Product Guide

Direct Contact Liquid Cooling (DCLC)

Industry leading data center solutions for
HPC, Cloud and Enterprise markets.

www.coolitsystems.com

T: 403.235.4895 Toll Free: 1.866.621.2665

Leadership, Collaboration & Expertise

CooIIT Systems Innovates and Delivers
CoolIT Systems is a world leader in Direct Contact Liquid Cooling for the Data Center,
Server and Desktop markets. CoolIT has been dedicated to the invention and design of
safe and reliable liquid cooling technology since 2001. As an experienced innovator with
50 patents and more than 2 million liquid cooling units deployed in desktop computers,
servers and data centers around the world, CoolITs Rack DCLC technology is the top
choice for many OEMs and system integrators.

We strive to deliver
the highest level of
product and service so
that when customers
choose CoolIT, they
know they are getting
the best.
Geoff Lyon, CEO/CTO CoolIT

Proven Technology

Achievements

Selling 30-40K DCLC units/month

CoolIT named Gartner 2015 Cool Vendor for Data Center Power & Cooling

>2M units sold worldwide

Geoff Lyon elected as Chair of The Green Grid Liquid Cooling Work Group

99.998% leak free and improving

Profit500 2014 #34 in Canada (1780% 5-year growth rate)

50 issued patents

Deloitte 2014 Technology Fast 50 Canada - ranked #23

Global Installations

Technology Partners

Solution Partners

2015, CoolIT Systems, Inc. All Rights Reserved

Focused on Your Cooling Challenges

Direct Contact Liquid Cooling (DCLC)
Direct Contact Liquid Cooling (DCLC) uses the exceptional thermal conductivity of liquid to provide dense, concentrated cooling
to targeted surface areas. By using DCLC, the dependence on fans and expensive air conditioning and air handling systems is
drastically reduced. This enables extremely high rack densities, reduced power use and access to significantly higher performance
potential.

DCLC Gives You The Advantage

With options for data centers with or without facility water hook up, any server in any rack can be liquid cooled with CoolITs
hardware, and benefit from immediate and measurable CAPEX and OPEX benefits.

Performance

Efficiency

Density

Facilitates peak performance for

higher powered or overclocked
processors.

Provides a significant reduction

in total data center energy
consumed.

Enables 100% utilization of rack &

data center spaces.

Immediate CAPEX & OPEX Benefits

Traditional data centers employ chiller-based air cooling systems
that consume 50% of all data center power. ASHRAE W3-W5
warm liquid cooling eliminates the need for chilled water supply and
delivers a rapid ROI. Integrating liquid cooling initially increases the
basic server cost; however, this increase is quickly offset by several
factors:

High density solutions require less data center equipment

(racks, switches, raised floor, etc) lowering overall CAPEX

Trust is a huge factor when putting

liquids in close proximity to critical
electronics. CoolITs technology
outfitted with Stublis non-drip
connectors works flawlessly.
Skeptics become converts.
Rusty Robertson, Aerospace/Defense Application Specialist
Stubli Corporation

22% decrease in OPEX thanks to reduced chilled water

requirements when using warm liquid cooling

ck Power

CAPEX
CAPEX
(annualized)
(annualized)

Data Center PUE

OPEX
OPEX
(annualized)
(annualized)

Rack
Density
Rack Power

Total IT Power

1.5 MW

1.5 MW

Total IT Pow

Total Data Center Power

2.7 MW

1.8 MW

Total Data C

100

55

# of Racks R

15kW/rack

27.7kW/rack

*Including Cooling IT UPS & AUX

# of Racks Required
IT Density

*Including Cooling

IT Density

* Using Koomeys data center costing methods

www.coolitsystems.com

T: 403.235.4895 Toll Free: 1.866.621.2665

Modular Components
Retrofitable Cooling Solutions for All IT Demands
Rack DCLC utilizes a three module approach (Server Module, Manifold Module and Heat Exchanger Module) that allows for a
tremendous amount of product flexibility when integrating liquid cooling. Rack DCLC Modules are designed for a flexible fit to various
compute environments. While Server Modules and Manifold Modules are installed with each system and are local to the rack, the
appropriate heat rejection method may vary. Rack DCLC offers a variety of heat exchanging modules depending on load requirements
and availability of facility water.

