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COVER FE/]TURE:

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INVITED PAPER

PHASED-ARRAY RADARS:
PAST, ASTOUNDING
BREAKTHROUGHS AND
FUTURE TRENDS
Phased-anmj radars Juwe seen ever increasingly wider use around the wodd over the last five decades. In
recent years, they have seen breakthroughs that led to capabilities not possible in the past. This is
exemplified by the devehrpment ofGaAs integrated niicroivave circuits called monolithic microwave
integrated circuits (MMIC) that make it pos.nble to build active electronically scanned arrays (AESA) that
have lighter weight, smaller volume, higher reliability and. lower cost. These developnwnts liave readied the
point where it is now possible to build a low-cosi 35 GHz phased airayfor a missile seeker costing
$30/element (total cost of array including all electronics divided by the number of elements). This is made
pos.sible because integration allows the whole T/R module to be put on a single chip. For some applications,
it wiU soon be possible to put multiple receivers or transmitters on a single chip. The advances provided by
Moore's Law have now made it feasible to do digital beam forming with all its nmnerous advantages. This
article describes these advances and also covers the potentialfor GaN and SiC chips that have the
capability of higher peak power by a factor often than G<iAs chips, arrays with instantanecms bandwidths
of up to 33:1, SiGe low-cost T/R modules and low-cost MEMS arrays. A real radar application for multipleinput multiple-output (MIMO) Ims been demonstrated by MITs Lincoln Laboratonj, which allows tlie
colierent comlnning of two radars to achieve a9dB increase in sensitivity. MIMO also makes possihle the
optimum removal of clutter in over the horizon (OTH) and airborne radars by permitting adaptive control
of the transmit antenna pattern in the receiver

ver the last five decades since the fonnation of tlie Microwave Journal, phiiscdanay radars have seen renuirkahle a(!vaiices ainl wide proliferation around tlie woild.
This is exemplified in Figures I, 2 and 3, which
give just a few examples oithe phased airays deployed over the last 50 years and under develop-

30

merit in recent years. Back in 1957 there


jnst a few iirray radai's. John Aliens article, "Array Radars: A Survey of Their Potential and
Their Limitations."^'! first published in MiE L I BliOOKNLIi
Life Fellotc IEEE
MICROW.WE JOURNAL JANUARY 200S

COVER FEATURE: NOW


Fig. 1 Example luhe (T) and salkl'ntate (SS)
ssiff plitiscd arrays having large
h

crmvave Journal in May of 1962, only


sliowvtl tJit' e\|X'rinient;il L-lnuul eleetinniciilly stecrahle aiTny nidar (ESAR)
that \MLs tlie jiredecessor of the FPSS5. In recent years there have heen
many important breakthroughs in
phiised-array technology' that bode well
for the future of phased-array
radars.'-'-"' This article ctners some
of the past developments and the exciting recent new breakthrinighs. The
piLst and recent hreaktlirouglis ctjvered
are listed in Table I.
GRUNMMI e^DHAWKEYE

RAT31DL

APG-63<V)2 ON
F-15(18)'[>200]''

GaA$ MMIC T/R MODULES

Di'lense companii'S 1KI\C snccessfuilv applied MMK:s to AFSA radars


over the hist decade.I The MMIC
APG-79 AESA ratlar on the F/A-IH
E/F allows siinnltaneou.s air-to-air
and air-to-gronnd modes (.see Figure
2b),^'This mean.s the aircraft can defend itself while at the same time deli\'er weapons to the target. Thi.s is
aehie\eti with onl\- a sm;J] increase in
the e<.ist ol the radar over the oidei"
mechanically scanned systcMn.''''''
AESA has peruiitted the Wedgetail
AESA L-band arrays to be placed on
tiie top of a Boeing 737-3()0 for the
Royal Anstralian Air Force withoul
the need ol a rotodome, such as used
on E-3 Sentr)- airborne warning and
control system (AW'ACIS'l airerufl (see
Figure 2b}. Wedgetmi prtnides 36(1"
coverage; tlie two back-to-back dorsal
arrays pnnide +fiO coverage broadside while the antenna above them
pr(j\ides endfire coverage of 30.
SEA-BA5ED X-BAND (SBX)
RADAR

The 24-.stor\-higli Sea-based X-band


(SBX) radiu; shnwii in Figures 4 and .5.
is a new wonder of ihe woild.-'' Part of
tlie US Ground-based Midoourse Defen.se anti-ballistic-missile svsteni. it is
the most powerini plia.sed-ana\ radar
ever pixxlnced.
LOW-COST PHASED ARRAYS

'Nunbo' Manufactured
"Planned

Who said .AFSAs ha\e to be expensive? On Defense Advanced Research Projects Agency (DARPA)
fimding, the feasibility' of a low-cost.
$iy Jv. 35 GHz array was
Fif^. 2 Example solul-stnle tltscrele (D) and
MMIC (M) activf arruijH.
MICROWAVT: JOtitNAL JANt ARY 200S

