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TXP

Hardware Course
TXP-HW

For Software Releases 7. 5 and Later


January, 2003

Siemens Westinghouse Power Corporation

TXP-HW Course

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Content:
Process control system
TXP
Hardware Configuration/
Maintenance Course

Course Code:

System Architecture

OM 650 /Exercise 1

AS 620B /Exercise 2

AS 620T / Exercise 3

SIMATIC H1 Plant Bus /Exercise 4&5

Ethernet Terminal Bus /Exercise 6

Reading I&C Drawings

Loading Procedures / Exercise 7

Preventative Maintenance /Exercise 8

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Troubleshooting /Exercise 9

11

Glossary of Terms

Since the equipment explained in this manual has a variety of uses, the user and those
responsible for applying this equipment must satisfy themselves as to the acceptability of
each application and use of the equipment. Under no circumstances will Siemens
Westinghouse Power Corporation be responsible or liable for any damage, including
indirect or consequential losses resulting from the use, misuse, or application of this
equipment.
The text, illustrations, charts and examples included in this manual are intended solely to
explain the use and application of the TXP control system. Due to the many variables
associated with specific use or applications, Siemens Westinghouse Power Corporation
cannot assume responsibility or liability for actual use based upon the data provided in
this manual.
No patent liability is assumed by Siemens Westinghouse Power Corporation with
respect to the use of circuits, information, equipment, or software described in this
manual.
No part of this manual may be reproduced, stored in a retrieval system, or transmitted in
any form or by any means, including electronic, mechanical, photocopying or otherwise,
without the prior express written permission of Siemens Westinghouse Power
Corporation.
This document is the property of and contains Proprietary Information owned by
Siemens Westinghouse Power Corporation and/or its subcontractors and suppliers. It is
transmitted in confidence and trust, and the user agrees to treat this document in strict
accordance with the terms and conditions of the agreement under which it was provided.
This manual is printed in the USA and is subject to change without notice.

Siemens Westinghouse Power Corporation


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System Architecture

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System Architecture
TXP Overview
The TXP process control system provides all I&C facilities that are necessary for
automating, handling, monitoring, and archiving processes specifically for power
plants.

The tasks of the TXP process control system are distributed to different
subsystems:
q

OM 650
Operating and Monitoring system. This is the process control and
information system for operator-process communication and
visualization.

AS 620
Automation System. This is the system used for process
automation.

ES 680
Engineering System. This system is employed for configuration and
commissioning.

SINEC H1
SIEMENS Network Communication. Communication system.

DS 670
Diagnostic System. Optional component for detailed system
diagnostics.

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OT1

OT2

OT3

OT4

OT5

Terminal bus

DS

PU1

PU2

SU

ES

Plant bus

AS1

AS2

AS3

AS4

OM 650 process control and information system


The OM 650 process control and information system is the interface between the
system and the operator in the control room. This window to the process enables
the process to be centrally monitored and controlled. In addition, the system
provides all functions that are required for logging the process and for archiving
the data.
AS 620 Automation System Overview
The AS 620 subsystem performs the automation tasks of the industrial
processes. The AS 620 acquires measured values and states from the process,
performs open and closed-loop control functions, and transfers the resulting
manipulated variable values, correction values, and commands to the process.
The other subsystems employ the AS 620 subsystem as the interface to the
process. The AS 620 transfers the commands from the OM 650 operator
communication and visualization system to the process, reads information from
the process that is required by OM 650, ES 680, or the DS 670 diagnostic
system and transfers this information to the upstream operator communication
and visualization level.
According to the different requirements that result from industrial measurement
and control activities safety relevant tasks (such as boiler protection), and highspeed control tasks (at the turbine unit for example), various variants of the AS
620 automation system are available.

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AS 620 B
Basic system for general automation tasks, system and unit protection, closedloop control.
Central structure or distributed arrangement using buses are both possible.
FUM B variant: In a central structure, FUM modules (function modules) are used
for connecting the sensors and actuators of the process.
SIM B variant: SIM modules (signal modules) enable a distributed structure to
be set up (locally, in vicinity to the process). A bus connects the SIM modules
with the central system components.
AS 620 F
Fail-safe for protection and control tasks that require TV approval (e.g. burner
control).
Single and fault-tolerant structures are both possible, including the variants with
the fail-safe automation processor (APF) and the fail-safe programmable
controller (AGF).
FUM F variant: Configuration with the fail-safe APF automation processor and
the related FUM F modules (fail-safe function modules).
SIM F variant: Configuration with the AGF programmable logic controller. This
variant employs the SIMATIC S5 95 F programmable logic controller with SIM F
modules.
AS 620 T
Turbine controller and other high-speed control tasks at the turbine unit.
Auxiliaries connection
Signal exchange with SIMATIC S5 units or other manufacturers components,
such as, Allen-Bradley PLCs for example. The SIMATIC units contain the
implementation of a complete automation task that is not configured via ES 680.
Combinations:
Combining two or more system variants is possible. The components of the
different variants must then be connected to the same component of the AP
automation processor. Any combination of the above mentioned system variants
is possible, except mixing FUM F and SIM F (AGF) components at the same
automation processor.

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ES 680 engineering system
The ES 680 engineering system is the central configuration system of TXP. ES
680 is used for configuring the AS 620 automation system, the OM 650 process
control and information system, the SINEC H1 FO bus system, and the
necessary hardware. ES 680 provides a configuration package for each target
system. ES 680 centrally administers all configuration data, which means data is
entered only once.
The configuration of the AS functions and processing functions in OM 650 are
based on control system flow charts. A control system flowchart editor in the ES
680 permits interactive entry of these control system flow charts.
The configuration principle of the ES 680 is based on consistent forward
configuration. Initial configuration and modifications are exclusively performed
through the configuration system with subsequent automatic code generation.
This guarantees real time documentation of the system hardware and all AS,
OM, and SINEC functions, and permits modifications to be centrally controlled.
SINEC H1 bus system
The network structure of the SINEC H1 bus system enables communication
between the individual sub-systems of TXP. The bus system complies with
international standards and consequently offers the prerequisites of open
communication.
DS 670 diagnostic system
The optional DS 670 diagnostic system is the tool that is used for monitoring and
detecting malfunctions in the I&C components of TXP.
In the event of a malfunction, the DS 670 swiftly points the user to the source of
the fault and informs about the cause and possible elimination of the fault.

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OM 650 & Exercise 1

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OM 650
The OM 650 sub-system is made up of all or some combination thereof of the
following components:
PU
SU
OT
CU

Processing Unit
Server Unit
Operating Terminal
Compact Unit

All of these components are made up of Pentium II computers running SCO


UNIX and for the OT and CU components a graphics server is needed if more
than 1 monitor is desired. Otherwise, an integrated graphics card for connecting
a single monitor can be used instead of the graphics server. The following
connectable devices are also available:
MOD
Magnetic Optical Disk
DAT
Digital Audio Tape
MMT
MultiMedia-Terminal
Monitor
Large-area display
Printer
Keyboard
Mouse
UNIX Computer
The UNIX computer accommodates the main memory, disk drives and modules
required for operating the particular OM component, and is optionally equipped
with an installed MOD (for SU and CU only) for the external storage of archived
data. An external MOD can also be connected, which allows reading in older
archived data from MOD storage media.
To bridge brief supply voltage failures and properly organize automatic shutdown
in the event of long-term supply voltage failure, the UNIX computer is supplied
with voltage via a UPS and informed of the mains voltage failure via a serial port.

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The following devices can be connected to the UNIX computer:

Up to two printers or one printer and one plotter


Up to two audible alarms and keys for acknowledgment of the audible alarm

With an integrated graphics card the following devices can be connected to the
UNIX computer:

1 monitor
1 keyboard
1 mouse

For servicing purposes the following devices can be connected (does not apply
to variants with an integrated graphics card):

1 monitor and
1 keyboard

An external DAT streamer can be connected for loading and saving the system
software.
Figure 1 shows the rear panel of the UNIX computer with a listing of the
individual connection ports. Figure 2 lists component specific interface
assignments of the UNIX computer.

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Fig.1: Generally applicable interface assignment of the UNIX computer

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Component specific slot assignment

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Explanations
Explanations of the component texts:
1k
4k
nMT
red
ME

Single-channel option with graphics


4-channel option
Single- to 4-channel option with graphics server
Redundant option
OM/ME system

Explanation of the slot assignment nomenclature:


2940
U2W
3COM
Combo
(BNC)

CP 1413
No. 1
CP 1413
No 2
Radio clock
Audible alarm 1
Audible alarm 2
Intel
Combo
(AUI)

Adaptec 2940 U2W, SCSI--3--Controller Ultrawide


Etherlink XL PCI 3C900--Combo (3COM), LAN card
Connector to the mMT graphics server, Licensing of the ES
functionality e.g. for CU/ME and CUES Redundancy coupling
for CU (substitute for terminal bus); Substitute for plant/ terminal
bus if not present
CP 1413 for connection to the plant bus
Second CP 1413 for connection to the plant bus
radio clock module (Hopf)
1st signal module
2nd signal module
Intel-Ether Express-Pro/10+ Combo PCI (Intel 10 MB), LAN
card
for connection to the terminal bus

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N-AT
NAT module for connection to the CS275 bus
Chase Research For connecting the capacitive 21 touchscreen monitors Ilyama
PCI--Fast 4
S10M/MT via Micro Touch Controller SMT3V, (stock no. 14-701),
(RJ45)
RS 232 port with 9--pin connection and Siemens label. To be
used with release version 7 or higher.
(1)
If the plug--in slot in all PU/OT--OMME systems of a plant is
used by audible alarm 1, the radio clock must be inserted into
the SU--OM/ME slot.

MultiMedia-Terminal
The MULTIMEDIA-TERMINAL MMT-X was designed to control large, modular
OVERVIEW display walls. Its multi-screen capability allows you to control
displays of nearly any size and layout. The display area is one logically
connected display. It is able to digitally control monitors based on modern
technologies such as Single LCD, DLP and Poly-Silicon LCD with the highest
display quality. High contrast and absolute immunity to electromagnetic
interference distinguishes this type of control. CRT monitors and projectors can
also be controlled by the MULTIMEDIA-TERMINAL MMT-X using the optional
analog output.
The hardware and software of the MULTIMEDIA-TERMINAL MMT-X is based on
world-wide accepted standards, so that the investment is protected. The
MULTIMEDIA-TERMINAL MMT-X offers the following exceptional capabilities:

High performance graphics output using the most modern processor and
chip technologies
Supports current LAN and WAN interfaces
Graphic and video outputs in high color quality
Video in a window, up and down scaleable
Unlimited, overlapping and freely moveable video and graphics windows

The graphics server is used for multi--channel mode as an extension of the OT


and CU, PU/ OT. It is suitable for the connection of 1 to 4 monitors, 1 to 4 largearea display units or a 2x2 display wall.
The mMT--X is available with a video card for the connection of a display wall or
large--area display units as an option. The video input card allows you to connect
a video source such as a video recorder, camera, etc. to the graphics server. It
supports the recording standards S--Video (S--VHS, Y/ C) and Composite (VHS,
FBAS, CVBS, Y). The video card has three 4--pin female Mini--DIN connectors
for the connection of up to three S--Video or 6 Composite video sources.

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Fig.3: Interface assignment of the mMT-X for large-area display units or a display wall

Fig.4: Monitor port assignment of the mMT-X


8

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Programming Device PG 740PII

Fig.5: Interface assignment of the PG 740PII

The PG740PII programmer is the hardware basis for the CT675 hand-held
operating device.

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The Cable Connectors Used
The following cables are used for the OM components:

Data cable (for connecting the graphics server to the UNIX computer)
Monitor cable for the graphics server
Monitor cable for the UNIX computer (for servicing purposes only)
Monitor cable for the UNIX computer if a graphics card is used, single-channel operation
AUI connection cable (3Com (network card) or CP1413)
NAT cable
Antenna cable (coax) for the radio clock card
Parallel printer cable
Serial printer cable
Mouse and keyboard cable extension for the graphics server
UPS data cable (black)
UPS power cable

Connection between the Mouse and Keyboard and the UNIX Computer
(Single Channel)

10

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Monitor Connection with a Single-Channel Graphics Card

Connection between Printer and the Parallel Port of the PC

Connection between Printer and the Serial Port of the PC

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Connection between the Mouse and Keyboard and the mMT-X

Connection of 4 Monitors to a 4-channel mMT-X

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Connection between the PC and the Terminal Bus

Connection between the PC and the Plant Bus

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Connection between the Graphics Server and the PC using a thin Ethernet
(coaxial) cable.

14

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Connection of the External DAT-Streamer to the PC
Caution
When connecting the external DAT-Streamer or the external MO drive to the PC
or WS both devices must be switched off. Otherwise the devices might be
damaged and their functionality would no longer be ensured.

Note: The SCSI address of the DAT streamer needs to be set to SCSI id 2

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Automatic Restart after Power Outage


In case of a mains voltage failure, the PC and the graphics server, if applicable,
are powered by the connected UPS. If the supply voltage does not return within
2 minutes the UPS will initiate a PC shutdown (approx. 3 minutes). During the
shutdown the mouse and keyboard are inoperable.
There are 2 status conditions possible during shutdown:
If the voltage returns during shutdown, the PC automatically starts up after
completion of the shutdown.
If the voltage does not return during shutdown the component is switched off
by the UPS, i.e. the UPS battery is no longer discharged.
After return of the voltage, the OM component (PC and graphics server)
automatically restarts. After the completion of the restart, the basic startup
display appears on each screen of the graphics server. The mouse and
keyboard are again inoperable.

Primergy 170

16

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Sinec Pro M7

Primergy 351/752

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Test/Exercise 1
G

What are the 4 sub-systems of TXP?

2
G

What is the name of the communications system that ties them together?

How many variants of the AS 620 system exist, and what are their different
uses?

What I/O modules are used for a central configuration of AS 620?

What I/O modules are used for a distributed configuration of AS 620?

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G

What are the 3 different types of OM 650 components?

What one component combines all OM 650 components?

What operating system runs on OM 650 computers?

Look at the back of your OM 650 computer and identify the following
components:
G
G
G
G
G

Keyboard and Mouse ports


SCSI bus connector
Video card
Graphics server communications card (if applicable)
Plant bus card (CP 1413)

What device(s) is (are) connected to the SCSI bus connector?

What is the MMT used for?

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G

What kind of cable is used to connect the MultiMedia-Terminal to the UNIX


computer?

What kind of cable(s) is (are) used to connect the UNIX computer to the Plant
Bus?

What is the primary use of the DAT streamer?

What is the MOD drive used for?

In a 4-channel MultiMedia-Terminal configuration, which CRT port is the leftmost monitor connected to?

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AS 620B & Exercise 2

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AS 620B Automation System
Automation Processor (AP)
The AP is the central component of the AS 620 B and AS 620 F automation
systems. It is based on the SIMATIC S5 CPU 948R. All subordinate AS 620
components are linked with the plant bus (and thus with the OM 650 system) via
the AP.
System and unit protection functions are processed in the AP. In addition to the
base operations, a large spectrum of power plant related open and closed-loop
control blocks are available for this purpose. The user employs these blocks on
the graphical ES 680 tool to create the user program that executes in the AP.
The AS 620 T employs a special automation processor, the APT (SIMADYN D),
to solve high-speed control tasks at the turbine unit. The APT communicates with
the TXP systems on the OM 650 level via an AP.
The AP also plays an important role in the connection of auxiliaries
(programmable logic controllers). These PLC systems also always communicate
via an AP with the OM 650 level.
The hardware of the automation processor is based on a SIMATIC S5 155U
central controller (CC). Figure 1 shows the basic structure and a possible slot
allocation of the central unit used as an AP. The slot numbers appear on the
annotation strip of the central unit rack. The actual installation of interface
modules and communications processors in the individual slots depends on the
plant-related structure and on the variant of the automation system.

Figure 1: Standard slot assignment of the AP


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003 011 019 027 035 043 051 059 067 075 083 091 099 107 115 123 131 139 147 155 163
Power supply
CPU 948R
IM304/324R

IM304
IM611/651
IM308
CP1430
CP5431
CP530
CP581
DEDA

* IM304 is only allowed in this slot as EG connection to the IM314R


Figure 1.1: Possible module installations when used as an AP

CPU 948R
The CPU 948R and 948RL can be used in S5-135U/155H central controllers and
is available in the following versions:
CPU version
CPU 948RL
CPU 948R-1
CPU 948R-2

Internal user memory (RAM)


128 Kbyte
640 Kbyte
1664 Kbyte

All three versions of the CPU 948 are programmed in STEP 5 (LAD, CSF, STL,
SCL) and process all STEP 5 operations at a very high speed. They are also
equipped with a high-speed floating-point arithmetic facility.
The following program processing levels are possible:
Cyclic
Time-controlled (9 different time grids, clock-controlled, delayed interrupt)
Interrupt-driven over the S5 bus
Soft STOP

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The CPU 948s electronics, including RAM, are on two PCBs (Printed Circuit
Boards), have Eurocard format, and are bolted to one another. They must never
be separated.
The modules front plate has a width of 2 2/3 standard slots, or 40 mm and takes
up two slots in the central controller rack. Figure 2 shows the front panel layout of
the CPU 948:

Fig. 2: Front panel indicators of CPU 948

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Principle of Operation
In a redundant system, identical user programs run in both sub-units. The subunits are event-synchronized; that is, only those events that could produce
different internal states in the two controllers cause them to be synchronized.
The internal state is determined by the states of the memory areas used, such
as process image, flags, counters, timers, and data blocks.
On startup or restart, the S5-155H assumes one of the operating states shown
below:
Solo mode:
The master sub-unit alone scans the user program and controls the
process; the standby sub-unit is inactive.
Activating the standby:
The master sub-unit passes the current data to the standby.
Error search mode:
The master sub-unit scans the user program and controls the process; the
standby sub-unit executes the self-test.
Redundant mode:
The master sub-unit controls the process; the standby sub-unit runs in
parallel (updated mode), and is ready to take over at any time.
After both sub-units have been started up, they are synchronized to ensure a
bump-less transfer in the event of a fault. The synchronization procedure used in
the S5-155H is known as event-driven synchronization, which means that the
sub-units are synchronized whenever an event occurs which could result in the
two sub-units having different internal states; for example different process
images, flags, timers or communications data. Synchronization is done at socalled synchronization points which are at the end of each ground cycle.
Each sub-unit reads its one-sided inputs (if applicable). The switched inputs are
read only by the master, who then updates the input image for both sub-units and
generates a unified input image.
At the end of each ground cycle, the entire process output image (PIQ) in both
CPU 948Rs is immediately compared by the IM 324R card. The PIQ (switched
PIQ by the master, one-sided PIQ by each processor) is output. The self-test is
then run.

