7VREG
VBB
Through a current-limiting
resistor
VIL
-0.3
0.3VREG
IIH
7.0
IIL
3.0
IPDCS
6.0
Pull-down Current on
Input (CS/LWAKE)
Note 1:
2:
3:
Internal current limited. 2.0 ms maximum recovery time (RLBUS = 0, TX = 0.4 VREG, VLBUS = VBB).
For design guidance only, not tested.
Node has to sustain the current that can flow under this condition; bus must be operational under this
condition.
DS22018D-page 14
MCP202X
2.2
DC Specifications (Continued)
DC Specifications
Electrical Characteristics:
Unless otherwise indicated, all limits are specified for:
VBB = 6.0V to 18.0V
TA = -40C to +125C
CLOADREG = 10 F
Parameter
Sym
Min.
Typ.
Max.
Units
VIH(LBUS)
0.6 VBB
VIL(LBUS)
-8
Conditions
18
Recessive state
0.4 VBB
Dominant state
VIH(LBUS) - VIL(LBUS)
Bus Interface
VHYS
0.175 VBB
Input Hysteresis
IOL(LBUS)
40
200
mA
IPU(LBUS)
180
ISC
50
200
mA
(Note 1)
VOH(LBUS)
0.8 VBB
VBB
VOLLO
(LBUS)
0.2 VBB
IBUS_PAS_DOM
-1
mA
Driver off,
VBUS = 0V,
VBAT = 12V
Leakage Current
(disconnected from
ground)
IBUS_NO_GND
-1
+1
mA
GNDDEVICE = VBAT,
0V < VBUS < 18V,
VBAT = 12V
Leakage Current
(disconnected from VBAT)
IBUS
100
VBAT = GND,
0 < VBUS < 18V,
(Note 3)
VBUS_CNT
0.475 VBB
0.5
VBB
0.525 VBB
Rslave
20
30
47
Slave Termination
Note 1:
2:
3:
Internal current limited. 2.0 ms maximum recovery time (RLBUS = 0, TX = 0.4 VREG, VLBUS = VBB).
For design guidance only, not tested.
Node has to sustain the current that can flow under this condition; bus must be operational under this
condition.
DS22018D-page 15
MCP202X
2.2
DC Specification (Continued)
Electrical Characteristics:
Unless otherwise indicated, all limits are specified for:
VBB = 6.0V to 18.0V
TA = -40C to +125C
CLOADREG = 10 F
DC Specifications
Parameter
Sym
Min.
Typ.
Max.
Units
Conditions
VOUT
4.85
5.00
5.15
VOUT2
10
50
mV
IVRQ
25
PSRR
50
dB
eN
100
Shutdown Voltage
VSD
3.5
4.0
VBB
6.0
18.0
VOFF
4.0
4.5
VON
5.5
6.0
Load Regulation
Quiescent Current
Note 1:
2:
3:
VRMS 10 Hz 40 MHz
CFILTER = 10 f,
CBP = 0.1 f, CLOAD 10 f,
ILOAD = 50 mA
See Figure 1-5
Internal current limited. 2.0 ms maximum recovery time (RLBUS = 0, TX = 0.4 VREG, VLBUS = VBB).
For design guidance only, not tested.
Node has to sustain the current that can flow under this condition; bus must be operational under this
condition.
FIGURE 2-1:
12V DFN
50
12V SOIC
18V DFN
40
18V SOIC
30
20
10
-40
-34
-28
-22
-16
-10
-4
2
8
14
20
26
32
38
44
50
56
62
68
74
80
86
92
98
104
110
116
122
Temperature (C)
DS22018D-page 16
MCP202X
2.2
DC Specification (Continued)
Electrical Characteristics:
Unless otherwise indicated, all limits are specified for:
VBB = 6.0V to 18.0V
TA = -40C to +125C
CLOADREG = 10 F
DC Specifications
Parameter
Sym
Min.
Typ.
Max.
Units
Conditions
Output Voltage
VOUT
3.20
3.30
3.40
Line Regulation
VOUT1
10
50
mV
IOUT = 1 mA,
6.0V < VBB < 18V
Load Regulation
VOUT2
10
50
mV
Quiescent Current
IVRQ
25
PSRR
50
dB
eN
100
Shutdown Voltage
VSD
2.5
2.7
VBB
6.0
18.0
VOFF
4.0
4.5
VON
5.5
6.0
Note 1:
2:
3:
VRMS 10 Hz 40 MHz
/Hz CFILTER = 10 f, CBP =
0.1 f CLOAD = 10 f,
ILOAD = 50 mA
See Figure 1-5
Internal current limited. 2.0 ms maximum recovery time (RLBUS = 0, TX = 0.4 VREG, VLBUS = VBB).
