Professional Documents
Culture Documents
Agenda
Mutlipaction
Corona (critical pressure)
Passive Intermodulation
Multipaction
OUTLINE
What is multipaction?
What are requirements for multipaction?
Some underlying physics
Description of multipaction curves
General procedure for analysis
Examples
Preventions
Design Limitations and effects
Testing and detection
4
Multipaction
Multipaction-overview
Time: (0 to )
Time: ( to 2)
e-
E
Secondary
Electrons
E = E0 sin (wt)
Multipaction
Multipaction
Multipaction
Electron Tracking
Multipaction has three stages
Drift
Due to initial velocity
Oscillation due to field superimposed on motion
Terminated by collision with wall (low energy, low yield)
Synchronization
Electrons travel out of step with applied field
Some collisions productive; others not
Build up
Electrons in sync with applied field
All collisions somewhat productive
Multipaction
Multipaction
Multipaction Mode
10
Multipaction
Multipaction Modes
(Hatch and Williams curves)
11
Multipaction
Multipaction Modes
(Susceptibility curves)
12
Multipaction
Multipaction Modes
Asymmetric modes
3/2 cycle transit one way
cycle transit other direction
other way
Net energy gain each direction
Integral number of cycles for
each round trip
Hybrid modes
Alternating between modes
every round trip
Eg. 3 cycles, 4cycles, 3
cycles, 4cycles, 3 cycles,
4cycles
Transition between two modes
13
Multipaction
14
Multipaction
Multipaction
Example #1 Transition
Two areas for concern are:
Vc
Vw
Vg
16
Multipaction
Transition
Coaxial Structure
Hole diameter is .162 in. Centre conductor is .050 in.
gap = .056 in = 1.422 mm
@f = 10.95 GHz, fd = 15.57 GHz mm
For Ag/Au surface, breakdown voltage V = 981 V(from
multipaction curves)
Pb = V2/2ZC = 9.62 kW
(ZC = 50 )
17
Multipaction
Transition
Probe Structure
Typical gap is .140 in.
gap = .140 in = 3.55 mm
(ZW = 543 )
18
Multipaction
Preventive Measures
Decrease the gap size below multipaction cutoff or increase in
the gap sizes higher than operating power/voltage.
19
Multipaction
20
Multipaction
Direct consequences
21
Multipaction
Detection methods
Local:
Electron probes
fibre optic
Mass spectrometer
Global :
nulling
Harmonics
22
Multipaction
LNA
SPECTRUM
ANALYZER
LNA
W/G Taper
Phased
Adjusted
W/G Short
BPF 2
Near Band
Noise
VACUUM CHAMBER
Synthesized
Source
HPA
LPF
BPF1
Internally
PM 3
PM 1
PM2
PM 5
PM1:
PM2:
PM3:
PM4:
PM5:
PM 4
Temperature
Monitoring
System (T Type
Thermocouple)
DUT
Elect
ron
Prob
e
Pico
Amp
Meter
23
Multipaction
Multipaction
Multipaction detection plots
25
Multipaction
RF breakdown phenomena
Takes place under vacuum conditions only.
Requires the presence of high electrical fields between surfaces
Free electrons accelerated by RF voltage to create an electron resonance growth.
The breakdown level is affected by:
- operating frequency
- applied RF voltage
- surface conditions
eSecondary
Electrons
Time: ( to 2)
E = E0 sin (wt)
26
Multipaction
Prediction:
- breakdown level is a function of fxd
- typical calculation is based on Hatch & Williams curve
Detection:
- near band noise floor
- harmonic detection
- forward/reverse power(nuling)
- electron probe detector
Prevention:
- control of frequency-gap product
- avoid sharp edges
- dielectric filling
- pressurization
27
Corona
28
29
Corona
Corona
Paschens Law
31
Corona
Critical pressure-Analysis
32
Corona
Preventive Measures
Pressurization
Cavity/Resonator
Lid
33
Passive Intermodulation
PIM
(A multidisciplinary problem)
34
Passive Intermodulation
Outline
Introduction
General review
PIM Sources
Design examples
Waveguide
Coaxial
35
Passive Intermodulation
Introduction
Passive Intermodulation
General Review
PIM is generated by the device non-linear relationship between
current and voltage
This non-linearity excites the harmonics of the input signals (2f1, 2f2,
3f1,) as well as the intermodulation products (f1+f2, 2f1+f2,)
The issue is typically associated with:
- High transmit power level
- High receive sensitivity
- maintained response over thermals is required
PIM level difficult to analyze or predict
Carriers
Example:
PIM (dB)
PIM Products
fc1=3705 MHz
COMUX
fc2=4195 MHz
Tx
Rx
F1+F2
3rd
5th
7th
9th
11th
Freq (MHz)
37
Passive Intermodulation
38
Passive Intermodulation
Cu shim 0.003-0.005"
Filter lid
waveguide
A dimension (e.g. 0.75")
Cavity wall
x microinches (e.g. 8, 16, 32)
filter boby halve
max
average
min
39
Passive Intermodulation
c
2
Band
Approx. Freq.