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Following the self-test, the process image input (PII) is read in again. The PII is
exchanged and unified and the ground cycle is re-called.
In each sub-unit, a check is made at every synchronization point to make sure
the other sub-unit is functioning. Depending on the result of the check, a switch
over from the standby to the master controller is performed and the message
Standby failure output.
The synchronization procedure is timed at each synchronization point by means
of a watchdog timer set to 30 ms. A check is also made at each synchronization
point to make sure that both sub-units are executing the same statement
(comparison of OP codes). If they are not, the standby controller stops and a
synchronization error is reported.

Switchover from standby to master takes place in the following instances:


1. Failure of the master CC (BASP, NAU or STOP switch)
2. Initial error search of both sub-unit CPUs unsuccessful (see Error search
mode)
3. First failure of a master controllers IM 314R when the standby controller has
access to a larger number of IM 314R interface modules than the master
4. First failure of a master controllers I/O bus (i.e. a wire break) or failure of an
IM 304 when the standby controller has access to a larger number of IM 314R
interface modules than the master
5. First failure of a switched I/O module
In cases 3 to 5 the new standby CPU does not stop, but continues functioning as
a standby controller.
The functional sequence of a switchover from standby to master is as follows:
The standby controller checks the operational status of the master controller at
each synchronization point. Failure of a master is detected at the hardware level
by evaluating the S5 bus signals BASP and NAU in the IM 324R parallel
interface module. The standby CPUs operating system detects the failure of the
master controller at the next synchronization point, and branches to a routine
which executes the following functions:

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Switches over the I/O buses of all IM 314R modules


Switches all two-channel I/Os to single-channel operation
Switches the operating system to Solo mode; that is, no sub-unit
synchronization

With regards to the I/Os allocated to the failed sub-unit, the following occurs:

PIQ and PII are set to zero


No ADF error is reported when this PIQ/PII is accessed
Timeout is reported in the event of direct access to one of these I/Os

Self-Test Strategy
A redundant systems highest priority is fault detection and fault localization. This
is required in order to control the fault. The S5-155Hs self-test routines run in
both CPUs. They detect and localize hardware failures in a minimal amount of
time. To localize a fault, it is necessary to only find out which modules are faulty
and to replace them.
Which self-test routines execute depends on the operating status of the system:

Self-test in the Restart routine


The entire self-test is run when a central controller is restarted. If a fault is
detected at this stage, the CPU stops. Because the self-test takes longer
than one minute, it is skipped on a warm restart of the master controller.
During execution of the self-test in the Restart routine, the RUN and
STOP LEDs on the front plate show a steady light. A complete self-test is
run in all Restart modes.

Self-test in cyclic mode


Each time the ground cycle is processed (once per cycle), part of the selftest is executed in small slices (2 ms test slices). The self-test therefore
runs, transparent of the other software, or in the background, until a
hardware failure is detected.

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Tested System Components
Important system components such as CPU, memory, I/Os and communications
links are continually tested and monitored. Following is a brief description of each
of these tests:

CPU test
Includes testing of STEP 5 operations, timers, CMOS clock, interrupt
mask and the scan time monitor

Firmware/RAM test
Comparison of the RAM in both sub-units and a checksum test of the OB,
SB, PB, FB, FX blocks and of the constants DB/DX. Also a RAM test for
all variable DB/DX

I/O bus test with IM 314R


Tests for short-circuits and breaks in the 721 I/O bus cable to the IM 314R

I/O bus test for page addressing


Page addressing is tested in cyclic mode once in every complete test run
and also once on each restart. The test detects the following faults:
A CP/IP reacts to (acknowledges) not only its own interface
number, but also to the other 255 interface numbers
An acknowledgement is issued by an unassigned interface
number

IM 304R/IM 324R parallel interface test


The parallel interfaces dual-port RAM is tested on both sub-units A and
B to locate any short-circuits or cable/wire breaks

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Self-Test in Error Search Mode
When an error is detected which, because it was found during a RAM
comparison test, could not be allocated to a specific sub-unit, the standby
controller enters the Error Search mode. This mode is also entered when a
discrepancy is found when comparing the output images of the two sub-units. In
Error Search mode, the self-test is not executed in slices, but rather in its
entirety, which takes approximately 10 to 30 seconds. Following is an example to
illustrate the functional sequence in Error Search Mode:
At the end of each ground cycle the two sub-units exchange and compare the
entire process output image (PIQ). If a discrepancy is found during this cyclic
PIQ comparison test, the memory locations in the PIQ are tested for stuck at 0
and stuck at 1 errors. If such an error is found, only the malfunctioning sub-unit
stops.
If the error cannot be localized, the 155H responds by placing the standby
controller into the Error Search mode and putting master controller into Solo
mode.
If the self-test locates a fault in the standby controller, the standby stops.
Otherwise, the standby controller is activated and a standby-master switchover
initiated. The PLC now runs in Redundant mode. Should another comparison
error be found, the new standby controller enters the Error Search mode while
the new master continues in Solo mode.
If the self-test locates an error in the new standby controller, which is now in
Error Search mode, the standby controller stops and reports an error. If the selftest cannot locate an error in this sub-unit either, the sub-unit stops with a
Non-locatable error if the second comparison error occurred within the same
test cycle.

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Mode Selector Switch
The mode selector switch has two positions:
RUN
When the mode selector switch is set to RUN and the green LED is on, the CPU
is processing the user program.
STOP
The CPU goes to soft STOP when the user switches from
RUN to STOP. The red STOP LED goes on.

Reset Switch
The restart functions Overall reset, Cold restart and Cold restart with
memory can be initiated via the mode selector switch and the reset switch:
Function
OVERALL RESET

RESET (Cold restart)

Cold restart with memory

Switch position

Description

Down

An overall reset reinitializes


the internal RAM (meaning
any data currently in RAM are
erased and the contents of the
memory card, if any, are
copied to internal RAM). A
complete self-test is then
executed.
A cold restart, or RESET,
resets all flags, timers,
counters and the process
image. OB 20 is then called,
and user program processing
begins again.
User program processing
begins again, but all flags,
timers, counters and the
process image retain their
current states.

Up

Middle

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Status LEDs
The STOP LED signals a soft STOP, the SYS FAULT LED a hard
STOP. In soft STOP mode, the CPU can cyclically scan the user program but
the digital outputs remain disabled. In hard STOP mode, no program can run;
the CPU is at a standstill. This state can only be exited by cycling the power.
Overview of Status LEDs
LED
RUN

STOP

Mode

SYSFAULT

RUN or Restart mode


On

Off

Off

The CPU is in RUN mode and is master

Flashes

Off

Off

The CPU is in RUN mode and is the standby

On

Flashes

Off

The CPU is master; the parallel link has failed

On

On

On

Appears briefly when the controller is switched on

On

On

Off

The CPU executes the self-test on startup

Off

Off

Off

The CPU is in the RESTART mode or PROGRAM TEST

The CPU is in soft stop mode.


After cycling the power on when the mode selector switch is at STOP and no
errors occurred during initialization.
A restart is possible.
The CPU is in soft stop mode.
An Overall reset was requested via mode selector switch/reset switch or by the
operating system. A restart is possible only after performing an overall reset or
after eliminating the problem and then performing an overall reset.
The CPU is in soft stop mode.

An error was detected during cyclic program processing. The CPU is at


STOP because no appropriate error handling routine was programmed.
When the mode selector switch is moved from RUN to STOP, the LED will
once again show a steady light as long as the error does not re-occur.

When error conditions exist, for example, selection of an illegal Restart


mode.

When a STOP operation was encountered in the user program.

In the event of a PROGRAM TEST programmer function for this CPU.

Some programming errors and controller faults also set the ADF, QVZ,
or ZYK LEDs.

Soft STOP mode


Off

On

Off

Off

Flashes
at high
frequency
Flashes
at low
frequency

Off

Off

10

Off

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Hard STOP mode
Off

Off

On

Activate standby mode


Flashes

Flashes

Off

The CPU is in hard STOP mode.

When error free execution of the system program is no longer possible, the
CPU enters the hard STOP mode

Reasons for a hard STOP:

Timeout (QVZ) or parity error (PARE) in system RAM

ISTACK overflow

STEP 5 operation STW

A hard STOP can only be exited by cycling the power on the controller.
The CPU is the standby, and the mode is Activate standby.

Overview of Error LEDs


LED
QVZ
(timeout)

ADF
On
ZYK
On
BASP
On
INIT
On

Description
A module addressed by the program no longer acknowledges, although/because:

It either acknowledged in the process image on a CPU cold restart and was entered as
available

Or was entered in the address list and was recognized as being available on a cold restart

Or was addressed in direct access mode

Or no access is possible to the data handling blocks on the module.


Possible causes:

Module failure; failure of the expansion unit

Module was removed during operation, while the CPU was at STOP or when controller was
switched off and there was no subsequent cold restart

Failure of the enable voltage L+


A timeout occurred while user memory was being accessed
The user program referenced an address in the process image which was not entered in DX1
The watchdog timer used for scan time monitoring responded and cyclic program processing was
interrupted
Command output is disabled; the digital outputs are set directly to the safe state (0)
This LED briefly shows a steady light during the initialization procedure which follows POWER ON,
and during operation in the event of a system fault

Interface Error LEDs SI1 and SI2


LED SI2 is always off unless there is a CPU fault. LED SI1 will be ON if no
communication is possible which is an internal error. It will be OFF if both
interfaces are initialized and ready.

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Communications Processor (CP 1430)
The CP 1430 communications processor is used to connect the AP to the Plant
Bus and will be discussed in detail in the chapter on the SIMATIC H1 Plant Bus.
Interface Module IM 324R
The IM 324R interface module is used in conjunction with the IM 304 interface
module in the accompanying AP rack for redundancy. The figure below illustrates
how the redundancy link and the expansion unit are interconnected:

Fig. 3: Redundant AP > AP connection

The IM 324R module is inserted in the main central controller rack and
determines which controller is the master. See figure 1.1 above for slot
assignments for the IM 324R.
The IM 304 > IM 314R connections from master to expansion and standby to
expansion are used to access the I/O from the field. The IM308 modules connect
to the ET200 stations to establish this link to the field I/O.

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EG - A

EG - B

Figure 4 shows the basic structure and a possible slot allocation of the expansion
rack:
Fig. 4: EG 185 U expansion unit slot assignments

Fig. 4.1: Possible module installations when used as EG

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EU902 FUM Rack
The function modules (FUM) of the individual control level are installed in the
EU902 racks. Each rack can accommodate upto 19 function modules and upto 2
IM614 interface modules. To ensure high availability, each function module has
two bus interfaces that are independent of each other. Each bus interface is
connected with a separate IM614 interface module via a separate rack bus.
The EU902 rack with the function modules connects to the AP via the IM304 and
IM 614 interface modules. One IM614 module of the rack connects to AP (A),
and the second to AP(B). This produces a continuous redundant bus connection
from the AP down to the function modules.
While the IM614 interface module in slot 155 is connected with AP(A), the IM614
in slot 163 is connected with AP(B).
Upto 4 IM614 interface modules in series connection may be combined to form a
bus chain that is connected to the AP via an IM304 module. The maximum
distance between the AP and the last IM614 of the bus chain is 100 meters.
Typical EU902 Rack configuration:

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Below is a typical connection layout for the EU902 rack to the Basic Automation
Processor.

IM614 Interface module


The IM614 interface module is used in the As620 B automation processor for
connecting the function modules (FUMs) to the AP automation processor. The
interface module is installed in each EU902 rack, and handles the entire data
traffic with the function modules in the rack
Two IM614 interface modules may be installed in each EU902 rack. This
provides a consistant redundancy of the I/O bus, from the automation processor
down to the function modules.
The major functions of the IM614 and IM304 interface modules are coupling the
higher order level (AP) with the FUM racks (EU902).

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Figure below shows front view of IM614 Interface module

The Function Module (FUM) of the Individual Control Level


The function module (FUM) of the individual control level form the interface
between the process control system and the process. Functionality and
connections of the FUM modules have been designed such that they satisfy the
specific requirements of the power plant technology. The major tasks of the
function modules include:

Acquiring, conditioning, processing, distributing and monitoring signals and


sensor supply

Processing stand-alone automation tasks for individual closed- and open


loop control systems.

Time stamp of 1ms resolution

Monitoring function for simple and precise diagnosis in the event of failure.

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Each module has its own microprocessor, a module related power supply, and
two independent bus interfaces that connect to the redundant cabinet bus
system. The system automatically selects the second bus system when the first
one fails. The defective module may then be located and replaced during
operation.
The figure below shows the basic structure of such a FUM module:

The connections to the analog and binary sensors on field level, and to the power
section of switching and actuating elements (switchgear), are established via the
function related part.
If necessary, manual intervention from conventional control locations (CCR) may
be performed via modules of the individual control level. In this case the
information is output via conventional indicators and signaling fields.
Besides various monitoring and diagnosis functions, the individual control levels
also acquires signal transitions of binary and/or the change of analog signal by
selectable value. The system adds a time stamp of 1ms resolution, and handles
these events as data with time (DMZ).

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FUM 210
The FUM 210 may be used for sensor conditioning of binary signals or drive
control functions depending upon the configuration chosen. Below is a summary
of the functions of the FUM 210 module.
The FUM 210 is inserted into the EU902 rack and its inputs are wire rapped onto
the back of the module

Sensor conditioning for binary signals with FUM 210

Acquiring of 28 binary signals

Output of 24v DC / 120mA for sensor supply

Sensor monitoring for open circuit and short circuit to ground

Signal simulation with software

Redundant design is possible

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Drive control with FUM 210

Control of upto 8 individual drives, 5 motors/solenoid valves/switchgear, 4


servo drives, 3 reversing drives.

The module has the following functions, depending on the application,

Acquiring the drive check-back messages (travel limit and torque limit
switches).

Interpreting switchgear messages (undervoltage, switchgear fault, and motor


temp high).

Monitoring C&I functions (Module fault, run time faults).

Simulation via software

Redundant design possible

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The illustration below shows the front view of a FUM 210 module

The card has fuse access, identification label and an error indication lamp on the
front of the card. All the inputs are fed to the back of the module from wire rapped
terminals.

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Connecting the ET 200M stations


The ET 200M stations connect to the AP via the IM 308-C and IM 153 interface
modules. A SINEC L2-DP bus chain with up to thirty two (32) IM 153 (ET 200M
stations) modules may be connected to each IM 308 (bus master) in the central
unit (CU) or expansion unit (EU). Up to ten IM 308 modules (10 chains) may be
connected to each AP. The total number of ET 200M stations is limited to 32.
The following maximum distances to the AP may not be exceeded in a
distributed structure.

Maximum length of a chain (L2-DP bus length):


- With copper conductor at a baud rate of 1,500 bits/s 200 meters
- With glass optical leads 1,400 meters
There are 3 types of connections possible with ET200 stations:
Directly, un-switched
Here, the IM 308 interface modules are installed in the APs central
controller. If the AP fails, all chains directly connected to this AP including
the ET 200M stations concerned and the SIM modules installed there are
no longer available.
Switched
Here, the IM 308 modules are installed in the expansion unit of the
redundant AP. The chains are connected with the master AP. If the master
AP fails, the standby AP immediately takes over mastership, and the ET
200M chains communicate with the new master AP.
Redundant (beginning from release 6)
The IM 308-C interface modules are present once on each bus chain and
AP subsystem. The bus medium is redundant. The ET 200M stations have
2 bus medium connections. Unlike the switched option, the availability of
the redundant option will not be impaired if an IM 308-C or a bus medium
fails. A mixture of redundant and non-redundant bus chains in one AP is
possible.

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IM 308 > IM 153 Interface Modules
The IM 308 C interface modules are used as the bus master on the PROFIBUS
(a.k.a. L2 bus) to establish a link to the IM 153 modules of the ET 200M family of
I/O modules. The figure below illustrates a typical configuration followed by a
table of connecting cables:

See item number of connecting cable in Table 5.1

Fig. 5: Typical ET 200M configuration

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Item
No.
1
2
3

4
5

Connection IM <--> or bus


component
Connecting cable
IM 324R <----> IM 304
Connecting cable
IM 304 <----> IM 314R
SINEC L2--DP two--wire cable
IM 308--B/C <----> ET 200M/U/B
Connecting cable
IM 316 <----> IM 316
Glass optical lead
FIBER OPTIC CABLE standard cable,
can be subdivided, prefabricated with 4
BFOC connectors
CUPOFLEX twin cable PVC UL
3.6 mm BFOC
OLM/S4 for PROFIBUS
Optical Link Module with glass optical
lead, for standard length with signaling
contact, 4 channel version
OLM/P4 for PROFIBUS
Optical Link Module with plastic optical
lead, 4 channel version with signaling
contact including 4 BFOC connectors

Order No.

Application/Comment

6ES5 721--0xxx0 *)

Redundancy link
AP (A) <--> AP (B)
Link ZG <--> EG with
switched I/O
Cable without connectors
Bus connector

6ES5 721--0xxx0 *)
6XV1 830--0AH10
6ES7972--0BA20-0XA0
6DS5 712--8yy00
6XV1 820--5Bxxx *)

5DX8031--8AAxx *)

6GK1 502--4AB10

6GK1 502--4AA10

ET 200M tiers one below the


other in a multi--tier structure
Link of Optical Link Modules
(OLM) for the connection of
ET 200M stations
Link of Optical Link Modules
(OLM) for the connection of
ET 200M stations, maximum
length 65 m
Optical Link Modules (OLM)
for the connection of ET
200M via glass optical leads
Optical Link Modules (OLM)
for the connection of ET
200M via plastic optical
leads

Fig. 5.1: Connecting cables

Bus terminating connector for SINEC L2-DP


The L2 bus connector is used as a bus terminating connector. The bus
connectors at the IM 308 card and the last ET 200M station must have the
terminating resistor installed in order for the bus to function properly.
Basic Structure of the ET 200M Stations
The ET 200M distributed I/O device is a DP slave within the distributed I/O
system ET 200. For TXP, it consists of the following components:
q

Slave interface module IM 153

Up to 8 Signal modules (SIM)

Up to 124 bytes for outputs and 124 bytes for inputs


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Slave interface modules and signal modules are installed on a profile rail. If
active bus modules are used, the modules can be plugged in and removed
during online operation.
The IM 153 slave interface module connects the SIM modules to the PROFIBUS
and the automation processor. Up to 32 ET 200M stations can be connected to a
bus chain. If 2 IM 153 slave interface modules are used a redundant connection
to the Profibus is possible.

Fig. 6: ET 200M station

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The IM 153 module has a back plane connector for connecting active head
station bus modules (Figure 7), which hold the SIM I/O modules.

Fig. 7: Installing a SIM module on a bus module of an ET 200M station

Each ET 200M station can be equipped with SIM modules up to an addressing


volume of 124 input bytes and 124 output bytes.
Each chain permits up to thirty two ET 200M stations to be connected with two
wire cables via SINEC L2--DP in a daisy-chain fashion (see Fig. 8).

