10/22/2015

Integrated Electronics
Introduction

Dr. Abid Karim

akarimpk@iqra.edu.pk

Week-wise Course Break-up

Week
1.

Topic to be Covered
Introduction to Microelectronics

Basic Properties of Semiconductor Materials

Review of materies, structural and operational characteristics of basic Quiz is due

Semiconductor Devices

Fabrication Processes: BJT and MOS fabrication processes, Design rules,

Packaging of Integrated circuits

Fabrication Processes: Complexity of Integrated circuits

Differential Amplifier: A simple Design

DC and AC analysis of Differential Amplifier

Op-Amp: Input offset voltage, input offset currents, input bias currents, offset
compensation
Op-amp with negative feedback
Op-amp with negative feedback
DC and AC analysis of op-amp ICs
Frequency Response of an op-amp
Mid Term Examinations

Remarks

Deadline for
Assignment # 1
Submission

Quiz is due

10/22/2015

Week-wise Course Break-up

Week
9

10

Topic to be Covered
Properties and Definitions of Digital Integretd Circuits: Introduction to Digital
Systems, Logic Operations, Digital IC Terminology (current and voltage
parameters of IC), FAN-IN, FAN-OUT, Transient characteristics, Propagation
Delay, Speed Power Product, Numarical Problems
Logic Families: Resistor Transistor Logic, Diode Transistor Logic, Transistor
Transistor Logic, Schottky Transistor Transistor Logic, Advanced Schottky,
Emitter Coupled Logic, CMOS, BiMOS, Numarical Problems

Remarks

Deadline for
Assignment
#
2
Submission

13

Comparision and Interfacing of Logic Families, TTL to CMOS interfacing, ECL Quiz is due
with TTL Interfacing, Numarical Problems
MOSFET: Structure of MOSFET, N-Channel MOSFET, Threshold Voltage, Drift
Velocity & Mobility, States and Regions of Operation, Current Voltage
Relations derivation of ID, VT
BiCMOS: BiCMOS Logic. NAND Gate, NOR Gate, Inverter in BiCMOS Logic

14

Square Wave Generators, 555 Timers, Schmitt Trigger

15

Astable logic Circuits, Monostable logic circuits

Quiz is due

16

Digital To Analog convertersion methods

Deadline for
Assignment #
3 Submission

11
12

Final Examinations

Class Policies and Recommended Books

Marks Distribution:

Assignments + Class Quizzes + Project(s) + Presentation(s)25%

Midterm Examination

Final Examination

25%
50%

Assignments:
Assignments would be assigned at least one week before the due date and
must be submitted on or before due date. No late assignment will be
accepted. You have to be very careful while you are solving your assignment.
Please do not try copy from someone else in order to avoid any problem at
the end of the semester

Recommended Books:
Solid State Electronics Device by Ben G. Streetman , Sanjay Banerjee
Microelectronic Circuits by Adel S. Sedra & Kenneth C. Smith
Digital Integrated Circuits by Jan M. Rabaey, Anantha Chandrakasan &
Borivoje Nikolic
Digital Integrated Circuits by Thomas A. Demassa & Zack Ciccone

10/22/2015

The First Computer

The Babbage
Difference Engine
(1832)
25,000 parts
cost: 17,470

ENIAC - The first electronic computer (1946)

10/22/2015

The Transistor Revolution

First transistor
Bell Labs, 1947

The First Integrated Circuits

Bipolar logic
1960s

ECL 3-input Gate

Motorola 1966

10/22/2015

Intel 4004 Micro-Processor

1971
1000 transistors
1 MHz operation

Intel Pentium (IV) Microprocessor

10/22/2015

What Next?
Why is designing ICs different today than it
was before?
Will it change in future?

Moores Law
In 1965, Gordon Moore noted that the
number of transistors on a chip doubled
every 18 to 24 months.
He made a prediction that semiconductor
technology will double its effectiveness
every 18 months

1959
1960
1961
1962
1963
1964
1965
1966
1967
1968
1969
1970
1971
1972
1973
1974
1975

LOG2 OF THE NUMBER OF

COMPONENTS PER INTEGRATED FUNCTION

10/22/2015

Moores Law

16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0

Electronics, April 19, 1965.

Evolution in Complexity

10/22/2015

Transistor Counts
1 Billion
Transistors

K
1,000,000
100,000
10,000
1,000

i486

Pentium III
Pentium II
Pentium Pro
Pentium

i386
80286

100
8086

10

Source: Intel

1
1975

1980

1985 1990

1995 2000

2005 2010

Projected

Moores law in Microprocessors

1000

2X growth in 1.96 years!

