PCB layout and design specifications

PCB design must know the PCB layout and design specifications
We all know that "no rules no standards," technology is the same, that in
PCB design time and need to pay attention to what spec?
Layout design specifications
A, should be greater than the distance from the plate edge 5mm = 197mil
B, first place and close structural elements, such as connectors, switches,
power sockets, etc.
C, placing priority circuit block of core components and bulky components,
and then to the center of the core element is placed around the circuit
components
D, power components placed in favor of the position of the heat
E, greater quality components should be avoided on the center plate,
should be close to the chassis side fixed placement
F, a high-frequency connection element as close as possible to reduce the
electromagnetic interference and distribution of high-frequency signal
G, input and output devices as far away
H, components with high pressure as possible on the commissioning of the
reach of the hand
I, thermal element away from the heating element
Layout J, adjustable element should be easy to adjust
K, consider the signal flow, reasonable arrangement of the signal flow of
the layout consistent as possible
L, the layout should be uniform, neat, compact
M, SMT components should note pad direction far as possible, in order to
facilitate assembly and welding, to reduce the possibility of bridging
N, decoupling capacitors should be close to the location of the power input
O, element surface wave height limit of 4mm
P, has a double-sided element PCB, larger denser IC, plug-in components
on the top plate, the bottom element only put a small number of pins and
small and loosely arranged chip components
Q, small size and high calorie plus radiator element is particularly important
to dissipate heat through the copper can lower power elements, and these
elements try not to put around the thermal element
R, high speed element as close to the connector; digital and analog circuits
widely apart, separated by the best land, and then single-point ground
S, near the positioning hole to pad distance not less than 7.62mm (300mil),
from the positioning hole to the edge of the surface-mount device is not less
than 5.08mm (200mil)
Wiring design specifications
A, the line should be avoided at an acute angle, right angle, forty-five
degrees should be used to trace
B, adjacent layers in the orthogonal direction to the signal line
C, high-frequency signal as short as possible
D, input and output signals to avoid adjacent parallel lines, between the
best online plus ground, to prevent feedback coupling
E, dual panel power lines, ground toward the best consistent with the data
flow, in order to enhance noise immunity

F, digital ground, analog ground should be separated. Clock and highfrequency signal line according to the characteristic impedance of the line
width asked to consider, so that impedance matching
G, block board wiring, drilling should be uniform
H, separate power and ground planes, power lines, ground as short and
thick, loop power supply and constructed as small as possible
I, the clock wiring should be less played the hole, try to avoid walking and
other signal lines and lines, and away from the general signal line, to avoid
interference with the signal line; at the same time the power supply is part of
the board, power and clock to prevent mutual interference ; when a circuit
board has a plurality of different frequency clock, two different frequencies of
the clock line and can not walk the line; avoid going near the clock line output
interface, to prevent high-frequency clock output coupled to the cABLE line
and transmitted; as board on a dedicated clock generation chip, which can not
go below the line, shall be covered in copper below, if necessary, its
specialized annexations
J, paired differential signal lines generally parallel lines, played sparingly
hole punch when necessary, should play with two lines, in order to achieve
impedance matching
K, two spot pitch is very small, can not be directly connected between the
pads; from mount pad via leads as far away from the pad farther.
pls contact sally sales15@raypcb.com ,skype:raypcb15 for more details.
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