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STA518

40V 3.5A quad power half bridge


Feature

Multipower BCD technology

Minimum input output pulse width distortion

200m RdsON complementary dmos output


stage

CMOS compatible logic inputs

Thermal protection

Thermal warning output

Under voltage protection

Short circuit protection

PSSO36 (slug up)

Description
STA518 is a monolithic quad half bridge stage in
Multipower BCD Technology. The device can be
used also as dual bridge or reconfigured, by
connecting CONFIG pin to Vdd pin, as single
bridge with double current capability.

The device is particularly designed to make the


output stage of a stereo All-Digital High Efficiency
(DDX) amplifier capable to deliver an output
power of 24W x 4 channels @ THD = 10% at Vcc
30V on 4W load in single ended configuration.
It can also deliver 50 + 50W @ THD = 10% at Vcc
29V as output power on 8W load in BTL
configuration and 70W @ THD = 10% at Vcc 34V
on 8W in single paralleled BTL configuration.
The input pins have threshold proportional to VL
pin voltage.

Order codes
Part number

Temp range, C

Package

Packing

STA518

-40 to 90

PowerSSO36 (slug up)

Tube

STA51813TR

-40 to 90

PowerSSO36 (slug up)

Tape & reel

May 2006

Rev 3

1/19
www.st.com

Contents

STA518

Contents
1

Audio application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Pins description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.1

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.2

Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.3

Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.4

Thermal information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.5

Electrical characteristcs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Technical information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.1

Logic interface and decode: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

4.2

Power outputs: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

4.3

Parallel output / high current operation: . . . . . . . . . . . . . . . . . . . . . . . . . . 13

4.4

Additional informations: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Characterization curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

2/19

STA518

List of tables

List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.

Pin Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Functional Pin Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Electrical Characteristcs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
VLOW, VHIGH variation with Ibias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Logic Truth Table (see Figure 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

3/19

List of figures

STA518

List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.

4/19

Audio application circuit ( Quad single ended) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5


Pin Connection (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Low current dead time for Single End application: test circuit. . . . . . . . . . . . . . . . . . . . . . . 11
High current dead time for Bridge application: block diagram . . . . . . . . . . . . . . . . . . . . . . 11
High current dead time for Bridge application: test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . 11
STA518 Block Diagram Full-Bridge DDX or Binary Modes . . . . . . . . . . . . . . . . . . . . . . . 12
STA518 Block Diagram Binary Half-Bridge Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Typical Stereo Full Bridge Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Typical Single BTL Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Power Dissipation vs Output Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Power Derating Curve . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
THD+N vs Output Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Output Power vs Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
THD vs Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Output Power vs Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
THD+N vs Output Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Power Dissipation vs Output Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
THD+N vs Output Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
PSSO36 (Slug Up) Mechanical Data & Package Dimensions . . . . . . . . . . . . . . . . . . . . . . 17

R57
10K

C58
100nF

TH_WAR

+3.3V

C60
100nF

33
34

VSS

VSS

GND-Reg

GNDSUB

IN2B

32

19

20

M14

M16

13

10

11

D03AU1474

PGND2N

OUTNR

OUTNR

C52
1F

VCC2N

PGND2P

OUTPR

OUTPR

VCC2P

PGND1N

OUTNL

OUTNL

C51
1F

VCC1N

PGND1P

OUTPL

OUTPL

C44
330pF

R44
20

C62
100nF

C43
330pF

R43
20

C42
330pF

R42
20

C61
100nF

C41
330pF

R41
20

R54
6

C74
100nF

L14 22H

R53
6

C73
100nF

L13 22H

R52
6

C72
100nF

L12 22H

R51
6

C71
100nF

L11 22H

C84
100nF

C83
100nF

C82
100nF

C81
100nF

R68
5K

R67
5K

R66
5K

R65
5K

R64
5K

R63
5K

R62
5K

R61
5K

C94
1F

C34 820F

C93
1F

C33 820F

C92
1F

C32 820F

C91
1F

C31 820F

C21
2200F

Audio application circuit ( Quad single ended)

GND-Clean

M15

M17

M4

M5

12

14

16

17

Figure 1.

