Professional Documents
Culture Documents
www.elsevier.com/locate/polymer
Advanced Materials and Processing Branch, National Aeronautics and Space Administration, Langley Research Center,
Mail Stop 226, Hampton VA 23681-2199, USA
b
National Institute of Aerospace, 144 Research Drive, Hampton VA 23666, USA
Received 12 April 2004; received in revised form 1 July 2004; accepted 2 July 2004
Available online 24 July 2004
Abstract
Thin film membranes of space environmentally stable polymeric materials possessing low color/solar absorptivity (a) are of interest for
potential applications on Gossamer spacecraft. In addition to these properties, sufficient electrical conductivity is required in order to
dissipate electrostatic charge (ESC) build-up brought about by the charged orbital environment. One approach to achieve sufficient electrical
conductivity for ESC mitigation is by the incorporation of single-walled carbon nanotubes (SWNTs). However, when SWNTs are dispersed
throughout the polymer matrix, the nanocomposite films tend to be significantly darker than the pristine material resulting in a higher a. The
incorporation of conductive additives in combination with a decreased SWNT loading level is one approach for improving a while retaining
conductivity. Taken individually, the low loading level of conductive additives and SWNTs was insufficient in achieving the percolation
level necessary for electrical conductivity. When added concurrently to the film, conductivity was achieved. The chemistry, physical and
mechanical properties of the nanocomposite films will be presented.
q 2004 Elsevier Ltd. All rights reserved.
Keywords: Low color polyimides; Nanocomposites; Electrostatic charge mitigation
1. Introduction
Several space mission concepts proposed by NASA are
based on the use of large, deployable, and ultra-lightweight
vehicles (e.g. Gossamer spacecraft) consisting of both
structural and polymer film components [1]. One example
of a proof of concept of this approach was the inflatable
antennae experiment (IAE) deployed from the space shuttle
Endeavor (STS-77) in 1996 [2]. This experiment involved
the successful deployment of a 14 m Mylarw film based
antennae from a compact vehicle (Spartan satellite). Since
this experiment was a proof of concept, the space
6134
2. Experimental
2.1. Starting materials
Aminophenyltrimethoxysilane (APTS, Gelest Inc.,
w90% meta, w10% para) was purified by vacuum
distillation. 4,4 0 -Hexafluoroisopropylidene diphthalic anhydride (6FDA, Hoechst Celanese Inc., mp 241243 8C) was
sublimed prior to use. 1,3-Bis(3-aminophenoxy)benzene
(APB, Mitsui Chemicals America, Inc. mp 107108.5 8C)
and N,N-dimethylacteamide (DMAc) were used as received
without further purification. SWNTs prepared by the HiPco
process were obtained from Tubes at Rice and purified by
heating at 250 8C for w16 h in a high humidity chamber
followed by Soxhlet extraction with hydrochloric acid
(22.2 wt%) for w24 h. All other chemicals were obtained
from commercial sources and used as received without
further purification.
2.2. Polymer synthesis
A typical preparative method of the alkoxysilane
terminated amide acid (ASTAAs) is described. Into a
500 ml three neck round-bottom flask equipped with a
mechanical stirrer, nitrogen gas inlet, and drying tube filled
with calcium sulfate were placed APB (22.8551 g,
0.0782 mol), APTS (0.8552 g, 0.0040 mol), and DMAc
(50 ml). Once dissolved, the flask was immersed in a room
temperature water bath to regulate the temperature. 6FDA
(35.6215 g, 0.0802 mol) was added in one portion as a
slurry in DMAc (45 ml) and rinsed in with 25 ml of DMAc
to afford a solution with a solids content of w34.4%. The
reaction was stirred for w24 h at ambient temperature under
nitrogen. The inherent viscosity (hinh) in DMAc at 25 8C for
a 0.5% (w/v) solution was 0.57 dl/g.
2.3. Blending of SWNT and ASTAA
The following example is representative of the
6135
oven at 100, 200 and 300 8C for 1 h each. The films were
subsequently removed from the glass plate and
characterized.
