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MARKING
DIAGRAMS
8
SOIC-- 8
D SUFFIX
CASE 751
8
1
1378
ALYW
G
1
PDIP-- 7
P SUFFIX
CASE 626B
1378P
AWL
YYWWG
1
1
A
L, WL
Y, YY
W, WW
G or G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb--Free Package
Features
Typical Applications
*For additional information on our Pb--Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference
Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2010
PIN CONNECTIONS
Dmg 1
8 HV
FB 2
CS 3
6 VCC
GND 4
5 Drv
(Top View)
ORDERING INFORMATION
Package
Shipping
NCP1378DR2G
SOIC--8
(Pb--Free)
NCP1378PG
PDIP--7
(Pb--Free)
50 Units/Rail
Device
NCP1378
R*
+
12 V @ 1 A
GND
OVP and
Demag
+
Universal
Network
NCP1378
1
Y1 Type
Symbol
Function
Description
Demag
FB
CS
This pin senses the primary current and routes it to the internal comparator
via an L.E.B. By inserting a resistor in series with the pin, you control the
level at which the skip operation takes place.
GND
The IC ground
--
Drv
Driving pulses
VCC
Supplies the IC
NC
--
HV
High--voltage pin
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2
NCP1378
4.5 ms
Delay
Demag
Resd
HV
Demag
+
8 ms
Blanking
PON
4 mA
5.2 V
+
S
OVP
VCC
S*
Q
R* R
8.4 V
7.5 V
5.6 V (Fault)
To Internal
Supply
10 V
50 mV
+
VCC
Drv
Driver src = 20 sink = 10
4.2 V
Fault
Mngt.
FB
Soft--Start = 1 ms
+
-
GND
1V
200 mA
when DRV
is OFF
Overload?
5 ms
Timeout
/3
340 ns
LEB
Timeout
Reset
CS
Demag
Symbol
Value
Unit
VCC Static
18
VCC Pulse
25
VCC, Drv
16
Maximum Voltage on all other pins except Pin 8 (HV), Pin 6 (VCC) and Pin 5 (Drv)
--
--0.3 to 10
Maximum Current into all pins except VCC (6), HV (8) and Demag (1) when 10 V ESD diodes are activated
--
5.0
mA
Idem
+3.0/--2.0
mA
RJC
57
C/W
RJA
178
C/W
RJA
100
C/W
TJMAX
150
Temperature Shutdown
--
155
Hysteresis in Shutdown
--
30
--
--60 to +150
ESD Capability, HBM Model (All pins except VCC and HV)
--
2.0
kV
--
200
VHV
500
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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NCP1378
ELECTRICAL CHARACTERISTICS (For typical values Tj = 25C, for min/max values Tj = 0C to +125C, Max Tj = 150C, VCC = 11 V
unless otherwise noted.)
Characteristic
Pin
Symbol
Min
Typ
Max
Unit
VCCON
7.8
8.4
9.0
VCCOFF
7.0
7.5
8.2
VCChyst
0.8
--
--
--
VCClatch
--
5.5
--
ICC1
--
1.0
1.3
(Note 1)
mA
ICC2
--
1.6
2.0
(Note 1)
mA
ICC3
--
220
--
mA
IC1
2.4
4.0
6.0
mA
IC2
--
4.5
--
mA
Tr
--
40
--
ns
Tf
--
20
--
ns
Source Resistance
ROH
10
20
36
Sink Resistance
ROL
4.0
10
20
IIB
--
0.02
--
mA
ILimit
0.9
1.0
1.1
TDEL
--
110
160
ns
TLEB
--
340
--
ns
Iskip
--
200
--
mA
Tsample
--
4.5
--
ms
Vref
4.6
5.2
6.3
Rup
--
20
--
--
Iratio
--
3.3
--
--
Internal Soft--Start
--
Tss
--
1.0
--
ms
Vth
30
50
90
mV
VH
--
20
--
mV
1
1
VCH
VCL
8.0
--0.9
10
--0.7
12
--0.5
Tdem
--
240
--
ns
Cpar
--
10
--
pF
Tblank
--
8.0
--
ms
SUPPLY SECTION
DRIVE OUTPUT
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NCP1378
8.8
8.0
8.6
7.8
VCCOFF, (V)
VCCON, (V)
TYPICAL CHARACTERISTICS
8.4
8.2
7.4
7.2
8.0
7.8
--25
25
50
75
100
7.0
--25
125
25
50
75
100
125
TEMPERATURE (C)
TEMPERATURE (C)
1.6
2.2
1.4
2.0
1.2
1.8
ICC2, (mA)
ICC1, (mA)
7.6
1.0
0.8
1.4
0.6
0.4
--25
1.6
1.2
25
50
75
100
1.0
--25
125
25
50
75
100
TEMPERATURE (C)
TEMPERATURE (C)
125
1.10
8
7
1.05
Ilimit, (V)
IC1, (mA)
4
3
1.00
0.95
2
1
0
--25
25
50
75
100
0.90
--25
125
25
50
75
100
TEMPERATURE (C)
TEMPERATURE (C)
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5
125
NCP1378
TYPICAL CHARACTERISTICS
40
20
35
18
16
14
25
ROL, ()
ROH, ()
30
20
15
12
10
8
6
10
0
--25
25
50
75
100
0
--25
125
TEMPERATURE (C)
25
50
75
100
125
TEMPERATURE (C)
120
6.5
100
6.0
Vref, (V)
VTH, (mV)
80
60
40
5.5
5.0
4.5
4.0
20
3.5
0
--25
25
50
75
100
3.0
--25
125
TEMPERATURE (C)
9.5
6.5
9.0
6.0
TOUT, (ms)
TOFF, (ms)
7.0
8.5
8.0
7.0
4.0
75
125
5.0
4.5
50
100
5.5
7.5
25
75
10.0
50
TEMPERATURE (C)
6.5
--25
25
100
3.5
--25
125
TEMPERATURE (C)
25
50
75
100
125
TEMPERATURE (C)
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NCP1378
APPLICATION INFORMATION
INTRODUCTION
Startup Sequence
8
+
--
HV
IC1 or 0
6
SVCC
Aux
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7
NCP1378
Skipping Cycle Mode
9.0
8.4 V
Regulation
VCC
8.0
7.0
1 Lp Ip2 Fsw D
burst with:
2
6.0
Lp = Primary inductance
Fsw = Switching frequency within the burst
Ip = Peak current at which skip cycle occurs
Dburst = Burst width/burst recurrence
5.0
3.00M
8.00M
13.0M
time in secs
18.0M
23.0M
MAX PEAK
CURRENT
200
DRIVER = HIGH ? I = 0
DRIVER = LOW ? I = 200 mA
SKIP CYCLE
CURRENT LIMIT
RESET
100
Rskip
Rsense
0
WIDTH
+
RECURRENCE
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NCP1378
Drain
Signal
Timeout
Signal
Demag RESTART
Current Sense and Timeout Restart
Drain
Signal
Timeout
Signal
5 ms
5 ms
Figure 19. When the primary natural ringing becomes too low, the current
sense initiates a new cycle when FB passes the skip level.
