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APM4115PU

P-Channel Enhancement Mode MOSFET

Features

Pin Description

-40V/-45A,
RDS(ON)= 12.5m (typ.) @ VGS=-10V

D
G

RDS(ON)= 18.5m (typ.) @ VGS=-4.5V

Super High Dense Cell Design

Reliable and Rugged

Top View of TO-252-3

Lead Free and Green Devices Available (RoHS


S

Compliant)

Applications

Power Management in LCD TV Inverter


D

P-Channel MOSFET

Ordering and Marking Information


Package Code
U : TO-252-3
Operating Junction Temperature Range
C : -55 to 150 oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device

APM4115P
Assembly Material
Handling Code
Temperature Range
Package Code

APM4115P U :

XXXXX - Date Code

APM4115P
XXXXX

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements
of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. ANPEC defines Green to
mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous
material and total of Br and Cl does not exceed 1500ppm by weight).

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright ANPEC Electronics Corp.
Rev. A.1 - Jul., 2009

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APM4115PU
Absolute Maximum Ratings
Symbol

Parameter

Rating

Unit

Common Ratings (TA=25C Unless Otherwise Noted)


VDSS

Drain-Source Voltage

-40

VGSS

Gate-Source Voltage

20

Maximum Junction Temperature

150

-55 to 150

TC=25C

-20

TC=25C

-90

TC=100C

-60

TC=25C

-45

TC=100C

-30

TC=25C

50

TC=100C

20

TJ
TSTG

Storage Temperature Range

*
IS

Diode Continuous Forward Current

IDP
ID

300s Pulse Drain Current Tested

PD

Continuous Drain Current

RJC

Maximum Power Dissipation


*

*
RJA

Thermal Resistance-Junction to Case

2.5

C/W

Thermal Resistance-Junction to Ambient

50

C/W

Notes: * Surface Mounted on 1in pad area, t 10 sec.


2

Electrical Characteristics

(TA = 25C unless otherwise noted)


APM4115PU

Symbol

Parameter

Test Conditions

Unit

Min.

Typ.

Max.

-40

-1

-30

-1.5

-2

-2.5

V
nA

Static Characteristics
BVDSS Drain-Source Breakdown Voltage
IDSS

Zero Gate Voltage Drain Current

VGS(th)
IGSS
RDS(ON)

VGS=0V, IDS=-250A
VDS=-32V, VGS=0V
TJ=85C

V
A

Gate Threshold Voltage

VDS=VGS, IDS=-250A

Gate Leakage Current

VGS=20V, VDS=0V

100

VGS=-10V, IDS=-20A

12.5

15.5

VGS=-4.5V, IDS=-10A

18.5

24.5

ISD=-20A, VGS=0V

-0.75

-1.1

28

ns

26

nC

Drain-Source On-state Resistance

Diode Characteristics
a

VSD

Diode Forward Voltage

trr

Reverse Recovery Time

Qrr

Reverse Recovery Charge

Copyright ANPEC Electronics Corp.


Rev. A.1 - Jul., 2009

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ISD=-20A, dlSD/dt=100A/s

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APM4115PU
Electrical Characteristics (Cont.)

(TA = 25C unless otherwise noted)


APM4115PU

Symbol

Parameter

Dynamic Characteristics
Gate Resistance

Ciss

Input Capacitance

Coss

Output Capacitance

Crss

Reverse Transfer Capacitance

td(ON)

Turn-on Delay Time

tr

Turn-on Rise Time

td(OFF)

Turn-off Delay Time

VGS=0V,VDS=0V,F=1MHz
VGS=0V,
VDS=-20V,
Frequency=1.0MHz

VDD=-20V, RL=20,
IDS=-1A, VGEN=-10V,
RG=6

Turn-off Fall Time

Gate Charge Characteristics


Qg

Min.

Typ.

Max.