Fig. 8: Daisy-chain connection of ET 200M stations


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The Signal Modules (SIM)
The following modules from the SIMATIC S7 ET 200M distributed I/O system are
used in AS 620 B:

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Concise Description of the Signal Modules in ET200M
Input Modules for Binary Signals SIM 321
The following modules can be used:

To read in the binary signals, the function block FB70 (BINAUF) or FB72
(BINEIN) is called up in the AP for each channel. If form C contacts are
connected, the FB70 (BINAUF) is required in the AP for each form C contact
system. Each form C contact system occupies two input channels. The NO
contact is on the odd channel (e.g. K1, K3, ...). The channel no. of the form C
contact system is specified by the channel--no. of the odd channel (e.g. K1, K3,
...).
The modules can also be used for the DCM function blocks FB163
(MOTVENTR), FB164 (STELANTR) and FB165 (REGELANR).
No provisions have been made for the installation of AC 120V modules in TXP
cabinets.
The following connection diagrams of the digital input modules always refer to
individual contacts. The following figure shows the type of form C contact
circuitry.

28

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SIM 321-1BH01 Module, DI 16 * DC 24 V
Order No.: 6ES7 321 - 1BH01-0AA0
Features:
16 inputs, electrically isolated in groups of 8
Rated input voltage DC 24 V
Suited for switches and 2-/3-/4-wire proximity switches (BEROs)

Connections of the module SIM 321--1BH01, DI 16 * DC 24 V

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SIM 321-7BH00 Module, DI 16 * DC 24 V with Sensor Power Supply /
Diagnosis
Order No. 6ES7 321 - 7BH00--0AB0
Features:

16 inputs, electrically isolated in groups of 16

Rated input voltage DC 24 V

Suited for switches and 2-/3-/4-wire proximity switches (BEROs)

2 short--circuit proof sensor power supplies, each supplying 8 channels

External redundant feeding of the sensor power supply is optional

Status indicators Sensor voltage (Vs) O.K:

Common fault indicator (SF)

Settable input delays 0,1 / 0, 5 / 3 / 15 / 20 ms; presetting: 3ms

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Connections of the module SIM 321-7BH00, DI 16* DC24V with sensor power supply/diagnostics

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SIM 321-1EH01 Module, DI 16 * AC 120 V
Order No.: 6ES7 321 - 1EH01-0AA0
Features:

16 Inputs, electrically isolated in groups of 4

Rated input voltage AC 120 V

Suited for switches and 2-/3-/4-wire proximity switches

Connections of the module SIM 321--1EH01, DI 16 * AC 120 V

32

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SIM 321-1BL00 Module, DI 32 * DC 24 V
Order No.: 6ES7 321 - 1BL00-0AA0
Features:

32 inputs, electrically isolated in groups of 16

Rated input voltage DC 24 V

Suited for switches and 2- /3- /4-wire proximity switches (BEROs)

Connections of the module SIM 321-1BL00, DI 32 * DC 24 V

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Output Module for Binary Signals SIM 322
The following modules can be used:

The associated function blocks in the AP are: FB71 ( BINAUS ) per channel or
binary outputs for the FB163 (MOTVENTR) FB164 (STELANTR) and FB165
(REGELANR).
No provisions for the use of AC 230 V modules in TXP cabinets have been
made.

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SIM 322-1HF01 Module, DO 8 * Rel. AC 230 V
Order No.: 6ES7 322 - 1HF01-0AA0
Features:

8 outputs, electrically isolated in groups of 2

Load voltage DC 24 V to120 V, AC 48 V to 230 V

Suited for AC/DC solenoid valves, contactors, motor starters, low power
motors and alarm lamps

Connections of the module SIM 322-1HF01; DO 8 * REL. AC 230 V

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SIM 322-1BH01 Module, DO 16 * DC 24 V / 0,5 A
Order No.: 6ES7 322 - 1BH01-0AA0
Features:

16 outputs, electrically isolated in groups of 8

Output current 0.5 A

Rated load voltage DC 24 V

Suited for solenoid valves, DC contactors and alarm lamps

Connections of the SIM 322-1BH01 module

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SIM 322-1HH00 Module, DO 16 * Rel. AC 120 V
Order No.: 6ES7 322 - 1HH00-0AA0
Features:

16 outputs, electrically isolated in groups of 8

Load voltage DC 24 V to 120 V, AC 48 V to 120 V

Suited for AC/DC solenoid valves, contactors, motor starters, low power
motors and alarm lamps

Connections of the module SIM 322-1HH00; DO 16 * Rel. AC 120 V

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SIM 322-1BL00 Module, DO 32 * DC 24 V / 0,5 A
Order No.: 6ES7 322 - 1BL00-0AA0
Features:

32 outputs, electrically isolated in groups of 8

Output current 0,5 A

Rated load voltage DC 24 V

Suited for solenoid valves, DC contactors and alarm lamps

Connections of the module SIM 322-1BL00; DO 32 * DC 24 V / 0,5 A

38

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SIM 323-1BL00 Module, DI 16 / DO 16 * DC 24 V /0,5 A
Order No.: 6ES7 323 - 1BL00-0AA0
Features:

16 inputs, electrically isolated in groups of 16

16 outputs, electrically isolated in groups of 8

Rated input voltage DC 24 V

Load voltage DC 24 V

Suited for switches and 2- /3- /4-wire proximity switches (BEROs), solenoid
valves,

DC contactors and alarm lamps

This module is optionally used for the following functions:

To input 8 form C contacts or 16 single contacts each with contact supply

To input and output 16 each binary signals

To read in control commands and output lamp signals for desk tiles in
conventional control rooms and operator stations
Drive control module for 4 motors/solenoid valves (FB153) or 2 reversing
actuators (FB156)

The output channel with the same channel no. as the input channel for the form
C contacts is used for the contact supply of single contacts.
The function block FB70 is called up to read in input signals in the AP for each
system (contact supply and individual contact or contact supply and form C
contact).
You are free to mix form C and single contacts. Binary contacts which are not
used for the contact sup-ply can be used for signal output.

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Example of a circuit with single contacts with sensor power supply

Connections of the module SIM 323-1BL00; DI 16 / DO 16 input and output of binary signals

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Analog input module SIM 331

Associated function blocks in the AP:


FB73 (ANAEIN ), FB74 (ANAAUS ), FB76 (ANATHERM ) and FB77 (ANAWID ):
Input ranges:
0...20 mA
4...20 mA
+--20mA
Thermocouples type J,K
Resistance thermometer Pt100
Connecting Voltage and Current Sensors, Resistance-Type-Thermometers
and Thermocouples
The abbreviations and mnemonics used in Fig. 9 through Fig. 12 have the
following meanings:

IC + : Constant-current lead (positive)

IC - : Constant-current lead (negative)

M +: Measuring lead (positive)

M -: Measuring lead (negative)

COMP+ : Compensating terminal (positive)

COMP - : Compensating terminal (negative)

MANA : Reference potential of the analog measuring circuit

M : Ground terminal

L +: Terminal for 24 V DC supply voltage

To reduce electrical interference, you should use twisted-pair shielded cables for
the analog signals. The shield of the analog signal cables should be grounded at
both cable ends.

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Connecting Current Sensors as 2-Wire and 4-Wire Transducers
The 2-wire transducer receives its short-circuit-proof power supply via the analog
input. This transducer then converts the measured variable into a current. Fourwire transducers have separate power supplies.
Two-wire transducers must be isolated sensors.
Fig. 9 shows you how to connect current sensors as 2-wire transducers to an
isolated analog input module.

Fig. 9: Connecting 2-wire transducers to an isolated analog input module

Fig. 10 shows you how to connect current sensors as 4-wire transducers to an


isolated analog input module.

Fig. 10: Connecting 4-wire transducers to an isolated analog input module

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Fig. 11 shows you how to connect resistance-type thermometers to an isolated
analog input module.

3
Fig. 11: Connecting resistance-type thermometers to an isolated analog input module

Thermocouples
If you connect thermocouples direct to the inputs of the module or via
compensating leads, you can use internal temperature compensation. Each
channel group can use a thermocouple type supported by the analog module
independently of the other channel groups.

Fig. 12: Connection of thermocouples with internal compensation to an isolated analog input module

When you input signals from 4-wire transducers, thermocouples or resistance-type thermometers, the not used inputs of the respective channel group must be
short-circuited and connected to the MANA terminal. If not used, the Comp input
must be jumpered.
Not used analog inputs should be deactivated via parameterization. This
shortens the cycle time of the module.
2-wire transducers need the connection of MANA to M. Not used channels need
no connection because of the existing shunt to MANA.

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SIM 331-7KB01 Module, AI 2 * 12 bit
Order No.: 6ES7 331 - 7KB01-0AB0
Features:
2 inputs in a channel group
Measured value resolution (depending on the integration time selected)
9 bit + sign
12 bit + sign
14 bit + sign
Measurement type selectable for each channel group:
Current
Resistor
Temperature
Optional measurement range selection for each channel group

Electrically isolated from the CPU

Electrically isolated from the load voltage (not with 2--wire transducer)

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Connections of the module SIM 331-7KB01; AI 2 * 12 bit for process signals

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Connections of the module SIM 331-7KB01; AI 2 * 12 bit

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SIM 331-7KF01 Module, AI 8 * 12 bit
Order No.: 6ES7 331 - 7KF01-0AB0
Features:

8 inputs in 4 channel groups

Measured value resolution selectable for each group (depending on the


integration time selected)
9 bit + sign
12 bit + sign
14 bit + sign
Measurement type selectable for each channel group:
Current
Resistor
Temperature
Free selection of measurement range for each channel group

Electrically isolated from the CPU

Electrically isolated from the load voltage (not with 2-wire transducer)

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Connections of the module SIM 331-7KF01; AI 8 * 12 bit for current and voltage measurement

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Connections of the module SIM 331-7KF01; AI 8 * 12 bit for resistance thermometers

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SIM 331-7NF00 Module, AI 8 * 12 bit
Order No.: 6ES7 331 - 7NF00-0AB0
Features:

8 inputs in 4 channel groups

Measured value resolution selectable for each group (depending on the


integration time selected )

15 bit + sign

Measurement type selectable for each channel group:


Current

Electrically isolated from the CPU

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Connections of the module SIM 331-7NF00; AI 8 * 12 bit for resistance thermometers

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Analog Output Module SM 332, AO 4 * 12 Bit
Order No.: 6ES7 332 - 5HD01-0AB0
Features:

4 outputs in 4 channel groups

The outputs are selectable by channels as


Voltage output
Current output
Resolution 12

Electrically isolated from the CPU and load voltage

The associated FB in the AP is the FB75 (ANAAUS). The setting of the function
block parameter Analog input range is independent from the HW setting of the
SIM332 selected to 0...20mA.

Connections of the module SIM 332; AO 4 * 12 bit.

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Test/Exercise 2
G

During normal redundant operation (functioning master and standby) what is


the status of the CPU 948Rs RUN and STOP LEDs..
G

On the Master?

On the Standby?

What 2 Interface Modules are connected to make up the redundancy link


between the CPU 948Rs?

What Interface Module is used to connect the ET 200 stations?

What is the maximum number of IM 153 modules that can be connected to an


AP?

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G

What bus is used to connect the ET 200M stations to the TXP Automation
Processor?

What is the maximum number of input and output bytes per ET 200M station?

If a single IM 308C chain has 6 stations connected to it which L2 connectors


in the chain need to be terminated?

Draw a diagram of a redundant AS 620 B system depicting all Interface


Modules down to the ET 200M stations and all necessary connections

What are the 5 different uses of the SIM 323 module?

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G

What SIM module would be used to connect 8 24 VDC single contact inputs?

What SIM module would be used to connect 4 type K thermocouples?

Turn off the power to your AS 620 and remove the I/O cards from the ET 200
station

Remove and reinstall one of the bus units

Reassemble the ET 200 station observing the coding keys on the terminating
connectors

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G

Turn the power back on and observe the CPU 948 LEDs on startup
G

What sequence did the LEDs go through?

What is the status of the LEDs after complete startup?

What does this indicate?

Perform a Cold RESET on the CPU 948


G

How is this accomplished?

Is the user program running in the CPU afterwards?

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AS 620T & Exercise 3

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AS 620 T Hardware Overview


4

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Rack Layout

Either 12 or 24 slot racks (SR12 or SR24)


Power Supply w/back-up battery
Outputs for Power Supply OK & Fan OK
2 back plane buses: L and C
PM6/PM5 (Processor Module)
EM11 (I/O Board)
CS12 (Fiber Optic Coupling)
CS22 (Fiber Optic Coupling)
CS7
(Carrier Module)
SS52
(Interface Board)
CSH11 (Communication Board)

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L & C Bus
Features

The L bus (local bus) is dedicated to processor and I/O tasks


The C bus (communication bus) is dedicated to communications tasks

C bus connection
L bus connection

CS7 plug in for SSx cards


. Note: The CS7 has C
and L bus connection.

SS connection

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PM6 Processor

Central Processing Unit for general open and closed-loop control tasks with high computational
requirements
Features

8 on-board digital inputs


64/128 MHz, 32/64 bit RISC processor
8 Mbyte DRAM (16Mb version)
256 Kbyte SDRAM
Cache: 16 Kbyte program, 16 Kbyte data
Clock pulse (external/internal):

32 MHz for local periphery


64 MHz for DRAM accesses

Program memory module

MS5 - 2 MB flash EPROM, 8 KB EEPROM


MS55 - 2 MB RAM, 8 KB EEPROM
MS51 - 4 MB Flash EPROM, 8 KB EEPROM

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PM6 (Display Codes)


The following display codes are displayed in the LED window of the
processor:

Display
1..8
A
.

0
b
C
E

Operating and error status


Configured number of the CPU
Display caused by the user software (configuring)
Initialization phase. Indivudual initialization steps are displayed with
increasing numbers during run - up phase.
5V available; no program is being executed
Initialization error due to erroneous or incorrectly inserted modules for
the actual software which has been configured: flashing "0" -> Error on
this module; steady "0" -> Error on other modules or error when
loading system software
Monitoring error (e.g. missing, discharged buffer battery, overload on
binary outputs)
Erroneous configured communications or connection
Operating system alarms, generally, time overrun
Fatal system error due to hardware or software problems which
resulted in a program crash: flashing "H" -> fault/error on this module;
steady "H" -> Fault/error on another module

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PM6 (Front panel and indications)

S1 Button

Used to delete error displays


Used with function block ASI as a binary input signal for trip resets
Program memory module

MS5 - 2 MB flash EPROM, 8 KB EEPROM


Used for storing user program
X1

Serial interface RS-232


X5

Binary Inputs BI1 - BI8

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EM11 I/O Board

Features

digitize analog inputs with A/D or V/F/D converters


binary I/O {in steam turbine governors only)
16 display LEDs
Output analog voltage signals

LEDs

H10/H20
H10 byte with Red LEDs (H11-H18)
H20 byte with Yellow LEDs (H21-H28)

X5

for incremental encoding


X6

X7

Digitize analog voltage signals


4 A/D channels
4 V/F/D channels
Digital/Analog conversion (2 channels)
16 binary inputs.
4 binary outputs for signal states of X5

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CS12 (Fiber Optic Coupling Master)

Features

Master FO communications link between 2 racks for redundancy


Can only be used on sub-racks with L and C buses Availability
Can be used with expansion slots (ICS1 & ICS2) to control up to 8
slave racks
X5

Receiver
X6

Transmitter

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CS22 Fiber (Optic Coupling - Slave)

Features

Slave FO communications link between 2 racks for redundancy


Can only be used on sub-racks with L and C bus
4
X5

Receiver
X6

Transmitter

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CS7 (Carrier Module)

Features

Relieves processor board of communications tasks


Can accommodate up to 3 interface modules
Occupies 2 slots

H10/H11

H20/H21

X10/X11
double test socket
Slot X1
Interface module slot

X20/X21
double test socket
Slot X2
Interface module slot

amber and green LED

amber and green LED

H30/H31
amber and green LED
X30/X31
double test socket
Slot X3
Interface module slot

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SS52 (Interface board PROFIBUS)

Features

Interface board for PROFIBUS protocol (SINEC L2)

X5

DB9 RS485 interface

LED
H10/H20/H30

LED
H11/H21/H31

dark
dark
dark
flashing

dark
lit
flickers
dark

lit
lit

dark
lit

Function
processor not initialized
no data basis in the ring
without data basis
initialization erroneous
initialization completed No bus
connection
"in the ring"

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CSH11 (Support Board)

Features

Plant Bus connection for communications with AS 620 B & OM 650


systems

Front Panel Connectors

Red and Green LEDs


Switch ADM,Run,STP
ADM
allows resetting CSH11 via reset button
Run > STP interrupts communication
STP > Run establishes communication
Reset button
X5
SINEC NML Programmer port
X6
Plant Bus connector cable port

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CSH11 (Support Board)

LED
Red (STP)

LED
Green (Run)

dark
dark
lit
lit

lit
flashing
dark
flashing

lit

lit

dark
flashing

dark
dark

4
Function
Run with data basis
NSAP address
Stop
Interrupt
Waiting for synchronization with
the monitor process in the host
Internal intermediate status of
the CP
Fatal CP error

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Rack OK

Fan OK

Power Supply OK

24 V

RK OK

14

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Master Rack Feedback

EM1
Rack

Ribbon to

Outputs a 1 if master; 0 if
slave

EM1
Rack

Outputs a 1 if master; 0 if
slave

Binary input

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Processor Commmunictaions Using CS12 to


CS22 FO Coupling

Transmit/Recieve
Rack "A"

Rack "B"

Receive/Transmit

16

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AddFEM Unit Interface

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AddFEM LEDs

There are 3 groups of LEDs


Each group has 4 LEDs
There are 2 types of LEDs:
Error LEDs are red and on the left side
Status LEDs are green or yellow and are located on the right side

18

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AddFEM Light Explanation

AddFEM Light Information Key

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AddFEM Connections

20

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Connections X4 & X5: Pin assignments for


Analog inputs and Outputs

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Connectors X6 and X7: Pin Assignments for


Digital Inputs and Outputs

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COM PROFIBUS

COM Profibus is used for:


Configuring the communication port
Setting up the network
Setting up the AddFEM I/O
Setting station addresses

Figure above shows the COM Profibus configuration screen as shown on


the PG740

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COM Profibus GSD File

The GSD file shows a graphical representation of the Profibus network.


It will show the DP master and all of the AddFEM slaves along with all the station addresses.