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SHUTTLE
RADAR
TOTOGRAPH
MISSION
(SRTCI
SIR

/'Vg. .3 Other phused arraif siisivmH


developed or ttnder development.
vd (see Figure 6).2 DARPA also
h i n d t ' d (lt'\('l(}pin('nl o f ; ! $ 1 0 Xl)aii[l, 10 iiiW. siiiule-cliip T/R nioclule.^ A 76 CM/, photOL-tclifd Hdtnum
lens arra)' costing only a few dollars
WHS de\el()pe(l inr aiitoniotixi' cruise

l'
TABLE I
BREAKTHROUGHS
Ffiased iirniy.s i'\
(SBX) nidur
35 ( ; M / $19 K active pluiscd anny
L()w-C(wl MKMS ])lia.sd
GaN.SiC
SiGt', CMOS
Digila! bcaiiil'oriiiing
k
and iisscinlily
M!M<)
idt'liuml arravs
p

iiiK* adaptive pnvct-ssinj; (STAP)


Tiihi- mlvauc-i'ineiits
d'Stah- "Imtlli^" pluLsedsirrav nidars
it ware lordc'iign nf pliasnl arniys

Purpose: Tracking *nd difcrimination radar


for Ground-baied Midcourie Defenta (GMD)
Diiplacement: 50.000 torn; 250 ft
(-24 (toriet) high
Radome: 103 ft high, t20ftdiam.,
18.000 Ibi
Radar: X'band phased array, 65% populated
m I''ig. 4 Sca-lnm-d X'hand (SB\) radcir.
34

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MICROWAVE JOV'RN.VL "JANUARY 2<M)8

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45,056 Best-of Breed Tranimit/


Receiver modulci
* 128 modules per lubarray
(352 tubarrayi total)
Time-delay steering at the
subarray level tupports
wideband waveformi
* Nine luper-iubarrays - ctockod
to tuppreif grating lobe

>
' Xnii (iniiii (iirhUcrtiiri-.

Sure, we sell lots of microwave


and millimeter-wave components.
But, let's face it, sometimes you're
not looking for just a component,
you're looking to create an entire
system. Come to us for the
complete solution. Give us
a call and talk to one of our
engineers. Together we'll
design the system that
exactly meets your needs.

LOW-CO5T MEMS PHASED ARRAY


If only we had a low loss pliiLse sliirter. Then we ooultl go
back to the passive-architecture electronically scanned
phased array with one mociule feeding many phase shifters
(10, for example). This could potentially reduce the eost ol'
iUi electronically scanned pluised array by a factor of about
ten. Micro-electromechanical systems (MEMS) offer this
promise. MEMS s\vitches have improved their reliability- by
three orders of magnitiide over what was reported in October 2003'' to a life of 6(X) billion switches.-^-^ There is still
need for improvement in the loss. The loss through a fonrbit phase shifter nsed in a 1-D scanned radonie antenna
^ ^ ^ ^ ^
space-fed lens (RADANT) is -1.25
dB. Two lenses are needed for a 2-D
scan so tliat the two-way loss for a 2-D
scanned RADANT array would be ~5
clB. but proi^ress is being made.*''
GaN AND SiC CHIPS
Wide bandgap GaN and SiC
MMIC chips offer the potential of
one to two orders inciease in T/R
module power (see Figure 7).2"
Table 2 summarizes the major advantages of GaN. Tables 3 and 4
compare GaN with Gay\s. This technology would make it possible to upgrade an existing AESA by replacing
the GaAs T/R modules with GaN or
SiC T/R modules having ten times
the power. This provides either a ten
times improvement in search volnme
Raytheon Buirt SI9K
Seeker Array; -600 EL
-$30/EL, -40mW/EL

l-'iii. 0 Su luw-cust \)fuised iiiratj-mil


true anymore.

Receivers
Transceivers/
Transmitters
Switcii Matrices
Block Converters
Radar Subsystems
Coherent Converters i i
Communication Systems ;
Integrated Amplifiiar Ass

10'
Kiymofu
to*

VACUUM
WOTRONJ

Twn

Ito*
\
ElECTRON
lAua
dub
MBKT ;

SOUDIMTE

IMMTT

10
100
FREQUENCY (GHiJ

A Fig. 7 Stute~()J-tlir-(in siiikl-ataic and


tube devices.
36

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MICROWAVE JOURNAL JANUARY 200S

COVER FEATURE: NOW


or a 78 percent increase iti track
range.^'** CREE provides commercial
SiC hybrid devices putting out 10 to
60 W'for lip to 4 GHz luul GaN liyhrid de\ices putting (iiit 15 to 120 W
from UHF to 40 GHz.'f^ Their goal is
to provide in one package 550 W
peak and 30 to 40 W average linear
power output using a single-stage
FET. CREE supports the design of
MMIC SiC and GaN cliips. For GaN
MMIC tliey provide 60 W saturated

from 2.5 to 4 GHz and 25 W saturated from 5 to 6 GHz. See References


16-18 for detailed siin'ex'S of state-ofthe-art on GaN and SiG.'
SiGe CHIPS

SiGe has tlie advantage of using Si


as a su})strate. the te'chnolog\' of the
low-cost, commercial integrated-circuit industry and whose exten.sive resources can be drawn upon. It offers
the potential of liiglier performance

egra

TECHNOLOGIES, INC.

