Lecture for EE 233

Optical MEMS for

Telecommunication Systems
Ming C. Wu
University of California, Berkeley
Department of EECS &
Berkeley Sensor and Actuator Center (BSAC)
wu@eecs.berkeley.edu

Ming Wu

Acknowledgment
Providing viewgraphs

Thomas Ducellier (Metconnex)

Dan Marom (Lucent)
Katsu Okamoto (Okamoto Lab)
Olav Solgaard (Stanford University)
Rod Tucker (Univ. Melborne)

Graduate students and Postdocs at Berkeley and UCLA

Monolithic WSS: Josh C.H. Chi, Chenlu Hou, Chi-hung Lee
WSS: J.C. Ted Tsai, Dr. Li Fan, Dr. Dooyoung Hah, Sophia
Huang
PLC switch: Josh C.H. Chi, Ted Tsai, in collaboration with Dr.
Katsu Okamoto
PhC switch: M.C. Mark Lee
MEMS Microdisk: M.C. Mark Lee, Jin Yao, David Leuenberger
Si Photonics: Sagi Mathai, Joanna Lai, Xin Sun (Prof. Tsu-Jae
King)

Ming Wu

OUTLINE
Introduction
Optical design considerations
Space division switches
2D MEMS optical switches
3D MEMS optical switches

Spectral domain processors

Wavelength-selective switches

Planar lightwave circuits (PLC)-MEMS Integration

Diffractive optical MEMS
New directions
Summary

Ming Wu

Why Optical MEMS ?

Optical MEMS offers

Low optical insertion loss

Low crosstalk
Transparency (wavelength, polarization, bit rate, data format)
Low power consumption

Why ?
The effect of moving optical elements is stronger than electrooptic, thermal-optic effects
Very efficient beam steering devices

What
Switches
Tunable devices (delay, dispersion, wavelength, bandwidth,
dynamic gain equalization, etc)

Ming Wu

Optical MEMS

Ming Wu

25 Years of Optical MEMS

Scanning Mirror
(Petersen, IBM)

Micromotoers
(Berkeley)

1980
Digital Micromirror
Device (DMD, TI)

TI
TIs DMD
TI
Ming Wu

Free-Space Optical Bench

(UCLA/Berkeley)

1990

3D MEMS
Switches

2000

Grating Light Valve

(GLV, Stanford)

2D MEMS Switches
(Tokyo U)

Silicon Light Machine

6

Digital Micromirror Devices (DMD)

~ 1 million DMDs on a chip

http://www.dlp.com/dlp/resources/dmmd.asp
Ming Wu

Digital Micromirror Device (DMD)

Texas Instruments

Top View of DMD

L. Hornbeck, Electronic Imaging, 1997

Ming Wu

Detailed Layer Structure of DMD

L. Hornbeck, Electronic Imaging, 1997

Ming Wu

TIs Digital Micromirror Devices (DMD)

(Texas Instruments, Digital Micromirror DeviceTM)

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10

Transfer Characteristics of Torsion

Mirrors
Bistable
Regime

Angle

Pull-in voltage
(or Stiffness Voltage)

2 z03
VS =
WL3C

Analog
Regime

Voltage
Pull-in
Voltage

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11

Principle of Projection System

Using DMD

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12

Projection Display Using

Digital Micromirror Display (DMD)

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13

Bulk Micromachining
Anisotropic wet chemical etching (restricted to fixed crystalline orientations)
<100>

<110>

<111>
<111>

Vertical
Sidewall

Deep reactive ion etching (DRIE or ICP-RIE)

High aspect ratio (> 20:1)

Independent of crystal orientation
More efficient use of real estate of
substrate (e.g., can produce
closely spaced structures)
Ming Wu

Combine with silicon-on-insulator (SOI)

or III-V epi wafer
Suspended structure in one-step
etching + releasing
Multi-layer structure by additional wafer
bonding
14

