Professional Documents
Culture Documents
(Siemens 1847-2005)
Formed in 1847, the company telegrapher bauanstalt Von
Siemens & Halske grew within the space of a few decades from a
small precision-engineering workshop, producing mechanical warning
bells for railways, wire insulation made of gutta-percha, and electrical
telegraph systems, into one of the words largest companies in
electrical & electronics engineering. Landmark inventions, an
immense
readiness
to
innovate,
and
strong
international
ABOUT SIEMENS AG
Siemens AG is a world class supplier of electrical and electronics
products and systems serving one of the largest and the most diverse
markets worldwide. Siemens Ltd. in India is a subsidiary of Siemens
AG, Germany. Siemens AG have been closely involved with
developments that are at leading age of electrical and electronics
engineering ever since the pioneering inventions of the founder of the
company- Werner von Siemens.
Siemens strength, acquired over many decades of pioneering
research and practical experience, lies in the development of
advanced technologies and in their timely application to a wide range
of high- quality, innovative and cost effective products. As a global
company, Siemens have manufacturing, sales and service facilities in
more than 170 countries. Employees worldwide in the offices,
factories, laboratories and service organizations total to about
390,600. All committed to providing the highest standard of
technological competence that Siemens has been a Synonym for,
right since inception. Siemens continuing commitment in this
direction is summed up in the organizations corporate mission
statement.
It want to be one of the most competitive companies in the field of
electrical and electronics engineering and set the pace for advances
in technology.
Energy
Power Generation (KWU)
Power generating facilities, equipment, systems and processes:
Non-nuclear power generation , refuse- fired power plants,
thermal waste recycling plants
Renewable power generation , photovoltaic, electrical
equipment for wind power plants, fuel cells
Industrial power plants and turbines
Nuclear power generations ( nuclear power plants , nuclear
power plant services, nuclear waste facilities)
Nuclear fuel cycle
I & C equipment and systems
Engineered ceramics
Laser technology
Power cables
System planning
Transportation
Transportation Systems
Equipments and Systems for rail transportation:
Safety and security systems
Control systems
Transmission lines and catenaries
Complete installations
Rapid- transit vehicles
Main line rolling stock
Automotive System
Electronic , electrical and electromechanical systems and
components:
Control and information system
Air management system
Electric motors and electric motor systems
L & T Vehicle wiring system
Sensor system
Actuators and fuel mixture components
Automation
Products, systems, equipments and services:
Programmable controls
Communications
Public Communication Networks
Public switching systems
Transmission systems
Mobile radio networks
Mobile radio systems
Telecommunication cables
Applications, networks
Communication terminals
Defense Electronics
Tactical and strategic networks
Radio systems
Products and services for information security
Reconnaissance and air defense systems
Command systems
Air traffic management
Control systems
Medicine
Medical Engineering
Roentgen systems
Magnetic resonance
Computed tomography
Angiography
Dental system
Life support system
Electrocardiography
Nuclear medicine and Patient monitoring
Radiation therapy
Ultrasound, Cardiac and Audio logical systems
Information
Siemens Nixdorf Information System AG
Large, medium-sized and small DP systems
Components
Semiconductors
Application-specific integrated circuits for:
Information technology
Automotive and traffic electronics
Industrial electronics
Entertainment electronics
Microcomputer components
Memory components
Discrete semiconductors:
Transistors, diodes and microwave semiconductors
Sensors
Power semiconductors and modules
Optoelectronics semiconductors:
Light-emitting diodes and displays
Infrared transmitters and receivers
Magnetic field sensors
Optocouplers
Semiconductor lasers
Optical waveguide components
Electromechanical Components
Lighting
Standard Products
Office and architectural lighting, Industrial lighting, Exterior lighting,
Light electronics.
