Professional Documents
Culture Documents
ChapterOutline
5.1DeviceStructureandPhysicalOperation
5.2CurrentVoltageCharacteristics
5.3MOSFETCircuitsatDC
5.4ApplyingtheMOSFETinAmplifierDesign
5.5SmallSignalOperationandModels
5.6BasicMOSFETAmplifierConfigurations
5.7BiasinginMOSAmplifierCircuits
5.8DiscreteCircuitMOSAmplifiers
5.9TheBodyEffectandOtherTopics
NTUEEElectronics L.H.Lu
51
5.1DeviceStructureandPhysicalOperation
DevicestructureofMOSFET
MOS metaloxidesemiconductorstructure
MOSFETisafourterminaldevice:gate(G),source(S),drain(D)andbody(B)
Thedevicesize(channelregion)isspecifiedbychannelwidth(W)andchannellength(L)
TwokindsofMOSFETs:nchannel(NMOS)andpchannel(PMOS)devices
Thedevicestructureisbasicallysymmetricintermsofdrainandsource
Sourceanddrainterminalsarespecifiedbytheoperationvoltage
NTUEEElectronics L.H.Lu
52
Operationwithzerogatevoltage
TheMOSstructureformaparallelplateplatecapacitorwithgateoxidelayerinthemiddle
Twopn junctions(SBandDB)areconnectedasbacktobackdiodes
Thesourceanddrainterminalsareisolatedbytwodepletionregionswithoutconductingcurrent
TheoperatingprincipleswillbeintroducedbyusingthenchannelMOSFETasanexample
Creatingachannelforcurrentflow
Positivechargesaccumulateingateasapositivevoltageappliestogateelectrode
Electricfieldformsadepletionregionbypushingholesinptypesubstrateawayfromthesurface
Electronsaccumulateonthesubstratesurfaceasgatevoltageexceedsathresholdvoltage Vt
Theinducedn regionthusformsachannel forcurrentflowfromdraintosource
Thechanneliscreatedbyinvertingthesubstratesurfacefromptypetontype inversionlayer
Thefieldcontrolstheamountofchargeinthechannelanddeterminesthechannelconductivity
NTUEEElectronics L.H.Lu
53
Applyingasmalldrainvoltage
ApositivevGS >Vt isusedtoinducethechannel nchannelenhancementtype MOSFET
FreeelectronstravelfromsourcetodrainthroughtheinducednchannelduetoasmallvDS
ThecurrentiD flowsfromdraintosource(oppositetothedirectionoftheflowofnegativecharge)
Thecurrentisproportionaltothenumberofcarriersintheinducedchannel
Thechanneliscontrolledbytheeffectivevoltage oroverdrivevoltage:vOV vGSVt
Theelectronchargeinthechannelduetotheoverdrivevoltage:|Q|=CoxWLvOV
GateoxidecapacitanceCox isdefinedascapacitanceperunitarea
MOSFETcanbeapproximatedasalinearresistorinthisregionwitharesistancevalueinversely
proportionaltotheexcessgatevoltage
iD (mA)
vGS =Vt +4V
0.4
0.3
0.2
0.1
100
NTUEEElectronics L.H.Lu
200
vGS Vt
vDS (mV)
54
Operationasincreasingdrainvoltage
AsvDS increases,thevoltagealongthechannelincreasesfrom0tovDS
ThevoltagebetweenthegateandthepointsalongthechanneldecreasesfromvGS atthesource
endto(vGSvDS)atthedrainend
SincetheinversionlayerdependsonthevoltagedifferenceacrosstheMOSstructure,increasing