31

36

REGULATORS

PROTECTIONS
&
LOGIC

M2

M3

+VCC

Audio application circuit

IN2A

VCCSIGN

35

22

VDD

VCCSIGN

21

30

IN1B

VDD

28

TH_WAR

26

27

FAULT

TRI-STATE

25

24

PWRDN

23

VL

29

CONFIG

IN1A

VCC1P

IN2B

IN2A

C53
100nF

IN1B

C58
100nF

R59
10K

PWRDN

IN1A

15

STA518
Audio application circuit

5/19

Pins description

STA518

Pins description
Figure 2.

Pin Connection (top view)


VCCSign

36

GND-SUB

VCCSign

35

OUT2B

VSS

34

OUT2B

VSS

33

VCC2B

IN2B

32

GND2B

IN2A

31

GND2A

IN1B

30

VCC2A

IN1A

29

OUT2A

TH_WAR

28

OUT2A

FAULT

27

10

OUT1B

TRI-STATE

26

11

OUT1B

PWRDN

25

12

VCC1B

CONFIG

24

13

GND1B

VL

23

14

GND1A

VDD

22

15

VCC1A

VDD

21

16

OUT1A

GND-Reg

20

17

OUT1A

GND-Clean

19

18

N.C.

D01AU1273

Table 1.

6/19

Pin Function

Pin

Description

GND-SUB

2;3

OUT2B

Output half bridge 2B

Vcc2B

Positive supply

GND2B

Negative Supply

GND2A

Negative Supply

Vcc2A

Positive supply

8;9

OUT2A

Output half bridge 2A

10 ; 11

OUT1B

Output half bridge 1B

12

Vcc1B

Positive supply

13

GND1B

Negative Supply

14

GND1A

Negative Supply

15

Vcc1A

Positive supply

16 ; 17

OUT1A

Output half bridge 1A

35 ; 36

Vcc Sign

Signal Positive supply

Substrate ground

STA518

Pins description
Table 1.

Pin Function (continued)

Pin

18

NC

Not connected

19

GND-clean

Logical ground

20

GND-Reg

Ground for regulator Vdd

21 ; 22

Vdd

5V Regulator referred to ground

23

VL

Logic Reference Voltage

24

CONFIG

Configuration pin

25

PWRDN

Stand-by pin

26

TRI-STATE

27

FAULT

28

TH-WAR

29

IN1A

Input of half bridge 1A

30

IN1B

Input of half bridge 1B

31

IN2A

Input of half bridge 2A

32

IN2B

Input of half bridge 2B

33 ; 34

Vss

5V Regulator referred to +Vcc

35 ; 36

Vcc Sign

Table 2.

Description

Hi-Z pin
Fault pin advisor
Thermal warning advisor

Signal Positive supply

Functional Pin Status

Pin Name

Pin N.

Logical value

FAULT

27

Fault detected (Short circuit,


or Thermal.)

FAULT *

27

Normal Operation

TRI-STATE

26

All powers in Hi-Z state

TRI-STATE

26

Normal operation

PWRDN

25

Low consumption

PWRDN

25

Normal operation

THWAR

28

Temperature of the IC =130C

28

Normal operation

CONFIG

24

Normal Operation

CONFIG(2)

24

OUT1A=OUT1B ;
OUT2A=OUT2B
(IF IN1A = IN1B; IN2A = IN2B)

(1)

THWAR

IC - STATUS

1. The pin is open collector. To have the high logic value, it needs to be pulled up by a resistor.
2. To put CONFIG = 1 means connect Pin 24 (CONFIG) to Pins 21, 22 (Vdd) to implemented single BTL
(MONO MODE) operation for high current.

