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TECHNOLOGICAL INSTITUTE OF THE PHILIPPINES

Aurora Blvd.. Cubao, Quezon City

COMPUTER ENGINEERING
DRAFTING AND DESIGN

LABORATORY ACTIVITY MANUAL


By:
Engr. Ronnie M. Dysangco
Engr. Maria Cecilia A. Venal

Table of Contents
INTRODUCTION ........................................................................................................................................... 4
ELECTRONIC SYMBOLS ......................................................................................................................... 4
ZenitPCB Layout ....................................................................................................................................... 5
Main Menu ............................................................................................................................................ 6
Design Rule: ......................................................................................................................................... 8
Error List browser Example ................................................................................................................... 9
Component Properties: ......................................................................................................................... 9
Bottom Soldering ................................................................................................................................ 12
Net Class Color ................................................................................................................................... 13
Net Properties ..................................................................................................................................... 14
Board Outline ...................................................................................................................................... 14
ZenitPCB Libraries .................................................................................................................................. 27
Decal Library Report ............................................................................................................................... 27
ACTIVITIES ................................................................................................................................................. 31
Activity No. 1................................................................................................................................... 32
PCB ETCHING AND ENGRAVING ........................................................................................... 32
Activity No. 2................................................................................................................................... 35
PCB DRILLING .......................................................................................................................... 35
Activity No. 3................................................................................................................................... 38
PCB SOLDERING ..................................................................................................................... 38
Activity No. 4................................................................................................................................... 41
BLOCK DIAGRAM AND FLOWCHARTING ............................................................................. 41
Activity No. 5................................................................................................................................... 48
LED LIGHTS CIRCUIT .............................................................................................................. 48
Activity No. 6................................................................................................................................... 53
BATTERY MONITORING CIRCUIT........................................................................................... 53
Activity No. 7................................................................................................................................... 58
PIC12C508SM CIRCUIT ............................................................................................................ 58
Activity No. 8................................................................................................................................... 66
COMPLEX CIRCUIT .................................................................................................................. 66
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Activity No. 9................................................................................................................................... 69


DC MOTOR CONTROLLER CIRCUIT ...................................................................................... 69
Activity No. 10................................................................................................................................. 72
USB INTERFACE CIRCUIT ....................................................................................................... 72

INTRODUCTION
ELECTRONIC SYMBOLS
Table 1Electronic Classification
Classification
1. Passive Components
2. Active Components

Description
It is a classification of electronic component that is
used for resistance of electrical current and storing
of electrical charge through a capacitance
It is classified as part of the semiconductor devices
such as diode, Bipolar Junction Transistor (BJT),
Vacuum Tube devices such as Vacuum tube
diode, triode, Tetrode, Pentode, etc.

Table 2 Basic Electronic Symbols


Name

Actual Image

Symbol

Transformer

Resistor

Capacitor

Fuse
Coil

Diode

Zener Diode

Varactor Diode

LED
(Light Emitting Diode)
Transistor
FET
(Field Effect Transistor)
Speaker

Microphone

Switch

Battery / Dry Cell

Motor

Integrated Circuit

ZenitPCB Layout
It is a complete open source software for PCB lay outing for personal or semi-professional circuit
development. It has a border line of 800 pins between the hobby and professional jobs and is one
of the advantages of this software. It is directed to all people who want to design a printed circuit
board or to students who want to create their own PCB design. The user interface in ZenitPCB has
been written using the Windows standard and it has been carefully designed to enable the user to
both learn the product quickly and make ZenitPCB output.

Main Menu
It contains all the headings for the main sub-menus and
commands. It also contains the application menus such as File,
View, Setup, etc.
The menu items are:

Figure 1 Main Menu

File It contains options to manage and save the data files.

View it contains options to zoom in/out the board


and to open a dialog bar.

Figure 1-a File Menu

Figure 1-b View Menu

Figure 1-b1 Fit Board and Fit all Elements


Layers:
This window displays the possible color for each layer of the
layout.

Figure 1-b-2 Display Layers


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Project Explorer:
This window contains the contents of the
grouped design which could either be
components or nets. It is shown in Figure 1-b-3.

Figure 1-b-3 Project Explorer


DRC:
This window contains check boxes that enable
various designer specifications. Each check
indicates the status of each choice.

Figure 1-b-4 DRC

Design Rule:
1. Electrical Elements [E-E]
This design rule shows the content of the net class property that can be modified with the trace width
and clearance.

Figure 1-b-4a Electrical Elements


2. Board Outline [B-E]
This design rule is asking for the clearance
between all Electrical Elements and Board
Outline.
3. Mounting Hole [M-E]
This design rule is asking for the clearance
between all Electrical Elements and Mounting
Holes.
4. Copper Pour [C-E]

Figure 1-b-5

This design rule is asking for the clearance


between all Electrical Elements and Copper Pour.
5. Component Outline [C-C]
This design rule is asking the clearance between all
Components. The system uses the placement outline
as references.
6. Text on Pad [T-P]
This design rule is asking the clearance between all
Pads and Silkscreen Text. (See Figure 1-b to 4b).

Figure 1-b-4b Component Outline

To execute this procedure go to setup on the select option.


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Error List browser Example

Figure 1-b-4c Element to Element

Figure 1-b-4e Component to Component

Figure 1-b-4d Text over Pad

Figure 1-b-4f Net not Routed

Component Properties:
This dialog contains all properties concern with the selected component, as shown in Figure 1-b-5
a.
b.
c.
d.
e.
f.
g.

Component
Location
Silk
Height
Bottom Decal (Refer to Figure 1-b-5a)
Plot Gerber Reference
Edit Button

Figure 1-b-5a Component Modification Window

Place Component:
In placing the component the bin contains all imported parts from the netlist which is easier to place all
parts according to the user needs. It is possible to place parts sequentially or one by one, on top layer or
bottom layer.
Line Offset:
Offset Line gives user the opportunity to copy or move shapes horizontally or vertically as shown in Figure
1-c.

Figure 1-c Offset

Board Report:
This part of ZenitPCB gives information about the project such as the number of components, trace width
and etc.
Current Capacity of Track:
This feature of ZenitPCB
gives information on the
total Ampere a trace could
carry. There are also
available formulas that can
be used such as Empirical,
Foil
Thickness
and
Temperature rise above
ambient as shown in Figure
1-d.