7.0
5.0
POSSIBLE
RESTARTS
TO INTERNAL
COMPARATOR
3.0
Resd
2k
3
1.0
--1.0
ESD
50 mV
0V
ESD
4
Rdem
Aux
1
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NCP1378
An internal timer prevents any restart within 8.0 ms
further to the driver going-- low transition. This prevents the
switching frequency to exceed (1.0/TON + 8.0 ms) but also
avoid false leakage inductance tripping at turn-- off. In some
cases, the leakage inductance kick is so energetic, that a
slight filtering is necessary.
The NCP1378 demagnetization detection pad features a
specific component arrangement as detailed by Figure 21.
In this picture, the zener diodes network protect the IC
against any potential ESD discharge that could appear on
the pins. The first ESD diode connected to the pad, exhibits
a parasitic capacitance. When this parasitic capacitance
(10 pF typically) is combined with Rdem, a restart delay is
created and the possibility to switch right in the
drain-- source wave exists. This guarantees QR operation
with all the associated benefits (low EMI, no turn-- on losses
etc.). Rdem should be calculated to limit the maximum
current flowing through pin 1 to less than
+3.0 mA/-- 2.0 mA: If during turn-- on, the auxiliary
winding delivers 30 V (at the highest line level), then the
minimum Rdem value is defined by: 30 + 0.7/3.0 mA =
10.2 k. This value will be further increased e.g. to
introduce a restart delay and also a slight filtering in case
of high leakage energy.
Figure 22 portrays a typical VDS shot at nominal output
power.
6.0
4.0
2.0
4.5 ms
0
400
DRAIN VOLTAGE (V)
SAMPLING HERE
8.0
300
200
100
0
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10
NCP1378
CTN
NCP1378
NCP1378
1
Aux.
ON/OFF
10 k
2
10 nF
Aux.
VCCcap
ON/OFF
Q1
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11
NCP1378
VccON
VccOFF
Vcc
Vcclatch
Driving Pulses
Soft--Start
Operating Shots
or C
CVCC is calculated using the equation C =
V
31.1 mF. Select a 47 mF/25 V and this will fit. During the
latchoff phase, the current consumption drops to 220 mA.
We can now calculate how long this latchoff phase will last:
(7.55.5) x 47 m/220 u = 427 ms.
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NCP1378
Figure 28. This plot gathers waveforms captured at three different operating points:
1st Upper Plot: Free run, valley switching operation, Pout = 26 W.
2nd Middle Plot: Min Toff clamps the switching frequency and selects
the second valley.
3rd Lowest Plot: The skip slices the second valley pattern and will
further expand the burst as Pout goes low.
200 mA x Rskip
Figure 29. This picture explains how the 200 mA internal offset
current creates the skip cycle level.
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NCP1378
PACKAGE DIMENSIONS
SOIC--8 NB
CASE 751--07
ISSUE AJ
- X--
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751--01 THRU 751--06 ARE OBSOLETE. NEW
STANDARD IS 751--07.
A
8
B
1
0.25 (0.010)
- Y--
G
C
DIM
A
B
C
D
G
H
J
K
M
N
S
X 45 _
SEATING
PLANE
- Z--
0.10 (0.004)
H
D
0.25 (0.010)
Z Y
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm
inches
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14
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0 _
8 _
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244
NCP1378
PACKAGE DIMENSIONS
PDIP--7
P SUFFIX
CASE 626B--01
ISSUE A
J
8
M
B
DIM
A
B
C
D
F
G
H
J
K
L
M
N
F
A
NOTE 2
C
- T--
SEATING
PLANE
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. DIMENSION L TO CENTER OF LEAD
WHEN FORMED PARALLEL.
4. PACKAGE CONTOUR OPTIONAL
(ROUND OR SQUARE CORNERS).
5. DIMENSIONS A AND B ARE DATUMS.
MILLIMETERS
MIN
MAX
9.40 10.16
6.10
6.60
3.94
4.45
0.38
0.51
1.02
1.78
2.54 BSC
0.76
1.27
0.20
0.30
2.92
3.43
7.62 BSC
-- -- -10
0.76
1.01
G
0.13 (0.005)
T A
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. SCILLC does not convey any license under
its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,
or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death
may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of
personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.
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15
NCP1378/D