2005 Sep AdvancedPkg

Contents
Zoom In
Zoom Out
For navigation instructions please click here
Next Page
Search Issue
SEPTEMBER 2005
THE INTERNATIONAL MAGAZINE FOR ELECTRONIC PACKAGING APPLICATIONS
Eliminating
Underfill Voids
X-ray
Inspection
MEMS Update
Temperature
Sensors
2005 APA
Recognition
Section
Forward
ADVANCED
PACKAGING
to a friend!
www.apmag.com
Contents
0509AP_CV1 CV1 Zoom In
Zoom Out
For navigation instructions please click here
Search Issue
Next Page
8/26/05 12:11:18 PM
Advanced
Packaging Previous Page Contents Zoom In Zoom Out

u
u
Front Cover
Search Issue
Next Page EMaGS

F
Heavy Wire Bonder

Heavy Wire Bonder 66000 G5
Fine Wire Bonder
Gold Ball Bonder
Innovative Technology Defines The

Future of Heavy Wire Bonding Today
Uniting flexibility,
bond process control,
speed and accuracy
unsurpassed quality
assurance through
patented bond
process control,
data tracer and post
bond inspection
utmost flexiblility
with modular component handling
simplest changeover from heavy to
fine wire
latest technology
multi-frequency
digital US-generator
www.fkdelvotec.com
Germany
USA
+49 (89) 62 995-0

+1 (949) 595-2200
Singapore
Austria
+65 (6890) 6020

+43 (7722) 670 52-82 80
Advanced

u
u
0509AP_CV2 CV2
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:11:31
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
Its rough in the semiconductor jungle
Heraeus is your machete.
Circuit provided courtesy of Agere Systems Inc.
Two of the industry's top three SiP assemblers depend

on Heraeus for semiconductor assembly materials that
help keep their businesses on competitive ground.
Because they know our products can help them cut
through their most demanding challenges, including
cost, size, performance and lead-free implementation.
Heraeus can do the same for you. We have the technical
expertise to provide you with the right products and
support for your application. Like conductive adhesives,
solder pastes, tack fluxes and more many of them leadfree. All designed to perform exactly the way you need
them to, from superior quality to consistent performance lot after lot.
As a pioneer and leader in developing lead-free standards for the industry, we can help ease your transition
to lead-free. And we have the global infrastructure to
support your business worldwide. So whether its
lead-free implementation or a new product application,
Heraeus will work side by side with your team throughout the process.
Sharpen your competitive edge with Heraeus. To find
out more, call 610-825-6050 or visit us online at
www.4cmd.com
Circuit Materials Division

24 Union Hill Road, West Conshohocken, PA 19428
Tel: 610-825-6050 Fax: 610-825-7061
Visit us on the Web: www.4cmd.com
Advanced

u
u
0509AP_1 1
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:25:25
PM
F
Advanced
u
u
Front Cover
Search Issue
Next Page EMaGS

F
PUBLISHER Jay Regan

603-891-9126
jregan@pennwell.com
EDITOR-IN-CHIEF Gail B. Flower

603-891-9395
Fax: 603-891-9328
gailf@pennwell.com
ASSISTANT EDITOR Lee Mather

603-891-9176
Fax: 603-891-9328
leem@pennwell.com
SILICON VALLEY OFFICE Julia Goldstein

TECHNICAL EDITOR 408-376-3987
julia.goldstein@sbcglobal.net
EDITORIAL OFFICES Communications and

Optoelectronics Group
98 Spit Brook Road
Nashua, NH 03062-5737
ART DIRECTOR Kelli Paquette-Mylchreest

ILLUSTRATOR Chris Hipp
PRODUCTION MANAGER Sheila Ward
CIRCULATION MANAGER Michelle McKeon
603-891-9351
michello@pennwell.com
SENIOR VICE PRESIDENT David Janoff

COMMUNICATIONS AND
OPTOELECTRONICS
GROUP
DIRECTOR, ATD AUDIENCE Gloria S. Adams
DEVELOPMENT
ATD PRODUCTION Mari Rodriguez
DIRECTOR
GROUP ART DIRECTOR Meg Fuschetti
ATD BUYERS GUIDE Judy Simers
DIRECTOR
CORPORATE OFFICES 1421 South Sheridan Road,
Tulsa, OK 74112;
918-835-3161
CORPORATE OFFICERS
CHAIRMAN Frank T. Lauinger
PRESIDENT AND CEO Robert F. Biolchini
CHIEF FINANCIAL OFFICER Mark Wilmoth
AAAAAAAAAAAAAAAAAAAAAA
AAAAAAAAAAAAAAAAAAAAAAAAA
Advanced Packaging magazine is published

by PennWell Corporation. Reproduction of text
and illustrations is not allowed without express
written permission. Opinions expressed by authors are not
necessarily those of the publisher, and this publication can
accept no responsibility in connection with any liability which
might develop as a result of articles published.
2
ADVANCED PACKAGING
September 2005
Advanced Previous Page

Contents Zoom In Zoom Out
0509mae_rev_2 2
Packaging
u
u
www.apmag.com
Front Cover
Search Issue
aGS
Next Page 8/30/05
EM2:36:36
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
Some people just cant wait to see the new

MRSI-M5 assembly work cell.
Theres a reason people are getting excited. For over 20 years Newport has set
the industry standard for complex die bonding solutions. Today we have taken it
another step forward with the introduction of the next generation assembly work
cell, the new MRSI-M5. Flexible by design, the MRSI-M5 is the right choice for
accuracy, speed and reliability.
The MRSI-M5 system has a large work area and is the best solution for a variety
of die bonding interconnect technologies including eutectic, epoxy die attach and
various flip chip processes. And, with Newport you can rest assured that you are
working with an industry leader who delivers global support, process experience
and manufacturing expertise. To see what all the excitement is about, visit
www.newport.com/workcell18 or call 978.667.9449.
2005 Newport Corporation
Advanced

u
u
0509AP_3 3
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:25:38
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
The Carsem MLP Advantage
Carsems comprehensive selection of cost-effective

MLP solutions gives you the crucial advantage you
need for todays demanding applications.
Carsems MLP (Micro Leadframe Package) is ideal for the demanding applications requiring near
chip-size packages with superior thermal-electrical performance. Our high-density leadframe
design concepts, high throughput singulation methods, and innovative technologies allow our
MLP to meet the most stringent MSL-1, Pb-free and green requirements, while delivering the most
cost-effective solutions you could need. Our patented FCOL (Flip Chip on Lead) and COL (Chip
on Lead) options provide even greater utilization of package space and enhanced performance for
Malaysia/Ipoh
60-5-5262333
USA/Los Angeles
626-854-0939
Europe/UK
44-1793-853888
USA/Dallas
972-580-1706
USA/Silicon Valley
831-438-6861
USA/Boston
508-699-4720
your designs. Carsem also offers turnkey services including RF testing.
China/Suzhou
86-512-62588883
Call Carsem today for a cost-effective MLP solution that will give you the
www.carsem.com
competitive advantage you need.
Advanced

u
u
0509AP_4 4
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:25:46
PM
F

u
u
Front Cover
CONTENTS
S E P T E M B E R
2 0 0 5
FEATURES
Search Issue
Next Page EMaGS

F
Advanced
On The Cover
Voids or air gaps in underfill are a
common problem across underfill
applications, from the smallest die on
flex to the largest BGA. The
consequences of having voids in
underfilled parts depend on the
package design and use model.
Courtesy of Asymtek.
14 Troubleshooting Underfill Void Elimination

Methods for Gaining Reliability in Underfill Applications
BY ALAN LEWIS
18 IEEE 1451.4
Facilitating Temperature Sensor Success
BY CHRIS SEYMOUR
20 MEMS Packaging Update

Providing a Foundation for Future Packaging Advancements
BY KEN GILLEO
THE
back-end
PROCESS
24 Building on a Basic X-ray Inspection Platform

Configuring an X-ray Inspection System
BY UDO E. FRANK
18
DEPARTMENTS
7 Editorial
A close-up of
plug-and-play
technology
that links the
application to
the calibration
lab.
BY GAIL FLOWER
8 In the News
29 Advanced Packaging Awards
Special Section
22
51 IMAPS 2005 Product Preview
A top
view of a
thermoplastic
cavity
package.
55 Advertiser Index
56 Editorial Board
BY JOSEPH FJELSTAD
24
A diagram of
a typical
X-ray system
for industrial
inspection.
ONLINE
www.apmag.com
AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA
INDUSTRY NEWS UPDATES . NEW PRODUCT HIGHLIGHTS . EDITORIAL COMMENTARY . SEARCHABLE ARTICLE ARCHIVES
INDUSTRY ASSOCIATION LINKS . CALENDAR OF EVENTS . TRADE SHOW NEWS . LEAD-FREE WEBINARS
Advanced

u
u
0509AP_5 5
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM4:29:54
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
Flight delayed.
Early delivery.
Hello Daddy.
NuSil Technology.
Precious moments. Shared when youre not there.

All because smaller, more advanced components can
rely on packaging thats durable in even the most
demanding circuitry. Thats where youll find NuSil.
Our customizable, low-outgassing packaging
materials are helping opto-electronic systems stay
contaminant-free under stressful, heated conditions.
While your needs might be very different, from
large batches to small, you can count on NuSil
to deliver precise, custom formulations and the
most complete line of encapsulants, under-fills
and die-attach adhesives available. All backed by
more than 25 years of packaging materials expertise.
Whats your challenge?

www.nusil.com
Europe +33 (0)4 92 96 93 31
US 805/684-8780
What? When? Where? If its NuSil, its no problem.

2005 NuSil Corporation. All rights reserved. AP0205-E
Advanced

u
u
0509AP_6 6
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:25:14
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
Editorial
G
A Breath of Fresh Air
omeone once said that

to do the same thing
over and over while
expecting a different
result is the definition of insanity. I thought of this while attending SEMICON West on July 12
14 in San Francisco. During each
interview with company leaders,
each review of new products, and
each technical session, I looked
for what was innovative and a
source for new ideas. Original
thinkers are keeping the backend ahead of the recovery curve
in the electronics marketplace,
and I was on a mission to talk to
a few creative leaders.
Tien Wu, Ph.D., Advanced
Semiconductor Engineering,
Inc.s (ASE) president, Americas/
Europe, presented a fresh perspective on mostly everything involving advanced packages. His background a BSCE degree from
Taiwan University and a MS and
Ph.D. in mechanical engineering
from the University of Pennsylvania fits his career choices. Prior
to joining ASE, Wu held several
management positions at IBM,
including R&D, process development, manufacturing, application
and ASIC design, marketing, and
sales in the U.S., Europe, and the
Asia-Pacific region.
How was ASEs growth outstanding this year? SEMIs midyear capital equipment consensus
forecast for the semiconductor
industry showed a 12% decline
from 2004 figures, ending at a
predicted $32.6 billion in sales
for 2005. SEMI members anticipated cautious spending this
year, as the expanded capacity in
2004 was absorbed. Respondents
to SEMIs survey said that the
market would grow at a singledigit rate in 2006 and reach $44.3
billion in 2008. ASE is gaining
market share among SATS providers, and their growth shows
double digits this year, outpacing competitors.
Wu sees a tightening of capacity in back-end processing, and
expects 2006 to be especially
fruitful for this segment of the
market. Back-end is leading
the industry, and ASE provides
back-end services. But theres
more to it than being in the right
market segment. There are lots
of reasons for ASEs success, according to Wu, including:
Flexibility of package assembly services, including bumping, bonding, testing, supplying
materials, and providing turnkey or stand-alone assistance.
Right investments for future
growth.
Willingness to meet present
demands or perceive future
customer demands.
If a customer wants completely lead-free, ASE provides leadfree packages. Cost control is
one of the biggest problems with
lead-free, according to Wu. The
cheapest material that works well
is what a customer will use. However, at present, there are no reliable standards of material choices
and no recipe. Each bill of materials is different for each OEM.
Eventually, lead-free will evolve
in the industry, but it will take a
few standards and verification of
materials used.
We asked Wu where he saw
the boundary between the frontand back-end. He said that it was
much more determined by business than by technology. Money, not processes, determines the
difference between the front- and
back-end, he added. That will be
another topic for a future article
in Advanced Packaging.
Editor-in-Chief
EDITORIAL ADVISORY BOARD

Daniel Baldwin, Ph.D.
Engent Corp.
Nasser Grayeli, Ph.D.

Intel Corp.
Stephen Kay
Ultratech Inc.
Rao R. Tummala, Ph.D.

Georgia Institute of Technology
Jeffrey C. Demmin
Tessera Technologies
Bruce Hueners
Palomar Technologies
George Riley, Ph.D.

FlipChips Dot Com
Jim Walker
Gartner-Dataquest
Joseph Fjelstad
SiliconPipe Inc.
R. Wayne Johnson, Ph.D.

Auburn University
Michael Steidl
Amkor Technology Inc.
www.apmag.com
Advanced

u
u
0509AP_7 7
September 2005
ADVANCED PACKAGING
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:25:53
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
IN THE
NEWS
Intel to Build 300-mm Wafer Factory

in Arizona
SANTA CLARA, CALIF. Intel Corp. plans
to build a new 300-mm wafer fabrication facility at its Chandler, Ariz. site,
and the $3 billion projects construction
is set to begin immediately. Designated
Fab 32, the new factory will begin microprocessor production in late 2007 on
45-nm process technology. This investment positions our manufacturing network for future growth to support our
platform initiatives, and will give us additional supply flexibility across a range
of products, states Paul Otellini, Intels
CEO. Once completed, Fab 32 will become Intels sixth 300-mm wafer facility,
and the structure will be about 1 million
sq. ft. 184,000 sq. ft. of which will be
cleanroom space.
300-mm wafer manufacturing increases lower-cost semiconductor production
ability when compared to 200-mm wafers. Total silicon surface area of a 300mm wafer is 225%, or more than twice
that of a 200-mm wafer, and the number
of printed die increases to 240%. Larger wafers lower production cost per chip
while eliminating overall use of resources
300-mm wafer manufacturing will use
40% less energy and water per chip than

a 200-mm wafer factory.
Intel also plans to invest $105 million
to convert an existing, inactive wafer fab
in New Mexico to a component temporary test facility. The project will provide
additional test capacity to the companys
factory network for the next 2 years, resulting in an additional 300 jobs at the
New Mexico site during that time. AP
SEMI Appoints New Board Chair,

Board Member
SAN FRANCISCO, CALIF. SEMI has ap-
pointed Ed Segal, senior advisor to Metron Technology, as chairman of SEMIs

International Board of Directors. Segal
succeeds Tetsuro (Terry) Higashi, chairman and CEO of Tokyo Electron Ltd.,
who served as chairman for the past
year. Also appointed as the Boards newest member is Michael Splinter, president
and CEO of Applied Materials. Archie
Hwang, chairman and CEO of Hermes
Epitek, succeeds Segal as vice chairman
of the board.
8
ADVANCED PACKAGING
Segal served as CEO of Metron from

July 1995 until its acquisition by Applied
Materials in December 2004. Prior to joining Metron, he served as president and
CEO of Transpacific Technology Corp., a
company he founded in 1982, which later
merged with Metron. SEMI is a unique
global trade organization serving the
semiconductor equipment and materials industry. In a period when the needs
of members are shifting, I am pleased to
have the opportunity to serve as chairman
of the organization, says Segal.
AP
0509AP_8 8
SHANGHAI, CHINA PennWell and

China Electronics Appliance Corporation (CEAC) will sponsor the 2005
SMT China International Conference on Emerging Technologies and
Lead-free Challenges, November 2122, 2005. This 3rd annual conference
will take place at the Shanghai International Convention Center, Shanghai, China, in conjunction with the
CEACs 66th China Electronic Fair
(CEF). SMT and SMT China magazines, sister publications to Advanced
Packaging, announce a call for papers
for this conference on topics such as
high-density, fine-pitch placement;
equipment modular design; process
optimization programming; 0201 and
01005 components; chip scale, BGA,
flip chip, and 3-D interconnection;
nanotechnology; and MEMS; as well
as several other SMT, emerging technology, and modern assembly topics.
Papers from environmental managers and technical experts are sought
on relevant subjects. For a complete
list of topics, and for the submission form, please visit www.smtmag.
com. Abstracts should be 300 words
AAAA
in length and include an attached abstract submission form and a brief
biography. The deadline for abstract
submission is September 25, 2005.
Presenters will be allotted 40-minute time slots for their presentation
and discussion. Simultaneous Mandarin/English interpretation will
be provided. Some papers may be
grouped together in a forum or panel discussion. Speakers will receive
discounted admission to the conference, including a copy of proceedings, and any refreshments and
luncheon. For more information on
the event, please e-mail Gail Flower
at gailf@pennwell.com; or Charlie
Zeng at charliesmt@sina.com. AP
September 2005
Advanced

u
u
SMT China International

Conference Call for Papers
www.apmag.com
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:28:44
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
Lead-Free Webinar Series
ASSEMBLY & MANUFACTURING

Wednesday, October 11TH, 12:00 Noon (Central)
Participate in the discussion.

