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Chapter 12
1-
trodes?
the joint.
Limitations:
189
on
your
observations
rega rdi ng
y-~
2008 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved.
This material is protected by Copyright and written permission should be obtained from the publisher prior to any prohibited
reproduction , storage in a retrieval system , or transmission in any fonm or by any means, electronic, mechani cal , photocop ying, recording, or
By the st udent. The students are encouraged 12.10 Expl ain why th e elect roslag welding process is
to deve lop their answe rs cons ideri ng th e signif
suit able for thi ck plates a nd heav y st ruct ural
ica nce of t he layered weld bead s and th e qual
sections.
ity of t heir interfaces. For exa m ple, there may
Electroslag weldin g (see Fi g. 12.8) ca n be pe r
be concerns regarding t he weld st re ngt h since
formed
with lar ge pla tes becau se th e t em per a
t he interfaces between adj acent beads may have
tures
a
t
taina ble through elect ric a rcs a re ve ry
some slag or sur face contamina nts th at have not
high.
A
co ntinuous a nd stab le arc can be
been remov ed . The hea t-affect ed zo ne and fa
achieved
a
nd
held long enough to melt thick
tigu e impli ca tion s of such weld s a re a lso a sig
plates.
nifican t concern .
12.11 What are t he similarit ies and di fferen ces be
tween consumable and nonconsumable elec
trode arc welding processes?
Submerged a rc weld ing (see Fig. 12.6) has 12.13 Explain why the gra ins in Fi g. 12.16 g row in
ve ry goo d qu ali ty becau se oxygen in t he atmo
the particular directions shown .
sphere ca nnot pen etrate t he weld zo ne where
The g ra ins grow in th e directions shown in
th e shield ing flux protects th e weld met al. Also ,
Fig. 12.16 because of t he sa me reas ons grains
t here a re no spa rks , spa tter, or fumes as in
g
row away from t he wall in cas ti ng process so
shielded met al a rc and so me other weld ing pro
lidification,
descr ibed in Secti on 5.2. Heat flux
cess .
it; in t he opposite dir ect.ion as grain growt h,
12.9 Expl ain the fac tors in vol ved in elect rode selec
meani ng a tem pe rat ure gra dient ex ists in t hat
tion in a rc: weld ing processes .
direction, so only grains orie nted in t he d irec
tion perpendicular from t he solid -metal sub
By the st udent. Re fer to Sect ion 12.3.8. Elec
strate will grow.
tr ode selection is guided by many facto rs, in
cluding t he process used a nd th e metals to be 12.14 Prepare a table listing the processes described
welded .
in this chapter and providing, for each process, .
190
2008 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved.
This material is protected by Copyright and writt en permission should be obtained from the publisher prior to any prohibited
reproduction , storage in a retrieval system, or transmi ssion in any form or by any means, electronic, mechanical, photocopying , recording, or
Rights and Permissions Departmen t, Pearson Educat ion, Inc., Upper Saddle River, NJ 07458.
011
.41wx G.
2008 Pearson Education, Inc., Upper Saddle River, NJ. I rights reserved .
This material is protected by Copyright and written permission should be obtan ed from the publisher prior to any prohibited
reproduction, storage in a retrieval system, or transmission in any form Of by any means, electronic, mechanical, photocopying, recording , or
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(c) Important factors are the nature of the 12.38 Which process uses a solder paste? What are
the advantages to this process '!
mating surfaces, the mate rials involved,
the shape of the projections, the tempera
Solder paste is used in reflow soldering, de
tures developed, the magnitude of the nor
scribed in Sect ion 12.13.3, which is also used for
mal force , and length of time.
soldering integrated circuits onto printed circuit
boards (Sect ion 13.13).
12.35 What factors influ ence the shape of th e upset
joint in flas h welding, as sh own in Fig. 12.37b? 12.39 E xp lain why some joints may have to be pre
't heated prior to welding.
