Failure Analysis of

MEMS

Micro-Electro-Mechanical
Systems (MEMS)
technology that in its most general form
can be defined as miniaturized mechanical
and electro-mechanical elements
made using the techniques of
microfabrication

Micro-Electro-Mechanical Systems
(MEMS)
Known as Micromachines in Japan and Micro
Systems Technologies in Europe
Made up of components between 1 to 100
micrometres in size (i.e. 0.001 to 0.1 mm)
generally range in size from 20 micrometres to a
millimetre (i.e. 0.02 to 1.0 mm).
usually consist of a central unit that processes data
(the microprocessor) & several components that
interact with the surroundings such as microsensors.

Micro-Electro-Mechanical
Systems (MEMS)
Accelerometer

Gyroscope

Microphone
for Mobile
Phones

MEMS RELIABILITY
One of the most critical points in developing a
reliability analysis is to understand the way in
which a system can fail, or commonly known as
its root cause.
For that reason, a failure mode is defined as the
apparent failure of a system, and the failure
mechanism as the physical cause (mechanical,
chemical, or thermal) of the failure modes in the
system.

Failure mechanisms of
MEMS
Mechanical Fracture
defined as the breaking of a uniform
material into two separate sections.

Mechanical Fracture
Ductile Fracture - occurs in ductile
materials. It is characterized by almost
uninterrupted plastic deformation of a
material.

Brittle fracture - occurs along crystal

planes and develops rapidly with little
deformation

Mechanical Fracture
Intercrystalline fracture - brittle
fracture that occurs along grain
boundaries in polycrystalline
materials, often beginning at a point
where impurities or precipitates
accumulate.

STICTION EFFECT
The moving parts
of micromechanical
machines tend to
seize up under
force of sticking
and friction.

TWO STAGES OF STICTION

Release Related Stiction
It occurs during sacrificial
layer removal in fabrication
and such stiction is cause by

capillary forces

In Use Stiction
It usually occurs when successfully released microstructures
are exposed to humid environment

STICTION CATEGORIES
Mechanical Collapes due to Capillary Force
Due to fabrication of MEMS. If
etching is performed in liquid
environment, a bridge of liquid
will be formed from the
suspended member and

substrate. When the liquid

is removed during dehydration cycle yielding to an attractive
capillary force which strong enough to make it collapse

STICTION CATEGORIES
Stiction by van der Waals and Casimir Forces
If the gap between contiveler and sustrate is a few
micrometer, a Stiction sometimes cause by the force
we called van der Waals and Casimir Force.

WEAR EFFECT
Wear may be defined as damage to a solid
surface caused by the removal or
displacement of material by the mechanical
action of a contacting solid, liquid, or gas.

TYPES OF WEAR
Adhesive Wear

Abraisive Wear
Corrosive Wear
Surface Fatigue Wear

ADHESIVE WEAR

Adhesive wear can be

found between
surfaces
during frictional cont
act and generally
refers to unwanted
displacement and
attachment of wear
debris and material
compounds from one
surface to another.

Abraisive Wear
Abrasive wear
occurs when a
hard rough
surface slides
across a softer
surface.

Corrosive Wear
This kind of wear occur in a variety of
situations both in lubricated and
unlubricated contacts. The
fundamental cause of these forms of
wear is chemical reaction between
the worn material and the corroding
medium

SURFACE FATIGUE WEAR

occurs mostly in
rolling
applications, such
as bearings and
gears. It affects
highly polished
surfaces that roll
instead of sliding.

DELAMINATION
It occurs when a material loses its adhesive
bond due to strong force. It can also arise due
to thermal expansion and a result of fatigue.

VIBRATION AND SHOCKS

Due to the sensitivity and fragile
nature of many MEMS external
vibrations can cause either through
inducing surface adhesion or through
fracturing device support structures,
external vibration can cause failure.
Long-term vibration can also
contribute to fatigue.

Shock is somehow different with

vibration.
Shock is a single mechanical impact
instead of repeated movement event.
It is a direct transfer of force in a
device and it is much stronger than
vibration.

ELECTROSTATIC DISCHARGE AND DIE

CHARGING
It occurs when a device is improperly handled.
A human body routinely develops an electric
potential in excess of 1,000V. Upon contacting
an electronic device, this buildup will discharge,
which will create a large potential difference
across the device. The effect is known to have
catastrophic effects in circuits and could have
similar effects in MEMS.

Dielectric charging and breakdown is the charging that may occur in

the dielectric layer. Sensors are known to drift over time due to charge
accumulating at the surface.

RADIATION EFFECTS
The field of radiation effects on MEMS is becoming increasingly important.
It has long been known that electrical systems are susceptible to radiation,
and recent research has raised the possibility that mechanical devices may
also be prone to radiation-induced damage. Especially sensitive to
radiation are devices that have mechanical motion governed by electric
fields across insulators, such as electrostatically positioned cantilever
beams. Insulators can fail under single event dielectric rupture. A further
complication is the fact that radiation can cause bulk lattice damage and
make materials more susceptible to fracture.