Talk to the experts.
Register today!
eg
www.apmag.com/webcasts
AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
IN THE
NEWS
News from SEMICON West
BY JULIA GOLDSTEIN
SAN FRANCISCO, CALIF. Many compa-
nies were eager to share their technology and business news with the editors
at Advanced Packaging. Here is some of
what we saw:
Test sockets. Kulicke & Soffa (K&S)
introduced a new test socket technology last year that replaces traditional
spring-loaded pins with a photolithography-based process. Flexible metal leads
are used as the contacts, providing low
contact force to minimize pad or bump
damage. Oded Lendner, senior VP of
AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA
Package Test, explained that K&S now

has a product based on this technology,
called Quatrix, which is being tested by
customers and is expected to go into production at the end of the year. Contactor
life has been tested up to 2.5 million cycles, and will be specified at one million
cycles for production. Standard metallization is Au over Ni, with a Pd-based
alloy as an option for probing lead-free
solder bumps. In an effort to improve
time-to-market for their standard products, K&S introduced web-based socket
selection software that enables customers to input specifications for BGA test
sockets and receive a detailed footprint
diagram and quote within 24 hours. Gold
Technologies has a new product for testing lead-free packages that is based on
their spring-loaded Au-plated probes,
but includes a proprietary coating on
the pins, as well as higher spring force.
They have also introduced a socket lid
design that can accommodate a range of
package heights.
Wafer Dicing. Laser dicing technologies are coming to the forefront. One
new player in the semiconductor space
will be New Wave Research. They introduced a compact laser scribing system for 2- and 3-in. sapphire wafers six
months ago, which is now used for highvolume production by customers in the
LED market. A new system for silicon
wafer dicing that can accommodate up
to 12-in. wafers is in development and
expected to be released in a little over a
year. Synova was showcasing their water jet-based laser system. Guiding the
laser beam down a 25- to 50-m-wide
water jet allows a much larger working
distance than conventional laser dicing
methods, and the water automatically
cools the area being cut, eliminating the
heat-affected zone. CEO Bernold Richerzhagen noted that customers are using
the system to cut Si, GaAs, and SiC wafers, as well as to remove edge damage
from thinned wafers after backgrinding.
Synovas next focus will be on package
dicing, where the variety of materials to
continued on page 13
10
ADVANCED PACKAGING
September 2005
Advanced

u
u
0509AP_10 10
www.apmag.com
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:29:04
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
#HECKOUT7HAT5LTRATECH#AN$O
&OR9OUR!DVANCED0ACKAGING0ROCESS
/NLY5LTRATECHDELIVERSTHEBESTPRICE TO PERFORMANCERATIOINTHEINDUSTRY!.$x
%NABLESCOST EFFECTIVEMIGRATIONTOmIPCHIPTECHNOLOGY
Q
)NCREASESYIELDPRODUCTIVITY
Q
2EDUCESYOURRISKCOSTOFOWNERSHIP
Q
%XTENDSTOTHENMNODE
Q
/WNSMORETHANOFTHEMARKET
Q
,EADSINGOLDSOLDER7,#30ANDPOST PASSIVATIONLITHOGRAPHY
Q
"UMPEDOVERMILLIONWAFERSLASTYEAR
Q
*OINTHEINDUSTRYLEADERSTHAT
HAVEALREADYDISCOVEREDTHE
5LTRATECHADVANTAGE7ITHLEADING
EDGETECHNOLOGYANDTHENEW
BREAKTHROUGH5NITY!00LATFORM
ITSTHEMOSTPRODUCTIVEANDCOST
EFFECTIVESOLUTIONFORADVANCED
PACKAGING4OSTEPUP9/52
ADVANCEDPACKAGINGPROCESS
VISITUSATWWWULTRATECHCOMAP
AAAAAAAAAAAAAAAAAAAAAAA
Ultratech
Advanced

u
u
0509AP_11 11
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:29:12
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
Theres no alternative
!
online
g
n
i
r
e
t
regis
cket
ime by nica.com/ti
o
Save t
r
roduct
www.p
The worlds leading trade show for electronics production

16th International Trade Fair, New Munich Trade Fair Centre
PCB manufacturing
Components manufacturing
MicroNanoWorld
Component mount technology
Test and measurement

Production logistics
Electronic manufacturing services
Your contact in the US:

Munich International Trade Fairs
German American Chamber of Commerce
12 East 49th Street, 24th Floor
New York, NY 10017
Tel. 212-974-1880
info@munich-tradefairs.com
www.productronica.com
Advanced

u
u
www.global-electronics.net
Front Cover
Search Issue
Next Page EMaGS

F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
IN THE
NEWS
continued from page 10
be cut poses many challenges.

Materials. Honeywell discussed their
wafer-thinning materials, announced in
April as the first new product line from
their Chandler, Ariz. manufacturing facility. By using a bulk etch, a stress relief
etch, and a texture etch to enhance adhesion, they are able to completely replace backgrinding and the wafer damage that goes along with it.
Polysciences, Inc. has been manufacturing encapsulants and adhesives for
OEM customers for decades, but this is
the first year they exhibited at SEMICON. One of their products is an encapsulant that is dispensed in a fine
line over wire bonds to lock the wires
in place. It effectively halves the length
of the long wires used in stacked packages. The encapsulant flows down to underlying wires, but does not touch the
substrate. Standard overmolding materials and processes can then be used
with minimal risk of wire sweep.
China or Mexico? Manufacturing
in China has been a hot topic in recent years, with much of the emphasis
on reducing manufacturing costs. Keynote speaker Tien Wu, President of ASE
Americas & Europe, gave an interesting
viewpoint. He said, Why you want to
go to China [is] to rule the world, not
to save 20%, but to be well-positioned to
sell products to the Chinese. He also noted that the emergence of China could be
considered as a black hole draining resources from the U.S. or as a new growth
engine driving the semiconductor industry. Tiens advice to companies considering expanding into China is not to go
ahead if their only reason is to trim labor
costs. Labor costs are rising in China, as
Scott Kulicke noted during K&Ss Press
Luncheon. High employee turnover, as
much as 25%, is a problem, and some
technical and managerial expertise is not
available in China. Hiring workers from
Taiwan and Singapore to fill the gaps increases costs. Still, K&S continues to shift
more of its manufacturing to China, and
Kulicke said that 90% of its wire bonder
sales are to Asian customers.
Ron Jones, co-founder of Silicon Border, is looking to greatly expand man-
ufacturing in Mexico and recently

announced groundbreaking on a billiondollar industrial and educational complex in Mexicali, Mexico, just south of
the U.S. border. Silicon Border has hired
two engineering firms, one American
and one Mexican, to design and build
the infrastructure and provide support
to tenants building manufacturing facilities. Jones is in negotiations with po-
Film-Like Quality
for a Digital World
Once again, a FEINFOCUS product leads the industry

with state-of-the-art X-ray inspection technology.
First, it was microfocus, then nanofocus, then AIM
and TXI technologies for better viewing.
Now FEINFOCUS systems offer
the clearest, sharpest digital
images available with new
HDX-ray imaging technology.
Precise, full tonality for better
quality analysis, with more than
65,000 grey scales and freely
selectable frame rates.
Contact us today for a free demonstration!
www.apmag.com
Advanced

u
u
0509AP_13 13
tential tenants IDMs from the U.S.,

Europe, and Asia and expects to sign
letters of intent by this fall. The long-term
goal is to have manufacturing facilities
covering all steps of semiconductor fabrication and assembly, providing a complete supply chain in North America. If
the first tenants are successful, it is likely
more will come and make Silicon Border
AP
a viable alternative to China.
www.comet.ch
September 2005
13
ADVANCED PACKAGING
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:29:24
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
C O V E R
S T O R Y
TROUBLESHOOTING
UNDERFILL
V O I D E L I M I N AT I O N
METHODS FOR GAINING RELIABILITY IN UNDERFILL APPLICATIONS

BY ALAN LEWIS
oids or air gaps in underfill are a common problem

across underfill applications, from the smallest die on
flex to the largest BGA. The consequences of having
voids in underfilled parts depend on the package design
and use model. Voids typically result in a loss of reliability. This
article explores strategies for troubleshooting void problems.
Detecting Voids
If you have determined there is a voiding problem, you probably already have a method of detecting the voids; however,
different methods can be useful for troubleshooting. Three of
the most common methods for detecting voids are the use of a
glass die substrate, ultrasonic imaging, and destructive testing
of a cross section or breaking the die off the part.
Using a glass die or substrate can be helpful. This method
provides instant feedback during testing and can be used to
help understand flow patterns to optimize underfill speed. Using underfill materials of different colors can also help visualize the flow. The disadvantage of this method is that flow and
voiding behavior may be slightly different for glass parts than
actual production parts.
14
ADVANCED PACKAGING
Ultrasonic acoustic imaging is a powerful tool. It allows the

user to detect voids in the underfill material on the actual production part before or after cure. The size of the void to be detected can be limited depending on the package and equipment
used, so there is a need to check with the equipment makers to
understand what size void can be detected. These tools are also
useful in reliability testing to detect delaminating and interconnect failures. Figure 1 shows an image of a void in an underfilled
package taken with an acoustic microscope.
Destructive testing uses a cross-section saw or breaks the die
or package away from the underfill. These methods can be useful to better understand the three-dimensional shape and position of the void. The primary disadvantage of this method is
that it cannot be used on uncured parts.
Causes of Voids
There are several potential root causes of voids. Describing them

and their root causes helps devise tests to troubleshoot them.
Some causes include:
Flow pattern voids. There are several sub-categories here, but all
of these voids occur during the time the material is flowing un-
September 2005
Advanced

u
u
0509AP_14 14
www.apmag.com
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:29:32
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
C O V E R
der the die or package. The leading edge
of the wave front traps a pocket of air.
Moisture voids. This type of void occurs
during curing when moisture from the
substrate outgases. This commonly occurs in organic substrates.
Voids caused by bubbles in the fluid. This
is rare in fluids that materials suppliers
packaged, as most suppliers are careful about packaging materials air-free.
However, mishandling the fluid or repackaging after receipt from the suppler
can introduce bubbles. In some cases,
suppliers provide samples or experimental fluids that may not be properly
de-gassed. If not configured properly,
some automated dispensing equipment
can also induce bubbles in the fluid path
during dispense.
Contamination voids. Contamination of
excess flux or other sources of contamination can occur in a variety of ways.
Void Characteristics
Void characteristics can help match them

up with their root causes. These include:
Shape Are the voids round or some
other shape?
Size Voids are usually described as the
area they cover in the plane of the die.
Frequency Do you get about one void
per 10 parts, or 10 voids per part? Do
voids occur during specific times, all the
time, or randomly?
Location Do the voids appear in one
place of the die or randomly? Do they
appear attached to interconnect bumps?
What is the relationship of the void to
the dispense pattern?
S T O R Y
Flow-pattern Voids
Two or more flow fronts meeting to trap

a pocket of air cause flow-pattern voids.
One cause of this can be the dispense
pattern. Dispensing on multiple sides of
a BGA or die can improve the speed of
the flow, but increases the probability of
trapping a void. Experimentation with
various dispense patterns or parts with
a quartz die or transparent substrate is
the most direct method of understanding how the voids are formed and how to
eliminate them. The use of underfill materials with different die colors for various dispense passes (Figure 2) can be a
good tool to visualize flow.
Temperature can affect the flow front
of the material. Temperature variations
on the part can also affect material crosslinking during flow, speed of flow, and
flow speed. Therefore, it is prudent to
consider this variable in testing.
Often, multiple dispense passes are
used to reduce fillet size, but can also increase the probability of trapping voids if
timing between the passes is not carefully
planned and controlled. The use of jetting
Figure 1. Image taken with acoustic

tomograph shows void in underfilled package.
Photo courtesy of Hitachi Kenki FineTech.
ate a void. If the voids are present with

the same characteristics before and after cure, it is a good indication that some
flow pattern during the underfill process
caused the void. If the number of voids
changes after cure, there could be more
than one root cause. In some cases, contamination can cause two different types
of voids; they can create an obstruction
during flow, then outgas during cure.
Cool Off. Precisely.

