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MAX232, MAX232I
SLLS047M FEBRUARY 1989 REVISED NOVEMBER 2014
3 Description
Device Information(1)
ORDER NUMBER
MAX232x
BODY SIZE
SOIC (16)
9.90 mm 3.91 mm
SOIC (16)
10.30 mm 7.50 mm
PDIP (16)
19.30 mm 6.35 mm
SOP (16)
10.3 mm 5.30 mm
2 Applications
PACKAGE (PIN)
TIA/EIA-232-F
Battery-Powered Systems
Terminals
Modems
Computers
4 Simplified Schematic
5V
POWER
2
ROUT
TOUT
RS232
RIN
RS232
TX
TIN
RX
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
MAX232, MAX232I
SLLS047M FEBRUARY 1989 REVISED NOVEMBER 2014
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
9
Features ..................................................................
Applications ...........................................................
Description .............................................................
Simplified Schematic.............................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
1
2
3
4
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
4
4
4
4
4
5
5
5
6
9.1
9.2
9.3
9.4
Overview ...................................................................
Functional Block Diagram .........................................
Feature Description...................................................
Device Functional Modes..........................................
9
9
9
9
12
12
12
12
5 Revision History
Changes from Revision L (March 2004) to Revision M
Page
Added Handling Rating table, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section................................................................ 1
MAX232, MAX232I
www.ti.com
C1+
VS+
C1
C2+
C2
VS
T2OUT
R2IN
16
15
14
13
12
11
10
VCC
GND
T1OUT
R1IN
R1OUT
T1IN
T2IN
R2OUT
Pin Functions
PIN
NAME
NO.
C1+
VS+
C1-
TYPE
DESCRIPTION
C2+
C2-
VS-
T2OUT, T1OUT
7, 14
R2IN, R1IN
8, 13
R2OUT, R1OUT
9, 12
T2IN, T1IN
10, 11
GND
15
Ground
VCC
16
MAX232, MAX232I
SLLS047M FEBRUARY 1989 REVISED NOVEMBER 2014
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
VCC
VS+
VS
VI
VO
(1)
(2)
MAX
6
VCC 0.3
15
0.3
15
0.3
VCC + 0.3
T1IN, T2IN
R1IN, R2IN
Short-circuit duration
TJ
MIN
0.3
UNIT
30
T1OUT, T2OUT
VS 0.3
VS+ + 0.3
R1OUT, R2OUT
0.3
VCC + 0.3
T1OUT, T2OUT
Unlimited
150
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to network GND.
V(ESD)
(1)
(2)
MIN
MAX
UNIT
-65
150
2000
1000
Electrostatic discharge
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
NOM
MAX
4.5
5.5
UNIT
VCC
Supply voltage
VIH
VIL
0.8
R1IN,
R2IN
30
TA
MAX232
70
MAX232I
40
85
RJA
(1)
MAX232xD
MAX232xDW
MAX232xN
SOIC
SOIC wide
PDIP
MAX232xNS
SOP
16 PINS
16 PINS
16 PINS
16 PINS
73
57
67
64
UNIT
C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).
PARAMETER
ICC
(1)
(2)
4
Supply current
MIN
TYP (2)
MAX
10
UNIT
mA
MAX232, MAX232I
www.ti.com
PARAMETER
VOH
T1OUT, T2OUT
RL = 3 k to GND
VOL
T1OUT, T2OUT
RL = 3 k to GND
rO
Output resistance
T1OUT, T2OUT
VS+ = VS = 0, VO = 2 V
IOS (4)
T1OUT, T2OUT
VCC = 5.5 V, VO = 0 V
IIS
T1IN, T2IN
VI = 0
(1)
(2)
(3)
(4)
MAX
7
7
UNIT
V
300
10
mA
200
PARAMETER
MIN
TYP (2)
MAX
R1OUT, R2OUT
IOH = 1 mA
VOL
R1OUT, R2OUT
IOL = 3.2 mA
VIT+
R1IN, R2IN
VCC = 5 V, TA = 25C
VIT
VCC = 5 V, TA = 25C
0.8
1.2
Vhys
R1IN, R2IN
VCC = 5 V
0.2
0.5
rI
R1IN, R2IN
VCC = 5 V, TA = 25C
(1)
(2)
(3)
3.5
UNIT
VOH
1.7
0.4
2.4
V
V
PARAMETER
SR
RL = 3 k to 7 k, see Figure 4
SR(t)
see Figure 5
Data rate
tPLH)
tPHL)
(1)
MIN
TYP (1)
MAX
UNIT
30
V/s
V/s
120
kbit/s
500
ns
500
ns
MAX232, MAX232I
SLLS047M FEBRUARY 1989 REVISED NOVEMBER 2014
www.ti.com
10
9
8
7
6
5
4
3
2
1
0
1
2
3
4
5
6
7
8
9
10
11
12
Voltage (V)
Voltage (V)
VOL
VOH
1
Load resistance (k )
TIN
TOUT (to RIN)
ROUT
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
Time (s)
C001
12
11
10
9
8
7
6
5
4
3
2
1
0
1
2
3
4
5
6
7
8
C001
MAX232, MAX232I
www.ti.com
Pulse
Generator
(see Note A)
RL = 1.3 k
R1OUT
or
R2OUT
R1IN
or
R2IN
See Note C
CL = 50 pF
(see Note B)
TEST CIRCUIT
10 ns
10 ns
Input
10%
90%
50%
90%
50%
3V
10%
0V
500 ns
tPLH
tPHL
VOH
Output
1.5 V
1.5 V
VOL
WAVEFORMS
A.