Figure 1-d Current Capacity

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Setup It contains the project options and the net class & properties as shown in Figure 1-e.
Grid
It is used to define the units. Basic working units
can be changed between Imperial and Metric
design units. The design units are stored in an
internal database with a precision of 1 micron.
Grids are used in ZenitSuite for defining the points
or steps that items will snap to when they are
placed and for visible references in the design as
shown in Figure 1-e-1.
Figure 1-e Set up
F
Option
It is used to change parameters relating to several
disparate functions within the system as shown in Figure
1-e2.

Figure 1-e1 Grid Settings

Figure 1-e2 Default Options

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Following Setting up:


Display
a. Zoom Around Component
1. Selected: to zoom components use the roller of the
mouse.
2. Not Selected: When looking for the components, the
workspaces use the actual view and put the
component on screen center. (Refer: Figures 1-fa1fa3)
b. Fill BoardOutline
Used for TruePCB view with Color Layer
c. OnFly Mouse over Components
Used when "overfly" with mouse a component, it can be
obtained by accessing the component name on status
bar without selecting method.
d. Print Center Sheet
It is used to print the project on the center screen.
e. Low Color on Pads
It is used to see how the traces enter on pad.
f. Zoom Effort & Pan Effort
It is the way of setting the Zoom and the Pan Increment
as shown in Figure 1-fb.
g. Hide Refer
Set the Hide/Show Reference when Zoom-Out and
Zoom-In

Figure 1-fa1

Figuren1-fa2

Figure 1-fa3

h. Net Class Show Color


It is very useful during the routing
procedure in identifying the glance, what
are the net class through different colors.
Bottom Soldering
Shows the portion of the board in which the holes
side would be shown for soldering procedure.

Figure 1-fb Mouse and Pan control


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DRC
Set non Electrical Elements Clearance
1. Silkscreen Text to Pads
2. Component to Component ( through Placement
Outline ) as shown in Figure 1-g
3. Mounting Hole to Electrical Elements
4. Board Outline to Electrical Elements
5. Fill Type
Elements of Fill Type
a. Fixed Pad
b. Fixed Trace
c. Route&Plane Obstruct
d. Component Obstruct
e. Fixed Hatch Color Like (for Trace)
Directory

Figure 1-g Route and component Obstruct

Setting up the locations of the following as shown in


Figure 1-h:
Net Class
ZenitPCB Layout may assign to each net, a design rule
that is enclosed in the Net Class. After set the net classes,
it will be saved on a setting file. The ZenitPCB Layout may
be assigned to each net; a design rule is enclosed in the
Net Class.
Net Class width of the trace:
1. Min

Figure 1-h Default Options Directory Window

2. Typical
3. Max
Save
After setting the net classes, it can be used on
another project without setting the NetClass.
File Menu:
1. Import
2. Export
Net Class Color

Figure 1-i Net Class Window

Is used to change the color of the net class


connection (ratsline) during the routing which is very useful to know, at a glance, the net class through
different colors.
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Net Properties
After creating the net class user can "join" each net with a class (Net Properties) as shown in
Figure 1-j.
Example
Assign a net class to net GND
1. Find the net name GND on the list
2. Select the item (check box selected)
3. Choose the net class "GND" on the combo box
4. Then Set it.
Set Dimension
it is used to set all dimension items as shown in Figure 1-k

Figure 1-j Nets Property Window

Place It contains the options to add new


items as shown in Figure 1-l.

Figure 1-k Dimension Setting


Board Outline
Wizard
To create a Rectangle or square board outline, here are the
easy steps to follow:
1.
Set the units (Default MM);
2.
Set the Length of the board;
3.
Set the Width of the board;
4.
Set the distance of the MountingHole from the board edge;
5.
Set the width of the board line as shown in Figure 1-l1.; and
6.
Then choose the right MountingHole you need;

Figure 1-l Place Properties

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Figure 1-l1BoardOutline Wizard


Polyline
Draw the board outline in a standard way, insertline and arc as the shape. The modification procedure as
shown in Figure 1-l2 shows the possible modification.

Figure 1-l2 Polyline


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Shape
In inserting a shape on a specific layer of the project the following are the available shapes that can be
used:
1. Line
2. Open Shape ( Not Close Polyline )
3. Close Shape ( Close Polyline )
4. Circle Shape
Edit Shape
This mode is used to sequentially add shape segments into a design, either to finish off a new shape being
added, or to rework an existing shape segment.
Place a New Shape
It contains the Place Shape or Draw Shape Toolbar, to start a particular type of shape. Pick a position and
then place into Edit Shape Mode as shown in Figure 1-m.

Figure 1-m Place a New Shape

Board Outline Wizard as shown at Figure 1-n


It used to create a Rectangle or square
board outline. Below are the steps on
creating the said Shape:
1. Set the units (Default MM)
2. Set the Length of the board
3. Set the Width of the board
4. Set the distance of the MountingHole
from the board edge
5. Set the width of the board line
6. Then choose the right MountingHole.
Figure 1-n Board Outline Wizard

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Copper Pour
It is used to flood unrouted areas of a PCB layout with copper
usually connected to a nominated signal - typically Ground (GND)
or VCC. This facility will then create voids around unconnected
tracks, components, pads, etc.

Figure 1-o Copper Pour Window

Figure 1-o1 Mounting Holes


Text
Use Insert Text to add displayed text to a design or library item
as shown in Figure 1-p
Font Type:
a. Simplex
b. Duplex
c. Triplex
d. Modern
Dimension

Figure 1-p Text

Insert Dimension is used to dimension items within the design,


or gaps between items within the design. It is used to display (in the form of a dimension) lengths of items
or points as shown in Figure 1-q.

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Figure 1-q Dimension


Dimension Setup:
Setting up defaults that:
1.
2.
3.
4.

Select the layer on which the Dimensions are placed (Layer)


Specify the units and the number of decimal places displayed by the Dimension values (Units)
Set up the appearance and size of the Dimension arrows
Set up the text size and format
Add Dimensions (Refer to Figure 1-q1)
Before adding dimensions you need to set up the
format and appearance of the dimensions:
1. Select the Dimension tab.
2. Choose Horizontal or Vertical Dimensions
3. Select First Point (This command is noted on
status bar). The screen cursor shows 1st.
4. Select Second Point (This command is noted
on status bar). The screen cursor shows 2nd.
Figure 1-q1 Set Dimension Window

5. At the end, select the line and text


position. The screen cursor shows 3rd.

To Move and Edit Dimensions (Refer at Figure 1-q2)


1.
2.
3.
4.
5.
6.