For design guidance only, not tested.
Node has to sustain the current that can flow under this condition; bus must be operational under this
condition.
FIGURE 2-2:
60
12V DFN
50
12V SOIC
18V DFN
40
18V SOIC
30
20
10
-40
-34
-28
-22
-16
-10
-4
2
8
14
20
26
32
38
44
50
56
62
68
74
80
86
92
98
104
110
116
122
Temperature (C)
DS22018D-page 17
MCP202X
2.3
AC Specification
AC CHARACTERISTICS
Parameter
Min.
Typ.
Max.
Units
Test Conditions
tSLOPE
3.5
22.5
Propagation Delay of
Transmitter
tTRANSPD
4.0
Propagation Delay of
Receiver
tRECPD
6.0
Symmetry of Propagation
Delay of Receiver rising
edge w.r.t. falling edge
tRECSYM
-2.0
2.0
Symmetry of Propagation
Delay of Transmitter rising
edge w.r.t. falling edge
tTRANSSYM
-2.0
2.0
tFAULT
32.5
39.6
%tBIT
CBUS;RBUS conditions:
1 nF; 1 k | 6.8 nF; 660 |
10 nF; 500
THREC(MAX) = 0.744 x VBB,
THDOM(MAX) = 0.581 x VBB,
VBB =7.0V - 18V; tBIT = 50 s.
D1 = tBUS_REC(MIN) / 2 x tBIT)
58.1
%tBIT
CBUS;RBUS conditions:
1 nF; 1 k | 6.8 nF; 660 |
10 nF; 500
THREC(MAX) = 0.284 x VBB,
THDOM(MAX) = 0.422 x VBB,
VBB =7.6V - 18V; tBIT = 50 s.
D2 = tBUS_REC(MAX) / 2 x tBIT)
40.1
%tBIT
CBUS;RBUS conditions:
1 nF; 1 k | 6.8 nF; 660 |
10 nF; 500
THREC(MAX) = 0.778 x VBB,
THDOM(MAX) = 0.616 x VBB,
VBB =7.0V - 18V; tBIT = 96 s.
D3 = tBUS_REC(MIN) / 2 x tBIT)
56.6
%tBIT
CBUS;RBUS conditions:
1 nF; 1 k | 6.8 nF; 660 |
10 nF; 500
THREC(MAX) = 0.251 x VBB,
THDOM(MAX) = 0.389 x VBB,
VBB =7.6V - 18V; tBIT = 96 s.
D4 = tBUS_REC(MAX) / 2 x tBIT)
DS22018D-page 18
MCP202X
AC CHARACTERISTICS
Parameter
Sym
Min.
Typ.
Max.
Units
Test Conditions
tBDB
10
20
tBACTVE
100
250
500
tVEVR
1200
(Note 1)
tCSOR
500
(Note 1)
tCSPD
80
tSHUTDOWN
20
100
tRPU
10.0
tRPD
10.0
Voltage Regulator
Bus Activity Debounce time
Bus Activity to Voltage
Regulator Enabled
Note 1:
2.4
Thermal Specifications
THERMAL CHARACTERISTICS
Parameter
Symbol
Typ
Max
Units
Recovery Temperature
RECOVERY
+140
Shutdown Temperature
SHUTDOWN
+150
tTHERM
1.5
5.0
ms
JA
35.7
C/W
JA
89.3
C/W
JA
149.5
C/W
JA
70
C/W
JA
95.3
C/W
JA
100
C/W
Test Conditions
Note 1:
The maximum power dissipation is a function of TJMAX, JA and ambient temperature TA. The maximum
allowable power dissipation at an ambient temperature is PD = (TJMAX - TA) JA. If this dissipation is
exceeded, the die temperature will rise above 150C and the MCP2021 will go into thermal shutdown.
