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SCDS174B AUGUST 2004 REVISED MAY 2005
Description
The TS5A3159 is a single-pole double-throw (SPDT)
analog switch that is designed to operate from 1.65 V
to 5.5 V. The device offers a low ON-state resistance
and an excellent ON-resistance, matching with the
break-before-make feature to prevent signal distortion
during the transferring of a signal from one channel to
another. The device has an excellent total harmonic
distortion (THD) performance and consumes very low
power. These features make this device suitable for
portable audio applications.
Features
D Specified Break-Before-Make Switching
D Low ON-State Resistance (1 W)
D Control Inputs Are 5-V Tolerant
D Low Charge Injection
D Excellent ON-Resistance Matching
D Low Total Harmonic Distortion
D 1.65-V to 5.5-V Single-Supply Operation
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
Applications
D Cell Phones
D PDAs
D Portable Instrumentation
Summary of Characteristics
V+ = 5 V and TA = 25 C
2:1 Multiplexer/
Demultiplexer
(1 SPDT)
Configuration
SOT-23 OR SC-70 PACKAGE
(TOP VIEW)
Number of channels
TS5A3159
1.1
6 IN
0.1
0.15
GND
V+
NC
COM
20 ns/15 ns
12 ns
36 pC
100 MHz
65 dB at 1 MHz
Crosstalk (XTALK)
65 dB at 1 MHz
IN
NC TO COM,
COM TO NC
NO TO COM,
COM TO NO
ON
OFF
OFF
ON
Package option
0.01%
20 nA
6-pin DBV or DCK
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
! "#$ %!& %
"! "! '! ! !( ! %% )*&
% "!+ %! !!$* $%! !+ $$ "!!&
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SCDS174B AUGUST 2004 REVISED MAY 2005
ORDERING INFORMATION
PACKAGE(1)
TA
40C to 85C
TOP-SIDE MARKING(2)
TS5A3159DBVR
JA8_
TS5A3159DCKR
JA_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
II/OK
INO, ICOM
VIN
IIK
6.5
0.5
V+ + 0.5
50
mA
200
mA
400
mA
6.5
50
mA
100
mA
0.5
VIN < 0
UNIT
0.5
VNO, VCOM < 0 or VNO, VCOM > V+
VNO, VCOM = 0 to V+
MAX
JA
165
C
Tstg
Storage temperature range
65
150
C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground, unless otherwise specified.
(3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4) This value is limited to 5.5 V maximum.
(5) Pulse at 1 ms duration < 10% duty cycle.
(6) The package thermal impedance is calculated in accordance with JESD 51-7.
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SCDS174B AUGUST 2004 REVISED MAY 2005
SYMBOL
TEST CONDITIONS
TA
V+
MIN TYP(1)
MAX
UNIT
V+
Analog Switch
Analog signal range
VCOM,
VNO, VNC
rpeak
Switch ON,
See Figure 11
25C
Peak ON resistance
ron
Switch ON,
See Figure 11
25C
ON-state resistance
ON-state resistance
match between
channels
ron
Switch ON,
See Figure 11
Switch ON,
See Figure 11
Full
Full
25C
1
4.5 V
1.5
0.75
4.5 V
ron(flat)
NC, NO