Range (GHz)
Skin Depth s
(Thou)
UHF
0.2 - 0.8
0.178 - 0.0891
1.5 1.6
0.065 0.063
2.0 2.7
0.056 0.048
3.7 7.25
0.041 0.029
7.25 8.4
0.029 0.0275
Ku
10.7 18
0.024 0.018
Ka
18 31
0.024 0.014
44
0.012
40
Passive Intermodulation
PIM sources
Tuning screws
They are located at high fields and currents regions to allow tunability, contact issue remain between
screw and filter body
Poor solder joints
If some flux residue (non linear material) is left after cleaning operation
Solder joints under high stress
Joint may crack creating a contact problem
Contamination
Minute metal particle from helical coils, bolts
Any other material
Micro cracks
When semi rigid cables are bent, it may originate a crack on the internal or external conductors
41
Passive Intermodulation
The lower the order of the product the stronger is expected its presence.
General rule is that the amplitude of the PIM signal is proportional to the amplitude
of each carrier.
-138
-145+log10(P**3)
-138.5
-139
-139.5
PIM (dBm)
-140
-140.5
-141
-141.5
-142
20
40
60
80
100
120
140
P(W)
42
Passive Intermodulation
43
Passive Intermodulation
Rx-band
0.00
-20.00
-40.00
S11 MUX
S12 CH1
S12 CH2
S12 CH3
S12 CH4
S12 cover filter
S11 cover filter
-80.00
-100.00
-120.00
-140.00
8990
8930
8869
8809
8749
8688
8628
8568
8508
8447
8387
8327
8266
8206
8146
8085
8025
7960
7900
7840
7780
7720
7660
7600
7540
7480
7420
7360
7300
7240
7180
7120
7060
-160.00
7000
Isolation (dB)
-60.00
Frequency
44
Passive Intermodulation
46
Passive Intermodulation
Transmit Path J1
Antenna
Connection J3
Receive Path J2
47
Passive Intermodulation
48
Passive Intermodulation
49
Passive Intermodulation
BPF(F
1)
BPF(F
2)
H-plane
bend
BPF(F
2)
Al
Brackets
Cover filter BB
Al
BPF\LPF
existing in
lab
(to reduce
the noise)
Al
Detection
diplexer
location of
DUT input
interface
Cover filter BB
hot plate
Detection
diplexer
SA
Input filter
SA
Cover filter BB
Al
BPF
Al
Al
Example of configuration
during formal test.
DUT is a 2 channel MUX
with output cover filter
DUT has
vertical w/g
input
(circulator)
Al
DUT
hot plate
BPF
50
Passive Intermodulation
51
Passive Intermodulation
PIM detect
PIM free
52
Passive Intermodulation
PIM summary
PIM is generated by the device non-linear response
The issue typically associated with:
- high transmit power level
- high receive sensitivity
- only one antenna (common port) for Tx and Rx
Example:
PIM Products
fc1=3705 MHz
COMUX
fc2=4195 MHz
Tx
Rx
F1+F2
3rd
5th
7th
9th
11th
Freq (MHz)
53
Passive Intermodulation
Dominant contributors of non-linearity(for passive device):
- similar or dissimilar metal-to-metal joints
- poor mechanical contact
- poor surface finish
- high current density
- temperature variation
- magnetic non-linear effects
54
Thank You
55