Professional Documents
Culture Documents
COMPUTER ENGINEERING
DRAFTING AND DESIGN
Table of Contents
INTRODUCTION ........................................................................................................................................... 4
ELECTRONIC SYMBOLS ......................................................................................................................... 4
ZenitPCB Layout ....................................................................................................................................... 5
Main Menu ............................................................................................................................................ 6
Design Rule: ......................................................................................................................................... 8
Error List browser Example ................................................................................................................... 9
Component Properties: ......................................................................................................................... 9
Bottom Soldering ................................................................................................................................ 12
Net Class Color ................................................................................................................................... 13
Net Properties ..................................................................................................................................... 14
Board Outline ...................................................................................................................................... 14
ZenitPCB Libraries .................................................................................................................................. 27
Decal Library Report ............................................................................................................................... 27
ACTIVITIES ................................................................................................................................................. 31
Activity No. 1................................................................................................................................... 32
PCB ETCHING AND ENGRAVING ........................................................................................... 32
Activity No. 2................................................................................................................................... 35
PCB DRILLING .......................................................................................................................... 35
Activity No. 3................................................................................................................................... 38
PCB SOLDERING ..................................................................................................................... 38
Activity No. 4................................................................................................................................... 41
BLOCK DIAGRAM AND FLOWCHARTING ............................................................................. 41
Activity No. 5................................................................................................................................... 48
LED LIGHTS CIRCUIT .............................................................................................................. 48
Activity No. 6................................................................................................................................... 53
BATTERY MONITORING CIRCUIT........................................................................................... 53
Activity No. 7................................................................................................................................... 58
PIC12C508SM CIRCUIT ............................................................................................................ 58
Activity No. 8................................................................................................................................... 66
COMPLEX CIRCUIT .................................................................................................................. 66
2
INTRODUCTION
ELECTRONIC SYMBOLS
Table 1Electronic Classification
Classification
1. Passive Components
2. Active Components
Description
It is a classification of electronic component that is
used for resistance of electrical current and storing
of electrical charge through a capacitance
It is classified as part of the semiconductor devices
such as diode, Bipolar Junction Transistor (BJT),
Vacuum Tube devices such as Vacuum tube
diode, triode, Tetrode, Pentode, etc.
Actual Image
Symbol
Transformer
Resistor
Capacitor
Fuse
Coil
Diode
Zener Diode
Varactor Diode
LED
(Light Emitting Diode)
Transistor
FET
(Field Effect Transistor)
Speaker
Microphone
Switch
Motor
Integrated Circuit
ZenitPCB Layout
It is a complete open source software for PCB lay outing for personal or semi-professional circuit
development. It has a border line of 800 pins between the hobby and professional jobs and is one
of the advantages of this software. It is directed to all people who want to design a printed circuit
board or to students who want to create their own PCB design. The user interface in ZenitPCB has
been written using the Windows standard and it has been carefully designed to enable the user to
both learn the product quickly and make ZenitPCB output.
Main Menu
It contains all the headings for the main sub-menus and
commands. It also contains the application menus such as File,
View, Setup, etc.
The menu items are:
Project Explorer:
This window contains the contents of the
grouped design which could either be
components or nets. It is shown in Figure 1-b-3.
Design Rule:
1. Electrical Elements [E-E]
This design rule shows the content of the net class property that can be modified with the trace width
and clearance.
Figure 1-b-5
Component Properties:
This dialog contains all properties concern with the selected component, as shown in Figure 1-b-5
a.
b.
c.
d.
e.
f.
g.
Component
Location
Silk
Height
Bottom Decal (Refer to Figure 1-b-5a)
Plot Gerber Reference
Edit Button
Place Component:
In placing the component the bin contains all imported parts from the netlist which is easier to place all
parts according to the user needs. It is possible to place parts sequentially or one by one, on top layer or
bottom layer.
Line Offset:
Offset Line gives user the opportunity to copy or move shapes horizontally or vertically as shown in Figure
1-c.
Board Report:
This part of ZenitPCB gives information about the project such as the number of components, trace width
and etc.
Current Capacity of Track:
This feature of ZenitPCB
gives information on the
total Ampere a trace could
carry. There are also
available formulas that can
be used such as Empirical,
Foil
Thickness
and
Temperature rise above
ambient as shown in Figure
1-d.
