Professional Documents
Culture Documents
www.ti.com
FEATURES
DESCRIPTION
23
APPLICATIONS
Temperature Measurement:
Thermocouple Measurement
Cold Junction Compensation
Thermistor Measurement
Portable Instrumentation
Factory Automation and Process Controls
2V
1M
GND
500
0.1 F
GND
AIN0
VDD
1 F
1M
500
ADS1118
Voltage
Reference
AIN1
0.1 F
SCLK
GND
GND
2V
1M
MUX
PGA
GND
500
0.1 F
DIN
Oscillator
AIN3
500
GND
0.1 F
CS
DOUT/DRDY
AIN2
1 F
1M
16-bit
ADC
SPI
Interface
High Accuracy
Temp Sensor
GND
GND
GND
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SPI is a trademark of Motorola.
All other trademarks are the property of their respective owners.
ADS1118
SBAS457B OCTOBER 2010 REVISED AUGUST 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
For the most current package and ordering information, see the Package Option Addendum at the end of this
document, or visit the device product folder on www.ti.com.
100, momentary
mA
10, continuous
mA
0.3 to +5.5
4000
1000
40 to +125
+150
60 to +150
ESD ratings
UNIT
0.3 to +5.5
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
PRODUCT FAMILY
DEVICE
RESOLUTION
(Bits)
MAXIMUM SAMPLE
RATE (SPS)
SPECIAL
FEATURES
PGA
INTERFACE
INPUT CHANNELS
(Differential/
Single-Ended)
ADS1118
16
860
Temperature sensor
Yes
SPI
2/4
ADS1018
12
3300
Temperature sensor
Yes
SPI
2/4
ADS1115
16
860
Comparator
Yes
I2C
2/4
ADS1114
16
860
Comparator
Yes
I2C
1/1
ADS1113
16
860
None
No
I C
1/1
ADS1015
12
3300
Comparator
Yes
I2C
2/4
ADS1014
12
3300
Comparator
Yes
I2C
1/1
ADS1013
12
3300
None
No
I2C
1/1
ADS1118
www.ti.com
ELECTRICAL CHARACTERISTICS
Maximum/minimum specifications at 40C to +125C, VDD = 3.3V, data rate = 8SPS, and full-scale (FS) = 2.048V, unless
otherwise noted. Typical values are at +25C, VDD = 3.3V, data rate = 8SPS, and full-scale (FS) = 2.048V, unless otherwise
noted.
ADS1118
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
ANALOG INPUT
Full-scale input voltage (1)
4.096/PGA
GND
V
VDD
See Table 1
FS = 6.144V (1)
FS = 1.024V
FS = 0.512V, 0.256V
100
SPS
SYSTEM PERFORMANCE
Resolution
No missing codes
16
10
Output noise
Integral nonlinearity
Offset error
Gain error
LSB
LSB
0.1
0.25
LSB
FS = 2.048V
0.002
LSB/C
0.2
LSB/V
FS = 2.048V at +25C
0.01
FS = 0.256V
FS = 2.048V
(3)
FS = 6.144V
(1)
0.15
%
ppm/C
40
10
Offset drift
Offset power-supply rejection
Bits
ppm/C
ppm/C
10
ppm/V
0.01
0.1
Gain match
0.01
0.1
Offset match
0.6
LSB
At dc and FS = 0.256V
105
dB
At dc and FS = 2.048V
100
dB
Common-mode rejection
At dc and FS = 6.144V
(1)
%
%
90
dB
105
dB
105
dB
TEMPERATURE SENSOR
Temperature sensor range
40
(1)
(2)
(3)
(4)
+125
0.03125
C
C/LSB
0C to +70C
0.2
0.5
40C to +125C
0.4
C
C
vs supply
0.03125
0.25
C/V
This parameter expresses the full-scale range of the ADC scaling. In no event should more than the smaller of VDD + 0.3V or 5.5V be
applied to this device.
Best fit INL covers 99% of full-scale.
Includes all errors from onboard PGA and reference.
Not production tested; ensured by characterization.