vDS willresultinataperedchannel
TheresistanceincreasesduetotaperedchannelandtheiDvDS curveisnolongerastraightline
AtthepointvDSsat =vGSVt ,thechannelispinchedoffatthedrainside
IncreasingvDS beyondthisvaluehaslittleeffectonthechannelshapeandiD saturatesatthisvalue
Trioderegion:vDS <vDSsat
Saturationregion:vDS vDSsat
Gate
vGS Vt
vGS
vDS
0
Source
Channel
Drain
vDS
vDS =0
vDS =vGS Vt
NTUEEElectronics L.H.Lu
55
DerivationoftheIVrelationship
InducedchargeinthechannelduetoMOScapacitor:
QI ( x) Cox [vGS Vt v( x)]
EquivalentresistancedR alongthechannel:
dR
dx
dx
IVderivations:
dv iD dR
v DS
C
n
iD dx
iD dx
W [vGS Vt v( x)]dv iD dx
ox
iD nCox
W
1 2
[(vGS Vt )vDS vDS
]
L
2
Processtransconductance parameter(A/V2):kn=nCox
Aspectratio:W/L
Transconductance parameter(A/V2):kn=nCox(W/L)
DraincurrentofMOSFETs:
1 2
]
Trioderegion: iD k n [(vGS Vt )vDS vDS
Saturationregion: iDsat
2
1
k n (vGS Vt ) 2
2
Onresistance(channelresistanceforsmallvDS):
rDS 1 / k n (vGS Vt )
NTUEEElectronics L.H.Lu
56
ThepchannelenhancementtypeMOSFET
pchannelenhancedtypeMOSFETsarefabricatedonntypesubstratewithp+ sourceandp+ drain
Normally,sourceisconnectedtohighvoltageanddrainisconnectedtolowvoltage
Asanegativevoltageappliestothegate,theresultingfieldpusheselectronsinntypesubstrateaway
fromthesurface,leavingbehindacarrierdepletionregion
Asgatevoltageexceedsanegativethresholdvoltage Vt ,holesaccumulateonthesubstratesurface
Aptypechannel(inversionlayer)isinducedforcurrentflowfromsourcetodrain
Negativegatevoltageisrequiredtoinducethechannel enhancementtype MOSFET
ComplementaryMOS(CMOS)
CMOStechnologyemploysbothPMOSandNMOSdevices
Ifsubstrateisptype,PMOStransistorsareformedinn well(ntypebodyneeded)
Ifsubstrateisntype,NMOStransistorsareformedinp well(ptypebodyneeded)
Thesubstrateandwellareconnectedtovoltageswhichreversebiasthejunctionsfordeviceisolation
Exercise5.1(Textbook)
Exercise5.2(Textbook)
NTUEEElectronics L.H.Lu
57
5.2CurrentVoltageCharacteristics
Circuitsymbol
nchannelenhancementmodeMOSFET
Thecurrentvoltagecharacteristics
Cutoffregion:(vGS Vt)
iD 0
Trioderegion:(vGS >Vt andvDS <vGSVt)
iD nCox
W
1 2
]
[(vGS Vt )vDS vDS
L
2
iD nCox
W
(vGS Vt ) 2
L
largesignalmodel(saturation)
NTUEEElectronics L.H.Lu
58
Channellengthmodulation
ThechannelpinchoffpointmovesslightlyawayfromdrainasvDS >vDSsat
Theeffectivechannellength(Leff)reduceswithvDS
Electronstraveltopinchoffpointwillbeswepttodrainbyelectricfield
ThelengthaccountedforconductanceinthechannelisreplacedbyLeff :
vGS Vt
Leff
k W [vGS Vt v( x)]dv
'
n
dx
L
1 ' W
1
1 W
W
(vGS Vt ) 2 k n'
(vGS Vt ) 2 k n' (vGS Vt ) 2 (1
)
kn
2 L
2 Leff
2 L L
L
L
1 W
assuming that
vDS iD k n'
(vGS Vt ) 2 (1 vDS )
2 L
L
iD
Finiteoutputresistance