OFF leakage current
INC(OFF),
INO(OFF)
Switch OFF,
See Figure 12
25C
NC, NO
ON leakage current
INC(ON),
INO(ON)
Switch ON,
See Figure 13
25C
COM
ON leakage current
Switch ON,
See Figure 13
25C
ICOM(ON)
1.1
1.1
4.5 V
25C
Full
Full
0.233
4.5 V
Full
0.1
25C
ON-state resistance
flatness
1.5
0.15
2
5.5 V
20
4
5.5 V
2
20
2.8
40
4
5.5 V
0.2
4
40
0.47
nA
nA
4
nA
40
40
Full
2.4
5.5
Full
0.8
VIH
VIL
IIH, IIL
VIN = 5.5 V or 0
Full
5.5 V
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SCDS174B AUGUST 2004 REVISED MAY 2005
TEST CONDITIONS
SYMBOL
MIN TYP(1)
TA
V+
4.5 V to
5.5 V
20
4.5 V to
5.5 V
15
MAX
UNIT
Dynamic
Turn-on time
VCOM = V+,
RL = 50 ,
CL = 35 pF,
See Figure 15
25C
tON
Turn-off time
VCOM = V+,
RL = 50 ,
CL = 35 pF,
See Figure 15
25C
tOFF
Break-before-make
time
CL = 35 pF,
See Figure 16
25C
tBBM
Full
4.5 V to
5.5 V
Full
Full
35
40
20
35
12
ns
ns
14.5
ns
Charge injection
QC
CL = 1 nF, VGEN = 0 V,
See Figure 20
25C
5V
36
pC
NC, NO
OFF capacitance
CNC(OFF),
CNO(OFF)
See Figure 14
25C
5V
23
pF
NC, NO
ON capacitance
CNC(ON),
CNO(ON)
See Figure 14
25C
5V
84
pF
COM
ON capacitance
CCOM(ON)
VCOM = V+ or GND,
Switch ON,
See Figure 14
25C
5V
84
pF
Digital input
capacitance
CIN
VIN = V+ or GND,
See Figure 14
25C
5V
2.1
pF
Bandwidth
BW
RL = 50 ,
Switch ON,
See Figure 17
25C
5V
100
MHz
OISO
RL = 50 ,
f = 1 MHz,
Switch OFF,
See Figure 18
25C
5V
65
dB
XTALK
RL = 50 ,
f = 1 MHz,
Switch ON,
See Figure 19
25C
5V
65
dB
THD
RL = 600 ,
CL = 50 pF,
f = 600 Hz to 20 kHz,
See Figure 21
25C
5V
0.01
VIN = V+ or GND,
Switch ON or OFF
Full
5.5 V
OFF isolation
Crosstalk
Total harmonic
distortion
Supply
Positive supply
current
(1) TA = 25C
I+
0.1
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SCDS174B AUGUST 2004 REVISED MAY 2005
SYMBOL
TEST CONDITIONS
TA
V+
MIN TYP(1)
MAX
UNIT
V+
Analog Switch
Analog signal range
VCOM,
VNO, VNC
Peak
ON-state resistance
rpeak
ON-state resistance
ron
ON-state resistance
match between
channels
Switch ON,
See Figure 11
25C
VNO or VNC = 2 V,
ICOM = 24 mA,
Switch ON,
See Figure 11
25C
ron
Switch ON,
See Figure 11
ON-state resistance
flatness
ron(flat)
Switch ON,
See Figure 11
NC, NO
OFF leakage current
INC(OFF),
INO(OFF)
VNC or VNO = 3 V,
VCOM = 0,
Switch OFF,
See Figure 12
25C
3.6 V
0.2
nA
NC, NO
ON leakage current
INC(ON),
INO(ON)
VNC or VNO = 3 V,
VCOM = Open,
Switch ON,
See Figure 13
25C
3.6 V
2.8
nA
COM
ON leakage current
ICOM(ON)
Switch ON,
See Figure 13
25C
3.6 V
0.47
nA
Full
Full
25C
1.35
2.1
3V
2.1
1.15
1.5
3V
1.5
3V
0.11
25C
0.225
3V
25C
0.25
VIH
VIL
IIH, IIL
Full
Full
VIN = 5.5 V or 0
Full
0
3.6 V
5.5
0.6
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SCDS174B AUGUST 2004 REVISED MAY 2005
TEST CONDITIONS
SYMBOL
MIN TYP(1)