10
Setup It contains the project options and the net class & properties as shown in Figure 1-e.
Grid
It is used to define the units. Basic working units
can be changed between Imperial and Metric
design units. The design units are stored in an
internal database with a precision of 1 micron.
Grids are used in ZenitSuite for defining the points
or steps that items will snap to when they are
placed and for visible references in the design as
shown in Figure 1-e-1.
Figure 1-e Set up
F
Option
It is used to change parameters relating to several
disparate functions within the system as shown in Figure
1-e2.
11
Figure 1-fa1
Figuren1-fa2
Figure 1-fa3
DRC
Set non Electrical Elements Clearance
1. Silkscreen Text to Pads
2. Component to Component ( through Placement
Outline ) as shown in Figure 1-g
3. Mounting Hole to Electrical Elements
4. Board Outline to Electrical Elements
5. Fill Type
Elements of Fill Type
a. Fixed Pad
b. Fixed Trace
c. Route&Plane Obstruct
d. Component Obstruct
e. Fixed Hatch Color Like (for Trace)
Directory
2. Typical
3. Max
Save
After setting the net classes, it can be used on
another project without setting the NetClass.
File Menu:
1. Import
2. Export
Net Class Color
Net Properties
After creating the net class user can "join" each net with a class (Net Properties) as shown in
Figure 1-j.
Example
Assign a net class to net GND
1. Find the net name GND on the list
2. Select the item (check box selected)
3. Choose the net class "GND" on the combo box
4. Then Set it.
Set Dimension
it is used to set all dimension items as shown in Figure 1-k
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Shape
In inserting a shape on a specific layer of the project the following are the available shapes that can be
used:
1. Line
2. Open Shape ( Not Close Polyline )
3. Close Shape ( Close Polyline )
4. Circle Shape
Edit Shape
This mode is used to sequentially add shape segments into a design, either to finish off a new shape being
added, or to rework an existing shape segment.
Place a New Shape
It contains the Place Shape or Draw Shape Toolbar, to start a particular type of shape. Pick a position and
then place into Edit Shape Mode as shown in Figure 1-m.
16
Copper Pour
It is used to flood unrouted areas of a PCB layout with copper
usually connected to a nominated signal - typically Ground (GND)
or VCC. This facility will then create voids around unconnected
tracks, components, pads, etc.
17
Select Line
Right Click and Move
Choose the new point
Click to new point
Select Line
On Popup Show Unit
Pick&Place Origin
Set the origin of the Pick & Place.
On this way it be can changed to XY reference, depending on the better point (fiducials, board), chosen for
the PCB assembly.
Mounting Hole
it is use to insert a mounting hole item into a PCB design or Component footprint. A mounting hole is like a
through-hole pad but is a Not Plated hole and uses a pad style, but does not have a pin number and will not
be included in a PCB netlist.
Slot Not Plated
Slot is a linear not plated milling hole .that can define it on
Padstack dialog as shown in Figure1-p. It is useful to increase
the clearance on the project or for mechanical clips.
Fiducial
Insert a Fiducial Pad into layout. Fiducials are necessary to
assemble the PCB like reference point for pick & place
machines as shown in Figure 1-r.
19
20
AutoRename Reference
Renumber Reference is used to interactively re-sequence the numeric order of the names of Components
Reference. The names of items normally consist of an alphabetic prefix followed by a number. Rename
adjusts the number for an item with the given prefix.
Add Connection
It is possible to Insert Connections directly into the layout, without necessarily having to import a netlist.
Delete Connection
Select a pad to detach the net. Then create a new connection in the
pad.
Delete All Copper
Delete all copper poured. Clearly not remove the copper pour
shape.
Show Copper Name
It can be selected to show or not, the net name about a copper
Figure 1-u Show-Copper Name
pours shape. The name will be showed on shape origin as shown in
Figure1-u.
Update Part from Library
21
ZenitPCB allows exporting reports into ASCII files, necessary for assembly printed circuit board.
The formatting of files can be either classical (as the image) or CSV (separator).
Help - Use this menu to access the on-line help system and other support features.
22
Main Toolbars
Figure 4 Filter
Figure 7 Dimension
Figure 6 Copper Pour
Decal Editor
Figure 10 Utility
23
Work Space
Add Pad
Open the "Add Pads" Dialog
Insert one or more pads.