High thermal conductivity multilayer aluminum nitride packages from AdTech
Ceramics are manufactured to achieve position tolerances better than +/- 0.2%,
hermetic vias and flatness less than 0.001"/". These features allow for thin film of the
external surfaces with increased density for high performance microwave applications.
Metal components may also be added as required.
The AdTech process has provided high quality, 100% dense AlN ceramic with
up to 40 layers in complexity for over 15 years. This, along with 30+ years of
HTCC production, makes AdTech Ceramics your prime source for custom
ceramic packages.
Test Strategies
The first step is to determine if the voids

occur before or after curing. This can be
helpful in eliminating some root causes. If
the voids are not present after dispensing,
but are present after curing, flow pattern
voids, or voids caused by bubbles in the
fluid, can be eliminated as a root cause.
At this point, it would be good to look
for moisture problems, contamination
problems, some source of outgassing during cure, or problems with cure profiles.
Most underfill materials are designed to
shrink during cure to create compressive
stress on the interconnect bumps to improve reliability. This shrinking can give
any outgassing source the ability to cre-
.002" top surface lines

and spaces
.001"/" flatness
+/- . 2% via position tolerance

Up to 40 layers
Straight through hermetic vias
AdTech Ceramics
ISO 9001:2000 Certified
Meeting your advanced ceramic needs with experience, communication and technology.
www.apmag.com
Advanced

u
u
0509AP_15 15
Advanced Technical Ceramics Company

511 Manufacturers Rd. Chattanooga, TN 37405
Tel (423) 755-5400 Fax (423) 755-5438
Internet: www.AdTechCeramics.com
Email: sales@AdTechCeramics.com
September 2005
15
ADVANCED PACKAGING
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:29:47
PM
F
Advanced

u
u
C O V E R
Front Cover
Search Issue
Next Page EMaGS

F
S T O R Y
technology, instead of needle dispensing,

to control fillet size can help reduce the
number of passes.1 Figure 3 shows jet dispensing of underfill.
Material flowing to other board features (passive components or vias), leaving the underfill material short, can also
cause flow-pattern voids. The use of jetting technology can help control the
placement of the underfill fluid.
Moisture Voids
Moisture in the substrate can outgas during cure, creating a void during the cure
process. These voids are often random in
placement and can have finger- or snakelike shapes. They usually are seen in packages using organic substrates.
To test if voids are caused by mois-
Figure 2. Use of glass and two colors of underfill can help visualize flow and formation of
flow-pattern voids.
ture, one can pre-bake the parts for several hours at temperatures above 100C,
then dispense immediately on the parts.
Once it has been established that moisture
is the root cause, further testing to establish optimal pre-bake times, temperatures,
and storage protocols can be designed. A
good metric for water content is to track
weight gain of a part with a precision analytic balance.
Note that some flux contamination
issues can be remedied with a pre-bake
procedure and act like moisture-induced
problems. It is easy to test for the difference. Moisture-induced problems will recur if the part is exposed to humidity; flux
contamination problems will not.
Contamination issues caused by excess
flux often create irregular or random flow
variations, particularly at the interconnect bumps. If the voids that are occurring during flow show this characteristic,
it would be prudent to investigate cleaning or sources of contamination. In some
cases, flux contamination can show up after cure in a series of small bubbles on the
side of the die opposite the dispense side.
Figure 3. Jet dispensing the underfill, rather than needle dispensing, can avoid some
causes of voiding under the die.
Apparently, fluid flow carries the flux to

the far side of the die.
Material Bubble Voids
As mentioned earlier, most material suppliers are very careful about packaging
underfill material with air bubbles. Improper handling, repackaging, or dispensing technology can induce these issues. If
air bubbles in the material are suspected,
there is a straightforward way to inspect
for this. Dispense the material from the
syringe through a fine needle and draw
a fine line in a long pattern, then inspect
for gaps in the dispensed line. If bubbles
in the material have been confirmed, contact your material supplier about proper
handling and storage of the fluid.
If no bubbles are found, this test can be
repeated with the valve, pump, or jet attached to the syringe. If voids occur during this test, and no voids were present
when dispensing directly from the syringe, then the equipment induced the
bubbles. In this case, contact your equipment supplier about proper setup and
equipment use.
Conclusion
Underfill voids can be a vexing production problem. Understanding the characteristics of various root causes, and how to
test for them, can help engineers resolve
the issues.
AP
References
1. Babiarz, Alec J., Paradigm Shift in Applying Underfill, Pan Pacific Microelectronics Symposium,
SMTA, 2005.
ALAN LEWIS, director of application engineering,
may be contacted at Asymtek, 2762 Loker Ave.
AAAAAAAAAAAAAAAAAAA
16
ADVANCED PACKAGING
0509AP_16 16
alewis@asymtek.com.
September 2005
Advanced

u
u
West, Carlsbad, CA 92010; 760/930-3379; e-mail:
www.apmag.com
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:29:55
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA
Advanced

u
u
0509AP_17 17
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:30:02
PM
F
Advanced
S TA N D A R D S

u
u
Front Cover
Search Issue
Next Page EMaGS

F
IEEE 1451.4
FACILITATING TEMPERATURE SENSOR SUCCESS
BY CHRIS SEYMOUR
emperature sensors are usually

consigned to supporting roles in
semiconductor manufacturing
and packaging. But, as in movies, how supporting roles perform can be
the difference between success and failure. When problems with temperature
accuracy, repeatability, or stability arise,
the spotlight turns and remains fixed on
temperature components.
In recent years, continuous and rapid
advancements in the semiconductor industry have thrust temperature sensors
into the spotlight. Traditional sensors
have struggled to keep pace, and often
have been the weakest link in new or advanced processes. For example, many of
todays applications, such as wafer and
integrated circuit (IC) test and bonding
applications, require an extremely tight
temperature tolerance, and therefore,
an extremely accurate sensor. During
the past decade, the only way to make
a sensor more accurate was to rely on
tighter material property controls. Over
the years, this has resulted in the use of
purer and more homogenous elemental
metals, which are often more costly and
less readily available. This approach has
only taken the industry so far. Process
drift, unachievable levels of accuracy,
and increasing costs drove the need
to abandon this approach and search
for more effective ways to improve sensor accuracy.
Two recent developments have
emerged and converged to overcome
the limitations of traditional sensors,
and perhaps more importantly, to bring
additional options and benefits to pro-
18
ADVANCED PACKAGING
cesses. These developments include the

use of smart-sensing technology and
the development of the IEEE 1451.4
smart-sensing technology architecture
standards. Today, many engineers involved in thermal processes are familiar
with both developments, but have only
Figure 1. The plug-and-play technology

provides linking of the application to the
calibration lab.
caught a glimpse of their potential.

Smart sensors achieve high-level accuracy not through the use of purer materials, but by putting their known charac-
September 2005
Advanced

u
u
0509AP_18 18
teristics to work. Specifically, four error

values, known from sensor calibration,
are transferred into a compatible temperature controller during installation. The
controller takes these four offset points,
connects them with three straight-line
segments, and then performs a high-order curve fit to correct known errors.
This process improves the sensors accuracy because it knows the error limitations at specific temperatures and replaces previously assumed tolerance windows
with exact information. The result is less
process variation, better efficiency, and
improved yield.
The other development, the IEEE
1451.4 standards, is also capturing the
attention of the industry. The standards
define the parameters for plug-and-play
analog sensors, their interface to existing instrumentation, and the use of
embedded transducer electronic data
sheets (TEDS) to convey a sensors error values automatically.
IEEE 1451.4 standards contribute to
smart sensing as Fords assembly line
eased automotive production. The standards not only provide a universal format for smart-sensing information and
the hardware it uses, they also propel the
quick adoption of smart sensing by eliminating adaptability concerns making
the technology mainstream.
Still, users and potential users of smart
sensors see only half of the technologys
potential. IEEE 1451.4-compliant instrumentation offers previously unobtainable levels of accuracy. But because
the sensors no longer rely on the purity
or composition of materials to achieve
www.apmag.com
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:32:07
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
S TA N D A R D S
6ODFSUBJOUZ $
QPTJUJWFPOMZTIPXO
accuracy, the industry is free

and failure prediction. Sensors

to use sensors constructed
change and degrade in a repeat5ZQF,TQFDJBMMJNJUT
from virtually any alloy. That
able and predictable way. There
freedom means alloys can
fore, it is simple to enable sensors
be selected to achieve other
to communicate their status and

benefits, such as stability, rohealth, via instrumentation, to
bustness, homogeneity, or low
operators and maintenance of
35%DMBTT"
price and availability.
ficials. This function allows usThis higher level of smarters to ask a sensor if it is func *&&&
BMMPZ/J4J
sensing technology opens
tioning properly before starting
CVMLDBM
the door to an unlimited vaa batch or process, or schedule

*&&&35%
riety of new sensors those
maintenance and downtime in a
TFOTPSDBM
that can meet modern design
more cost-effective manner.

goals. If a smart thermocou5FNQFSBUVSF $
ple can carry its entire voltConclusion

4NBSUUIFSNPDPVQMFTDBOOPXCFNPSFBDDVSBUFUIBOTUBOEBSE35%T
age table information, and
Combined, the benefits of smart
BUNPTUUFNQFSBUVSFT4NBSU35%TDBOBDIJFWFSFGFSFODFBDDVSBDZ
this information can be comsensing, especially with IEEE
municated to a controller to Table 1. Calibration information increases accuracy.
1451.4 standards offering form
correct known errors, it is no
and function, are transforming
longer forced to be a standard thermo- best accuracy, but also a low-temperature sensors from a limiting factor within new
couple, such as Type J or K. Instead, al- rating. Conversely, glass-coated thermis- or advanced processes, to an enabling comternative metals that are more accurate, tors arent very accurate, but offer a high- ponent worthy of their own spotlight. AP
stable, and available can be used. For temperature rating. Using smart-sensing
example, engineers specifying a type of technology allows the engineer to make a CHRIS SEYMOUR served as sensor strategic marketing
thermistor may have struggled between glass-coated thermistor as accurate as an manager for Watlow. For more information, please conepoxy-coated units and glass-coated epoxy-coated thermistor.
tact Watlow Electric Manufacturing Co., 12001 Lackland
Smart sensing contributes to diagnostics Road., St. Louis, MO 63146; 1-800-4-WATLOW.
units. Epoxy-coated thermistors offer the
Do you need faster, lower cost,

better dispensing?
Its called, Jetting.
Dispensing problems typically

associated with needles such
as die clipping, broken wires,
bent needles and dripping are
eliminated with jetting
technology. With jetting, you
have fewer problems,
higher yields and
a better process.
The jet shoots a fluid

stream as small as 100m
and achieves wet out
areas as small as 250m
allowing tighter die
spacing. Jetting has been
proven to deliver higher
thoughput compared
to needle dispensing
for die sizes from
under 1 mm to
over 20mm.
Jetting delivers speed

increases of 400% over
needle dispensing with
improved yields and
better accuracies with
these fluids:
Underfills
Encapsulants
Flux
Conductive adhesives
UV-cure adhesives
Get into production

and to the market
faster with jetting.
FIND OUT MORE NOW:

Americas:
Europe:
Japan:
China:
Email:
+1-760-431-1919
+31-43-352-4466
+ 81-3-5762-2801
+86-21-5899-1879
info@asymtek.com
www.dispensejet.com
See Asymtek at IMAPS Booth 645 and ATE Booth 5623

www.apmag.com
Advanced

u
u
0509AP_19 19
September 2005
19
ADVANCED PACKAGING
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:32:13
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
M E M S
MEMS Packaging
Update
PROVIDING A FOUNDATION FOR FUTURE PACKAGING ADVANCEMENTS
BY KEN GILLEO
icroelectromechanical systems (MEMS) are alive and

well in 2005 with a growing market now in the billions of dollars. Motion sensors, todays
fastest-growing commercial segment,
continue to see frequent new product
launches by both established and new
suppliers. While simpler ink-jet chips
have more market share because they are
disposable (part of the ink-jet cartridge),
this is a limited market. Inertial sensors,
however, continue to find new applications on a regular basis. While air bag
systems are still the main market for sensors, there are many newer applications,
such as disk drive free-fall detectors and
innovative consumer applications.
The most popular MEMS fabrication
process is surface machining where sacrificial materials, such as SiO2, are selectively formed and then etched away to
leave 3-D structures typically made of
silicon. This process is also compatible
with CMOS and allows intelligence to
be built into the MEMS chip. MEMS inertial devices have moving parts, which
equates to special handling and packaging challenges. MEMS parts can be sensitive to mechanical shock, especially
in unpackaged form, and are especially vulnerable to particulate contamination, such as residue from wafer sawing. The mechanical motion zone of a
MEMS chip must be protected during
singulation with a temporary mask, or
by wafer-level packaging techniques.
However, the most significant packaging challenge is to provide environmental protection that does not restrict
20
ADVANCED PACKAGING
chip-level motion. Electronic devices

are readily overmolded and the encapsulant can contact the active side of the
chip. But direct contact of the MEMS
Figure 1. Packaged MEMS accelerometers.
surface with molding compound or

other encapsulant would freeze the
moving parts. MEMS-specific designs
offer the most suitable solutions to
these special needs.
MEMS Package Requirements
The hermeticity debate continues; do we

really need a full-hermetic package for
inertial devices like accelerometers and
gyroscopes? We should consider that
many other types of MEMS products are
not packaged in hermetic enclosures because they require access to the outside
world, as is the case with ink-jet chips
and fluidic-MEMS products. But inertial sensors are somewhat unique and
0509AP_20 20
the first MEMS-package requirement is

free space typically achieved with cavity-style packaging. Some devices also
require internal atmosphere control because moisture and particle contamination can be damaging. Getters (trapped
moisture and particles), lubricants, or
anti-stiction agents may also be added
to the package to prevent wear, degradation, or stiction. Stiction, a combination of sticking and friction, occurs
when smooth, planar surfaces make
contact and become locked together
permanently by short-range atom forces. Because MEMS devices are so small,
these moving parts have a high area-tomass ratio, making stiction likely. More
September 2005
Advanced

u
u
require only electrical I/Os. At present,

however, inertial devices are being hermetically enclosed with cavity designs so
mechanical action is allowed. Therefore,
www.apmag.com
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:50:59
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
Coming Next Month:
Lead- free
EL E C T RO N IC S
Critical Issues
Compelling Coverage
Are you ready for the lead-free challenge? To help
you make the transition, we are offering Lead-free
Electronics, a stand-alone magazine supplement with
exclusive editorial coverage of market perspectives,
technology predictions, influential new products, and
expert viewpoints.
Heres a preview of Lead-free Electronics:
Advanced Packaging, Connector Specifier and

SMT magazines bring you an extraordinary
opportunity to reach qualified buyers in one
Lead-free problem areas, including tin whiskers,

tombstoning, and temperature control
Successful OEM implementation programs
Issues facing the connector industry
Rework
of the hottest markets
Marking and/or labeling of lead-free

products and materials
Exclusive Editorial Content
News
Information for Key Decision-makers
Tech Toolbox
Reach an audited circulation of 23,000+
Products
who are 100% one-year qualified, with

100% PURCHASING POWER
Contact your sales representative for

information on a lead-free ad package!
Web Resources
Calendar of Lead-free Events
Helping you Stay Ahead of the

Emerging Lead-Free Electronics Market
Look for your copy next month!
www.apmag.com
Advanced

u
u
0509AP_21 21
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM1:00:26
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
M E M S
complex MEMS devices, such as gas and
fluid analyzers, require selective access to
the environment.
Commercial Package Designs
MEMS inertial sensors are one of the

oldest classes of products and one of the
most active areas. Production is expected
to exceed 600 million devices for 2005.
Cambridge, Mass.-based Analog Devic-
Plastic vs. Ceramic
Electronics have benefited from lowcost plastic non-hermetic packaging

materials for the past 50 years. Simple
epoxy overmolding adds little cost, especially today, with area or flood-molding techniques that produce hundreds
of packages per cycle. The main cost for
plastic packaging, however, has been attributed to the platform, or chip carri-
Figure 2. Thermoplastic cavity packages.
es, Inc. (ADI) did much of the pioneering work in this field and enjoys a leadership position in the accelerometer area.
ADI reached a milestone earlier this year
when they shipped their 200-millionth
inertial sensor. But there is substantial
competition. Freescale also has a long
history in motion sensors and recently
has launched 3-axis motion-sensor products. OKI, MemSense, Hitachi, Kionix,
and STMicroelectronics have, or soon
will offer 3-axis accelerometers. While
such devices are useful for the automotive market, other applications include
cell phone pedometers, game sensors/
controllers, and a variety of sports products. MEMS can already help improve
your golf game or fly-casting skills.
Most inertial devices are packaged in
small QFN format. The smallest package is 5 5 1.2 mm, offered by Kionix,
but competitors have designs only slightly larger. Figure 1 shows several QFN
MEMS packages. Most use ceramic hermetic packages, at least for now. The simple QFN has reduced the cost over earlier ceramic cavity-style packages that had
accounted for more than half of the total
component cost. But even newer ceramic
QFNs are not the lowest-cost packages.
The general electronics market enjoys
low-cost plastic packaging that reaches
as low as $0.05 per assembled package
for low I/O QFNs. This is almost an order of magnitude lower than MEMS ceramic QFNs.
22
ADVANCED PACKAGING
er. The QFN has reduced cost by simplifying the platform and eliminating
secondary operations, such as solderball attachment, making this the lowest
cost design in production. Aware of the
cost benefits of plastics, the MEMS industry has been seeking ways to adapt
cost-reducing plastics. Because a cavity is required, at least around the mechanical zone, two basic strategies are
available.
Although epoxy cavity packages are
feasible, transfer molding is not the
perfect process here. However, injection molding, a more common plasticshaping process outside of the package industry, is ideal for producing
3-D shapes, including cavities. Injection molding uses thermoplastic resins
instead of thermosets, and that can be
beneficial. There are several commercial high-temperature (>300oC stability)
thermoplastics that have better properties than epoxies, especially regarding
low moisture absorption. Whats more,
materials such as liquid-crystal polymers (LCPs) pass flammability specs
without adding flame retardants. Bromine flame retardants are coming under
regulatory attack and may be banned, so
intrinsic flame retardancy is a plus for
packaging materials. Even better, thermoplastics are no-waste materials,
since they can be remelted and reused.
This also means that thermoplastic electronics could be recycled just like many
0509AP_22 22
Future
MEMS will continue to grow at a steady,

sustainable rate that will drive low-cost
packaging innovation. Plastic packaging is certainly in the future, but ceramic dominates for now. MEMS packaging
technology, because of its high versatility,
will also provide the foundation for nanoelectronics devices that could emerge
within the next 5 years. A paradigm shift
AP
is likely within a decade.1
Reference
1. Gilleo, K., MEMS/MOEM Packaging: Concepts, designs, materials and processes, McGraw-Hill, New York,
NY June 2005.
KEN GILLEO, Ph.D., is a consultant at ET-Trends LLC,
38 Cedar Pond Drive, Suite 6, Warwick, RI 02886;
401/965-8019; e-mail: Ken@ET-Trends.com.
September 2005
Advanced

u
u
other thermoplastic products.