2.7. Other characterization
Melting point ranges (tangent of onset to melt and the
endothermic peak) were determined by either DSC at a
heating rate of 10 8C/min or visually on a Thomas-Hoover
capillary melting point apparatus (uncorrected). Glass
transition temperatures (Tgs) were determined on thin
films at a heating rate of 20 8C/min and were taken as the
inflection point of the DH vs. temperature curve. Optical
microscopy was performed on an Olympus BH-2 at a
magnification of 200!. The percentage transmission (%T)
at 500 nm was obtained on thin films using a Perkin-Elmer
Lambda 900 UV/VIS/near-IR spectrometer. The a was
measured on an AZ Technology Model LPSR-300 spectroreflectometer with measurements taken between 250 and
2800 nm using a vapor deposited aluminum on Kaptonw
film (1st surface mirror) as a reflective reference for air mass
0 per ASTM E903. An AZ Technology Temp 2000A
infrared reflectometer was used to measure 3. High
resolution scanning electron microscopy (HRSEM) was
obtained on a Hitachi S-4700 and S-5200 field emission
scanning electron microscopy systems operating below
2.0 kV. The composite images were obtained in the low
voltage mode in order to set up a stable local electric field on
the sample while minimizing beam-induced damage. Surface resistivity was measured using a Prostatw PSI-870
Surface Resistance and Resistivity Indicator per ASTM D257 operating at 9 V and reported as an average of three
readings. Volume resistivity was measured using a Prostatw
PRS-801 Resistance System with a PRF-911 Concentric
Ring Fixture operating at 10100 V per ASTM D-257.
6136
6137
P1
P2
P3
P4
P5
P6
P7
P8
SWNT (wt%)
0.03
0.03
0.03
0.04
0.04
Additive (wt%)
CuSO4, 0.014
CuCl2, 0.014
CuSO4, 0.014
CuSO4, 0.042
CuSO4, 0.014
Tg (8C)
207
207
206
205
206
206
207
206
Modulus (GPa)
116G7
118G9
123G2
122G6
117G8
124G5
121G2
118G8
3.4G0.1
3.4G0.1
3.5G0.1
3.5G0.2
3.4G0.2
3.4G0.1
3.4G0.1
3.4G0.1
5G1
5G1
5G1
5G1
5G1
5G1
6G1
5G1
6138
6139
Table 2
Optical transparency at 500 nm
Film ID
SWNT (wt%)
Additive (wt%)
%T at 500 nm
A at 500 nma
P1
P2
P3
P4
P5
P6
P7
P8
48
45
48
45
48
45
48
45
0.03
0.03
0.03
0.04
0.04
CuSO4, 0.014
CuCl2, 0.014
CuSO4, 0.014
CuSO4, 0.042
CuSO4, 0.014
85
76
69
66
63
53
58
59
0.0706
0.1367
0.1612
0.1805
0.2007
0.2757
0.2366
0.2291
AZ 2K log10 %T
solvent and air was the blank. The following series were
plotted against A at 500 nm affording Beers law relationships (Fig. 4):
(1) wt% SWNT inclusion (P1, P4, and P7);
(2) wt% SWNT inclusion at constant copper sulfate loading
(P2, P5, and P8);
(3) wt% CuSO4 loading at constant SWNT loading (P4
P6).
Linear least-squares fit of the data and correlation
coefficient are shown below.
(1) AZ(4.0377)(SWNT wt%)K1(SWNT wt%)C0.0684
R2Z0.99.
(2) A at constant CuSO4 loadingZ(2.7404)(SWNT wt%)K1
(SWNT wt%)C0.1191 R2Z1.00.
(3) A at constant SWNT loadingZ(2.3255)(CuSO4 wt%)K1
(CuSO4 wt%)C0.1191 R2Z0.98.
In a typical Beers law plot, A is zero at zero
concentration. In the present study, the non-zero
intercept of the lines is presumably due to scattering
and reflection by the film surface(s); neither of which
are accounted for in this study. The slope of the line is
analogous to the extinction coefficient obtained from a
Beers law plot and corresponds to contributions from
both the matrix and nanoadditives.
6140
Table 3
Thermo-optical properties
Film ID
SWNT (wt%)
Additive (wt%)
P1
P2
P3
P4
P5
P6
P7
P8
48
45
48
45
48
45
48
45
0.03
0.03
0.03
0.04
0.04
CuSO4, 0.014
CuCl2, 0.014
CuSO4, 0.014
CuSO4, 0.042
CuSO4, 0.014
0.09
0.10
0.12
0.22
0.28
0.31
0.30
0.31
0.58
0.56
0.58
0.61
0.63
0.64
0.65
0.64
Fig. 7. Surface and volume resistivities vs. CuSO4 loading at 0.03 wt%
SWNT loading.
