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Product information

BOBO
ELLE_ANDY@163.COM

For mechanical

General Description

Directory

. Presentation of Camera
. Camera of all sort
. Cameras principium
. The structure of the Camera and subassembly
. The guide line of camera
. The camera roadmap

For mechanical

Presentation of Camera

1.0 A routine of presentation

2.0 Technology of presentation

For mechanical

1.0

Presentation of Camera

A routine of presentation

CAMERA

CAMERA
mobile phone30
130200

For mechanical

Presentation of Camera

2.0 Technology of presentation

General Description
The camera module is a sensors on board module designed for mobile application
where low power consumption and small size are of utmost importance.
Proprietary sensor technology utilizes advanced algorithms to cancel Fixed Pattern
Noise (FPN), eliminate smearing, and drastically reduce blooming. All required camera
functions are programmable through the Serial Camera Control Bus (SCCB ) interface.
The device can be programmed to provide image output in various fully processed
and encoded formats.

Application
PC Camera/ Dual Mode, and Cellular phones
Video conference equipment, Machine vision, Security camera,
Biometrics, Digital Still Cameras

For mechanical

Camera of all sort

1.0 Digital camera

2.0 Digital Still Cameras

For mechanical

Camera of all sort

1.0 Digital camera

USB
HOST SYSTEMCAMERA
USB
IO (BTB,USB,MINI USB)HOST SYSTEMHOST SYSTEM
DISPLAYCAMERACAMERADIGITAL
CAMERA

For mechanical

Camera of all sort

2.0 Simulant camera

SYSTEM MEMORY
HOST SYSTEM
HOST SYSTEMDISPLAY

For mechanical

Cameras principium

1.0

General Description

2.0

System Show

For mechanical

.
1.0

Cameras principium

General Description
LENS

A/D
DSPIODISPLAY

CAMERA

LENS

A/D(CMOS

IO

DISPLAY

SCE

SENSOR

(DSP)

(PC)

(PIC)

For mechanical

.
2.0

Cameras principium

System Show

For mechanical

Cameras principium

For mechanical

Cameras principium

MicroMI360 CMOS

For mechanical

The structure of the Camera and subassembly

CCD
CCD
LENS
CAMERASENSORCCD
LENSSENSORSENSOR
SENSORLENS

A. RGBR.G.B
RGB
B. CMYKCMYK
RGB
SENSOR
CCDSENSORSENSOR
DSP
For mechanical

The structure of the Camera and subassembly


Assembly method proposal
Socket type(camera module detachable)

Soldering reflow process can be applicable for the socket.


Sockets are applied from Socket maker directly.