Select Line
Right Click and Move
Choose the new point
Click to new point
Select Line
On Popup Show Unit

Figure 1-q2 Move and Edit Dimension


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Pick&Place Origin
Set the origin of the Pick & Place.
On this way it be can changed to XY reference, depending on the better point (fiducials, board), chosen for
the PCB assembly.
Mounting Hole
it is use to insert a mounting hole item into a PCB design or Component footprint. A mounting hole is like a
through-hole pad but is a Not Plated hole and uses a pad style, but does not have a pin number and will not
be included in a PCB netlist.
Slot Not Plated
Slot is a linear not plated milling hole .that can define it on
Padstack dialog as shown in Figure1-p. It is useful to increase
the clearance on the project or for mechanical clips.
Fiducial
Insert a Fiducial Pad into layout. Fiducials are necessary to
assemble the PCB like reference point for pick & place
machines as shown in Figure 1-r.

Figure 1-q Slot Property

Place Via (Only on Toolbar)


Add Vias into layout.

Figure 1-r Fiducial

1. Select from Combo box the Add Vias type.


2. Select, from "Net Name" combo box, the net or click
on trace or pad to get the right net name.
3. Place the component via on project with Apply Button
Figure 1-s PlaceVias

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Action - it contains the utilities for specialize tasks.

Figure 1-t Action Menu


Route Trace
Manual track routing in ZenitPCB has been developed for easy understanding and usage. At the same time
it is extremely flexible, so there are a number of features to become familiar with.
Delete All Trace
Delete all trace (Fix and Unfix) and vias.
High-Light Pad without Net
With menu command "Highlight pads without nets" Useful on
forward annotation changes
Select All Components
Select all components on workspace.
Replace Component
Replace selected component footprint, with a new one with the
Figure 1-u High Light Pad
same pin number.
Rename Component
Rename the selected component Reference. A warning is
displayed if there is another equal Reference Name as shown in
Figure 1-t.
Delete Component
Delete selected component.
Figure 1-t Rename Reference Window

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AutoRename Reference
Renumber Reference is used to interactively re-sequence the numeric order of the names of Components
Reference. The names of items normally consist of an alphabetic prefix followed by a number. Rename
adjusts the number for an item with the given prefix.
Add Connection
It is possible to Insert Connections directly into the layout, without necessarily having to import a netlist.
Delete Connection
Select a pad to detach the net. Then create a new connection in the
pad.
Delete All Copper
Delete all copper poured. Clearly not remove the copper pour
shape.
Show Copper Name
It can be selected to show or not, the net name about a copper
Figure 1-u Show-Copper Name
pours shape. The name will be showed on shape origin as shown in
Figure1-u.
Update Part from Library

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Import Jumpers on Project

ZenitPCB allows exporting reports into ASCII files, necessary for assembly printed circuit board.
The formatting of files can be either classical (as the image) or CSV (separator).

Help - Use this menu to access the on-line help system and other support features.

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Main Toolbars

Figure 3 Draw Shape

Figure 2 Main Menu

Figure 4 Filter

Figure 5 PCB Command

Figure 7 Dimension
Figure 6 Copper Pour

Figure 8 Obstruct Shape

Figure 9 Decal Type

Decal Editor
Figure 10 Utility
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Work Space
Add Pad
Open the "Add Pads" Dialog
Insert one or more pads.
Use the button "Select". The system opens the Padstack
library, choose the appropriate pad.
Set the Position X,Y and Angle of the pad.

Figure 11 Add PAds

Figure 12 Multiple Pads

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Copy Properties
Copy the properties of selected pad into other pads when selected them.

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How to add Placement Outline Shape


Select "Placement Outline" from Action->Draw or from
Placement outlines Button on Draw Shape toolbar.
The system uses the placement outline to check Component to
Component constraint see picture below
Set-Change Shape Width and Change Layer Combo box
Before creating a shape, set a width of the polyline.
Selecting an existing polyline, set a new value and confirm the
value with the key "W".

Library Manager
List the system shown:
1.
2.
3.
4.
5.
6.
7.
8.
9.

Name of the component


Decal Type
Description
Prefix
Value
Price
Height
List of Pad Type
Footprint (Decal) Preview

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ZenitPCB Libraries
ZenitPCB provides more than 800 components (SMD & TH) for an immediate placement on
project.
Table 3 List of Components
Chip Capacitor

Chip Resistor

Metal Electrode Face


( MELF )
Chip Inductor
Chip Tantalum Capacitor
Ceramic Flat Packs
( CFP )
Plastic Quad Flat ( PQFP )
Quad Flat Packs ( QFP )
Shrink Quad Flat Pack
( SQFP )
Plastic Leaded Chip Carriers Rectangle Plastic Leaded Chip Carriers Square Thin
Small
Outline
(PLCC)
(PLCC)
Packaged ( TSOP )
Small Outline ICs ( SOIC )
Small Outline J-Lead ICs (SOJ)
Small Outline Packages
( SOP )
Shrink Small Outline ICs (SSOIC)
SMD Dual in Line
Miscellaneous Decals
Through-Hole DIPs

Through-Hole Axials

Through-Hole Radials

Transistors

Stocko Connectors

Molex Connectors

Lumberg Connectors

Miscellaneus SMD

Jumpers

Decal Library Report


This is a Report overview of all decals inside libraries.

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Padstack
In Padstack dialog you can create, copy or delete padstack.

Padstack Properties:
4 Types:
Through
Hole

Padstack with Plated Drill Through Hole.

SMD

Surface mount device Pad

Mounting
Hole
Fiducial

Padstack with Not-Plated Drill Through Hole.


Surface mount Pad used for Pick&Place
equipment.
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Hole Type:
Round Drill (Report on Through-hole Plated & Not Plated Files)
Round
Slotted Drill (Report on Slot Plated & Not Slot Plated)
Slotted
Plated: Plated or not the hole
Create New Offset Pads

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Pads Properties:
On the form Option it is possible to set the padstak library, so it is possible to create several libraries.