SurfaceSurface-Micromachining:
2 Standard
Standard Foundry Process
MUMPs
MUMPs

SUMMiT
SUMMiT
1 um

12.75 um

0.5 um

Poly 4

2 um

CMP2

Poly 3

6.25 um
Poly 2

CMP1

Poly 2
Poly 1

Poly 1
Poly 0

Poly 0

Si Substrate

Si Substrate

Sandia National Lab

MEMSCAP

Fairchild (SUMMiT-4)
Ming Wu

15

MEMS Technologies and Optical Element Size

Optical
Element
Size

1 cm

1 mm

Scanning display
Imaging

Applications

Main
Fabrication
Technologies
Main
Actuation
Mechanisms

Ming Wu

100 m

10 m

1 m

Mirror-based
VOA

3D-MEMS
OXC

Projection
OADM
display
WSS
2D Gain equalizer 2x2 Switches
MEMS Dispersion
VOA
Switch compensator

Bulk-Micromachining

Diffractive
MEMS

Surface-Micromachining

(Single Crystalline Si,

DRIE, Wafer Bonding)

(Poly-Si, Al)

Electromagnetic
Actuation

Microresonators
Photonic
Crystals

NanoFabrication

Electrostatic Actuation

16

Optical Designs

Ming Wu

17

Direct Coupling Without Lenses

0

Thermally Expanded Core

(TEC) Fiber

Insertion Loss (dB)

Single Mode Fiber (SMF)

-1

IndexMatching
Fluid

-2
-3

Air

Air

-4
-5

TEC

SMF
0

200

400

600

800

1000

Distance (um)

Short propagation distance

May be used for small switches or VOAs
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18

Example: 2x2 Switch

Cross
State

Bar
State

Marxer, et al., J-MEMS, vol.6, 1997. p.277-85.

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19

Free-Space Optics: Gaussian Beam

2 2 w0

2w 0

w02
b=

z 2
w ( z ) = w0 1 +
b
2

(Confocal Parameter)

Larger beam waist Long collimation length

System size ~ 2b
Mirror diameter ~ 2aw0,
Ming Wu

a ~ 1.5 to 2
20

10

Space Division Switches:

(1) 2D MEMS Optical Switches

(2) 3D MEMS Optical Switches

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21

Scaling of 2D MEMS Optical Switches

2 2w0

2w0
ADD Channels

2D MEMS
Switch
Chip

DROP
Channels

2b
N : Port Count
P : Fiber Pitch

Input
Channels

L = NP 2b =
Collimator
Arrays

: Chip Length

2R
: Fill Factor of Micromirror
P
R = aw0 : Mirror Radius,

=
Output
Channels

a ~ 1.5 to 2

L = 2b

N
Ming Wu

2w02

w0
a

2a 2 2
N
L =
2

22

11

Port Count of 2D MEMS Switches

Port Count vs Beam Size

Loss Due to Mirror Tilt

5

80

Loss due to Mirror Tilt (dB)

Maximum Port Count

Fill Factor =
70%

60

50%

40

30%
20

0
0

50

100

150

Mirror Tilt =

0.2
3

0.1

0.05

200

50

1/e Beam Waist (m)

w0
a
2a 2 2
N
L =
2

Port Count : N
Chip Size :
Ming Wu

100

150

200

1/e Beam Waist (m)

Accuracy and uniformity of mirror

angles impose a loss penalty, which
limit the maximum port count

23

SurfaceSurface-Micromachined
2D MEMS Optical Switches (16x16)

L. Fan, et al., OFC 2002

16x16 Switch
L. Fan, et al., OFC 2002

Absolute angular uniformity ~ 0.05

70

Number

60
50
40
30
20

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24

90.20

90.16

90.12

90.08

90.04

90.00

89.96

89.92

89.88

89.84

89.80

10

Mirror Angle (degree)