Analog Devices has been exploring
plastic-cavity packages for their MEMS
gyroscope family. However, ADI first
caps the MEMS device at wafer level
so that the motion zone is hermetically
enclosed. Now, the device is protected
from both particulate contamination
and moisture. The bonded-silicon caps
are specially singulated so that they are
smaller than the chip, allowing bonding pad access. The capped MEMS device can now be handled more like an
ordinary electronic chip. While some
parts can be overmolded with epoxy,
chips that are more mechanically sensitive are placed inside injection-molded cavity packages. Overmolding adds
stress due to shrinkage that detunes the
MEMS sensor, making it undesirable for
some products. Once the capped device
is attached and wire bonded to the cavity package, a lid is sealed using dispensed adhesive. The capping adds cost,
but solves pre-package problems, such
as contamination from sawing. However, many MEMS devices cannot be
capped and these are candidates for injection-molded, plastic-cavity packages.
These thermoplastic packages have better barrier performance than non-hermetic epoxies, but do not achieve full
hermeticity; the term near-hermetic
package (NHP) seems appropriate. Figure 2 shows low-cost thermoplastic cavity packages.
www.apmag.com
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:51:05
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
Assemble it faster, better, for less.
ATExpo, because your

challenge never ends.
EXHIBITION: September 27-29, 2005

CONFERENCE: September 26-29, 2005
Donald E. Stephens Convention Center
Rosemont (Chicago), IL
See demonstrations of hundreds of NEW ASSEMBLY PRODUCTS,
technologies and processes. Youll see exhibits from nearly 600 of the
worlds leading manufacturers and suppliers as well as live assembly
lines. Plus pavilions dedicated to Electronics Assembly, Flexible Automation
and Wire Processing.
FREE KEYNOTES FROM NASA, BOEING, AND FORD.
Register today for FREE show

admission and conference
discounts at www.atexpo.com
SPONSORED BY
PRODUCED
AND MANAGED BY
See even more new products with FREE admission to the

CO-LOCATED INTERNATIONAL ROBOTS AND VISION SHOW
featuring the latest robotics and machine vision products. Between our
two shows, youll nd the most complete showing of robots in the US
with robots for assembling parts of all sizes.
ALL-NEW INDUSTRY DEVELOPED CONFERENCE PROGRAM

Learn from assembly experts on critical subjects like Lean Sigma,
Nanotechnology, Error Proong and more. Register early for
conference discounts.
ASSEMBLY TECHNOLOGY EXPO. Dont miss this once a year
chance to boost your competitive advantage.
Advanced

u
u
0509AP_23 23
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:51:12
PM
F
Advanced

u
u
THE
back-end
Front Cover
Search Issue
Next Page EMaGS

F
PROCESS
Building on a Basic X-ray

Inspection Platform
Configuring an X-ray Inspection System
BY UDO E. FRANK
emiconductor components, high-density circuitry, waferreal-time image processing system.

level chip scale packages, stacked assemblies, micro-elecThis system provides a basic X-ray imaging capability contromechanical systems (MEMS), and micro-opto-elec- tained within a radiation-secure cabinet with a 1 1-m footprint.
tromechanical systems (MOEMS) the advantages of X-ray Additional capabilities can be added to the platform. Instead of
inspection are well recognized and understood for such applica- a microfocus tube, a multifocus tube can be substituted. This
tions. However, selecting the right X-ray system for each appli- tube offers three mode capabilities with a single tube: microfocation can be a challenge.
cus, nanofocus and high-power. Instead of
A variety of factors come into play, ina four-axes manipulator, a six-axes subasX-ray tube
cluding how equipment will be used and
sembly can be incorporated. Should the
where it will be installed (in a production
application warrant additional costs, add
line or off-line), feature-size capability rea high-resolution scientific-grade camera,
quired, and a host of performance charBGA module, voiding calculation softacteristics, such as contrast, sharpness,
ware and direct digital detectors.
Sample on X-Y-Z
magnification, and acceptable noise level.
With such a system, the decision comes
manipulator with
rotating/tilting
Applications also can change. Selecting
down to what level of performance is rean X-ray inspection system often means
quired. What detail detectability, for inpurchasing equipment that exceeds curstance, is necessary? If above 1 m, then a
rent requirements.
microfocus tube will suffice. On the other
An alternative, cost-effective aphand, for improved feature recognition, a
tube with nanofocus capability is required
proach is to purchase a basic system
Detector
to meet these requirements. The decision
that is configured to meet current perwill impact cost, because a microfocus
formance requirements. What distintube costs less than a multifocus tube with
guishes the system is the versatility of Figure 1. Diagram of a typical X-ray system for
an additional nanofocus mode. However, a
the platform concept, which allows the industrial inspection.
cost/performance analysis based upon imsystems X-ray inspection capabilities to
be tailored to specific inspection needs. In this case, the basic mediate and near-term application needs could determine that
the extra, upfront expense of a multifocus tube.
configuration includes:
Open microfocus tube with a transmission target the tube
features an acceleration range up to 160 kV and a detail de- Design and Performance Considerations
tectability of 1 m. The tube also incorporates a design that X-ray systems primarily consist of three subassemblies: an X-ray
enables controlled and continuous stable output intensity for source, remote- controlled fixture for holding and manipulatX-ray emission, constant image contrast, and brightness.
ing the sample, and a radiation detector (Figure 1). These sub Geometric magnification up to 2000.
assemblies are contained in a multiple-fused, radiation-shield 4-axes manipulator capability of accommodating sample sizes ed cabinet.
The X-ray source for industrial inspection is a tube, which
up to 440 550 mm (17 21 in.).
may be sealed or open. An open design usually is a stainless 4-in. (102-mm) dual-field image intensifier.
steel tube, in which a continuous vacuum is created, and it can be
Digital-imaging chain with a CCD camera.
A 17" (432-mm) monitor, GUI (graphical user interface) and opened for cleaning and maintenance. However, a sealed tube is
24
ADVANCED PACKAGING
September 2005
Advanced

u
u
0509AP_24 24
www.apmag.com
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:52:34
PM
F
Advanced

u
u
Front Cover
Search Issue
THE
Next Page EMaGS

F
back-end
PROCESS
Only open tubes can achieve such highone in which the vacuum is introduced
resolution grades, are capable of higherat the time of manufacture, and it cannot
Cathode
acceleration voltages than sealed tubes,
be opened without destroying it.
Grid
and provide higher tube power with
The manipulator is designed to prohigher intensities (dose rates). They are
vide precise X-Y-Z positioning and rotating/tilting of the sample at varied
Alignment unit the standard in X-ray microscopy.
As seen in Figure 3, the near-puncspeeds, depending on whether a quick
Electron beam
tiform shape of the focal spot elimioverview of the part at low magnificanates peripheral shadowing in the Xtion, or a more detailed examination at
ray image almost entirely, achieving a
higher magnification, is desired. The
Objective
nearly infinite in-depth sharpness. The
function of the detector is to convert
required resolution is important when
the real-time X-ray data into an image
selecting tube types for the application.
of visible light that can be seen and exObjective
The smaller the focal-spot capability, the
amined by the human eye. The most
aperture
higher the tube cost, and vice versa.
common detector is a combination
Target
Magnification. All absorbing strucvideo camera/image intensifier. Other
tures
of the 3-D sample under inspectypes include high-dynamic scientificX-ray beam
tion are projected as a 2-D shadow image
grade cameras and flat-panel direct digonto the entrance field of the detector.
ital detectors (DDDs).
To determine the required configura- Figure 2. Microfocus transmission tube showing gen- Geometric magnification depends on
the position of the sample between the
tion for a particular application, choices eration of X-ray beam.
X-ray source and detector plane on the
are required in terms of the subassemblies to be installed in the cabinet, such as ball with a void, radiation must penetrate relationship of the focus-to-detector distype of mode required: microfocus, nano- the ball sufficiently to depict the difference tance (FDD) and focus-to-object distance
focus, or high-power; most appropriate in absorption between the solid metal and (FOD). Magnification (m) equals FDD ditype of tube: open or sealed; what mo- the less-dense area of the void. Therefore, vided by FOD. Magnification increases sigtion is required of the manipulator; and finding the optimal contrast is a one-pa- nificantly within the last few millimeters
what type of imaging system is most suit- rameter task of determining proper accel- toward the focal spot of the X-ray source.
able. These are a few of the specific design eration voltage, because all other param- Because of this, the X-ray tube must be
eters in an X-ray system can be adjusted a transmission-target type, as a transmisquestions that should be considered:
sion target features a thin X-ray window
Contrast. X-rays are generated within automatically.
Sharpness. The focal spot, a resolution (250 m) located practically at the same
a continuously evacuated tube housing.
Electrons are emitted from a cathode, tube generally half the diameter of the fo- level with the focal spot and a thin target
accelerated through a high-tension field cal spot, determines image or geometric layer sputtered onto the inner side of the
(typically 10 to 225 kV) and focused onto sharpness. Therefore, a microfocus X-ray X-ray window from which X-rays emit.
a thin layer of target material, usually tung- tube provides a resolution of about 1 m. With a typical FDD of 500 mm, maximum geometric magnification
sten (Figure 2). As electrons cola) With punctiform
b) With extended
of 2000 can be achieved if the
lide with target-material particles,
FEINFOCUS
(conventional)
X-ray source
X-ray source
sample to be examined touchthey are slowed down, and the loss
X-ray source
in kinetic energy is converted into
es the outer surface of the XF
F
other types of energy, mostly heat, Benet:
ray window. This also is called
Highest feature
but also X-rays. Acceleration volt- recognition
stamp magnification.
age determines the velocity and capability
An FOD of 1.25 mm results
FOD
violence of the collisions with the
in a geometric magnification of
target material; and therefore, the
400, while an FOD of 5 mm
FDD
Object
penetration power of the X-rays
achieves 100. For a sample that
generated. At 30 kV, more soft rais 5-mm high, total achievable
diation, which is highly absorbed
geometric magnification can
in typical electronics assemblies,
vary by a factor of 20. In selectImage plane
is generated. At 160 kV, more hard
ing a tube design for a particular
radiation is generated. The objecapplication, maximum geomettive in selecting acceleration voltric magnification required must
age for a particular application is
be taken into consideration.
Ug
to achieve the highest possible abTotal magnification is visible
FDD Geometrical unsharpness: Ug = F (m-1)
FOD
sorption (or attenuation) differ- F: Focal spot size Geom. magnication: m =
to the operator on the displayence. Thus, in viewing a solder Figure 3. Relationship of focal spot diameter and geometric sharpness. ing media. If, for example, the
www.apmag.com
Advanced

u
u
0509AP_25 25
September 2005
25
ADVANCED PACKAGING
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:52:39
PM
F
Advanced

u
u
THE
back-end
Front Cover
inspection, noise plays an inferior role because sufficient photons are available. For
X-ray inspection, however, the situation is
different; X-ray intensity, or dose rate, has
a significant influence on noise. The relation of absorption signal to the gray-value
noise level (frequently referred to as the
signal-to-noise ratio) doubles with quadrupled intensity. The objective in X-ray
inspection is to achieve the highest possible intensity. An Isowatt function keeps
AAAAAAAAAAAAAAAAAAA
ADVANCED PACKAGING
0509AP_26 26
B
F
electrical power applied to the target constant and ensures consistent optimal conditions independent of the selected acceleration voltage.
A recursion filter also is an efficient tool
for reducing noise level without losing realtime impressions of an image. It creates an
output image that is the weighted sum of
prior images in a time sequence. During
imaging, gray values of individual captured
images are being added pixel-wise, and averaged. Images that were captured earlier
will be less weighted than those captured
more recently. Noise reduction can be
achieved for an unmoved sample. Should
the sample be moved; however, the image
would be smeared. This can be avoided
when reducing the recursion level during movement so the image appears to be
noisier, while the sample structures remain
clearly discernible during motion. An automatic adjustment of the recursion level
to the motion status (moving noise reduction) ensures user-friendly operation.
FDD also influences X-ray intensity. The relation is an inverse square.
Therefore, when the FDD is doubled,
the captured intensity is reduced to a
quarter of the previous amount. For
this reason, the sample should be positioned as close to the X-ray tube as
possible, while adjusting the FDD to
the required magnification grade. This
is possible only with systems enabling a
variable-detector position.
Leaving the pixel number constant
where the converted entrance image is imaged results in useful post-magnification
effects. This is possible when the detector
unit consists of a combination of an image
intensifier and camera. The image intensifier converts X-ray waves into visible light
and amplifies them. The optical image
available at the output field is observed by
a camera and displayed onto a computer
monitor. The most cost-efficient solution is
a video camera (760 570 pixels with 256
gray values = 8 bits), which is sufficient for
a range of applications. The entrance field
of the image intensifier can be set to various sizes electronically. Because the image
size in the output field of the image intensifier and the pixel number of the camera
image remain constant, magnification
grade of the image displayed on the implemented system monitor changes. This fea-
September 2005
Advanced

u
u
Next Page EMaGS
PROCESS
X-ray image is copied from a monitor

screen onto a wall (by an LCD projector),
the image on the wall is enlarged visibly
compared to that on the screen. However, the resolution remains the same because only the image pixels are displayed
larger in size.
Noise. In addition to image contrast
and sharpness, noise is an important factor in determining image quality because
it affects the observed clarity. For optical
26
Search Issue
www.apmag.com
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:52:45
PM
F
Advanced

u
u
Front Cover
Search Issue
THE
ture is called post-magnification or imageintensifier zoom.