Server Module
CoolITs Server Modules can cool any combination of CPU, GPU, Xeon Phi and Memory components, with customization available
for VR, ASIC, FPGA, and other devices. A server installed with CoolIT Systems Rack DCLC technology remains hot-swappable and
simple to service.

CPU

GPU

Memory

V-groove Micro-channel
Cold Plate

R4 Passive Head Unit

FEP Tubing

Leak Detection Cable

CoolITs patented V-groove

Micro-channel Cold Plate is a
solid copper component that
maximizes performance for
todays high thermal density
applications. This design
directs the coolest liquid to
the warmest region of the
processor first.

The R4 is a passive cold plate

technology employed by
CoolIT in centralized pumping
architectures. The R4 system
is purpose-designed to
accommodate lower profile
footprints such as blades and
other custom chassis and is
guaranteed to withstand over
200 PSI.

CoolIT employs Fluorinated

Ethylene Propylene (FEP)
tubing for ultra-high reliability
applications. The design of
this tube consists of both
CVT (Corrugated Tube) and
straight wall sections. FEP is
durable, compact, and offers
low water vapor transmission.

CoolIT offers an effective, low

cost, patented Leak Detection
System that can be deployed
at the server level. This leak
detection cable can be placed
nearly anywhere inside the
chassis.

2015, CoolIT Systems, Inc. All Rights Reserved

Manifold Module
The Manifold Module is the system that transports liquid between the Heat Exchanger Modules and any number of Server Modules. The
Manifold Module can be customized to suit any server or rack environment. Utilizing a stainless steel body and non-drip quick connects
makes CoolITs Manifold Modules incredibly safe and robust.
Rack Manifold

CoolITs Rack Manifolds are made

of reliable stainless steel, dry-break
dripless quick connects, and are
organized for a manual connection at
the front or back of the rack. Manifolds
are flexible and can be arranged
vertically or horizontally within a rack.

Chassis Manifold

Stubli Quick Connects

CoolITs Chassis Manifolds are

integrated into blade style chassis and
use blind-mate quick connects that are
designed to accept a small misalignment
between the server and chassis manifold.
These blind-mate systems are the a
reliable and user-friendly way to liquid
cool servers.

Employed in all Rack and Chassis

Manifolds, Stubli is CoolITs expert
choice for quick connect technology.
Stubli product has industry leading
reliability, is simple to use, and is
100% drip-free.

Heat Exchanger Module

Your choice of Liquid-to-Liquid or Liquid-to-Air centralized pumping Heat Exchanger Module:
CHx (Liquid-to-Liquid)

AHx (Liquid-to-Air)

Requires Facility Water

CHx and AHx solutions support all sizes

of racks. Various sizing and designs are
available depending on customer needs
and environmental factors.

No Facility Water

Modules
Server Module
Manifold Module
CHx650 Module
CHx40 Module
AHx35 Module
AHx20 Module

www.coolitsystems.com

T: 403.235.4895 Toll Free: 1.866.621.2665

Liquid-to-Liquid heat exchanger that manages a network of IT cabinets.

Rack DCLC CHx650 solution is designed to manage the
distribution of clean, treated coolant to and from a network
of IT cabinets.
This CHx accepts ASHRAE W3-W5 (2C - 45C) warm
facility water and can manage 650kW of processor load
per network.

Key Features
Manages 650kW of IT load
W3-W5 warm water cooling
Redundant centralized pumps
Full control system

Key Benefits
Significantly reduces energy costs
Dramatically increase CPU/GPU density
Eliminates the need for chillers and CRACs
Servers remain hot-swappable and easy to service
Monitor system health remotely
The CHx650 Module can be customized to fit various
data center environments. Standard equipment groups
offer N+1 redundancy and when used in tandem can
provide tier 4 resiliency.

CoolingCooling
Capacity
CHx650 Module
Capacity
Maximum Cooling
Input
Temperature
(C)
Maximum
CoolingLoad
Load(kW)
(kW)vs.
vs.Facility
FacilityLiquid
Liquid
Input
Temperature
(C)

Capacity (kW)

1000
750
500
250

Cooling Capacity
(@ 30 C facility liquid)

650kW

Power Consumption
(Max)

4.2kW

Racks Per Solution

5-20

ROI (months)

1-6

Facility Liquid Integration

Yes

10

20

30

40

50

Facility Input Temperature (C)

2015, CoolIT Systems, Inc. All Rights Reserved

Liquid-to-Liquid heat exchanger that manages a single IT cabinet.