Osram GmbH
Lighting technology products:
General lighting service lamps
Fluorescent lamps
High pressure discharge lamps
Traffic/signal lamps & Photo-optics
Siemens in India
Siemens association with India began in 1867 when Wernervon-Siemens personally supervised the laying of the first submarine
telegraph line between Calcutta and London. This historic event
marked the beginning of a long and fruitful association. Siemens and
India have grown together. In making countrys priorities its own,
Siemens has put its experience and expertise in areas of national
importance. Siemens have played an active role in the technological
progress experienced in the last four decades. Siemens grow out of a
response to the needs of the nation. Today, Siemens involvement
reflects the current trends in electronics and electrical technology- in
Milestones to progress
1954
1957
1959
1960
1963
1966
1973
1975
1977
1980
1981
1991
1993
1994
Panels
1. Control Panel
2. Relay Panel
3. Control Desks
2. Fuse Switches.
3. Low voltage switches.
4. Direct on line starter.
5. Miniature circuit breakers.
2.
3.
4.
5.
6.
7.
8.
9.
Nashik Works
Kalwa Works
Aurangabad Works
Manufacturing of Control
Panels
consisting of
1. Switchgears
3. Fuses
2. Drives
4. Fuse Holders
1.
2.
3.
Logistics
4.
only out of the certain approved ones. The authorized buyers from
purchase department creates a Purchase Order (P.O.) when
purchase requisition is received which automatically gets created by
Spiridon when Production Order is created by concerned
departments such as System Logistics.
5.
Receiving
This department receives the material from the vendor. Here the
quantity of the material is checked & then forwarded to the QI for
inspection. The rejected material from QI is also received by receiving
and is then forwarded to the vendors again.
6.
Quality Incoming
7.
Stores
8.
Manufacturing
9.
Testing
This departments test the final product. They hold the responsibility &
give quality assurance to the Client. During testing if any fault is
detected than that assembly is sent to repairs for repairing. Testing
mainly comprises of HV testing, IR testing and continuity testing.
Nashik Works
Automation &
Drives (A & D)
-System
Department.
Manufactures
Control Panels
Transportation (TS)
-E&S (Electronics & Signaling)
1. K-50 Relays
2. R.S.G. (Railway signaling
group)
3. F.T.G.S.
4. E.M.U. (Electrical Multiple
Unit)
5. T.C.C.1, 2, 3
6. N.C.C.C.
7. E.C.C. 1, 2
8. W.D.G. 4
Production Cell-Systems
Logistics (MPS)
Structure assembly
Wiring
Testing
DC drive: 6RA22
6RA24
6RA70
PLC
S5
S7
The drives can be further classified according to wattage as: AC Drives: UP to 200KW
200KW-630KW
ABIVE 630KW
DC Drives: UP to 210KW
210KW-600KW
Above 600KW
Systems Structure: -
Production Cell-Systems
Logistics
(MPS)
Structure assy.
Wiring
Testing
Logistics
Manufacture is one of the key activity is needed to attain fitness
for use and numerous safeguards are employed to help assure that
the resulting product is indeed fit for use.
Manufacturing planning & scheduling (MPS) comprises the activities
needed to put the factory in a state of readiness to produce to quality
and other standards. Responsibility for carrying out these planning
activities varies widely and depends mainly on:
Planning Activity
No.
1.
Review design for clarity of
specification and for
2.
3.
operations, sequences
Provide machines and tools
process specification
Capable machines & tools
4.
Capable instrumentation
5.
Operation sheet.
adjustment
Define responsibilities for quality Agreed pattern for responsibilities.
Select and train production
Quailed production operators
9.
personnel.
Prove adequacy of planning,
tryouts, trail lots.
Proof of adequacy.
ADVANTAGES OF PLANNING
1) Minimize Risks:Planning helps to minimize or reduce risks. Potential risks are
forecasted and necessary protective devices are decided well in
advance. If the risk occurs, then the protective devices are put into
practice. The protective devices may reduce the impact of risks.
2) Facilities Coordination: The plans of one department are coordinated with the plans of all
other concerned departments. This brings in unity among the various
departments of the organization. In the other word, the concerned
departments work in close harmony in the implementation of the
plans.