When switching the entrance image of
the image intensifier from 4-in. diameter to 2 in., post-magnification grade is
doubled while signal-to-noise ratio is decreased to half (double noise), because
the entrance field of the detector is reduced to a quarter of its size. Using postmagnification effects is particularly useful when geometric magnification cannot
be increased further, because the sample
already touches the X-ray tube.
For higher requirements, a camera with
more than 1-M image pixels is recommended in combination with an imageprocessing chain featuring a gray-value
resolution of 16 bit = 65,536 gray values.
This Scientific Grade Camera (SGC),
which also is used with an image intensifier, offers the opportunity to reduce the
image repeat frequency of 25 frames/second (real-time) to less than 1 frame/second. The advantage is in the acquisition
time. The longer an image is exposed, the
longer the X-rays can work in, the more
X-ray photons can be captured for the image, and the lower the noise level.
For high requirements, a DDD is recommended with the highest pixel amount
(1,888 1,408 pixels), best contrast resolution (16-bit), and lowest noise level because it enables real-time operation with
30 frames/second, while providing an image quality that can compete with an X-ray
film. Moreover, in comparison to an image
intensifier/camera combination, the DDD
is about the height, so the FDD and the
maximally achievable magnification of the
X-ray system can be increased considerably.
The entrance plane of the detector is 24 18
cm, so that Eurocard Format (16 10 cm)
PCBs can be displayed completely at 1.5fold magnification. Because the pixel size
of this detector is 127 m, 85-m structures
can be resolved.
less-than-cost-effective purchase.
Another choice is available the ability
to configure a versatile X-ray platform that
meets specific inspection needs. The versatile X-ray platform offers a cost-effective
approach to purchasing the most suitable
system. Tthe decision that must be made is
one of determining the basic level of performance required. The type of tube selected
represents the most fundamental decision,
as it determines resolution and focal-spot
Next Page EMaGS

F
back-end
PROCESS
size. Contrast, sharpness, magnification,

and noise, as well as imaging requirements
for the application, also represent an important set of choices. The advantage of such a
system is significant the likelihood of a
more profitable bottom line.
AP
UDO E. FRANK, Ph.D. has served as director of technology development at FEINFOCUS. For more information, please contact COMET North America Inc.,
203/969-2161; e-mail: info@cometna.com.
For More Details Call 207-781-9603

or Vist www.intertechusa.com/orfid.htm
Organic RFID
2005
The Promise of Printed Electronics

with Organic Semiconductors
October 19-21 B Hilton San Diego Resort B San Diego, CA
Conclusion
Inspection and analysis of electronic assemblies and parts using high-resolution

X-ray technology mandates several choices
when selecting a system. The tendency is
to purchase a system with capabilities that
exceed the need because of the minimum
level of capability available, or in anticipation of future requirements. The result is a
www.apmag.com
Advanced

u
u
0509AP_27 27
Conference Co-Chairs:
Supported By:
Dr. Daniel Gamota,

Motorola Corporation
Dr. Kiyoshi Yase,
National Institute of Advanced
Industrial Science and
Technology
September 2005
27
ADVANCED PACKAGING
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:52:53
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
IMAPS 2005 presents

The 38th International Symposium
on Microelectronics
Pennsylvania Convention Center
Philadelphia, PA
Everything in electronics between the chip and the system!
Conference & Events

September 25 - 29, 2005
Exhibits
September 27 - 29, 2005
To view the Technical Program, Reserve Booth Space or Register as an Attendee, please visit
www.imaps2005.org
Advanced

u
u
0509AP_28 28
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:53:00
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F

2005 ADVANCED PACKAGING AWARDS
SPECIAL SECTION
Celebrating Product Excellence in Semiconductor Packaging
Advanced

u
u
0509AP_29 29
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:54:17
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
F RO M T H E E D ITO R - I N - C H I E F
Advanced Packaging Salutes

Innovative Excellence
t is with great pleasure that once again, Advanced
Packaging Magazine congratulated the participants and winners of the 2005 Advanced Packaging Awards (APAs). This was the 5th annual
APA ceremony in a program that has become a leading industry event, as well as a prestigious recognition for companies devoted to innovations in semiconductor packaging. From the beginning,
SEMI and Advanced Packaging have worked
together to award creative advancements in
technology, and the result of our efforts can
be seen in the overwhelming support from
the packaging industry.
This year in San Francisco, during SEMICON West, on July 13, 2005, in the Regency
Ballroom, the winners were announced in
20 categories. Judges from a distinguished
created the right balance of elegance so fitting

for this industry celebration. We found it suitable to
recognize such an evolving technological industry
as ours in such a monumental, timeless building. It
reminds us that despite changes in the industry, a
firm foundation will keep us steadfast.
After the presentations, guests enjoyed hors
doeuvres and cocktails, and discussed the changes they have seen at SEMICON West throughout the years. For this celebration, Advanced Packaging teamed up with one of its sister publications
focused on front-end assembly, Solid State Technology.
David Barach, publisher of Solid State Technology,
welcomed all attendees, suggesting that this dual celebration become a new, yearly tradition at SEMICON
West. Bringing award celebrants from the packaging industry together with a range of semiconductor manufacturing companies was
From the beginning, SEMI and Advanced Packaging
an enjoyable way to unite a large
have worked together to award creative advancements in portion of the electronics manufacturing industry into one room for a
technology, and the result of our efforts can be seen in the relaxed evening.
In the following pages, you will
overwhelming support from the packaging industry.
find presentations recognizing the
winners of this years awards. Take a
panel comprising industry experts and members
few minutes to read about these creative new prodfrom academia chose the winners. The panel looked
ucts and the companies who are behind these investat submissions based on the ability to meet a sigments in R&D. Next year, we invite all companies
nificant industry challenge; a creative application
involved in the back-end packaging process to submit
of a new or existing technology; overall quality and
their product or service to the 2006 APAs. Simply fill
consistency of performance; economic merits and
out the registration form and follow the step-by-step
throughput characteristics. Products were judged
instructions to be listed on the website (www.apmag.
on their innovativeness, cost-effectiveness, qualicom). Then join the winners circle as you keep the
ty contribution, ease of use, maintainability/repa- AAAA
spirit of ingenuity alive.
rability, technical advancement, speed/throughput
Congratulations to this years winners.
improvements, and environmental responsibility. An APA crystal display was presented to the
winning companies.
Jay Regan, our publisher, welcomed all attendees
to the event. The Regency Ballroom, with its carved Gail Flower
wood walls, arches, and ornate suspended lighting Advanced Packaging Editor-in-Chief
30
ADVANCED PACKAGING
September 2005
Advanced

u
u
0509AP_30 30
www.apmag.com
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:54:39
PM
F
Advanced

u
u
Front Cover
Search Issue
2005
Next Page EMaGS

F
A DVA N C E D PAC K AG I N G AWA R D S
3-D PACKAGING TECHNOLOGY
NOVEL PACKAGE DESIGN
Amkor Technology Inc.
Advanced Interconnect
Technologies
ASM Technology Ltd.
Etched Leadless Package (ELP)
BP2000
PACKAGE DESIGN SOFTWARE &

EQUIPMENT
SURFACE TREATMENT EQUIPMENT &

MATERIALS
CAD Design Software
Aqueous Technologies Corp.
Bond Wire Optimizer/3D Design
Focus-Wash
QUALITY ASSURANCE/MANAGEMENT
TOOLS
TESTING EQUIPMENT
ASM Technology Ltd.

Osprey
KIC
LongLife ATE Socket
PAvfBGA
SUBSTRATE & SUBMOUNT EQUIPMENT

& MATERIALS
DIE ATTACH EQUIPMENT & MATERIALS
Hover-Davis Inc.
DDf Ultra
DISPENSING/ENCAPSULATION
MOLDING/UNDERFILL EQUIPMENT &
MATERIALS
Gryphics Inc.
SlimKIC 2000
ENVIRONMENTALLY FRIENDLY
MATERIALS
REFLOW EQUIPMENT
THERMAL MANAGEMENT
TECHNOLOGY
Aqueous Technologies Corp.
Tamura H.A. Systems Inc.
Dow Corning
Focus-Wash
FLIP - Flat Linear Induction Pump

and
TC-5022
FLIP CHIP ATTACH EQUIPMENT

& MATERIALS
PRO-MATION Inc.
WAFER DICING/THINNING EQUIPMENT
Pro-8 Laser Soldering System
DEK Printing Machines Ltd.
Datacon Technology AG
Galaxy
8800 FC Smart Line
SEMICONDUCTOR ASSEMBLY & TEST

SERVICES (SATS)
HANDLING EQUIPMENT/FIXTURES
Kulicke & Soffa
WAFER-LEVEL PACKAGING
EQUIPMENT & MATERIALS
Hover-Davis Inc.
Quatrix
Milara Inc.
DDf Ultra
SemiTouch Wafer Printer System (STW-I)
INSPECTION/IMAGING HANDLING
SPECIALIZED ADVANCED PACKAGING

WIRE BONDING EQUIPMENT
August Technology Corp.
Tyco Electronics Automation Group
ASM Technology Ltd.
3Di All-Surfaces
Tyco RFID Line
Harrier
details available at www.apmag.com

www.apmag.com
Advanced

u
u
0509AP_31 31
September 2005
31
ADVANCED PACKAGING
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:54:47
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
Two In a Row
for the world's most flexible Reel to

Reel RFID Assembly system
Tyco Electronics Automation Group has won two of the most
prestigious industry awards back to back for their
RFID assembly system.
Throughput up to 9000 cph

Full 20" wide web process capability
12 micron placement repeatability 3 sigma (process
dependent)
Passive or active designs
Direct die pick from wafer down to .008"
Positive displacement dispense technology
Modular construction allowing for future capacity
expansion
Fully capable of placing ancillary components such as
Capable of tape and reel die placement

Full closed loop process control of individual thermodes
including:
Lower thermode temperature
Upper thermode temperature
Fully adjustable thermode pressure
Fully programmable cycle timer
SPC data capture
batteries.
Technologies for tomorrow...available today.

www.automation.tycoelectronics.com
Contact us at teagsales@tycoelectronics.com; Phone: 215-657-6202; Fax: 215-657-6356;
Tyco Electronics Corporation, Automation Group, Willow Grove, PA 19090. TYCO is a trademark.
Advanced

u
u
0509AP_32 32
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM1:05:40
PM
F
Advanced
u
u
Front Cover
Search Issue
Next Page EMaGS

F
The Future Offers Choices.

Offering Diverse Engineering and Automation Expertise
We are constantly looking for innovative ways to exceed the expectations of our customers
Custom Engineering
Production Consulting
Application Analysis
Turn-Key Integration
APS-1H Hybrid Module

Assembly Systems
Flexible
Service
Agreements
Customized
Training
24 Hour TechSupport
Automated PCB Depaneling
SMT Pick and Place

Assemblers
Tyco Electronics MPS-Series
Powerful SMT Software Solutions
Material Handling Systems

The glue that holds it together...
PCB Insertion Equipment
Automated Selective
Soldering Systems
Press-Fit Connectors
Mini-Wave & Multiple

Wave Configurations
Discreet Reeled Press-Fit

and thru-Hole Products
Tyco Electronics Automation Group

TYCO is a trademark. Other trademarks used are the properties of their respective owners.
Tyco Electronics Corporation, Automation Group, Willow Grove, PA 19090; Phone: 215-657-6202; Fax: 215-657-6356; E-mail: teagsales@tycoelectronics.com
Advanced
u
u
0509AP_33 33
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM1:05:46
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
We Did It Again and again and again

...
...
(and again and again and again and again and again)!
New award-winning focus wash
Aqueous Technologies Corporation

9055 Rancho Park Court
Rancho Cucamonga, CA 91730 USA
U.S. & Canada: 1.800.218.8128 World: 1.909.944.7771
sales@aqueoustech.com www.aqueoustech.com
Aqueous Technologies introduces Focus-Wash,

an exclusive (patent pending) spray technology
that makes all other spray systems obsolete.
Aqueous Technologies unique "Focus-Wash"
spray system directs cleaning solution to all areas
of the boards, including between and under
components. The unique (patent pending)
oscillating board rack and asymmetrical spray
nozzle design produce millions of overlapping
spray patterns, virtually eliminating shadowing.
Focus-Wash produces more than five times the
impact pressure of former models. The SMT
Series cleaners are designed for fine-pitch, high
density SMT assemblies. Focus-Wash is standard
on all SMT-Series automatic de-fluxing systems
Aqueous Technologies has won an unpresidented 8 awards in 2 yearsa record in this industry.
Advanced

u
u
0509AP_34 34
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM1:05:51
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
WHY
CUSTOMERS
CHOOSE
AQUEOUS
TECHNOLOGIES
Inline Format De-Fluxing Systems
4 Models to Choose From
2003 SMT
Vision Award
Winner
2003 AP
Award Winner
and 2003 SMT
Vision Award Winner
Batch Format De-Fluxing Systems

Nine Models to Choose From
UltraSonic Stencil Cleaning Systems

Six Models to Choose From
(Semi-Automatic and Fully Automatic)
Cleanliness Testing Systems

Zero-Ion
AAAAAAAAAAAAAAAAAAAAA
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
TWO AWARDS
ARE ALWAYS
BETTER THAN ONE
Hover-Davis wins two awards for
their DDf Ultra direct die feeders
Introducing our NEW DDf technology
Active package-less SMDs at the wafer level are now a
reality. Eliminate the cost associated with packaging trays
and embossed tapes with a new form of component
packaging: NONE!
Recurring cumulative costs associated with high-volume
packaging of components is staggering. The Hover-Davis
DDf makes this cost a thing of the past!
The new DDf technology from Hover-Davis crosses the
threshold of a new era in electronics manufacturing. The
DDf enables you to introduce wafer-level devices to your
placement equipment and eliminate the costs associated
with packaging.
Imagine being able to deliver thousands of die per hour to
your placement machine, while only three to four feeder
slots are consumed.
Die-Attach Equipment & Materials

Handling Equipment/Fixtures
World Leader in Component Delivery Systems

2005, Hover-Davis. Hover-Davis and Direct Die Feeder are trademarks.
Visit us at www.hoverdavis.com/go/ddf for more information
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA
AAAAAAAAAAA
Advanced

u
u
AAAAAAAAAA
Front Cover
Search Issue
Next Page EMaGS

F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
Amkor proudly accepts the 2005 Advanced

Packaging Award for our innovative PSvfBGA
package, which is an integral component of
Package-on-Package (PoP) technology.
PSvfBGA
Amkor's PSvfBGA is a high-density logic-IC package
that resides at the bottom of the PoP stack. The package reduces the routing density and component area
required in the underlying motherboard, and thus
forms an interconnect foundation for the entire PoP
stack. The top of Amkor's package has a standard
surface mount pad interface between the base logic
and top memory components. The standard interface
is designed to support a broad range of memory
device combinations required for current and next
generation products.
Advanced

u
u
0509AP_38 38
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM1:06:18
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
36 years of assembly & test leadership

Five million square feet of manufacturing space
Turnkey solutions for wirebond and flip chip
Factories strategically located throughout Asia
Supporting the worlds leading semiconductor companies with
world class operational scope
the industrys largest package design staff
an extensive portfolio of packaging and test technology
a worldwide sales and support organization
Enabling a Microelectronic World

www.amkor.com
Advanced

u
u
0509AP_39 39
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM1:06:29
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM1:06:37
PM
the new world of

advanced packaging
Advanced

u
u
0509AP_40 40
B
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
member of Besi group
Datacon Technology GmbH