ro [
iD 1
1
k' W
V
]vGS constant [ n (vGS Vt ) 2 ]1
A
vDS
2 L
I D I D
59
Thebodyeffect
TheBSandBDjunctionshouldbereversebiasedforthedevicetofunctionproperly
Normally,thebodyofanchannelMOSFETisconnectedtothemostnegativevoltage
ThedepletionregionwidensinBSandBDjunctionsandunderthechannelasVSB increases
Bodyeffect:Vt increasesduetotheexcesschargeinthedepletionregionunderthechannel
Thebodyeffectcancauseconsiderabledegradationincircuitperformance
Thresholdvoltage:
Vt Vt 0 [ 2 f VSB 2 f ]
where
2qN A Si
Cox
and f
kT
N
ln( A )
q
ni
Currentequations:
W
1 2
]
[(vGS Vt )vDS vDS
L
2
1
W
nCox (vGS Vt ) 2
2
L
iD nCox
iDsat
Temperatureeffect
Vt decreasesby~2mVforevery1Crise iD increaseswithtemperature
kn decreaseswithtemperature iD decreaseswithincreasingtemperature
Foragivenbiasvoltage,theoverallobservedeffectofatemperatureincreaseisadecreaseiniD
NTUEEElectronics L.H.Lu
510
Breakdownandinputprotection
Weakavalanche
pn junctionbetweenthedrainandsubstratesuffersavalanchebreakdownasVDS increases
Largedraincurrentisobserved
Typicalbreakdownvoltage20~150V
Punchthrough
Occursatlowervoltage(~20V)forshortchanneldevices
Draincurrentincreasesrapidlyasthedraindepletionregionextendsthroughthechannel
Doesnotresultinpermanentdamagetothedevice
Gateoxidebreakdown
Gateoxidebreakdownoccurswhengatetosourcevoltageexceeds30V
Permanentdamagetothedevice
InputProtection
ProtectioncircuitisneededfortheinputterminalsofMOSintegratedcircuits
Usingclampingdiodefortheinputprotection
NTUEEElectronics L.H.Lu
511
ThepchannelenhancementtypeMOSFET
ForaPMOS,thesourceisconnectedtohighvoltageandthedrainisconnectedtolowvoltage
ToinducethepchannelfortheMOSFET,anegativevGS isrequired Vt (thresholdvoltage)<0V
Thebodyisnormallyconnectedtothemostpositivevoltage
Thecurrentvoltagecharacteristics
Cutoffregion:(vGS Vtp)
iD 0
Trioderegion:(vGS <Vtp andvDS >vGSVtp)
W
2
iD 2 p Cox L (vGS Vtp )
Transconductance parameterkp =pCox 0.4kn
ThevaluesofvGS ,vDS ,Vt and forpchannelMOSFEToperationareallnegative
DraincurrentiD isstilldefinedasapositivecurrent
NTUEEElectronics L.H.Lu
512
Exercise5.4(Textbook)
Exercise5.5(Textbook)
Exercise5.6(Textbook)
Exercise5.7(Textbook)
NTUEEElectronics L.H.Lu
513
5.3MOSFETCircuitsatDC
DCanalysisforMOSFETcircuits
Assumetheoperationmodeandsolvethedcbiasutilizingthecorrespondingcurrentequation
Verifytheassumptionwithterminalvoltages(cutoff,triodeandsaturation)
Ifthesolutionisinvalid,changetheassumptionofoperationmodeandanalyzeagain
DCanalysisexample
AssumingMOSFETinsaturation
1 W
VSS VGS I D RS VGS k n' (VGS Vt ) 2 RS
2 L
VGS 3V or 1V (not a valid solution)
AssumingMOSFETinsaturation
VGS 3V and VDS 1.696V
AssumingMOSFETintriode
W
1 2
I D kn' [(VGS Vt )VDS VDS
]
L
2