TA
V+
3 V to
3.6 V
30
3 V to
3.6 V
20
MAX
UNIT
Dynamic
Turn-on time
VCOM = V+,
RL = 50 ,
CL = 35 pF,
See Figure 15
25C
tON
Turn-off time
VCOM = V+,
RL = 50 ,
CL = 35 pF,
See Figure 15
25C
tOFF
Break-before-make
time
CL = 35 pF,
See Figure 16
25C
tBBM
Full
3 V to
3.6 V
Full
Full
40
55
25
40
21
ns
ns
29
ns
Charge injection
QC
CL = 1 nF, VGEN = 0 V,
See Figure 20
25C
3.3 V
20
pC
NC, NO
OFF capacitance
CNC(OFF),
CNO(OFF)
See Figure 14
25C
3.3 V
23
pF
NC, NO
ON capacitance
CNC(ON),
CNO(ON)
See Figure 14
25C
3.3V
84
pF
COM
ON capacitance
CCOM(ON)
VCOM = V+ or GND,
Switch ON,
See Figure 14
25C
3.3 V
84
pF
Digital input
capacitance
CIN
VIN = V+ or GND,
See Figure 14
25C
3.3 V
2.1
pF
Bandwidth
BW
RL = 50 ,
Switch ON,
See Figure 17
25C
3.3 V
100
MHz
OISO
RL = 50 ,
f = 1 MHz,
Switch OFF,
See Figure 18
25C
3.3 V
65
dB
XTALK
RL = 50 ,
f = 1 MHz,
Switch ON,
See Figure 19
25C
3.3 V
65
dB
THD
RL = 600 ,
CL = 50 pF,
f = 600 Hz to 20 kHz,
See Figure 21
25C
3.3 V
0.015
VIN = V+ or GND,
Switch ON or OFF
Full
3.6 V
OFF isolation
Crosstalk
Total harmonic
distortion
Supply
Positive supply
current
(1) TA = 25C
I+
0.1
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SCDS174B AUGUST 2004 REVISED MAY 2005
SYMBOL
TEST CONDITIONS
TA
V+
MIN TYP(1)
MAX
UNIT
V+
Analog Switch
Analog signal range
VCOM,
VNO, VNC
Peak
ON-state resistance
Switch ON,
See Figure 11
25C
rpeak
ron
Switch ON,
See Figure 11
25C
ON-state resistance
ON-state resistance
match between
channels
ron
Switch ON,
See Figure 11
ON-state resistance
flatness
ron(flat)
Switch ON,
See Figure 11
NC, NO
Off leakage current
INC(OFF),
INO(OFF)
Switch OFF,
See Figure 12
25C
2.7 V
0.2
nA
NC, NO
On leakage current
INC(ON),
INO(ON)
Switch ON,
See Figure 13
25C
2.7 V
2.8
nA
COM
On leakage current
ICOM(ON)
Switch ON,
See Figure 13
25C
2.7 V
0.47
nA
Full
Full
25C
1.7
2.7
2.5 V
2.7
1.45
2.5 V
2.5 V
0.7
25C
0.5
2.5 V
25C
0.45
VIH
VIL
IIH, IIL
Full
1.8
Full
VIN = 5.5 V or 0
Full
0
2.7 V
5.5
0.6
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SCDS174B AUGUST 2004 REVISED MAY 2005
TEST CONDITIONS
SYMBOL
MIN TYP(1)
TA
V+
2.3 V to
2.7 V
40
2.3 V to
2.7 V
30
MAX
UNIT
Dynamic
Turn-on time
VCOM = V+,
RL = 50 ,
CL = 35 pF,
See Figure 15
25C
tON
Turn-off time
VCOM = V+,
RL = 50 ,
CL = 35 pF,
See Figure 15
25C
tOFF
Break-before-make
time
CL = 35 pF,
See Figure 16
25C
tBBM
Full
2.3 V to
2.7 V
Full
Full
55
70
40
55
33
ns
ns
39
ns
Charge injection
QC
CL = 1 nF, VGEN = 0 V,
See Figure 20
25C
2.5 V
13
pC
NC, NO
OFF capacitance
CNC(OFF),
CNO(OFF)
See Figure 14
25C
2.5 V
23
pF
NC, NO
ON capacitance
CNC(ON),
CNO(ON)
See Figure 14
25C
2.5V
84
pF
COM
ON capacitance
CCOM(ON)
VCOM = V+ or GND,
Switch ON,
See Figure 14
25C
2.5 V
84
pF