TMP Rr PULSED POWER LEADER!

at low cost. SiGe does not compete


with GaAs with respect to microwa\e
output power or noise figure. It offers
low cost and the ability to integrate
many functions on a single chip. In
addition to microwave power amplifiers and a low-noise figure receiver
on one chip, it can have A/Ds and
digital circuitry. It can have CMOS
on the same chip. Si CMOS. GTRI is

TABLE II
GaN TECHNOLOGY ADVANTAGES
GaN lias the highest [xnu'r dciisih nlaiiv
existing tec'hin)!og\'
enahlcs retiiEL-cil chip size - IDWI.T cost
tor a given power
sni;il!er FET size enables broader
bantlwjdth because of higher impeditnce
GaN capable nf higber operating voltage
jn
power system
GaN on SiC ha.s
i
condiicti\'ity eonipared
inaiiitain moderate efiiiiiriel ternps ;U high

Integra's Miniaturized Power Amplifier (MPA) devices are


completely impedance matched to 50 ohms internal to the
package. The MPAL series utilizes gold metali2ed silicon
LDMOS technology. They are characterized for simple pulsed
operation (lOOus, 10%) with low and constant quiescent current.
They are capable of operating under other pulsed operational
modes and under other classes of bias.

TABLE III
ADVANTAGES OF MMIC GaN
OVER GaAi MMIC
Provides .sy.steiii adMinlages re: weiglil,
coLiliiig. priiTie [lower, enst. sensitiviU', range
2H V vs. 10 Vat ix current (I) provides
5- Wx power witli - same gain
iuid elik'ieniy as C.nAs
Iligl) voltage Ga/\s Pl'lEMT al 10 t(} 20 V
lit lower [ pro\ides only ] .5 to 2x power.
CiiiN iu<m' c-ompact for same power.
GaN has liigJKT niatdiing Z * wider BW,
Helialiility tesLs at eie\ated temperatures
'indicate lO^hrlUe
Ra\tlifOii goal: 1.25 inni trairsistoi;
4{)V.6,4W/mrii,(:= 12 dB.
PAK = m% at 10 GHz

TABLE IV
GaN VI. GaAs COMPARISON

Parameter

2.7 - 3.1 GHz and 3.0 3.5 GHz frequency bands


Flexible class of operation: AB, B or A
Flexible pulsed operational modes

Output prmer
r, c . i I
'^ at-;
densit)'
W/nini)\ fl.5 to l.a

Integra Technologies, Inc. 321 Coral Circle El Segundo, CA 902454620


Telephone: (310) 606-0855 Fax:(310)606-0865
Copyr>glit 2007 All Righls Reserved

^."^

www.integratech.com ' ^ ^
38

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Operating
voltage (VI

5 to 20

28 to 48

Breakdown
voltage iV)

20 to 40

> Hit)

- 0.5

- 1

47

390(Z)/490 (SiC)

Mavimiim
cnrrent (.Vniin)
Tlieniial
(WViii-K)

MrCROWA\T. JOrRNAI. JANl ABY 200S

COVER FEATURE: NOW


CMOS CHIPS
CMOS now operates at microwave
Ireqiiencies. It. too, uses a silicon suhstrate and is the technology widely used
ill the coinputtT iuthistrv. It Imlils thf
promise of low cost and low powei' (or
the receiver parts of T/R modules. Like
SiCe. it lias tlie advantage of allowinjj
the integration of many functions on a
siujrle chip, even more so than SiGf.
One ciiip can have RF, IF, haseljand.
microprocessor, memory, tunable filters
and A/Ds a .system on'a chip (SOC). It
tan be c()ini)inetl with CaAs or GaN for
the microwave power amplifier and low
noise flpue receiver. Using CaN has the
ad\antage oi beintj robn.st euon^h that a
limitrr may not be needed. Si to,tietlifr
with CMOS offers the possibility- of the
integration of many receive and/or tran.smit channels on a single chip.
DIGITAL BEAM FORMING (DBF)
DBF hiLs am\ecl lor microwave .AESA radars (see Figure
8). It provides many sipiificant advantages over anulojf hram
fomiing.' For large arrays I used to say DBF Is only being

DBF: Formt J beami


pointing at jammer
and one dt target

8 LNAt
8 PHASE SHIFTERS
GArN CONTROL/CH
8:1 COMBINER
6-18 GHt
N F - 6 dB*
0.7W
2.3 2.4 mm
SiGeBiCMOS"

SLC
OUTPUT

i) Addplivc-adaplive array (Brookner and Howell, Pro(\

developing a SiCk' single-chip T/R module for use in an


.\I*;S.A radar. Its initial design had a peak power of > 50
inW using a nvo-stage power amplifier (PA). Work is under way to achieve 1 W peak by using
three stages.'^ The cost per element of
an .AES.A using such a module is expect('<I to be l/KK) that of a GaAs array nsinti
high-power T/R modules.'^ The low
power per module is made up for in a
railiU" by using a larger array, one that
possibly folds on itself.