ADS1118
SBAS457B OCTOBER 2010 REVISED AUGUST 2012
www.ti.com
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DIGITAL INPUT/OUTPUT
Logic level
VIH
0.7VDD
VDD
VIL
GND
0.2VDD
VOH
IOH = 1mA
0.8VDD
VOL
IOL = 1mA
GND
V
0.2VDD
Input leakage
IH
VIH = 5.5V
10
IL
VIL = GND
10
5.5
200
POWER-SUPPLY REQUIREMENTS
Power-supply voltage
2
Power-down current at +25C
0.5
Supply current
150
300
VDD = 5.0V
0.9
mW
VDD = 3.3V
0.5
mW
VDD = 2.0V
0.3
mW
TEMPERATURE
Storage temperature
60
+150
Specified temperature
40
+125
THERMAL INFORMATION
ADS1118
THERMAL METRIC (1)
DGS
UNITS
10 PINS
JA
JCtop
51.5
JB
108.4
JT
JB
106.5
JCbot
n/a
(1)
186.8
2.7
C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
ADS1118
www.ti.com
PIN CONFIGURATIONS
RUG PACKAGE
QFN-10
(TOP VIEW)
DGS PACKAGE
MSOP-10
(TOP VIEW)
DIN
10
SCLK
DOUT/DRDY
CS
VDD
GND
AIN3
AIN0
AIN2
SCLK
10 DIN
CS
DOUT/DRDY
GND
VDD
AIN0
AIN3
AIN1
AIN2
5
AIN1
PIN DESCRIPTIONS
PIN #
PIN NAME
ANALOG/
DIGITAL
INPUT/
OUTPUT
SCLK
Digital input
CS
Digital input
GND
Analog
AIN0
Analog input
AIN1
Analog input
AIN2
Analog input
AIN3
Analog input
VDD
Analog
DOUT/DRDY
Digital output
10
DIN
Digital input
DESCRIPTION
Ground
ADS1118
SBAS457B OCTOBER 2010 REVISED AUGUST 2012
www.ti.com
CS
tSCLK
tCSSC
tSPWH
tSCCS
SCLK
tDIHD
tDIST
tSPWL
tSCSC
DIN
tCSDOD
tDOHD
tDOPD
tCSDOZ
Hi-Z
Hi-Z
DOUT
(1)
(2)
(3)
DESCRIPTION
MIN
MAX
UNIT
tCSSC
100
ns
tSCLK
SCLK period
250
ns
tSPWH
100
ns
tSPWL
tDIST
50
50
100
ns
28
tDIHD
tDOPD
tDOHD
tCSDOD
tCSDOZ
ms
ns
ns
50
ns
ns
100
ns
100
ns
tCSH
CS high pulse
200
ns
tSCCS
100
ns
ADS1118
www.ti.com
TYPICAL CHARACTERISTICS
At TA = +25C and VDD = 3.3V, unless otherwise noted.
TOTAL ERROR vs INPUT SIGNAL
VDD = 2V
VDD = 3.3V
VDD = 5V
1
0
-1
-2
FS = 2.048V
Data Rate = 860SPS
Differential Inputs
-3
-4
-2.048
-1.024
1
0
1
2
3
1.024
4
60 40 20
2.048
20
40
60
80
Temperature (C)
Figure 2.
Figure 3.
10
35
FS = 0.512V
FS = 2.048V
DR = 860SPS
DR = 860SPS
30
RMS Noise (V)
DR = 128SPS
25
20
15
DR = 128SPS
10
DR = 8SPS
DR = 8SPS
5
0
0.5 0.4 0.3 0.2 0.1 0
0.1 0.2
Input Voltage (V)
0.3
0.4
0
2.0
0.5
2.5
3.0
G017
3.5
4.0
4.5
Supply Voltage (V)
Figure 4.
NOISE vs TEMPERATURE
G018
(1)
15
FS = 2.048V
Data Rate = 8SPS
8
RMS Noise (V)
5.5
Figure 5.
10
9
5.0
7
6
5
4
3
12.5
FS = 0.256V
FS = 0.512V
FS = 2.048V
FS = 6.144V
10
7.5
5
2.5
2
1
40
20
20
40
60
Temperature (C)
80
100
120
0
2.0
G019
Figure 6.
(1)
2.5
3.0
3.5
4.0
4.5
Supply Voltage (V)
5.0
5.5
G010
Figure 7.
This parameter expresses the full-scale range of the ADC scaling. In no event should more than VDD + 0.3V be applied to this device.
Submit Documentation Feedback
ADS1118
SBAS457B OCTOBER 2010 REVISED AUGUST 2012
www.ti.com
10
FS = 2.048V
VDD = 3.3V
DR = 8SPS
Best Fit
3
2
1
0
1
2
40C
+25C
+125C
3
4
5
1.5
40C
+25C
+125C
8
Integral Nonlinearity (ppm)
6
4
2
0
2
4
FS = 0.512V
VDD = 3.3V
DR = 8SPS
Best Fit
6
8
0.5
0
0.5
Input Signal (V)
1.5
10
0.5
0.4
0.2
G011
Figure 8.