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COM PROFIBUS: Parameterization of the


Operating Mode for AddFEM

Parameterization is done via menu selections from within the COM Profibus
software:

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COM PROFIBUS: Parameterization of the


Analog Inputs/Outputs for AddFEM
Analog Inputs 1-6 can be parameterized as current or voltage
Analog Inputs 7-12 can be parameterized as only current

Analog Outputs 1-4 can be parameterized as current +/- 30 Ma


Analog Outputs 5-8 can be parameterized as current +/- 20 Ma

26

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COM PROFIBUS: Parameterization of the


Analog Input Filters for AddFEM

Filters can be used to suppress unwanted signals on the Analog inputs

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AddFEM Connections to Profibus

If a connector has only one wire, it should always be connected to the connector with
the arrow pointing into the connector housing

Other end of bus

The terminating resistors should only be turned on at the two ends of each run

When connectors are piggy backed all rules for terminating resistors are reversed

28

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AddFEM General Troubleshooting

Symptom:
No communication to an AddFEM module, but there is communication
on other AddFEM modules

Solution:
Check that terminating resistors are correctly set on all connectors,
and check that Profibus cables are correctly terminated in the
connectors

Symptom:
If EXTF light is active
Solution:
Check that all current loops are complete, and check that there are no
short circuits on both analog and digital I/Os

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Fast I/O Redundancy: 501CT Concept

Redundant AP connections
One AddFEM module failure initiates a trip

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Example of CT Redundancy (1)

In this example, the Governor System is in fault free operation; Green is used
to show the master; Orange is used to show the slave

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Example of CT Redundancy (2)

If the connection to the third AddFEM module on bus A is removed...

32

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Example of CT Redundancy (3)

The AddFEM module 3 will switch from A bus master to B bus master

This changes the status bits sent back to the Simadyn Processor

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Example of CT Redundancy (4)

Simadyn racks A and B receive status that AddFEM module 3 switched for A to B
Simadyn rack A switches from Master to Slave, and Simadyn rack B from Slave to
Master

The Governor software sends a life bit that tells whether it is the Master or Slave (this
is a special Hex Code) to the AddFEM modules...

34

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Example of CT Redundancy (5)

The AddFEM modules receive the Hex Code and switch to bus B
The AddFEM modules always select the bus channel that is the system Master,
unless that channel is faulty

If either of the Simadyn racks do not switch, or either of the AddFEM modules do
not switch, the turbine is tripped due to double failure

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Test/Exercise 3
G

Where is the user program stored for the AS620T processor?

What are the different uses of the L and C busses?

What I/O module is used for direct access to the processor (no L or C bus
connection)?

What is the EM11 card used for?

What 2 modules make up the redundancy link between the 2 processors?

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What card is used to connect the AS620T to the Plant Bus?

How is data sent from the AS620T to the OM650 PU?

What is the AddFEM Module used for?

Which tool is used to set up the AddFEM unit?

On a separate sheet of paper draw a diagram of a complete redundant


AS620T including all input and output modules

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SIMATIC H1 Plant Bus


& Exercise 4/5

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SIMATIC H1 Plant Bus
Access Mechanism
All busses in TXP use the Carrier Sense Multiple Access Collision Detection
(CSMA/CD) access mechanism. Both the electrical and optical versions of the
Industrial Ethernet CSMA/CD bus are based on the baseband transmission
procedure whereby the information to be transferred is directly superimposed
onto the transmission medium, which means no high-frequency carrier signal
modulation is used. The CSMA/CD access mechanism allows one transmission
channel to be shared by all connected stations.
The CSMA/CD access mechanism is described in the Ethernet specification
IEEE 802.3 (1st edition 1985) and its extension (2nd edition 1989). This
internationally used standard initially only covered electrical coaxial CSMA/CD
busses. Then CSMA/CD busses with new transmission media such as Fiber
Optic and twisted-pair cabling were developed and used.

The bus components required are based on the extended IEEE 802.3 standard
and allow different types of CSMA/CD busses to be used.
The SIMATIC NET Industrial Ethernet is based on the Open System
Interconnection (OSI) reference model of the International Standardization
Organization (ISO). Figure 1 illustrates the 7 layers of the OSI model:
5-7
4

See section on communication protocols


Transport
Reliable data
Connection/
transmission
disconnection
Acknowledgement
Segmentation
Network
Communication
Addressing of other
between busses
busses

Data Link

Access mechanism
to the transmission
medium

Physical

Physical
specification of the
transmission
medium

CSMA/CD
mechanism
Checksum
calculation
Coaxial/FO cabling

ISO
transport
TCP/IP
ISO network
Data Link

Physical

Fig. 1: OSI 7 layer reference model

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In the SIMATIC NET Industrial Ethernet the layers 1 (physical layer) and 2a
(media access control) conform to the IEEE 802.3 standard. These layers specify
the physical features of the transmission medium and the access mechanism of
the stations to the transmission medium.
Carrier Sense and Multiple Access
On a CSMA/CD bus, all nodes connected to the bus check, or sense, what is
being sent on the bus. Each node at any time has the right to access the
transmission medium provided that the bus is not being used by another node. In
other words, listen while talking.
Carrier Sense
Every node checks the bus for a carrier. Transmission is only attempted if
the transmission medium is not being used by another node.
Multiple Access
Each node controls its own bus access independent of other nodes.
As soon as a node starts transmitting data on the bus the transmission medium
is blocked for all other nodes. The nodes sense the data on the bus and are able
to receive but cannot send data themselves.
If a station wants to send data while data is being transmitted by another station
it waits until the packet currently being sent has been received. After a GAP time
of 9.6 microseconds it can start sending data. Figure 2 depicts Carrier Sense:

Fig. 2: Carrier Sense


2

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Collision Detection
If several nodes are waiting to send data packets on the bus the possibility exists
that two or more stations transmit their data simultaneously to the transmission
medium since they found the medium to be available at approximately the same
time.
As the data packets of these nodes are sent simultaneously a so-called collision
occurs on the transmission medium. The colliding data packets are destroyed
and lost. Once a transmitting node detects a collision, it stops sending data
immediately. Data packets that were lost must be re-transmitted after a collision.
Figure 3 illustrates collision detection:

Fig. 3: Collision Detection

The node that first detects the collision sends a jam signal, which makes it easy
for other stations to also detect the collision, and then stops its own transmission
procedure.
A node must still be transmitting data in order to be able to detect a collision
with its own signal. IEEE 802.3 defines a maximum propagation time of 25.6 s
for a signal to travel from one end of the bus to the other and back. In order to
allow the sender to detect a collision with a signal from a node which is the
maximum permissible distance away, the minimum transmission time must be
51.2 s (= twice the single-direction signal propagation time).

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Data traffic between two stations can also include data packets that would be
too short to fill the minimum transmission time, such as, acknowledge packets.
These packets would be supplemented up to the required minimum length of 64
bytes:
(64 bytes = (512 bits x 100ns) =51.2 s)
This procedure is called padding.

Fig. 4: Collision after the maximum propagation time

Retransmission after a collision


In order to prevent all nodes waiting to transmit data from sending data at the
same time after a collision the stations delay retransmission for some random
length of time within a specific time interval.
The maximum number of retransmission attempts is 16. After the waiting period
the nodes attempt to transfer the data again. The node with the shortest waiting
period is the first to transfer while the others retry after different waiting periods.
After the 16th collision, no further retransmission attempt is made and a signal is
issued to the next higher protocol layer.
4

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The CSMA/CD access mechanism for access to the transmission medium is
always the same no matter whether the bus uses electrical, optical or mixed
cabling. The only differences between these busses are the physical
representation of the data signals on the transmission medium as electrical or
light signals and the transmission media and bus components used.
Designation
Bit time at 10 Mbps
Minimum packet length
Maximum packet length
Maximum transmission time
GAP time
Jam signal
Maximum number of retransmission attempts
after a collision
th
th
Maximum waiting period up to the 10 16
retransmission attempts
Maximum theoretical bus length

Value
100 ns
512 bits (64 bytes) = 51.2 s
12,144 bits (1,518 bytes)
Approximately 1.214 ms
9.6 s
32 bits
16
52.4 ms
Approximately 4,520 m

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Communication Protocols for the Plant Bus
Communication on the plant bus is based on the ISO/OSI 7-layer model for open
communication. The layer model is a widely used and accepted architectural
scheme that allows communication in a varied device environment. The layers
result from the specification and grouping of the different communication
functions, each of which plays an important role in implementing communication.
Each layer serves the layer above and uses the services of the layer below, if
they exist.
Communication protocols describe the rules, structures and procedures that
have to be applied during communication among bus participants. They are
specified in binding documents, such as ISO, IEEE, and ANSI, or widely used
standards, such as, RFCs of the Department Of Defense.
In order for two bus participants to be able to intercommunicate the
corresponding protocol stack must be implemented and the protocol parameters
to be used must be specified (the OSI layers used, addresses, number and type
of connections, data lengths, etc.). Figure 5 is a graphical representation of the
OSI 7-layer model:

Fig. 5: The ISO/OSI 7-layer model

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The Protocols Used
The table below shows the protocols used for communication between the
various systems connected to the plant bus in TXP:
Protocol
layer
according
to ISO/OSI

7
6
5
4
3
2
1

AS 620
OM 650

AS 620
AS 620

AS 620
DS 670

AS 620
ES 680

AS 620
Std. S5
(ancillary
plant sys.)

AS 620 SIMADYN

As 620
CP 581

APRED

APRED

APRED

AS511

APRED

AP (STF)

APRED

SIMATIC
NET
real-time
transm.

Empty
ISO
transport
ISO
network

ISO
transport
ISO
network

ISO
transport
ISO
network

ISO
ISO
transport transport
ISO
ISO
network
network
ISO Data Link
IEEE 802.3

ISO
transport
ISO
network

ISO
transport
ISO
network

AP (STF)

Automation Protocol/SINEC Technological Functions: higher


protocol functions based on the AP protocol from Siemens
(OSI layers 5 through 7, no redundancy functions)

APRED

Siemens implementation of the OSI layers 5 through 7


(redundancy protocol, based on the AP protocol)

AS511

SIMATIC S5-specific protocol for remote programming and


remote diagnosis of SIMATIC S5 devices

SIMATIC NETSiemens Network Architecture: SIEMENS implementation of the


ISO/OSI model for industrial communication

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Star Couplers
In TXP, star couplers are the center of the Industrial Ethernet bus. The various
transmission media are coupled to the star couplers via plug-in type interface
cards. The figure below shows a typical Fiber Optics Industrial Ethernet bus with
star couplers:

Fig. 12: Industrial Ethernet bus with star couplers

TXP uses several types of star couplers: undivided AC, divided AC, undivided
24V DC, and divided 24V DC. Of course, the undivided types are used where
there is no redundancy requirements and the divided types for redundant
configurations.
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Each type of star coupler comes with two power packs:

The power packs of all star couplers operate with shared load
Each power pack is able to provide the star coupler with power if the other
power pack fails
All power packs can be removed and inserted under voltage (hot swapping).

For availability reasons, the redundant voltage supplies to the star couplers must
be connected to separate supply voltages.
The figure below shows the front and rear views of a 24V DC divided star
coupler, which contains two star couplers each provided with a plug-in power
pack on the left-hand side. Both power packs operate with shared load and they
both have a green LED to indicate power ON.

Fig. 13: Front view

Fig. 13.1: Rear view

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Star Coupler Equipment
Star couplers are equipped with interface cards, management cards or
supervisory modules as required. The plug-in slots that are not assigned must be
covered by dummy plates to ensure optimal shielding and convection.

Fig. 14: Slot assignments of star coupler

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- Power packs:
The power packs can only be plugged into the provided plug-in slots
- Interface cards:
The plug-in slots for the various types of interface cards are freely
selectable.
-

Management cards or supervisory modules:


Each star coupler provides a specific plug-in slot (the divided star coupler
provides two) for the insertion of a management card or supervisory
module. If no management card/supervisory module is required the plugin slot can also be used to plug in an interface card.

The power packs, interface cards, management cards and supervisory modules
can also be inserted and removed during operation while the star coupler is
under voltage.

Two star couplers are always connected via a Fiber Optic path. Each star coupler
must contain an optical interface card for this path. The following optical
interface cards are available:
OYDE-S....
ECFL2
ECFL4
Figure 14 depicts the basic principle of star coupler connections:

Fig. 14: Basic principle of star coupler connections

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Polarity of FO Cables
FO paths always require two fibers: one for the transmission and one for the
receive direction. The following principle applies if two devices are connected via
FO cables:
From
Device 1 transmission port
Device 1 receive port

To
Device 2 receive port
Device 2 transmission port

The receive and transmission ports on the FO interface cards and optical
transceivers are identified as follows:

Reversal of the polarity of the transmission and receive direction is indicated by a


flashing red CD-LED on the interface card front panel (low light).

12

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Virtual Ring Theory
The single-fault tolerance implemented in the TXP bus system is based on the
virtual ring principle whereby the star couplers are connected to a ring via FO
paths. At one point in this ring the FO connection between two star couplers is
operated in the redundant mode. During fault-free operation this path is open
and thus provides the line topology required for operating a CSMA/CD bus. All
the other paths are normal FO paths and are not redundant.
The redundant mode of a FO path can be implemented using various interface
cards. Figure 15 shows the virtual ring concept during normal operation:

Fig. 15: Virtual-ring (normal operation)

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The monitoring logic on the interface card, whose port is set in the redundant
mode, monitors the virtual-ring for interruptions. The redundant path that had
been open up to the time the interruption occurred is then closed and
communication is possible in both directions to the location of the interruption.
Figure 16 shows the virtual-ring concept during abnormal operation:

Fig. 16: Virtual ring (redundant path is activated)

14

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Practical set-up
The redundant FO path is selected during the planning phase and implemented
during setup. The required settings on the pair of interface cards, which
terminate both sides of the redundant path, depend on the type of interface card
used. In the figure below, the redundant path is implemented using a pair of
OYDE cards. (Some of the OYDE cards in this example are inserted into
management plug-in slots that can also be used for interface cards if no
management is required).

Fig. 17: Redundant path with a pair of OYDEs.

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Interface Cards and Management Modules for Star Couplers
TXP uses the following interface cards, management cards, and supervisory
modules for star couplers:
Interface cards:
Twisted-pair ports
ECTP3
AUI ports
ECAUI
Multi-mode FO ports
OYDE-S C
ECFL2
ECFL4
Management cards/supervisory modules:
MIKE
HSSM or HSSM2

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ECTP3
The multi-port twisted-pair interface card ECTP3 allows three terminating devices
with twisted-pair (TP) interface or TP transceivers to be connected to the
Industrial Ethernet bus via TP cable segments. Participants connected to the card
and which have faults are separated from the bus.
The interface card ECTP3 can be inserted and removed online. The card is not
provided with a fuse. Figure 18 shows the front panel of the ECTP3 card followed
by a table listing the meaning of the LEDs:

Fig. 18: The ECTP3 front panel

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LED response
Meaning of the
LED
Card-level
indicator
DA (Data)
P/MGMT (Power/
Management)
P/MGMT (Power/
Management)
DIS (Disable)
Port-level
indicators
LS (Link Status)
LS (Link Status)
CD/DIS (Collision
Detection/Disable
CD/DIS (Collision
Detection/Disable
CD/DIS (Collision
Detection/Disable
DA (Data)
MDI (port 1 only)

LED
color

No Error

Yellow

Briefly lit

Green/
Yellow

Yellow steady
light
Green steady
light

Yellow

Error

Data is sent to the basic system bus


by one of the three ports
Supply voltage for the star coupler is
present
Management is active
Steady light

Green

Steady light

Red/
Yellow

Red, briefly lit

Not lit

Red steady
light
Yellow steady
light
Yellow
Yellow

Remarks

Briefly lit

Card is separated from the system


bus

Link status of the port is OK, the


connection to the participant is
established
Link Status of the port is not OK
Collision has occurred
Port is segmented
Port was blocked in the send and
receive direction
Data is received at the port
Not applicable to TXP

Fig. 18.1: Meaning of ECTP3 front panel LEDs

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ECAUI
The twin transceiver card ECAUI allows two terminating devices to be connected
via AUI port. Faulty terminating devices are separated from the bus system.
The ECAUI interface card can be inserted and removed online. The card is not
provided with a fuse. Figure 19 shows the front panel of the ECAUI card followed
by a table listing the meaning of the LEDs:

Fig. 19: The ECAUI front panel


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LED response
Meaning of the
LED
Card-level
indicator
P/MGMT
(Power/
Management)
P/MGMT
(Power/
Management)
P/MGMT
(Power/
Management)
DA (Data)

LED
color

No Error

Green/
Yellow

Green steady
light

Supply voltage is present,


management is active

Yellow steady
light

Management card is not inserted

DIS (Disable)

Yellow

Port-level
indicators
P1, P2
(Power1, Power2)
P1, P2
(Power1, Power2)
CD/DIS (Collision
Detection/Disable
CD/DIS (Collision
Detection/Disable
CD/DIS (Collision
Detection/Disable
DA (Data)
SQE Test

Error

Yellow steady
light
Yellow

Green

Red/
Yellow

Briefly lit
Steady light

Steady light

Connection to the management card


is interrupted
Data is sent to the basic devices
system bus
Card is separated from the system
bus by management

Not lit

Supply voltage of the terminating


device connected is present
No AUI cable connected to the port

Red, briefly lit

Collision has occurred


Red steady
light
Yellow steady
light

Yellow
Yellow

Remarks

Briefly lit
Not lit

Port was blocked in the send or


receive direction
Port was deactivated by management
Data is received at the port
SQE test is switched off for this port

Fig. 19.1: Meaning of ECAUI front panel LEDs

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OYDE-S C
The FO interface card OYDE-S C allows a star coupler or an optical transceiver
to be connected to the Industrial Ethernet bus.
The interface card OYDE-S C can be inserted and removed under voltage. The
cards are not provided with a fuse. Figure 20 shows the front panel of the OYDES card followed by a table listing the meaning of the LEDs:

Fig. 20: The OYDE-S front panel

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LED response
Meaning of the
LED
Card-level
indicator
P (Power)
P (Power)

LED
color

No Error

Green

Steady light
Flashing light

CD (Collision
Detection)
CD (Collision
Detection)
CD (Collision
Detection)
CD (Collision
Detection)
DA (Data)

Red

Briefly lit

Yellow

Error

Remarks

Supply voltage is present


Redundant mode (card is in standby
mode)
Collision has occurred
Steady light

Jabber control is active or partitioning

Flashing light

Low light (cable interrupted)

Flashing light
light/dark

Low light and partitioning

Irregularly lit

Data is received via FO cable

Fig. 20.1: Meaning of OYDE-S front panel LEDs

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ECFL2
The FO interface card ECFL2 allows one more star coupler and a bus participant,
or two bus participants to be connected to the Industrial Ethernet bus.
The ECFL2 interface card can be inserted and removed online. The card is not
provided with a fuse. Figure 21 shows the front panel of the ECFL2 card followed
by a table listing the meaning of the LEDs:

Fig. 21: The ECFL2 front panel

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LED response
Meaning of the
LED
Card-level
indicator
P/MGMT
(Power/
Management)
P/MGMT
(Power/
Management)
P/MGMT
(Power/
Management)
DA (Data)

LED
color

No Error

Green/
Yellow

Green steady
light

Supply voltage from the star coupler


present, management is active

Yellow steady
light

Management card is not inserted

DIS (Disable)