2-3 dB FOR 6-12 GHz


'USABLE RANGE: 2-60 GHi

A J-V^. /1 F.xttriiif lih iiitrpvtioti: .siii[^lf chip iiith eif^hl rccfiver


channels. (Koh i? Hebiez, Univ. of Calif., San Diego, MWJ, May,

RECEIVER
ANTENNA

MF'

At receiver can icsn trant.


beam in AZ 0 EL for planar
tram, array to locate target!
in EL & AZ; alternatively generate
ttacked receive beami that cover
region illuminated on transmit lo at
not to watte power or time

Hi \-hinul l2S-,-lemt'nl Pi.H


hlock; 2.2 lbs. 7.4" x J" x OM
40

u
Adjurti Ai B Hi of tram.
array at rec.
to maximize tic

ifH. 12 Optimization oflransmil heani tit receiver for max S/C.


MICROWAVE JOl'RNAL JANUARY 2008

COVER FEATURE: NOW


done at subarniy. This is no longer tnie.
l-llta II;LS doiH' it at thr element level tor
a 2.'5(X)-eIeinent iirray at S-band, a niajor lireakthroitgh. Using DBF eliminates the analog coinhinin<i; han]\\'are.
iiiiiJog clo\\7i-a)n\ei1iiig and all the errt)rs associated with them. This in tnni
will lead to nltni-Iow side lolies. It will
allow the iinplemt-ntatitin ol multiple
ln'ams ]i()iiitiMg in (liflercnt direct ions.
It will eiiul}le tlie adapti\e nse ol different parts of the mitenna for tliiTerenf

applieations at the same time. It permits simnltaneoMS reduction by a faetor


ol almost two oi the tnuismit RF average sc^iireli power and search (Krupiuiey.^ The cost .saviiiy;s gained from the
simnltaneous reduction l)y a factor of
almost two of the transmit RF avemgc
search power and search ocenpaney
will be lar greater than the increased
cost due to the greater re(jnired signal
processing. At the same time, the
seareh angle accuracy is improved by

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Why buy any other brand?


When your netuiorh fequif es the best In
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Radio Waves your first choice.

M UADiit iH UltcROWMvi Mm
WWfci iMuiuivetinccom

imvAwir

about 4() percent.^ DBF will also permit better adapti\'e-:irray pr(x.t?ssing.
ADAPTIVE-ARRAY PROCESSING

The development of adaptive-arr;i\' processing represents a major


step forward in increasing the usefulnoss of phased arrays. It started with
the invention by F.VV. Hnwells ol tluside lobe canceller (SLC), which he
filed on May 4. 1959 (two years after
the formation ol the Mirnnidvc jonrnal) and was patented on Aiignst 24,
19fi5 (US Patent No. .'3,202.990). This
was followed by the seminal work of
S.R Applebaniii published as an internal Syraeusc University Research
Coqi. report in August 1966 and then
published in the September 1976
special issne on adaptive aiiteimas of
the IEEE Tramuctkms on Antennas
and Fropagation. The SLC nulls ont
jammers whose signals come in
throngh the side lobes of the main
antenna by using an.\iliar}' antennas
placed elose to the main antenna.
These auxiliary antennas receive the
jamming signals. By apprDpiiatr prtieessing of the signals rccei\ed In thr
auxiliary antennas, it is possi!)lc to
generate jammer signals having the
same amplitude antl phase as those
coming in tiirongh the side lobes. Bs
subtracting tliese signals from the
jammed signals in the main channel
the jamming interferenee is eancelled. If a phased array is used t(t
form the main beam, elements lbrming the array can also be used as thr
auxiliar\- antennas, thus seniiig dual
use as elements for the main array
and as the auxiliary antennas. It is
useful to look at the side lobe canceller physically from another point
of view. Specifically, tfie comliination
of tlie main anttnina and tin- an.\iiiaiy
elements with its pnwessing can be
viewed as n new antenna system. .As
snch, its antenna side lobe jialtern
will have nulls in the directions ol thi'
jammers while it also has its uiiuii
beam pointing in the direction of potential targets to be deteeted, the direetioii the inain beam would [joint
when no SLC proce.ssing is used.
Very little is published as to which
nidars used SLC. This is because of
the sensitivity'of snch information.
For a phiLsed ai'ray thei'e exists luiother more efVective way lor canc<4ing
jammers coming in through the side
lobes antl even in through the main

42

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MICROWAVE JOI;R.N,\L JANUARY 200f(

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lobe. It is to adjust ndaptively the uinplitiule aiul pliase weisfhts of the array
SO as to put nulls in the directions oi"
the jammers while maintaining the
main l)eam poiutin;[;in the reijuirt-d direction. The.se amplitude and phase
weight adjustmeuts iire made hitscd on
the jamming sigiKiIs recei\'eil b)' the ai'ray and tlieir ciJcnlated direction. This
sv'stem is kuouii as a luJly atlaptive arra)' processor". Here again it is useiul ttj
view tlie fully adaptive array froni an-

other physical point of \iew. Just as previously we viewed the SLX" as an arrav'
that puts nulls in die direction of the
januners. we can now go the other way
and \ie\v the (ully adaptive array
processor iw a SLC.^'"
Fidiy adaptive arrays have been
too (lifficiilt to implement for large
arrays up to uow. the luirdv\'iu-e and
tile processing load being too great,
To reduce the complexity, eonsideration lias been given to doing fully

