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Article history:
Received 5 July 2013
Received in revised form
27 March 2014
Accepted 1 April 2014
Available online 28 April 2014
Additive Manufacturing (AM) processes for metallic parts using both laser and electron beam heat
sources are becoming increasingly popular due to their potential of producing near net shape structural
components. The thermal history generated by additive manufacturing is essential in determining the
resulting microstructure, material properties, residual stress, and distortion.
In this work nite element techniques for modeling metal deposition heat transfer analyses of
additive manufacturing are investigated in detail. In particular, both quiet and inactive element
activation are reviewed in detail and techniques for minimizing errors associated with element
activation errors are proposed. 1D and 3D numerical examples are used to demonstrate that both
methods can give equivalent results if implemented properly. It is also shown that neglecting surface
convection and radiation on the continuously evolving interface between active and inactive elements
can lead to errors. A new hybrid quiet inactive metal deposition method is also proposed to accelerate
computer run times.
& 2014 Elsevier B.V. All rights reserved.
Keywords:
Additive manufacturing
Metal deposition
Element activation
Heat transfer
1. Introduction
Additive Manufacturing (AM) processes for metallic parts using
both laser and electron beam heat sources have the potential of
producing near net shape structural components over a range of
sizes (mm3 through m3). Applications range from customized
medical implants to aerospace components. Both laser and electron beam based deposition systems have been utilized to deposit
a range of materials. All Additive Manufacturing processes are
similar in that a three dimensional part represented by a CAD le
is sliced into layers (build plan) which in turn dene scan
trajectories of the heat source. A high power energy source (laser
or electron beam) is used to heat and melt metal powder or wire,
which solidies to form a fully dense layer. The powder may be fed
to the heat source through nozzles or may be raked into at layers
in powder bed systems. The addition of multiple layers can
produce a three dimensional fully dense part.
Signicant research has been devoted over the past ten years
into investigating the effects of processing parameters on the
resulting microstructure during additive manufacturing [17].
Another concern in additive manufacturing is distortion and
residual stress [813]. The thermal history generated by additive
manufacturing is essential in determining the resulting microstructure, material properties, residual stress, and distortion.
Modeling the thermal history of the additive manufacturing
process is similar to modeling multi-pass welding [4,1416].
Thermo-mechanical modeling of welding has been an active research
http://dx.doi.org/10.1016/j.nel.2014.04.003
0168-874X/& 2014 Elsevier B.V. All rights reserved.
area since the late 1970s [1719]. A detailed review of nite element
modeling for welding is available in references [2027]. Typically,
transient heat conduction analyses are performed in Lagrangian
reference frames as opposed to Eulerian transport analyses which
most often used to predict the temperature eld and physical shape
of the melt pool [2832], buoyancy, surface tension, and magnetohydro-dynamic effects [33], or powder melt pool interaction [34].
Building a complex part with additive manufacturing may require
depositing hundreds or thousands of layers of material which compared to multi-pass welding introduces signicant computational cost.
Therefore, computational efciency becomes paramount. Notable
work in the thermal and microstructural modeling in additive
manufacturing is available in Refs. [15,7]. Residual stress and deformation modeling is investigated in Refs. [1416,35,36].
The material deposition in additive manufacturing is modeled by
using inactive or quiet elements which are activated as the added
material (powder or wire) solidies. Two metal deposition methods
are reported for modeling material deposition: (1) the use of quiet
or (2) inactive elements [23,37,38]. In the quiet approach, the
elements are present in the analysis but are assigned properties
so they do not affect the analysis. In the inactive element approach,
elements are not included in the analysis until the corresponding
material has been added. A variety of general purpose commercial
codes have been reportedly used to model metal deposition: Zhu
et al. [39] use Ansys et al. [40,41] use Adina et al. [42] and Ye et al.
[43] use Abaqus et al. [44] use Comsol, and Lundback and Lindgren
[14] use Marc. However, the numerical approach implemented
52
qp x; t h T T 1 sT 4 T 41
dH dH dT
dT
C p
dt
dT dt
dt
Q x; t C p
dT
kTT 0
dt
8
dn T n T n 1 T
Cn
dn t
t n 1t
Aq element
dR
dn T
on the surface AT
qs x; t qp x; t
on the surface Aq
#
1
B TN N
N N N C p n
B kB B
dV
T
T
t n 1t
V element
"
#
Z
C p n T n 1 T
N
NT N
dV
T n t n 1 t
V element
Z
q
11
NT N dA
T
Aq element
Q x; t
"
T k n
T Q
12
T BT
13
Aq
AT
Fig. 1. A body with volume V, prescribed temperature on surface AT, and prescribed
surface ux on surface Aq.
14
C p quiet sC p C p
15
where, kquiet and C p quiet are the thermal conductivity and specic
heat used for quiet elements, and sk and sC p are the scaling factors
used for the thermal conductivity and specic heat, respectively.
The quiet element method has the following advantages:
53
T2
T1
T3
Fig. 3. Illustration of interface between active and inactive (or quiet) elements.
Eqs. (10) and (11) for the inactive elements before their
activation. n 1 T is not reset for the active elements, otherwise,
energy would be lost.
4. Interface between active and inactive elements
Fig. 3 illustrates a nite element mesh for the simulation of
building a thin wall by powder fed metal deposition additive
manufacturing. The active element region is shown as contour shaded
with temperature results and the inactive (or quiet) region as translucent. The interface between active and inactive (or quiet) elements is
also illustrated in the gure. Surface convection and radiation conditions (Eq. (5)) need to be applied to this interface since it is an external
free surface. The interface continuously changes as the metal is
deposited during processing. Therefore, algorithms need to be developed to calculate the location of the evolving interface and apply
surface convection and radiation as needed.
