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Do Minh Nghiep

Materials Science Center

Electron Microscopy
and Diffraction
4. Electron
Electron-- specimen interaction,
Scattering process and application
Content

 Interaction of primary beam and specimen


 Interaction volume and signals obtained
 Scattering process
 Secondary electron image (SEI) and detector
 Backscattered electron image (BSEI) and detector
 X-ray spectra
 Factors influencing resolution: voltage and Zsample

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Interaction
mode
and volume

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Monte
Monte--Carlo simulation
The size and shape of the
region of primary
excitation can be
estimated by carrying out
simulations that use
Monte Carlo calculations
and take into account the
composition (Z
(Z), thickness
(d) of the specimen and
accelerated voltage ((V
V)

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Monte
Monte--Carlo simulation

 An interaction
volume can also be
used to predict the
types of signals that
will be produced and
the depth from which
they can escape.

 Monte Carlo simulations of electron trajectories are based on 1) the


energy of the primary beam electron, 2) the likelihood of an interaction, 3)
the change in direction and energy of the electron, 4) the mean free path
of the electron and 5) a “random” factor for any given interaction
interaction..
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Monte--Carlo simulation
Monte

http://www.small-world.net/efs.htm
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Interaction volume
Incident beam

Interaction
volume

 Electron
Electron--sample interaction volume has a pear shape (left)
(left)..
 Actual image of interaction volume between incident beam and
sample surface (right) showing shape and size of primary excitation region
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Interaction depth of signals
Prim.
beam
1. Auger electron
Spec.
1. Auger electron (0,1
0,1--2 nm)
nm
surface 2. Sec. electron 2. Secondary
electron (10 nm)
nm
3. Backscattered
3. Back-scat.
electron electron ( 5 mm)
6. Xray fluorescence

4. Charact. X-ray
Primary Signals: 4. Charac. 5. Continiium X-ray
§iÖn tö thø cÊp Xray
6. Fluorescence
§iÖn tö t¸n x¹ ng­îc 5. Xray continium
Xray (  10 mm)
Tia r¬ngen
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Determination of interaction depth

Ec = 7 eV; Eo = 20 keV; r = 7 g.cm-3; d = 0.8 mm

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Use of signals
When the electron beam strikes a sample, both photon and
electron signals are emitted:
Backscattered electron
electron::
Xray: sample
Xray:
Incident electron topographic info and phase
composition (Z) contrast (SEM)
(SEM+EDS/WDS) Xray fluorescence
fluorescence::
elemental composition
Secondary electron
electron:: (EPMA)
surface topography Auger electron
electron::
(SEM) surface composition
Electric current
current::
Specimen electrical property

Transmitted electron:
electron: microstructure, crystal structure, composition (TEM+EELS)

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Informations from interaction

Electron and photon signals give infos about


- Topography of surface
- Microstructure and /or morphology
- Crystal and/or defect structure
- Chemical composition
- Electrical current
- Local magnetic field

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Scattering process

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Electron
scattering
 Scattering
Scattering:: change in the
primary motion direction
 Names:
- without energy loss:
elastic scattering
- with energy loss:
inelastic scattering
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Electron scattering
 Elastic (coherent) scattering: electron changes its
trajectory but energy unchanged
- Scattered transmitted electron (diffraction)
- Back-scattered electron
 Inelastic (incoherent) scattering: electron changes its
trojectory and loses a part of energy for secondary
processes
- Secondary electron
- Auger electron
- Continium and characteristic X-ray radiation
- Cathodoluminiscence

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Electron scattering

The probability of an
elastic vs..
vs an
inelastic collision is
based primarily on
the atomic weight of
the specimen (Z).