TEMPERATURE
The temperature range in which a device will operate within acceptable
parameters is determined by the coefficient of linear expansion. In
devices where the coefficients are poorly matched, there will be a low
tolerance for thermal variations.

Thermal effects cause problems in metal packaging, as the thermal

coefficient of expansion of metals can be greater than ten-times that of
silicon.

HUMIDITY
Humidity is considered another serious concern for MEMS. Surface
micromachined devices are extremely hydrophilic for reasons related to
processing. In the presence of humidity, water will condense into small
cracks and pores on the surface of these structures.

PARTICULATES
Particulates are fine particles that are prevalent in the atmosphere. These
particles have been known to electrically short out MEMS and can also
induce stiction. While these particles are normally filtered out of the clean
room environment, many MEMS are designed to operate outside the
confines of the clean room and without the safety of a hermetically sealed
package.

Failure Analysis Technique

Optical Microscopy
one of the most valuable and widely used
tools in the FA of MEMS.

referred to as light microscope, is a type

of microscope which uses visible light and a
system of lenses to magnify images of
small samples.

Optical Microscopy
The features that can be observed optically
include:
textures,

stains,
debris,
fracture, and
abnormal displacements.

Optical Microscopy

Scanning Laser
Microscopy (SLM)
It is a technique used for obtaining
high-resolution optical images
with depth selectivity.

A confocal image is an image with

a very limited depth of field (depth
of focus) created by inserting an
aperture in the optical path.
By taking a series of confocal
images at different focal planes,
an extended depth-of-focus image
can be constructed

Scanning Laser
Microscopy (SLM)

Scanning Electron
Microscopy (SEM)
A method for high-resolution
imaging of surfaces. The SEM use s
electrons for imaging, much as a
light microscope uses visible light.
The SEM has been useful for
imaging defects at high
magnification as well as
determining electrical continuity in
static and operating micro engines

Scanning Electron
Microscopy (SEM)
Passive voltage contrast is defined as contrast which
arises from voltage differences induced by rastering
the beam causing various elements reach an
equilibrium potential through self-charging.
Active voltage contrast is defined as that arising
from external application of voltage on different
structures.

Acoustic Microscopy
A high frequency ultrasound transducer emits sound
waves that can be received back (echo) or transmitted
through a material. The acoustic signature or waveform may
then be interpreted to determine variations of acoustic
impedance within a sample. The difference in acoustic
impedance may indicate a change in material densities or
separation at an interface. The transducer may also be
mechanically scanned across the sample in a raster pattern
emitting and receiving the ultrasound signal to generate an
image (pulse-echo). An immersion fluid medium, typically DI
water, is used to acoustically couple the sample while
performing the analysis.

Acoustic Emission
Acoustic Emission (AE) testing is a powerful method for
examining the behavior of materials deforming under
stress. Acoustic Emission may be defined as a transient
elastic wave generated by the rapid release of energy
within a material. Materials "talk" when they are in
trouble: with Acoustic Emission equipment you can
"listen" to the sounds of cracks growing, fibers breaking
and many other modes of active damage in the stressed
material.

Laser Cutting
The laser is used for failure analysis of new and
returned devices to isolate faulty components by cutting
the traces (metal lines) that connect them to the rest of
the circuit, to remove passivation over the circuit to
provide access to circuit traces and connections, and to
dig through multiple layers of interlayer dielectrics and
even metal allowing electrical contact to be made to
buried circuit paths.

Lift Off Technique

Careful removing elements of a microengine with
a conductive laboratory adhesive tape used for SEM
mounting has added another dimension to the analysis
of microengines. The lift-off technique allows
examination of the bottom surfaces of engines (Fig. 23)
that provide additional information (such as the
accumulation of wear debris or evidence of damage to
pin receiver holes) for determining failure modes of the
defective and failed microengines

Focused Ion Beam (FIB)

Resembles a Scanning Electron Microscope
Uses a focused beam of positive gallium ions to
irradiate the surface of the sample in a defined
area. This irradiation causes surface charging,
which can be neutralized by a flow of low energy
electrons from a flood gun

Focused Ion Beam (FIB)

Focused Ion
Beam (FIB)

FIB workstation

Focused Ion
Beam (FIB)
Principle

the gallium (Ga+) primary ion beam

hits the sample surface and sputters
a small amount of material, which
leaves the surface as either
secondary ions (i+ or i-) or neutral
atoms (n0). The primary beam also
produces secondary electrons (e). As
the primary beam rasters on the
sample surface, the signal from the
sputtered ions or secondary
electrons is collected to form an
image

Focused Ion
Beam (FIB)
Usage

Micro imaging
used as a micro machining tool, to
modify or machine materials at the
micro- and nanoscale
to cut unwanted electrical
connections
to deposit conductive material in
order to make a connection

Focused Ion
Beam (FIB)

Sample image milled

by FIB

Atomic Force Microscopy (AFM)

Also called scanning-force microscopy (SFM), is
a very high-resolution type of scanning probe
microscopy (SPM), with demonstrated
resolution on the order of fractions of a
nanometer, more than 1000 times better than
the optical diffraction limit.
The atomic force microscope (AFM) provides
very detailed topographic images and surface
traces.