INL vs INPUT SIGNAL
3
2
G012
1
0
1
2
40C
+25C
+125C
1.5
40C
+25C
+125C
8
6
4
2
0
2
4
FS = 0.512V
VDD = 5V
DR = 8SPS
Best Fit
6
8
0.5
0
0.5
Input Signal (V)
1.5
10
0.5
0.4
0.2
G013
Figure 10.
0.1
0
0.1
Input Signal (V)
0.2
0.4
0.5
G014
Figure 11.
INL vs TEMPERATURE
12
16
FS = 2.048V
DR = 8SPS
Best Fit
VDD = 2V
VDD = 3.3V
VDD = 5V
8
6
4
2
0
60 40 20
FS = 2.048V
Best Fit
14
Integral Nonlinearity (ppm)
0.5
FS = 2.048V
VDD = 5V
DR = 8SPS
Best Fit
40C
+25C
+125C
12
10
8
6
4
2
20
40
60
80
Temperature (C)
G015
Figure 12.
0.4
10
10
0.2
Figure 9.
0.1
0
0.1
Input Signal (V)
16
32
64
128
250
Data Rate (SPS)
475
860
G016
Figure 13.
ADS1118
www.ti.com
60
60
AIN0 to GND
AIN1 to GND
AIN2 to GND
AIN3 to GND
AIN0 to GND
AIN1 to GND
AIN2 to GND
AIN3 to GND
40
Offset Voltage (V)
40
20
0
20
40
20
0
20
40
FS = 2.048V
60
40
20
FS = 2.048V
20
40
60
Temperature (C)
80
100
60
120
2.5
3
3.5
4
Supply Voltage (V)
G004
Figure 14.
DIFFERENTIAL OFFSET vs TEMPERATURE
G005
AIN0 to AIN1
AIN0 to AIN3
AIN1 to AIN3
AIN2 to AIN3
20
AIN0 to AIN1
AIN0 to AIN3
AIN1 to AIN3
AIN2 to AIN3
30
Offset Voltage (V)
30
Offset Voltage (V)
Figure 15.
40
10
0
10
20
30
20
10
0
10
20
30
FS = 2.048V
40
40
20
FS = 2.048V
20
40
60
Temperature (C)
80
100
40
120
2.5
G006
Figure 16.
3
3.5
4
Supply Voltage (V)
4.5
5
G007
Figure 17.
OFFSET HISTOGRAM
15
200
Offset Drift from 40C to +125C
FS = 2.048V, MUX = AIN0 to AIN3
30 units from one production lot
Number of Occurrences
4.5
10
100
50
10
8
6
4
2
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
0.005
0.004
0.003
0.002
0.001
0.001
0.002
0.003
0.004
0
0.005
150
Offset (V)
G046
Figure 18.
G000
Figure 19.
ADS1118
SBAS457B OCTOBER 2010 REVISED AUGUST 2012
www.ti.com
0.05
0.15
0.04
0.10
0.02
0.03
0.01
0
FS = 0.256V
FS = 0.512V
FS = 1.024V
FS = 2.048V
FS = 4.096V
FS = 6.144V
0.01
0.02
0.03
0.04
0.05
40
20
20
40
60
80
Temperature (C)
100
120
0.05
FS = 256mV
0
FS = 2.048V
-0.05
-0.10
-0.15
140
2.0
2.5
3.0
3.5
G008
Figure 20.
4.5
5.0
5.5
Figure 21.
200
300
250
Number of Occurrences
4.0
150
100
50
VDD = 5V
200
150
VDD = 3.3V
VDD = 2V
100
50
0.05
0.04
0.045
0.03
0.035
0.02
0.025
0.01
0.015
0.005
0.01
0.005
0.015
0.02
0
-40
-20
VDD = 2V
VDD = 3.3V
VDD = 5V
120
140
-10
-20
3.5
Gain (dB)
100
FREQUENCY RESPONSE
0
3
2.5
2
1.5
-30
-40
-50
-60
-70
0.5
20
20
40
60
80
Temperature (C)
100
120
140
-80
1
G003
Figure 24.
10
80
Figure 23.
0
40
60
G000
40
Temperature (C)
Figure 22.
4.5
20
10
100
1k
10k
Figure 25.
ADS1118
www.ti.com
40
0.6
35
Number of Occurrences
0.4
0.2
0
0.2
0.4
0.6
30
25
20
15
10
5
0.8
G023
0.5
0.4
0.3
0.2
120
0.1
100
80
0.1
20
40
60
Temperature (C)
0.2
0.3
20
0.5
1
40
0.4
0.8
Figure 27.