As seen in Fig. 3, the interface is an internal surface in the mesh.
When using general purpose FEA codes, it is difcult to compute
the interface between active and inactive (or quiet) elements using
user subroutines. Thus, it is common practice to neglect the
surface convection and radiation on this interface. This simplication may be appropriate in weld modeling since the ller metal
and therefore the size of the interface is negligible compared to
the base metal. However, in additive manufacturing, the size of the
deposited material could be signicant compared to the substrate
and thus neglecting surface convection and radiation on the
interface between active and inactive elements can be a source
of error as demonstrated in the examples section.
5. Numerical examples
5.1. 1D Examples
The 1D bar problem of Fig. 4 is used to illustrate and quantify
potential errors of the implementation of the quiet and inactive
80
60
Temperature (C)
40
20
0
20
40
10
10
Xcoordinate (mm)
54
53.5
53
Temperature (C)
54
52.5
q1:sk=1,scp=1
q2:sk=.01,scp=1
q3:sk=.0001,scp=1
q5:sk=.0001,scp=.1
q6:sk=.0001,scp=.01
q7:sk=.0001,scp=.01,100elmts
q8:sk=.0001,scp=.01,(n1)T reset
exact
52
51.5
51
50.5
50
49.5
Xcoordinate (mm)
Table 1
1D quiet element method test cases and results.
Case #
# of elements
sk
sC p
n1
Exact
q1
q2
q3
q4
q5
q6
q7
q8
10
10
10
10
10
10
100
10
1
.01
.0001
.000001
.0001
.0001
.0001
.0001
1
1
1
1
.1
.01
.01
.01
No
No
No
No
No
No
No
Yes
T reset
T center (% err)
100
50.0000 ( 50.0000)
85.7959 ( 14.2041)
88.3958 ( 11.6042)
88.4261 ( 11.5739)
98.6704 ( 1.3296)
99.8347 ( .1653)
99.9016 ( .0984)
99.8347 ( .1653)
100
T center (% err)
50
50.0000 (2.8422e 14)
50.0000 (2.8422e 14)
50.0000 (1.8943e 11)
50.0000 (1.8915e 11)
52.6393 (5.2786)
53.6090 (7.2180)
53.2298 (6.4596)
49.9635 ( .0729)
Table 2
1D inactive element method test cases and results.
Case # # of elements
n1
Exact
i1
i2
i3
i4
No
No
Yes
Yes
10
100
10
100
T reset
T center (% err)
100
100
100
100
100
100
T center (% err)
50
55.0000
50.5000
50.0000
50.0000
(0)
(0)
(0)
(0)
(10.0000)
(1.0000)
( 4.2633e 14)
(3.4106e 13)
100
i1:10elmts
i2:100elmts
i3:10elmts,(n1)T reset
i4:100elmts,(n1)T reset
exact
90
80
Temperature (C)
60
50
40
30
20
10
0
10
Xcoordinate (mm)
56
55
Temperature (C)
54
i1:10elmts
i2:100elmts
i3:10elmts,(n1)T reset
i4:100elmts,(n1)T reset
exact
53
52
51
50
49
70
10
Xcoordinate (mm)
55
p
6 3P f 3x2 =a2 3y2 =b2 3z vw t2 =c2
p e
abc
16
17
56
Fig. 10. Substrate heating and quiet element wall model (1C, case sq1).
Table 3
Thermal properties of TI64.
Temperature (1C)
23
93
205
315
426
537
649
760
871
6.6E 3
7.3E 3
9.1E 3
10.6E 3
12.6E 3
14.6E 3
17.5E 3
565
574
603
649
699
770
858
959
2000
s1:substrate only, reference
sq1:sk=.000001,scp=.01
si1
1500
Temperature (C)
1000
500
500
1000
10
10
15
Zcoordinate (mm)
Fig. 11. Comparison of wall build temperature results.
Table 4
Substrate test cases and results.
Case #
Description
Method
sk
sC p
n1
s1
sq1
si1
Substrate only
Substrate and wall
Substrate and wall
Quiet
Inactive
.000001
.01
T reset
max % err
Reference
.0390
6.375e 5
57
Case #
Interface
conv & rad
Method
sk
sC p
n1
wq1
wq2
wi1
wi2
wiq1
wiq2
wiq3
Yes
Yes
Yes
Yes
Yes
Yes
No
Quiet
Quiet
Inactive
Inactive
Inactive/quiet
Inactive/quiet
Inactive/quiet
.000001
.000001
.01
.01
.000001
.000001
.000001
.01
.01
.01
No
Yes
No
Yes
No
Yes
Yes
T reset
max % err
4.1234
.3734
5.3056
Reference
3.5323
.5242
7.5832
Table 6
Wall build run times (s).
Case #
wq1
wq2
wi1
wi2
wiq1
wiq2
wiq3
1029
1009
2383
1875
1062
976
1014
7864
7587
8102
8179
6313
6284
6296
58
Fig. 12. Wall build using quiet elements (1C, case wq2).
Fig. 13. Wall build not showing quiet elements (1C, case wq2).
59
Fig. 14. Wall build using inactive element layers, quiet elements within layer (1C, case wiq2).
2500
Temperature (C)
2000
wq2: quiet,sk=.000001,scp=.01
wi2: inactive, reference
wi3:inactive, no interface bcs
1500
6. Conclusions
1000
500
500
10
10
15
Zcoordinate (mm)
Fig. 15. Comparison of wall build temperature results.
60
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