Rack DCLC CHx40 solution is designed to manage the distribution of clean, treated coolant within a single IT cabinet.
This 2U CHx accepts ASHRAE W3-W5 (2C - 45C) warm
facility water and can manage 40kW+ of processor load per
rack.

Key Features
Supports 40kW+ cooling capacity per rack
W3-W5 warm water cooling
Redundant centralized pumps
2U form factor
Leak detection and mitigation system
Full control system

Key Benefits
Dramatically increase CPU/GPU density
Eliminates the need for chillers and CRACs
Servers remain hot-swappable and easy to service
Monitor system health remotely

CHx40 Module Cooling Capacity

Cooling Capacity (kW)

CHx40 Cooling Capacity

Cooling Capacity
(@ 30 C facility water)

40kW

Power Consumption
(Max)

110-120 Watts

30

Racks Per Solution

20

ROI (months)

1-6

10

Facility Water Integration

Yes

60

Facility water temperature

20C
30C
40C

50
40

10

20

30

40

Facility Flow Rate (L/min)

www.coolitsystems.com

T: 403.235.4895 Toll Free: 1.866.621.2665

Liquid-to-Air heat exchanger for faster, more powerful clusters in less space.
The AHx35 Module is a unique top-of-rack solution that
can manage 35kW+ of processor load without the need
of facility water.
The AHx35 Module dissipates heat to the surrounding
environment via a liquid-to-air heat exchanger.

Key Features
Supports 35kW+ cooling capacity per rack
No facility water required
Redundant centralized pumps

AHx35 Module - various designs available

(hot aisle, cold aisle, chimney, or other)

Leak detection and mitigation system

Full control system

Key Benefits
Dramatically increase CPU/GPU density
Stand alone rack-based liquid cooling
Monitor system health remotely
Servers remain hot-swappable and easy to service
Easily upgradable to CHx Module

AHx35 Module Cooling Capacity

AHx35 Cooling Capacity

Cooling Capacity (kW)

*Cherry Creek AHx

Cooling Capacity
(@ 25C air)

35kW

Power Consumption
(Max)

795 Watts

30

Racks Per Solution

20

ROI (months)

1-12

10

Facility Water Integration

No

60
50
40

10

20

30

40

50

Facility Air
Air Inlet
Inlet Temperature
Temperature (C)
Facility
(C)
2015, CoolIT Systems, Inc. All Rights Reserved

Liquid-to-Air heat exchanger for powerful clusters in limited space.

The AHx20 Module packs an incredible amount of heat
load management into a small form factor. This top-of-rack
solution provides superior processor performance and very
high densities.
The AHx20 Module is perfect for compute environments
that are short on space, big on compute, and dont have
access to facility water.

Key Features
Supports 20kW+ cooling capacity per rack
No facility water required
Redundant centralized pumps
Leak detection and mitigation system
Full control system

Key Benefits
Dramatically increase CPU/GPU density
Stand alone rack-based liquid cooling
Servers remain hot-swappable and easy to service
Monitor system health remotely
Easily upgradable to CHx Module

AHx20 Module Cooling Capacity

Capacity
Maximum Cooling
Load
(W) vs.
Facility
AirFacility
Inlet Temperature
(C) (C)
Maximum
Cooling
Load
(W) vs.
Air Inlet Temperature

Capacity (kW)

30
22.5
15
7.5

Cooling Capacity
(@ 25C facility water)

20kW

Power Consumption
(Max)

300 Watts

Racks Per Solution

ROI (months)

1-12

Facility Water Integration

No

10
20
30
40
FacilityFacility
Air Inlet
Temperature
(C)
Input Temperature (C)
www.coolitsystems.com

50

T: 403.235.4895 Toll Free: 1.866.621.2665

Case Study
CoolIT Deploys Rack DCLC Solution to Poznan Supercomputing & Networking
Center in Partnership with Huawei and Itprojekt

