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VISHAY
Vishay Semiconductors
Features
Glass passivated junction
Hermetically sealed package
Applications
High voltage rectification
Efficiency diode in horizontal deflection circuits
Mechanical Data
Case: Sintered glass case, SOD 64
Terminals: Plated axial leads, solderable per
MIL-STD-750, Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
949588
Parts Table
Part
Type differentiation
BY228
Package
VR = 1500 V; IFAV = 3 A
SOD64
Test condition
Symbol
Value
Unit
VR
1500
IR = 100 A
VRRM
1650
IFSM
50
IFAV
Reverse voltage
Sub type
I(BR)R = 0.4 A
Tj
140
Tstg
- 55 to +
175
ER
10
mJ
Test condition
on PC board with spacing 25 mm
Sub type
Symbol
Value
Unit
RthJA
70
K/W
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1
BY228
VISHAY
Vishay Semiconductors
Electrical Characteristics
Tamb = 25 C, unless otherwise specified
Parameter
Test condition
Sub type
Symbol
Forward voltage
IF = 5 A
VF
Reverse current
VR = 1500 V
IR
Min
Typ.
Max
Unit
1.5
VR = 1500 V, Tj = 140 C
IR
140
trr
20
IF = 0.5 A, IR = 1 A, iR = 0,25 A
trr
3.5
30
20
l
10
TL=constant
0
0
10
15
20
25
2.5
2.0
1.5
1.0
RthJA=70K/W
PCB: d=25mm
0.5
0.0
30
l Lead Length ( mm )
94 9081
VR=VRRM
half sinewave
RthJA=25K/W
l=10mm
3.0
25
50
75
100
125
150
16408
1000
100.000
VR = VRRM
IR Reverse Current ( mA )
I F Forward Current ( A)
10.000
Tj=150C
1.000
Tj=25C
0.100
0.010
0.001
10
1
0.0
0.5
1.0
1.5
2.0
2.5
3.0
VF Forward Voltage ( V )
16407
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2
100
25
16409
50
75
100
125
150
Tj Junction Temperature ( C )
BY228
VISHAY
Vishay Semiconductors
350
70
VR = VRRM
CD Diode Capacitance ( pF )
300
250
PRLimit
@100%VR
200
150
PRLimit
@80%VR
100
50
0
50
40
30
20
10
0
25
16410
f=1MHz
60
50
75
100
125
Tj Junction Temperature ( C )
150
0.1
16411
1.0
10.0
VR Reverse Voltage ( V )
100.0
Package Dimensions in mm
Sintered Glass Case
SOD 64
Weight max. 1.0g
Cathode Identification
4.3 max.
technical drawings
according to DIN
specifications
1.35 max.
26 min.
4.2 max.
26 min.
94 9587
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3
BY228
VISHAY
Vishay Semiconductors
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and
operatingsystems with respect to their impact on the health and safety of our employees and the public, as
well as their impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are
known as ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs
and forbid their use within the next ten years. Various national and international initiatives are pressing for an
earlier ban on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the
use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments
respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
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