4) Facilities proper direction: Planning provides proper direction in which the activities need to be
conducted. This facilitates the manager to the direct his subordinates
as and when required. Clear-cut direction is given so that the
subordinates undertaken the right at the right time.
5) Facilitates Control :A plan provides a yardstick against which actual performance can be
compared. Such comparison will enable to find out the deviation from
the plans. If deviations are noticed, the manager may take the right
corrective steps at the right time.
6) Generates efficiency: Planning enables optimum utilization of resources. All the resourcesi.e., physical and human resources are put to their best use. The
optimum utilization of resources enables a company to achieve
highest possible returns at lowest possible costs.
This department mainly deals with:-
Structure
0020
Wiring
0030
Testing
0040
Finishing
is
responsible
for
the
enhancement
and
What is PR?
Purchase Requation should be prepared when material is created
and the BOM is planned. It is forwarded to only corresponding
vendor.
Purchase Order (P.O.): Once the source is finalized, the buyer places the P.O.,
-i.e.; purchase order. It is the document, which gives the GO AHEAD
instruction to the vendor for commencing the manufacturing the items
listed in it.
Structure assembly or Manufacturing Dept.: This is the very basic department of System. It deals with the
component mounting in the panel.
In the structure assembly of the panel the components are
mounted on GI (Galvanized iron) Sheet, in which all the heavy
components are involve, like Drives, Switch Fuse Units, Main
Contactors & Auxiliary Contactors, PVC (Poly Venal Chloride) cable
channel for cable bunches, MCBs & MPCBs etc.
This mounting is carried out on the basis of Front View &
Equipment layout given in the main drawing. This layout is prepared
considering suitable wiring Routine of that panel. The front view &
equipment layout is shown ahead.
The bus baring is also a main job in structure assembly. In this
activity jointing & its marking is done. Some important precautions
are taken during bus bearing. This activity is carried out to increase
the current rating of bus bar.
The fully structured panel is then forwarded to the wiring
section.
Phosphating.
Passivation.
Drying.
Powder coating is done after the pretreatment.
After powder coating:
No area of surface of the component should be without powder coat.
The coating thickness should be 50-60 microns. (Avg. 55 microns)
PANEL ENCLOSURE
1. Panels are offered with IP20 / IP41 degree of protection as a
standard execution.
2. In case of any other degree of protection, the same is to be
discussed first with A & D-NW before finalizing the order.
3. Basic structure of 8MU panels remains the same. The doors,
covers are suitably modified for archiving different degree of
protection.
4. IP20 enclosure
a) No gaskets on doors / covers.
b) Doors (front & Rear) are provided with suitable louvers.
5. IP 41 enclosure
a) White felt for doors, side covers.
b) Doors (front/rear) are provided with suitable louvers.
BUSBAR MARKING
As per IS 11353-1985 marking for bus bars used for main
connections should be as follows:
Bus bar for Main
Letter
Three-phase
Red-Yellow-Blue
R, Y, B
Two phase
R, B
Single phase
Red
Neutral connection
Black
Connection to Earth
Green
Connection
For AC
Phase connection:
For DC
Positive
Red
Negative
Blue
Connection to earth
Green
BUSBAR JOINTING
2. Manufacturing Precautions:
It should be checked whether any deformation like burr, bulging,
dents exist on contact surface. These defects give rise to higher
contact resistance & consequently higher temperature rise at the
joint. Hence they should be removed before proceeding further.
Brushing:
Contact surface should be thoroughly brushed with steel
wire brush so that Aluminum oxide film is removed which is nonconducting. Brushing may also be necessary in case of copper bus
Greasing
5. Tightening:
6. Re tightening:
On account of the yield of aluminum, all screw joints are to be retightening 24 hours after commissioning & again after 4 weeks as
well as once every year.
Whenever joints is opened for a long time proper precautions as
mentioned in above points 2 to 5.
Wiring
The wiring is another main function in the panel manufacturing. The
wiring is done on the basis of the wiring diagram given in the drawing.
There are basically two main types of wiring diagram.
i. Single line diagram.
ii. Three line diagram.