Yellow

Port-level
indicators
LS (Link Status)

Green

Yellow steady
light
Yellow

LS (Link Status)
LS (Link Status)
CD/DIS (Collision
Detection/Disable
CD/DIS (Collision
Detection/Disable
CD/DIS (Collision
Detection/Disable
DA (Data)

Error

Irregularly lit
Steady light

Steady light

Flashing light
Not lit
Red/
Yellow

Red, briefly lit


Red steady
light
Yellow steady
light

Yellow

Irregularly lit

Remarks

Connection to the management card


is interrupted
Data is sent to the star coupler
system bus
Card is separated from the system
bus by management

Normal mode: the FO connection of


this port is okay and active
Redundant mode: the FO connection
of this port is okay, the port is active
Redundant mode: the FO connection
of this port is okay, the port is in the
stand-by mode
The FO connection is not in order
Collision has occurred
Port was blocked in the send or
receive direction
Port was deactivated by management
Data is received at the port

Fig. 21.1: Meaning of ECFL2 front panel LEDs

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ECFL4
The ECFL4 FO interface card allows a star coupler and additionally three bus
participants, or up to four bus participants to be connected to the Industrial
Ethernet bus. The ECFL4 interface card can be inserted and removed online. The
card is not provided with a fuse. Figure 22 shows the front panel of the ECFL4
card followed by a table listing the meaning of the LEDs:

Fig. 22: The ECFL4 front panel

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LED response
Meaning of the
LED
Card-level
indicator
P/MGMT
(Power/
Management)
P/MGMT
(Power/
Management)
P/MGMT
(Power/
Management)
DA (Data)

LED
color

No Error

Green/
Yellow

Green steady
light

Supply voltage from the star coupler


present, management is active

Yellow steady
light

Management card is not inserted

DIS (Disable)

Yellow

Port-level
indicators
LS (Link Status)

Green

Yellow steady
light
Yellow

LS (Link Status)
LS (Link Status)
CD/DIS (Collision
Detection/Disable
CD/DIS (Collision
Detection/Disable
CD/DIS (Collision
Detection/Disable
DA (Data)

Error

Irregularly lit
Steady light

Steady light

Flashing light
Not lit
Red/
Yellow

Red, briefly lit


Red steady
light
Yellow steady
light

Yellow

Irregularly lit

Remarks

Connection to the management card


is interrupted
Data is sent to the star coupler
system bus
Card is separated from the system
bus by management

Normal mode: the FO connection of


this port is okay and active
Redundant mode: the FO connection
of this port is okay, the port is active
Redundant mode: the FO connection
of this port is okay, the port is in the
stand-by mode
The FO connection is not in order
Collision has occurred
Port was blocked in the send or
receive direction
Port was deactivated by management
Data is received at the port

Fig. 22.1: Meaning of ECFL4 front panel LEDs

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The Management Card MIKE
The management card MIKE is used in TXP in conjunction with the diagnostic
system DS670 for star coupler and LAN diagnosis. MIKE provides all information
required for evaluation in the DS670.
TXP uses the flash variant of MIKE, i.e. the MIKE operating system is already
stored in the EPROM. Figure 23 shows the front panel of the MIKE card. A
detailed listing of the LEDs is in the Bus System manual.

Fig. 23: The MIKE front panel

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The Star Coupler Supervisory Modules HSSM and HSSM2
The supervisory modules HSSM (Hub Status Supervisor Module) and HSSM2
provide defined fault alarms and warnings from the star coupler as hardware
signals. These signals can be incorporated into the existing TXP alarm strategy
via the automation cabinets.
Either module can be used as an alternative to MIKE management card, but just
as for the MIKE they must be inserted into the far right plug-in slot in the
undivided and in the far right plug-in slots in each half of the divided star
coupler.
Either module can be inserted and removed online (after insertion a self-test
must be activated). The cards are not provided with fuses. Figure 24 shows the
front panel of the HSSM module and the pin-out of the front panel connector
followed by a table listing the meaning of the LEDs:

Fig. 24: HSSM front panel and pin-out of connector


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LED response
Meaning of the
LED
Card-level
indicator
HUB OK (star
coupler OK)
HUB OK (star
coupler OK)
HSSM OK

LED
color

No Error

Green

Steady light

Green

LOAD 1-40
LOAD 1-40

Steady light
Flashing light
Not lit

Red

Steady light

Red

Steady light

Yellow

Remarks

Star coupler common alarm, OK


Not lit

HSSM OK
HSSM OK
ERROR
Interface
ERROR Fan

Error

Lit
Steady light

Star coupler common alarm, not OK


Supervisory module is ready for
operation
HSSM hardware fault
Supervisory module being initialized
or self-test is active
Interface cards signal fault or self-test
is active
Fan fault (irrelevant to the ASGE..) or
self-test is active
Current mains load in %
Self-test is active

Fig. 24.1: Meaning of HSSM front panel LEDs

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Compact star couplers OLM ( Optical Link Module )

As far as availability and transmission reliability are concerned, the OLMs have
the same features as star couplers:

Use of redundant optical paths

2 separate feed-ins for the voltage supply

Diagnosis via LEDs

Alarm contact for fault signaling ( same as the supervisory module


HSSM for star couplers )

Interfaces:

Two optical ports for connection to other modules (analogous to


the star coupler)

Three industrial twisted-pair ports (ITP) to connect terminating


devices

The optical ports can be used for the interconnection of several OLMs to form a
redundant optical ring, or OLMs can be incorporated into an existing redundant
optical ring containing star couplers.

The industrial twisted-pair ports are used to connect, via ITP cable, up to three
terminating devices which have an ITP port, or terminating devices which have
an AUI interface and twisted-pair transceiver TPTR.

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Fig. 13.2 Front and side view of an OLM

Fig. 13.3 Bottom and top view

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Fig. 13.4 Meaning of the LEDs

DIP switch

Position

LA1

ON
OFF
ON
OFF
ON
OFF
ON
OFF
ON
OFF
ON
OFF

LA2
LA3
LA4
LA5
R5

Meaning
Alarm link status port 1 (ITP) is OK activated
Alarm link status port 1 (ITP) is not OK deactivated
Alarm link status port 2 (ITP) is OK activated
Alarm link status port 2 (ITP) is not OK deactivated
Alarm link status port 3 (ITP) is OK activated
Alarm link status port 3 (ITP) is not OK deactivated
Alarm link status port 4 (ITP) is OK activated
Alarm link status port 4 (ITP) is not OK deactivated
Alarm link status port 5 (ITP) is OK activated
Alarm link status port 5 (ITP) is not OK deactivated
Port 5 is in the redundant mode
Port 5 is in the normal mode

Fig. 13.5 DIP switch block mounted in the OLM housing

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Optical Switch Modules (OSM) and Electrical Switch Modules (ESM)

The Optical Switch Modules(OSM) and the Electrical Switch Modules (ESM)
permit switched networks with speed upto 100 Mbit/s. By segmentation the load
in existing network can be separated which increases performance. Redundancy
is incorporated in the OSM and ESM modules, enabling the design of redundant
Industrial Ethernet ring structures.
The design of an optical ring requires OSMs with 2 FO ports. ESMs also permit
the design of rings with copper cables (ITP standard cable). These electrical
rings are designed with 2 twisted-pair ports. The data rate in the ring is 100
Mbit/s and up to 50 OSMs or ESMs per ring may be used. In addition to the 2ring ports, the OSM and ESM have 6 more ports to which terminal devices and
network segments can be connected. These ports are available either as 6x ITP
or 6x RJ45 interface.
As with the star couplers (HSSM) monitoring of the modules can be done via a
signaling contact and interrogation via the DS670 is also permitted, as with the
Mike card. Furthermore, OSM and ESM are prepared for the integration in
network management systems on the basis of SNMP (Simple Network
Management Protocol) and web-based management.

Fig 13.6 Front view of an OSM Module

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Fast Ethernet
The benefit of Fast Ethernet is that it has all the features of the classic Ethernet
standard with a data rate increased by a factor of 10 to 100Mbps. The data
format, the CSMA/CD protocol and the glass fiber-optic cables and cat 5 twisted
pair cables are identical in both systems, but if you wish to utilize the full potential
of high speed performance with glass fiber link switched technology must be
used.
The table below shows typical properties for a 6 port ITP OSM, which would
utilize the 2 FO ports to make a redundant ring connection.

Properties of the OSM ITP62


Electrical ports

6 x 10/100 Mbps auto-negotiation ports


with ITP connection (sub-D 9 pin
female)
Optical Ports
2 x 100 Mpbs FO ports (full duplex)
BFOC female connector
Maximum distance between two OSMs 3000m (multimode graded-index fiber)
Maximum ring span with 50 OSMs
150 km
Switching Method
Switching Increases the Transmission Capacity and Span of a Network
The limited capacity due to the baseband transmission method and the limited
span due to the CSMA/CD protocol means that an Ethernet network in a large
plant with a large volume of traffic often reaches its limitation, we call this the
meltdown point. Using switching technology, networks limits can be extended
considerably.
Basics of switching.
Networks operating at the physical layer such as star couplers, OLMs and ESMs
pass on received data transparently. This means that all data received at a port
are output again to all other ports regardless of the content. This obviously slows
down the network and is less efficient. Network components with a switching
function froward data from sender to receiver directly based on the source and
destination address information.

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Address Filtering
By analyzing the data traffic, a switch automatically learns which Data Terminal
Equipment (DTE) is obtainable by checking its ports, this method is known as
tech-in-mode. To enable it to carry out this function it enters the destination
address in an address table which is maintained for each port. Therefore only
data entered for DTEs in other subnets are switched from the input port to the
appropriate output port of the switch. The switch is capable of handling several
such data flows at the same time provided they do not have the same port as
their destination.
Filtering of the data traffic based on the source and destination address, means
that data will only be transmitted on the path on which they will reach the
receiver. This means that the entire network is used for more efficiently.
As well as having the ability to learn addresss that are attached to the OSM/ESM
it also has the capability of monitoring the age of the addresses it has learnt.
Address entries that exceed a certain age (aging time on the OSM/ESM is 40
seconds) are deleted. If a packet is received by an OSM/ESM for which there is
no address entry, the OSM/ESM will distribute it to all ports.
Redundant Ring Structure
As with star couplers and OLMs a redundant ring structure can be implemented
with the OSM/ESM. Like the star coupler a redundant path is configured in the
system, but in OSMs and ESMs it is known as a redundancy manager (RM). So
with the aid of one OSM functioning as the RM, both ends of an optical bus made
up of OSMs are connected together using the ports 7 and 8.
The RM monitors the OSM bus connected to it, close the bus if it detects an
interruption and therefore reestablishes a functioning bus configuration. A
maximum of 50 OSMs are permitted in an optical ring. This allows a
reconfiguration time of less than 0.3s to be achieved. The RM mode is activated
on the OSM by a DIP switch which is located on the upper casing of the OSM
module. The DIP switch is titled RM and has a selection for ON or OFF.

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Example of a redundant ring structure is shown below:

AP

OSM in
RM-mode

PU

Plant Bus

From the above example you can see that one OSM has been designated the
redundant manger (RM). Under normal operation the information will be routed
via the shortest path from sender to reciever. If however the normal route were
disrupted the OSM in RM mode will detect the distirbance and will dynamically
re-route the information. An example of this is shown on the next page.

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OSM in RM mode redirects the data in the case of a distirbance or break in the
normal path:

AP

OSM in
RM-mode

PU

Data Flow

Plant Bus

Redirected data

The OSM is capable of reconfiguring a redundant path within 0.3 seconds.

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RM Redundancy Manager (green LED)

Status
Lit

Not lit
Flashing

38

Meaning
The OSM/ESM is the operating in the redundancy manager
mode. The ring is operating free of errors, in other words
the redundancy manager does not allow traffic through but
monitors the ring.
Note: One OSM must operate in the redundancy manager
mode (and only one) in each OSM/ESM ring.
The OSM/ESM is not in the redundancy manager mode
The OSM/ESM is in the redundancy manager mode and has
detected a break on the ring. The OSM/ESM makes the
connection between the two ring ports so that a functional
bus configuration is reestablished

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Communication Processors
In TXP the bus participants are connected to the terminal and plant busses via
their own interface modules which are also termed communication processors.
The Plant bus communications processors are shown in the following table:
System

Communication processor

AS 620
OM 650
ES 680
DS 670

CP
CP
CP
CP

1430
1413
1413
1413

The CP1430 Communication Processor


The CP1430 communication processor connects the TXP automation system
AS620 to the Industrial Ethernet bus. Figure 25 shows the CP 1430 card:

Fig. 25: CP 1430

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The CP 1430 can be directly plugged into the AS 620 central rack. For redundant
configurations a CP 1430 is inserted into each rack. The structure of the card is
as follows:

It has a single width European format and no fan


Bus connection is via a 15-pin Sub-D socket with automatic changeover
between the AUI interface and the Industrial twisted-pair interface (combined
interface)
The programming interface is located on the front panel
Run/stop switch and operating status LEDs are available on the front panel

The functions of the CP 1430 are listed below:

40

To handle the message transmission including layer 7 of the ISO model,


freeing the automation system from the communication tasks
Time synchronization (can be configured as time master for the bus)
To support test and diagnostic functions
Integrated AUI and industrial twisted-pair interface
Connection parameters configured using the ES680

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The CP1413 Communication Processor
The CP1413 communication processor allows the TXP operation and monitoring
system OM650, the engineering system ES680 and the diagnostic system DS670
to be connected to the plant bus. Figure 26 shows the CP 1413 card:

Fig. 26: CP 1413

Structure
The card has the short PC-AT format and is connected to the Industrial Ethernet
bus via AUI interface. The card has a built-in 15V-voltage supply to feed the
electrical or optical transceiver via the AUI interface. Several CP1413 modules
can be operated side by side in a computer.

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Functions

42

To handle the transport and user-oriented protocol layers 1 through 7 of the


ISO 7 layer model
To handle redundant communications
SIMATIC NET TF user interface
Configuration of the connection parameters using ES680
Data transfer between the host computer and the CP1413 via UNIX interface
module drivers
Communication with the plant bus via the SINEC technological functions
(STF)

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TXP-HW
Test/Exercise 4
q

What 2 layers of the SIMATIC NET Industrial Ethernet conform to the IEEE
802.3 standard?

What is the difference between a token ring network and a CSMA/CD


network?

What happens to a data packet after a collision?

How does a bus participant respond to a data collision?

What 4 protocols did Siemens create for use on the Plant Bus?

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q

Which of these protocols is used for AS <-> OM communications?

Which TXP component does not evaluate synchronous time on the plant bus?

Which card on the Plant bus is used for time master when no bus clock is
present?

Which 2 TXP components communicate with one another using the AP (STF)
protocol?

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TXP-HW
Test/Exercise 5
q

What transmission medium is required for the redundant path on the Plant
Bus?

How is a virtual ring established in the bus system of TXP?

What types of star coupler modules are used for the redundancy path in the
virtual ring?

Which star coupler modules can be swapped on-line?

With which TXP component is the MIKE management card used and for what
purpose?

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What is the main purpose of the Hub Status Supervisor Module?

What bus speeds may be optained by using OSM modules?

How does the operation of an OSM differ from that of a star coupler?

How is redundancy in the virtual ring set up with OSMs?

What is the communications processor in the AS 620 called?

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q

What is the communications processor in the ES 680 called?

Locate the CP 1413 cards on the back of your OM computer and the ES 680
workstation

On a separate piece of paper draw a sketch of a typical Plant Bus including


all possible participants (when applicable list the appropriate communications
card(s))

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Ethernet Terminal Bus


& Exercise 6

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Terminal Bus
TXP separates communications tasks between two busses: terminal bus and
plant bus. The previous chapter described the tasks of the plant bus. This
chapter will cover the tasks of the terminal bus. The figure below shows the
components within TXP that are attached to the terminal bus:

OT1

OT2

OT3

OT4

OT5

Terminal bus

DS

PU1

PU2

SU

ES

Plant bus

AS1

AS2

AS3

6
AS4

Fig. 1: Terminal bus and Plant bus components

The OM 650 components that are attached to the terminal bus are Operating
Terminals (OT), Processing Units (PU), and Server Units (SU). The ES
(engineering system) and DS (diagnostic system) are also connected to the
terminal bus.
Like the plant bus, the terminal bus at the hardware level is an Ethernet bus
using the same access mechanism as the plant bus: CSMA/CD. The protocols
used at the terminal bus level come from the TCP/IP suite of protocols.
Therefore, the terminal bus is the same type of bus that is commonly used in
office networks and The Internet.
TCP/IP Basics
In the 1960s, the United States government agency DARPA (Defense Advanced
Research Projects Agency) funded research on how to connect computers in
order to exchange data among them. The purpose of this research was to build
command and control functions in case of a nuclear incident.