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Electron scattering

Elastic scattering Inelastic scattering


 A beam electron interacts with the electrical field  A beam electron interacts with the
of the nucleus of a specimen atom electrical field of electrons of a specimen
 Resulting in: atom
- a change in the direction of the beam electron  Resulting in:
without a significant change in the energy of the - a transfer of energy to the specimen atom
beam electron - secondary electrons (<50 eV), Auger
- backscattered electrons (>50 eV) and continuous electrons, characteristic x-x-rays and
x-rays are formed, electron diffraction cathodoluminescence are formed
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How signals are formed
High
High--energy Secondary electron
primary electron
Primary electron inin--
elastically scattered

A hole is created
L M in the shell
K

Auger electron Characteristic X-


X-ray
Shell electron released
as an Auger electron

A shell electron falls


to the vacant shell

De-
De-excitation occurs by
release of X-
X-ray photon

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Signal
Inelastically
scattered e-
energy
Backscattered
Electron Signal
 Secondary electron:
< 50 eV
 Back-scattered
electron: > 80 % of
primary electron
energy
 X-ray: 0.520 keV

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Auger electron

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Auger electron

 Low energy electrons emitted from the upper 2-


2-3 nm of the surface and
 Contains information about the element that produced it based on its energy
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Auger electron spectrum

An Auger spectrum for Aluminum showing peaks


for different electron replacement events
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Secondary electron
(SE) image and detector

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Secondary electron (SE)
 Secondary electrons are
usually the result of an
inelastic collision in which
the energy of the primary
beam is partly transferred
to an electron that is then
emitted from the atom as
SE.
 Secondary electrons
typically have an energy
of 50 eV or less.

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Secondary
electron

 Although secondary
electrons are produced
throughout the interaction
region, they can only escape
from the uppermost portion
due to their low energy.
 SE gives info of topography
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Primary electron Edge effect and Surface
sample thickness
Primary electron
topography
Fewer SE
escape MoreSE
escape
on edges Fewer SE
contrast by SE
escape on
flat areas

Thick sample  The angle at which the beam


strikes the specimen and the
Primary electron distance from the surface are
SE escape from both sides
important factors in how much
of signal escapes from the
specimen.
specimen.
Thin sample
 Rough area: more signals,
Flat area: fewer signals
 Thick sample  thin sample
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Surface
Sample
surface
topography
contrast by SE
Sometimes one can take
advantage of the this effect
and increase useable
signal by tilting the
specimen towards the
detector and at an angle
relative to the primary
beam.
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Detectors

 SE detector:
- Lateral: side mounted
- Annular: in
in--lens
 BSE detector:
- Solid state detector

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SE detector
 The position of the
secondary electron
detector also affects signal
collection and shadow.
 An in-
in-lens detector within
the column is more
efficient at collecting
secondary electrons that
are generated close to the
final lens (i.e. short
working distance).

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SE detector
 An in
in--lens detector does not
use a faraday collector as
this would affect the primary
beam electrons, but instead
depends on the natural
trajectory of the secondary
electrons to strike it
it..
 It takes advantage of the
focusing action of the lens to
bring these SE to cross over
and then spread out to strike
the annular detector
detector..

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SE detector

Side mounted: deep image In


In--lens: distinckt surface

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SE detector
Phosphorus crystal
2. Scintillator
1. Faraday Electrode
cage/grid Photocathode 4. Photomultiplier tube

SE
Photons Photoelectrons SE
~ 300V +10kV 3. Light guide pipe Dinodes
Amplifier

CRT

SE detector system usually consists of 4 parts: (1) a Faraday cage,


(2) a scintillator, (3) a light guide pipe, (4) a photomultiplier.
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SE detector

Everhart -Thornley detector setup with


Faraday cage biased to +300 V to collect SE
Photomultiplier

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SE detector: Faraday cage

A conventional secondary electron detector is positioned off to the side of the


specimen. A faraday cage (kept at a positive bias) draws in the low energy
secondary electrons. The electrons are then accelerated towards a scintillator
which is kept at a very high bias in order to accelerate them into the phosphorus.
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SE detector: scintillator

Scintillator

The Everhart
Everhart--Thornley detector has an aluminum coating (+ (+10
10--12
keV) that also serves to reflect the photons back down the light pipe
pipe..