6141
Table 4
Surface and volume resistivity characterization
Film ID
SWNT (wt%)
Additive (wt%)
P1
P2
P3
P4
P5
P6
P7
P8
0.03
0.03
0.03
0.04
0.04
CuSO4, 0.014
CuCl2, 0.014
CuSO4, 0.014
CuSO4, 0.042
CuSO4, 0.014
O1012
O1012
O1012
O1012
108
107
108
108
8.5!1015
8.7!1015
9.1!1015
9.9!1014
1.9!1010
1.5!1010
1.7!1010
2.0!1010
conductivity at 0.05 vol% [8]. In another report, experimental data using untreated catalytically grown SWNTs in
an epoxy matrix suggested that the electrical percolation
threshold was between 0.0225 and 0.04 wt% [18].
The addition of 0.014 wt% CuSO4 to a mix containing
0.03 wt% SWNTs resulted in a film (P5) exhibiting a
surface and volume resistivity of 108 U/square and
1010 U cm, respectively. These values were comparable to
that of P7 that contained 0.04 wt% SWNT and no salt. The
addition of the salt has been proposed to increase the ionic
strength of the matrix [13]. This presumably caused the
SWNT to agglomerate and form a sufficient network to
provide conductivity. The optical micrograph of P5
previously shown (Fig. 2) tends to support this network
formation. Increasing the salt concentration (P6 compared
to P5) afforded one order of magnitude improvement in
surface resistivity. The volume resistivity though remained
unchanged.
When 0.014 wt% CuSO4 was added to a SWNT
composition (P8) that already displayed conductivity (P7),
the surface and volume resistivity remained unchanged.
However, there was more apparent SWNT agglomeration in
P8 as compared to P7 as previously discussed.
The data was plotted vs. SWNT (Fig. 6) and CuSO4
(Fig. 7) wt% loading. As seen in Fig. 6, a sharp drop in the
surface and volume resistivities occurred between 0.03 and
0.04 SWNT wt% loading. This implied that the percolation
threshold necessary for conductivity resided between these
two points. In Fig. 7, it can be seen that the addition of a
small amount of salt in a film composition that was just
below the percolation threshold, conductivity was achieved.
No further enhancement in the conductivity was observed
with increased salt loading.
4. Summary
Films with surface and volume resistivities sufficient to
mitigate ESC build-up (1061010 U/square) were prepared
by the incorporation of a low loading level of SWNTs in
conjunction with a small amount of inorganic salt. The
inorganic salt was proposed to increase the ionic strength of
the matrix thereby resulting in sufficient network formation
References
[1] Jenkins CHM. Gossamer space: membrane and inflatable structures
technology for space applications, vol. 191.: American Institute of
Aeronautics and Astronautics; 2001.
[2] http://www.sti.nasa.gov/tto/spinoff1996/13.html.
[3] Watson KA, Palmieri FL, Connell JW. Macromolecules 2002;35:
4968.
[4] SRS Technologies. Huntsville. AL 35806. http://www.stg.srs.com/
atd/polyimidesales/cp_prop.htm.
[5] Watson KA, Smith Jr JG, Connell JW. Society for the Advancement
of Materials and Process Engineering Technical Conference Series,
vol. 33 2001 p. 1551.
[6] Glatkowski P, Mack P, Conroy JL, Piche JW, Winsor P. US Patent
6,265,466 B1, issued July 24, 2001 to Eikos, Inc.
[7] Smith Jr JG, Watson KA, Thompson CM, Connell JW. Society for the
Advancement of Materials and Process Engineering Technical
Conference Series, 34 2002 p. 365.
[8] Park C, Ounaies Z, Watson KA, Crooks RE, Smith Jr JG, Lowther SE,
Connell JW, Siochi EJ, Harrison JS, St Clair TL. Chem Phys Lett
2002;364:303.
[9] Watson KA, Smith Jr JG, Connell JW. Society for the Advancement
of Material and Process Engineering Proceedings, 48 2003 p. 1145.
[10] Glatkowski P. Society for the Advancement of Material and Process
Engineering Proceedings, 48 2003 p. 2146.
[11] Smith JG Jr, Connell JW, Lillehei P, Watson KA, Thompson CM.
Materials Research Society Spring 2002 Session T. On-line Proceedings; 2002. 733E: T3.5. www.mrs.org/publications/epubs/proceedings/spring2002/t/.
[12] Smith Jr JG, Connell JW, Delozier DM, Lillehei PT, Watson KA,
Lin Y, Zhou B, Sun Y-P. Polymer 2004;45:825.
6142