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The idea was to be able to move data across the network even if parts of the
network became disrupted. For example, if a network link were taken out by
enemy attack, the traffic on that link would automatically be rerouted to a different
link. This reliable scheme is called dynamic rerouting and is useful to modern day
networks that arent affected by nuclear attacks, such as, if a network link is cut
in a power plant the data is still able to reach its destination via a different route.
Several California Universities did additional research while a Massachusetts firm
built the first test network, called ARPANET (Advanced Research Projects
Agency NETwork), which connected academic and military research centers.
In the mid 1970s, the network had grown enough that DARPA began to
investigate the possibility of building and connecting additional networks. The
need for more network capacity drove research into technologies such as
Ethernet and token ring, as well as satellite and radio communications.
As ARPANET grew larger and larger it became increasingly harder to manage,
so it was split into two separate networks called MILNET (for military
installations) and a new ARPANET for civilian sites. Since both networks still
needed to be connected the Internet Protocol connected the two by routing traffic
from one network to the other.
DARPA funded the development of a whole set of protocols for communication
on the ARPANET, which is now known as the suite of protocols named for two of
its parts: TCP/IP, which stands for Transmission Control Protocol / Internet
Protocol. The protocols were designed to support multiple connected networks.
Even though there were only two networks to begin with, IP was from the
beginning capable of connecting thousands of networks. This capability is one of
the reasons TCP/IP is still so popular today.
When the UNIX operating system was being developed at the University of
California at Berkeley, they added TCP/IP into their software distribution kit,
which spawned a rapid growth spurt of TCP/IP, especially in academic
environments. In the early 1980s, the Secretary of Defense mandated that all
computers connected to the ARPANET had to use TCP/IP.
Because of a technical limitation, the ARPANET was limited to 256 computers
and as a result several other networks sprouted up to handle the traffic:
CSNET, the Computer Science Network
HEPNET, the High Energy Physics Network
NSFNET, the National Science Foundation Network
JNET, the Japanese Computer Network
All of these networks were, and are today, interconnected by means of the
TCP/IP protocol suite.
2

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One of the biggest strengths of TCP/IP is that it is independent of all the available
alternatives. Following is a list of advantages:
Its independent of the network topology (ring, star, etc.)
Its independent of the transmission medium (wire, satellite, etc.)
Its independent of specific vendors
Its independent of the operating system and computer hardware (UNIX,
Windows NT, etc.)
TCP/IP ties networks and The Internet together, regardless of the hardware and
software used to build those networks. It is commonly thought that TCP/IP is only
for linking UNIX computers because it has been included in UNIX for so long, but
this is not true. TCP/IP runs on and connects just about everything. There are
other network protocols, such as IBMs and Novells, but no protocol connects as
many different hardware and software platforms as TCP/IP.
The Protocols of TCP/IP
The protocols of TCP/IP stack up in layers, also, similar to the OSI Reference
Model, but TCP/IP has fewer layers. The table below lists the layers associated
with TCP/IP and the protocols that are used in each layer:
TCP/IP layer
Internet
Transport
Application

OSI layer
Physical
Data link
Internet
Transport
Session, Presentation,
Application

TCP/IP Protocols
IP, IPNG, ICMP, ARP, RARP
TCP, UDP
RPC, SMTP, FTP, TFTP

The physical and data link layers are not directly related to TCP/IP because it is
software that is independent of the underlying hardware. The internet and
transport layers are analogous to the OSIs same layers. The application layer
combines the session, presentation, and application layers of the OSI model.
List of TCP/IP Protocols
IP Internet Protocol
IPNG Internet Protocol Next Generation
ICMP Internet Control Message Protocol
ARP Address Resolution Protocol
RARP Reverse Address Resolution Protocol
TCP - Transmission Control Protocol
UDP User Datagram Protocol
RPC Remote Procedure Call
SMPT Simple Mail Transfer Protocol
FTP File Transfer Protocol
TFTP Trivial File Transfer Protocol
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The ISO / OSI seven layer model
Following is a brief description of each layer:
Layer 1: The physical layer
This layer is pure hardware, including cable, satellite, or other connection
medium, and the network interface card. This is where electrical signals
move around on the network.
Layer 2: The data link layer
This is another layer where hardware is involved. This is the layer that
splits data into packets to be sent across the connection medium. Ethernet
or token ring wiring gets handled at this layer. Once the data is on the
wire, the data link layer handles any interference by not allowing the data
to become garbled.
Layer 3: The network layer
This is the first place on the OSI model where a TCP/IP protocol fits into
the equation. IP is the TCP/IP protocol that works at this layer. This layer
gets packets from the data link layer and sends them to the correct
network address. If more than one possible route is available for your data
to travel, the network layer figures out the best route. Without this layer,
the data would never get to the right place.
Layer 4: The transport layer
Though the network layer routes data to its destination, it cannot
guarantee that the packets holding the data will arrive in the correct order
or that they wont have picked up any errors during transmission. Thats
the transport layers job. TCP is one of the TCP/IP protocols that work at
the transport layer; UDP (User Datagram Protocol) is another one. The
transport layer makes sure that the packets have no errors and that all the
packets arrive and are in the correct order. Without this layer, the network
could not be trusted.
Layer 5: The session layer
The other protocols that make up TCP/IP sit here on Layer 5 and above.
This layer establishes and coordinates a session, which is the name for a
connection between two computers. Before two computers can move data
between them a session must be established.
4

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Layer 6: The presentation layer
The presentation layer works with the operating system and file system.
Heres where files get converted from one format to another, if the
participants use different formats. Without the presentation layer, file
transfer would be restricted to computers with the same file format.
Layer 7: The application layer
This is the layer where our work is done, such as requesting to transfer a
file across the network. Without the application layer, no data to be sent or
messages could be created and the computer wouldnt know what to do
with any data that gets sent to it.

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Terminal Bus Communications Processors


The TXP components that connect to the terminal bus are the ES 680
engineering system, the OM 650 SU server unit, the OM 650 PU processor unit,
the OM 650 OT operating terminal, and the DS 670 diagnostics system. The
communications processors used in these components are 3COM Etherlink III
cards. It is a standard off-the-shelf Network Interface Card (NIC) that plugs into
an ISA slot on the motherboard of all the PCs. In the case of the ES 680 it is built
into the motherboard. The figure below shows the 3COM Etherlink III card:

Fig. 2: 3COM Etherlink III module

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Data Exchange between TXP nodes over the Terminal Bus
As seen in figure 1 on page 1, all components of TXP are connected to the
terminal bus with the exception of the automation systems. There are several
communication paths over the terminal bus between the TXP nodes. Following is
a brief summary of those communication paths.
ES <-> SU
The ES is used to engineer all data for the DCS. When building up the logic for
the automation systems, there are many signal definitions created. These signal
definitions, or point descriptions, are gathered in a central database that is called
the BDM database. This database, after compilation, needs to be transferred
from the ES to the SU where it permanently resides. The terminal bus connection
between the ES and SU is used for this transfer.
ES <-> PU
All the alarm handling and any calculation logic are built up on the ES. After
compilation, this data needs to be transferred to the PU. The terminal bus
connection between the ES and PU is used for this transfer.

ES <-> OT
All graphics that are created on the ES, after compilation, need to be transferred
to the OTs. The terminal bus connection between the ES and OT is used for this
transfer.
ES <-> DS
The terminal bus connection between the ES and DS is used by the DS to
extract the engineering data it needs to build up its graphics for diagnosing the
entire DCS from the DS terminal.
There are no dynamic connections between the ES and other terminal bus
participants. It is only used to transfer data from the ES to the other participants.

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OT <-> SU
Whenever a graphic is called up on an OT screen, any text descriptions that are
attached to a tag are extracted from the BDM database on the SU.
Whenever a trend screen is called up on an OT screen, the dynamic data
contained in the trend is extracted from the Long Term Archive on the SU.
Whenever a log is built on the OT the data is extracted from the Long Term
Archive residing on the SU.
All of this data exchange is done over the terminal bus.
OT <-> PU
All TTDs, or events, in TXP are transferred from the automation systems they
were generated in to the PU assigned to that particular AS. When a graphic is
called up on an OT screen, all the dynamic data that appears on the screen
comes from this gathering of events in the PU via the terminal bus connection.
All alarm-handling functions are handled by the PU via function blocks for the
particular automation systems that contain the alarms. These alarms are shown
to the operator via the terminal bus connection between the OT and PU.
DS <-> PU, SU, OT
The DS extracts all diagnostic data from buffers in the PU, SU, and OT and
builds up its graphic displays using the terminal bus connection.

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Test/Exercise 6
What does TCP/IP stand for?

Who initiated the development of the TCP/IP suite of protocols?

Which TXP components are connect to the Terminal Bus?

Which TXP components other than the ES 680 communicate with it via the
Terminal Bus?

Why does an OT have to communicate with an SU over the Terminal Bus?

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Why is an OT not connected to the Plant Bus?

If the SU and PU functionalitys were combined in one UNIX computer, would


this computer have:
A. Only a CP 1413
B. Only a 3COM Etherlink III
C. Both a CP 1413 and a 3COM Etherlink III

Locate the 3COM Etherlink III card on your OM computer

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Reading I&C Drawings


7

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Reading I&C Drawings


Introduction
Siemens Westinghouse will typically supply drawings as part of the project
deliverables. The drawings incorporate terminology and symbology that may be
unfamiliar to some users. This section will provide the student with some
information on how to read and understand these drawings.
KKS
Unless specified differently by the customer, all Siemens Westinghouse drawings
and documentation will incorporate the Kraftwerk KennzeichenSystem (KKS)
which is German for Power Plant Identification System. KKS tags are used to
represent drawings, equipment, and locations.
Pictured below is a typical description of a KKS drawing (Figure 1).

Figure 1. KKS Designation of Power Plant Drawing

KKS Designation of Equipment Mounting Location


In Figure 2 an example of a KKS structure for identification of mounting location
is shown. The prefix "+" is used to represent mounting location information. The
"." between CJP02 and DC015 is used to identify that DC015 is a module
location within the cabinet CJP02. This identifier is used in the I&C manuals.

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Identification of Mounting Location


+

UBA01 CJP02 . DC015


Module location
Tier = DC
Slot = 015
Cabinet Number
TXP Cabinet 2
Location
Electrical Container 1
Unit 1

Mounting Location Identifier

Figure 2 - Identification of Mounting Location

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Figure 2 shows the overall structure of the KKS mounting location, but in most
cases the numbers used within the drawings are abbreviated in some form or
another. The following list provides some other examples of mounting locations
that are commonly used in the I&C manuals:
+CJP02

This type of number is normally used to identify the cabinet. It can


be found in the drawing title block or on the drawing itself. The
prefix "+ in this case represents the unit number in which this
drawing pertains.

+.DC015

This type of number is used to identify a module. The prefix "+ in


this case represents both the Unit and the cabinet number. The
cabinet number in these cases can be found in the title block of the
drawing.

+.XD007

This type of number is used to identify a Termi-point connection.


Below this number the letters A to H would be listed to show
connection points for the individual signal. The prefix "+" in this
case represents both the Unit and the cabinet number in which the
termi-point is physically located. The cabinet number in these cases
can be found in the title block of the drawing.

Types of Drawings
A typical TXP installation should come with (but not limited to) the following
drawings:

Cabinet Assembly
Power Distribution
Wiring Diagrams (a.k.a. Elementaries)
Control Room Layout
Bus Layout and Terminations
System Layout and Connections

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Cabinet Assembly Drawings
Cabinet assembly drawings typically show the cabinet profiles, location of equipment in
the cabinet, terminal block layout, and any special instructions required for the assembler
to build the cabinet.
Cabinets are typically organized in stations, sometimes referred to as racks or nests by
other vendors. A station may contain an I/O rack such as an ET200, or it may contain
equipment from another vendor. I/O stations generally have slots, where the individual
modules are installed.
Figure 3 is a typical drawing showing the cabinet and layout of the stations. Figure 4
depicts the individual stations in greater detail, indicating item number of parts and
individual module locations or slots.

Power Distribution Drawings


Power distribution drawings show the user how each individual module in the
station is powered. Power to cabinets can be distributed from a single cabinet or
distributed individually. The example in Figure 5 is a cabinet fed redundantly
from a single cabinet.
The first drawing in the set shows the feeds from the power distribution cabinet
wired into terminal blocks with a KKS label. Protection circuitry and alarms are
also shown on the drawing (Figure 5). Thereafter, there will be a drawing for
each individual station in the cabinet showing the power distribution wiring for
each SIM module and the field bus or L2 connection (Figure 6).
Wiring Diagrams or Elementaries
Wiring diagrams may be required to show (1) internal cabinet wiring and/or (2)
field-to-cabinet wiring, similar to an ISA loop sheet (Figure 7). These drawings
may also be generated from the TXP ES680 and are called MSR drawings.
Bus Connection Drawing
Bus connection drawings show the L2 or Profibus connections required for each
station from end to end. These should correspond to the L2 bus label shown on
the power distribution drawings. Figure 8 is an example of a typical bus
connection drawing.

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Module

Intermediate
Terminal

Field Cable

Cabinet Side

Field Side

Figure 3. MSR (loop) Drawing

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TXP-HW Course

Loading Procedures
& Exercise 7
8

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TXP-HW Course

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Loading Procedures
AS 620
CPU 948
If the SYS FAULT light on the CPU 948 is on, the card must be changed. To
change the CPU 948 card proceed as follows:
(There are no dip switch settings on the CPU 948)
Step
1
2
3
4
5

Action required
Power down rack containing
desired CPU
Remove CPU
Insert new CPU with mode
selector switch set to STOP
Power on rack
Hold the RESET switch in the
OVERALL RESET position
while switching the mode
selector switch from STOP to
RUN then release the RESET
switch
Hold the RESET switch in the
RESET position while
switching the mode selector
switch from "STOP to RUN
Then release the reset switch.

Result (LEDs on CPU)

Red STOP LED On


Red INIT LED briefly On
Red BASP On
Red STOP LED On
Red BASP LED On
Green RUN LED On
2. Red STOP LED On
Green RUN LED Off
BASP LED On
CPU as master:
1. Red STOP LED On
Green RUN LED On
2. Green RUN LED On
3. Red BASP Off
CPU as standby
1. Red STOP LED On
Green RUN LED On
2. Red STOP LED Off
Green RUN LED Off
3. Red STOP LED blinks
Green RUN LED blinks
4. Green RUN LED On
5. Red STOP LED briefly On
6. Green RUN LED blinks
Red BASP LED Off
1.

Note: If replacing a CPU in a redundant system, once the general reset is


finished the now reserve CPU will automatically backup from the master.

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TXP-HW Course
The AP should be in run mode before a code transfer is attempted. This is
indicated by a steady green run light on the master and a flashing green run light
on the standby processor.
To load the program in the CPU proceed as follows:
From the main ES 680 menu click on Transfer then AP then Load AP (offline)
as below:

The following menu will appear:

Type in the desired AP number, the name of a protocol file (for later perusal), and
select User and system software, then click on OK.
2
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A check on the previously generated code will now be carried out, if the code is
suitable for transfer you will be prompted, as shown below, to confirm that you
really wish to load code to the AP offline.

8
Click on Yes to begin the loading of code offline to the selected AP. The ES680
will attempt to connect to the AP. An error message at this point will indicate that
an AP reset is required and then the transfer will need to be reattempted. Up to
three overall reset and general reset combinations may be required before the
AP is ready to accept the code, even if the indicating lights on the AP show a
running condition.
At this point the offline handler will take control of the AP and place it in stop.
First it will down load code to the master (A) then it will update the slave (B) CPU.
When the process is complete a pop-up window will appear stating that the down
load is complete. You will need to acknowledge this message by clicking on the
close button in the pop-up window.

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TXP-HW Course
CP 1430
1. Change CP1430 (there are no jumpers to set on the CP 1430)
Switch the rack off containing the desired 1430 card
Pull the old CP1430 card
Put in the new card
Put the Run/Stop-switch into the Run-position
Switch the rack on
2. Obtain MAC-addresses
Launch FUP editor
Open the YDH-drawing
Click on the symbol of the CP1430 you want to change
Open the module properties mask
Read the MAC-addresses. Address 1 is for the primary rack, address 2 for the

standby rack
3. Initialize new CP1430
Hook up the PG740 to the CP1430
Start the S5-software
In the main menu line: select: Change->others
Select the directory COM1430, if not already selected
Select SINEC NCM COMs in this directory
Type in a file name where prompted (must begin with A; e.g. Atest)
Select CP-Functions then Stop from the main menu line. The Stop-light at the
CP should go on
Select Edit then CP Init from the main menu line. Editing of the fields should be
possible
Enter the MAC-address and the Basis SSNR (232 for the primary rack (AP A),
236 for the standby rack (AP B)) and hit F7 (ok)
If the CP 1430 is to be set up as the Clock Master, Select Edit then Clock Init
from the main menu line.
Set the Clock Master Field to Y for yes and hit F7 (ok).
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Select CP-Functions then Start from the main menu line. Both the RUN and
STOP LEDs should be on indicating the CP is not synchronized with the CPU
If the CP 1430 is Clock Master, Select Utilities then Clock Functions
Press F2 to set time. Enter the current date and time (Winter time of the local time
zone must be set; date is in DDMMYY format)

Afterward, LAN code needs to be downloaded to the new CP. It can be done with
the Offline Load of the AP or separately. To accomplish this proceed as follows:
From the main ES 680 menu click on Transfer then LAN then AP as below:

The following menu will appear:

Type in the desired AP number and a protocol file name (for later perusal, then
click on OK
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TXP-HW Course
IM 324R
To change the IM 324R card proceed as follows:

Power down rack containing IM 324R (primary rack)


Remove old card
Set jumper switches on new card (see figure below)

There is only one jumper setting that needs to be checked on this card:
Jumper 1-2 of X101
All other jumpers

Inserted for AG S5-155H


In delivery state

Insert new card


Power rack on

There is no code to transfer to this card

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TXP-HW Course
IM 304
The IM 304 card is used to connect the secondary rack to the primary rack for
redundancy, connecting both the primary and secondary racks to the expansion
rack or connected out to a EU902 FUM rack.
To change the IM 304 card proceed as follows:

Power down rack containing IM 304


Remove old card
Set jumper switches on new card (see figure below)

X11 jumper (for cable connection with IM 324R or IM 314R)


-State upon delivery:
for up to 100 m cable length:
-For IM 304 - IM 324R connection only in an AG S5-155H:

Jumper 3-4
Jumper 1-2

X21/X22 switch (to enable interfaces for the connection with IM 324R or IM
314R)
-State upon delivery with disabled interfaces:
X21 OFF / X22 OFF
-For connection IM 304 with IM 324R (AG S5-155H): X21 ON / X22 OFF
-For connection IM 304 with IM 314R (EG 185U):
X21 ON / X22 ON

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X14 jumper switch (defines the minimum number of inoperable interfaces for
the inoperable I/O message)
-State upon delivery for 1 inoperable interface
Jumper 1-2
-for 2 inoperable interfaces
Jumper 2-3
X15 jumper switch (defines onward routing of the inoperable I/O message)
-State upon delivery
-Inoperable I/O message is routed onwards
Jumper 1--2
-inoperable I/O message is not routed onwards No jumper

Insert new card


Power rack on

There is no code to transfer to this card


Additional information for connection of IM304 to IM614 in EU902 FUM rack.
Jumper settings:
The connection of the function modules to the automation processor requires
jumpers on the IM304 interface madule and encoding switches in the EU 902
rack to be set.

IM304 (interface to EU 902 FUM rack)


The length of the link between the IM304 and the last IM614 interface mdule
in the bus chain must be set on the x!! jumper soclet on the IM304 interface
module.

The X3 of the IM304 interface module must be de-activated via the associated
switch on the front panel if an IM 614 interface is connected ( switch position OFF
from X22)

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On the IM 304 module X11 defines the distance between IM 304 and IM 614
interface modules.

The figure above shows how to select the distance between the IM304 and
IM614 with the X11 jumpers on the IM304 module.
IM 314R
To change the IM 314R card proceed as follows:

Power down rack containing IM 314R (expansion rack)


Remove old card
Set jumper switches on new card (see figure below)

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Jumper settings:
Jumper 1-2 of X5 Inserted
Jumper 1-2 of X7 Must be removed
Jumper 2-3 of X7 Inserted
Jumper of X10 Inserted
Jumper of X101 Inserted
S1 switch settings:
Contacts 1 ... 6

OFF, OFF, OFF, OFF, OFF, ON

Insert new card


Power rack on

There is no code to transfer to this card

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TXP-HW Course
IM 308-C
To change the IM 308-C card proceed as follows:

Power down rack containing IM 308-C


Remove old card
Set jumper switches on new card (see figure below)

Jumper X9 and X10 settings:


X9:
X10

the jumper must be set to position 1-2 for TXP


Position 1-2 if the PROFIBUS-DP interface is operated as
grounded
Position 2-3 if the PROFIBUS-DP interface is operated as nongrounded

Insert new card

Power rack on

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TXP-HW Course
If a new Memory card needs to be programmed proceed as follows:
From the main ES 680 menu select Generators, then AP, then Create ET200
Memory Card for Field devices as shown below:

The following menu will appear:

Type in the desired AP number then click on OK. The following window should
appear if the generation of data was successful:

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After completion of this compiler a file will exist for each IM 308-C card in the
chosen AP with the following naming convention: A0001_01.pbp. The A0001
denotes the AP number (1 in this case), the _01 denotes the line number of the
IM 308-C card (also 1 in this case). To view where the file is stored you need to
choose Edit, then View/Print from the ES680 menu bar as shown below:

Click on Code Generating from the next window, shown below.