Innstr. 16, 6240 Radfeld, Austria
Tel.: +43 5337 600-0, Fax: +43 5337 600-660
info@datacon.at, www.datacon.at
Advanced

u
u
0509AP_41 41
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM1:06:48
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
Advanced
Front Cover
Search Issue
Next Page EMaGS
Advanced
Front Cover
Search Issue
Next Page EMaGS

u
u

u
u
B
F
B
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
TECHNOLOGY
WINS AWARDS
MILARA WINS 4 VISION AWARDS IN 2 YEARS
FOR THEIR SUPERIOR PRINTING TECHNOLOGY

MILARA takes its combined system technology practice
one step further with the development of the new
SemiTouch Wafer Printer System (STW-1). Capable of
both wafer stencil printing and bumping within a single
system, the STW-1 is molded after Milara's standard
SemiTouch printer but offers significant advantages,
such as converting from wafter bumper to stencil
printer in just seconds, at the press of a button.
For ultra-fine-pitching printing (down to 70 m),
STW-1 uses a new vision system with accuracies of 12
m and patented vibration squeegee technology that
has proven viablity in wafter bumping. STW-1 offers
100 perfect printing reliability (no missed apertures on
wafers with excess of 25,000 per print) and unsurpassed
solder brick geometry.
MILARA HAS A MACHINE FOR ALL YOUR PCB AND PACKAGING APPLICATIONS
Milara Inc. 4 Marc Rd., Medway, MA, 02053

Contact Stephen Brodeur 508.533.5322 Fax: 508.533.8686 Email: Sales@milara.net
Advanced

u
u
0509AP_44 44
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM1:07:29
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
PRINT AND BUMP

WITH THE AWARD WINNING
MILARA SEMITOUCH
WAFER PRINTING SYSTEM
Milara now takes its combined system technology practice one step
further with the development of the new SemiTouch Wafer Printer
system (STW-1).The system is capable of both wafer stencil printing
and bumping within
a single system.The
STW-1 is molded
after Milaras standard
SemiTouch printer,
but offers signicant
advantages. One
important advantage is that by
pressing a single button, the system
converts itself from a wafer bumper to
stencil printer in seconds.
Milara has incorporated a new
vision system with accuracies of 12 m
that yields capabilities of ultra-nepitch printing. Utilizing their patented
vibration squeegee technology, which
has proven viability in wafer bumping,
the STW-1 employs the same
technology to accomplish ultra-ne
pitch-printing (down to 70 m) with
100 percent printing reliability (no
missed apertures on wafers with excess of
25,000 per print) in conjunction with
unsurpassed solder brick geometry.
MILARA HAS A MACHINE FOR ALL YOUR PCB AND PACKAGING APPLICATIONS
71 West Street, Medeld, MA 02652

508-359-2786 Fax 508-359-5533 Email: info@milara.net
Advanced

u
u
0509AP_45 45
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM1:07:33
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS
2005
F
3-D PACKAGING TECHNOLOGY
Package Stackable BGA

Amkor Technologys Package Stackable very-thin
fine-pitch Ball Grid Array (PSvfBGA) is a highdensity bottom package in a new JEDEC family
called Package on Package (PoP). PSvfBGA was

developed to address complete product requirements to achieve optimum cost and performance.
It eliminates the test, yield, and logistic obstacles
with stacked die assembly, provides OEMs with
full sourcing and product flexibility, and leads to
the reduction of the development required for
new device combinations. Amkor Technology,
Chandler, Ariz., www.amkor.com.
widths. Features
include a compact mold tool
or chase, which
can be changed
frequently, and a
pellet bowl feeding system that
dispenses various
epoxy molding
pellet diameters
at the turn of a knob. ASM Pacific Technology
Ltd., Hong Kong, www.asmpacific.com.
dispensing system, with needles for small dies

and a shower head for large dies, offers fast, precise adhesive application, with two online cameras that monitor exact substrate adjustment and
check for correct adhesive application. The dualhead flip chip bonding system ensures 8500-uph
throughput with 25-m at 3 process accura-
ENVIRONMENTALLY FRIENDLY
MATERIALS/SURFACE TREATMENT
Batch Washer
Focus-Wash is a combination of several wash
methods that focuses the wash solution into
cy. The adhesive cures with a multi-thermode

bond head, guaranteeing quick pitch change between 9.5 and 14.25 mm. Fully automatic covertape handling prevents thermode contamination
by adhesive. Datacon Technology AG, Radfeld,
Austria, www.datacon.at.
INSPECTION/IMAGING EQUIPMENT
Surface Inspection System
DIE ATTACH EQUIPMENT & MATERIALS/

HANDLING EQUIPMENT/FIXTURES
3Di All-Surfaces combines high accuracy and

speed to increase bump yields. The system is
able to inspect the front surface of wafers for
patterned area 2-D defects such as passivation,
excess residue, and missing, damaged, or satel-
Die Feeder
The DDf Ultra feeds a wide range of bare die and
flip chips with high throughput, and is mountable
to most placement machines. As a complement to
the DDf, the performance of DDf Ultra is
optimized around the
handling of small flip
chips. The DDf Ultra
is capable of feeding
die down to 0.5 mm
sq. with a throughput
exceeding 6,000 die/
hour with smaller die sizes and higher throughputs planned.
Hover-Davis Inc., Rochester, N.Y., www.hoverAAAAAAAAA
davis.com.
AAAAAAAA
smaller, higher-impact areas. Capabilities include

a spray system with a 15 spray angle, increasing
flow rate by approximately 60% to better reach
between boards, and a spray arm that uses 10
nozzles arranged to create 10 concentric spray
patterns. An oscillating board rack eliminates
blind spots by creating infinite impingement
angles. Multi-stage, high-performance spray
pump designs optimize the pump/nozzle design
to provide increased pump performance and efficiency. Aqueous Technologies Corp., Rancho
Cucamonga, Calif., www.aqueoustech.com.
DISPENSING/ENCAPSULATION/
MOLDING/UNDERFILL EQUIPMENT
& MATERIALS
FLIP CHIP ATTACH EQUIPMENT

& MATERIALS
Molding System
The 8800 FC Smart Line interlinks three machine modules: the 8800 FC Smart Line Flip Chip
Bonder with integrated dispenser, a curing station
with integrated electrical testing, and an optical
inspection and reject-marking unit. A dual-head
The Osprey system is fully programmable,

eliminating product-related part (PRP) conversion. The robust, highly flexible indexing technology can handle 90- to 300-mm leadframe
46
ADVANCED PACKAGING
Flip Chip Production Line
0509AP_46 46
NOVEL PACKAGE DESIGN
Etched Leadless Package

The etched leadless package, or ELP, package
family is based on a patented technology that
includes tight integration for an increased I/O
September 2005
Advanced

u
u
lite bumps. The system reports 3-D bump height

at production speeds, and is able to measure the
roughness of copper, gold, and solder bumps for
morphology. It combines high throughput and
high-accuracy bump and wafer inspection in one
system. August Technology Corp., Bloomington,
Minn., www.augusttech.com.
www.apmag.com
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:54:58
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F

count, reduced footprint to optimize board space,
and features that enable
electrical and thermal performance. It offers singulation that increases reliability at the die to
package interconnects, improves saw blade life,
and provides pre-singulation strip testing. The
new package family has no exposed metal on the
package sides, and the half-pattern leadframes
ensure a robust assembly process. Advanced
Interconnect Technologies, Sunnyvale, Calif.,
www.aitsales.com.
REFLOW EQUIPMENT
Induction Pump
The flat linear induction pump (FLIP) solder
bath for lead-free wave soldering solutions features linear induction pumping technology, in
which three phases of AC current flow through
induction coils to induce horizontal magnetic
fields inside a solder bath. The magnetic fields
generate vertical force (F) per Flemings left-
gy uses a single plane of contacts without moving

parts to offer repeatable dimensional placement
tolerance and electrical performance in meeting
the most aggressive roadmaps for package tests.
Advanced photolithography techniques result in
precise, flexible contact geometries with 3- to 4m repeatability. With lower touchdown force
between the contacts and the package, Quatrix
test sockets eliminate problems associated with
PACKAGE DESIGN SOFTWARE

& EQUIPMENT
Bond Wire Software Tool

The Bond Wire Optimizer is a stand-alone tool
that calculates clearances of bond wires based
on bond-wire profiles and X and Y die placement
hand law. The force moves molten solder upward through nozzles, which flows down by
gravity. Tamura H.A. Systems Inc., Beaverton,
Ore., www.tamura-ha.com.
tolerances. Advanced features include capillary
sequencing and capillary clearance checking
tools. These tools are for pre-manufacturing error
checking tools on the PC. CAD Design Software,
Los Gatos, Calif., www.cad-design.com.
QUALITY ASSURANCE/
MANAGEMENT TOOLS
Process Development Tool

The SlimKIC 2000 is designed to handle the
higher process temperatures required by leadfree assemblies, protecting product quality as it
is processed through the reflow process. The kit
includes a stainless-steel thermal barrier that offers heat protection up to 350C, and medium
temperature thermocouples rated up to 400C.

The optional KIC Auto-Focus provides the best
first guess and automatic optimized oven setup for difficult lead-free applications. KIC, San
Diego, Calif., www.kicthermal.com.
Laser Soldering System

The PRO-8 inline soldering station features a 60W diode laser with a 10,000-hour life, a 4-axis
Cartesian robot, a fiducial recognition system,
an air knife and fume extraction on the soldering lens, an automated solder feeder, and an optional Micro Camera interfaced into a high-resolution panel for real-time viewing. The laser can
be precisely controlled and is highly repeatable, providing a highly
focused heating
zone. Its process
speed results yield
solder-grain size
reduction and intermetallic oxide
formation. PRO-MATION Inc., Kenosha, Wis.,
www.pro-mation-inc.com.
SEMICONDUCTOR ASSEMBLY & TEST
SERVICES (SATS)
Package Test Technology

Developed as an alternative to traditional contactor methods using spring pins for test sockets, the
Quatrix photolithographic package test technolo-
www.apmag.com
Advanced

u
u
0509AP_47 47
the high combined forces encountered in highpin-count applications for chips with high-density I/O. Kulicke & Soffa Industries Inc., Willow
Grove, Pa., www.kns.com.
SPECIALIZED ADVANCED PACKAGING
RFID Assembly System

Reel-to-reel RFID assembly system includes
throughput up to 9,000 cph, a full, 20 wide
Web process capability, and 12-m placement
repeatability at 3 sigma. The system offers
either passive or active design, direct die pick

from wafers down to 0.008, and positive displacement dispense technology. The system features modular construction, allowing for future
capacity expansion. It is fully capable of placing
ancillary components, such as batteries, and it
also is capable of tape-and-reel die placement.
It uses complete closed loop process control on
the thermal compression station to ensure consistency of performance and high quality. The
cure station also provides pressure control of
each thermode, and real-time feedback pro-
September 2005
47
ADVANCED PACKAGING
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:55:08
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F

vides statistical process control. Tyco Electronics
Automation Group, Willow Grove, Pa.,
www.tycoelectronics.com.
user interface, IP-based access to DEKs knowledge servers through Interactiv, and HawkEye
on-board 100% print verification technology, it
enables next-generation manufacturing, maximizes uptime, and reduces cost of ownership.
DEK Printing Machines Ltd., Flemington, N.J.,
www.dek.com.
SUBSTRATE & SUBMOUNT EQUIPMENT

& MATERIALS
Ball Placement System

BP2000 provides dual motorized cameras attached to the pin transfer head, resulting in PR
alignments on two fiducial marks of the BGA
substrate before both flux and ball placement, so
it will not severely affect cycle time. With alignment calculation, both the pin transfer head and
WAFER-LEVEL PACKAGING
Wafer Printing System

The SemiTouch wafer printer system (STW-1)
is capable of both wafer stencil printing and
bumping within a single system. One important
between the microprocessor package and its de-
ball transfer head can correct its position with

respect to the substrate position in the X, Y, and
theta directions. ASM Pacific Technology Ltd.,
Hong Kong, www.asmpacific.com.
TESTING EQUIPMENT
Test Socket
The new Long Life ATE Socket was designed
and developed by Gryphics to provide a lower
cost, yet high performance alternative to existing Test Sockets used for QFN, QFP, or SO
style devices in
an Automated
High Volume
Production environment. The
unique design
incorporates a
polymer substrate populated wit high frequency test contacts
snapped into place, facilitating easy removal and
replacement of the contacts individually or as
a group. Special features on the contacts have
been designed to address the unique effects of
lead free solders. Gryphics Inc., Plymouth, Minn.,
www.gryphics.com.
vice-cooling heatsink and highly efficient transfer of heat away from the processor. It allows
manufacturers to achieve low thermal resistance
(0.07 cm2C/W) with thin bond lines (<25 m),
offering long-term thermal stability and enabling
pressure-independent processing. It also gives
users a wide process window to improve manufacturing consistency, repeatability, and overall yield. Dow Corning Corp., Midland, Mich.,
www.dowcorning.com.
WAFER DICING/THINNING EQUIPMENT
Mass Imaging Platform

Galaxy Micron-class high-accuracy mass imaging platform accurately places solder balls
at both the wafer and substrate levels, as well
as for ultra-fine-pitch print and reflow bumping. Equipped with ISCAN (Intelligent Scalable
Control Area Network) technology, the Instinctiv
THERMAL MANAGEMENT
TECHNOLOGY
Thermally Conductive Grease

TC-5022 thermally conductive grease offers a
10% to 15% reduction in thermal resistance,
according to customer testing, improving thermal performance. It provides a thermal path
48
ADVANCED PACKAGING
0509AP_48 48
WIRE BONDING EQUIPMENT
Wire Bonder
The Harrier dual-head gold/
copper wire bonder is equipped
with ASM-developed
motion control
and precise vision
technology, ensuring high speed
and placement accuracy with 50-m
pad pitch capability.
It also is capable of
achieving 6.3- to 43K throughput with a
wire count of 2 to
14 wires. Reverse
indexing and multi-tasking capabilities ensure complete independence of the two bond
heads. ASM Pacific Technology Ltd., Hong
Kong, www.asmpacific.com.
AP
September 2005
Advanced

u
u
advantage is that by pressing a single button,

the system converts itself from a wafer bumper to stencil printer in a short time, eliminating
changeover and facilitating the process. Milara
Inc., Medway, Mass., www.milarasmt.com.
www.apmag.com
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:55:20
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
Coming on Thursday Sept. 15, 2005 @ 2:00 ET U.S.