Use the button "Select". The system opens the Padstack
library, choose the appropriate pad.
Set the Position X,Y and Angle of the pad.
24
Copy Properties
Copy the properties of selected pad into other pads when selected them.
25
Library Manager
List the system shown:
1.
2.
3.
4.
5.
6.
7.
8.
9.
26
ZenitPCB Libraries
ZenitPCB provides more than 800 components (SMD & TH) for an immediate placement on
project.
Table 3 List of Components
Chip Capacitor
Chip Resistor
Through-Hole Axials
Through-Hole Radials
Transistors
Stocko Connectors
Molex Connectors
Lumberg Connectors
Miscellaneus SMD
Jumpers
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Padstack
In Padstack dialog you can create, copy or delete padstack.
Padstack Properties:
4 Types:
Through
Hole
SMD
Mounting
Hole
Fiducial
Hole Type:
Round Drill (Report on Through-hole Plated & Not Plated Files)
Round
Slotted Drill (Report on Slot Plated & Not Slot Plated)
Slotted
Plated: Plated or not the hole
Create New Offset Pads
29
Pads Properties:
On the form Option it is possible to set the padstak library, so it is possible to create several libraries.
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ACTIVITIES
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Activity No. 1
PCB ETCHING AND ENGRAVING
Course Code: CPE 403/CPE 304
Program:
Course Title: Comp. Engg Drafting and Design
Date Performed:
Section:
Date Submitted:
Name :
Instructor:
1. Objective(s):
The activity aims to examine the different etching procedure that is faster and applicable. This
experiment also provides students with knowledge and skills on command manipulation using CAD
software.
2. Intended Learning Outcomes (ILOs):
The students shall be able to:
2.1 Classify the procedure in designing a PCB layout; and
2.2 Compare the different techniques on removing the PCB copper from the board.
3. Discussion:
Etching is a processes of using a strong chemical or mordant to cut into the unprotected parts of metal
surface that can create a design.
In pure etching, copper, zinc or steel plate is covered with a waxy ground which is resistant to acid. A waxy
acid-resist (Ground) is applied to a metal plate such as copper or zinc but steel plate is another medium
with different qualities. There are two common types of ground: hard ground and soft ground.
Hard ground can be applied in two ways. Solid hard ground comes in a hard waxy block. To apply hard
ground of this variety, the plate to be etched is placed upon a hot-plate (set at 70 degrees C), a kind of
metal worktop that is heated up. The plate heats up and the ground is applied by hand, melting onto the
plate as it is applied. The ground is spread over the plate as evenly as possible using a roller. Once applied
the etching plate is removed from the hot-plate and allowed to cool which hardens the ground.
After the ground has hardened the artist "smokes" the plate, classically with 3 beeswax tapers, applying the
flame to the plate to darken the ground and make it easier to see what parts of the plate are exposed.
Smoking not only darkens the plate but adds a small amount of wax. Afterwards the artist uses a sharp tool
to scratch into the ground, exposing the metal.
The second way to apply hard ground is by liquid hard ground. This comes in a can and is applied with a
brush upon the plate to be etched. Exposed to air the hard ground will harden.
Soft ground also comes in liquid form and is allowed to dry but it does not dry hard like hard ground and is
impressionable. After the soft ground has dried the printmaker may apply materials such as leaves, objects,
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hand prints and so on which will penetrate the soft ground and expose the plate underneath.
The ground can also be applied in a fine mist, using powdered rosin or spray paint. This process is called
aquatint, and allows for the creation of tones, shadows, and solid areas of color. Soft-ground etching uses a
special softer ground. The artist places a piece of paper (or cloth etc. in modern uses) over the ground and
draws on it. The print resembles a drawing.
Engraving is the practice of incising a design onto a hard, usually flat surface, by cutting grooves into it. The
result may be a decorated object in itself, as when silver, gold, steel, or glass are engraved, or may provide
an intaglio printing plate, of copper or another metal, for printing images on paper as prints or illustrations;
these images are also called engravings.
Engraving was a historically important method of producing images on paper in artistic printmaking,
in mapmaking, and also for commercial reproductions and illustrations for books and magazines. It has
long been replaced by various photographic processes in its commercial applications and, partly because
of the difficulty of learning the technique, is much less common in printmaking, where it has been largely
replaced by etching and other techniques.