Digital input
capacitance
CIN
VIN = V+ or GND,
See Figure 14
25C
2.5 V
2.1
pF
Bandwidth
BW
RL = 50 ,
Switch ON,
See Figure 17
25C
2.5 V
100
MHz
OISO
RL = 50 ,
f = 1 MHz,
Switch OFF,
See Figure 18
25C
2.5 V
64
dB
XTALK
RL = 50 ,
f = 1 MHz,
Switch ON,
See Figure 19
25C
2.5 V
64
dB
THD
RL = 600 ,
CL = 50 pF,
f = 600 Hz to 20 kHz,
See Figure 21
25C
2.5 V
0.025
VIN = V+ or GND,
Switch ON or OFF
Full
2.7 V
OFF isolation
Crosstalk
Total harmonic
distortion
Supply
Positive supply
current
(1) TA = 25C
I+
0.1
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SCDS174B AUGUST 2004 REVISED MAY 2005
SYMBOL
TEST CONDITIONS
TA
V+
MIN TYP(1)
MAX
UNIT
V+
Analog Switch
Analog signal range
VCOM,
VNO, VNC
Peak
ON-state resistance
Switch ON,
See Figure 11
25C
rpeak
ron
Switch ON,
See Figure 11
25C
ON-state resistance
ON-state resistance
match between
channels
Switch ON,
See Figure 11
25C
ron
ON-state resistance
flatness
ron(flat)
Switch ON,
See Figure 11
Full
Full
4.9
1.8 V
4.9
1.7
3.2
1.8 V
3.2
0.7
1.8 V
Full
0.7
25C
1.85
Full
25C
1.85
1.8 V
0.9
Full
0.9
NC, NO
Off leakage current
INC(OFF),
INO(OFF)
Switch OFF,
See Figure 12
25C
1.95 V
0.2
nA
NC, NO
On leakage current
INC(ON),
INO(ON)
Switch ON,
See Figure 13
25C
1.95 V
2.8
nA
COM
On leakage current
ICOM(ON)
Switch ON,
See Figure 13
25C
1.95 V
0.47
nA
VIH
VIL
Input leakage
current
IIH, IIL
VIN = 5.5 V or 0
Full
1.5
Full
Full
1.95 V
5.5
0.6
V
V
(1) TA = 25C
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SCDS174B AUGUST 2004 REVISED MAY 2005
TEST CONDITIONS
SYMBOL
MIN TYP(1)
TA
V+
1.65 V to
1.95 V
65
1.65 V to
1.95 V
40
MAX
UNIT
Dynamic
Turn-on time
VCOM = V+,
RL = 50 ,
CL = 35 pF,
See Figure 15
25C
tON
Turn-off time
VCOM = V+,
RL = 50 ,
CL = 35 pF,
See Figure 15
25C
tOFF
Break-before-make
time
CL = 35 pF,
See Figure 16
25C
tBBM
Full
1.65 V to
1.95 V
Full
Full
70
95
55
70
60
ns
ns
72
ns
0.5
Charge injection
QC
CL = 1 nF, VGEN = 0 V,
See Figure 20
25C
1.8 V
13
pC
NC, NO
OFF capacitance
CNC(OFF),
CNO(OFF)
See Figure 14
25C
1.8 V
23
pF
NC, NO
ON capacitance
CNC(ON),
CNO(ON)
See Figure 14
25C
1.8V
84
pF
COM
ON capacitance
CCOM(ON)
VCOM = V+ or GND,
Switch ON,
See Figure 14
25C
1.8 V
84
pF
Digital input
capacitance
CIN
VIN = V+ or GND,
See Figure 14
25C
1.8 V
2.1
pF
Bandwidth
BW
RL = 50 ,
Switch ON,
See Figure 17
25C
1.8 V
100
MHz
OISO
RL = 50 ,
f = 1 MHz,
Switch OFF,
See Figure 18
25C
1.8 V
63
dB
XTALK
RL = 50 ,
f = 1 MHz,
Switch ON,
See Figure 19
25C
1.8 V
63
dB
VIN = V+ or GND,
Switch ON or
OFF
Full
1.95 V
OFF isolation
Crosstalk
Supply
Positive supply
current
(1) TA = 25C
10
I+
0.1
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SCDS174B AUGUST 2004 REVISED MAY 2005
TYPICAL PERFORMANCE
3.5
1.6