15
0.5
0.4
0.3
0.5
0.5
0.4
0.3
0.2
0.1
0.1
0.2
0
0.3
0
0.4
0.2
10
0.1
10
20
15
25
0.1
20
30
0.2
25
0.3
Number of Occurrences
35
30
0.5
G040
G042
Figure 28.
Figure 29.
15
G043
Figure 30.
0.5
0.5
0.5
0.4
0.3
0.2
0.1
0.1
0.2
0
0.3
0
0.4
0.5
0.4
10
0.3
10
20
0.2
15
25
0.1
20
25
30
0.1
30
0.2
Number of Occurrences
35
40
Ambient temperature = 70C
48 units from 3 production lots
0.3
40
0.4
Number of Occurrences
35
40
Ambient temperature = 0C
48 units from 3 production lots
0.4
40
Number of Occurrences
G040
Figure 26.
G045
Figure 31.
11
ADS1118
SBAS457B OCTOBER 2010 REVISED AUGUST 2012
www.ti.com
80
0.6
70
Number of Occurrences
0.4
0.2
0
-0.2
-0.4
-0.6
$PELHQW WHPSHUDWXUH
94 units from production
60
50
40
30
20
10
-0.8
-1
C007
0.5
0.4
0.3
0.2
120
0.1
100
80
-0.1
20
40
60
Temperature (C)
-0.2
-0.3
-20
-0.5
0
-40
-0.4
Figure 33.
30
0.5
0.4
0.3
-0.5
0.5
0.4
0.3
0.2
0.1
-0.1
0
-0.2
0
-0.3
10
-0.4
10
0.2
20
0.1
20
40
30
50
-0.1
40
60
-0.2
50
-0.3
Number of Occurrences
70
60
-0.5
Number of Occurences
70
80
Ambient temperature = 0C
94 units from production
-0.4
80
C002
C003
Figure 34.
Figure 35.
90
80
50
70
Number of Occurrences
Number of Occurrences
C001
Figure 32.
60
50
40
30
20
40
30
20
10
10
C004
Figure 36.
12
0.5
0.4
0.3
0.2
0.1
-0.1
-0.2
-0.3
-0.4
-0.5
0.5
0.4
0.3
0.2
0.1
-0.1
-0.2
-0.3
-0.4
0
-0.5
C006
Figure 37.
ADS1118
www.ti.com
OVERVIEW
The ADS1118 is a very small, low-power, 16-bit, delta-sigma () analog-to-digital converter (ADC). The
ADS1118 is extremely easy to configure and design into a wide variety of applications, and allows precise
measurements to be obtained with very little effort. Both experienced and novice users of data converters find
designing with the ADS1118 family to be intuitive and problem-free.
The ADS1118 consists of a analog-to-digital (A/D) core with adjustable gain, an internal voltage reference, a
clock oscillator, and an SPI. This device is also a highly linear and accurate temperature sensor. All of these
features are intended to reduce required external circuitry and improve performance. Figure 38 shows the
ADS1118 functional block diagram.
VDD
Device
Voltage
Reference
MUX
AIN0
Gain = 2/3, 1,
2, 4, 8, or 16
CS
SCLK
AIN1
16-Bit DS
ADC
PGA
SPI
Interface
DIN
DOUT/DRDY
AIN2
Oscillator
AIN3
Temperature
Sensor
GND
13
ADS1118
SBAS457B OCTOBER 2010 REVISED AUGUST 2012
www.ti.com
MULTIPLEXER
The ADS1118 contains an input multiplexer, as shown in Figure 39. Either four single-ended or two differential
signals can be measured. Additionally, AIN0 and AIN1 may be measured differentially to AIN3. The multiplexer is
configured by three bits in the Config Register. When single-ended signals are measured, the negative input of
the ADC is internally connected to GND by a switch within the multiplexer.
VDD
Device
AIN0
VDD
GND
AINP
AIN1
AINN
VDD
GND
AIN2
VDD
GND
AIN3
GND
GND
(1)
If it is possible that the voltages on the input pins may violate these conditions, external Schottky clamp diodes
and/or series resistors may be required to limit the input current to safe values (see the Absolute Maximum
Ratings table). While the analog inputs can support signals marginally above supply, under no circumstances
should any analog or digital input or output be driven to greater than 5.5V with respect to the GND pin.
Also, overdriving one unused input on the ADS1118 may affect conversions taking place on other input pins. If
overdrive on unused inputs is possible, it is recommended to clamp the signal with external Schottky diodes.