Reference: http://en.wikipedia.org/wiki/Etching
4. Materials and Equipment:
1.
2.
3.
4.
5.
6.
2x2 PCB
Chemical Solution
4 pcs. Plastic Container
Permanent Marker
Masking Tape
Cutting Devices
5. Procedure:
1. Cut 4pcs. (1x1 inch) PCB.
2. Place the PCB in a different container.
3. Apply the surface level Ferric Chloride solution.
4. Fill out the Table 1-1.
5. Prepare 2 set of 2x2 PCB.
6. Wrap a 1 2x2 PCB using a masking tape.
7. Write Technological Institute of the Philippines at the top of covered copper portion.
8. Use a cutting device to engrave the words.
9. Remove all excess masking tape at the PCB.
10. Using the permanent market write the word Technological Institute of the Philippines.
11. Place the each PCB inside the container with copper laid up and copper lay down position.
12. Apply the best technique in Table 1-1.
13. Fill-out Table 1-2.
33
1.
2.
3.
4.
Trial
Leave the PCB.
Leave the PCB within 5 mins. Then
shake the container until all copper are
remove.
Shake the container in 5 mins. Then
leave until the all copper are removed.
Shave the container until all the copper
is removed.
Time Finished
Total Time
Procedure
1. Copper Up Dip
2. Copper Dip Down
7. Data Analysis:
8. Assessment Rubric:
34
Activity No. 2
PCB DRILLING
Course Code: CPE 403/CPE 304
Program:
Course Title: Comp. Engg Drafting and Design
Date Performed:
Section:
Date Submitted:
Name :
Instructor:
1. Objective(s):
The activity aims to practice the students ability in PCB drilling process. This experiment also provides
students knowledge and skills on PCB Lay outing.
2. Intended Learning Outcomes (ILOs):
The students shall be able to:
2.1 Show competency on drilling standard and procedure in designing a PCB layout; and
2.2 Illustrate the effect of drilling standard in developing a circuit design.
3. Discussion:
Drilling
Holes through a PCB are typically drilled with small-diameter drill bits made of solid coated tungsten
carbide. Coated tungsten carbide is recommended since many board materials are very abrasive and
drilling must be high RPM and high feed to be cost effective. Drill bits must also remain sharp so as not to
mar or tear the traces. Drilling with high-speed-steel is simply not feasible since the drill bits will dull quickly
and thus tear the copper and ruin the boards. The drilling is performed by automated drilling machines with
placement controlled by a drill tape or drill file. These computer-generated files are also called numerically
controlled drill (NCD) files or "Excellon files". The drill file describes the location and size of each drilled
hole. These holes are often filled with annular rings (hollow rivets) to create vias. Vias allow the electrical
and thermal connection of conductors on opposite sides of the PCB.
When very small vias are required, drilling with mechanical bits is costly because of high rates of wear and
breakage. In this case, the vias may be evaporated by lasers. Laser-drilled vias typically have an inferior
surface finish inside the hole. These holes are called micro vias.
It is also possible with controlled-depth drilling, laser drilling, or by pre-drilling the individual sheets of the
PCB before lamination, to produce holes that connect only some of the copper layers, rather than passing
through the entire board. These holes are called blind vias when they connect an internal copper layer to
an outer layer, or buried vias when they connect two or more internal copper layers and no outer layers.
The hole walls for boards with 2 or more layers can be made conductive and then electroplated with copper
to form plated-through holes. These holes electrically connect the conducting layers of the PCB. For
multilayer boards, those with 3 layers or more, drilling typically produces a smear of the high temperature
decomposition products of bonding agent in the laminate system. Before the holes can be plated through,
35
this smear must be removed by a chemical de-smear process, or by plasma-etch. The de-smear process
ensures that a good connection is made to the copper layers when the hole is plated through. On high
reliability boards a process called etch-back is performed chemically with a potassium permanganate
based etchant or plasma. The etch-back removes resin and the glass fibers so that the copper layers
extend into the hole and as the hole is plated become integral with the deposited copper.