The pulse generator has the following characteristics: ZO = 50 , duty cycle 50%.
B.
C.
Figure 3. Receiver Test Circuit and Waveforms for tPHL and tPLH Measurements
MAX232, MAX232I
SLLS047M FEBRUARY 1989 REVISED NOVEMBER 2014
www.ti.com
Pulse
Generator
(see Note A)
T1OUT or T2OUT
EIA-232 Output
CL = 10 pF
(see Note B)
RL
TEST CIRCUIT
10 ns
10 ns
90%
50%
Input
10%
3V
90%
50%
10%
0V
5 s
tPLH
tPHL
90%
Output
VOH
90%
10%
10%
VOL
tTLH
tTHL
0.8 (V
SR =
V )
0.8 (V
V
)
OH
OL
OL
OH
or
t
t
TLH
THL
WAVEFORMS
A.
The pulse generator has the following characteristics: ZO = 50 , duty cycle 50%.
B.
Figure 4. Driver Test Circuit and Waveforms for tPHL and tPLH Measurements (5-s Input)
Pulse
Generator
(see Note A)
EIA-232 Output
3 k
CL = 2.5 nF
TEST CIRCUIT
10 ns
10 ns
Input
90%
1.5 V
10%
90%
1.5 V
10%
20 s
tTLH
tTHL
Output
3V
3V
3 V
3 V
SR =
THL
6V
or t
VOH
VOL
TLH
WAVEFORMS
A.
The pulse generator has the following characteristics: ZO = 50 , duty cycle 50%.
Figure 5. Test Circuit and Waveforms for tTHL and tTLH Measurements (20-s Input)
MAX232, MAX232I
www.ti.com
9 Detailed Description
9.1 Overview
The MAX232 device is a dual driver/receiver that includes a capacitive voltage generator using four capacitors to
supply TIA/EIA-232-F voltage levels from a single 5-V supply. Each receiver converts TIA/EIA-232-F inputs to 5V TTL/CMOS levels. These receivers have a typical threshold of 1.3 V, a typical hysteresis of 0.5 V, and can
accept 30-V inputs. Each driver converts TTL/CMOS input levels into TIA/EIA-232-F levels. The driver, receiver,
and voltage-generator functions are available as cells in the Texas Instruments LinASIC library. Outputs are
protected against shorts to ground.
5V
POWER
2
ROUT
TOUT
RS232
RIN
RS232
TX
TIN
RX
(1)
INPUT
OUTPUT
TIN
TOUT
MAX232, MAX232I
SLLS047M FEBRUARY 1989 REVISED NOVEMBER 2014
www.ti.com
(1)
INPUTS
OUTPUT
RIN
ROUT
Open
16
1
C1
1 F 3
4
C2
1 F 5
To CMOS or TTL
C3
VCC
C1+
8.5 V
VS+
C1
VS
C2+
1 F
2
6
8.5 V
C4
+
C2
11
14
10
12
13
1 F
EIA-232 Output
EIA-232 Output
EIA-232 Input
EIA-232 Input
0V
15
GND
C3 can be connected to VCC or GND.
NOTES: A. Resistor values shown are nominal.
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be
connected as shown. In addition to the 1-F capacitors shown, the MAX202 can operate with 0.1-F capacitors.
