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LM2901V, NCV2901,
MC3302
Single Supply Quad
Comparators
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SOIC14
D SUFFIX
CASE 751A
14
PDIP14
N, P SUFFIX
CASE 646
14
1
TSSOP14
DTB SUFFIX
CASE 948G
14
1
PIN CONNECTIONS
Output 2
14
Output 3
Output 1
13
Output 4
VCC
12
GND
- Input 1
11
+ Input 4
10
- Input 4
+ Input 3
- Input 3
+ Input 1
- Input 2
+ Input 2
*
1
)
*2
)
)
*
)
*
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
Symbol
VCC
LM239/LM339/LM2901, V
MC3302
VIDR
LM239/LM339/LM2901, V
MC3302
Value
Vdc
+36 or 18
+30 or 15
Vdc
36
30
VICMR
0.3 to VCC
ISC
Continuous
PD
Junction Temperature
Operating Ambient Temperature Range
1.0
8.0
W
mW/C
TJ
150
TA
Tstg
Vdc
1/RqJA
LM239
MC3302
LM2901
LM2901V, NCV2901
LM339
Storage Temperature Range
Unit
VESD
25 to +85
40 to +85
40 to +105
40 to +125
0 to +70
65 to +150
C
V
1500
200
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The maximum output current may be as high as 20 mA, independent of the magnitude of VCC. Output short circuits to VCC can cause excessive
heating and eventual destruction.
2. VESD rating for NCV/SC devices is: Human Body Model 2000 V; Machine Model 200 V.
VCC
- Input
+ Input
GND
NOTE: Diagram shown is for 1 comparator.
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2
Output
LM239/339
MC3302
Symbol
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
VIO
2.0
5.0
2.0
7.0
3.0
20
mVdc
IIB
25
250
25
250
25
500
nA
IIO
5.0
50
5.0
50
3.0
100
nA
VICMR
VCC
1.5
VCC
1.5
VCC
1.5
0.8
2.0
0.8
2.0
0.8
2.0
RL = , VCC = 30 Vdc
1.0
2.5
1.0
2.5
1.0
2.5
AVOL
50
200
25
100
25
100
V/mV
300
300
300
ns
1.3
1.3
1.3
ms
ISink
6.0
16
6.0
16
6.0
16
mA
Vsat
130
400
130
400
130
500
mV
IOL
0.1
0.1
0.1
nA
Characteristic
Voltage Gain
ICC
mA
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3
LM239/339
MC3302
Symbol
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
VIO
9.0
15
40
mVdc
IIB
400
500
1000
nA
IIO
150
200
300
nA
VICMR
VCC
2.0
VCC
2.0
VCC
2.0
Vsat
700
700
700
mV
IOL
1.0
1.0
1.0
mA
VID
VCC
VCC
VCC
Vdc
Characteristic
+ VCC
+ VCC
R3
10 k
Vin
+ VCC
Rref
Rref
10 k
Vref
VO
R1
R2
Vref
10k
R1
1.0 M
Vref [
R3
Rref + R1
1.0 M
R3 ] R1 / / Rref / / R2
VH =
R1/ / Rref + R2
VO
10 k
VCC R1
R1 / / Rref
R2
Vin
10 k
Vref =
VCC R1
Rref + R1
R2 [ R1 / / Rref
Amount of Hysteresis VH
R2
VH =
[(V
-V
]
R2 + R3 O(max) O(min)
[VO(max) - VO(min)]
R2 Rref / / R1
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4
1.20
1.00
0.80
TA = -55 C
36
TA = +25 C
30
TA = +125C
24
18
12
6.0
0
0.60
-50
-25
0
25
50
75
TA, AMBIENT TEMPERATURE (C)
100
125
4.0
8.0
12
16
20
24
VCC, POWER SUPPLY VOLTAGE (Vdc)
28
8.0
IO, OUTPUT CURRENT (mA)
1.40
7.0
TA = +25 C
6.0
TA = -55 C
5.0
TA = +125C
4.0
3.0
2.0
1.0
0
100
200
300
400
500
VCC
RS
Vin
Vref
VCC 4.0 V
+
-
VCC
RS = Source Resistance
R1 ] RS
RL
kW
1/4 MC14001
+15
100
1/4 MC7400
+5.0
10
CMOS
TTL
R1
VO
R2
R3
330 k
330 k
R4
VCC
(V)
Device
+
C
R1
Logic
10 k
100 k
RL
330 k
VCC
T1
T2
T1 = T2 = 0.69 RC
7.2
f[
C(mF)
R2 = R3 = R4
R1 [ R2 // R3 // R4
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5
32
+15 V
R1
8.2 k
R4
220 k
D1
6.8 k
R2
Vin
R5
220 k
10 k
*
)
Vin
Vin(min)
VCC
15 k
R3
10 M
*
Vin
+
VEE
10 k
VO
VCC
VEE
VO
Dq
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6
Shipping
LM239DG
SOIC14 (PbFree)
55 Units/Tube
LM239DR2G
SOIC14 (PbFree)
Device
LM239DTBR2G
TSSOP14 (PbFree)
LM239NG
PDIP14 (PbFree)
25 Units/Rail
LM339DG
SOIC14 (PbFree)
55 Units/Tube
LM339DR2G
LM339DTBR2G
SOIC14 (PbFree)
TSSOP14 (PbFree)
LM339NG
PDIP14 (PbFree)
25 Units/Rail
LM2901DG
SOIC14 (PbFree)
55 Units/Rail
LM2901DR2G
SOIC14 (PbFree)
LM2901DTBR2G
TSSOP14 (PbFree)
LM2901NG
PDIP14 (PbFree)
25 Units/Rail
LM2901VDG
SOIC14 (PbFree)
55 Units/Tube
LM2901VDR2G
SOIC14 (PbFree)
LM2901VDTBR2G
LM2901VNG
NCV2901DR2G*
NCV2901DTBR2G*
NCV2901CTR*
MC3302DG
MC3302DR2G
MC3302DTBR2G
MC3302PG
TSSOP14 (PbFree)
PDIP14 (PbFree)
SOIC14 (PbFree)
TSSOP14 (PbFree)
Bare Die
SOIC14 (PbFree)
55 Units/Tube
SOIC14 (PbFree)
TSSOP14 (PbFree)
PDIP14 (PbFree)
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ100 Qualified and PPAP
Capable.