Reference: http://en.wikipedia.org/wiki/Printed_circuit_board#Drilling
Table 1. Electronic Symbols hole on board
Description
Number of holes
R- Resistor
L-Inductance
C- Capacitance
D-Diode
T- Transformer
F-Fuse
Q- Transistor
J- Jumper
Possible Image
2x2 PCB
Chemical Solution
Plastic Container
Permanent Marker
Masking Tape
Mini drill
Sand paper
5. Procedure:
1.
2.
3.
4.
Design a two PCB Layout at the 2x2 PCB shown at Figure 2-1 using a masking tape
Engrave the Copper Layout.
Dip the PCB at the Ferric Chloride Solution to remove excess copper at the board.
Wash the PCB using running water.
36
5. Use a mini drill to put holes on the copper side of the first PCB.
6. Wipe the PCB using the Sand paper.
7. Use a mini drill to put holes on the board side of the second PCB.
Figure 2-1
8. Attach the PCB at Data and Result
6. Data and Results:
PCB Drilled in the Copper Side
7. Data Analysis:
8. Assessment Rubric:
37
Activity No. 3
PCB SOLDERING
Course Code: CPE 403/CPE 304
Program:
Course Title: Comp. Engg Drafting and Design
Date Performed:
Section:
Date Submitted:
Name :
Instructor:
1. Objective(s):
The activity aims to practice the students ability in PCB drilling process. This experiment also provides
students knowledge and skills on PCB Lay outing.
2. Intended Learning Outcomes (ILOs):
The students shall be able to:
2.1 Show competency on drilling standard and procedure in designing a PCB layout; and
2.2 Illustrate the effect of drilling standard in developing a circuit design.
3. Discussion:
Safety precautions
1. Never touch the element or tip of the soldering iron. They are very hot (about 600F) and will give a
nasty burn.
2. Always return the soldering iron to its stand when not in use. Never put it down on the workbench,
even for a moment!
3. Work in a well-ventilated area. The smoke formed as melt solder is mostly from the flux and quite
irritating. Avoid breathing it by keeping the head to the side of, not above.
4. Wash both hands after using solder. Solder contains lead which is a poisonous metal.
Preparing the soldering iron
1. Place the soldering iron in its stand and plug in. Set the knob on the soldering iron station to a
starting level of 4. The iron will take a few minutes to reach its operating temperature of about
600F.
2. Dampen the sponge in the stand. It should be damped, not dripping wet.
3. Wait a few minutes for the soldering iron to warm up. Check if it is ready by trying to melt a little
solder on the tip.
4. Wipe the tip of the iron on the damp sponge. This will clean the tip.
5. Melt a little solder on the tip of the iron. This is called 'tinning' and it will drastically help the heat to
flow from the iron's tip to the joint. If it seems to be taking a long time for a joint to heat up it is most
likely because the tip is not tinned.
Inserting the component
Bend the leads of the component to fit in the holes in the board if necessary.
1. Insert the component into the board. IMPORTANT make absolute sure that the components are
38
placed correct location and in the correct orientation. Some of the components must be soldered in
a certain orientation in order to function.
2. If possible, bend the leads of the component outward once they are inserted into the board. This
will keep the component from falling out if you turn the board upside-down.
2x2 PCB
Chemical Solution
Plastic Container
Permanent Marker
Masking Tape
Mini drill
4 pcs. Resistor (any value)
5. Procedure:
1. Design a PCB layout for Figure 3-1 using 2x2 PCB.
2.
3.
4.
5.
6.
7.
8.
7. Data Analysis:
8. Assessment Rubric:
40
Activity No. 4
BLOCK DIAGRAM AND FLOWCHARTING
Course Code: CPE 403/CPE 304
Program:
Course Title: Comp. Engg Drafting and Design
Date Performed:
Section:
Date Submitted:
Name :
Instructor:
1. Objective(s):
The activity aims to design a circuit block diagram and flow chart using ZenitPCB software. This
experiment also provides students knowledge and skills on PCB Lay outing.
2. Intended Learning Outcomes (ILOs):
The students shall be able to:
2.1 Create a circuit block diagram and circuit flow chart using ZenitPCB software; and
2.2 Design a circuit block diagram and circuit flow chart PCB layout.
3. Discussion:
Block Diagram
It is a kind of flowcharting that is considered as a high-level type that can quickly overview the major
process steps and relationship for every component. It is a useful tool for both design and modification of
the existing process or design, but it cannot cater the level of full detailed requirements for more
comprehensive preparation or analysis. The block diagram shows the whole process with in the system of
connecting every electronic component by showing different algorithm and projected process as shown in
Figure 4.1.