12

Scaling of 3D MEMS OXC

2D Array of 2-Axis
Micromirrors

Input
Collimators

Output
Collimators

2D Array of 2-Axis
Micromirrors

L( )
9a 2

Port Count : N =

2w0

Optical Path Length : L = 2b =

: Mechanical Scan Angle

R = aw0 : Mirror Radius

2w0

2w02

a ~ 1.5 to 2
w0 : Beam Waist

L
3

Ming Wu

25

Lucents Lambda Router

(Lucent Lambda Router)

Ming Wu

26

13

2D Scanners with Staggered Vertical

Combdrives

Mirror surface
Mirror array
substrate

Comb teeth

Gold bump
Electrode
substrate
Fujitsu, 2002
Ming Wu

27

Fujitsu Micromirror for 33-D MEMS Optical Switch

Ming Wu

28

14

Fujitsus 3-D MEMS Switch

Mitsuhiro Yano, Fumio Yamagishi, and Toshitaka Tsuda, IEEE J. SELECTED TOPICS QUANTUM
ELECTRONICS, VOL. 11, p. 383, MARCH/APRIL 2005
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29

Fujitsus 3-D MEMS Switch

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30

15

Fujitsus 3-D MEMS Switch

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31

Wavelength-Selective Switches (WSS)

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16

1xN WavelengthWavelength-Selective Switch &

NxN WavelengthWavelength-Selective Cross Connect
1, 2, , n

1,
3, 4,
2,
n,

14 WSS

Ming Wu

1, 2, , n
1, 2, , n
1, 2, , n
1, 2, , n

44 WSXC

1,
3, 4,
2,
n,

33

Optical Network Architecture

OADM (Ring)
Add-Drop with fixed s

Ring Network

ROADM (Ring)
Add-Drop with programmable s
1xN Wavelength-Selective Switch (Mesh)
Multi-degree ROADM
North

WSS

ADD
DROP

DROP

ADD

OADM

DROP

Lack of
Connectivity

ADD

WSS

Mesh Network

South

NxN Wavelength-Selective Cross Connect (Mesh)

WSXC

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34

17

Fourier Transform Pulse Shaper

A. M. Weiner, J. P. Heritage, and E. M. Kirschner, J. Opt. Soc. Am. 1988

Shaping femtosecond pulses by modulating the phases and

amplitudes of their spectral components

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35

Dynamic WDM Functions

tors
lima
l
o
C

M
Li EM
gh S
tM S
Ar od pat
ra ul ial
y ato
r

g
in
at
r
G

f
f
Ming Wu

MEMS Spatial
Light Modulator
Array

Dynamic
WDM
Functions

Piston Mirrors

Femtosecond pulse
shaper

ON-OFF
reflectors

Wavelength
blocker

Variable
reflectivity
mirror

Spectral (or gain)

equalizer

1x2 Digital
micromirrors

Optical add-drop
multiplexer (OADM)

1xN analog
micromirrors

WavelengthSelective Switch
(WSS)

Deformable
mirrors

Tunable dispersion
compensator

36

18

1x4 Wavelength-Selective Switch (WSS)

Y

tors
lima
l
o
C

g
in
at
r
G

Analog
Micromirror
Array

f
f
Ming Wu

37

1x4 WSS

D. Marom et al. (Lucent), OFC 2002

1x4 WSS
Channel spacing: 50 or 100 GHz
MEMS performance: 12 ( > 55 V )

Ming Wu

T. Ducellier et al. (JDS-U),

ECOC 2002
1x4 WSS
Channel spacing: 100 GHz
MEMS performance: 2

38

19

64 Channel, Wavelength-Selective 41 Switch (D. Marom)

Free-Space Implementation

WSS provides:
Port switching
Wide passbands
10 dB DSE
Blocking
Low insert loss
Low PDL, DGD

Ming Wu

39

Analog Micromirror Array (UCLA)

Movable fingers

Mirror

y
x

Hidden springs

Rotation Angle (deg)

Fixed fingers

8
6

Anchor

Comb Finger Spacing

Scan Angles

0.5m 1m

Voltage

2m
3m

4
2
DMD-Like

0
0
Ming Wu

5
10
15
20
Applied Voltage (V)

25

+/- 6 (mechanical)
6V

Fill Factor

98%

Res. Freq.