For mechanical

The structure of the Camera and subassembly

CCD

Micro-lens

Surface shield
Color Filter

Readout gate

n
n
Si-sub

Detection Node

SiO2
photodiode

Leak current flowing into photo


diode

defect

For mechanical

The structure of the Camera and subassembly


1.0 LENS
CAMERAPLASTIC)(GLASS)
CAMERA1P,2P,1G1P,1G3P,2G2P,4G
MOBILE PHONE
CAMERA1G3P13

2.0 SENSOR
SENSOR

SENSOR
CCDCharge Couple Device)
CMOSComplementary Metal Oxide Semiconductor

For mechanical

The structure of the Camera and subassembly

CCD/CMOS
A.
CCD
CMOSAADC

B.
CCD
CMOS
CMOS

CCD

For mechanical

The structure of the Camera and subassembly

C.
CCDCCDADC
34
CMOSCCD1/3CMOS
3.3V

For mechanical

The structure of the Camera and subassembly

D. Structure comparison : CCD sensor & CMOS


sensor
Aluminum layer
CCD sensor
Oxide layer

CMOS sensor

Electron

Horizontal CCD

Vertical scan

Vertical CCD

Vertical CCD

Electron

Horizontal scan
For mechanical

The structure of the Camera and subassembly

E. Operation Comparison
Interline transfer CCD

Frame transfer CCD

PD

PD

PD

PD

PD

PD

PD

PD

PD

PD

PD

PD

PD
PD

PD

PD

PD

PD

PD

PD

PD

PD

PD

PD to V-CCD

V-CCD to H-CCD

PD
PD
PD

Storage
section

PD

H-CCD to Amp Tr

Horizontal CCD

Horizontal CCD

IT-CCD

PD

Vertical CCD

PD

PD

PD

Vertical CCD

PD

PD

Image
section

PD

Vertical CCD

PD

Vertical CCD

PD

Vertical CCD

Vertical CCD

Photo diode

Amp Tr

FT-CCD
For mechanical

The structure of the Camera and subassembly

Frame interline transfer CCD

PD

PD

PD

PD

PD

PD

PD

PD

Storage
section

PD

Vertical CCD

PD

Vertical CCD

Image
section

PD

PD

Vertical CCD

Photo diode

Horizontal CCD

Amp Tr

FIT-CCD

For mechanical

The structure of the Camera and subassembly


Performance comparison
(CCD)

The same pixel size is assumed

IT CCD

FT CCD

FIT CCD

Dyastron
sensor

Sensitivity

good

good without

good

good

Noise

good

fair

good

good

Smear

large

large

small

None

Chip size

small

large

large

small

micro lens

For mechanical

The structure of the Camera and subassembly

F. Power consumption comparison :CMOS sensor CCD

1k
Proportional to array resolution
CCD with driver and ADC

300

makes big difference in Mega pixel area

100

30

CMOS ( No ADC)
Proportional to square root of array
resolution

10

10

33

100

300

Array resolution ( 10k pixels)


For mechanical

The structure of the Camera and subassembly

H. Module construction comparison CMOS vs CCD


(CCD block)
CCD drive circuit : 2or3chip+3power
Size of module is large

(CMOS block)
include drive circut
Size of module is small

Mechanical
shutter

H-Driver
V-Driver

+5V

-7.5V

CMOS

CCD

TG

+15V

3 power source

Optical lens
S/H,
A/D,
DSP

(DSP&JPEG)
Optical
Lens

Image
processo
r(JPEG)
+2.5V

Image
processo
r

+1.5V

1 or 2 power source

For mechanical

The structure of the Camera and subassembly

I. CCD camera module structure


Elaborate high density assembly technology is required in each case to install
several semiconductor chips and many passives onto board.

CCD:MID

CCD: CSP

DSP: flip chip

DSP: MCP BGA

CCD: Wire bonding


DSP :MCP BGA

For mechanical

The structure of the Camera and subassembly

J. Dynastron camera module structure


Much simpler assembly owing to single chip and fewer passives

Lens

IR cut glass

Sensor chip
Substrate (FR4)

For mechanical

The structure of the Camera and subassembly


CMOS
A. CCD

B.

5lux
C.

CCD
CCDMOBILE PHONECAMREACMOS
MOBILE PHONECCD CAMERA

For mechanical

The structure of the Camera and subassembly


3.0 A/D
A/DADC(Analog Digital Converter )
ADCCAMERA SYSTEM
ADC
CAMERACMOSA/D

4.0 DSP
DSPDIGITAL SIGNAL PROCESSING
USBPC
DSP:
A. ISPimage signal processor
B. JPEG encoderJPEG
C. USB device controllerUSB

For mechanical

. The guide line of camera

1.0
JPEG(joint photographic expert group)

JPEG

2.0

3.0

For mechanical

. The guide line of camera


4.0 AWB

SENSORSENSOR

5.0
3.3V2.5V

For mechanical

. The guide line of camera


6.0

A/Dbit

SENSOR24SENSOR36
z 24SENSOR2^8=2568
2562562561677
z 36SENSOR2^12=409612
40964096409668.7

For mechanical

. The guide line of camera


7.0 /(IO)
RS232/422:115kbit/s
PP1Mbit/s
IrDA115kbit/s
USBUSB1.112Mbit/s,USB2.0
480bit/s
IEEE1394()(ilink):100M~400Mbit/s

8.0 (image Format/ Color space)


RGB24,I420
RGB24RGB8bit256256*256*256

I420YUV
: RGB565RGB444YUV4:2:2
For mechanical

. The guide line of camera


9.0 Resolution
1024*7681024
768

/(Resolution)
SXGA1280 x1024130
XGA1024 x76880
SVGA800 x60050
VGA640x4803035648X488
CIF(352x288) 10
SIF/QVGA(320x240)
QCIF(176x144)
QSIF/QQVGA(160x120)

For mechanical

The camera roadmap

CAMERACAMERA
CAMERACAMERA
CAMERA
CAMERA
CAMERA

For mechanical

END

For mechanical

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