41
42
43
Symbol
Input / Output
Arrow
Decision
Connector
Process
44
45
Flow Chart
46
7. Data Analysis:
8. Assessment Rubric:
47
Activity No. 5
LED LIGHTS CIRCUIT
Course Code: CPE 403/CPE 304
Program:
Course Title: Comp. Engg Drafting and Design
Date Performed:
Section:
Date Submitted:
Name :
Instructor:
1. Objective(s):
The activity aims to design a LED Circuit using ZenitCapture software. This experiment also provides
students knowledge and skills on Circuit Layouting.
2. Intended Learning Outcomes (ILOs):
The students shall be able to:
2.1 Create a LED circuit using ZenitCapture software; and
2.2 Design a LED circuit connection using 2x2 Printed Circuit Board (PCB).
3. Discussion:
The LED (Light Emitting Diode) is a semiconductor diode that emits visible light or near infra-red radiation
when it is forward biased. Inside the LED is a semiconductor which is encased in a transparent epoxy resin
which could be either diffused or clear lens. The LED, unlike a normal bulb, has a limited viewing angle
between 30 to 90.
Example:
What would be the resistor value that can resist to a 9 volt battery to light up a LED?
Resistor = (Voltage supplied - LED Voltage*) / LED Current*
48
Note: * - Different LED colour has different current requirement, which could be from 10mA to 30mA.
Luxeons would be from 350mA to 1000mA.
Resistor = (9 - 1.8) / 0.018
Resistor = 400 Ohm
The closest value for this (Under the E12 Resistor value) would be 390 Ohms.
2x2 PCB
Ferric Chloride Solution
ZenitCapture Software
Plastic Container
5. Procedure:
1. Open ZenitCapture software.
2. Create a new project save it as filename: ACT5
3. Modify the respective field as shown in Figure 5-2.
49
5.
6.
7.
8.
9.
PCB Design
50
Hard Copy
51
7. Data Analysis:
8. Assessment Rubric:
52
Activity No. 6
BATTERY MONITORING CIRCUIT
Course Code: CPE 403/CPE 304
Program:
Course Title: Comp. Engg Drafting and Design
Date Performed:
Section:
Date Submitted:
Name :
Instructor:
1. Objective(s):
The activity aims to design a Circuit Wiring Diagram using ZenitCapture software. This experiment also
provides students knowledge and skills on battery monitoring circuit design.
2. Intended Learning Outcomes (ILOs):
The students shall be able to:
2.1 Create a Battery Monitoring Circuit using ZenitCapture software; and
2.2 Design a Battery Monitoring Circuit connection using 2x2 Printed Circuit Board (PCB).
3. Discussion:
Electric battery is a device consisting of one or more electrochemical cells that convert stored chemical
energy into electrical energy. Each cell contains a positive terminal, or cathode, and a negative terminal, or
anode. Electrolytes allow ions to move between the electrodes and terminals, which allows current to flow
out of the battery to perform work.
Primary (single-use or "disposable") batteries are used once and discarded; the electrode materials are
irreversibly changed during discharge. Common examples are the alkaline battery used for flashlights and
a multitude of portable devices. Secondary (rechargeable batteries) can be discharged and recharged
multiple times; the original composition of the electrodes can be restored by reverse current.
Batteries have much lower specific energy (energy per unit mass) than common fuels such as gasoline.
This is somewhat mitigated by the fact that batteries deliver their energy as electricity (which can be
converted efficiently to mechanical work), whereas using fuels in engines entails a low efficiency of
conversion to work.
There are many example of battery monitoring circuit in which the Zener controlled transistor shows the
states of the battery. When the battery voltage is less than 11 volts, the Zener diodes ZD1 and ZD2 cease
to conduct and Red LED only lights when the battery is in the low condition. If the voltage is between 12
volts and 14 volts, ZEner T1 lights an indication of normal voltage. In the case that the battery voltage
exceeds 15 volts, Zener diode ZD2 also conducts and T2 forwarded bias. Yellow LED indicates the
overcharging state. Figure 6-1 shows the original circuit diagram developed by
http://www.electroschematics.com/4838/battery-monitor/
53
5. Procedure:
1. Open ZenitCapture software.
2. Create a new project save it as filename: ACT6
3. Modify the respective field as shown in Figure 6-2.
54
5.