The Challenge
Poznan Supercomputing & Networking Center (PSNC) was looking for
a safe and reliable way to increase HPC compute density while lowering
overall operating costs. In addition, PSNC wanted to leverage the
lower operating temperatures from liquid cooling to increase processor
performance.
The Solution
The PSNC solution combines Huawei CH121 blade servers in the E9000
chassis with CoolIT Systems Rack DCLC CHx40 centralized pumping
solution to manage 100% of CPU and memory thermal load. Dual left
and right Manifold Modules were positioned on the front of the rack
to manage the front i/o server architecture and ensure easy and quick
service access to the blades. The cluster, delivered by Warsaw based
systems integrator Itprojekt, is an extremely efficient solution that utilizes
inlet water temperatures of 40C and beyond.
HPC Setup
CoolIT Systems Rack DCLC CHx40
CPU and Memory cooled by liquid
Huawei E9000 chassis
Huawei CH121 server
Intel Xeon Processor E5-2697 v3
Memory: DDR4 8GB
128 servers in 3 racks

Results
80% of total IT load managed by liquid cooling
75% fan speed reduction
30kW per rack
910 GFLOPS per node (116 TFLOPS total)
40C primary fluid supply temperature
First ever Huawei liquid cooled cluster

Reducing energy usage and lowering

operating costs are permanently on
our check-list when planning for new
high performance computing clusters.
Liquid cooling is the most efficient way
to achieve our objectives and we are
seeing excellent results and reliability
from the combined Huawei and CoolIT
Systems cluster.
Radoslaw Januszewski, IT Specialist,
PSNC

2015, CoolIT Systems, Inc. All Rights Reserved

Case Study
CASE STUDY: Cooling a Supercomputer
Liquid Cooling for Heat Reuse: Center of Biological Sequence Analysis at the
Technical University of Denmark

The Challenge
The Center for Biological Sequence Analysis (CBS) at the Technical
University of Denmark is striving towards C02 neutrality in its High
Performance Computing (HPC) facility known as Computerome. An equally
important goal is provisioning these computational resources as efficiently
as possible within a modular data center environment. CoolIT Systems
accepted the challenge to deliver a liquid cooled system that dramatically
lowers energy consumed for cooling and provides a workable system to
recycle the waste heat from the servers.
The Solution
CoolIT Systems is addressing CBSs need to be CO2 neutral in the universitys HPC facility by replacing traditional air
cooling with highly efficient liquid. The CBS solution combines rack mounted HP ProLiant DL560 Gen8 servers with
CoolIT Systems direct contact liquid cooling and Rack DCLC CHx40 centralized pumping solution, to manage the
dual CPU thermal load. The liquid is distributed directly to the processors through stainless steel manifolds that utilize all
metal, dry-break quick connects for hot-swappable servicing of any single server. With 16,000+ cores and 92 TB memory,
Computerome is now ranked 121 of the Top500 supercomputers in the world. The cluster, delivered by Go Virtual, accepts
an inlet water temperature of 40C and beyond to gain maximum efficiency. CBS enables waste heat recovery by routing
the high temperature liquid from the servers to provide heat for the adjacent buildings and nearby town of Roskilde.

HPC Setup
CoolIT Systems Rack DCLC CHx40
Dual CPU liquid cooled server modules
HP ProLiant DL560 Gen8 servers
Intel Xeon Processor E5 4600v2 130Watt CPUs
Modular data center
40C primary fluid supply temperature

Results
72% of total IT load managed by liquid cooling
14kW total rack load (130watt CPUs x 108)
563 GFLOPS per server (at peak performance)
Further results will be published after testing

An important goal was provisioning these

computational resources as efficiently as
possible. CoolIT delivered a liquid cooled
system that lowers the energy consumed
for cooling and provides opportunities to
reuse the waste heat from the servers.
Peter Lngreen, Head of HPC,
CBS-DTU

www.coolitsystems.com

T: 403.235.4895 Toll Free: 1.866.621.2665

@coolitsystems
sales@coolitsystems.com
www.coolitsystems.com

T: +1 403.235.4895
Toll Free: 1.866.621.2665
Bay 10, 2928 Sunridge Way N.E., Calgary, AB, T1Y 7H9, CANADA