Transistors (MT)

100

P4
PIII

10
486

1
386
286

0.1
0.01

PII
Pentium proc

8086
8080
8008
4004

8085

0.001
1970

1980

1990
Year

2000

2010

Transistors on Lead Microprocessors double every 2 years

10/22/2015

Die Size Growth

Die size (mm)

100

10
8080
8008
4004

8086
8085

1
1970

286

386

PII
486 Pentium proc

~7% growth per year

~2X growth in 10 years

1980

1990
Year

2000

2010

Die size grows by 14% to satisfy Moores Law

Frequency
10000

Doubles every
2 years

Frequency (Mhz)

1000
100

486
10

8085

1
0.1
1970

8086 286

PII
Pentium proc

386

8080
8008
4004
1980

1990
Year

2000

2010

Lead Microprocessors frequency doubles every 2 years

10/22/2015

Power Dissipation
100

Power (Watts)

PII
Pentium proc
10
8086 286
1
4004

8008

486
386

8085
8080

0.1
1971

1974

1978

1985

1992

2000

Year

Lead Microprocessors power continues to increase

Power will be a major problem

100000

18KW
5KW
1.5KW
500W

Power (Watts)

10000
1000
Pentium proc

100

286
486
8086 386
8085
8080
8008
1 4004

10

0.1
1971

1974

1978 1985 1992

Year

2000 2004

2008

Power delivery and dissipation will be prohibitive

10

10/22/2015

Power density
Power Density (W/cm2)

10000

Rocket
Nozzle

1000

Nuclear
Reactor

100

8086
10 4004
Hot Plate
PII
8008 8085
Pentium proc
386
286
486
8080
1
1970

1980

1990
Year

2000

2010

Power density too high to keep junctions at low temp

Not Only Microprocessors

Cell
Phone
Small
Signal RF

Digital Cellular Market

(Phones Shipped)

Power
RF

Power
Management

1996 1997 1998 1999 2000

Units

48M 86M 162M 260M 435M

Analog
Baseband
Digital Baseband
(DSP + MCU)

(data from Texas Instruments)

11

10/22/2015

(M)

Productivity Trends
10,000
10,000,000

100,000
100,000,000

Logic Tr./Chip
Tr./Staff Month.

10,000
10,000,000

100
100,000

Productivity
(K) Trans./Staff - Mo.

Complexity
Logic Transistor per Chip

1,000
1,000,000

1,000
1,000,000
58%/Yr. compounded
Complexity growth rate

10,00010

100
100,000

1,0001

10
10,000
x

0.1
100
x x

0.01
10

xx
x

1
1,000

21%/Yr. compound
Productivity growth rate

0.1
100
0.01
10

2009

2007

2005

2003

2001

1999

1997

1995

1993

1991

1989

1987

1985

1983

1981

0.001
1

Source: Sematech

Complexity outpaces design productivity

Why Scaling?
Technology shrinks by 0.7/generation
With every generation can integrate 2x more
functions per chip; chip cost does not increase
significantly
Cost of a function decreases by 2x
But
How to design chips with more and more functions?
Design engineering population does not double every two
years

Hence, a need for more efficient design methods

Exploit different levels of abstraction
24

12

10/22/2015

Integration Levels
Small-Scale Integration (SSI)

1960

Medium-Scale Integration (MSI)

1970

Large-Scale Integration (LSI)

1974

very large-scale integration

(VLSI)

1985

ultra-large-scale integration

Over in
Late1990/

Technology

10 m
3 m
1.5 m
1 m
800 nm (0.80 m)
600 nm (0.60 m)
350 nm (0.35 m)
250 nm (0.25 m)
180 nm (0.18 m)
130 nm (0.13 m)

90 nm
65 nm
45 nm
32 nm (Double Patterning)
22 nm (End of Planar Bulk
CMOS)
16 nm (Transition to
Nanoelectronics)
11 nm (Nanoelectronics)

Feature Size

13

10/22/2015

Device Feature Size

Feature size reductions
enabled by process
innovations.
Smaller features lead to
more transistors per
unit area and therefore
higher density.

Rapid Increase in Density of

Microelectronics

Memory chip density

versus time.

Microprocessor complexity
versus time.

14

10/22/2015

Processor

Transistor count

Date of
introduction

Manufacturer

Technology

Area

Intel 4004

2,300

1971

Intel

10 m

12 mm

Intel 8008

3,500

1972

Intel

10 m

14 mm

Motorola 6800

4,100

1974

Motorola

6 m

16 mm

Intel 8080

4,500

1974

Intel

6 m

20 mm

RCA 1802

5,000

1974

RCA

5 m

27 mm

Intel 8085

6,500

1976

Intel

3 m

20 mm

Zilog Z80

8,500

1976

Zilog

4 m

18 mm

Intel 8086

29,000

1978

Intel

3 m

33 mm

Intel 8088

29,000

1979

Intel

3 m

33 mm

Motorola 68000

68,000

1979

Motorola

3.5 m

44 mm

Intel 80286

134,000

1982

Intel

1.5 m

49 mm

Intel 80386

275,000

1985

Intel

1.5 m

104 mm

Intel 80486

1,180,235

1989

Intel

1 m

173 mm

Processor

Transistor count

Date of
introduction

Manufacturer

Technology

Area

R4000

1,350,000

1991

MIPS

1.0 m

213 mm

Pentium

3,100,000

1993

Intel

0.8 m

294 mm

ARM 7

578977[3]