10
MAX232, MAX232I
www.ti.com
10
9
8
7
6
5
4
3
2
1
0
1
2
3
4
5
6
7
8
9
10
11
12
Voltage (V)
Voltage (V)
VOL
VOH
1
Load resistance (k )
12
11
10
9
8
7
6
5
4
3
2
1
0
1
2
3
4
5
6
7
8
TIN
TOUT (to RIN)
ROUT
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
Time (s)
C001
C001
12 Layout
12.1 Layout Guidelines
Keep the external capacitor traces short. This is more important on C1 and C2 nodes that have the fastest rise
and fall times.
1 C1+
VCC 16
1 F
1 F
2 VS+
GND 15
3 C1-
T1OUT 14
4 C2+
R1IN 13
5 C2-
R1OUT 12
6 VS-
T1IN 11
7 T2OUT
T2IN 10
VCC
1 F
Ground
1 F
Ground
1 F
8 R2IN
R2OUT 9
11
MAX232, MAX232I
SLLS047M FEBRUARY 1989 REVISED NOVEMBER 2014
www.ti.com
PRODUCT FOLDER
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
MAX232
Click here
Click here
Click here
Click here
Click here
MAX232I
Click here
Click here
Click here
Click here
Click here
13.2 Trademarks
All trademarks are the property of their respective owners.
13.4 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms and definitions.
12
www.ti.com
10-Jun-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
MAX232D
ACTIVE
SOIC
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX232
MAX232DE4
ACTIVE
SOIC
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX232
MAX232DG4
ACTIVE
SOIC
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX232
MAX232DR
ACTIVE
SOIC
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
0 to 70
MAX232
MAX232DRE4
ACTIVE
SOIC
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX232
MAX232DRG4
ACTIVE
SOIC
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX232
MAX232DW
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX232
MAX232DWE4
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX232
MAX232DWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX232
MAX232DWR
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
0 to 70
MAX232
MAX232DWRE4
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX232
MAX232DWRG4
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX232
MAX232ID
ACTIVE
SOIC
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX232I
MAX232IDE4
ACTIVE
SOIC
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX232I
MAX232IDG4
ACTIVE
SOIC
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX232I
MAX232IDR
ACTIVE
SOIC
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX232I
MAX232IDRG4
ACTIVE
SOIC
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX232I
Addendum-Page 1
Samples
www.ti.com
10-Jun-2014
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
MAX232IDW
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX232I
MAX232IDWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX232I
MAX232IDWR
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 85
MAX232I
MAX232IDWRE4
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX232I
MAX232IDWRG4
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX232I
MAX232IN
ACTIVE
PDIP
16
25
Pb-Free
(RoHS)
CU NIPDAU
-40 to 85
MAX232IN
MAX232INE4
ACTIVE
PDIP
16
25
Pb-Free
(RoHS)
CU NIPDAU
-40 to 85
MAX232IN
MAX232N
ACTIVE
PDIP
16
25
Pb-Free
(RoHS)
CU NIPDAU
0 to 70
MAX232N
MAX232NE4
ACTIVE
PDIP
16
25
Pb-Free
(RoHS)
CU NIPDAU
0 to 70
MAX232N
MAX232NSR
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX232
(1)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 2
Samples
www.ti.com
10-Jun-2014
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
27-Feb-2015
Device
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
MAX232DR
SOIC
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
MAX232DR
SOIC
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
MAX232DRG4
SOIC
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
MAX232DRG4
SOIC
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
MAX232DWR
SOIC
DW
16
2000
330.0
16.4
10.75
10.7
2.7
12.0
16.0
Q1
MAX232DWRG4
SOIC
DW
16
2000
330.0
16.4
10.75
10.7
2.7
12.0
16.0
Q1
MAX232IDR
SOIC
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
MAX232IDWR
SOIC
DW
16
2000
330.0
16.4
10.75
10.7
2.7
12.0
16.0
Q1
MAX232IDWRG4
SOIC
DW
16
2000
330.0
16.4
10.75
10.7
2.7
12.0
16.0
Q1
Pack Materials-Page 1
27-Feb-2015
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
MAX232DR
SOIC
16
2500
333.2
345.9
28.6
MAX232DR
SOIC
16
2500
367.0
367.0
38.0
MAX232DRG4
SOIC
16
2500
333.2
345.9
28.6
MAX232DRG4
SOIC
16
2500
367.0
367.0
38.0
MAX232DWR
SOIC
DW
16
2000
367.0
367.0
38.0
MAX232DWRG4
SOIC
DW
16
2000
367.0
367.0
38.0
MAX232IDR
SOIC
16
2500
333.2
345.9
28.6
MAX232IDWR
SOIC
DW
16
2000
367.0
367.0
38.0
MAX232IDWRG4
SOIC
DW
16
2000
367.0
367.0
38.0
Pack Materials-Page 2
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