VGS I D RS VSS
VDS I D ( RD RS ) VDD VSS
VGS 3.35V , VDS 0.35V and I D 0.33mA
NTUEEElectronics L.H.Lu
514
Exercise5.8(Textbook)
Exercise5.9(Textbook)
Exercise5.10(Textbook)
Example5.5(Textbook)
Example5.6(Textbook)
Exercise5.12(Textbook)
Example5.7(Textbook)
Example5.8(Textbook)
NTUEEElectronics L.H.Lu
515
5.4ApplyingtheMOSFETinAmplifierDesign
MOSFETvoltageamplifier
MOSFETwitharesistiveloadRD canbeusedasavoltageamplifier
Thevoltagetransfercharacteristic(VTC)
TheplotofvI (vGS)versusvO (vDS)
DCanalysisasvGS increasesfrom0toVDD
Cutoffmode:(0V vGS <Vt)
iD 0
vO vDS VDD
Saturationmode:(vGS >Vt)
1
2
iD 2 kn (vGS Vt )
1
2
vO vDS VDD 2 kn (vGS Vt ) RD
Triodemode:(vGS furtherincreases)
1 2
]
iD kn [(vGS Vt )vDS vDS
2
1
2
2
vO vDS VDD kn [(vGS Vt )vDS vDS ]RD
NTUEEElectronics L.H.Lu
516
BiasingtheMOSFETtoobtainlinearamplification
TheslopeintheVTCindicatesvoltagegain
MOSFETinsaturationcanbeusedasvoltageamplification
PointQ isknownasbiaspointordcoperatingpoint
1
2
Thesmallsignalvoltagegain
TheamplifiergainistheslopeatQ:
Av
dvDS
dvGS
vGS VGS
k n (VGS Vt ) RD k nVOV RD
Maximumvoltagegainoftheamplifier
| Av ||
I D RD
V
| DD | Av max |
VOV / 2 VOV / 2
NTUEEElectronics L.H.Lu
517
DeterminingtheVTCbygraphicalanalysis
Providesmoreinsightintothecircuitoperation
Loadline:thestraightlinerepresentsineffecttheload
iD =(VDDvDS)/RD
Theoperatingpointistheintersectionpoint
LocatingthebiaspointQ
Thebiaspoint(intersection)isdeterminedbyproperlychoosingtheloadline
TheoutputvoltageisboundedbyVDD (upperbound)andVOV(lowerbound)
Theloadlinedeterminesthevoltagegain
Thebiaspointdeterminesthemaximumupper/lowervoltageswingoftheamplifier
NTUEEElectronics L.H.Lu
518
5.5SmallSignalOperationandModels
TheDCbiaspoint
MOSFETinsaturation
1
1
Draincurrent: I D kn (VGS Vt ) 2 knVOV2
Drainvoltage: VDS
2
2
VDD I D RD VOV
Thesmallsignalcircuitparametersaredeterminedbythebiaspoint
Thesignalsignaloperation
Thesmallsignaldraincurrent:
vGS VGS vgs
1 'W
1 W
1 W 2
W
(VGS Vt ) 2 k n'
(VGS Vt )vgs k n'
k n (VGS vgs Vt ) 2 k n'
vgs
2 L
2 L
2 L
L
1 W
W
(VGS Vt ) 2 kn'
(VGS Vt )vgs I D id
k n'
2 L
L
W
(VGS Vt )v gs
id k n'
L
iD
Thesmallsignalvoltagegain:
vD VDD iD RD VDD ( I D id ) RD VD id Rd VD vd
vd id RD k n
Av
W
VOV RD vgs
L
vd
W
k n VOV RD
vgs
L
NTUEEElectronics L.H.Lu
519
Thesmallsignalparameters
Transconductance(gm):describeshowid changewithvgs
gm
id
i
D
vgs vGS
vGS VGS
k n'
W
W
(VGS Vt ) 2k n'
ID
L
L
Outputresistance(ro):describeshowid changewithvds
ro [
1
V
iD 1
]vGS constant
A
vDS
I D I D
DraincurrentvarieswithvDS duetochannellengthmodulation
Finitero tomodelthelineardependenceofiDonvDS
Theeffectcanbeneglectedifro issufficientlylarge
Bodytransconductance(gmb):describeshowid changeswithvbs