The important factors are the amount of heat
generated (if too lit tl e heat, the material will
Some joints may have to be preheated pr ior to
not deform to the required extent) , the nature
welding in order to :
of the contracting surfaces (oxid e layers, con
tamin ants, etc.) , the force a pp lied (t he higher
(a) control and reduce the cooling rate, espe
th e force , the greater the upset volume) , the ex
cially for metals with high thermal con
posed length between the pieces and the clamps
ductivity, suchas aluminum and copper,
194
2008 Pearson Education, Inc ., Upper Saddle River, NJ . All rights reserved.
This material is protected by Copyright and writDn perrrission should be oblaned from the publisher prior to any prohibited
reproduction, storage in a retrieval system, or transmission in any form or by a ny means, electronic, mechanical, photocopying, recording , or
2008 Po rsen Education , Inc ., Upper Saddle River . NJ. All rights rose rv d.
This material is protected by Copyright and wrilt n per missio n should be obta ined from the publshor prior to any prohibited
reproduction. storage in a retrieval system. or transmission in any form or by any means, electronic, mechanical, photocopying, recording, or
Rights and Permissions Depa rtme nt, Pearson Education. Inc., Uppe r Saddle River, NJ 07458 .
By t he student . See Sect ion 12.15.1. Note, 12.57 How different is adhesive bonding from other
for example, that if a hole has larg-e burrs
joining methods'! What limitations does it
(see Fig . 7.5) it can adversely a ffect joint qual
have'!
ity, and also possibly causing crevice corrosion
By the student. Revi ew Section 12.14. Adhe
(p . 109). If the hole is significantly larger than
sive bond ing is significan t ly different from other
the rivet , no compress ive st ress will be devel
joining methods in that the workp iece materi
oped on its cylindrical surface when the rivet is
als are of various types, there is no penetration
upset,
of t he work piece surfaces, and bonding is done
at room temperature. Its main limitations are
12.54 What precautions should be taken in mechani
the necessity for clean sur faces, tight clearances,
cal joining of dissimilar metals'!
and the longer times req uired .
By the student. In joining dissimilar metals, 12.58 Soldering is generally a.pplied to thinner com
one must be careful about their possible chemi
ponents. W hy?
cal interact ion. O ften , two dissimilar met als re
act in a cathodic process, causing galvanic cor
Solders have much lower strength than braze
rosion and corrosive wear (see Section 3.9.7).
fillers or weld beads. Therefore, in joining mem
This is especially a concern in marine applica
bers to be subjected to significan t loads, which
tions, where sea salt can cause major degrada.
is typical of members with large thickness , one
tion, as well as in chemical industries.
would nor mally consider brazing or welding,
bu t not soldering. A benefit of solde ring when
12.55 What difficulties are involved in joining plas
joining thin components is that it takes place at
tics'! What about in joining ceramics? Why?
much lower temperatures than br azing or weld
ing, so that one does not have to be concerned
By the student. See Section 12.16. Plastics can
about the workpiece melting due to localized
be difficult to join. The thermal cond uctivity is
heating, or signi fica nt warping in the joint area.
so low that, if me lted, plast ics will flow before
they resolidify; thermosets will not melt , but 12.59 Explain why adhesively bonded joints tend to
will degrade as temperature is incr eased. Ther
be weak in peeling.
moplastics ar e generally soft and thus cannot
Adhesives are weak in peeling because there is
be compressed very much in threaded connec
a concentrated, high tensile stress at the tip of
tions, so the bonds with these processes will not
the joint when being peeled (see Fig. 12.50);
be very strong. T herm oplas tics are usu ally as
consequently,
their low tensile strength reduces
sembled with snap fasteners when st rengt h is
the
peeling
forces
. (Recall that this situation
not a key concern, or with adhesives. Ceramics
is
somewhat
analogous
to crack initiation and
can be joined by ad hesive bonding, and also by
propagation in metals under tensile stresses; see
mechanical means in which the brittleness and
Fig. 3.30.) Note, however, that tougher adhe
notch sensitivity of these materials ar e impor
sives can require considerable force and energy
tant concerns.
to peel, as can be appreciated when trying to
12.56 Comment on your observations concerning the
peel off some adhesive tapes.
197