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M100G125 - 1

800

M100G125 - 2

30

-/2
- 
-;/

-

Eon

mWs

600
20

400
10
Eoff

200
E

Ptot

0
0

20

TC

40

60

80

100

120

140

0
IC

160
C

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40

60

80

100

120

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40

20

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mWs
30

M100G125 - 4

1000
A

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tp=
10s

100

Eon

100s

20

10
1ms
Eoff

10

@5
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10ms

1
IC

E
0

0,1
0 R
G

20

40

60

80

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10

100

1000

10000

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2,5

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12

/ 2

10
di/dt=1000 A/s
3000 A/s
5000 A/s

8
1,5

/ 2
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BM/7A
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6
allowed numbers of
short circuits: <1000

1
4
0,5

2
ICSC/IC

ICpuls/IC
0

0
0

200

VCE

400

600

800

1000 1200 1400


V

?$#8/'579@@"+@,4,5+$7#+5,+!
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1

time between short


circuits: >1s

200
VCE

400

600

800

1000 1200 1400


V

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M100G125 - 8

150

-/ 2
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100

50

IC
0
0

TC

20

40

60

80

100

120

140

160
C

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M100G125 - 9

160

A
140

140

17V
15V
13V
11V
9V
7V

120
100

100
80

60

60

40

40

20
IC

20
IC
0

0
VCE

17V
15V
13V
11V
9V
7V

120

80

M100G125 - 10

160

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M100G125 - 12

150

*7)!-"+!N!

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100

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50

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SKM 100 GB 125 DN

M100G125 - 13

20
V

ICpuls = 75 A

18

800V

14

VGE = 0 V
f = 1 MHz

nF

600

16

M100G125.XLS-14

100

10

Cies

12
10
8

4
VGE

Coes

6
C

2
0

Cres

0,1
0 Q
Gate

200

400

600

nC

800

Fig. 13 Typ. gate charge characteristic

10

20

30

Fig. 14 Typ. capacitances vs.VCE

M100G125 - 15

1000

VCE

Tj = 125 C
VCE = 600 V
VGE = 15 V
RGon = 12
RGoff = 12
induct. load

tdoff
ns

M100G125 - 16

10000

Tj = 125 C
VCE = 600 V
VGE = 15 V
IC = 75 A
induct. load

tdoff

ns

1000
tdon

tdon
100

100

tr

tr

tf

tf
10

10
0

IC

20

40

60

80

100

120
A

Fig. 15 Typ. switching times vs. IC

RG

20

40

60

Fig. 16 Typ. switching times vs. gate resistor RG


M100G125 - 18

M100G125.XLS-17

100

80

A
80

RG=
6

12

Tj=25C, typ.

Tj=125C, max.

60

VCC = 600 V
Tj = 125 C
VGE = 15 V

mJ

Tj=125C, typ.

20

Tj=25C, max.

40

60

2
20

1
EoffD

IF
0

0
0

VF

Fig. 17 Typ. CAL diode forward characteristic




IF

50

100

150

Fig. 18 Diode turn-off energy dissipation per pulse


 

by SEMIKRON

SKM 100 GB 125 DN

M100G125 - 19

M100G125 - 20

1
K/W

K/W
0,1

0,1

0,01

0,01

D=0,50
0,20
0,10
0,05
0,02
0,01

0,001
ZthJC

0,001
single pulse
ZthJC

single pulse

0,0001
0,00001 0,0001
tp

D=0,5
0,2
0,1
0,05
0,02
0,01

0,001

0,01

0,1

0,0001
0,00001

Fig. 19 Transient thermal impedance of IGBT


ZthJC = f (tp); D = tp / tc = tp f

A
RG=
6

0,0001

0,001

0,01

0,1

Fig. 20 Transient thermal impedance of


inverse CAL diodes Zthjc = f (tp); D = tp / tc = tp f
M100G125 - 23

M100G125 - 22

120

tp

120

- 
-/2
-:/

- 
-/2
-:/
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A
RG= 6

80

80
9
9
12

12

40

40

20

20

60

60

IRR

IRR
0

0
0

IF

40

80

A 120

Fig. 22 Typ. CAL diode peak reverse recovery


current IRR = f (IF; RG)

A/us 5000

2500

diF/dt

Fig. 23 Typ. CAL diode peak reverse recovery


current IRR = f (di/dt)
M100G125 - 24

20
uC
15
12

RG= 6 I =
F
100 A

20

75 A

60

10

- 
-/2
-:/

56 A
38 A
19 A

5
Qrr
0
0

diF/dt

2500

A/us

5000

Fig. 24 Typ. CAL diode recovered charge Qrr-@!)$0)


by SEMIKRON

010924

B 6 41



SEMITRANS 2N (low inductance)
Case D 93
UL Recognized
File no. E 63 532




Dimensions in mm
Case outline and circuit diagram

Mechanical Data
Symbol Conditions
M1
M2
a
w

to heatsink, SI Units
to heatsink, US Units
for terminals, SI Units
for terminals, US Units

Values
(M6)
(M5)

Units

min.

typ.

max.

3
27
2,5
22

5
44
5
44
5x9,81
160

Nm
lb.in.
Nm
lb.in.
m/s2
g

This is an electrostatic discharge


sensitive device (ESDS).
Please observe the international
standard IEC 747-1, Chapter IX.
Eight devices are supplied in one
SEMIBOX A without mounting hardware, which can be ordered separately under Ident No. 33321100 (for
10 SEMITRANS 2)
Larger packing units of 20 and 42
pieces are used if suitable

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