1 'W
k n (vGS Vt ) 2
2 L
i
i Vt
W
V
Vt
(vGS Vt ) t g m
g mb D vGS constant D
k n'
vBS vDS constant Vt vBS
L
vBS
vSB
iD
vSB
2 2F VSB
g mb g m
+
+
vgs
gmvgs
gmbvbs
D
B
ro vbs
ThebodyeffectoftheMOSFETismodeledbygmb
Canbeneglectedifbodyandsourceareconnectedtogether
NTUEEElectronics L.H.Lu
520
Thesmallsignalequivalentcircuitmodels
Hybrid model
Neglectro
Tmodel
Neglectro
NTUEEElectronics L.H.Lu
521
5.6BasicMOSFETAmplifierConfiguration
Threebasicconfigurations
CommonSource(CS)
CommonGete(CG)
CommonDrain(CD)
Characterizingamplifiers
TheMOSFETcircuitscanbecharacterizedbyavoltageamplifiermodel(unilateralmodel)
TheelectricalpropertiesoftheamplifierisrepresentedbyRin,Ro andAvo
Theanalysisisbasedonthesmallsignalorlinearequivalentcircuit(dccomponentsnotincluded)
vo
RL
Avo
vi RL Ro
v
Rin
Rin
RL
Overallvoltagegain: Gv o
Av
Avo
vsig Rin Rsig
Rin Rsig RL Rso
Voltagegain: Av
NTUEEElectronics L.H.Lu
522
Thecommonsource(CS)amplifier
CharacteristicparametersoftheCSamplifier
Inputresistance: Rin
Outputresistance: Ro RD || ro RD
Opencircuitvoltagegain: Avo g m ( RD || ro ) g m RD
Voltagegain: Av g m ( RD || RL || ro ) g m ( RD || RL )
Overallvoltagegain: Gv
r
r
g m ( RD || RL || ro ) g m
( RD || RL )
r Rsig
r Rsig
CSamplifiercanprovidehighvoltagegain
Inputandoutputareoutofphaseduetonegativegain
Outputresistanceismoderatetohigh
SmallRD reducesRo atthecostofvoltagegain
NTUEEElectronics L.H.Lu
523
Thecommonsource(CS)withasourceresistance
Characteristicparameters(byneglectingro)
Inputresistance:
Rin
Outputresistance:
Ro RD
Opencircuitvoltagegain:
Avo
g m RD
1 g m Rs
Voltagegain:
Av
g m ( RD || RL )
1 g m Rs
Overallvoltagegain:
Gv
g m ( RD || RL )
1 g m Rs
SourcedegenerationresistanceRs isadopted
Gainisreducedbythefactor(1+gmRs)
Consideredanegativefeedbackoftheamplifier
NTUEEElectronics L.H.Lu
524
Thecommongate(CG)amplifier
CharacteristicparametersoftheCGamplifier(byneglectingro)
Inputresistance: Rin 1 / g m
Outputresistance: Ro RD
Opencircuitvoltagegain: Avo g m RD
Voltagegain: Av g m ( RD || RL )
Overallvoltagegain: Gv
1
g m ( RD || RL )
1 g m Rsig
CGamplifiercanprovidehighvoltagegain
Inputandoutputareinphaseduetopositivegain
Inputresistanceisverylow
AsingleCGstageisnotsuitableforvoltageamplification
Outputresistanceismoderatetohigh
SmallRD reducesRo atthecostofvoltagegain
Theamplifierisnolongerunilateralifro isincluded
NTUEEElectronics L.H.Lu
525
Thecommoncollector(CD)amplifier
CharacteristicparametersoftheCDamplifier(byneglectingro)
Inputresistance: Rin
Outputresistance: Ro 1 / g m
Voltagegain: Av RL /( RL 1 / g m ) g m RL /( g m RL 1) 1
Overallvoltagegain: Gv ( RL ) /( RL 1 / g m ) g m RL /( g m RL 1) 1
CDamplifierisalsocalledsourcefollower.
