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Microfluidics 2012
Heidelberg, December 3-5, 2012
Heidelberg, Germany
Contents:
Introduction
Literature review
Problem statement
Solution methodology
Results and discussion
04 December 2012
Heidelberg, Germany
Introduction:
ri
ri
1
t
Conventional tube
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ri
ri
1 or 1
t
t
Microtubes
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As
1
Af
Microchannel on
solid substrate
Literature
Conduction parameter =
(k s As ) /(m cp L)
2 NTU
qcond
s / L
M
ks
qconv f cpf f u
Bi
ks
As Ts
M
f cp u L A f Tf
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k s As
m c
Ratio of axial heat transfer within the solid duct or tube due to axial
temperature gradient in it to the energy flow carried by the fluid in the
channel in the axial direction
Conventional channel: Bahnke and Howard (1964)
Microscale counter-flow heat exchangers: Peterson (1998, 1999)
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qconv f cp u L A f
FLUID
SOLID
Li et al. (2009):
ks
As Ts
M
f cp u L A f Tf
Ts To Ti Solid
Tf To Ti Fluid
Zhang et al. (2009): Study on conjugate heat transfer in thick micro tube
Criteria for judging the effect of axial wall conduction may vary on
case to case basis depending on boundary condition and
geometrical parameter
*IJHMT 47(2004) 3993-4004, IJHMT 50(2007) 3447-3460, IJHMT 53(2010) 3977-3989
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Discussion:
Chein et al. (2012)*
- Silica glasss
- Steel
- Copper
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PROBLEM STATEMENT
Assumptions:
Heat transfer and fluid
flow takes place at
steady state
Flow is laminar,
incompressible
Constant thermophysical properties
Negligible heat loss by
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- Radiation
- Natural convection
9
PROBLEM STATEMENT
Three dimensional
numerical heat transfer
study on commercial
CFD platform (FLUENT):
Objective:
Peripherally averaged
local heat flux, wall
temperature
Peripherally averaged
local wall temperature
Bulk fluid temperature
FIG 1. MICROCHANNEL WITH CONDUCTIVE WALLS
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PROBLEM STATEMENT
Three dimensional
numerical heat transfer
study on commercial
CFD platform (FLUENT):
Pressure discretization
using STANDARD
scheme
SIMPLE algorithm for
velocity-pressure
coupling
SECOND ORDER
UPWIND scheme for
momentum and energy
equation
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VARIABLE PARAMETERS:
Thickness ratio:
s
sf
f
2, 8, 16
ks
k sf
kf
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26, 635
12
z
x
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Grid
4560300
6080400
75100500
13
q z
q
z*
z
Re Pr Dh
Q
2 s f L
qz / q
FIG 3. VARIATION OF DIMENSIONLESS LOCAL SURFACE
HEAT FLUX ALONG THE CHANNEL LENGTH
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q z
q
f
T f T fi
T fo T fi
T w T fi
T fo T fi
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15
q z
q
f
T f T fi
T fo T fi
T w T fi
T fo T fi
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Nu z
qz
Tf
h Dh
kf
Case 1:
Case 2:
Case 3:
17
f
H
Constant area
Constant width
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Constant height
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Discussion
Trkakar and Okutucu-zyurt (2012)*
Channel
height
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Conclusions:
1. Ks/kf determines the extent of the axial conduction in the substrate.
2. Thicker substrates lead to a reduction in thermal resistance and
therefore an increase in the axial back-conduction.
3. Increasing flow Re reduces the axial back-conduction.
4. Unless true distribution of temperature at the fluid-solid interface, true
bulk fluid temperature and the heat flux is known, the estimates of
Nusselt number can be misleading.
5. All other factors remaining the same, thin substrates made of low
conducting materials, experiencing high flow rates provide a better
solution in terms of minimizing the effect of axial conduction in the
substrate.
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For a given flow rate and sf, the thermal conductivity ratio ksf is the key
factor in determining the effects of axial wall conduction on the heat transport
behavior.
Higher ksf leads to axial back conduction, thus decreasing the average Nusselt
number as compared to the Nusselt number obtained for the case when the
wall thickness is negligible.
Very low ksf leads to a situation where the channel heat transfer can be
compared to a channel having zero wall thickness with only one side heated
with a constant heat flux and the rest of the three sides being adiabatic; this
leads to lower average Nusselt number.
It has also been shown that similar phenomena will be observed in substrates
having a tubular geometry.
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ACKNOWLEDGEMENTS
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