The Solid State Technology Nanotechnology Webcast
NANOTECHNOLOGY:
A Glimpse into the Future
Nanotechnology is one of the most promising
areas being explored to dramatically shrink
semiconductor features down to the nanometer range and beyond, potentially even
to molecular and atomic scales.
Solid State Technology magazine has
assembled a panel of experts from some of
todays leading nanotechnology programs
to participate in this special webcast. Solid
State Technology editorial director Robert
Haavind will moderate presentations by
Frank Robertson, coordinator of Intels
nanotechnology collaboration programs
with research groups worldwide, and
Dr. Ahmad Busnaina, who heads the
NSF Nanoscale Science & Engineering
Center at Northeastern University.
This webcast will look at three critical
aspects of nanotechnology developments
in the semiconductor field:
Device Technology - promising
electronic devices, application areas,
and nanotech inserted into CMOS process
flows; Nanomanufacturing - processing
techniques, differences from traditional
manufacturing; and Nanotechnology
Programs - what they are, funding
expectations and goals.
To reserve your sponsorship

today, contact a sales
representatives.
U.S. East, Northwest,
Southwest & Canada
Paul Weingartner: ph: 603.891.9211;
e-mail: paulw@pennwell.com
U.S. Midwest & Silicon Valley
Kris Collins: ph: 630.910.9876;
e-mail: kristinec@pennwell.com
Digital Media
Bob Collopy: ph: 603.891.9424
e-mail: bobc@pennwell.com
Attendees will then participate in a

follow-up Q&A discussion with the
panelists online. We aim to make this
one of the most informative sessions to
date on the future of nanotechnology
and its impact on readers and online
users of Solid State Technology.
SPACE AVAILABLE:
Maximum 5 sponsors, first-come, first-served.
0509AP_49 49
1. Moderator begins the Nanotechnology

Webcast by audibly recognizing your company
as a key sponsor.
2. Your company logo is listed on the introductory page and every following page of the
Nanotechnology Webcast presentation for
maximum exposure!
3. Sales Leads! Receive complete contact information for all who register for the Webcast.
4. Comprehensive promotion of Nanotechnology
Webcasts as follows:
Print: Pre and post webcast promotional advertising in Solid State Technology, Advanced Packaging,
Clean Rooms, and Laser Focus World.
Online: On our website; www.solid-state.com and
in SSTs weekly e-newsletter Semiconductor Weekly.
E-mail Blasts: 4 FREE e-mail blast promotions:
30 days before the Webcast,
14 days prior to Webcast
2 days before the Webcast (to remind
pre-registrants to participate)
and a post-event e-mail blast to remind
industry professionals to view the archived
Nanotechnology Webcast on our website:
www.solid-state.com.
COST: $5,000 gross/per sponsor

(maximum of 5 sponsors)
5. The Webcast will be promoted and archived

on SSTs website for 12 months following the
presentation, allowing for year-round exposure
and continuous sales leads!
Reprints, Classieds,
Recruitment
Maureen Kane: ph: 603.891.9423;
e-mail: maureenk@pennwell.com
Italy
Jean-Pierre Bruel:
ph: 39.03.175.1494;
e-mail: medias@pcbrianza.net
France, Netherlands, Belgium,

W. Switzerland, Spain, Greece,
Portugal, Andorra, Monaco
Luis Matutano: ph: 33.1.4791.7011;
e-mail: luism@pennwell.com
Japan
Manami Konishi:
ph: 81.3.5771.8886;
e-mail: manami.konishi@ex-press.jp
United Kingdom, Scandinavia

Amanda Loftus: ph: 44.1793.862111;
e-mail: amandal@pennwell.com
Germany, Austria, N. Switzerland, Eastern Europe, Liechtenstein, Russia
Johann Bylek: ph: 49.89.904.80.143;
e-mail: johannb@pennwell.com
Singapore
Adeline Lam: ph: 65.6.836.2272;
e-mail: alam@publicitas.com
Korea
Chi-luck Kim ph: 822.574.2466;
e-mail: seminews@semiconnews.
co.kr
Advanced

u
u
SPONSORSHIP FEATURES/
BENEFITS:
Hong Kong, China

Adonis Mak: ph: 852.2.838.6298;
e-mail: adonism@actintl.com.hk
Taiwan
Cindy Yang: ph: 886.2.2396.5128 ;
e-mail: cindy@arco.com.tw
India
Rajan Sharmai: ph: 91.11.686.1113;
e-mail: rajan@interadsindia.com
Israel
Dan Aronovic: ph: 972.9.899.5813;
e-mail: rhodanny@actcom.co.il
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:55:31
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
Once again, congratulations to this years

winners of the Advanced Packaging Awards!
We look forward to
seeing you at next years
celebration.
Advanced

u
u
0509AP_50 50
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:55:44
PM
F
Advanced

u
u
NEW
Front Cover
Search Issue
Next Page EMaGS

F
PRODUCTS
2005 products
Assembly Cell
The Integrated Process Assembly Cell (IPAC)
is a continuously configurable, modular platform that mixes high-volume SMT manufacturing with advanced microelectronics in one
machine. Four modules configure for die attach/flip chip, dispenser, chipshooter, and oddform components. Its
<1-m footprint allows it
to fit into small spaces. It
can handle back-end assembly markets such as
SiP and 3-D assembly.
The dispensing configuration handles underfill,
dam and fill, flux spray,
solder paste, thermal
compounds, die attach
adhesive, and sealants using the appropriate pump, pis-
ton, auger, or jet. Die attach/flip chip configuration features include capability for die
placement accuracy down to 10 m, duallane and dual-gantry design up to 5,000 uph,
300-mm WDE, tape-and-reel and direct-die
feeding supply options, and precision mountforce control. Panasonic Factory Solutions Co.,
Elgin, Ill., www.panasonic.com.
Booth #333
Wafer Prober
The BlueRay semiautomatic wafer prober incorporates Z-axis accuracy and communication for high-speed testing of optoelectronic devices. It guarantees repeatable electric
contact with the device under test (DUT), reducing pad damage and eliminating probemark inspections. It optimizes communication
between the prober and the controller to provide
a fast cycle time. Because it is semiautomatic,
it allows manufacturers to automate test pro-
cesses. SUSS MicroTec AG, Munich, Germany,

www.suss.com.
Booth #203
Work Cell
The MRSI-M5 5-m work cell provides advanced
solutions for complex epoxy die attach, eutectic, and flip chip bonding for microwave modules, RF circuits, MEMS, advanced semiconductor packages, multi-chip modules, hybrid
devices, and photonic packages. Its entire base
is formed of a cast polymer composite engineered
Leeno is a leader in high performance

semiconductor probes, providing the test
market with unique cost effective solutions.
Measured band width available > 30 Ghz
CRES available of < 20 mOhms
No charge for custom designs
All manufacturing and assembly
performed in a modern, state of the
art facility, with no outsourcing
insuring tight quality control
For your quotation
or catalog contact:
Gordon LaPorte GLaPorte@Qualmax.com
or 209.892.3401
www.leenoqualmax.com
Exclusive Distributor, Corporate Office
Qualmax, 2013 Sandy Dr., Suite 101, State College, PA 16803,Tel 814.234.8500
www.apmag.com
Advanced

u
u
0509AP_51 51
September 2005
51
ADVANCED PACKAGING
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM1:08:45
PM
F
Advanced

u
u
NEW
Front Cover
Search Issue
Next Page EMaGS

F
PRODUCTS
for its thermal stability and vibration-dampening

properties. A large work area accommodates a
eutectic stage, 60 waffle packs, 10 tape feeders,
and a conveyor. Its material handling conveyor operates in-line or cassetteto-cassette. Feathertouch force control,
combined with closedloop force
feedback,
provides
the ability
to handle delicate devices,
such as GaAs and
InP, without damage to internal die
features. 360 orientation and pattern matching
enables vision processing for challenging die and
FLEX LINE
SP003 vertical lift,
substrate materials. Newport Corp., North Billerica,

Mass., www.newport.com. Booth #612
Dispensing System
The Spectrum S-820 Series system offers dispensing for batch
production, such
as jetting underfill for flip chips
and chip scale
packages. With
Fluidmove for
Windows XP software, the dispensing programs and
processes port directly to the in-line
Axiom systems.
Clear front, top,
and side panels facilitate viewing while dispensing and help to access parts in the dispense
area. A built-in vertical syringe holder provides
a queue for thawing material prior to production. It integrates with most jets, pumps, and
valves, including the DispenseJet DJ-9000 and
Heli-flow DV-7000 valve. Asymtek, Carlsbad,
Calif., www.asymtek.com. Booth #645
Bond Tester
The Series 4000HS measures solder-bond reliability without applying force. It performs both
4-m/s shear pull and 1.3-m/s cold bump pull
Be More Flexible
mortised stencil printer

(CBP) with industry-standard jaw technology.
High-bandwidth force measurement transducers and an air-bearing, frictionless intelligent load
cartridge system provide shear height control.
Features include built-in automatic safety guards
with interlocks and an on-board results package,
including Stats, CpK, and some SPC functions.
Dage Precision Industries Inc., Fremont, Calif.,
www.dageinc.com. Booth #500
CSM7100 4,000 cph

pick & place machine
with laser centering, auto
fiducial finding, and up to
100 intelligent feeders
RO300FC full convection
reflow oven for lead-free.
HYFLEX LINE
SP200-AV finepitch,
Automatic Vision Adjust
stencil printer
FLX2010 Super Flexible
placer with extra large
PCB size and huge feeder
capacity
RO400FC reflow oven with
very low Delta T. Ready for
lead-free.
Visit ATE
booth #5800
52
ADVANCED PACKAGING
Essemtec USA Glassboro, NJ 08028

Phone: 856-218-1131 Fax: 856-218-1134
Email: sales@essemtec-usa.com www.essemtec.com
September 2005
Advanced

u
u
0509AP_52 52
Test and Burn-in Socket

The Textool BGA open-top socket with 1.0-mm
pitch uses modular, injection-molded bodies and
stamp-and-form contacts for high-end logic,
PBGA, MCM, and SiP devices. This Type III socket is designed for burn-in of BGA packages up to
47.5 mm2 and
lead counts to
2025. A nestcomb design
allows full
matrix array
applications
with minimal
Z-axis warp.
A Micro-wiping contact
scrubs device leads, removing the oxide layer
from solder balls and contaminants from the
contact surface. 3M Electronics, Austin, Texas,
www.3m.com/electronics. Booth #106
AP
www.apmag.com
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM1:08:51
PM
F
Advanced

u
u
ATV TECHNOLOGY, INC.
ATV Technology, Inc. offers the most energy efficient thermal

processing equipment available, including Solder Reflow
Ovens, Atomic Layer Deposition, and Wafer Bonding systems.
Our Programmable Process Furnaces have a compact footprint
and excellent temperature uniformity. Also from ATV are
products for R&D and pre-production including Diamond
Scribers, Hot Plates and Micromanipulator Systems and the
LTCC Sintering Press.
Next Page EMaGS

F
the new world of

advanced packaging
Hybrid Die Bonding Requirements?

Keep Pace with Technology from Datacon
The key to your success

QFN assembly at NS Electronics
Bangkok. The highly reliable
advanced leadless packages from
NSEB lead the industry in Pb-free,
Green, 260c compatible assembly.
- World class assembly and test
cycle time.
- World class quality
- Room to grow (site 2 qualified)
- Knowledgeable and well trained
sales and customer service.
- Extensive R&D on advanced
packages.
Please contact Jerry Kirby at
jkirby@nseb.com, 408-749-9155,
ext. 104.
Search Issue
AP marketplace
21 Concord Street
North Reading, MA 01864
(800) 883-4288 or (978) 664-1948
Fax: (978) 664-4819
www.atv-tech.com
E-mail: atvtec@att.net
AP industry directory
THERMAL PROCESSING
EQUIPMENT
Front Cover
The Datacon 2200 apm+ helps you keep

pace with the latest hybrid die bonding
technologies. From stringent military and
medical applications to the hottest
new automotive electronics Datacon
provides users around the globe with
hybrid die bonding solutions that offer
extraordinary flexibility and accuracy with
minimal space requirements.
Visit us at www.datacon.at
Datacon Technology AG, Innstrasse 16, 6240 Radfeld, Austria,

Tel.: +43 5337 600-0, Fax: +43 5337 600-660, info@datacon.at, www.datacon.at
www.datacon.at
www.nseb.com
POSITION: Package Layout Designer

Responsibilities include working with customers and BDI SI engineering team to perform package layout with the objective to optimize the
package for cost and performance.
tively seek ways to optimize package design and streamline modeling

techniques. Primary areas of focus will be signal integrity and power
distribution issues associated with high performance designs.
POSITION: Signal Integrity Engineer
SKILLS/EXPERIENCE:
Minimum of 3 years experience in the eld of signal integrity and
high speed digital design.
Have worked on designs that have gone through full product
introduction and eld deployment.
Strong knowledge of Cadence SpecctraQuest and SigXP, HSpice,
IBIS and Sigrity Tools. Experience with Ansoft HFSS, Ansoft Q3D,
and/or Agilent ADS a plus.
Procient with high speed serial and parallel interfaces ie XAUI,
PCI-Express, GE, DDR2, QDR, SATA, SAS
Experience with optimizing power distribution throughout board
and package.
Able to condense complex simulation results into concise presentation.
Working knowledge of IC package technology and industry signal
integrity issues and trends.
Responsibilities would include performing signal integrity analysis and

providing electrical design expertise for IC package and board product
design. This job requires interfacing with customers IC design, package, board and reference platform design teams. Expected to proac-
EDUCATION REQUIREMENTS:
BSEE with 5+ years or MSEE with 3+ years experience related to signal
integrity.
SKILLS/EXPERIENCE:
Minimum of 3 years experience doing package layout.
Procient in Cadence APD or equivalent package layout tool
with ability/drive to learn APD.
Must possess good knowledge of Flip Chip and Wire Bond
technologies.
Knowledge of scripting or programming language (skill, perl,
Excel) will be a plus.
Excellent oral and written communication skills.
EDUCATION REQUIREMENTS:
Diploma or Higher Education preferred.
www.apmag.com
Advanced

u
u
0509AP_53 53
AP classified
Bayside Design Inc (BDI), a self funded startup, was incorporated in Dec 2002 and its main focus is to provide
high speed interconnect design services. We are looking for self motivated individuals with passion and drive to make
our company grow. Our environment is ideal for the self-starting engineer providing intellectual challenge and a wide
breadth of opportunities. We are not just a design services company but offer opportunity to work on leading edge
customer product design challenges. Compensation and benets are very competitive. We have strategic partnerships with leading Electronic Design Automation companies and have over fty customers from around the globe. We
are growing and have the following openings. To apply please write to info@baysidedesign.com
September 2005
53
ADVANCED PACKAGING
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM1:09:00
PM
F
Advanced
Front Cover
Search Issue
New Manual Wire Bonder
Next Page EMaGS

F
Newport Corporation,
the World Leader in
Automated Dispense and
Assembly Equipment
F&K Delvotec introduces a

completely new series of manual
wire bonders that offer both ball
and wedge bonding capability for
Au and Al wire applications. These
modern and simple to operate
machines are perfect for small labs
and R&D facilities. The pure Z linear
motion and LCD programming
interface offer the modern features
for todays applications while staying
within the purchasing budget.
For more information call us at
949-595-2200 or visit us on the
web at
Eutectic bonding
Epoxy die attach
Flip chip
Conductive epoxy dispensing
Contact Newport at
(978) 667-9449
sales@ma.newport.com
www.fkdelvotec.com
www.newport.com
Adhesive and Sealant

Custom Packaging Services
Solder Reflow Ovens SRO 702/704/706
APS packages two-component

reactive adhesives and sealants in
A-PAK flexible pouches, pre-mixed
and frozen syringes and cartridges
and various dual cartridge systems.
Dual cartridge systems are available
with mixing nozzles, dispensing guns
and other accessories.
For a Free Sample using your supplied
material and for more information on
other Custom Services, call...
1 (800) 222-1117
www.adhesivepackaging.com
sales@adhesivepackaging.com
FINEPLACER System
AP marketplace

u
u
FLIP CHIP BONDER

+/- 5 Micron Placement Accuracy
Mu
usi proc ltiple
ng ess
sys a sin es
tem gle
Wafer Bonding
Vacuum Processing
Overpressure to 30 psi
Maximum Temp. 450
Hydrogen Safety System
Wafer Solder Bump Reflow
Annealing
Au Ge Alloying
Ga As Processes
Fluxless Soldering
Flat Pack Encapsulation
ATV Technology, Inc.