7/19

Electrical specifications

STA518

Electrical specifications

3.1

Absolute maximum ratings


Table 3.

Absolute maximum ratings

Symbol

3.2

Parameter

Value

Unit

VCC

DC Supply Voltage (Pin 4,7,12,15)

40

Vmax

Maximum Voltage on pins 23 to 32

5.5

-40 to 90

Top

Operating Temperature Range

Ptot

Power Dissipation (Tcase = 70C)

21

Tstg, Tj

Storage and Junction Temperature

-40 to 150

Recommended operating conditions


Table 4.

Recommended operating conditions (*)

Symbol
VCC

Parameter

Min.

DC Supply Voltage

10

VL

Input Logic Reference

2.7

Tamb

Ambient Temperature

Typ.

3.3

Max.

Unit

36.0

5.0

70

Max.

Unit

1.5

C/W

(*) performances not guaranteed beyond recommended operating conditions

3.3

Thermal data
Table 5.

Thermal data (*)

Symbol
Tj-case

Parameter

Min.

Typ.

Thermal Resistance Junction to Case (thermal pad)

TjSD

Thermal shut-down junction temperature

150

Twarn

Thermal warning temperature

130

thSD

Thermal shut-down hysteresis

25

(*) see Thermal information

3.4

Thermal information
The power dissipated within the device depends primarly on the supply voltage, load
impedance and output modulation level. The PSSO36 Package of the STA518 includes an
exposed thermal slug on the top of the device to provide a direct thermal path from the IC to
the heatsink. For the Quad single ended application the Dissipated Power vs Ouptut Power
is shown in Figure 10.

8/19

STA518

Electrical specifications
Considering that for the STA518 the Thermal resistance Junction to slug is 1.5C/W and the
extimated Thermal resistance due to the grease placed between slug and heat sink is
2.3C/W ( the use of thermal pads for this package is not recommended), the suitable Heat
Sink Rth to be used can be drawn from the following graph Figure 11, where is shown the
Derating Power vs.Tambient for different heatsinkers.

3.5

Electrical characteristcs

Table 6.

Electrical Characteristcs
Refer to circuit in Figure 3 (VL = 3.3V; VCC = 30V; RL = 8; fsw = 384KHz;
Tamb = 25C unless otherwise specified)

Symbol

Parameter

Test conditions

Min.

Typ.

Max.

Unit

200

270

50

RdsON

Power Pchannel/Nchannel
MOSFET RdsON

Id = 1A

Idss

Power Pchannel/Nchannel
leakage Idss

VCC = 35V

gN

Power Pchannel RdsON


Matching

Id = 1A

95

gP

Power Nchannel RdsON


Matching

Id = 1A

95

Dt_s

Low current Dead Time (static)

see test circuit Figure 3

Dt_d

High current Dead Time


(dinamic)

td ON
td OFF

20

ns

L = 22H; C = 470nF; RL = 8
Id = 3A; seeFigure 5

50

ns

Turn-on delay time

Resistive load; VCC = 30V

100

ns

Turn-off delay time

Resistive load; VCC = 30V

100

ns

25

ns

25

ns

36

VL/2
+300mV

tr

Rise time

tf

Fall time

10

Resistive load; as Figure 3

VCC

Supply voltage operating voltage

VIN-H

High level input voltage

VIN-L

Low level input voltage

IIN-H

Hi level Input current

Pin voltage = VL

IIN-L

Low level input current

Pin voltage = 0.3V

35

IPWRDNH

10

VL/2 300mV

Hi level PWRDN pin input current VL = 3.3V

VLOW

Low logical state voltage VLow


(pin PWRDN, TRISTATE) (1)

VL = 3.3V

VHIGH

High logical state voltage VHigh


(pin PWRDN, TRISTATE) (1)

VL = 3.3V

IVCCPWRDN

Supply current from Vcc in Power


PWRDN = 0
Down

0.8

V
1.7

mA

9/19

Electrical specifications
Table 6.