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SE detector: scintillator

The scintillator is a
phosphor crystal that
absorbs an electron
and generates a
photon.

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SE detector: scintillator

The photons
produced in the
scintillator are
carried down a
fiber optic light
pipe out of the
microscope.

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SE detector: photomultiplier

Most of the secondary electron detector lies outside of the SEM


chamber and is based on a photomultiplier tube (PMT)
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SE detector: photomultiplier

The PMT is converting the incoming photons into electrons which are then drawn to
dynodes kept at a positive bias. The dynodes are made of material with a low work
function and thus give up excess electrons for every electron that strikes them. The
result “multiplies” the signal contained in each photon produced by the scintillator.
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SE detector: photomultiplier
1. The electronic signal from
the PMT is further increased
by a signal amplifier.
2. Thus an increase in “gain”
is accomplished by voltage
applied to the dynodes of the
PMT and alters the contrast of
the image.
3. An increase in the “black”
level is made by increasing
the current in the amplifier and
alters the brightness of the
image.
4. Signal is thus increased at
the scintillator, PMT, and
amplifier.
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Back
Back--scattered
electron (BSE) image
and detection

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Back-
Back-scattered electron (BSE)

 Backscattered electrons
are the result of elastic
collisions with atoms of the
specimen.
 They result in emitted
electrons that have an
energy of 80 % or more of
the original energy of the
primary beam electron.

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Back-
Back-scattered electron (BSE)
 Backscattered
electrons are also
produced throughout
the interaction region
but because of their
greater energy can
escape from deeper in
the specimen.
 Backward scattering
about 180 o.

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Z-contrast SEI
by BSE
 Production of backscattered
electrons varies with atomic
number (Z).
 Higher atomic number
elements appear brighter (or BSEI
scatter more effectively) than
lower atomic number
elements.
 Resulting image shows
elemental contrast.
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BSE detector
Backscatter electrons
have a greater energy
and can escape from
deeper within the
specimen than can
secondary electrons, but
because they are more
readily produced by high
atomic weight elements
they can be used to
visualize differences in
elemental composition.
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Repulsed SEs Primary e-
BSEs BSE detector
Primary e-

Objective

Primary e-
BSEs
Convert
target
Backward
SEs
SEs from
sample
+300V
-50 V
Grid

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BSE detector

The topography of the specimen will also affect the


amount of backscatter signal and so backscatter
imaging is often carried out on flat polished samples
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BSE detector

Since backscattered electrons have a high energy they


cannot be collected by way of a Faraday cage or other device
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BSE detector

The most common design is a four quadrant solid state


detector that is positioned directly above the specimen
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BSE detector

Two image modes:


- COMPO (A+B)
composition image
- TOPO (A-B)
topography image

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Example 1
SEI

Blood cells with


nuclei stained with
a silver compound
are visible in
backscatter mode,
BSEI even though they
are beneath the
surface of the cell
membrane.

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Example 2

Gold particles on E. coli appear as bright white dots due to


the higher percentage of backscattered electrons compared
to the low atomic weight elements in the specimen.
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Example 3

Ni

Backscatter image of nickel in a leaf


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Example 4

Backscatter image of a composite (polished cement


fragment) in which low atomic weight particles appear
dark and high atomic weight particles are white.
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Electron detectors in
Environmental SEM
• BSE Detector: Large-area scintillator detector
is more suitable than E-T detector. Because of
electric discharge of the last, BSEs lose a bit
of energy in the gas medium and have enough
energy to activate scintillator.
• SE Detector: Gas-Amplification Detector (Gas
Phase Detector)

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Environmental SEM

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Environmental
SEM
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SE detector in Environmental SEM
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SE detector in Environmental SEM

Environmental electrons are a form of secondary electrons that


are produced via interactions of secondary electrons produced
by the specimen that strike gas molecules in the chamber, thus
amplifying the signal.
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SE detector in Environmental SEM

Movie of melting sample in ESEM

An environmental SEM or ESEM actually requires gas of


some sort (usually water vapor) to create the signal and
can operate at elevated pressures as high as 1 x 10 Torr
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Watching paint dry in ESEM

0 min. 15 min.