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ACTIVITIES

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Activity No. 1
PCB ETCHING AND ENGRAVING
Course Code: CPE 403/CPE 304
Program:
Course Title: Comp. Engg Drafting and Design
Date Performed:
Section:
Date Submitted:
Name :
Instructor:
1. Objective(s):
The activity aims to examine the different etching procedure that is faster and applicable. This
experiment also provides students with knowledge and skills on command manipulation using CAD
software.
2. Intended Learning Outcomes (ILOs):
The students shall be able to:
2.1 Classify the procedure in designing a PCB layout; and
2.2 Compare the different techniques on removing the PCB copper from the board.
3. Discussion:
Etching is a processes of using a strong chemical or mordant to cut into the unprotected parts of metal
surface that can create a design.
In pure etching, copper, zinc or steel plate is covered with a waxy ground which is resistant to acid. A waxy
acid-resist (Ground) is applied to a metal plate such as copper or zinc but steel plate is another medium
with different qualities. There are two common types of ground: hard ground and soft ground.
Hard ground can be applied in two ways. Solid hard ground comes in a hard waxy block. To apply hard
ground of this variety, the plate to be etched is placed upon a hot-plate (set at 70 degrees C), a kind of
metal worktop that is heated up. The plate heats up and the ground is applied by hand, melting onto the
plate as it is applied. The ground is spread over the plate as evenly as possible using a roller. Once applied
the etching plate is removed from the hot-plate and allowed to cool which hardens the ground.
After the ground has hardened the artist "smokes" the plate, classically with 3 beeswax tapers, applying the
flame to the plate to darken the ground and make it easier to see what parts of the plate are exposed.
Smoking not only darkens the plate but adds a small amount of wax. Afterwards the artist uses a sharp tool
to scratch into the ground, exposing the metal.
The second way to apply hard ground is by liquid hard ground. This comes in a can and is applied with a
brush upon the plate to be etched. Exposed to air the hard ground will harden.
Soft ground also comes in liquid form and is allowed to dry but it does not dry hard like hard ground and is
impressionable. After the soft ground has dried the printmaker may apply materials such as leaves, objects,
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hand prints and so on which will penetrate the soft ground and expose the plate underneath.
The ground can also be applied in a fine mist, using powdered rosin or spray paint. This process is called
aquatint, and allows for the creation of tones, shadows, and solid areas of color. Soft-ground etching uses a
special softer ground. The artist places a piece of paper (or cloth etc. in modern uses) over the ground and
draws on it. The print resembles a drawing.
Engraving is the practice of incising a design onto a hard, usually flat surface, by cutting grooves into it. The
result may be a decorated object in itself, as when silver, gold, steel, or glass are engraved, or may provide
an intaglio printing plate, of copper or another metal, for printing images on paper as prints or illustrations;
these images are also called engravings.
Engraving was a historically important method of producing images on paper in artistic printmaking,
in mapmaking, and also for commercial reproductions and illustrations for books and magazines. It has
long been replaced by various photographic processes in its commercial applications and, partly because
of the difficulty of learning the technique, is much less common in printmaking, where it has been largely
replaced by etching and other techniques.
Reference: http://en.wikipedia.org/wiki/Etching
4. Materials and Equipment:
1.
2.
3.
4.
5.
6.

2x2 PCB
Chemical Solution
4 pcs. Plastic Container
Permanent Marker
Masking Tape
Cutting Devices

5. Procedure:
1. Cut 4pcs. (1x1 inch) PCB.
2. Place the PCB in a different container.
3. Apply the surface level Ferric Chloride solution.
4. Fill out the Table 1-1.
5. Prepare 2 set of 2x2 PCB.
6. Wrap a 1 2x2 PCB using a masking tape.
7. Write Technological Institute of the Philippines at the top of covered copper portion.
8. Use a cutting device to engrave the words.
9. Remove all excess masking tape at the PCB.
10. Using the permanent market write the word Technological Institute of the Philippines.
11. Place the each PCB inside the container with copper laid up and copper lay down position.
12. Apply the best technique in Table 1-1.
13. Fill-out Table 1-2.
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6. Data and Results:


Table 1-1. Trials
Time Started

1.
2.
3.
4.

Trial
Leave the PCB.
Leave the PCB within 5 mins. Then
shake the container until all copper are
remove.
Shake the container in 5 mins. Then
leave until the all copper are removed.
Shave the container until all the copper
is removed.

Time Finished

Total Time

Table 1-2. Engraving and Etching Procedure


Time Started Time Finished
Total Time

Procedure
1. Copper Up Dip
2. Copper Dip Down
7. Data Analysis:

8. Assessment Rubric:

34

Activity No. 2
PCB DRILLING
Course Code: CPE 403/CPE 304
Program:
Course Title: Comp. Engg Drafting and Design
Date Performed:
Section:
Date Submitted:
Name :
Instructor:
1. Objective(s):
The activity aims to practice the students ability in PCB drilling process. This experiment also provides
students knowledge and skills on PCB Lay outing.
2. Intended Learning Outcomes (ILOs):
The students shall be able to:
2.1 Show competency on drilling standard and procedure in designing a PCB layout; and
2.2 Illustrate the effect of drilling standard in developing a circuit design.
3. Discussion:
Drilling
Holes through a PCB are typically drilled with small-diameter drill bits made of solid coated tungsten
carbide. Coated tungsten carbide is recommended since many board materials are very abrasive and
drilling must be high RPM and high feed to be cost effective. Drill bits must also remain sharp so as not to
mar or tear the traces. Drilling with high-speed-steel is simply not feasible since the drill bits will dull quickly
and thus tear the copper and ruin the boards. The drilling is performed by automated drilling machines with
placement controlled by a drill tape or drill file. These computer-generated files are also called numerically
controlled drill (NCD) files or "Excellon files". The drill file describes the location and size of each drilled
hole. These holes are often filled with annular rings (hollow rivets) to create vias. Vias allow the electrical
and thermal connection of conductors on opposite sides of the PCB.
When very small vias are required, drilling with mechanical bits is costly because of high rates of wear and
breakage. In this case, the vias may be evaporated by lasers. Laser-drilled vias typically have an inferior
surface finish inside the hole. These holes are called micro vias.
It is also possible with controlled-depth drilling, laser drilling, or by pre-drilling the individual sheets of the
PCB before lamination, to produce holes that connect only some of the copper layers, rather than passing
through the entire board. These holes are called blind vias when they connect an internal copper layer to
an outer layer, or buried vias when they connect two or more internal copper layers and no outer layers.
The hole walls for boards with 2 or more layers can be made conductive and then electroplated with copper
to form plated-through holes. These holes electrically connect the conducting layers of the PCB. For
multilayer boards, those with 3 layers or more, drilling typically produces a smear of the high temperature
decomposition products of bonding agent in the laminate system. Before the holes can be plated through,
35

this smear must be removed by a chemical de-smear process, or by plasma-etch. The de-smear process
ensures that a good connection is made to the copper layers when the hole is plated through. On high
reliability boards a process called etch-back is performed chemically with a potassium permanganate
based etchant or plasma. The etch-back removes resin and the glass fibers so that the copper layers
extend into the hole and as the hole is plated become integral with the deposited copper.
Reference: http://en.wikipedia.org/wiki/Printed_circuit_board#Drilling
Table 1. Electronic Symbols hole on board
Description

Number of holes

R- Resistor

L-Inductance

C- Capacitance

D-Diode

T- Transformer

F-Fuse

Q- Transistor

TP- Test Point

J- Jumper

Possible Image

4. Materials and Equipment:


1.
2.
3.
4.
5.
6.
7.

