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Persistence Market Research Released New Market Report According to a new market report
published by Persistence Market Research Global Market Study on Semiconductor
Assembly & Testing Services (SATS): To be Driven by Increasing Demand for HighEnd Packaging Solutions, the semiconductor assembly & testing services market is
estimated to be valued at US$ 29,585.9 Mn by the end of 2015 and is anticipated to expand
at a CAGR of 4.7% from 2015 to 2021, to account for US$ 39,050.7 Mn by 2021.
Semiconductor Assembly and Testing Services (SATS) market are witnessing increased
demand for outsourced SATS services. Presently, around half of the market is exploiting the
Outsourced Semiconductor Assembly and Test (OSAT) services, and the trend is expected to
continue in the long run. With increasing competition from the leading and regional players,
the market is witnessing consolidation. This helps market participants in utilizing resources
of other players to meet increasing technological demands.
Currently, the semiconductor assembly & testing services market across the world is mainly
driven by factors such as increasing demand for mobility and connectivity in the consumer
electronic products. An increasing demand for connected devices worldwide including
smartphones and tablets having connectivity and multimedia capabilities are fuelling the
demand for higher packaging technologies, setting up potential revenue opportunity for the
SATS market. Additional features offered by SATS providers over in-house testing and
packaging capabilities is also one of the primary reasons for the market growth. Additionally,
SATS providers facilitate a more efficient supply chain and in-turn reduces time-to-market for
a product, therefore SATS providers are becoming the primary choice of integrated design
manufacturers.
Increased use of safety systems in the automobile industry is also one of the factors
contributing to the growth of the SATS market. . However, factors such as the high capital
On the basis of services, the semiconductor assembly & testing services market has been
segmented into assembly & packaging services and testing services. The assembly &
packaging services segment is expected to account for 79.4% share of the global
Semiconductor assembly & testing services market by 2015 end and is anticipated to
increase at a CAGR of 4.9%, during the forecast period (20152021).
The Assembly and Packaging services segment is further classified on the basis of packaging
solutions (interconnecting technologies) which includes copper and gold wire bonding,
copper clip, flip chip, wafer level packaging, and TSV. Copper and gold wire bonding
accounted for the 55.5%share of the assembly and packaging services segment in 2014.
The wafer level packaging (interconnecting technology) segment in the global SATS market
is anticipated to expand at a CAGR of 9.2% during the forecast period.
On the basis of application, the semiconductor assembly & testing services market is
segmented into communications, computing & networking, consumer electronics, industrial
and automotive electronics. Among these, communication segment dominated the market in
2014 and is expected to account for 49.4% share of the global semiconductor assembly &
testing services market by 2015 end. This segment is expected to expand at CAGR of 5.9%
during the forecast period.
Increasing adoption of tablets and wearable devices globally, is expected to drive the market
growth of consumer electronics segment during the forecast period. Consumer electronics
segment is analyzed to increase at a CAGR of 6.6% during the forecast period.
The report provides detailed information about various trends driving each segment and
offers analysis and insights about the potential of the semiconductor assembly & testing
services market in specific regions. On the basis of region, the semiconductor assembly &
testing services market is segmented into six regions; among these, Taiwan is expected to
dominate the market representing 46.5% share by the end of 2015. The market in the region
is analyzed to represent largest market share by 2021 expanding at a CAGR of 5.8% during
the forecast.
Key players in global semiconductor assembly & testing services market include ASE Group,
Amkor Technologies Inc., STATS ChipPAC Ltd. (JCET), Silicon Precision Industries Co. Ltd.,
Powertech Technology Inc., CORWIL Technology corporation, Psi Technologies Inc. (IMI),
GlobalFoundries and Chipbond Technology Corporation.
Market History:
The global semiconductor assembly & testing services market is anticipated to expand at a
CAGR of 4.7% during the period 2015-2021 to reach US$ 39,050.7 Mn by 2021.
The global semiconductor assembly & testing services market was valued at US$ 28,177.9
Mn in 2014. Increasing adoption of consumer electronics products including tablet PCs,
wearable devices (smart watches, smart glasses, head mounted displays, fitness equipment
etc.), gaming consoles, audio/video devices along with the rising penetration of smartphones
in the communications segment is driving the overall SATS market growth. Additionally,
growing technological advancements in next-generation cars (automotive electronics)
equipped with enhancing car safety and management systems, are also driving the growth
of SATS market.
In 2014, the assembly & packaging services segment was valued at US$ 22,298.9 Mn and is
expected to account for US$ 23,494.8 Mn by the end of 2015. Advanced packaging solutions
such as wafer level packages and flip chip are driving the market growth of packaging
solutions (inter-connecting solutions) segment in the total SATS market.
In 2014, wafer level packaging segment was valued at US$ 3,508.9 Mn and is expected to
reach US$ 3,800.6 Mn by the end of 2015. Growing adoption of wearable devices which
mandates high performance with low power and thermal ratings, the demand for wafer-level
In 2014, consumer electronics application segment was valued at US$ 3,738.5 Mn and is
analyzed to value US$ 3,999.6 Mn by the end of 2015.
Key players in global semiconductor assembly & testing services market include ASE Group,
Amkor Technologies Inc., STATS ChipPAC Ltd. (JCET), Silicon Precision Industries Co. Ltd.,
Powertech Technology Inc., CORWIL Technology corporation, Psi Technologies Inc. (IMI),
Global Foundries and Chipbond Technology Corporation.
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