14
ADS1118
www.ti.com
ANALOG INPUTS
The ADS1118 uses a switched-capacitor input stage where capacitors are continuously charged and then
discharged to measure the voltage between AINP and AINN. The capacitors used are small, and to external
circuitry, the average loading appears resistive. This structure is shown in Figure 40. The resistance is set by the
capacitor values and the rate at which they are switched. Figure 41 shows the on/off setting of the switches
illustrated in Figure 40. During the sampling phase, switches S1 are closed. This event charges CA1 to AINP, CA2
to AINN, and CB to (AINP AINN). During the discharge phase, S1 is first opened and then S2 is closed. Both CA1
and CA2 then discharge to approximately 0.7V and CB discharges to 0V. This charging draws a very small
transient current from the source driving the ADS1118 analog inputs. The average value of this current can be
used to calculate the effective impedance (Reff), where Reff = VIN/IAVERAGE.
0.7V
CA1
AINP
S1
ZCM
S2
0.7V
Equivalent
Circuit
AINP
CB
S1
ZDIFF
S2
AINN
AINN
0.7V
ZCM
CA2
fCLK = 250kHz
0.7V
6.144V
(1)
4.096V(1) (1)
15M
2.048V
4.9M
1.024V
2.4M
0.512V
710k
0.256V
710k
15
ADS1118
SBAS457B OCTOBER 2010 REVISED AUGUST 2012
www.ti.com
The typical value of the input impedance cannot be neglected. Unless the input source has a low impedance, the
ADS1118 input impedance may affect the measurement accuracy. For sources with high output impedance,
buffering may be necessary. Note that active buffers introduce noise, and also introduce offset and gain errors.
All of these factors should be considered in high-accuracy applications.
Because the clock oscillator frequency drifts slightly with temperature, the input impedances also drift. For many
applications, this input impedance drift can be ignored, and the values given in Table 1 for typical input
impedance are valid.
FULL-SCALE INPUT
A PGA is implemented before the core of the ADS1118. The PGA can be set to gains of 2/3, 1, 2, 4, 8, and
16. Table 2 shows the corresponding full-scale (FS) ranges. The PGA is configured by three bits in the Config
register. The PGA = 2/3 setting allows input measurement to extend up to the supply voltage when VDD is larger
than 4V. Note, however, in this case (as well as for PGA = 1 and VDD < 4V) that it is not possible to reach a fullscale output code on the ADC. Analog input voltages may never exceed the analog input voltage limits given in
the Electrical Characteristics table.
Table 2. PGA Gain Full-Scale Range
(1)
16
PGA SETTING
FS (V)
2/3
6.144V(1) (1)
4.096V(1)
2.048V
1.024V
0.512V
16
0.256V
ADS1118
www.ti.com
DATA FORMAT
The ADS1118 provides 16 bits of data in binary twos complement format. The positive full-scale input produces
an output code of 7FFFh and the negative full-scale input produces an output code of 8000h. The output clips at
these codes for signals that exceed full-scale. Table 3 summarizes the ideal output codes for different input
signals. Figure 42 shows code transitions versus input voltage.
Table 3. Input Signal versus Ideal Output Code
INPUT SIGNAL, VIN
(AINP AINN)
15
FS (2
15
1)/2
7FFFh
+FS/215
0001h
0
15
FS/2
FFFFh
FS
(1)
8000h
0x7FFF
0x0001
0x0000
0xFFFF
Output Code
0x7FFE
0x8001
0x8000
-FS
2
15
-FS
2
FS
15
FS
2
-1
15
17
ADS1118
SBAS457B OCTOBER 2010 REVISED AUGUST 2012
www.ti.com
TEMPERATURE SENSOR
The temperature measurement mode of the ADS1118 is configured as a 14-bit result when enabled. Two bytes
must be read to obtain data. The first byte is the most significant byte (MSB), followed by a second byte, the
least significant byte (LSB). The first 14 bits are used to indicate temperature. That is, the 14-bit temperature
result is left-justified within the 16-bit result register and the last two bits always read back as '0'. One 14-bit LSB
equals 0.03125C. Negative numbers are represented in binary twos complement format.
Table 4. 14-bit Temperature Data Format
TEMPERATURE (C)
HEX
128
1000
127.96875
0FFF
100
0C80
80
0A00
75
0960
50
0640
25
0320
0.25
0008
0000
0.25
3FF8
25
3CE0
55
3920
18
ADS1118
www.ti.com
ALIASING
As with any data converter, if the input signal contains frequencies greater than half the data rate, aliasing
occurs. To prevent aliasing, the input signal must be bandlimited. Some signals are inherently bandlimited; for
example, the output of a thermocouple has a limited rate of change. Nevertheless, these signals can contain
noise and interference components. These components can fold back into the sampling band in the same way as
with any other signal.