2x2 PCB
Chemical Solution
Plastic Container
Permanent Marker
Masking Tape
Mini drill
Sand paper

5. Procedure:
1.
2.
3.
4.

Design a two PCB Layout at the 2x2 PCB shown at Figure 2-1 using a masking tape
Engrave the Copper Layout.
Dip the PCB at the Ferric Chloride Solution to remove excess copper at the board.
Wash the PCB using running water.
36

5. Use a mini drill to put holes on the copper side of the first PCB.
6. Wipe the PCB using the Sand paper.
7. Use a mini drill to put holes on the board side of the second PCB.

Figure 2-1
8. Attach the PCB at Data and Result
6. Data and Results:
PCB Drilled in the Copper Side

PCB Drilled in the Board Side

7. Data Analysis:

8. Assessment Rubric:

37

Activity No. 3
PCB SOLDERING
Course Code: CPE 403/CPE 304
Program:
Course Title: Comp. Engg Drafting and Design
Date Performed:
Section:
Date Submitted:
Name :
Instructor:
1. Objective(s):
The activity aims to practice the students ability in PCB drilling process. This experiment also provides
students knowledge and skills on PCB Lay outing.
2. Intended Learning Outcomes (ILOs):
The students shall be able to:
2.1 Show competency on drilling standard and procedure in designing a PCB layout; and
2.2 Illustrate the effect of drilling standard in developing a circuit design.
3. Discussion:
Safety precautions
1. Never touch the element or tip of the soldering iron. They are very hot (about 600F) and will give a
nasty burn.
2. Always return the soldering iron to its stand when not in use. Never put it down on the workbench,
even for a moment!
3. Work in a well-ventilated area. The smoke formed as melt solder is mostly from the flux and quite
irritating. Avoid breathing it by keeping the head to the side of, not above.
4. Wash both hands after using solder. Solder contains lead which is a poisonous metal.
Preparing the soldering iron
1. Place the soldering iron in its stand and plug in. Set the knob on the soldering iron station to a
starting level of 4. The iron will take a few minutes to reach its operating temperature of about
600F.
2. Dampen the sponge in the stand. It should be damped, not dripping wet.
3. Wait a few minutes for the soldering iron to warm up. Check if it is ready by trying to melt a little
solder on the tip.
4. Wipe the tip of the iron on the damp sponge. This will clean the tip.
5. Melt a little solder on the tip of the iron. This is called 'tinning' and it will drastically help the heat to
flow from the iron's tip to the joint. If it seems to be taking a long time for a joint to heat up it is most
likely because the tip is not tinned.
Inserting the component
Bend the leads of the component to fit in the holes in the board if necessary.
1. Insert the component into the board. IMPORTANT make absolute sure that the components are
38

placed correct location and in the correct orientation. Some of the components must be soldered in
a certain orientation in order to function.
2. If possible, bend the leads of the component outward once they are inserted into the board. This
will keep the component from falling out if you turn the board upside-down.

4. Materials and Equipment:


1.
2.
3.
4.
5.
6.
7.

2x2 PCB
Chemical Solution
Plastic Container
Permanent Marker
Masking Tape
Mini drill
4 pcs. Resistor (any value)

5. Procedure:
1. Design a PCB layout for Figure 3-1 using 2x2 PCB.

2.
3.
4.
5.
6.
7.
8.

Figure 3-1 Resistor Connection


Dip the PCB using Ferric Chloride solution.
Remove all excess copper at the PCB.
Wash the PCB using running water.
Drilled the holes of the circuit design.
Placed the resistor at the board.
Use soldering iron and Lead wire to attach the resistors.
Attached the PCB at the data and result.
39

6. Data and Results:

7. Data Analysis:

8. Assessment Rubric:

40

Activity No. 4
BLOCK DIAGRAM AND FLOWCHARTING
Course Code: CPE 403/CPE 304
Program:
Course Title: Comp. Engg Drafting and Design
Date Performed:
Section:
Date Submitted:
Name :
Instructor:
1. Objective(s):
The activity aims to design a circuit block diagram and flow chart using ZenitPCB software. This
experiment also provides students knowledge and skills on PCB Lay outing.
2. Intended Learning Outcomes (ILOs):
The students shall be able to:
2.1 Create a circuit block diagram and circuit flow chart using ZenitPCB software; and
2.2 Design a circuit block diagram and circuit flow chart PCB layout.
3. Discussion:
Block Diagram
It is a kind of flowcharting that is considered as a high-level type that can quickly overview the major
process steps and relationship for every component. It is a useful tool for both design and modification of
the existing process or design, but it cannot cater the level of full detailed requirements for more
comprehensive preparation or analysis. The block diagram shows the whole process with in the system of
connecting every electronic component by showing different algorithm and projected process as shown in
Figure 4.1.

Figure 4.1 Intel Core 2 Duo Processor Block Diagram


Figure 4.2 Intel Pentium 4 Block Diagram shows the simplified version of the microprocessor block diagram
in which it is not very particular with the whole process but much more on identifying the major components
that will affect the whole process.

41

Figure 4.2 Intel Pentium 4 Block Diagram


The Microprocessor architecture also helps us on identifying the components that are connected to each
part that illustrate the connectivity of each set up as shown in Figure 4.3 the CPU, Northbridge, Southbridge
is considered as the major component that takes all responsibilities on connecting other peripherals with
the computer system.