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7
PDIP14
N, P SUFFIX
CASE 646
14
14
14
LM339N
AWLYYWWG
1
14
LM2901N
AWLYYWWG
LM239N
AWLYYWWG
1
14
LM2901VN
AWLYYWWG
MC3302P
AWLYYWWG
SOIC14
D SUFFIX
CASE 751A
14
14
14
LM339DG
AWLYWW
1
14
LM239DG
AWLYWW
1
LM2901DG
AWLYWW
1
14
LM2901VDG
AWLYWW
MC3302DG
AWLYWW
TSSOP14
DTB SUFFIX
CASE 948G
14
14
339
ALYW G
G
239
ALYW G
G
1
14
14
14
2901
V
ALYW G
G
2901
ALYW G
G
1
A
= Assembly Location
WL, L = Wafer Lot
YY, Y
= Year
WW, W = Work Week
G or G = PbFree Package
(Note: Microdot may be in either location)
*This marking diagram also applies to NCV2901.
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8
3302
ALYW G
G
1
A
8
H
E1
1
NOTE 8
b2
TOP VIEW
END VIEW
A2
A
NOTE 3
L
SEATING
PLANE
A1
D1
e
M
eB
END VIEW
14X b
SIDE VIEW
0.010
C A
NOTE 6
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9
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACKAGE SEATED IN JEDEC SEATING PLANE GAUGE GS3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION E3 IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
DIM
A
A1
A2
b
b2
C
D
D1
E
E1
e
eB
L
M
INCHES
MIN
MAX
0.210
0.015
0.115 0.195
0.014 0.022
0.060 TYP
0.008 0.014
0.735 0.775
0.005
0.300 0.325
0.240 0.280
0.100 BSC
0.430
0.115 0.150
10
MILLIMETERS
MIN
MAX
5.33
0.38
2.92
4.95
0.35
0.56
1.52 TYP
0.20
0.36
18.67 19.69
0.13
7.62
8.26
6.10
7.11
2.54 BSC
10.92
2.92
3.81
10
A
B
14
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
A3
E
L
1
0.25
DETAIL A
13X
b
0.25
C A
DETAIL A
X 45 _
A1
C
SEATING
PLANE
DIM
A
A1
A3
b
D
E
e
H
h
L
M
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.19
0.25
0.35
0.49
8.55
8.75
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0_
7_
SOLDERING FOOTPRINT*
6.50
14X
1.18
1
1.27
PITCH
14X
0.58
DIMENSIONS: MILLIMETERS
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10
INCHES
MIN
MAX
0.054 0.068
0.004 0.010
0.008 0.010
0.014 0.019
0.337 0.344
0.150 0.157
0.050 BSC
0.228 0.244
0.010 0.019
0.016 0.049
0_
7_
0.10 (0.004)
0.15 (0.006) T U
T U
N
2X
14
L/2
0.25 (0.010)
M
B
U
L
PIN 1
IDENT.
N
F
0.15 (0.006) T U
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE W.
DETAIL E
K
A
V
K1
J J1
SECTION NN
W
C
0.10 (0.004)
T SEATING
PLANE
DETAIL E
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
INCHES
MIN
MAX
MIN MAX
4.90
5.10 0.193 0.200
4.30
4.50 0.169 0.177
1.20
0.047
0.05
0.15 0.002 0.006
0.50
0.75 0.020 0.030
0.65 BSC
0.026 BSC
0.50
0.60 0.020 0.024
0.09
0.20 0.004 0.008
0.09
0.16 0.004 0.006
0.19
0.30 0.007 0.012
0.19
0.25 0.007 0.010
6.40 BSC
0.252 BSC
0_
8_
0_
8_
SOLDERING FOOTPRINT
7.06
1
0.65
PITCH
14X
0.36
14X
1.26
DIMENSIONS: MILLIMETERS
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLCs product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
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any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
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11
LM339/D