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Select the desired AP number (ag0001 in this case)

then transfer and the ET200 datafile (A0001_01.pbp in this case) will be as
shown below:

This is the file location for the IM308-C memeory card


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TXP-HW Course
To be able to program the memory card this file must be put on the PG 740 via a
floppy disk. To accomplish this proceed as follows:

Open a UNIX shell (click on the desktop with the right mouse button, and
select X Terminal as shown below).

Type cd listen/as/agxxxx/transfer then enter (agxxxx will be the number of


the AP you are working with i.e ag0001 in this case). After you hit enter you
will come back to the prompt. Now type ls l to observe the filename you
want to transfer to the floppy disk. An example is shown below:

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TXP-HW Course

With a blank floppy disk in the drive type:


For ES 680 HP workstations: copyIM308Cfiles <AS Number> then enter
(e.g. copyIM308Cfiles 1)
For SCO UNIX machines: doscp <filename> a: then enter (the
filename is the name you listed in the step above) An example is shown
below:

When finished remove floppy from drive and insert into PG 740 floppy drive
On the PG 740 start the COM PROFIBUS software
In the main menu click on File then Import then ASCII File
Select the a drive and double click on the .pbp file
A Result of Conversion window will appear stating no error, no warning
Click on OK
A window will appear showing the Overview of Master Systems, as shown
below.

16
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Highlight the IM308-C card by clicking on it once, failing to do this will result in
not being able to export the file to the memory card in the steps below.
With the new memory card inserted in the MEM CARD slot (right-hand side),
on the PG click on File then Export then Memory Card
In the next screen change the user defined time to 0.20 seconds
With the rack containing the IM308 C card powered down, Insert new memory
card into IM 308-C card
Power the rack on and switch IM 308-C card to RUN

The table below lists the meanings of the mode selector switch on the IM 308-C
card:
Designation

Function

Mode selector
switch

The mode selector switch is a three position switch:


RN (RUN): normal operation; IM 308-C reads the inputs of the slaves and sets the
outputs

ST (STOP): IM 308-C does not exchange data with the slaves; it may, however,
receive the token (send authorization) from another master on the bus and pass
on the token (not applicable in TXP)

OFF: IM 308-C does not exchange data with the slaves and cannot receive token
from another master (not applicable in TXP)

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TXP-HW Course
The table below lists the meaning of the BF LED on the IM 308-C:
BF

Meaning

Remedy

Off

Data exchanged with all


parameterized slaves
Bus fault1 (physical fault)

On

Flashes

No exchange of data with at least


one slave which is assigned to an IM
308-C master

Check:
Whether there is a short circuit on the data
lines of the PROFIBUS
The parameters set with COM PROFIBUS
(different baud rates)
Check whether the bus cable is connected to
the IM 308-C
Wait until the IM 308-C has powered up. If
LED does not cease flashing, check the DP
slaves or interpret the diagnostics report for
the DP slaves.

1 During power-up, the RN, OF, and IF LEDs light up along with the BF LED for approx. 0.5
seconds

The table below lists the meaning of the RN, OF, and IF LEDs on the IM 308-C:
RN

OF

IF

Meaning

Remedy

On

On

On

On

Off

Off

IM 308-C is powering up (BF


LED on also)
Status in Run:
IM 308-C reads the slave
inputs and sets the outputs.

Flashes

Off

Off

IM 308-C parameterizes all


slaves on the bus and checks
their address-ability
Status is Clear:
Afterwards, the IM 308-C
reads the inputs but sets all
outputs to 0.

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TXP-HW Course
ET200M
IM 153-2

To change an IM 153-2 module proceed as follows:

If station is non-redundant, power down the ET 200 station, otherwise,


remove faulty module with the backup module in place

Disconnect L+ and M leads to module

Unplug the PROFIBUS connector from the front of the module

Loosen screw on the bottom of the module and remove it

Set DIP switch address (located on front of the module; see figure below)

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Bus address DIP switch

Insert module onto DIN rail and tighten the fastening screw at the bottom

Reconnect the L+ and M leads

Plug the PROFIBUS connector back into module

20
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TXP-HW Course
ET 200M I/O modules
All of the ET 200M I/O modules can be replaced online. Proceed as follows:

Remove terminating strip on the front of the module by depressing the button
on top while pulling the terminal strip away (see figure below)

ET 200M I/O terminating connector

Loosen screw on the bottom of the module and remove it

Insert new module

Tighten screw on the bottom of the module

Plug in terminating connector

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TXP-HW Course
H1 Star Coupler Cards
Following is a list of applicable star coupler cards and their respective jumper
settings. All Star Coupler cards can be changed online.
ECTP3
The figure below shows the ECTP3 PCB followed by a list of jumper settings:

Switch/jumper settings
The ECTP3 interface card can be used with the as-delivered status. The
following are the settings, which are relevant for TXP and should be used to
check the card settings.
Group disable
(separate the ECTP3 interface card from the star coupler system bus)
In TXP, the 6-fold switch unit DIP6 remains in the OFF position (Group
enabled, this is also the status upon delivery)
The switches 1-5 are irrelevant to TXP
MDI/MDI-X mode
All jumpers in the jumper unit must be plugged into the MDI-X side for
TXP (status upon delivery)
22
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TXP-HW Course
ECAUI
The figure below shows the ECAUI PCB followed by a list of jumper settings:

Switch/jumper settings

Setting the SQE test


In TXP the SQE test (tests the collision detection circuit) must be switched
off. SW1, switch 1 and switch 2 must be set to "OFF" (this is the status
upon delivery).
Activating the port shutdown
The port-shutdown must be switched off in TXP. SW1, switch 3 and switch
4 must be set to "OFF" (this is the status upon delivery). Switch 5 of SW1
is irrelevant to TXP.

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TXP-HW Course
OYDE-S C
The figure below shows the OYDE -S PCB followed by a list of jumper settings:

Diagnosis LEDs on the PCB


The PCB LEDs are only visible if the plug-in slot to the right of the interface card
is not occupied. If the red front-panel CD-LED shows steady light the PCB LEDs
2-5 indicate a specific diagnosis of the present fault. The following table lists the
faults indicated by the LEDs:
LED no.
1
2

Response
Red light
Red light

Yellow light

Red light

All

Off

Description
Fragment extension is active
Send and receive paths in the send direction
are blocked since data packet is too long
(jabber control is active)
Segmentation due to more than 64 subsequent
collisions
Receive path in the receive direction is blocked
since data packet is too long
Separated on the management stations
request

24
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Switch settings
The transmitter power, IDLE/low light, and operating mode are set via switch unit
SW1.
How to set the optical transmitter power
The optical transmitter power of the OYDE-S C must be adapted to the length of
the FO cable used. It is set by the switches 1, 2, and 3 of SW 1. The transmitter
power can be set in three ratings.
OYDE-S C interface cards interconnected via an FO path must be set to the
same optical transmitter power. The ratings are listed in the table below:
Transmitter
power rating
Rating 1
Rating 2
(status upon
delivery
Rating 3

Launchable
optical
power
12 dBm
18 dBm

Typical bridgeable distance

SW1,
switch 1

SW1,
switch 2

SW1,
switch 3

Up to 2,000m
Up to 4,000m

On
On

Off
On

Off
Off

22 dBm

Up to 4,500m

On

On

On

IDLE/low light function


The IDLE/low light function is set using SW1, switch 4:
The switch setting required in TXP is "off" (this means, low-light enabled and is
the status upon delivery). This setting must not be changed.

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TXP-HW Course
Operating mode
The operating mode of the OYDE-S C interface card is set using SW1, switches
5, 6, and 7 according to the following table:
Operating mode

TXP setting if.

Standard
operating mode
(status upon
delivery)

a normal FO path
is to be operated via
this OYDE-S C (i.e.
an FO path which
connects bus
participants or
another star coupler)
a redundant FO
path is to be
operated via this
OYDE-S C (i.e. an
FO path between
two star couplers
which closes the
virtual ring)1

Redundant mode

SW1,
switch 4

SW1,
switch 5

SW1,
switch 6

SW1,
switch 7

Off

Off

Off

Off

Off

Off

Off

On

The OYDE-S C modules located at both ends of a redundant FO path must


both be switched to the redundant mode.
Additional switches/jumpers
In addition to the switches described above no additional switches must be
operated and no additional jumpers inserted on the OYDE-S C interface card.
The settings of the other switches/jumpers on the PCB must retain their status
supplied upon delivery and must not be changed.
Switch 8 of SW1 is irrelevant to TXP.

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TXP-HW Course
ECFL2
The figure below shows the ECFL2 PCB followed by a list of jumper settings:

The table below lists the DIP2 switch settings:


Operating
mode
Standard
operating
mode
(status upon
delivery)
Redundant
mode 2

TXP settings if

Setting for port 1

a normal FO path is to
be operated via this
ECFL2 (i.e. an FO path
which connects a bus
participant or another star
coupler)
a redundant FO path is
to be operated via this
ECFL2 (i.e. an FO path
between two star couplers
which closes the virtual
ring)1

Setting for port 2

DIP2,
switch 1

DIP2,
switch 2

DIP2,
switch 3

DIP2,
switch 4

On

Off

On

Off

On

On

On

On

Only one port at one ECFL2 of the two connecting ports of the ECFL2
modules located at both ends of a redundant FO path must be switched to
redundant mode 2. The other ports remain in the standard operating mode.
Note The switch S5 of DIP2 and the entire DIP1 are irrelevant to TXP.

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TXP-HW Course
ECFL4
The figure below shows the ECFL4 PCB followed by a list of jumper settings:

The table below lists the DIP2 switch settings:


Operating
mode
Standard
operating
mode
(status
upon
delivery)
Redundant
mode 2

TXP settings if

a normal FO path is to
be operated via this port of
the ECFL4 (i.e. an FO path
which connects to another
bus participant or to
another star coupler)
a redundant FO path is
to be operated via this port
of the ECFL4 (i.e. an FO
path between two star
couplers which closes the
virtual ring)1

Setting for port 1

Setting for port 2

DIP2,
switch 1

DIP2,
switch 2

DIP2,
switch 3

DIP2,
switch 4

On

Off

On

Off

On

On

On

On

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The table below lists the DIP3 switch settings:
Operating
mode
Standard
operating
mode
(status
upon
delivery)
Redundant
mode 2

TXP settings if

Setting for port 3

a normal FO path is to
be operated via this port of
the ECFL4 (i.e. an FO path
which connects to another
bus participant or to
another star coupler)
a redundant FO path is
to be operated via this port
of the ECFL4 (i.e. an FO
path between two star
couplers which closes the
virtual ring)1

Setting for port 4

DIP3,
switch 1

DIP3,
switch 2

DIP3,
switch 3

DIP3,
switch 4

On

Off

On

Off

On

On

On

on

Only one of the two ECFL4 modules located at both ends of a redundant FO
path must be switched to redundant mode 2.
Note The switch S5 of DIP2, DIP3, and the entire DIP1 are irrelevant to TXP.

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HSSM and MIKE cards
The HSSM and MIKE cards are for special applications only. Please refer to the
product manuals provided with the project.
Interface Module for PROFIBUS--DP (Optical Network Component)
If more than one station (up to 8) is involved, the PROFIBUS--DP bus system is
set up for example as a ring network. AP and ET 200 stations are connected via
Optical Link Modules (OLM) (see figure below). The OLM connects either to
copper core cables or to fiber--optic cables. IM 308--B/C modules and ET 200
stations are connected via copper core cables. Fiber--optic cables may be used
for the connections between the OLMs. These optical leads may be made from
plastic or glass. The maximum cable length is 1,400 me-ters for glass fiber--optic
and 25 meters for plastic leads (provided that the bus components are used that
are specified for PROFIBUS--DP (FO) in the IK 10 catalog /19/). Please refer to
the applicable documents /12/, /19/ for further information.

Connecting ET 200 stations via PROFIBUS--DP OLM

30
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Test/Exercise 7
G

Assemble your AS 620 system based on the YDR diagrams

Configure the CP 1430 communications processor for your AS 620

Configure the IM 308 card for your ET 200 station

Install the CPU 948R processor in your AS 620

Power up your AS 620 and load all necessary code

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Preventive Maintenance
& Exercise 8

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Preventative Maintenance
Maintenance of AS 620 Components
Replacing the Lithium Battery in the Central Rack ZG 155H
Warning
Lithium batteries can explode when incorrectly handled. If they are not properly disposed
of toxic substances may be released. So please note: Do not throw new or discharged
batteries into open flames and do not solder the cell body. Do not recharge the battery!
Only the replacement batteries from SIEMENS should be used. This will ensure that your
battery is short-circuit proof. The Lithium battery is subject to the regulation for dangerous
goods. When shipping batteries reuse the original packing material. Old batteries should
be returned to the manufacturer/recycler or properly disposed of as toxic waste. The
regulations for the transportation of dangerous goods must be observed.
To be carried out when?
- If necessary battery failure indicated by: "Fault" LED + OM alarm
Caution:
Be sure to use the correct polarity when installing the batteries!
The batteries can be replaced without data loss if the power supply unit is switched on.
The left LED is allocated to the left battery and the right LED to the right battery.
Procedure:

Open the black battery lid located at the top of the module front panel

Replace the empty battery

Ensure correct polarity

Close the battery door

Press the "Reset" key of the power supply module (the yellow "Fault" LED goes out)

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Replacing the fan in the ZG 155H
To be carried out when?
Every 50,000 h and
If necessary fan failure indicated by: LED "F 1 or "F2" or "F3"+ OM alarm
The fan can be replaced without data loss if the power supply unit is switched on.
Note:
The existing three fans work in 2-out-of-3 redundancy, which means that the failure of one
fan is tolerated. In which case the other two fans increase their load

Procedure:

Open the two quick-release locks at the front of the row of fans by turning a screwdriver
in the anti-clockwise direction a quarter turn (see Figure below)
Grasp the bottom cover plate with both hands, press it slightly down and completely
remove it from the row of fans
Unlock the fan to be replaced by pressing the fan handle away from the casing using
your thumb
Remove the fan to be replaced (the other two fans increase their load). Insert the new fan
until it latches into position (see Figure on next page). The associated red "F X" LED of
the fan automatically goes out
Insert the bottom cover plate and press it upwards
Tighten the quick-release locks by turning a screwdriver in clock-wise direction a quarter
turn

FAN 1

FAN 2

FAN 3

Fan insert for ZG 155 H, for item a please refer to another chapter

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FAN

Fan insert including fan

Replacing the dust filter in the ZG 155H


To be carried out when?
Annually and
If necessary indicated by: the red LEDs "F1", "F2", "F3".
The dust filter can be replaced while the ZG is in operation
Procedure:

Open the two quick-release locks at the front of the row of fans by turning a screwdriver
in the anti-clockwise direction a quarter turn (see Figure below)
Grasp the bottom cover plate with both hands, press it slightly down and completely
remove it from the row of fans
Flip the filter cassette downward and remove it by pulling it forward
The filter frame is fastened to either the bottom cover plate or to the far edge of the
bottom cover plate by snap hinges and snaps. The filter mats are attached to the filter
frame. To remove the filter frame proceed as follows:

FILTER
FRAME
COVER

Filter frame in the fan insert

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The filter frame can then be removed from the snap hinges
Install the new filter frame in the reverse order
Put the bottom cover plate back in and press it upwards
Tighten the quick-release locks by turning a screwdriver in the clock-wise direction a
quarter turn (see Figure above)

Power supply module 6ES5955 (for ZG/EG 155H)


Switch off the power supply before you remove or insert the module!

In a redundant AP, replacement can be carried out while the AP is in operation.


This does not apply to single-channel couplings to SIM components (F SIM, B
SIM), ancillary plant systems and AS620 T (SIMADYN). In a non-redundant AP,
replacement leads to a failure of the AS functions.