TA = 255C
3
1.4
2.5
1.2
V+ = 1.8 V
TA = 85C
TA = 25C
1
ron ()
2
ron ()
V+ = 3 V
V+ = 2.5 V
1.5
TA = 40C
0.8
V+ = 3 V
0.6
1
0.4
V+ = 4.5 V
0.5
0.2
0
VCOM (V)
V+ = 4.5 V
V+ = 5 V
16
14
TA = 85C
12
Leakage (nA)
0.8
ron ()
18
1.2
TA = 25C
0.6
TA = 40C
10
INC(ON)
8
6
0.4
ICOM(ON)
4
0.2
2
VCOM (V)
INO(ON)
2
INO(OFF)
0
0
40
INC(OFF)
20
VCOM (V)
20
40
60
80
100
Temperature (C)
50
20
VCOM = V+
TA = 25C
tr < 20 ns
tf < 20 ns
40
tr = 2.5 ns
tf = 2.5 ns
V+ = 5 V
18
16
tON/OFF (ns)
tON/OFF (ns)
14
30
20
12
10
8
6
4
10
2
0
0
0
Figure 5. tON/OFF vs V+
40
20
20
40
60
80
100
Temperature (C)
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SCDS174B AUGUST 2004 REVISED MAY 2005
OFF Isolation
10
Vt+
Bandwidth
20
30
Vt
1.5
Gain (dB)
0.5
0
1.5
2.5
3.5
4.5
50
60
70
80
8
9
90
0.1
10
100
Frequency (MHz)
0.035
14
V+ = 5 V
12
0.030
10
0.025
ICC (nA)
1K
8
6
V+ = 3 V
0.020
0.015
0.010
0.005
0
0
40
20
20
40
60
80
Temperature (C)
12
Crosstalk
40
Loss dB
2.5
100
10
100
1K
10K
100K
Frequency (MHz)
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SCDS174B AUGUST 2004 REVISED MAY 2005
PIN DESCRIPTION
PIN
NUMBER
NAME
NO
GND
NC
COM
V+
Power supply
IN
DESCRIPTION
Normally-open terminal
Digital ground
Normally-closed terminal
Common terminal
PARAMETER DESCRIPTION
SYMBOL
DESCRIPTION
VCOM
Voltage at COM
VNC
Voltage at NC
VNO
Voltage at NO
ron
Resistance between COM and NC or COM and NO ports, when the channel is ON
rpeak
ron
ron(flat)
Difference between the maximum and minimum value of ron in a channel over the specified range of conditions
INC(OFF)
Leakage current measured at the NC port, with the corresponding channel (NC to COM) in the OFF state under worst-case
input and output conditions
INO(OFF)
Leakage current measured at the NO port, with the corresponding channel (NO to COM) in the OFF state under worst-case
input and output conditions
INC(ON)
Leakage current measured at the NC port, with the corresponding channel (NC to COM) in the ON state and the output (COM)
being open
INO(ON)
Leakage current measured at the NO port, with the corresponding channel (NO to COM) in the ON state and the output (COM)
being open
ICOM(ON)
Leakage current measured at the COM port, with the corresponding channel (COM to NO or COM to NC) in the ON state and
the output (NC or NO) being open
VIH
Minimum input voltage for logic high for the control input (IN)
VIL
Minimum input voltage for logic low for the control input (IN)
VIN
Voltage at IN
IIH, IIL
tON
Turn-on time for the switch. This parameter is measured under the specified range of conditions and by the propagation delay
between the digital control (IN) signal and analog outputs (COM, NC, or NO) signal, when the switch is turning ON.