Inputresistanceisveryhigh
Outputresistanceisverylow
Thevoltagegainislessthanbutcanbecloseto1
CDamplifiercanbeusedasvoltagebuffer
NTUEEElectronics L.H.Lu
526
5.7BiasinginMOSAmplifierCircuits
DCbiasforMOSFETamplifier
Theamplifiersareoperatingataproperdcbiaspoint
Linearsignalamplificationisprovidedbasedonsmallsignalcircuitoperation
TheDCbiascircuitistoensuretheMOSFETinsaturationwithapropercollectorcurrentID
Biasingbyfixinggatetosourcevoltage
1
2
1
2
Biasingbyfixinggatevoltageandconnectingasourceresistance
1
2
1
I D kn (VGS Vt ) 2
Thebiasconditionisspecifiedby:and
VG VGS kn (VGS Vt ) 2 RS
2
Draincurrenthasbettertolerancetovariationsinthedeviceparameters
NTUEEElectronics L.H.Lu
527
Biasingusingadraintogatefeedbackresistor
Asinglepowersupplyisneeded
RG ensurestheMOSFETinsaturation(VGS =VDS)
MOSFEToperatingpoint: VDD VGS 1 k n (VGS Vt ) 2
RD
ThevalueofthefeedbackresistorRG affectsthesmallsignalgain
Biasingusingaconstantcurrentsource
TheMOSFETcanbebiasedwithaconstantcurrentsourceI
TheresistorRD ischosentooperatetheMOSFETinactivemode
Thecurrentsourceistypicallyacurrentmirror
Currentmirrorcircuit:
MOSFETsQ1 andQ2 areinsaturation
ThereferencecurrentIREF =I =ID
VDD VGS 1
k n (VGS Vt ) 2
R
2
1
I REF k n (VGS Vt ) 2
2
Whenapplyingtotheamplifiercircuit,thevoltage
VD2 hastobehighenoughtoensureQ2 insaturation
NTUEEElectronics L.H.Lu
528
Example5.12(Textbook)
Exercise5.33(Textbook)
Exercise5.34(Textbook)
Exercise5.35(Textbook)
Exercise5.36(Textbook)
NTUEEElectronics L.H.Lu
529
5.8DiscreteCircuitMOSAmplifiers
Circuitanalysis:
DCanalysis:
Removeallacsources(shortforvoltagesourceandopenforcurrentsource)
Allcapacitorsareconsideredopencircuit
DCanalysisofMOSFETcircuitsforallnodalvoltagesandbranchcurrents
FindthedccurrentID andmakesuretheMOSFETisinsaturation
ACanalysis:
Removealldcsources(shortforvoltagesourceandopenforcurrentsource)
Alllargecapacitorsareconsideredshortcircuit
ReplacetheMOSFETwithitssmallsignalmodelforacanalysis
ThecircuitparametersinthesmallsignalmodelareobtainedbasedonthevalueofID
Completeamplifiercircuit
DCequivalentcircuit
NTUEEElectronics L.H.Lu
ACequivalentcircuit
530
Thecommonsource(CS)amplifier
Thecommonsourceamplifierwithasourceresistance
NTUEEElectronics L.H.Lu
531
Thecommongate(CG)amplifier
Thecommondrain(CD)amplifier
NTUEEElectronics L.H.Lu
532
Theamplifierfrequencyresponse
Thegainfallsoffatlowfrequencybandduetotheeffectsofthecouplingandbypasscapacitors
ThegainfallsoffathighfrequencybandduetotheinternalcapacitiveeffectsintheMOSFETs
Midband:
Allcouplingandbypasscapacitors(largecapacitance)areconsideredshortcircuit
Allinternalcapacitiveeffects(smallcapacitance)areconsideredopencircuit
Midband gainisnearlyconstantandisevaluatedbysmallsignalanalysis
ThebandwidthisdefinedasBW =fH fL
AfigureofmeritfortheamplifierisitsgainbandwidthproductdefinedasGB =|AM|BW
NTUEEElectronics L.H.Lu
533
Exercise5.37(Textbook)
Exercise5.38(Textbook)
Exercise5.39(Textbook)
Exercise5.40(Textbook)
Exercise5.41(Textbook)
NTUEEElectronics L.H.Lu
534