Package Description

Package Code
Lead Finish
J-STD-609 Category
Assembly Location

Material
Leadframe

Sub-Total
Integrated Circuit
Sub-Total
Die Attach

Sub-Total
Die Pad Plating
Sub-Total
Bond Wire
Sub-Total
Encapsulation

Sub-Total
Terminal Plating
Sub-Total
Total

Atmel Corporation - Package Material Declaration Datasheet

28-Lead, 0.300" / 7.62 mm Wide, Plastic Dual Inline Package (PDIP)
28P3
GPC
PNM
Matte Tin (Sn)
RoHS Compliant
Yes
e3
Green Compliant
Yes
External Manufacturing
REACH Compliant
Yes

Substance
Copper (Cu)
Iron (Fe)
Phosphorous (P)
Zinc (Zn)
Silicon (Si)
Silver (Ag)
Epoxy Resin
t-Butyl Phenyl Glycidyl Ether
Butyl Cellosolve Acetate
Phenolic Resin
Dicyandiamide
Silver (Ag)
Gold (Au)
Silica Fused
Epoxy Resin
Phenol Resin
Epoxy, Cresol Novolac
Carbon Black
Tin (Sn)

Package Material Declaration

Homogeneous Material
CAS #
Weight (mg) Percentage
ppm
7440-50-8
539.843
97.4
974000
7439-89-6
13.302
2.4
24000
7723-14-0
0.554
0.1
1000
7440-66-6
0.554
0.1
1000
554.254
100.0
1000000
7440-21-3
4.345
100.0
1000000
4.345
100.0
1000000
7440-22-4
0.214
72.1
721000
9003-36-5
0.058
19.5
195000
3101-60-8
0.019
6.5
65000
112-07-2
0.002
0.8
8000
92-88-6
0.002
0.8
8000
461-58-5
0.001
0.3
3000
0.297
100.0
1000000
7440-22-4
0.354
100.0
1000000
0.354
100.0
1000000
7440-57-5
0.223
100.0
1000000
0.223
100.0
1000000
60676-86-0
1195.531
86.5
865000
Proprietary
76.016
5.5
55000
Proprietary
76.016
5.5
55000
29690-82-2
30.407
2.2
22000
1333-86-4
4.146
0.3
3000
1382.117
100.0
1000000
7440-31-5
53.038
100.0
1000000
53.038
100.0
1000000
1994.628

Package
Percentage
ppm
27.06
270649
0.67
6669
0.03
278
0.03
278
27.79
277873
0.22
2179
0.22
2179
0.01
107
0.00
29
0.00
10
0.00
1
0.00
1
0.00
0
0.01
149
0.02
177
0.02
177
0.01
112
0.01
112
59.94
599376
3.81
38111
3.81
38111
1.52
15244
0.21
2079
69.29
692920
2.66
26591
2.66
26591
100.00
1000000

Package Material Declaration Certificate

Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this
declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the
European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by
Electronic Information Products (China RoHS).
Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted
chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be
proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify
or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations
provided herein unless otherwise provided by a written contract or other agreement signed by both parties.
Name / Title:

William B. Dupey III / Quality Engineer & Chemist

Date:

November 18, 2013

RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb),
Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) and maximum concentration
value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material.
Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of
0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and
Chlorine (Cl) in any homogeneous material.