adaptive arniv proce.ssing at the subarray level. This reduces the number
oi elements from thousantis to a few
tens. This is what is done on the
UK's Multi-fuiictiou p]lectronit;LlIy
Scainied Adaptive Hatlar (MESAIi)."
Witli ttie advaueti-s of DBF, it is now
possible to think ol aehieving the performance ot fully adaptive proci'ssiug
without its couiplexity. In fact, tlie
equiviJent jammer suppressi(jn of a fully adaptive array without its computation and transient penalties can he
achieved. This can be accomplished
with adaptive-adaptive array pnK*essirig.' This involves no more than Itx-ating digitally where the jamnu'rs are.
then ]K)intiug lieains at tliesc jainiucrs
(these beams are effectively eigenl)eams)^-'"-"* luid using these lu-iims as
side lobe cancellers for the uiaiu beam
(see Figure 9). For a U)(K)-cleuit'iit arra\' having to cope with 10 jammers, we
now have to invert a 10 x 10 matrix instead of a KXX) X KXK) niatiix and the
transient time is reduced iiy a factor ot
100. lu a elas.siciJ full)' adaptive arra),
one does not make use of" tlie loctition
of the jammers. But we can eiLsily determine their hjcation rather than to
put on biiudei's. Tliis method i.s e(julvaleut to the method of Principal C^otnjx)nents.^ The jammers c;ui easily be located by doing a Fast Fourier Transform aeross [he array This vvil[ not
locate jammers less tliaii a Ix^anivvidth
apart, but fbr uiany applications it may
be g(K)d enough. If lietter jamuier VAUci'llation is needed, then two stjuinted
beiuns about .'3/4 of a beamvvitlth apart
can be used fbr each located jammer.
Tliis is betmise for closely spaci'd jammers, less tlian a beamvvidth apart, lite
eigen}>eams are sum and difference
beams."' Alternately the Music algoritlim can be used.''^ Adaptive-adaptive
anay pnx-essing is in the .same spirit iH.s
the knowledge aided techniques
DAHPA has been recently funding
known as Knowledge Aided Sensor
Signal Processor & Expert System
(K.\SSPFR).^^ which they have applied
to Space-time Adaptive Proces.siug
(STAP) discussed in the next section.

STAP

STAP is adaptive-an ay proee.s.siiip;


of a piil.se Doppler vvavefbrui. It provides adaptive nulling of ground clutter and jammers on a moving plat(oriu. On a ino\ing platfbrui it places
a 2-D Doppler-angle null where the
44

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MICBOWAVE JOURNAL JANUARY 2008

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cluttfv is.^ STAP is being used on the
new carrier-based E2-D Advanced
Hawkeyes AN/APY-9 radar sliown in
Fignre l.'^^ It is used in tlie littoral
LTivironnifint.'''^ It can also be nsed to
cancel ont ground clutter tor a
giound-based pulse Doppler radar.^'
PACKAGING AND ASSEMBLY

It is now possible to package and


assemble active pbascd arrays having
low cost, li"hf weitiiit and small \-ol-

nnie. The technique involves the use


of coinniercial printed wiring boards
(PCB) and no packages for indi\idnal
T/R modules. An X-band buildingblock ana\' of" 128 elements and T/R
modules was built having a size of" 7.4
X 10.1 X 0.21 in.2<' (see Figure 10).
Its T/R module chips are flip-chip
mounted on the backside of the PCB.
No case is used for the modules. An
approach using low- and high-temperature cofired ceramic (LTCC/

HTCC) for the multilayer board is


presented in Reference 21. The ultimate in packaging and HF integration
is the placement oi many receivers or
transmitter channels, or both, on u
single chip together with their combiner; see Figure 11, wliere eight receiver channels are integrated onto a
.single chip.-^ This shonld be possible
for some radar apphcations in the
near future. Future plans are to integrate 16 to 32 receiver ciiaiinels on a
single chip and 16 transiiut channels
on a single cliip operating from 30 to
23

MIMO
Lincoln Laboratory at MIT has

U T I L I T Y MONITORING MOBILE BROADBAND CONNECTIVITY

demonstrated that one can c-ohereiitly


combine two itientical radars to achieve
a 9 dB increase in sensitivity." They
first transmit From each radiu- orthogonal wu\t'tonns at the same carder frequency to acliie\e the coherence on receive. They next use identical waveforms and vaiy the phase and tlelays of
the transmitted waveforms to achieve
coherence on transmit on the target as
well its coherence on rt^oeixx". This provides a 9 dB increase in sensitivit)* over
a single radar. By combining N radars
they get an 1iicTea.se in scnsiti\it\' of \-^.
Another application for MIMO is for
OTH. airl)orne and ground radars.
With MIMO it is possible by transmitting orthogonal waveforms from sejiaratc transmit elements or subiurays to
identify aud isolate the signals from
each transmit element oi' subarray. This
tlien permits the adiiptivc c-ontrol at tlie
receiver of the transmitter jiatteni so as
to achieve optiiiinin clutter rejection,'''
Figure 12 shows this for the case
wliere lui iirray is used for tnuismit and
a single element aTiteniia is u.sed on receive. By using an array on receive LLS
well as on transmit both the transmit
and receive antenna patterns ean he
atlaptively controlled for optimum clntter lejcction. Nulls can be plact-d on
the triuismit antenna pattern as well as
the receive pattern ui tlie directioii of
stixing clutter seatterers.