6.
7.
8.
9.
55
Hard Copy
56
7. Data Analysis:
8. Assessment Rubric:
57
Activity No. 7
PIC12C508SM CIRCUIT
Course Code: CPE 403/CPE 304
Program:
Course Title: Comp. Engg Drafting and Design
Date Performed:
Section:
Date Submitted:
Name :
Instructor:
1. Objective(s):
The activity aims to design a PIC12C508SM Circuit using ZenitCapture and ZenitPCB software. This
experiment also provides students knowledge and skills on PIC12C508SM circuit design.
2. Intended Learning Outcomes (ILOs):
The students shall be able to:
2.1 Create a PIC12C508SM Circuit using ZenitCapture and ZenitPCB software.
2.2 Design a PIC12C508SM Circuit connection using 2x2 Printed Circuit Board (PCB).
3. Discussion:
PIC12C5XX microcontroller family is consist of 8-pin, 8-bit CMOS microcontrollers. Its high performance
RISC CPU has only 33 single word instructions. All instructions are single cycle except for program
branches which are two-cycle. The operating speed of 4Mhz clock input for DC and a 1 s instruction cycle
is one of its features. Its high performance also covers the 12-bit wide instruction and 8-bit wide data path.
The seven special function hardware registers, two-level deep hardware stack, direct, indirect and relative
addressing modes for data and instruction covers the internal 4 MHz RC oscillator with programmable
calibration and the in-circuit serial programming are some other features of its high-performance RISC
CPU. The peripheral features are the following: 8-bit real time clock/counter (TMRO) with 8-bit
programmable prescaler, Power-On Reset (POR), Device Reset Timer (DTR), Watchdog Timer (WDT) with
its own on-chip RC oscillator for reliable operation, Programmable code-protection, 1,000,000 erase/write
cycle EEPROM data memory, power saving SLEEP mode, Wake-up from SLEEP on pin change, Internal
weak pull-ups on I/O pins and many more. It CMOS technology covers the low power, high speed CMOS
EEPROM/ROM Technology with full static design of wide operating voltage range with a wide temperature
range from the following: Commercial: 0C to +70C, Industrial: -40C to +85C, Extended: -40C to
+125C and a low power consumption of < 2 mA @ 5V, 4 MHz, 15 A typical @ 3V, 32 KHz, < 1 A
typical standby current. Figure 7-1 shows the pin diagram of PIC12C5XX.
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Reference: http://pdfdata.datasheetsite.com/pdf1/Microchip/PIC12LCE519T-04-SN.pdf
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10.
11.
12.
13.
14.
15.
Package ACT7.
Create a Netlist PCB.
Open ZenitPCB Software.
Create a 50x50 mm Board Outline.
Import the ACT7 components.
Place the components inside the boundary as shown in Figure 7-5.
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7. Data Analysis:
8. Assessment Rubric:
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Activity No. 8
COMPLEX CIRCUIT
Course Code: CPE 403/CPE 304
Program:
Course Title: Comp. Engg Drafting and Design
Date Performed:
Section:
Date Submitted:
Name :
Instructor:
1. Objective(s):
The activity aims to design a Complicated Circuit using ZenitPCB software. This experiment also
provides students knowledge and skills on Complicated Circuit design.
2. Intended Learning Outcomes (ILOs):
The students shall be able to:
2.1 Create a Complicated Circuit using ZenitPCB software; and
2.2 Design a Complicated Circuit connection using 2x2 Printed Circuit Board (PCB).
3. Discussion:
A complex circuit is an interconnection of electrical components to form a closed electrical loop. The circuit
is formed by elements such as resistors, capacitors, switches inductors and an electricity source.
4. Materials and Equipment:
1.
2.
3.
4.
4x4 PCB
Ferric Chloride Solution
ZenitCapture Software
Plastic Containner
5. Procedure:
1.
2.
3.
4.
5.
6.
7.
8.