3.4 kHz

Stability (3hr)

0.00085

System (3hr)

0.0035dB

D. Hah, et al (UCLA) J. MEMS, 2004, p. 279

J.C. Tsai, et al (UCLA) IEEE PTL 2004, p. 1041
40

20

Scaling of WSS
wColl

w MEMS
Analog
Micromirror
Array

Collimators

w MEMS =
N spatial

wColl

22 f # Grating

N spatial N =
Ming Wu

System size ~ 2 f

BW f

22 f # Grating

Total capacity (Nspatial x N )

is constant
Proportional to f

41

Approach for Increasing Port Count (1)

D. Marom
(Lucent)

Use anamorphic prism pair to compress lateral beam size on

MEMS micromirrors
Elliptical beams on MEMS mirrors Rectangular
micromirror
Ming Wu

42

21

Approach for Increasing Port Count (2)

Y

1xN2 WSS:
2D collimator array
1D array of 2-axis
micromirror array

Grating

Port count is increased

from N to N2
N is the diffraction-limited
linear port count

High port count WSS

1x32 WSS has been
demonstrated

f
Resolution lens

J.-C. Tsai, et al., (UCLA) ECOC 2004, Paper

Tu1.5.2

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43

High-Fill Factor 2-Axis Micromirror Array

Mirror
Lever

2-DOF mirror joint

Vertical
combdrive
actuators

Gimbal-less
High Fill factor (> 98%)

Large scan angle

3x angle amplification by leverage

Low voltage
Powerful vertical combdrive actuators
J.C. Tsai, L. Fan, D. Hah, and M.C. Wu, IEEE LEOS
International Conference on Optical MEMS 2004
Ming Wu

Original mirror
position

44

22

SEM of GimbalGimbal-less 22-Axis Analog Micromirror

Array

Ming Wu

SUMMiT-V 5-layer surface micromachining process

Mirror pitch: 200 um

Large scan angles: 6.7 (mechanically) @ 75 V

Fill factor: 98%

Resonant frequency = 5.9 kHz

J.C. Tsai, L. Fan, D. Hah, and M.C. Wu, IEEE LEOS
International Conference on
45 Optical MEMS 2004

Planar Lightwave Circuit (PLC) MEMS

Ming Wu

46

23

Reconfigurable Optical Add/Drop Multiplexer

(ROADM)
Drop Main output
port port

Main Add
input port
port
(a) Configuration of 16ch-100GHz OADM

(b) Photograph of OADM

K. Okamoto et al., Electron. Lett., vol. 31, pp.723-724, 1995

(VG courtesy of K. Okamoto)

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47

PLC 1x9 WSS

Output 1
Output 2
1x2

Input

Output 3
Output 4

1x9 WSS
Thermal optic switch
450 mW / switch
Total power ~ 14W
Loss ~ 5.4 dB
Isolation > 46 dB

Output 5

C.R. Doerr, et al. (Lucent), OFC 2002 Postdeadline Paper, FA3

Ming Wu

48

24

2x2 MEMS Waveguide WSXC

3 diffraction orders by AWG

Optical phases of (+1, 0, -1) orders
modulated by MEMS piston mirrors
Chip ~ 5 x 9 mm2

100 GHz channel spacing

10.6 dB insertion loss
20 dB extinction ratio

D.T. Fuchs, et al (Lucent) IEEE PTL, Jan. 2004

Ming Wu

49

40 Channel, Wavelength-Selective 12 Switch (D. Marom)

Hybrid PLC and Free-Space Implementation
Input

MEMS
micromirror
array

Port 1
Port 2

Hybrid WSS provides:

Same benefits as free space WSS
Compact implementation
Integration of additional functionality

Cylindrical
collimators

Switch to Port 1

Ming Wu

> 0

PLC 1 and PLC 2

Fourier
lens

< 0

Switch to Port 2

50

25

Compact Spectral Pulse Shaper (D. Marom)