Atomic Force Microscopy (AFM)

Atomic Force Microscopy (AFM)

Principle
The AFM consists of a cantilever with a
sharp tip (probe) at its end that is used to
scan the specimen surface. The cantilever
is typically silicon or silicon nitride with a
tip radius of curvature on the order of
nanometers. When the tip is brought into
proximity of a sample surface, forces
between the tip and the sample lead to a
deflection of the cantilever. Along with
force, additional quantities may
simultaneously be measured through the
use of specialized types of probes.
Typically, the deflection is measured using
a laser spot reflected from the top surface
of the cantilever into an array of
photodiodes. Other methods that are
used include optical interferometry,
capacitive sensing or piezoresistive AFM
cantilevers

Usage

the identification of atoms at a

surface
the evaluation of interactions
between a specific atom and its
neighboring atoms
the study of changes in physical
properties arising from changes in
an atomic arrangement through
atomic manipulation.

Atomic Force Microscopy (AFM)

Imaging Modes
Contact Mode
- the tip is "dragged" across the surface of the sample and the
contours of the surface are measured either using the deflection of
the cantilever directly or, more commonly, using the feedback signal
required to keep the cantilever at a constant position the evaluation
of interactions between a specific atom and its neighboring atoms
Non-Contact Mode
- the tip of the cantilever does not contact the sample surface. The
cantilever is instead oscillated at either its resonant frequency
(frequency modulation) or just above (amplitude modulation) where
the amplitude of oscillation is typically a few nanometers (<10 nm)
down to a few picometers
Tapping Mode
- the cantilever is driven to oscillate up and down at or near its
resonance frequency by a small piezoelectric element mounted in the
AFM tip holder similar to non-contact mode. However, the amplitude
of this oscillation is greater than 10 nm, typically 100 to 200 nm

Failure Analysis of
Passive
Components

Resistors
Resistors can fail open or short, alongside their value changing under
environmental conditions and outside performance limits. Examples of resistor
failures include:

Manufacturing defects causing intermittent problems. For example,

improperly crimped caps on carbon or metal resistors can loosen and lose
contact, and the resistor-to-cap resistance can change the values of the
resistor

Surface-mount resistors delaminating where dissimilar materials join, like

between the ceramic substrate and the resistive layer.

Nichrome thin-film resistors in integrated circuits attacked by phosphorus

from the passivation glass, corroding them and increasing their resistance.

SMD resistors with silver metallization of contacts suffering open-circuit

failure in a sulfur-rich environment, due to buildup of silver sulfide.

Copper dendrites growing from Copper(II) oxide present in some materials

(like the layer facilitating adhesion of metallization to a ceramic substrate)
and bridging the trimming kerf slot.

Resistors

Capacitors
Capacitors are characterized by their capacitance, parasitic resistance in series
and parallel, breakdown voltage and dissipation factor; both parasitic parameters
are often frequency- and voltage-dependent. Structurally, capacitors consist of
electrodes separated by a dielectric, connecting leads, and housing; deterioration
of any of these may cause parameter shifts or failure. Shorted failures and leakage
due to increase of parallel parasitic resistance are the most common failure modes
of capacitors, followed by open failures. Some examples of capacitor failures
include:

Dielectric breakdown due to overvoltage or aging of the dielectric, occurring

when breakdown voltage falls below operating voltage. Some types of
capacitors "self-heal", as internal arcing vaporizes parts of the electrodes around
the failed spot. Others form a conductive pathway through the dielectric,
leading to shorting or partial loss of dielectric resistance.

Electrode materials migrating across the dielectric, forming conductive paths.

Leads separated from the capacitor by rough handling during storage,

assembly or operation, leading to an open failure. The failure can occur invisibly
inside the packaging and is measurable.

Increase of dissipation factor due to contamination of capacitor materials,

particularly from flux and solvent residues.

Electrolytic capacitors
In addition to the problems listed above, electrolytic capacitors suffer from
these failures:

Aluminum versions having their electrolyte dry out for a gradual leakage,
equivalent series resistance and loss of capacitance. Power dissipation by
high ripple currents and internal resistances cause an increase of the
capacitor's internal temperature beyond specifications, accelerating the
deterioration rate; such capacitors usually fail short.

Electrolyte contamination (like from moisture) corroding the electrodes,

leading to capacitance loss and shorts.

Electrolytes evolving a gas, increasing pressure inside the capacitor housing

and sometimes causing an explosion; an example is the capacitor plague.

Tantalum versions being electrically overstressed, permanently degrading

the dielectric and sometimes causing open or short failure. Sites that have
failed this way are usually visible as a discolored dielectric or as a locally
melted anode.

MULTI-LAYER CHIP CAPACITORS

(MLCCS)

TANTALUM CAPACITORS

ALUMINUM ELECTROLYTIC
CAPACITORS

INDUCTORS

Diodes