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7. Data Analysis:
8. Assessment Rubric:
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Activity No. 9
DC MOTOR CONTROLLER CIRCUIT
Course Code: CPE 403/CPE 304
Program:
Course Title: Comp. Engg Drafting and Design
Date Performed:
Section:
Date Submitted:
Name :
Instructor:
1. Objective(s):
The activity aims to design a DC motor controller circuit using ZenitPCB software. This experiment also
provides students knowledge and skills on DC motor controller Circuit design.
2. Intended Learning Outcomes (ILOs):
The students shall be able to:
2.1 Create a DC motor controller circuit using ZenitPCB software; and
2.2 Design a DC motor controller connection using 2x2 Printed Circuit Board (PCB).
3. Discussion:
DC motor relies on the facts that like magnet poles repels and unlike magnetic poles attract each other. A
coil of wire with a current running through it generates an electromagnetic field aligned with the center of
the coil. By switching the current on or off in a coil its magnet field can be switched on or off or by switching
the direction of the current in the coil the direction of the generated magnetic field can be switched 180. A
simple DC motor typically has a stationary set of magnets in the stator and an armature with a series of two
or more windings of wire wrapped in insulated stack slots around iron pole pieces (called stack teeth) with
the ends of the wires terminating on a commutator. The armature includes the mounting bearings that keep
it in the center of the motor and the power shaft of the motor and the commutator connections. The winding
in the armature continues to loop all the way around the armature and uses either single or parallel
conductors (wires), and can circle several times around the stack teeth. The total amount of current sent to
the coil, the coil's size and what it's wrapped around dictate the strength of the electromagnetic field
created. The sequence of turning a particular coil on or off dictates what direction the effective
electromagnetic fields are pointed. By turning on and off coils in sequence a rotating magnetic field can be
created. These rotating magnetic fields interact with the magnetic fields of the magnets (permanent
or electromagnets) in the stationary part of the motor (stator) to create a force on the armature which
causes it to rotate. In some DC motor designs the stator fields use electromagnets to create their magnetic
fields which allow greater control over the motor. At high power levels, DC motors are almost always cooled
using forced air.
A PIC programmer is a circuit which interfaces the PC to the microcontroller using the PC's parallel, serial
or USB port. It can write data to the microcontroller and read it back for verification.
The PIC programmer translates digital logic levels from the PC to suitable logic levels for the
microcontroller - most levels are ok as they are, but for 'normal' (or high volt) programming of a PIC
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4x4 PCB
Ferric Chloride Solution
ZenitCapture Software
Plastic container
5. Procedure:
1.
2.
3.
4.
5.
6.
7.
8.
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7. Data Analysis:
8. Assessment Rubric:
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Activity No. 10
USB INTERFACE CIRCUIT
Course Code: CPE 403/CPE 304
Program:
Course Title: Comp. Engg Drafting and Design
Date Performed:
Section:
Date Submitted:
Name :
Instructor:
1. Objective(s):
The activity aims to design a USB interface Circuit using ZenitPCB software. This experiment also
provides students knowledge and skills on USB interface Circuit design.
2. Intended Learning Outcomes (ILOs):
The students shall be able to:
2.1 Create a USB interface circuit using ZenitPCB software; and
2.2 Design a USB interface Circuit connection using 2x2 Printed Circuit Board (PCB).
3. Discussion:
Universal Serial Bus (USB) is an industry standard developed in the mid-1990s that defines the cables,
connectors and communications protocols used in a bus for connection, communication, and power supply
between computers and electronic devices.
USB was designed to standardize the connection of computer peripherals (including keyboards, pointing
devices, digital cameras, printers, portable media players, disk drives and network adapters) to personal
computers, both to communicate and to supply electric power. It has become commonplace on other
devices, such as smartphones, PDAs and video game consoles. USB has effectively replaced a variety of
earlier interfaces, such as serial and parallel ports, as well as separate power chargers for portable
devices.
Reference: http://en.wikipedia.org/wiki/USB
4. Materials and Equipment:
1.
2.
3.
4.
4x4 PCB
Ferric Chloride Solution
ZenitCapture Software
Plastic container
5. Procedure:
1. Open ZenitPCB software.
2. Create a new project save it as filename: ACT9
3. Create the circuit in Figure 9-1.
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4.
5.
6.
7.
8.
7. Data Analysis:
8. Assessment Rubric:
74