DS22018D-page 19
MCP202X
2.5
FIGURE 2-3:
50%
LBUS
.95VLBUS
.50VBB
.0++++++++++++++++++++++++---5V
0.0V
TTRANSPDR
TTRANSPDF
TRECPDF
TRECPDR
RXD
50%
Internal TXD/RXD
Compare
Match
50%
Match
Match
Match
Match
FAULT Sampling
TFAULT
TFAULT
FAULT/TXE Output
FIGURE 2-4:
Stable
Hold
Value
Stable
Hold
Value
Stable
CS/LWAKE
TCSOR
VREG
VOUT
TCSPD
DS22018D-page 20
MCP202X
FIGURE 2-5:
TVEVR
LBUS
.4VBB
TBDB + TBACTVE
VREG
VOUT
FIGURE 2-6:
6.0V
5.0V
VBB
5.0V
4.0V
3.5V
VREG
TRPD
TRPD
RESET
TRPU
TRPU
DS22018D-page 21
MCP202X
FIGURE 2-7:
CS/LWAKE
TCSOR
VREG
VOUT
TRPU
TCSPD
RESET
FIGURE 2-8:
0.2
Ibbq mA
0.15
0.1
Vbb = 6V
Vbb = 7.3V
0.05
Vbb = 12V
Vbb = 14.4V
Vbb = 18V
0
-40C
25C
85C
125C
Temperature (C)
DS22018D-page 22
MCP202X
TYPICAL IBBTO VS TEMPERATURE
mA
FIGURE 2-9:
0.18
0.16
0.14
0.12
0.1
0.08
0.06
0.04
0.02
0
-40C
Vbb = 6V
Vbb = 7.3V
Vbb = 12V
Vbb = 14.4V
Vbb = 18V
25C
85C
125C
Temperature (C)
FIGURE 2-10:
0.025
Ipd (mA)
0.02
0.015
0.01
Vbb = 6V
Vbb = 7.3V
Vbb = 12V
0.005
Vbb = 14.4V
Vbb = 18V
0
-40C
25C
85C
125C
Temperature (C)
DS22018D-page 23
MCP202X
NOTES:
DS22018D-page 24
MCP202X
3.0
PACKAGING INFORMATION
3.1
202150
e3
E/MD^^
0733
256
e3
*
Note:
Example:
2021500
e3
E/P^^256
0729
XXXXXXXX
XXXXXNNN
YYWW
Legend: XX...X
Y
YY
WW
NNN
Example:
2021500
e3
E/MF^^
0733
256
XXXXXXXX
XXXXYYWW
NNN
Example:
Example:
2021500E
e3
SN^^0729
256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week 01)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
DS22018D-page 25
MCP202X
3.1
Example:
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
YYWWNNN
MCP2022-500
e3
E/P^^
0729256
Example:
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
XXXXXXXX
YYWW
NNN
Legend: XX...X
Y
YY
WW
NNN
e3
Note:
DS22018D-page 26
MCP2022-500
E/SL^^
e3
0729256
Example
2022500E
0729
256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week 01)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
MCP202X
8-Lead Plastic Dual Flat, No Lead Package (MD) 4x4x0.9 mm Body [DFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
L
E2
K
EXPOSED
PAD
2
1
NOTE 1
NOTE 1
D2
TOP VIEW
BOTTOM VIEW
A3
A
A1
NOTE 2
Units
Dimension Limits
Number of Pins
MILLIMETERS
MIN
NOM
MAX
Pitch
Overall Height
0.80
0.80 BSC
0.90
1.00
Standoff
A1
0.00
0.02
0.05
Contact Thickness
A3
0.20 REF
Overall Length
E2
Overall Width
D2
0.00
3.00
3.60
0.25
0.30
0.35
Contact Length
0.30
0.55
0.65
Contact-to-Exposed Pad
0.20
Contact Width
4.00 BSC
0.00
2.20
2.80
4.00 BSC
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-131C
DS22018D-page 27
MCP202X
D
%
!"#$
!" #$ %!&!!
'#(
$
)**%%%
*#
DS22018D-page 28
MCP202X
8-Lead Plastic Dual Flat, No Lead Package (MF) 6x5 mm Body [DFN-S]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
b
N
N
K
E
E2
EXPOSED PAD
NOTE 1
NOTE 1
D2
BOTTOM VIEW
TOP VIEW
A3
A1
NOTE 2
Units
Dimension Limits
Number of Pins
MILLIMETERS
MIN
NOM
MAX
Pitch
Overall Height
0.80
1.27 BSC
0.85
1.00
Standoff
A1
0.00
0.01
0.05
Contact Thickness
A3
0.20 REF
Overall Length
5.00 BSC
Overall Width
D2
3.90
4.00
4.10
E2
2.20
2.30
2.40
6.00 BSC
Contact Width
0.35
0.40
0.48
Contact Length
0.50
0.60
0.75
Contact-to-Exposed Pad
K
0.20
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
DS22018D-page 29
MCP202X
%
!" #$ %!&!!