2800

320

220

11

21

75

135

89

161

35

64

40

56

12

Unit

RG

tf

Test Conditions

Gate-Source Charge

Qgd

Gate-Drain Charge

pF

ns

Total Gate Charge

Qgs

VDS=-20V, VGS=-10V,
IDS=-20A

nC

Note a : Pulse test ; pulse width300s, duty cycle2%.


Note b : Guaranteed by design, not subject to production testing.

Copyright ANPEC Electronics Corp.


Rev. A.1 - Jul., 2009

Downloaded from DatasheetLib.com - datasheet search engine

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APM4115PU
Typical Operating Characteristics
Power Dissipation

Drain Current
50

60

50

-ID - Drain Current (A)

40

Ptot - Power (W)

40

30

20

30

20

10

10

TC=25 C,VG=-10V

TC=25 C
0

20

40

60

80 100 120 140 160 180

20

60

80 100 120 140 160

T - Junction Temperature (C)

T - Junction Temperature (C)

Safe Operation Area

Thermal Transient Impedance

Normalized Transient Thermal Resistance

200
100
Lim
it

1ms

Rd
s(o
n)

-ID - Drain Current (A)

40

10

10ms
100ms
1s
DC

TC=25 C

0.1
0.01

0.1

10

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0.2
0.1
0.05

0.1
0.02

0.01

0.01

Single Pulse

1E-3
1E-4

100

-VDS - Drain - Source Voltage (V)

Copyright ANPEC Electronics Corp.


Rev. A.1 - Jul., 2009

Duty = 0.5

Mounted on 1in pad


o
RJA :50 C/W

1E-3

0.01

0.1

10

100

Square Wave Pulse Duration (sec)

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APM4115PU
Typical Operating Characteristics (Cont.)
Output Characteristics

Drain-Source On Resistance

100

35

-5V

-ID - Drain Current (A)

80

RDS(ON) - On - Resistance (m)

90

40

VGS=-6,-7,-8,-9,-10V

70
-4.5V

60
50
40

-4V

30
20

-3.5V

30

VGS=-4.5V

25
20
VGS=-10V

15
10
5

10

-3V

0
0.0

0.5

1.0

1.5

2.0

2.5

3.0

20

40

60

-VDS - Drain - Source Voltage (V)

-ID - Drain Current (A)

Drain-Source On Resistance

Gate Threshold Voltage


IDS =-250A

ID= -20A

1.4

35

Normalized Threshold Voltage

RDS(ON) - On - Resistance (m)

100

1.6

40

30
25
20
15
10
5

80

1.2
1.0
0.8
0.6
0.4
0.2

0.0
-50 -25

10

-VGS - Gate - Source Voltage (V)

Copyright ANPEC Electronics Corp.


Rev. A.1 - Jul., 2009

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25

50

75

100 125 150

Tj - Junction Temperature (C)

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APM4115PU
Typical Operating Characteristics (Cont.)
Drain-Source On Resistance

Source-Drain Diode Forward

2.0
IDS = -20A

1.6
o

-IS - Source Current (A)

Normalized On Resistance

1.8

100

VGS = -10V

1.4
1.2
1.0
0.8
0.6

10

Tj=25 C

0.4
1

0.2

0.0
-50 -25

RON@Tj=25 C: 12.5m
0

25

50

75

0.5
0.0

100 125 150

0.6

0.9

1.2

1.5

-VSD - Source - Drain Voltage (V)

Capacitance

Gate Charge
VDS= -20V

-VGS - Gate-source Voltage (V)

3200
2800

Ciss

2400
2000
1600
1200
800
Coss

400

10

15

20

25

30

35

8
7
6
5
4
3
2

40

-VDS - Drain - Source Voltage (V)

Copyright ANPEC Electronics Corp.


Rev. A.1 - Jul., 2009

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ID= -20A

Crss
5

1.8

10

Frequency=1MHz

0
0

0.3

Tj - Junction Temperature (C)

3600

C - Capacitance (pF)

Tj=150 C

10

15

20

25

30

35

40

QG - Gate Charge (nC)

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APM4115PU
Package Information
TO-252-3
E

A
E1

c2

L4

D1

L3

b3

SEE VIEW A

GAUGE PLANE

SEATING PLANE

0.25

A1

L
VIEW A
TO-252-3

S
Y
M
B
O
L

MIN.