The ADS1118 digital filter provides some attenuation of high-frequency noise, but the digital sinc filter frequency
response cannot completely replace an anti-aliasing filter. For some applications, some external filtering may be
needed; in such instances, a simple RC filter is adequate.
When designing an input filter circuit, be sure to take into account the interaction between the filter network and
the input impedance of the ADS1118.
OPERATING MODES
The ADS1118 operates in one of two modes: continuous conversion or single-shot. In continuous conversion
mode, the ADS1118 continuously performs conversions. Once a conversion has been completed, the ADS1118
places the result in the Conversion Register and immediately begins another conversion. In single-shot mode,
the ADS1118 waits until the OS bit is set high. Once asserted, the bit is set to '0', indicating that a conversion is
currently in progress. Once conversion data are ready, the OS bit reasserts and the device powers down. Writing
a '1' to the OS bit during a conversion has no effect.
SERIAL INTERFACE
The SPI-compatible serial interface consists of either four signals: CS, SCLK, DIN, and DOUT/DRDY; or three
signals, in which case CS may be tied low. The interface is used to read conversion data, read and write
registers, and control the ADS1118 operation.
19
ADS1118
SBAS457B OCTOBER 2010 REVISED AUGUST 2012
www.ti.com
POWER-DOWN MODE
When the PWDN bit in the Config Register is set to '1', the ADS1118 enters a lower power standby state. This
condition is also the default state the ADS1118 enters when power is first supplied. In this mode, the ADS1118
uses no more than 2A of current. During this time, the device responds to commands, but does not perform any
data conversion. To exit this mode, simply write a '0' to the PWDN bit in the Config Register.
20
ADS1118
www.ti.com
REGISTERS
The ADS1118 has two registers that are accessible via the SPI port. The Conversion Register contains the result
of the last conversion. The Config Register allows the modification of the ADS1118 operating modes and the
ability to query the status of the device.
Conversion Register
This 16-bit register contains the result of the last conversion in binary twos complement format. Following powerup, the Conversion Register is cleared to '0', and remains '0' until the first conversion is completed.
The register format is shown in Table 5.
Table 5. Conversion Register (Read-Only)
BIT
15
14
13
12
11
10
NAME
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
Config Register
The 16-bit register can be used to control the ADS1118 operating mode, input selection, data rate, PGA settings,
and comparator modes. The register format is shown in Table 6.
Table 6. Config Register (Read/Write)
BIT
15
14
13
12
NAME
OS
MUX2
MUX1
MUX0
11
10
PGA2
PGA1
PGA0
MODE
blank
BIT
NAME
DR2
DR1
DR0
TS_MODE
PULL_UP_
EN
NOP1
NOP2
CNV_RDY_FL
Default = 8583h.
Bit 15
Bits[14:12]
Bits[11:9]
Bit 8
100 : FS = 0.512V
101 : FS = 0.256V
110 : FS = 0.256V
111 : FS = 0.256V
(1)
This parameter expresses the full-scale range of the ADC scaling. In no event should more than VDD + 0.3V be applied to this device.
21
ADS1118
SBAS457B OCTOBER 2010 REVISED AUGUST 2012
Bits[7:5]
www.ti.com
Bit 4
Bit 3
Bits[2:0]
NOP: No operation
The NOP bits control whether data are written to the Config Register or not. In order for data to be written to
the Config Register, the NOP bits must be written as '01'. Any other value written to the NOP bits results in a
NOP command. This means that DIN can be held high or low during SCLK pulses without data being written to
the Config Register.
00 : Invalid data, do not update the contents of the Config Register.
01 : Valid data, update the Config Register (default)
10 : Invalid data, do not update the contents of the Config Register.
11: Invalid data, do not update the contents of the Config Register.
Bit 0
22
ADS1118
www.ti.com
DATA RETRIEVAL
Data may be read in one of two modes: Single-Shot and Continuous Conversion mode. The mode is selected by
writing to the OS bit in the Config Register.
Continuous Conversion Mode
In Continuous Conversion mode, the conversion data are read from the device without an op code command.
When DOUT/DRDY asserts low (indicating that new conversion data are ready), the conversion data are read by
shifting the data out on DOUT. The MSB of the data (bit 15) on DOUT/DRDY is clocked out on the first rising
edge of SCLK.