1994

ARM

0.5 m

68.51 mm

Pentium Pro

5,500,000[4]

1995

Intel

0.5 m

307 mm

AMD K5

4,300,000

1996

AMD

0.5 m

251 mm

Pentium II

7,500,000

1997

Intel

0.35 m

195 mm

AMD K6

8,800,000

1997

AMD

0.35 m

162 mm

Pentium III

9,500,000

1999

Intel

0.25 m

128 mm

AMD K6-III

21,300,000

1999

AMD

0.25 m

118 mm

AMD K7

22,000,000

1999

AMD

0.25 m

184 mm

Pentium 4

42,000,000

2000

Intel

180 nm

217 mm

Atom

47,000,000

2008

Intel

45 nm

24 mm

AMD K8

105,900,000

2003

AMD

130 nm

193 mm

15

10/22/2015

Processor

Transistor count

Date of
introduction

Manufacturer

Technology

Area

Itanium 2 McKinley

220,000,000

2002

Intel

180 nm

421 mm

Cell

241,000,000

2006

Sony/IBM/Toshiba

90 nm

221 mm

Core 2 Duo

291,000,000

2006

Intel

65 nm

143 mm

Itanium 2 Madison 6M

410,000,000

2003

Intel

130 nm

374 mm

463,000,000[5]

2007

AMD

65 nm

283 mm

758,000,000[5]

2008

AMD

45 nm

258 mm

592,000,000

2004

Intel

130 nm

432 mm

Core i7 (Quad)

731,000,000

2008

Intel

45 nm

263 mm

POWER6

789,000,000

2007

IBM

65 nm

341 mm

Six-Core Opteron 2400

904,000,000

2009

AMD

45 nm

346 mm

16-Core SPARC T3

1,000,000,000[7]

2010

Sun/Oracle

40 nm

377 mm

1,160,000,000

2011

Intel

32 nm

216 mm

Technology

Area

AMD K10 quad-core 2M

L3
AMD K10 quad-core 6M
L3
Itanium 2 with 9MB
cache

Quad-Core + GPU Core

i7

Processor

Transistor count

Date of
introduction

Manufacturer

Six-Core Core i7 (Gulftown)

1,170,000,000

2010

Intel

32 nm

240 mm

8-core POWER7 32M L3

1,200,000,000

2010

IBM

45 nm

567 mm

8-Core AMD Bulldozer

1,200,000,000[8]

2012

AMD

32nm

315 mm

Quad-Core + GPU AMD Trinity

1,303,000,000

2012

AMD

32 nm

246 mm

Quad-Core + GPU Core i7

1,400,000,000

2012

Intel

22 nm

160 mm

Quad-Core Itanium Tukwila

2,000,000,000[11]

2010

Intel

65 nm

699 mm

8-core POWER7+ 80M L3

2,100,000,000

2012

IBM

32 nm

567 mm

2011

Intel

32 nm

434 mm

Six-Core Core i7/8-Core Xeon E5

2,270,000,000

[12]

(Sandy Bridge-E/EP)

16

10/22/2015

Processor

Transistor count

Date of
introduction

Manufacturer

Technology

Area

8-Core Xeon Nehalem-EX

2,300,000,000[13]

2010

Intel

45 nm

684 mm

10-Core Xeon Westmere-EX

2,600,000,000

2011

Intel

32 nm

512 mm

Six-core zEC12

2,750,000,000

2012

IBM

32 nm

597 mm

8-Core
Itanium Poulson

3,100,000,000

2012

Intel

32 nm

544 mm

62-Core Xeon Phi

5,000,000,000

2012

Intel

22 nm

Xbox One Main SoC

5,000,000,000

2013

Microsoft

FPGA

Transistor count

Date of introduction

363 mm

Manufacturer

Technology

Virtex

~70,000,000

1997

Xilinx

Virtex-E

~200,000,000

1998

Xilinx

Virtex-II

~350,000,000

2000

Xilinx

Virtex-II PRO

~430,000,000

2002

Xilinx

Virtex-4

1,000,000,000

2004

Xilinx

90 nm

Virtex-5

1,100,000,000[21]

2006

Xilinx

65 nm

Stratix IV

2,500,000,000[22]

2008

Altera

40 nm

Stratix V

3,800,000,000[23]

2011

Altera

28 nm

Virtex-7

6,800,000,000[24]

2011

Xilinx

28 nm

130 nm

17

10/22/2015

Design Abstraction Levels

SYSTEM

MODULE
+
GATE

CIRCUIT

DEVICE
G
D

S
n+

n+

Views / Abstractions / Hierarchies

Structural

Behavioral

device

Circuit

Physical

Logic
Architectural

D.Gajski, Silicon Compilation, Addison Wesley, 1988

18

10/22/2015

300mm wafer, 90nm

P4 2.4 Ghz, 1.5V, 131mm2

90nm transistor (Intel)

19

10/22/2015

20