1. Single line diagram :
This gives the basic idea of the automation Systems. The flow of
supply & the Drive action is described in this.
2. Three line diagram :
This is the main wiring diagram. It is divided in three parts i.e.
i. Power Wiring.
ii. Control wiring
iii. Signal wiring.
WIRE ROUTING
In general the wiring in the panels can be divided in three broad
categories.
1. Power Wiring:
Width
6mm
10 mm
The size and color of multistrand cables used for PLCs & drive
systems:
Signal
For PLC
For Digital Input 0.5 sq mm PVC Red
For Digital output- 0.5 sq mm PVC Red (or
depending upon the current rating mentioned).
For Analog input & output 0.22 sq mm multicore
shielded cable.
For Drive
For digital as well as analog signals 0.22 sq mm
multicore shielded cables are used.
Power
R-Phase Black cable with RED Insulation tape
Y-Phase Black cable with YELLOW Insulation
tape.
B-Phase Black cable with BLUE Insulation tape.
Neutral Black cable with BLACK Insulation tape.
Control
1.5 sq mm PVC Grey wire is used for control circuit
sleeve
Ferrule type used: a. Round type 0.5 sq mm & 0.75 sq mm for cables used for signal
wiring.
b. T-type 1.5 & 2.5 sq mm for cables for control wiring.
PILOT LAMPS
1. The color GREEN should be used for pilot lamp to indicate the
motor is STOPPED or the circuit is OPENED
2. Where there are two pilot lamps the pilot lamp for STOP
should be colored as GREEN and pilot lamp for ON should
be colored as RED
3. If there is a pilot lamp for indication of stop and several other for
start, as for example forward and reverse, for full speed and
reduced speed, only the stop pilot lamp should be colored
GREEN
MOUNTIG POSITION FOR PILOT LAMP
Description
Color
OFF
ON
RED
GREEN
RESET
BLACK
Description
Color
OFF
RED
ON
RAISE
GREEN
BLUE
LOWER
AMBER
RESET
BLACK
TEST FIELD
The testing of the automation panels to reach the international
standards is performed in this dept.
The various tests carried out are as follows:
Visual test:
This test involves visually checking the structure of the
panel and components according to the part list (BOM),sometimes
the components like MCBs or Fuse links are shortfall then such
components are assembled other than real one in Partlist,that is
called Dummy Supply.
Continuity test:
This test is carried out to check whether there is continuity in
the circuit, there is no short circuit, loose connection etc.
Function test:
Giving the supply & connecting the output of the drive to the
motor and checking whether the automation panel is functioning
properly carry out this test.
If there is a PLC in the circuitry the programming it
accordingly & then checking the output.
After all these tests are performed then the panel is
stamped and sends for dispatch.
Step#1: Documentation
Step#7: HV test
HV test to be carried out separately for power section,
control section and electronic section. All test with respect to
PE.
Connections to be kept as were done for ir test.
HV test for 1 Minute- 1st attempt. High voltage
=2Vm+1KVDC for power and control section (Vm is the
operating voltage of the circuit.)
For electronic section where the operating voltage is <100V,
HV =500V DC
After successful HV test, IR test to be repeated
IR and HV test are hazardous
Repairs
It is the department which deals with the repairing of faulty
equipments and assemblies. The repaired assemblies are than
dispatched to their respective departments for mounting into panels.
The test sequence for the repairs department is of two types:
1. Visual inspection
1. Removal of dust and clean the PCB.
2. Checking for general placement and soldering of component
3. Check for proper connections and color code of the wires
2.
Functional testing
1. It is carried out after visual testing. Separate test Jigs are
available for different cards and assemblies.
2. By connecting proper power supplies and signal to these
cards we check that the proper output is there or not
3. This is done by connecting CRO and multimeter and
observing the response of device on that. If any card is faulty
it is detected that which section of the card is faulty.
Eg. Problem in the over voltage section we find the faulty
component in the section and replace the faulty
component.
4. Than that card is sent for pre-testing.
In pre-testing we check the assembly without load and see
the response of its output with respect to the input and check
whether they are properly working or not.