Hybrid PLC and Free-Space Implementation
3.0

Phase []

2.5
2.0
1.5
1.0
0.5
0.0
0

20

40

60

80

Voltage

Input Pulse

Thru shaper

Dispersion

Compensated Shaped signal

MEMS piston motion micromirror array

>2 phase modulation
Polarization insensitive

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51

Pulse Shaper provides:

Spectral domain processing
Polarization independent
Gateway to optical arbitrary
waveform synthesis

2D arrangement of ports for scalable 1x9

WSS
Array of Waveguide Dispersive Elements
Collimating/Focusing
lenses
MEMS mirror
linear array

Ming Wu

52

26

Interleaved spectrum switched to all

output ports

Ming Wu

53

Free-Space and Hybrid Integrated 1xN

WSS
Free-Space 1xN WSS

Hybrid 1xN WSS

Optical
Fibers

Grating

Microlens

Bulk
Lens

MEMS
Chip

Silica PLC

f
Resolution Lens

Silica PLC has low insertion loss

Large space

Hybrid integration requires external

collimator and lens

Complicated alignment
D. Marom, et al. (Lucent), OFC 2002.

T. Ducellier et al. (Metconnex), ECOC, 2004

T. Ducellier, et al. (JDS-U), ECOC 2002.

D.M. Marom et al. (Lucent), OMEMS 2004

S. Huang, et al. (UCLA), O-MEMS 2002.

D.M. Marom et al. (Lucent), ECOC 2005

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27

SiliconSilicon-Based Monolithic 1x4 WavelengthWavelength-Selective Switch

Silicon PLC is compatible with SOI-MEMS technologies

Excess Insertion loss can be reduced with AR coating and smoothed
sidewall (e.g. hydrogen annealing)

C.H. Chi et al., CLEO 2005

Ming Wu

55

Integrated Optical Components

Parabolic Collimator

Parabolic Focusing Reflector

90 off-axis

TIR

TIR

Blazed Micro-grating

Electrostatic Micromirror

TIR
Ming Wu

C.H. Chi et al., OFC 2006

56

28

4x4 Wavelength-Selective Cross Connect

1x4 WSS
1 2 8

In1
In2
In3
In4
In1
In2
In3
In4

Ming Wu

Free-Space WSXC

1
3 4
2
6 8

WSS

4x4 WSXC
WSS1

WSS5

WSS2

WSS6

WSS3

WSS7

WSS4

WSS8
WSS1
WSS2
WSS3
WSS4

Out1
Out2
Out3
Out4
Out1
Out2

D. M. Marom et al. (Lucent), ECOC 2003

Out3

Four passive 1x4 splitters (6.5 dB loss)

Out4

C.H. Chi et al., OFC 2006

Four 4x1 WSS (4 dB loss)

57

Monolithic 4x4 WSXC Planar Integration

Support Broadcast and Multicast Functions
1x4 MMI splitter

Waveguide Shuffle Network

WSS1

Waveguide Bending

Waveguide Crossing

Out1
Out2
In1
In2
In3
In4
Out3
Out4

WSS2

46mm

WSS3

WSS4

Ming Wu

C.H. Chi et al., OFC 2006

58

32mm

29

Simulation
Waveguide Bend (2D FDTD)

MMI (3D BPM)

R = 100 m
Splitting Loss = 6.1 dB

1 m Offset

Nonuniformity = 0.004 dB

Loss = 1 dB
1 m Offset

Waveguide Crossing (2D FDTD)

Loss
0.05 dB

890 um
40 um

C.H. Chi et al., OFC 2006

Ming Wu

Crosstalk
-66 dB

59

Fabricated Device
1x4 WSS

Solid Immersion Mirror

Micromirror

100m

Micro-grating

Collimator

50m
Ming Wu

4x4 WSXC

5m

C.H. Chi et al., OFC 2006

60

30

Spectral Response of 4x4 WSXC

-40

Transmissivity (dB)