MAX.

MIN.

MAX.

2.18

2.39

0.086

0.094

MILLIMETERS

INCHES

0.005

0.13

A1
b

0.50

0.89

0.020

0.035

b3

4.95

5.46

0.195

0.215

0.46

0.61

0.018

0.024

c2

0.46

0.89

0.018

0.035

5.33

6.22

0.210

0.245

D1

4.57

6.00

0.180

0.236

6.35

6.73

0.250

0.265

E1

3.81

6.00

0.150

0.236

2.29 BSC

0.090 BSC

9.40

10.41

0.370

0.410

0.90

1.78

0.035

0.070

L3

0.89

2.03

0.035

0.080

L4
0

0.040

1.02
0

Note : Follow JEDEC TO-252 .

Copyright ANPEC Electronics Corp.


Rev. A.1 - Jul., 2009

Downloaded from DatasheetLib.com - datasheet search engine

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APM4115PU
Carrier Tape & Reel Dimensions
P0

P2

P1

B0

E1

OD0

K0

A0

OD1 B

SECTION A-A

SECTION B-B

H
A

T1

Application

330.02.00 50 MIN.
TO-252-3

P0

4.00.10

T1

P1

8.00.10

E1

16.4+2.00 13.0+0.50
-0.00
-0.20 1.5 MIN. 20.2 MIN. 16.00.30 1.750.10 7.500.05
P2

D0

2.00.05

1.5+0.10
-0.00

D1

1.5 MIN.

A0

B0

K0

0.6+0.00
-0.40 6.800.20 10.400.20 2.500.20
(mm)

Devices Per Unit


Package Type
TO-252-3

Unit
Tape & Reel

Copyright ANPEC Electronics Corp.


Rev. A.1 - Jul., 2009

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Quantity
2500

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APM4115PU
Taping Direction Information
TO-252-3

USER DIRECTION OF FEED

Classification Profile

Copyright ANPEC Electronics Corp.


Rev. A.1 - Jul., 2009

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APM4115PU
Classification Reflow Profiles
Profile Feature

Sn-Pb Eutectic Assembly

Pb-Free Assembly

100 C
150 C
60-120 seconds

150 C
200 C
60-120 seconds

3 C/second max.

3C/second max.

183 C
60-150 seconds

217 C
60-150 seconds

See Classification Temp in table 1

See Classification Temp in table 2

Time (tP)** within 5C of the specified


classification temperature (Tc)

20** seconds

30** seconds

Average ramp-down rate (Tp to Tsmax)

6 C/second max.

6 C/second max.

6 minutes max.

8 minutes max.

Preheat & Soak


Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body Temperature
(Tp)*

Time 25C to peak temperature

* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.

Table 1. SnPb Eutectic Process Classification Temperatures (Tc)


3
Package
Volume mm
Thickness
<350
<2.5 mm
235 C
2.5 mm

Volume mm
350
220 C

220 C

220 C

Table 2. Pb-free Process Classification Temperatures (Tc)


Package
Thickness
<1.6 mm
1.6 mm 2.5 mm
2.5 mm

Volume mm
<350
260 C
260 C
250 C

Volume mm
350-2000
260 C
250 C
245 C

Volume mm
>2000
260 C
245 C
245 C

Reliability Test Program


Test item
SOLDERABILITY
HOLT
PCT
TCT

Method
JESD-22, B102
JESD-22, A108
JESD-22, A102
JESD-22, A104

Copyright ANPEC Electronics Corp.


Rev. A.1 - Jul., 2009

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10

Description
5 Sec, 245C
1000 Hrs, Bias @ 125C
168 Hrs, 100%RH, 2atm, 121C
500 Cycles, -65C~150C

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APM4115PU
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindain City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838

Copyright ANPEC Electronics Corp.


Rev. A.1 - Jul., 2009

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11

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