56

ULTRA-WIDEBAND ARRAYS

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ANTENNAS
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smiths

Ultra-widcbaiid array ti'chiu)log\'


is here. This teclinnlogv' allows the
use of one antenna for many different
applii ations at different bands.
Ravtheon has de\elope(l a dual-polarized notch-radiating element that has
an instantaneous bandwidtli from l.S
MICROWAVE JOURNAL JANUARY 2008

COVER FEATURE: NOW


to 18 GHz.3>-i'' The Georgia Teclinical
Kesearch Institute {GTRI) is developing an urniy luiviniT; 33:1 instantiint'Oii.s haiKKvicltli witli potential oi
100: l.'^"^

and error. It has been recently shown


that it is feasible to build an active
2-D phased array at X-band using
T\\Ts that lit within the array lattice.
one TWT per element. ^^

TUBE ADVANCEMENTS

SOLID-STATE "BOTTLE"
PHASED-ARRAY RADARS

Tubes arc niakijig major ad\ances.'-' '-^2 Tlu' a\'ailaliilily ofpovvorful software now allows tlie design
<trtnlies without the need for trial

NETWORKS
INTERNATIONAL
CORPORATION

The new F,-2D radar uses a solid


state "bottle" transmitter. Its rimge is

SPACE QUALIFIED PRODUCTS

SOFTWARE FOR THE DESIGN


OF PHASED ARRAYS

Powerlul software is a\ailable now


(like IIFSS. PARANA and CST) that
allows the prediction of the perlbrniiUK-e of antciuULs to ver\' high aceuracy without the need for costk tiial and
error eonstnicHoiis and im-asnreiitents.
An array designed in the mid '7()s required much trial-antl-error and measurements. Today it can be designed
witliout triiil-iuid-error to a small fraction of a dB vising Ansofts HFSS.
ACKNOWLEDGMENT

I thank Kaymoiul Hale. Oolin


Whelan and John DeFalco ui
Raytheon Co. for their input on GaN,
.SiC. SiOc and CMOS.
References

Screening Inspection
Visual Pre-cap (MIL-STD-883, Method 20171
L.C. Filters

Temperature Cycling (MIL-STD-ZOZ. Method W Test B)

Crystal Fitters -

Sinusoidal Vibration (MIL-STD-202F. Method 204D)

Discrete & Monolithic

Random Vibration IMIL-STD-202F, Method 214)

TCXO's

PINO Tesl (MIL-STO-883. Method 2020. Tesi B)

10+ years of space heritage


(Commercial & Military

Aging (MIL C 3098)


Fine Leak Test (MIL-STD 202, Method 112, Test C)
Phase Noise Under Vibration

applications)

Radiographic inspection
Product reliability Up to 30
years operaling life

Reliability Analysis

Complete in-house

Component Selection

IS-Level screening)

Crystals: ESA/SCCG level C#


Discrete semiconductars: JANTXV per MIL PRF'19500
Microcircuits: MIL-STD-883 class 8
Passive Parts: ER type with failure level "S" or better
Connectors: ESA/SCC level C3

IMIC
913.685.3400
15237 Broadmoor
Overland Park, KS 66223
www.nickc.com
e-mail: sales@nickc.com

48

Vfsll http://mw).hotims.com/]6337-105

fen.sp ( I . C C : M D ) , ' D A H P A wch sile. Aii-

giist 24. 2tH)5.


.3. L. Corey, Jiitrniatltmiit Stjmposiiim oti
Phiisvd-arnnj Sijsicmfi tind Technology,
Boston. MA. (>t()ber20<)3.
-1. L. Caivy. GTllI, privutf tijiiLiiiuiiiL'ation.
5. J. Muciel, Riidant Tcfli. Inc.. priviite comniiiiiifatioii; si-f dlso ]. Miit'irl. J.I'". Siot-nni.
J.K. Sinitli and J. Turt!.'. 'VIKMS ElcitninicaU) SteiTa!)!c Anlnniiiis i'or Firf
Coiptnjl RadarK." 2(K)7 IEEE Rddiir Confcrt-iifc-. April 17-20. 2(.X17. Boston, MA.
fi. \\. l.l;i\is ;ind H. Fanti.'. IFIEE Trmi-intiioiis
on Aiitciiita

Calculation carried out per MIL-H0BK-217F


environmental testing

1. 1,;. liriHikruT. I'liasct! Arrays iirul Umliir:


Piisl, Prfseiit and Future," Mirrouavr
Joiinial, Jamum' 2l)()(i, pp. 2-1-16; sev also
Inlcrnatioiinl SijinjHmiim mi Vlmsi'd-nnwi
.Sf/.v/cifM and Techiivliiffj, Bostuti, MA, Oct<')lK'r2(Wn. pp, 1-U.
2. T. Clark, "Low-cost Cniist- Mis.sile De-