tOFF
Turn-off time for the switch. This parameter is measured under the specified range of conditions and by the propagation delay
between the digital control (IN) signal and analog outputs (COM, NC, or NO) signal, when the switch is turning OFF.
tBBM
Break-before-make time. This parameter is measured under the specified range of conditions and by the propagation delay
between the output of two adjacent analog channels (NC and NO), when the control signal changes state.
QC
Charge injection is a measurement of unwanted signal coupling from the control (IN) input to the analog (NC, NO, or COM)
output. This is measured in coulomb (C) and measured by the total charge induced due to switching of the control input.
Charge injection, QC = CL VO, CL is the load capacitance, and VO is the change in analog output voltage.
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DESCRIPTION
CNC(OFF)
Capacitance at the NC port when the corresponding channel (NC to COM) is OFF
CNO(OFF)
Capacitance at the NO port when the corresponding channel (NO to COM) is OFF
CNC(ON)
CNO(ON)
CCOM(ON)
Capacitance at the COM port when the corresponding channel (COM to NC or COM to NO) is ON
CIN
Capacitance of IN
OISO
OFF isolation of the switch is a measurement OFF-state switch impedance. This is measured in dB in a specific frequency,
with the corresponding channel (NC to COM or NO to COM) in the OFF state.
XTALK
Crosstalk is a measurement of unwanted signal coupling from an ON channel to an OFF channel (NC to NO or NO to NC).
This is measured in a specific frequency and in dB.
BW
Bandwidth of the switch. This is the frequency in which the gain of an ON channel is 3 dB below the DC gain.
I+
I+
This is the increase in I+ for each control (IN) input that is at the specified voltage, rather than at V+ or GND.
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SCDS174B AUGUST 2004 REVISED MAY 2005
VNC NC
COM
+
VCOM
Channel ON
VNO NO
r on +
VI
ICOM
IN
VI = VIH or VIL
+
GND
VNC NC
COM
VCOM
OFF-State Leakage Current
Channel OFF
VI = VIH or VIL
VNO NO
VI
IN
+
GND
VNC NC
+
COM
VNO NO
VI
VCOM
IN
+
GND
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SCDS174B AUGUST 2004 REVISED MAY 2005
V+
VCOM COM
Capacitance
Meter
VBIAS
VNC
NC
VNO
NO
VI
IN
VBIAS = V+ or GND
VI = VIH or VIL
Capacitance is measured at NC,
NO, COM, and IN inputs during
ON and OFF conditions.
GND
NC or NO VNC or VNO
VCOM
VI
TEST
RL
CL
VCOM
tON
50
35 pF
V+
tOFF
50
35 pF
V+
COM
CL(2)
NC or NO
RL
IN
CL(2)
Logic
Input(1)
RL
GND
V+
Logic
Input
(VI)
50%
50%
0
tON
tOFF
Switch
Output
(VNC or VNO)
90%
90%
(1) All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr < 5 ns, tf < 5 ns.
(2) CL includes probe and jig capacitance.
VNC or VNO
NC or NO
VCOM
V+
50%
0
COM
NC or NO
CL(2)
VI
Logic
Input(1)
IN
RL
Switch
Output
(VCOM)
90%
90%
tBBM
GND
(1) All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr < 5 ns, tf < 5 ns.
(2) CL includes probe and jig capacitance.