'#(
$
)**%%%
*#
DS22018D-page 30
MCP202X
8-Lead Plastic Dual In-Line (P) 300 mil Body [PDIP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
E1
2
D
A2
A1
e
eB
b1
b
Units
Dimension Limits
Number of Pins
INCHES
MIN
NOM
MAX
Pitch
.210
A2
.115
.130
.195
A1
.015
.290
.310
.325
E1
.240
.250
.280
Overall Length
.348
.365
.400
.115
.130
.150
Lead Thickness
.008
.010
.015
b1
.040
.060
.070
.014
.018
.022
eB
.100 BSC
.430
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-018B
DS22018D-page 31
MCP202X
8-Lead Plastic Small Outline (SN) Narrow, 3.90 mm Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
e
N
E
E1
NOTE 1
1
b
h
A2
A1
L1
Units
Dimension Limits
Number of Pins
MILLIMETERS
MIN
NOM
MAX
Pitch
Overall Height
1.27 BSC
A2
1.25
Standoff
A1
0.10
0.25
Overall Width
E1
3.90 BSC
Overall Length
4.90 BSC
1.75
6.00 BSC
Chamfer (optional)
0.25
0.50
Foot Length
0.40
1.27
Footprint
L1
1.04 REF
Foot Angle
Lead Thickness
0.17
0.25
Lead Width
0.31
0.51
15
15
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-057B
DS22018D-page 32
MCP202X
&
'
(&))*+
%
!"#&',-$
!" #$ %!&!!
'#(
$
)**%%%
*#
DS22018D-page 33
MCP202X
14-Lead Plastic Dual In-Line (P) 300 mil Body [PDIP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
E1
D
E
A2
L
A1
b1
b
eB
Units
Dimension Limits
Number of Pins
INCHES
MIN
NOM
MAX
14
Pitch
.210
A2
.115
.130
.195
A1
.015
.290
.310
.325
E1
.240
.250
.280
Overall Length
.735
.750
.775
.115
.130
.150
Lead Thickness
.008
.010
.015
b1
.045
.060
.070
.014
.018
.022
eB
.100 BSC
.430
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-005B
DS22018D-page 34
MCP202X
14-Lead Plastic Small Outline (SL) Narrow, 3.90 mm Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
1
e
h
A2
A1
L1
Units
Dimension Limits
Number of Pins
MILLIMETERS
MIN
NOM
MAX
14
Pitch
Overall Height
1.27 BSC
A2
1.25
Standoff
A1
0.10
0.25
Overall Width
E1
3.90 BSC
Overall Length
8.65 BSC
1.75
6.00 BSC
Chamfer (optional)
0.25
0.50
Foot Length
0.40
1.27
Footprint
L1
1.04 REF
Foot Angle
Lead Thickness
0.17
0.25
Lead Width
0.31
0.51
15
15
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-065B
DS22018D-page 35
MCP202X
%
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'#(
$
)**%%%
*#
DS22018D-page 36
MCP202X
14-Lead Plastic Thin Shrink Small Outline (ST) 4.4 mm Body [TSSOP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
1 2
e
b
c
A2
A1
Units
Dimension Limits
Number of Pins
L1
MILLIMETERS
MIN
NOM
MAX
14
Pitch
Overall Height
0.65 BSC
A2
0.80
1.00
1.05
Standoff
A1
0.05
0.15
1.20
Overall Width
E1
4.30
6.40 BSC
4.40
4.90
5.00
5.10
Foot Length
0.45
0.60
0.75
Footprint
L1
4.50
1.00 REF
Foot Angle
Lead Thickness
0.09
0.20
Lead Width
b
0.19
0.30
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-087B
DS22018D-page 37
MCP202X
NOTES:
DS22018D-page 38
MCP202X
APPENDIX A:
REVISION HISTORY
5.
DS22018D-page 39
MCP202X
NOTES:
DS22018D-page 40
MCP202X
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
/XX
Temperature
Range
Device:
Package
Temperature Range:
= -40C to +125C
Package:
MD
MF
P
SN
SL
ST
=
=
=
=
=
=
Examples:
a)
b)
c)
d)
e)
f)
g)
h)
i)
a)
b)
c)
d)
e)
f)
g)
MCP2021-330E/SN:
MCP2021-330E/P:
MCP2021-500E/MF:
MCP2021-500E/SN:
MCP2021-500E/MD:
MCP2021-330E/P:
MCP2021T-330E/SN:
MCP2022-330E/SN:
MCP2022-330E/P:
MCP2022-500E/SN:
MCP2022-500E/P:
MCP2022T-330E/SN:
DS22018D-page 41
MCP202X
NOTES:
DS22018D-page 42
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchips Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as unbreakable.
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchips code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PRO MATE, rfPIC and SmartShunt are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
FilterLab, Linear Active Thermistor, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, In-Circuit Serial
Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM,
PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo,
PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total
Endurance, UNI/O, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
2008, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
DS22018D-page 43
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
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Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
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Web Address:
www.microchip.com
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01/02/08
DS22018D-page 44