If the automation device (ZG or EG) has an IM 308 for coupling ET 200 stations,
the IM 308 must be switched to "STOP" prior to switching off the power supply!
Otherwise outputs on the ET 200 might stay set thus leading to hazardous plant
statuses! After switching on the power supply the IM 308 must be switched back
to "RUN"

Replace the module as follows:

Switch off the voltage supply to that half of the sub-rack containing the defective
voltage supply module (make sure you switch off the correct miniature circuit
breaker!). Provide all cables connected to the front-panel connections with labels
or refer to the TELEPERM XP AS 620 system manual 6DP6200-1DA01, section
10 "Setting up, Installation" for the wiring

Loosen the cables. Rotate the lower screw by 90 to unlatch the module and pull
the lug to remove the module from the central device

Set the configuration switch located at the right-hand side of the power supply
module to the desired position on the new module. The meaning of the switch
positions is shown in the Figure on the next page

Push the Lithium batteries in observing correct polarity

Plug the new module into the plug-in slot of the defective module and properly
connect all cables to the front-panel connections according to your labels or as
described in the TELEPERM XP AS 620 system manual 6DP6200-1DA01,
register 10 "Setting up, Installation"

Switch on the voltage supply of the central device (indicated on the CPU 948 by
the red "Stop" LED flashing and the red "BASP" LED steady lit

Carry out a general reset on the CPU: Keep the "reset" switch in the "reset"
position while changing the operating mode switch from "RUN" to "STOP" and
back to "RUN" again

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In redundant APs a restart is initiated followed by an automatic update from the


still intact redundant partner. After the update the green "RUN" LED starts
flashing. Basic initialization of the CP 1430 will have to be performed (a
programmer with COM 1430 is required) and then a LAN transfer from the
ES680. In non-redundant APs overall code from the ES 680 must also be
transferred into the AS

Configuration switches and their settings (default in bold letters)

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Maintenance of Bus Components
Note:
To clean the casing of bus components either use a vacuum cleaner or wipe it using a
soft, dry cloth. Do not use water or solutions. Fan and fan grilles shall be cleaned using a
vacuum cleaner only

The table below lists the regular maintenance activities for the bus components:
Device
Star coupler

Affected
Ventilation slots at
the bottom and top
of the star coupler
casing
Voltage supply

Power packs
Dummy plates
Star coupler
interface
cards

OLM

Connections

Maintenance interval
Once per year

Check the power supply cable for


firm connection. Inspect the supply
cables for proper installation,
tension relief or damage
Visually inspect the operation
LEDs of the power pack
Check for completeness and
proper installation
Check the LAN cables (FO cable,
drop cable, and/or ITP cable) for
firm connection

Once per year or


immediately after
installation work in the
vicinity
Once per year

Unused FO ports

Check whether dummy plugs are


present on the unused FO ports

Fastening

Check the installation of the snapon top-hat profile rail and the
OLMs
Check the terminal base, the cable
fastening and the installation

24V voltage
supply
Connections

Checks/maintenance
Ensure free air flow in and out,
vacuum off accumulated dust if
present

Check the LAN cables (FO and


ITP cable) for firm connection and
installation

Once per year


Once per year or
immediately after
installation work in the
vicinity
Once per year
Once per year
Once per year or
immediately after
installation work in the
vicinity
Once per year or
immediately after
installation work in the
vicinity

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Maintenance of OM 650 and ES 680 Components
As discussed in earlier chapters all OM 650 components and the ES 680 are
computer-based components. Depending on the environment the computers are
in, dust can accumulate on the internal components of the computer. Periodic
removal of this dust should be a part of the preventive maintenance plan.
Documentation of the I&C system computers in a plant forms an integral part of
the I&C system maintenance. However, the computer hardware and software are
subject to upgrading and updating. All hardware and software changes must be
documented.
Siemens Westinghouse recommends that a profile of each TXP computer is kept
describing the status of the current equipment of the computers (see below).
Computer Profile
Plant:

Administrator:
Phone:

Common Data
Computer type:

Date of installation:

Host name:

IP address:

LAN 1 address:

LAN 2 address:

HW serial no.:

Software ID:

HW equipment:
Hard drives:

RAM:

Tape device:

Software Installation
Function:
Operating system:
q Ingres release:
q ES 680
release:
q Dynavis X release:
Logins and Passwords
Login
q
q
q
q
q

license:
license:
license:
Password

root
ingres
txpom
txpes
<project login>

User
system administrator
ingres administrator
OM650 administrator
ES680 administrator
Project administrator

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Proceed as follows to determine the values of the fields in the computer profile:
Host name
OM 650 PC (SU, PU, OT, etc.)
From UNIX shell type hostname

ES 680 workstation
From UNIX shell type hostname

IP address
OM 650 PC (SU, PU, OT, etc.)
From UNIX shell type ping <hostname>

ES 680 workstation
From UNIX shell type /etc/ping <hostname>

LAN address 1 and 2


OM 650 PC (SU, PU, OT, etc.)
Located in equipment documentation provided
with project or contact the Assembling Center

ES 680 workstation
From UNIX shell type /etc/lanscan

HW serial no.
OM 650 PC (SU, PU, OT, etc.)
Printed on back of machine

ES 680 workstation
Printed on back of machine

HW equipment: Hard drives


OM 650 PC (SU, PU, OT, etc.)
Located in equipment documentation provided
with project or contact the Assembling Center

ES 680 workstation
Located in equipment documentation provided
with project or contact the Assembling Center

HW equipment: RAM
OM 650 PC (SU, PU, OT, etc.)
Reboot machine:
logged in as root type: init 6

ES 680 workstation
Reboot machine:
logged in as root type: shutdown r y 0

Software Installation
OM 650/ ES 680 PC (SU, PU, OT, etc.)
Operating system: SCO Open Server 5.0.4
w/patches Ingres release: from an Hpterm
type: sql <database name>
Ingres license: Type ingprenv write down
II_AUTHORIZATION
ES 680 release: upper right-hand corner of
main menu
ES 680 license: in file
/Install/txpes/sw/sw7.0.SCO/config/lizenz/STA
RTMENU
DYNAVIS-X release: DYNAVIS-X Domain rel.
in MMI editor protocol window
DYNAVIS-X license: in file
/install/dyx/etc/DYNAVIS.LIC.<machine name>
8

ES 680 workstation
Operating system: HP-UX 10.20 w/patches
Ingres release: from an Hpterm type: sql
<database name>
Ingres license: Type ingprenv write down
II_AUTHORIZATION
ES 680 release: upper right-hand corner of
main menu
ES 680 license: in file
/Install/txpes/sw/sw7.0.HP800/config/lizenz/ST
ARTMENU
DYNAVIS-X release: DYNAVIS-X Domain rel.
in MMI editor protocol window
DYNAVIS-X license: in file
/install/dyx/etc/DYNAVIS.LIC.<machine name>

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Logins and Passwords
OM 650 PC (SU, PU, OT, etc.)
root: roots1
txpom: /1txpom
txpes: /1txpes

ES 680 workstation
root: <machine model no.> (e.g. 715/80hp)
ingres: ca123
project admin: (given at turn-over)

In addition to a profile of every computer, backups should be made of data stored


on the individual component. Proceed as follows to make backups of pertinent
data:
OM 650 (SU, PU, OT, CU) Hard Drive Backup
Boot and root diskettes of SCO version 5 are available from the AC which allow
you to save or restore the entire hard disk content of a PC including version 3.
Note: The SCSI-ID 2 must be set before POWER ON of the external drive if it can be set at the
external DAT drive!
Due to the initializing procedure on the SCSI bus it may occur that the call-up is rejected up to
twice when addressing the DAT drive and a HW fault alarm is output! If the hardware is intact
the third attempt normally is successful.

Requirements:

OM component with a DAT drive (DAT tape 120m)

(internal DAT or external DAT with SCSI address 2)


Ensure that the OM component is shut down and switched off

To Generate a backup tape (OT, PU, SU, CU):


Insert the boot diskette SCO R5.0.4 and switch on the machine => Boot from
diskette
On boot: Press the RETURN key
=> Starts booting
Follow the dialog and then insert the ROOT diskette SCO R 5.0.4
Om.Backup
=> Backup generated
haltsys
=> Shut down the machine

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To load the backup tape (OT, PU, SU, CU):
Insert the boot diskette SCO R5.0.4 and switch on the machine => Boot from
diskette
On boot: Press the RETURN key
=> Starts booting
Follow the dialog and then insert the ROOT diskette SCO R 5.0.4
Om.Restore
=> Restore is generated
haltsys
=> Shut down the machine
ES 680 Database Backup
Command Sequence for Creating a Database Backup

Log in as project administrator


Exit out of TXP ES 680 software
Type esMonitor.sh stop
mkdir <backup directory> (e.g. /tmp/save; observe the free disk space!)
cd <backup directory>
unloaddb -c <project name>
unload.ing

The backup so created can be saved on tape with the following commands:

With the current directory one level above backup directory (e.g. if
backup directory is /tmp/save current directory must be /tmp)
Type tar cfv /dev/rStp0 <backup directory> (e.g. tar cfv /dev/rStp0
save)

Command sequence for loading a database backup

Log in as project administrator


Exit out of TXP ES680 software
Read in the tape with the backup under the same path as used for reading
out (e.g. /tmp/save)
With the current directory /tmp type tar xfv /dev/rStp0
Type esMonitor.sh stop
destroydb <database name>
createdb -d<database name> <database name>
cd <backup directory>
reload.ing

10

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Test/Exercise 8
G

Locate the Lithium batteries on your 155 rack

Remove and replace one of the fans in your 155 rack

Fill in the necessary information on the computer profile sheet for both the
OM CU and ES workstation (if applicable)

Perform a database back-up of the ES 680 database

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Trouble Shooting & Exercise 9

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Troubleshooting
Troubleshooting of AS 620 components
On occurrence of component faults the DS 670 provides information about the
fault location and the present fault in an optimal manner. If a DS 670 is not
present the lamp alarms and LEDs of the components described below can be
used to determine which necessary fault elimination measures are required.
Central rack (ZG) and Expansion rack (EG) 155H
Indicated by: Yellow Fault LED on the power supply module is lit and OM Alarm
Replace the Lithium battery
Indicated by: the RED LEDs F1, F2, or F3 are lit and OM Alarm
Replace the fan
Indicated by: the RED LEDs F1, F2, or F3 are lit
Replace the dust filter
Indicated by: the RED LEDs F1, F2, or F3 are flashing
Replace the dust filter
Indicated by: the green 5V LED on the power supply module is not lit
Check the voltage supply. If it is O.K. replace the power supply module.
Indicated by: the green 24V LED on the power supply module is not lit
Check the voltage supply. If it is O.K. replace the power supply module.
Indicated by: Fan shutdown and none of the red LEDs F1 ,F2, and F3 on the
fan insert front are lit
Replace the fuse in the fan insert.

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CPU 948
Indicated by: the RED SYS FAULT LED is lit
Replace the CPU 948
Indicated by: the RED STOP LED is lit and the RUN/STOP switch is in the RUN
position
Check I&C ASD
De-energize the Central rack; wait for approx. 1 min.; Re-energize the rack;
execute a general reset and restart switches; CPU should go to RUN again
In all other cases please contact Siemens Westinghouse HOTLINE
IM 304
Indicated by: the RED FAULT LED is lit since the connection to the partner
module is interrupted
Check the 721-connector cable. If it is okay replace the IM 304
IM 324R
Indicated by: the green ON LED is not lit
Check the voltage supply of the Central rack, If it is okay replace the IM 324R
CP 1430
Indicated by: the RED FAULT LED is lit
Replace the CP 1430
Indicated by: the green Fault15V LED is not lit
Check the Central rack (source of the 15V voltage supply). If it is okay replace
the CP 1430
Indicated by: the RED STOP LED is lit and the RUN/STOP switch is set to RUN
Determine the status using the PG 740 and COM 1430; Invoke COM 1430 ->
CP functions -> Status -> if status is STOP -> set to RUN

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IM 308
Indicated by: the RED IF LED is lit
Replace the IM 308
Indicated by: the RED BF LED is lit
The connection to the subordinate station has failed. Voltage failure of the
subordinate station
IM 314 R
Indicated by: the green ON LED is not lit
Check the voltage supply of the expansion rack. Check 721-connector cable.
Troubleshooting of Bus components
The TXP bus system consists of:

Transmission media (optical virtual ring, optical or copper cables in star


configuration)
Active bus components (star couplers, OLMs, CPs, bridges)
Software (drivers, CP databases, operating software for the bridge and MIKE)
Time components
Communications functions (protocol procedures)

Faults that occur within these component groups are signaled either directly or
indirectly. The tables below list possible fault causes and alarm locations:

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Cabling
Fault
Interruption

Fault due to failing to meet


installation, commissioning,
operation, or planning
guidelines

Possible cause
Loose
connections/plugs
Torn apart
Crush
Strain too high
Wrong polarity
Minimum bend radius
limit exceeded
Excessive length
Impermissible
extension
Electromagnetic faults
Equalizing currents on
the shield (insufficient
ground potential
equalization)

Signaled via..
Interface card LEDs1
DS 670 (optional)
ASD via HSSM (optional)
ASD, indirectly
(connection failure)

Possible cause
Power pack failure
Failure of supply
voltages
Blown fuse

Signaled via..
Interface card LEDs1
DS 670 (optional)
ASD via HSSM (optional)
ASD, indirectly
(connection failure)
Interface card LEDs1
DS 670 (optional)
ASD, via HSSM (optional)
ASD, indirectly
(connection failure)
ASD, directly (blown fuse)

Interface card LEDs1


DS 670 (optional)

Star Couplers
Fault
Voltage supply failure

Fault due to failing to meet


installation, commissioning,
operation, or planning
guidelines

Module failure

Minimum bend radius


limit exceeded
Excessive length
Impermissible
extension
Electromagnetic faults
Equalizing currents on
the shield (insufficient
ground potential
equalization)
Back-panel bus failure

Fault due to failing to meet


installation, commissioning,
operation, or planning
guidelines

Overheating

Interface card LEDs1


DS 670 (optional)
ASD, via HSSM (optional)
ASD, indirectly
(connection failure)
Interface card LEDs1
DS 670 (optional)
ASD, via HSSM (optional)
ASD, indirectly
(connection failure)

See chapter 4 of this manual for meaning of LEDs on individual cards

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Optical Interface cards
Fault
Module failure

Fault due to failing to meet


installation, commissioning,
operation, or planning
guidelines

Possible cause
Failure of
send/receive section
of the optical ports
Reduced performance
of the send/receive
section
Partial/total failure of
the module logic
Wrong switch setting

Signaled via..
Interface card LEDs1
DS 670 (optional)
ASD via HSSM (optional)
ASD, indirectly
(connection failure)

Possible cause
Failure of
send/receive section
of the electrical ports
Partial/total failure of
the module logic
Wrong switch setting

Signaled via..
Interface card LEDs1
DS 670 (optional)
ASD via HSSM (optional)
ASD, indirectly
(connection failure)
Interface card LEDs1
DS 670 (optional)
ASD via HSSM (optional)
ASD, indirectly
(connection failure)

Interface card LEDs1


DS 670 (optional)
ASD via HSSM (optional)
ASD, indirectly
(connection failure)

Electrical Interface cards


Fault
Module failure

Fault due to failing to meet


installation, commissioning,
operation, or planning
guidelines

Supervisory Module (HSSM)


Fault
Module failure
Fault due to failing to meet
installation, commissioning,
operation, or planning
guidelines

Possible cause
Partial/total failure of
the module logic
Wrong switch setting
Faulty connection of
the relay outputs

Signaled via..
HSSM LED
ASD via HSSM (optional)
HSSM LED
ASD via HSSM (optional)

Possible cause
Partial/total failure of
the module logic
Program fault

Signaled via..
MIKE LEDs
DS 670 (optional)
MIKE LEDs
DS 670 (optional)
MIKE LEDs
DS 670 (optional)

10

Management card (MIKE)


Fault
Module failure
Program fault
Fault due to failing to meet
installation, commissioning,
operation, or planning
guidelines

Faulty address setting


Faulty
parameterization

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OLM (Optical Link Module)

Fault
Voltage supply failure

Possible cause
Failure of the supply
voltages
Blown fuse
Power failure

Module failure

Send/receive section
failure of the optical
ports
Send/receive section
failure of the electrical
ports
Reduced performance
of the optical
send/receive section
Partial/total failure of
the module logic

Possible cause
Failure of the supply
voltages
Blown fuse
Power failure

Signaled via
Module LEDs
ASD via alarm contact
(optional)
ASD, indirectly
(connection failure)
ASD, directly
(blownfuse)
Module LEDs
ASD via alarm contact
(optional)
ASD, indirectly
(connection failure)

OSM (Optical Switch Module)

Fault
Voltage supply failure

Module failure

Send/receive section
failure of the optical
ports
Send/receive section
failure of the electrical
ports
Reduced performance
of the optical
send/receive section
Partial/total failure of
the module logic

Signaled via
Module LEDs
ASD via alarm contact
(optional)
DS670 (optional (1))
Telnet or browser
SMTP
ASD, indirectly
(connection failure)
ASD, directly
(blownfuse)
Module LEDs
ASD via alarm contact
(optional)
DS670 (optional (1))
Telnet or browser
SMTP)
ASD, indirectly
(connection failure)

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Troubleshooting of OM 650 components
Each OM computer has an extensive collection of software troubleshooting tools
installed on them. All of these tools can be found under the login txpom in the
search path. Following is a few of the most commonly used tools that are used to
locate communications problems within the OM system:
PL Indicating the Status of the OM Components and OM Managers
Syntax
PL [-t] [-1]
DESCRIPTION
The current statuses held by the infrastructure are indicated for the OM
components and the object managers. The indication is from the view of the local
OM component, i.e. the OM component on which PL has been invoked.
If option -1 is not provided, the representation is updated in a 6-seconds cycle.
To deselect cyclic output press the Del key
If option t is selected the time synchronization status is displayed as shown in
the example below:
w01cu1 SyncState: OK
StLTK OmKomp Time StOMK MMI ASR MAC ARC BDM LZA NTB PRT
akt
w01cu1
okay fue
fue fue fue fue fue fue fue fue

In this example, w01cu1 is the hostname of the OM component. The Time


column indicates that the time synchronization is okay. The fue status of the
individual object managers denotes that all are running properly. If all object
managers are not fue please contact the HOTLINE for assistance.

10

pas indicates starting


anf indicates initialization
fue indicates running Master
akt indicates active standby
abg indicates not working

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rdb Reading out the AS620B Component Status
Syntax
rdb
DESCRIPTION
For basic troubleshooting of AS communication problems, only use function 3
without checking with the HOTLINE first. Although the other functions are not
blocked they should only be used by HOTLINE personnel.
FUNCTION 3:

This function is used to indicate the status of the


communication connections to the AS620B at a point in time

Example of function 3:
TXP system comprising four AS620B components in total: AS1 AS2 AS3 AS4.
The AS2 component is not available.
rdb <RETURN>
3
Function 3
3
3-second cycle
0
No storage in a file
Output:
AS
index
00
01
02
03

Status
fc000710
08000008
f4000710
ec000710

TTD
Tel No.
1423
0
4628
2904

Anz.
GAanf
0
0
1
0

Update
ToSS
1
0
589
6

The status word fc000710 indicates all communications with the associated AS
are functioning correctly. If the status word does not show fc000710 the
HOTLINE should be contacted for assistance.

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TXP-HW
Test/Exercise 9
G

Power on your OM system and determine whether all of the Object Managers
are running properly. What program is used to accomplish this?

Determine the status of the connection with the AS 620. What tool is used to
accomplish this?

While monitoring the connection unplug the plant bus cable from the CP
1430. What did the status change to?

10

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TXP-HW Course

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Glossary of Terms

11

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Glossary of Terms:
Abbreviation

Definition

AP

Automation Processor

AS620B
AS620F
AS620T

Automation System (Basic)


Automation System (Fail Safe)
Automation System (Turbine Controller)

ARC

Short Term Archive

ASR

Automation System Representative

AUI

Attachment Unit Interface

BDM

Text Data-base Manager

CPU

Central Processing Unit

CSMA/CD

Carrier Sense Multiple Access / Collision Detection

CU

Compact Unit

DAT

Digital Audio Tape

DS

Diagnostic Station

DTE

Data Terminal Equipment

ES

Engineering Station

ESM

Electrical Switching Module

F.O

Fiber Optic

FTP

File Transfer Protocol

FUM

Function Module

GUI

Graphical User Interface

ISO

International Organizations for Standards


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ITP

Industrial Twisted Pair

LAN

Local Area Network

LZA

Long Term Archive

MAC

Media Access Control (Ethernet MAC Address)

MMI

Man Machine Interface

MMT

Multi Media Terminal

NIC

Network Interface Card

NTB

Notebook

OLM

Optical link Module

OSM

Optical Switching Module

OSI

Open Systems Interconnection

OT

Operating Terminal

PRT

Log Function

PU

Processor Unit

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RAM

Random Access Memory

ROM

Read Only Memory

SCSI

Small Computer System Interface

SCO

Santa Cruz Operating System

SIM

Signal Input Module

SU

Server Unit

TCP/IP

Transmission Control Protocol/ Internet Protocol

TFTP

Trivial File Transfer Protocol

TTD

Time Tagged Data

TSAP

Transport Service Access Points

11

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