W
www.ti.com
SCDS174B AUGUST 2004 REVISED MAY 2005
V+
Network Analyzer
50 W
VNC
NC
Source
Signal
VCOM
VI = VIH or VIL
NO
Network Analyzer Setup
VI
50 W
IN
GND
DC Bias = 350 mV
V+
Network Analyzer
50 W
VNC NC
VI = VIH or VIL
COM
Source
Signal
50 W
VCOM
NO
Network Analyzer Setup
VI
50 W
IN
GND
DC Bias = 350 mV
V+
Network Analyzer
50 W
NC
VCOM
Source
Signal
VNO
50 W
VI
+
VI = VIH or VIL
NO
50 W
IN
GND
W
www.ti.com
SCDS174B AUGUST 2004 REVISED MAY 2005
V+
RGEN
VGEN
OFF
ON
OFF V
IL
NC or NO
COM
VIH
Logic
Input
(VI)
VCOM
VCOM
VCOM
NC or NO
CL(2)
VI
VGEN = 0 to V+
RGEN = 0
CL = 0.1 nF
QC = CL VCOM
VI = VIH or VIL
IN
Logic
Input(1)
GND
(1) All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr < 5 ns, tf < 5 ns.
(2) CL includes probe and jig capacitance.
V+/2
V+
RL
10 mF
VO
COM
NO
VSOURCE
RL
VI
CL(1)
IN
+
GND
18
10 mF
NC
Analyzer
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
TS5A3159DBVR
ACTIVE
SOT-23
DBV
CU NIPDAU
Level-1-260C-UNLIM
TS5A3159DBVRE4
ACTIVE
SOT-23
DBV
CU NIPDAU
Level-1-260C-UNLIM
TS5A3159DBVRG4
ACTIVE
SOT-23
DBV
CU NIPDAU
Level-1-260C-UNLIM
TS5A3159DBVT
ACTIVE
SOT-23
DBV
250
CU NIPDAU
Level-1-260C-UNLIM
TS5A3159DBVTE4
ACTIVE
SOT-23
DBV
250
CU NIPDAU
Level-1-260C-UNLIM
TS5A3159DBVTG4
ACTIVE
SOT-23
DBV
250
CU NIPDAU
Level-1-260C-UNLIM
TS5A3159DCKR
ACTIVE
SC70
DCK
CU NIPDAU
Level-1-260C-UNLIM
TS5A3159DCKRE4
ACTIVE
SC70
DCK
CU NIPDAU
Level-1-260C-UNLIM
TS5A3159DCKRG4
ACTIVE
SC70
DCK
CU NIPDAU
Level-1-260C-UNLIM
TS5A3159DCKT
ACTIVE
SC70
DCK
250
CU NIPDAU
Level-1-260C-UNLIM
TS5A3159DCKTE4
ACTIVE
SC70
DCK
250
CU NIPDAU
Level-1-260C-UNLIM
TS5A3159DCKTG4
ACTIVE
SC70
DCK
250
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
(1)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1
18-Sep-2008
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TS5A3159 :
Enhanced Product: TS5A3159-EP
NOTE: Qualified Version Definitions:
Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 2
8-May-2009
Device
SPQ
TS5A3159DBVR
SOT-23
3000
180.0
DBV
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
9.2
3.23
3.17
1.37
4.0
8.0
Q3
TS5A3159DBVT
SOT-23
DBV
250
180.0
9.2
3.23
3.17
1.37
4.0
8.0
Q3
TS5A3159DCKR
SC70
DCK
3000
180.0
8.4
2.24
2.34
1.22
4.0
8.0
Q3
TS5A3159DCKT
SC70
DCK
250
180.0
8.4
2.55
2.34
1.22
4.0
8.0
Q3
Pack Materials-Page 1
8-May-2009
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TS5A3159DBVR
SOT-23
DBV
3000
202.0
201.0
28.0
TS5A3159DBVT
SOT-23
DBV
250
202.0
201.0
28.0
TS5A3159DCKR
SC70
DCK
3000
202.0
201.0
28.0
TS5A3159DCKT
SC70
DCK
250
202.0
201.0
28.0
Pack Materials-Page 2
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