Figure 4.3 Computer Architecture Block Diagram

42

Figure 4.4 NT50Tr Puma Block Diagram


NT50Tr Puma Block Diagram by ASUS mother board shows the detailed connection of each component
that affects the operation of data transmission with respect to its functionality as shown in Figure 4.4.
Table 4.1 List of Block Diagram Symbols
Name
Symbol
Use
Rectangle
Indication of Process
Arrows
Indication of Flow
FLOWCHARTS
It is a different shape that represents different actions or steps within the process that connects with the
flow of its algorithm. It is a representation of diagrammatic illustration that shows all sequence of operation
that will be perform to conclude with final solution that will be drawn in the early stages of computer
programming solution. It also facilitates the communication between programmers and business people
who play a vital role in the programming analysis. Some say that it is easy to develop a program in any
high-level language if the flowchart is already formulated and created.

43

Symbol

Table 4.2 List of Basic Flowcharting Symbols


Name
Description
It represents the start or end
Start/Terminator
of the process.

Input / Output

Arrow

Decision

Connector

Process

It is used to show that the


process will be executed.
It is the flow control in
flowcharting that indicates the
end of the certain process and
start of the new procedure.
It sometimes called as the
conditional that is typically
contain the positive and
negative answer on a certain
question.
It is used to connect a certain
process for continuous
procedure or process of the
given flow.
It is a representation that show
the flow of the assign process

4. Materials and Equipment:


1. Bond paper
2. Printer
3. Computer with ZenitPCB Software
5. Procedure:
1. Open ZenitPCB software.
2. Create a New PCB file save it as Block filename.
3. Create a 59.6mm x 39.9 mm rectangle.
4. Insert a 6 mm Text as shown at Figure 4-5.

44

Figure 4-5 Source Block Diagram


5. Create 3 more 59.6mm x 39.9 mm rectangle under the source.
6. Connect and label each rectangle as shown in Figure 4-6.

Figure 4-6 Resistor Connection Block Diagram

45

7. Print Block and paste it at the Data and Results.


8. Create a new project save it as Flow Filename.
9. Draw a Circuit flow chart for Figure 4-7.

Figure 4-7 Series-Parallel Connection


10. Print Circuit Flowchart and paste it at the Data and Results.
11. Draw the Block Diagram and the flow chart at the 1 pc. 2x2 PCB.
12. Dip the PCB at the Ferric Chloride solution inside the container.
13. Remove the PCB if there is no remaining excess copper.
14. Attached the PCB output at the data and results.
6. Data and Results:
Block Diagram

Flow Chart

46

Block Diagram (PCB)

Flow Chart (PCB)

7. Data Analysis:

8. Assessment Rubric:

47

Activity No. 5
LED LIGHTS CIRCUIT
Course Code: CPE 403/CPE 304
Program:
Course Title: Comp. Engg Drafting and Design
Date Performed:
Section:
Date Submitted:
Name :
Instructor:
1. Objective(s):
The activity aims to design a LED Circuit using ZenitCapture software. This experiment also provides
students knowledge and skills on Circuit Layouting.
2. Intended Learning Outcomes (ILOs):
The students shall be able to:
2.1 Create a LED circuit using ZenitCapture software; and
2.2 Design a LED circuit connection using 2x2 Printed Circuit Board (PCB).
3. Discussion:
The LED (Light Emitting Diode) is a semiconductor diode that emits visible light or near infra-red radiation
when it is forward biased. Inside the LED is a semiconductor which is encased in a transparent epoxy resin
which could be either diffused or clear lens. The LED, unlike a normal bulb, has a limited viewing angle
between 30 to 90.

Figure 5-1 LED Symbol


Current Limiting Resistor for LEDs
Formula when calculating the value of the current limiting resistor for the LED.
(
(

Example:
What would be the resistor value that can resist to a 9 volt battery to light up a LED?
Resistor = (Voltage supplied - LED Voltage*) / LED Current*
48

Note: * - Different LED colour has different current requirement, which could be from 10mA to 30mA.
Luxeons would be from 350mA to 1000mA.
Resistor = (9 - 1.8) / 0.018
Resistor = 400 Ohm
The closest value for this (Under the E12 Resistor value) would be 390 Ohms.

4. Materials and Equipment:


1.
2.
3.
4.

2x2 PCB
Ferric Chloride Solution
ZenitCapture Software
Plastic Container

5. Procedure:
1. Open ZenitCapture software.
2. Create a new project save it as filename: ACT5
3. Modify the respective field as shown in Figure 5-2.

Figure 5-2 Template Label


a. Drawing Name: (Activity Title)
b. Number: (No. of times for this Activity)
c. Drawn By: (Students Name)
d. Company: TIP-CpE
4. Create the circuit in Figure 5-3.

49

5.
6.
7.
8.
9.

Figure 5-3 LED Circuit


Print the file and attach it at the data and results.
Create a PCB design using 2x2 PCB.
Etch the PCB using Ferric Chloride solution.
Wash the PCB after etching.
Place the PCB output at the Data and Results.

6. Data and Results:

PCB Design

50

Hard Copy

51

7. Data Analysis:

8. Assessment Rubric:

52

Activity No. 6
BATTERY MONITORING CIRCUIT
Course Code: CPE 403/CPE 304
Program:
Course Title: Comp. Engg Drafting and Design
Date Performed:
Section:
Date Submitted:
Name :
Instructor:
1. Objective(s):
The activity aims to design a Circuit Wiring Diagram using ZenitCapture software. This experiment also
provides students knowledge and skills on battery monitoring circuit design.
2. Intended Learning Outcomes (ILOs):
The students shall be able to:
2.1 Create a Battery Monitoring Circuit using ZenitCapture software; and
2.2 Design a Battery Monitoring Circuit connection using 2x2 Printed Circuit Board (PCB).
3. Discussion:
Electric battery is a device consisting of one or more electrochemical cells that convert stored chemical
energy into electrical energy. Each cell contains a positive terminal, or cathode, and a negative terminal, or
anode. Electrolytes allow ions to move between the electrodes and terminals, which allows current to flow
out of the battery to perform work.
Primary (single-use or "disposable") batteries are used once and discarded; the electrode materials are
irreversibly changed during discharge. Common examples are the alkaline battery used for flashlights and
a multitude of portable devices. Secondary (rechargeable batteries) can be discharged and recharged
multiple times; the original composition of the electrodes can be restored by reverse current.
Batteries have much lower specific energy (energy per unit mass) than common fuels such as gasoline.
This is somewhat mitigated by the fact that batteries deliver their energy as electricity (which can be
converted efficiently to mechanical work), whereas using fuels in engines entails a low efficiency of
conversion to work.
There are many example of battery monitoring circuit in which the Zener controlled transistor shows the
states of the battery. When the battery voltage is less than 11 volts, the Zener diodes ZD1 and ZD2 cease
to conduct and Red LED only lights when the battery is in the low condition. If the voltage is between 12
volts and 14 volts, ZEner T1 lights an indication of normal voltage. In the case that the battery voltage
exceeds 15 volts, Zener diode ZD2 also conducts and T2 forwarded bias. Yellow LED indicates the
overcharging state. Figure 6-1 shows the original circuit diagram developed by
http://www.electroschematics.com/4838/battery-monitor/

53

Figure 6-1. Battery Monitoring Circuit by http://www.electroschematics.com/4838/battery-monitor/

4. Materials and Equipment:


1.
2.
3.
4.