Grating Efficiency (Theoretical)

M3
M4
M5
M6
M7
M8

-5

-45

-10

-50

-15

-55

-20

-60

-25

-65

-30

-70
1460

1480

1500

1520

1540

1560

Grating Efficiency (dB)

-35

-35
1580

Wavelength (nm)

Six micromirrors tested with available tuning range: 1460-1580 nm

3 dB passbands:
1477-1482 nm, 1488-1494 nm, 1507-1517 nm
1527-1535 nm, 1539-1553 nm, 1561-1573 nm

Additional passband from adjacent grating order

Ming Wu

C.H. Chi et al., OFC 2006

61

Transfer Curve of 4x4 WSXC

Signals are selected from each
input port and transported to the
designated output port

WSS1

Extinction ratio from In1 is lower

due to imperfect AR coating
WSS2

-35

Transmission (dB)

Out1
Out2
In1
In2
In3
In4
Out3
Out4

WSS3

WSS4

In 1

In 2

In 3

In 4

-40
-45
-50
-55
-60
-65
-70

20 40 60 80 100 120 140 160

Voltage (v)
Ming Wu

C.H. Chi et al., OFC 2006

62

31

Diffractive Optical MEMS

Ming Wu

63

Grating Light Valve

Incident Light Reflected

Incident Light Diffracted

Nitride with
Al coating

O. Solgaard, F. S. A. Sandejas, D. M. Bloom, "A deformable grating optical modulator", Optics

Letters, vol. 17, no. 9, pp. 688-690, 1 May 1992.

Applications

Projection display
Variable optical attenuators (VOA)
Gain equalizers
Wavelength blockers

Companies
Silicon light machine (Cypress),
Lightconnect, Polychromix, Kodak

Ming Wu

Silicon Light Machine

Polychromix
64

32

Telecommunications Applications

Dynamic Spectral Equalizer (DSE)

Reconfigurable Channel Blocking Filter

Ming Wu

Dynamic Gain Equalizer

65

MEMS Switchable WDM Deinterleaver Based on

GiresGires-Tournois Interferometer
Olav Solgaard, Stanford University

Input fiber

Tunable
Tunable
Laser
Laser

Power
Power
Detector
Detector
MEMS Beam
Focusing
Mirror Splitter
Lens
Array

Output
Fiber Array

http://wdm.stanford.edu/snrc/kyoungsik12_10_01.ppt
Ming Wu

66

33

Nanophotonic MEMS

Ming Wu

67

Whispering Gallery Mode (WGM)

WGM first explained by

Lord Rayleigh in 1910
Used in
Acoustic waves
Microwaves

St Pauls Cathedral, London

Ming Wu

Optical waves

68

34

WGM in Silica Microsphere

Made by melting a fiber
tip
First demonstrated by
Braginsky, et al, 1989
Extremely high Q
~ 2x1010
Maleki, et al, (JPL)
2004

Ming Wu

69

Optical Microresonators
0

Equivalent Circuit
m:1

Filter proposed by Marcatili

(Bell Labs), 1969

1:m

Channel dropping filter

Needs high Q > 105
Surface roughness < 1 nm
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70

35

Microring Resonator-Based PIC

42 m

Thermally Tuned
with Vernier Architecture

S. T. Chu, B. E. Little, V. Van, J. V. Hryniewicz, P. P. Absil, F. G. Johnson, D. Gill, O. King, F.

Seiferth, M. Trakalo and J. Shanton (Little Optics) OFC 2004
Ming Wu

71

Variable Quality Factor

Output

Power Coupling (2)

1e+0

Input

Over-coupled

1e-1

Critically Coupled

1e-2

Under-coupled
1e-3
1e-4

Decoupled
0.0

0.1

0.2

0.3

0.4

0.5

Disk-Waveguide Spacing (m)