6 Proiuifialii'ii.

July 2 0 0 ] ,

pj
7. E. Brookner antl J. Howcll. AdaptiveAdaptive .Arrays Processing. lEF-E Pror.
April 19S6.i>p. 602-04.
8. \ t . Rnssfll. (') al.. IEEE Traus. of MIT
12/97. pp. 2-H4-2453.
9. J.R. GupRi. Sjuin'-Timc Aiiapfive Pwccssiriiifiir Hmhir. Artcc-li I louse Inc.. 2003,
U). W'.F. (".abripl. "Adaptivf Arrays: An Introdnclioti." Pivr- lEEt.. Vol. 64', No. 2, Febmary 1976. pp. 2,'5^J-272.
I I S , t:<)Mtts, K. Ciinmo. j . McHarg. F. Unhpy
and D. Wciklc. "Rfitcnt Distributed Co'licrcut Apcrtiin- Mriisiirt-nifnls ior Next
Grneration BMO Hadai.' 2007 \KKK
Riitlar (^nniVrc-nfi-, April 17-20. 2007,
Biistiin. MA.
12. B. LfVTish and E.J. Dutkowski. "Vncunin
Elcctronit-s: Slatns and Trends," 2007
IEEE Radar CAinfereiitp, April 17-20,
2(H)7. Boslou. MA,
1.3. H, (in. AiLgic-Tnitk-iiig ,'\diiptt\<' ,\rray;
Ada|rtivf-Adiiptivr,"2(Kt7 IEEE RudnrCin'i[(Tencft. April 17-20, 2007, Bosttiii. MA,
14. R,J. Barker. ].H, B(H.skf. N.C. Lnluiiann.
Jr. and G.S. Nusijiovich. Modcni Micwwavf fiiui MiUintetcr-ivdvtf Power Ehxtroiiio!, Wiley-tnterscience and IEEE
Press, 2005,
MICROWAVE JOURNAL JANUARY 20()S

COVER FEATURE: NOW


l.T. G.J. Frazer, Y.I. Ahraniii\ilc-li and B.A.
Joliiison, "Spatially Wavcrorni Diverse
Uadar: Pcrspct-tives lor Ilifih Fre(]iient:y
OTIIH." 0(17 lERR Radar Conferenoe,
April 17-20. 2(XI7. Boston. MA.
l(i. Vlilligmi, cl ;J., HnilarC'.on-2007.
17. Kopp,/Wi<:<vi-3WJ7.
IS, Rdsk-cr. HfiilfiK:oii-2()()7.
li). Milfli(.'ll. et ai.. Riidtii-Coii.
20. Pn/ella and Aim. Rfi,ki-Coii-20()7.
21. S. A!-Taii, MCIC. Vn. tlollege London.
22. E. Brookner. "I'hased .\irny and Hadar
Breaklhriiitglis." liadaK'.ou-2(X)7.
23. Koli and Rebiea. Microwave jmtrtial. May,
2IH17.

24. J. Allf'n. Microwave Journal, May, 1962,


pp. fi7-7y.
2.5. J.K. Green, "F/A48E/F AESA." Militaiy
Raibir Qmlen-niK-. Jiuic 26-27. 2007.
26. J.F. Fellows, "SBX Ovci^it'w." Militiirj'
Hadiir Conlcrent-e, |Line 26-27. 2007.
27. N. Kolia.s. Hiiijtlieon Techuoloi^ij Today.
No. 2. 2(H)7.
2S. M. Riissfll. w/j-Cf.n-20fjr.
29. E. BrookruT. "Pliased Arrays for tlie
New Milleiniiniri." Proceed iiif^s of
lite IEEE 2(l(H) IiUcnialioiial Sijinixisiiiin
1)11 I'luisctl-arr/iij HysleiiiK and Tfrlinolngy, Dana Point, CA, May 2000. pp.

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5530A

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5531

10 GHz

5541A

>26 GHz

5542
5542K

40 GHz

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5542LL

>40 GHz

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16 V

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5545

20 GHz

65 kHz

50 V

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5546

7 GHz

3.5 KHz

50 V

500 mA

5547

15 GHz

5 kHz

50 V

500 mA

55508

18 GHz

100 kHz'

50 V

500 mA'

5575A

I2GHi'

lOkHz"

50 V

500 mA-

5580

15 GH.'

mkHz

50 V

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5585

18 GHz

2 GHz

100 V

6 Amps

5586

5 GHz

1 GHz

100 V

8 Amps

5587

2 GHz

200 MHz

100 V

6 Amps

5569

2.6 GHz

300 MHz

100 V

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SMI 00

13GHI

14 kHz

16V

500 mA

SMI 01

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Low f cutoff down to 3.5kH2
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V-2236