2 pcs. 2x2 PCB


Ferric Chloride Solution
ZenitCapture Software
Plastic Containner

5. Procedure:
1. Open ZenitCapture software.
2. Create a new project save it as filename: ACT6
3. Modify the respective field as shown in Figure 6-2.

Figure 6-2 Template Label


a. Drawing Name: (Activity Title)
b. Number: (No. of times for this Activity)
c. Drawn By: (Students Name)
d. Company: TIP-CpE
4. Create the circuit in Figure 6-1.

54

5.
6.
7.
8.
9.

Print the file and attach it at the data and results.


Create a PCB design using 2x2 PCB.
Etch the PCB using Ferric Chloride solution.
Wash the PCB after etching.
Place the PCB output at the Data and Results.

6. Data and Results:


PCB Design

55

Hard Copy

56

7. Data Analysis:

8. Assessment Rubric:

57

Activity No. 7
PIC12C508SM CIRCUIT
Course Code: CPE 403/CPE 304
Program:
Course Title: Comp. Engg Drafting and Design
Date Performed:
Section:
Date Submitted:
Name :
Instructor:
1. Objective(s):
The activity aims to design a PIC12C508SM Circuit using ZenitCapture and ZenitPCB software. This
experiment also provides students knowledge and skills on PIC12C508SM circuit design.
2. Intended Learning Outcomes (ILOs):
The students shall be able to:
2.1 Create a PIC12C508SM Circuit using ZenitCapture and ZenitPCB software.
2.2 Design a PIC12C508SM Circuit connection using 2x2 Printed Circuit Board (PCB).
3. Discussion:
PIC12C5XX microcontroller family is consist of 8-pin, 8-bit CMOS microcontrollers. Its high performance
RISC CPU has only 33 single word instructions. All instructions are single cycle except for program
branches which are two-cycle. The operating speed of 4Mhz clock input for DC and a 1 s instruction cycle
is one of its features. Its high performance also covers the 12-bit wide instruction and 8-bit wide data path.
The seven special function hardware registers, two-level deep hardware stack, direct, indirect and relative
addressing modes for data and instruction covers the internal 4 MHz RC oscillator with programmable
calibration and the in-circuit serial programming are some other features of its high-performance RISC
CPU. The peripheral features are the following: 8-bit real time clock/counter (TMRO) with 8-bit
programmable prescaler, Power-On Reset (POR), Device Reset Timer (DTR), Watchdog Timer (WDT) with
its own on-chip RC oscillator for reliable operation, Programmable code-protection, 1,000,000 erase/write
cycle EEPROM data memory, power saving SLEEP mode, Wake-up from SLEEP on pin change, Internal
weak pull-ups on I/O pins and many more. It CMOS technology covers the low power, high speed CMOS
EEPROM/ROM Technology with full static design of wide operating voltage range with a wide temperature
range from the following: Commercial: 0C to +70C, Industrial: -40C to +85C, Extended: -40C to
+125C and a low power consumption of < 2 mA @ 5V, 4 MHz, 15 A typical @ 3V, 32 KHz, < 1 A
typical standby current. Figure 7-1 shows the pin diagram of PIC12C5XX.

58

Figure 7-1 PIC12C5XX Pin Diagram


Its application fits perfectly for personal care appliances and security system to low-power remote
transmitters/receivers. The EPROM technology makes customized application program extremely fast and
convenient, while the EEPROM fata memory technology allows for the changing of calibration factors and
security codes. The small footprint packages, for through hole or surface mounting, make this
microcontroller series perfect for applications with space limitations. Low-cost, lower-power, high
performance, ease of use and I/O flexibility makes the PIC12C5XX series very versatile even in areas
where no microcontroller use has been considered before. Figure 7-2 shows the block diagram of
PIC12C5XX.

59

Figure 7-2 PIC12C5XX Block Diagram

Reference: http://pdfdata.datasheetsite.com/pdf1/Microchip/PIC12LCE519T-04-SN.pdf

4. Materials and Equipment:


1. 2 pcs. 2x2 PCB
2. Ferric Chloride Solution
3. ZenitCapture Software
4. Plastic Container
5. Procedure:
1. Open ZenitCapture software.
2. Create a new project save it as filename: ACT7
3. Modify the respective field as shown in Figure 7-3.

60

Figure 7-3 Template Label


a. Drawing Name: (Activity Title)
b. Number: (No. of times for this Activity)
c. Drawn By: (Students Name)
d. Company: TIP-CpE
4. Create the circuit in Figure 7-4.

Figure 7-4 PIC12C55 Circuit


5.
6.
7.
8.
9.

Print the file and attach it at the data and results.


Create a PCB design using 2x2 PCB.
Etch the PCB using Ferric Chloride solution.
Wash the PCB after etching.
Place the PCB output at the Data and Results.
61

10.
11.
12.
13.
14.
15.

Package ACT7.
Create a Netlist PCB.
Open ZenitPCB Software.
Create a 50x50 mm Board Outline.
Import the ACT7 components.
Place the components inside the boundary as shown in Figure 7-5.

Figure 7-5 PIC12C5 Circuit


16. Print the file and attach it at the data and results.
17. Create a PCB design using 2x2 PCB.

6. Data and Results:


PCB Design Figure 7-4

PCB Design Figure 7-5

62

Hard Copy Figure 7-4

63

Hard Copy Figure 7-5

64

7. Data Analysis:

8. Assessment Rubric:

65

Activity No. 8
COMPLEX CIRCUIT
Course Code: CPE 403/CPE 304
Program:
Course Title: Comp. Engg Drafting and Design
Date Performed:
Section:
Date Submitted:
Name :
Instructor:
1. Objective(s):
The activity aims to design a Complicated Circuit using ZenitPCB software. This experiment also
provides students knowledge and skills on Complicated Circuit design.
2. Intended Learning Outcomes (ILOs):
The students shall be able to:
2.1 Create a Complicated Circuit using ZenitPCB software; and
2.2 Design a Complicated Circuit connection using 2x2 Printed Circuit Board (PCB).
3. Discussion:
A complex circuit is an interconnection of electrical components to form a closed electrical loop. The circuit
is formed by elements such as resistors, capacitors, switches inductors and an electricity source.
4. Materials and Equipment:
1.
2.
3.
4.