Under-coupled

Critically Coupled

Over-coupled

Transmission

De-coupled

Frequency

Ming Wu

Frequency

Frequency

Frequency

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36

Scaling of Optical Wires

Insensitive to surface
roughness
Multi-mode
Lower density
t

Higher density
Very sensitive to
surface roughness
w

Single Mode

rms 1 nm
Waveguide Loss (cm-1)

w t 0.18

Surface Roughness

m2

Thickness, t (um)

TM Like

Ming Wu

TE Like

Si
OX

Multimode
Single
Mode
Waveguide Width, w (um)

73

TM-like Mode

Surface
Roughness

0.25um

5 nm
0.5um

3 nm
1 nm

Waveguide Width (um)

< 0.25-nm Surface Roughness

by H2 Annealing
Before Annealing

After Annealing
Silicon Waveguide

Silicon Waveguide

SiO2

SiO2

Microdisk

Sidewall

Microdisk

Sidewall
Substrate

Substrate

Ming Wu

Surface Roughness
< 0.25 nm
74

37

Microdisk Resonator with MEMS Tunable

Coupler (First Generation Device)
V
Waveguides

Microdisk

Successfully demonstrated
Switchable notch filter (O-MEMS 03)
Tunable dispersion, 0 ~ 400 ps/nm (CLEO 04)

Q ~ 10,000 due to vertical offset

Phase 2: Vertical Coupling

Ming Wu

75

SecondSecond-Generation MEMS Microdisk Resonator

Microdisk

Left Electrode
Waveguide

Right Electrode

Radius: 20 m
Thickness : 0.25 m

Suspended deformable
waveguides

Microdisk Resonator

Width: 800 nm
Thickness: 250 nm
Length: 100 m

Waveguide

Initial gap spacing

WG/Disk: 1 m

Ming Wu

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38

Under- to Over-Coupling
Critical Coupling (=)

Under Coupling (<)

Straight

Largely-bent

Slightly-bent

Microdisk

Microdisk

Microdisk

Transmission (dB)

Over Coupling (> )

-5

-5

-5

0V

-10

17V

-10

-20

Resonant
-15 Wavelength
-20 = 1549.37nm

-25

-25

-15

-30
1548.5

Ming Wu

1549

1549.5

-15
-20
-25

-30
1550 1548.5

Wavelength (nm)

23.5V

-10

1549

1549.5

1550

-30
1548.5

1549

1549.5

1550

Wavelength (nm)

Wavelength (nm)
77

Reconfigurable Optical AddAdd-Drop Multiplexer

(ROADM)
Parallel
ParallelConfiguration
Configuration
Input

Through

Drop

Add

Cross
CrossConfiguration
Configuration
Input

Add

Through

Transmission
At Resonance

Drop

Drop

Through

Waveguide-Disk Spacing
Ming Wu

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Dynamic Wavelength Add-Drop

Applied Voltage: 30V

Applied Voltage: 0V

Through Port

Through Port

1550

1555

1560

Drop Port
0
-10

Transmission (dB)

Transmission (dB)

-10
-20

Through

-10
-20

1550

1555

1560

Drop Port
0
-10

Input
-20

1550

1555

1560

Wavelength (nm)

-20

1550

1555

Drop

1560

Wavelength (nm)

Cascadable, hitless operation

Almost 0 dB insertion loss is observed without bias
Ming Wu

79

Spoiling Q by MEMS Metal Membrane

Use a metal membrane to spoil the Q of microring resonator
Low loss resonant wavelength sent to Drop port
High loss all wavelengths transmitted to Through port

Disabled resonance

Enable resonance

Gregory N. Nielson, et al., (MIT) MEMS based wavelength selective optical switching for
integrated photonic circuits, CLEO 2004
Ming Wu

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40

SUMMARY
Tremendous progresses have been made in

MEMS devices and manufacturing

Micro-optics
Packaging
Control

New trends in Optical MEMS -- Integration

Ming Wu

Higher level of integration, less free-space alignment

MEMS-PLC integration
MEMS-nanophotonics integration
Electronics integration
Single-chip optical MEMS system

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