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DATA SHEET
book, halfpage
M3D088
2002 Feb 04
Philips Semiconductors
Product specification
FEATURES
Low current (max. 100 mA)
PIN
DESCRIPTION
base
emitter
collector
handbook, halfpage
3
3
MARKING
TYPE NUMBER
MARKING CODE(1)
BC856
3D*
BC856A
3A*
BC856B
3B*
BC857
3H*
BC857A
3E*
BC857B
3F*
BC857C
3G*
BC858B
3K*
2
1
Top view
Fig.1
Note
1. * = -: made in Hong Kong.
* = t: made in Malaysia.
2002 Feb 04
2
MAM256
Philips Semiconductors
Product specification
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 60134).
SYMBOL
VCBO
VCEO
PARAMETER
collector-base voltage
CONDITIONS
MIN.
MAX.
UNIT
open emitter
BC856
80
BC857
50
BC858
30
BC856
65
BC857
45
BC858
30
collector-emitter voltage
open base
VEBO
emitter-base voltage
open collector
IC
100
mA
ICM
200
mA
IBM
200
mA
Ptot
250
mW
Tstg
storage temperature
65
+150
Tj
junction temperature
150
Tamb
65
+150
Tamb 25 C; note 1
Note
1. Transistor mounted on an FR4 printed-circuit board, standard footprint.
THERMAL CHARACTERISTICS
SYMBOL
Rth j-a
PARAMETER
thermal resistance from junction to
ambient
CONDITIONS
in free air; note 1
Note
1. Transistor mounted on an FR4 printed-circuit board, standard footprint.
2002 Feb 04
VALUE
UNIT
500
K/W
Philips Semiconductors
Product specification
CHARACTERISTICS
Tamb = 25 C; unless otherwise specified.
SYMBOL
ICBO
PARAMETER
CONDITIONS
UNIT
15
nA
100
nA
BC856
125
475
BC857
125
800
BC856A; BC857A
125
250
220
475
BC857C
420
800
VEB = 5 V; IC = 0
hFE
DC current gain
IC = 2 mA; VCE = 5 V
VBE
MAX.
VCB = 30 V; IE = 0
VBEsat
TYP.
VCB = 30 V; IE = 0;
Tj = 150 C
IEBO
VCEsat
MIN.
base-emitter voltage
IC = 10 mA; IB = 0.5 mA
75
300
mV
250
650
mV
IC = 10 mA; IB = 0.5 mA
700
mV
850
mV
IC = 2 mA; VCE = 5 V
600
650
750
mV
IC = 10 mA; VCE = 5 V
820
mV
Cc
collector capacitance
VCB = 10 V; IE = Ie = 0;
f = 1 MHz
4.5
pF
fT
transition frequency
VCE = 5 V; IC = 10 mA;
f = 100 MHz
100
MHz
noise figure
IC = 200 A; VCE = 5 V;
RS = 2 k; f = 1 kHz;
B = 200 Hz
10
dB
Note
1. Pulse test: tp 300 s; 0.02.
2002 Feb 04
Philips Semiconductors
Product specification
MGT711
500
MGT712
1200
VBE
(mV)
1000
handbook, halfpage
handbook, halfpage
hFE
400
(1)
(1)
800
300
(2)
600
(2)
200
(3)
400
(3)
100
200
0
102
101
10
0
102
102
103
I C (mA)
101
BC857A; VCE = 5 V.
(1) Tamb = 150 C.
(2) Tamb = 25 C.
(3) Tamb = 55 C.
BC857A; VCE = 5 V.
(1) Tamb = 55 C.
(2) Tamb = 25 C.
(3) Tamb = 150 C.
Fig.2
Fig.3
MGT713
104
handbook, halfpage
VCEsat
(mV)
1200
VBEsat
(mV)
1000
103
800
10
102
103
I C (mA)
MGT714
handbook, halfpage
(1)
(2)
(3)
600
102
400
(1)
200
(3) (2)
10
101
10
0
101
102
103
I C (mA)
Fig.4
Fig.5
2002 Feb 04
10
102
103
I C (mA)
Philips Semiconductors
Product specification
MGT715
1000
MGT716
1200
VBE
(mV)
1000
handbook, halfpage
handbook, halfpage
hFE
800
(1)
800
600
(2)
(1)
600
400
200
0
102
101
(2)
400
(3)
200
10
(3)
0
102
102
103
I C (mA)
101
BC857B; VCE = 5 V.
(1) Tamb = 150 C.
(2) Tamb = 25 C.
(3) Tamb = 55 C.
BC857B; VCE = 5 V.
(1) Tamb = 55 C.
(2) Tamb = 25 C.
(3) Tamb = 150 C.
Fig.6
Fig.7
MGT717
104
handbook, halfpage
VCEsat
(mV)
1200
VBEsat
(mV)
1000
103
800
10
102
103
I C (mA)
MGT718
handbook, halfpage
(1)
(2)
600
(3)
400
102
(1)
200
(3) (2)
10
101
10
0
101
102
103
I C (mA)
Fig.8
Fig.9
2002 Feb 04
10
102
103
I C (mA)
Philips Semiconductors
Product specification
MGT719
1000
MGT720
1200
VBE
(mV)
1000
handbook, halfpage
handbook, halfpage
hFE
(1)
800
(1)
800
600
(2)
(2)
600
400
400
(3)
(3)
200
0
102
200
101
10
0
101
102
103
I C (mA)
10
102
103
I C (mA)
BC857C; VCE = 5 V.
(1) Tamb = 150 C.
(2) Tamb = 25 C.
(3) Tamb = 55 C.
BC857C; VCE = 5 V.
(1) Tamb = 55 C.
(2) Tamb = 25 C.
(3) Tamb = 150 C.
MGT721
104
handbook, halfpage
VCEsat
(mV)
1200
VBEsat
(mV)
1000
103
800
MGT722
handbook, halfpage
(1)
(2)
600
(3)
400
102
(1)
200
(3) (2)
10
101
10
0
101
102
103
I C (mA)
10
102
103
I C (mA)
2002 Feb 04
Philips Semiconductors
Product specification
PACKAGE OUTLINE
Plastic surface mounted package; 3 leads
SOT23
HE
v M A
Q
A
A1
2
e1
bp
c
w M B
Lp
e
detail X
2 mm
scale
A1
max.
bp
e1
HE
Lp
mm
1.1
0.9
0.1
0.48
0.38
0.15
0.09
3.0
2.8
1.4
1.2
1.9
0.95
2.5
2.1
0.45
0.15
0.55
0.45
0.2
0.1
OUTLINE
VERSION
SOT23
2002 Feb 04
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
99-09-13
TO-236AB
Philips Semiconductors
Product specification
PRODUCT
STATUS(2)
DEFINITIONS
Objective data
Development
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary data
Qualification
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DEFINITIONS
DISCLAIMERS
2002 Feb 04
Philips Semiconductors
Product specification
2002 Feb 04
10
Philips Semiconductors
Product specification
2002 Feb 04
11
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
SCA74
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
613514/04/pp12
Feb 04