4x4 PCB
Ferric Chloride Solution
ZenitCapture Software
Plastic Containner

5. Procedure:
1.
2.
3.
4.
5.
6.
7.
8.

Open ZenitPCB software.


Create a new project save it as filename: ACT8
Create the circuit at Figure 8-1.
Print the file and attach it at the data and results.
Create a PCB design using 4x4 PCB.
Etch the PCB using Ferric Chloride solution.
Wash the PCB after etching.
Place the PCB output at the Data and Results.

66

Figure 8-1 Battery Monitor Circuit


6. Data and Results:

PCB Design Figure 8-1

67

7. Data Analysis:

8. Assessment Rubric:

68

Activity No. 9
DC MOTOR CONTROLLER CIRCUIT
Course Code: CPE 403/CPE 304
Program:
Course Title: Comp. Engg Drafting and Design
Date Performed:
Section:
Date Submitted:
Name :
Instructor:
1. Objective(s):
The activity aims to design a DC motor controller circuit using ZenitPCB software. This experiment also
provides students knowledge and skills on DC motor controller Circuit design.
2. Intended Learning Outcomes (ILOs):
The students shall be able to:
2.1 Create a DC motor controller circuit using ZenitPCB software; and
2.2 Design a DC motor controller connection using 2x2 Printed Circuit Board (PCB).
3. Discussion:
DC motor relies on the facts that like magnet poles repels and unlike magnetic poles attract each other. A
coil of wire with a current running through it generates an electromagnetic field aligned with the center of
the coil. By switching the current on or off in a coil its magnet field can be switched on or off or by switching
the direction of the current in the coil the direction of the generated magnetic field can be switched 180. A
simple DC motor typically has a stationary set of magnets in the stator and an armature with a series of two
or more windings of wire wrapped in insulated stack slots around iron pole pieces (called stack teeth) with
the ends of the wires terminating on a commutator. The armature includes the mounting bearings that keep
it in the center of the motor and the power shaft of the motor and the commutator connections. The winding
in the armature continues to loop all the way around the armature and uses either single or parallel
conductors (wires), and can circle several times around the stack teeth. The total amount of current sent to
the coil, the coil's size and what it's wrapped around dictate the strength of the electromagnetic field
created. The sequence of turning a particular coil on or off dictates what direction the effective
electromagnetic fields are pointed. By turning on and off coils in sequence a rotating magnetic field can be
created. These rotating magnetic fields interact with the magnetic fields of the magnets (permanent
or electromagnets) in the stationary part of the motor (stator) to create a force on the armature which
causes it to rotate. In some DC motor designs the stator fields use electromagnets to create their magnetic
fields which allow greater control over the motor. At high power levels, DC motors are almost always cooled
using forced air.
A PIC programmer is a circuit which interfaces the PC to the microcontroller using the PC's parallel, serial
or USB port. It can write data to the microcontroller and read it back for verification.
The PIC programmer translates digital logic levels from the PC to suitable logic levels for the
microcontroller - most levels are ok as they are, but for 'normal' (or high volt) programming of a PIC
69

microcontroller the voltage at the MCLR pin is needed.


Reference: http://en.wikipedia.org/wiki/DC_motor
4. Materials and Equipment:
1.
2.
3.
4.

4x4 PCB
Ferric Chloride Solution
ZenitCapture Software
Plastic container

5. Procedure:
1.
2.
3.
4.
5.
6.
7.
8.

Open ZenitPCB software.


Create a new project save it as filename: ACT9
Create the circuit in Figure 9-1.
Print the file and attach it at the data and results.
Create a PCB design using 4x4 PCB.
Etch the PCB using Ferric Chloride solution.
Wash the PCB after etching.
Place the PCB output at the Data and Results.

Figure 9-1 DC Motor Circuit

70

6. Data and Results:

PCB Design Figure 9-1

7. Data Analysis:

8. Assessment Rubric:

71

Activity No. 10
USB INTERFACE CIRCUIT
Course Code: CPE 403/CPE 304
Program:
Course Title: Comp. Engg Drafting and Design
Date Performed:
Section:
Date Submitted:
Name :
Instructor:
1. Objective(s):
The activity aims to design a USB interface Circuit using ZenitPCB software. This experiment also
provides students knowledge and skills on USB interface Circuit design.
2. Intended Learning Outcomes (ILOs):
The students shall be able to:
2.1 Create a USB interface circuit using ZenitPCB software; and
2.2 Design a USB interface Circuit connection using 2x2 Printed Circuit Board (PCB).
3. Discussion:
Universal Serial Bus (USB) is an industry standard developed in the mid-1990s that defines the cables,
connectors and communications protocols used in a bus for connection, communication, and power supply
between computers and electronic devices.
USB was designed to standardize the connection of computer peripherals (including keyboards, pointing
devices, digital cameras, printers, portable media players, disk drives and network adapters) to personal
computers, both to communicate and to supply electric power. It has become commonplace on other
devices, such as smartphones, PDAs and video game consoles. USB has effectively replaced a variety of
earlier interfaces, such as serial and parallel ports, as well as separate power chargers for portable
devices.
Reference: http://en.wikipedia.org/wiki/USB
4. Materials and Equipment:
1.
2.
3.
4.

4x4 PCB
Ferric Chloride Solution
ZenitCapture Software
Plastic container

5. Procedure:
1. Open ZenitPCB software.
2. Create a new project save it as filename: ACT9
3. Create the circuit in Figure 9-1.
72

4.
5.
6.
7.
8.

Print the file and attach it at the data and results.


Create a PCB design using 4x4 PCB.
Etch the PCB using Ferric Chloride solution.
Wash the PCB after etching.
Place the PCB output at the Data and Results.

Figure 10-1 USB Interface Circuit


73

6. Data and Results:

PCB Design Figure 9-1

7. Data Analysis:

8. Assessment Rubric:

74

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