21 Concord Street, North Reading, MA 01864
(800) 883-4288 or (978) 664-1948
Fax: (978) 664-4819
email: atvtec@att.net
Pico System
www.atv-tech.com
PhotoMachining, Inc. performs
precision laser micromachining on
a variety of different materials
including plastics, metals, glass,
ceramics, etc. Our eleven different
types of lasers allow us wide
flexibility to address many
applications. We also design and
manufacture custom laser machine
tools.
Contact sales@photomachining.com,
or phone 603-882-9944.
Opto-electronic component assembly

Thermocompression bonding
Ultrasonic / Thermosonic bonding
Eutectic (C4, AuSn) Soldering
Chip on Glass
UV Cure
Dispensing / Stamping
480-893-1630
finetechusa.com
www.finetechusa.com
54
ADVANCED PACKAGING
September 2005
Advanced

u
u
0509AP_54 54
www.photomachining.com
www.apmag.com
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM1:09:07
PM
F
Advanced

u
u
A D V E R T I S E R
Front Cover
Search Issue
advertiser
54
Adhesive Packaging Specialties
21
Advanced Packaging Magazine
www.apmag.com
15
Advanced Technical Ceramics
www.AdTechCeramics.com
website
38-39
Amkor Technology
www.amkor.com
34-35
Aqueous
www.aqueoustech.com
26
Aspen Technologies
www.aspentechnologies.net
19
Asymtek
www.dispensejet.com
23
AT Expo
www.atexpo.com
53, 54
ATV Technology
www.atv-tech.com
53
Bayside Design Inc.
www.baysidedesign.com
Carsem
www.carsem.com
16
Chemsultants
www.chemsultants.com
40-41, 53
Datacon GmbH
www.datacon.at, www.besi.com
52
Essemtec
www.essemtec.com
CV2, 54
F & K Delvotec
www.fkdelvotec.com
13
Feinfocus
www.comet.ch
54
Finetech
www.finetechusa.com
Heraeus
www.4cmd.com
CV3
Honeywell
www.honeywell.com/sites/sm/em/
36-37
Hover Davis
www.hoverdavis.com
28
IMAPS
www.imaps2005.org
CV4
INDIUM
www.indium.com
27
Intertech Corporation
www.intertechusa.com/orfid.htm
42-43
KIC
www.kicthermal.com
Lead-Free Webinar Series
www.apmag.com/webcasts
March Plasma
www.marchplasma.com
12
Messe Muenchen GmbH
www.productronica.com
44-45
Milara Inc.
www.milara.net
3, 54
Newport Corp.
www.newport.com
53
NS Electronics USA
www.nseb.com
Nusil
www.nusil.com
17
Palomar Technologies
www.palomartechnologies.com
54
Photomachining, Inc.
www.photomachining.com
51
Qualmax
www.qualmax.com
10
Saes Getters
www.saesgetters.com
PUBLISHER
Jay Regan
603-891-9126; Fax: 603-891-9328
jregan@pennwell.com
UNITED STATES
AND CANADA
SALES MANAGER
Kathy Poggi
603-891-9361; Fax: 603-891-9297
kpoggi@pennwell.com
INTERNET SALES MANAGER
Shaun Shen
650-281-6868; Fax: 408-370-9585
sshen@pennnet.com
DIRECT MARKETING
REPRESENTATIVE/
ARTICLE REPRINTS
Rhonda Charron
603-891-9121; Fax: 603-891-9328
rhondac@pennwell.com
LIST RENTAL
Bob Dromgoole
603-891-9128; Fax: 603-891-9272
bobd@pennwell.com
AD TRAFFIC MANAGER
Richard Shepard
918-831-9519; Fax: 918-831-9415
richards@pennwell.com
MARKETING
COMMUNICATIONS
MANAGER
Deborah Rodriguez
603-891-9482; Fax: 603-891-9290
deborahr@pennwell.com
PUBLISHERS ASSISTANT
Barbara Scacco
603-891-9156; Fax: 603-891-9328
barbaras@pennwell.com
UNITED KINGDOM,
SCANDINAVIA
Luis Matutano
33-1-47-91-70-11;
Fax: 33-1-55-02-03-85
luism@pennwell.com
GERMANY, AUSTRIA,
N. SWITZERLAND,
EASTERN EUROPE
Johann Bylek
49-89-904-80-144;
Fax: 49-89-904-80-145
johannb@pennwell.com
HONG KONG, CHINA
TAIWAN
49
SST Nanotechnology Webcast
www.solid-state.com
Tyco
11
Ultratech
www.ultratech.com/ap2
www.apmag.com
Advanced
Jean-Pierre Bruel
Medias International
39-03-1751494; Fax: 39-03-1751482
medias@pcbrianza.net
Adonis Mak, Act International
852-2-838-6298;
Fax: 852-2-838-2766
adonism@actintl.com.hk
Grace Wu, Vicky Kung
Arco Publications
886-2-2396-5128;
Fax: 886-2-2395-9571
or 866-2-2393-8815
vicky@arco.com.tw
JAPAN
Manami Konishi, e.x. press Co., Ltd.

81-3-5771-8886;
Fax: 81-3-5771-8887
manami.konishi@ex-press.jp
KOREA
Wan Sik Yang, Chom Dan Inc.

82-2-322-0525; Fax: 82-2-323-5324
yws51@chomdan.co.kr
This ad index is published as a service. Advanced Packaging does not assume any liability for errors or omissions.
September 2005, Volume 14, Number 9 2005 Advanced Packaging (ISSN 1065-0555) is published 12 times a year, monthly, by PennWell
Corp., 1421 South Sheridan Road, Tulsa, OK 74112; telephone 918-835-3161; fax 918-831-9497; Web address http://www.pennwell.com. All
rights reserved. Subscriptions: 847-559-7500, 7:30 a.m.-6 p.m. CST. U.S., $85; Canada, $115; International Air, $172; one year (12 issues); Single
copy issue: U.S., $12; Canada, $15; Intl single, $17; US/Canada Buyers Guide, $75; Intl Buyers Guide, $95. POSTMASTER: send address changes
to Advanced Packaging, P.O. Box 3425, Northbrook, IL 60065. Return undeliverable Canadian addresses to Advanced Packaging,P.
O. Box 122, Niagara Falls, ON L2E 6S4 Canada. Periodicals Postage Paid at Tulsa, OK, and at additional mailing offices. We make portions of our
subscriber list available to carefully screened companies that offer products and services that may be important for your work. If you do not want to
receive these offers and/or information, please let us know by contacting us at List Services, 98 Spit Brook Road, Nashua, NH 03062-5737.
Printed in the USA.
GST No. 126813153.
Publications Mail Agreement No. 40052420.
Amanda Loftus
44-1793-862111;
Fax: 44-1793-862110
amandal@pennwell.com
FRANCE, BELGIUM, SPAIN,

NETHERLANDS,
S. SWITZERLAND, PORTUGAL
ITALY
32-33
0509AP_55 55
I N D E X
page

u
u
Next Page EMaGS
SINGAPORE, THAILAND,
MALAYSIA & INDONESIA
EXECUTIVE OFFICES
September 2005
Adeline Lam
65-6-836-2272;
Fax: 65-6-735-9653
alam@publicitas.com
Advanced Technology Division
98 Spit Brook Road
Nashua, NH 03062-5737
Tel: 603-891-0123
55
ADVANCED PACKAGING
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM1:11:22
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
EDITORIAL BOARD
OPTOELECTRONICS
Optoelectronics Packaging
espite the crushing blow dealt to

the optoelectronics industry following the dot-com boom, research in the area continues because of the continuing allure of the benefits
that technology promises. Fortunately, the
world of photonics is not small, so not every facet of the sector was hit badly. While
much attention has been given to telecom
and datacom applications, photonics actually embraces many technologies, including
data storage, image sensors, displays, and
lighting, and serves a wider range of products, from cell phones to automobiles.
Still, the extreme bandwidth potential of
optoelectronics is undeniably attractive. As
a solution for long-haul data transmission, it
is the technology of choice; however, there
has been considerable reconsideration in
determining where the bright line is relative to where optoelectronics should start
and stop. That line is made less bright and
more diffused, as simpler and more pervasive copper-based interconnection technologies continue to make significant performance strides. There has already been a lab
demonstration of OC-768 performance (40
Gbps) in a 2-connector, 30-in. copper backplane channel, meeting a benchmark that
was presumed to require an optical solution. But it is clear that photonics in general, specifically optoelectronics, will continue to play an important role, and research
should explore new solutions in the anticipation that there will likely one day be a true
optical transistor.
That aside, optoelectronics packaging has
progressed slowly in the last few years, following the reduced pace of the telecom industry and its latent recovery. Recently, the
industry has begun to see signs of a solidifying turnaround. A situation analysis prepared by Prismark for NEMI last year noted
that global production of communications
equipment driven primarily by Internet use
was expected to increase at an average rate
56
ADVANCED PACKAGING
of 6.5% per year and reach $226B in 2008. Indications are that research and development continues at a modest and measured pace. With the wounds still sore,
it appears that caution and certainty have replaced the unbridled risk-taking of
the late 1990s.
With respect to optoelectronics packaging, the challenges remain the same. With
reliable mass assembly methods and standards still elusive, cost continues to be a
drag on expanded use of the technology. As a result, packaging cost remains high,
and there is still much hand-soldering and many competing designs. Moreover,
there are vexing, but solvable, problems associated with thermal issues related to
the vertical-cavity surface-emitting lasers (VCSELs) used to transmit and receive
photons. The lasers must be kept at exactly the same wavelength to communicate
properly, and the operation temperatures of these devices must be controlled,
lest the wavelength vary. This requires active cooling, which can prove to be both
costly and energy-intensive.
As for general package types for optoelectronic applications, they include
transmitters, receivers, modulators, VCSELs, and diode arrays. The packages
can be non-hermetic or near-hermetic. TO-cans and butterfly packages remain
common choices alongside newer BGAs. However, more advanced structures are
being proposed, such as optical-RF modules and flip-mounted optoelectronic
chip structures having VCSEL arrays with an optical underfill. The latter structures are designed to couple to optical-waveguide layers at a 90 angle. There is
also ongoing research in developing thin film lasers and photo detectors, which
could cause a change in direction or a new set of requirements.
Economic and technological challenges for optoelectronics are similar to those
facing electronics-only packages; however, optoelectronics have their own set of
concerns, such as waveguide coupling and fiber alignment. Components often have
pigtailed fiber, requiring a connector or fiber splicing, or a connector receptacle
or port as part of the package. RF connections also figure prominently because of
the bandwidth and high frequency associated with optoelectronics. Because they
tend to be hybrid in structure, integration of somewhat disparate technologies
creates assembly challenges. Finally, optoelectronics are not immune to matters
of reliability and environmental condition concerns.
One can say that photonics and optoelectronics have a bright future, but there
will continue to be challenges to meet and overcome for full benefit in a cost-effective manner. Having challenges is important because, paraphrasing the poet Robert
Browning, Our grasp should exceed our reach, what else is research for?
AP
References
1. Merritt, R., Board Design Revamped, Electronic Engineering Times, Oct. 13, 2003.
2. Turbini, L. and Stafford, J., Optoelectronic, The 10th Anniversary NEMI Roadmap Workshop, June,
2004.
3. Shibata, A., Status of IEC, IPC/JPCA Optoelectronics Standards, JISSO International Council Meeting, Herndon, VA, May, 2005.
JOE FJELSTAD, founder and principal, may be contacted at SiliconPipe, Inc., 992 DeAnza Blvd., San
Jose, CA 95129; 408/973-1744, e-mail: jfjelstad@sipipe.com.
September 2005
Advanced

u
u
0509AP_56 56
www.apmag.com
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM1:11:28
PM
F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
Advanced

u
u
Front Cover
Search Issue
Next Page EMaGS

F
Semiconductor
Assembly
Materials
Wafer & Chip
Bumping
Specialty Solders &

Specialty Assemblies
} Wafer Bumping Solder Pastes

} Wafer Bumping Fluxes
} Flip-Chip Fluxes
Power Semiconductor
Assembly Materials
} Die-Attach Solder Paste
} Die-Attach Solder Wire
} Die-Attach Solder Preforms
} Hermetic Package Sealing

} Eutectic AuSn Die-Attach Solder
} Materials for: MEMS, RF, Photonics
Semiconductor Packaging
Assembly Materials
} BGA Solder Spheres
} Ball-Attach Fluxes
} Thermal Interface Materials
www .indium.com
AAAAAAAAAAAAAAA
S O L D E R
askus @ indium.com
PRC +86 (0)512 6 28 34900
SINGAPORE +65 6 268 8678
UK +44 (0) 1908 580 400
USA +1 315 853 4900
See
Mexitronica,
See
usus
atat
Semicon
West,Booth
Booth608
8632
Advanced

u
u
0509AP_CV4 CV4
Front Cover
Search Issue
aGS
Next Page 8/26/05
EM12:11:44
PM
F

2005 Sep AdvancedPkg

Uploaded by

Document Information

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

2005 Sep AdvancedPkg

Uploaded by

Copyright:

Available Formats

Contents

For navigation instructions please click here

THE INTERNATIONAL MAGAZINE FOR ELECTRONIC PACKAGING APPLICATIONS

For navigation instructions please click here

Next Page EMaGS

Heavy Wire Bonder

Fine Wire Bonder

Gold Ball Bonder

Innovative Technology Defines The

+49 (89) 62 995-0

+65 (6890) 6020

Next Page EMaGS

Its rough in the semiconductor jungle

Heraeus is your machete.

Circuit provided courtesy of Agere Systems Inc.

Two of the industry's top three SiP assemblers depend

Circuit Materials Division

Next Page EMaGS

PUBLISHER Jay Regan

EDITOR-IN-CHIEF Gail B. Flower

ASSISTANT EDITOR Lee Mather

SILICON VALLEY OFFICE Julia Goldstein

EDITORIAL OFFICES Communications and

ART DIRECTOR Kelli Paquette-Mylchreest

SENIOR VICE PRESIDENT David Janoff

Advanced Packaging magazine is published

Advanced Previous Page

Next Page EMaGS

Some people just cant wait to see the new

2005 Newport Corporation

Next Page EMaGS

The Carsem MLP Advantage

Carsems comprehensive selection of cost-effective

your designs. Carsem also offers turnkey services including RF testing.

competitive advantage you need.

Next Page EMaGS

14 Troubleshooting Underfill Void Elimination

20 MEMS Packaging Update

24 Building on a Basic X-ray Inspection Platform

51 IMAPS 2005 Product Preview

Next Page EMaGS

Precious moments. Shared when youre not there.

Whats your challenge?

What? When? Where? If its NuSil, its no problem.

Next Page EMaGS

A Breath of Fresh Air

omeone once said that

EDITORIAL ADVISORY BOARD

Nasser Grayeli, Ph.D.

Rao R. Tummala, Ph.D.

George Riley, Ph.D.

R. Wayne Johnson, Ph.D.

Next Page EMaGS

Intel to Build 300-mm Wafer Factory

40% less energy and water per chip than

SEMI Appoints New Board Chair,

pointed Ed Segal, senior advisor to Metron Technology, as chairman of SEMIs

Segal served as CEO of Metron from

SHANGHAI, CHINA PennWell and

SMT China International

Next Page EMaGS

Lead-Free Webinar Series

ASSEMBLY & MANUFACTURING

Participate in the discussion.

/NLY5LTRATECHDELIVERSTHEBESTPRICE TO PERFORMANCERATIOINTHEINDUSTRY!.$x