As shown in Figure 43, the data consist of two bytes for the conversion result and an additional two bytes for the
Config Register readback. The data read operation must be completed 16/fCLK cycles before DOUT asserts
again.
(1)
CS
17
25
SCLK
DOUT
Hi-Z
DIN
DATA MSB
DATA LSB
CONFIG MSB
CONFIG LSB
CONFIG MSB
CONFIG LSB
CONFIG MSB
CONFIG LSB
Next Data
Ready
(1) CS may be held low. If CS is low, DOUT/DRDY asserts low indicating new data.
CS
17
25
tUPDATE
SCLK
DOUT
DIN
Hi-Z
Data
Ready
DATA MSB
DATA LSB
CONFIG MSB
CONFIG LSB
CONFIG MSB
CONFIG LSB
CONFIG MSB
CONFIG LSB
Next Data
Ready
(1) CS may be held low. If CS is low, DOUT/DRDY asserts low indicating new data.
23
ADS1118
SBAS457B OCTOBER 2010 REVISED AUGUST 2012
www.ti.com
APPLICATION INFORMATION
The following sections give example circuits and suggestions for using the ADS1118 in various situations.
Device
10
VDD
DIN
Microcontroller or
Microprocessor
with SPI Port
SCLK
DOUT/DRDY
CS
VDD
GND
AIN3
AIN0
AIN2
0.1mF (typ)
AIN1
5
DOUT
DIN
Inputs Selected
from Configuration
Register
CS
SCLK
24
ADS1118
www.ti.com
It is recommended to employ best design practices when laying out a printed circuit board (PCB) for both analog
and digital components. This recommendation generally means that the layout should separate analog
components [such as ADCs, op amps, references, digital-to-analog converters (DACs), and analog MUXs] from
digital components [such as microcontrollers, complex programmable logic devices (CPLDs), field-programmable
gate arrays (FPGAs), radio frequency (RF) tranceivers, universal serial bus (USB) tranceivers, and switching
regulators]. An example of good component placement is shown in Figure 46. While Figure 46 provides a good
example of component placement, the best placement for each application is unique to the geometries,
components, and PCB fabrication capabilities being employed. That is, there is no single layout that is perfect for
every design and careful consideration must always be used when designing with any analog components.
ADS1118
Ground fill or
Ground plane
Supply
Generation
Interface
Tranceiver
Microprocessor
Optional: Split
Ground Cut
Signal
Conditioning
(RC filters
and
amplifiers)
Ground fill or
Ground plane
Optional: Split
Ground Cut
Ground fill or
Ground plane
Connector
or Antenna
Ground fill or
Ground plane
25
ADS1118
SBAS457B OCTOBER 2010 REVISED AUGUST 2012
www.ti.com
SCLK
DIN
10 DIN
1 SCLK DOUT/DRDY 9
2 CS
VDD
DOUT
3 GND
AIN3
CS1
4 AIN0
AIN2
AIN1
CS2
ADS1118
10 DIN
1 SCLK DOUT/DRDY 9
2 CS
VDD
3 GND
AIN3
AIN2
4 AIN0
AIN1
26
ADS1118
www.ti.com
SINGLE-ENDED INPUTS
Although the ADS1118 has two differential inputs, the device can easily measure four single-ended signals.
Figure 48 shows a single-ended connection scheme. The ADS1118 is configured for single-ended measurement
by configuring the MUX to measure each channel with respect to ground. Data are then read out of one input
based on the selection in the Config Register. The single-ended signal can range from 0V to supply. The
ADS1118 loses no linearity anywhere within the input range. Negative voltages cannot be applied to this circuit
because the ADS1118 can only accept positive voltages.
The ADS1118 input range is bipolar differential. The single-ended circuit shown in Figure 48 covers only half the
ADS1118 input scale because it does not produce differentially negative inputs; therefore, one bit of resolution is
lost. For optimal noise performance, it is recommended to use differential configurations whenever possible.
Differential configurations maximize the dynamic range of the ADC and provide strong attenuation of commonmode noise.