10 min.
20 min.

Example
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The ESEM uses a special detector
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X-ray spectrum

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X-rays
 X-rays are indirectly produced
when an electron is displaced
through a collision with a
primary beam electron and is
replaced by another electron
electron..
 The resultant loss of energy is
given off in the form of an X-ray.
ray.
 The energy will always be less
than the energy of the primary
beam electron
electron..

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X-ray spectrum
EDS

 Because of their high


energy (5-20 keV) X-rays
can escape from very
deep in the specimen.
 X-rays are used for
elemental analysis (EDS,
WDS)
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Resolution and its
influencing factors

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Resolution decreases as
interaction volume increases
 Resolution in an SEM is
ultimately determined by
the size of the region
from which signal is
produced.
 Thus for the same
region of excitation the
resolution from the three
signals differs and
decreases from
secondary to backscatter
and X-X-rays.
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Resolution and excitation region

If the region of excitation remains small then signal will be


produced from a small region and there will be no overlapping
from adjacent regions. In this case each individual spot is
resolved from its neighbors.
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Resolution and excitation region

Even a slight increase in size of the region of signal


production can result in decreased resolution.
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Resolution and excitation region

If the beam is scanned in exactly the same positions but


the region of excitation is larger then the regions of signal
production will also be larger and overlap with adjacent
ones. Such an image would therefore not be resolved
resolved..
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Interaction volume are affected by
dB, EB and Zsamp

Factors affecting size of


the interaction region are:
 Diameter of the primary
beam dB
 Energy of the primary
beam EB
 Atomic weight of the
specimen Zsamp
 Coating of specimen

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How dB, EB and Zsamp affect
the resolution

Resolution Interaction Beam Beam Atomic


Resolution Power, volume, diameter, energy, weight, Coating
RP Vint dB EB Zsamp

      thin, heavy

      thick, light

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Affect of beam crossover
 Final primary beam probe size
dB from a field emitter is (10-
10-
100)x
100 )x smaller than that of a
conventional tungsten filament
or LaB6 emitter
emitter.. This is one
reason why FESEMs have the
best image resolution
resolution..

 FESEMs also tend to remain stable at very low accelerating


voltages (0.5 – 5 keV) resulting in shallow (nông
(nông)) regions of
excitation and thus higher image resolution.

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Resolution and stigmatism

Overlapping of signal production is also the primary reason why it


is so critical to have the beam of an SEM properly stigmated.
Even if the size of the region is kept small, it is only those regions
which are perfectly circular that will produce the best resolution.

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Resolution and stigmatism

Astigmatic regions may not reduce image


resolution in one dimension.
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Resolution and stigmatism

But can still reduce resolution by overlapping


with adjacent regions.
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Example 1: affect of coating

Chromium

Gold

Mycoplasma pneumonia sputtered by


Au gives better image than by Cr
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Affect of
accelerated

Increasing E
voltage Increasing Z Z RP

and atomic
weight
E RP

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Affect of accelerated voltage
and atomic weight

The relationship of accelerating voltage (Eo) to atomic weight


(Z) of the specimen and its affect on the depth of penetration
is in reverse order.
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Example 2:
affect of accelerating voltage

3,0 keV 20,0 keV

At higher voltage image is brighter due to more signal

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Example 3:
affect of accelerating voltage

3,0 keV 20,0 keV

But reduced resolution because of


larger interaction volume caused.
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Resolution - cathode material -
voltage relationship

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