If the assembly is OK, it is sent for the final testing. If the
ckt. is not OK than the functional testing is again repeated.
4. Final testing
It comprises ON load testing of assembly for half an hour
and if the assembly works properly, the OK tested sticker is
marked on it and sent to their corresponding department.
Stores
Siemens stores is divided into three categories, ie. Electronic,
Mechanical and Direct Order store. All the records of the transaction
are kept on SAP. Whenever and material is added or removed from
the store its entry is made on SAP. Thus at any time SAP gives the
information regarding the quantity of material present.
In stores the material is kept in special cases known as Bins.
Each Bin is associated with the corresponding Bin no.and has a
material removal or addition record sheet. At the time of removal of
material the corresponding entry of the quantity of material is made in
it. This is than later compared with the SAP entry.
The material in stores is divided into three categories:
1. A-type material:
it consists of materials which are most costly but least in
utilization. They are kept in the upper or distant bins. Eg. Masterdrives, DC converter, etc.
2. B-type material:
It consists of materials which are moderately expensive and
moderate in utilisation. They are kept in the middle bins. Eg. Current
transformer, DC Amplifiers, etc.
3.C-type materials:
It consists of materials which are least expensive but most in
utility. They are kept in the lower bins which are easy in reach .
Eg. Capacitors, diodes, transistors, resistors,etc.
Is physical
quantity
available on
Is the
GRN
storage
location
available on
GRN
A
Is item no.
and
description
on GRN
matching
with Bin Card
Is
use- before
sticker
affixed to the
component?
A
Bin the item respective
storage location
Is mlfb and
item
description
on SDS
matching
with that on
Bin Card
A
Store Material In
Al Bins/Cartoons
Plastic Bins/Pallets /Trolleys
Note:
1.
2.
3.
4.
5.
Definitions:
Nil
References:
------------
Responsibilities:
as per the Activity
Activity:
A.1 Material received at the Incoming Inspection
1. Items are identified in table specified under A.2
2. After routine test of items as per AQL & Sampling plan following
points additionally to be checked.
Date of manufacturing
Date of expiry
3. Based on above data, the shelf life of respective item should
only be referred in table specified under A.2
4. Fix the USE BEFORE green label with MONTH/YEAR written
on each packet/ reel/cartoon containing local / imported items
Where date of expiry is not mentioned.
A.2
Mat. DescriptiClass on
Shelf
life
Storage Working
location instructions
months
335
332
---
PCB
12
Diodes
Transistor
Thyristors 18
(THT only)
SMD
Solder
Paste
---
Electro.
stores
Electro.
Stores
Fridge
NW/PC
B
Ident.
for
loca
-tion
Yellow
Sticker
Not
req.
Description
Material
class
330
331
---
Wire
wound
resistors
(THT only).
Resistors
(THT only)
Makes:MFR
Thermax
Draloric
Welwyn
Roederstin
Beyschlag
(BC Comp.)
Vitramon
Others
Capacitors
(THT only)
Makes:S+M(Epco)
Roederstin
Beyschlag
(BC Comp.)
Vitramon
Others
SMD
Adhesive
Shelf Storage
life
location
(mont
hs)
6
12
24
24
12
60
24
Working
instruction
-Check the
solderability
of leads as
per
procedure
NW/PR/ISP/
Electro. 11,dated ___
Stores all non
conforming
components
should be
scrapped.
Ident.
for
location
Green
sticker
24
6
24
60
24
24
6
---
-Check the
solderability
of leads as
per
Electro. procedure
Green
Stores NW/PR/ISP/ Stick11, dated __
er
All non
conforming
components
should be
scrapped
All syringes
Fridge crossed
Not
NW/
manufacturer requiPCB
expiry date
red
should be
scrapped
Mat.
clas
s
Description
Shelf Storage
life
locati(months)
on
143
Sticker
label
503
Packing
material
221
chemical
lacquers
Paints
Working
instruction
Mech.
stores
Ident.
for
location
Not
required
Not
required
Not
required