VDD
Device
10
DIN
SCLK
DOUT/DRDY
CS
VDD
GND
AIN3
AIN0
AIN2
0.1mF (typ)
AIN1
5
Inputs Selected
from Configuration
Register
27
ADS1118
SBAS457B OCTOBER 2010 REVISED AUGUST 2012
www.ti.com
3.3V
RPU = 1M
GND
CCMA = 0.1 F
500
AIN0
VDD
RDIFFA
CDIFF = 1 F
AIN1
RDIFFB
RPD = 1M
500
CCMB = 0.1 F
Voltage
Reference
SCLK
GND
GND
PGA
GND
3.3V
RPU = 1M
MUX
Digital Filter
and
Interface
16-bit
ADC
DIN
CCMA = 0.1 F
500
CS
DOUT/DRDY
AIN2
RDIFFA
CDIFF = 1 F
RPD = 1M
GND
Oscillator
AIN3
RDIFFB
500
Temp Sensor
GND
CCMB = 0.1 F
GND
GND
28
ADS1118
www.ti.com
The two 1M resistors (RPU and RPD) serve two purposes. The first purpose is to offer a common-mode bias
near midsupply. While the ADS1118 does offer the ability to float the common-mode of a signal or connect any of
the inputs to a common point such as ground or supply, it is generally recommended to avoid such situations.
Connecting one of the inputs to a common point decreases performance by converting common-mode noise into
differential signal noise that is not strongly attenuated. The second purpose of the 1M resistors is to offer a
weak pull-up and pull-down for sensor open detection. In the event that a sensor is disconnected, the inputs to
the ADC extend to supply and ground and yield a full-scale readout, indicating a sensor disconnection.
The procedure to actually achieve cold junction compensation is simple and can be done in several ways. One
way is to interleave readings between the thermocouple inputs and the temperature sensor. That is, acquire one
on-chip temperature result for every thermocouple ADC voltage measured. If the cold junction is in a very stable
environment, more periodic cold junction measurements may be sufficient. These operations yield two results for
every thermocouple measurement and cold junction measurement cycle: the thermocouple voltage or VTC and
the on-chip temperature or TCJC. In order to account for the cold junction, the temperature sensor within the
ADS1118 must first be converted to a voltage proportional to the thermocouple currently being used yielding
VCJC. This conversion is generally accomplished by performing a reverse lookup on the table being used for the
thermocouple voltage to temperature conversion. Then, adding the two voltages yields the thermocouple
compensated voltage VActual where VCJC + VTC = VActual. VActual is then converted to temperature using the same
lookup table from before, yielding TActual.
Thermocouple manufacturers usually supply a lookup table with their thermocouples that offer excellent accuracy
for linearization of a specific type of thermocouple. The granularity on these lookup tables is generally very
precise (at around 1C for each lookup value). To save microcontroller memory and development time, an
interpolation technique applied to these values can be used. By choosing 16 to 32 equally-spaced values from
the manufacturer's lookup tables over a desired temperature range, using a simple linear approximation of
intervals between is generally very precise.
29
ADS1118
SBAS457B OCTOBER 2010 REVISED AUGUST 2012
www.ti.com
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (July 2011) to Revision B
Page
30
www.ti.com
17-Sep-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
(3)
ADS1118IDGSR
ACTIVE
MSOP
DGS
10
2500
Green (RoHS
& no Sb/Br)
ADS1118IDGST
ACTIVE
MSOP
DGS
10
250
Green (RoHS
& no Sb/Br)
ADS1118IRUGR
ACTIVE
X2QFN
RUG
10
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
ADS1118IRUGT
ACTIVE
X2QFN
RUG
10
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Samples
(Requires Login)
(1)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
26-Sep-2012
Device
ADS1118IDGSR
DGS
10
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2500
330.0
12.4
5.3
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3.3
1.3
8.0
12.0
Q1
ADS1118IDGST
MSOP
DGS
10
250
180.0
12.4
5.3
3.3
1.3
8.0
12.0
Q1
ADS1118IRUGR
X2QFN
RUG
10
3000
179.0
8.4
1.75
2.25
0.65
4.0
8.0
Q1
ADS1118IRUGT
X2QFN
RUG
10
250
179.0
8.4
1.75
2.25
0.65
4.0
8.0
Q1
Pack Materials-Page 1
26-Sep-2012
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
ADS1118IDGSR
MSOP
DGS
10
2500
370.0
355.0
55.0
ADS1118IDGST
MSOP
DGS
10
250
195.0
200.0
45.0
ADS1118IRUGR
X2QFN
RUG
10
3000
203.0
203.0
35.0
ADS1118IRUGT
X2QFN
RUG
10
250
203.0
203.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TIs goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Applications
Audio
www.ti.com/audio
www.ti.com/automotive
Amplifiers
amplifier.ti.com
www.ti.com/communications
Data Converters
dataconverter.ti.com
www.ti.com/computers
DLP Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
www.ti.com/energy
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
www.ti.com/video
RFID
www.ti-rfid.com
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright 2012, Texas Instruments Incorporated