3(). E. Braolcner, "Phased Aniiy.s : Major .Ativarices and Kiiliire Tren<!.s Into (lie Next
Milleiiiilnni," I'nicecithi^s of the 2S'''
Moxcow hitenitilinuiit ConfiTencf nn .AJJt<!niui Thconj and Tccfniolo'^ij. Moscow,
Russia. Soptemhev l!J98. pp. 24-12.
31. E. Bnx>kiitT. "I'luLsixl-anity Hiulars, " ^tmtifu-.\iiu-riam. Kclniiary l9.S.5.pp.94-l()2.
32. Iv Hroukiirr (['-(I.), i'mrtiral Phmrd-orraij
Antcwui .S|/.s7f'w, Artctli House IIR'., 1!)91.
3^3. K. BrodkiTcr. Aupvctn of Modem lindar.
Ch. 2. Aitt-ch 1 InusL- Inc.. 19SS.
-3-1. E. Urookner, Radar Technology. Artedi
Ilimsc Inc.. 1977,
'Vi. F,. linxikncr, "Hiuliir Iniiitiirig inr Aims
OmtifiL" Cli. 11 \\\ Anns Coiilrol \'i-rif\ai'
HoHH. The Tt'clmoli'ffi's That Make it Po.s.\iblc. K. Tsipis. D.W Haffriiri-ilcr anil R
Jaiicway (Kds.), Pergamoii-Brawoy's, i/)n(ioii.uk. 19Sfi.
:J(1 K. BnMikinT. "l.ai^e Pliast'd-arniy Uaelars,"
Cli, 7 in Nuclear Anni Ti'rhtiotof!;ics in the
WfiOs. D. Schroef r mid D. Hafenieistt-r
(Eds.l, ."Vmericiui institute of Phv'sics, New
York, NY. 1988'Yi. Farina, ct al., "MiiUicliatmfl Hadar: Advaiiocd IrivplcnK'ntatioii Tct'lmuldgy und
Ex[)cnint'nta! HfSidts," Prnr. 20(15 IRS.
Brrlin. Scptetiiber 6-8. 2(H).5. pp. .317^330.
3S. (.:TH1. Hoiiziw Magazine. 2()6.
39. Machine Design. Maaii 22. 2007.
40. R..^, Moiiziiigo and T.W. Miller. Inlnxluction to Adaptive .-\rrr/(/.v. Jolin Wiley &
Sons Inc.. I9SII.
41. M.f:. WVlls. "MK.SAH Arlapliv.- Nnlllng,"

lEECiilloijuinni. jnm-, 1990.


42. J. (iiifiri and J. Hrrpn. "Military- Hadar,"
Jiinf 2.5-27. 2(X)7.
43. K. Tmt and li. Cnnirninjf.s. ct al.. Inti'nialiorial SynipcKsinni iiri Pila.scd-array Systems anrl Technology, OttobL-r 2003,
Boston. MA.
41. S. Brierle); Raj'thcon Co.
Eli BrookfMr nv-rtiM't/ ltl\
tii:ii: '/-ij/.v fi-fi Til,' citii
C<JI<!S..- ofllir Clli, -</.Vclr
York III tt)5:i wuthlx MEE
antt Dr.Sc ilei>rei'.H {wm
Ciiundiiii Vnivi-rtltij In /95.5
niul /062, n:'ifm-tlu-!y. tir
Iwx hern ill thr Hai/llmm Co.
vine- /afi2, whrri' Iw h n
Prtnrijiiil Eiinliirrrinfi,
Mlow. Thi-n- hr his woihul
n,, tlir .\SI.)r:-X niihr.
.\STOIi Air Stin-cilUiiuf
Ihitm: IhUXMiSAT li.
.\ffiini/il<lf C.roumt4mK{t
j
]-bnsfil
Riittarini%ra}ia.
\.\\-SV.\ii\Jti H'lMorl upiiriiilr. CJH Ct mH\ D.WF..
PAVE I'.AWH, MSti. CORIi.\]Vl}Y Tn.\.\l). ISrtizillan
SlVA^t. Srr-'i. At'.at^i. miKWS. l 'KWII Siin:-lll/iiit:t
Hacliir Fniiiiv, i.S/tPf n W C d / f / U UAfJh C/JCrarfr Prior
III Riiijllii-iiii hi- ui<iki-il oil rildiirnl lllr Cullimlilll
I.'iid.vrai/fy t-:lf-lr<iiiUi lii-irnn-li IMII. I'iriit liHI.I. Sii^l'i
mil lioiiii- Ar hih tir m^ivi-il (/ IEEE 2Wf> Ut^nttiaJ.
fimrtl Mi-iliitfiT Radar Tniniotii^i 0 .Apiitivatlim ''Fur
Piiiiu'iTtu'^ CtmliilntlUm.^ I'l Phixiil-mniii Hiuliir Hystiin
/HJI'.VIJ;".*. ' " liiiiliii' Sii^iiiil Prtinsiim l)i.uiii\x. and In
('imliiiitmii Eiliirtiliim t'riii^miiis fi>r litidar Eiiiiini'iTu:'
tlwlEEE2imWfirrru\Vl\llfAii:nnl:th.-j,mnmh>ftlir
f'rtinktifi Inilll'ilr Pn-'iilum Atctnl lor iirsi jHipiT mviirti

ff

lO IFlW l t r
II.i.sM
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ofthr IEEE.

PliascJ-umn Anii'Nna.Sy.sliMi
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in railnr. phmccf iirraxji liuil h-arkiniiimmiul tlif
r.il OUT lO.IMIO l.m-r/itU-utM tlii'^r
riHinin Hr irns banquet xpedkrr and krijnotc x)iraker:i>\
Iliiaw III- /tn.! iivrr 11(1 ;JHIN.7\. (rt/A'.v aiul ronv.iiioiulrni-rJi
lokl-1 cm/W. Ill lul/IUlim. Inr hi.\ nm-r H(l iniiUd wlkn llnil

MICROWAVE JOURNAL JANUARY 2(K>S

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