Electrical Characteristcs (continued)


Refer to circuit in Figure 3 (VL = 3.3V; VCC = 30V; RL = 8; fsw = 384KHz;
Tamb = 25C unless otherwise specified)

Symbol

IFAULT

IVCC-hiz

IVCC

IVCC-q
VUV
tpw_min

STA518

Parameter

Test conditions

Min.

Typ.

Max.

Unit

Output Current pins


FAULT -TH-WARN when
FAULT CONDITIONS

Vpin = 3.3V

mA

Supply current from Vcc in Tristate

VCC = 30V; Tri-state = 0

22

mA

Supply current from VCC in


operation
(both channel switching)

VCC = 30V;
Input pulse width = 50% Duty;
Switching Frequency = 384kHz;
No LC filters;

50

mA

Isc (short circuit current limit) (2)

VCC = 30V

3.5

Undervoltage protection
threshold
Output minimum pulse width

No Load

70

150

ns

1. The Table 7 explains the VLOW, VHIGH variation with Ibias.


2. See relevant Application Note AN1994

Table 7.

VLOW, VHIGH variation with Ibias


VL

VLow min

VHigh max

Unit

2.7

0.7

1.5

3.3

0.8

1.7

0.85

1.85

Table 8.

Logic Truth Table (see Figure 4)

TRI-STATE

INxA

INxB

Q1

Q2

Q3

Q4

OUTPUT
MODE

OFF

OFF

OFF

OFF

Hi-Z

OFF

OFF

ON

ON

DUMP

OFF

ON

ON

OFF

NEGATIVE

ON

OFF

OFF

ON

POSITIVE

ON

ON

OFF

OFF

Not used

10/19

STA518

Electrical specifications
Figure 3.

Low current dead time for Single End application: test circuit.
OUTxY
Vcc
(3/4)Vcc
Low current dead time = MAX(DTr,DTf)
(1/2)Vcc
(1/4)Vcc
+Vcc
t
DTr

Duty cycle = 50%

DTf

M58

OUTxY

INxY

R 8

M57

+
-

gnd

Figure 4.

V67 =
vdc = Vcc/2
D03AU1458

High current dead time for Bridge application: block diagram


+VCC

Q1

Q2

OUTxA

INxA

OUTxB

Q3

INxB

Q4

GND

Figure 5.

D00AU1134

High current dead time for Bridge application: test circuit


High Current Dead time for Bridge application = ABS(DTout(A)-DTin(A))+ABS(DTOUT(B)-DTin(B))
+VCC

Duty cycle=A

Duty cycle=B

DTout(A)
M58

DTin(A)

Q1

Q2
Rload=8

OUTA
INA
Iout=4A
M57

Q3

DTout(B)

L67 22
C69
470nF

L68 22

C71 470nF

C70
470nF

M64
DTin(B)

OUTB

INB
Iout=4A
Q4

Duty cycle A and B: Fixed to have DC output current of 4A in the direction shown in figure

M63

D03AU1517

11/19

Technical information

STA518

Technical information
The STA518 is a dual channel H-Bridge that is able to deliver 50W per channel (@
THD=10% RL = 8,
VCC = 29V) of audio output power in high efficiency.
The STA518 converts both DDX and binary-controlled PWM signals into audio power at the
load. It includes a logic interface , integrated bridge drivers, high efficiency MOSFET outputs
and thermal and short circuit protection circuitry.
In DDX mode, two logic level signals per channel are used to control high-speed MOSFET
switches to connect the speaker load to the input supply or to ground in a Bridge
configuration, according to the damped ternary Modulation operation.
In Binary Mode operation , both Full Bridge and Half Bridge Modes are supported. The
STA518 includes over-current and thermal protection as well as an under-voltage
Lockout with automatic recovery. A thermal warning status is also provided.
Figure 6.

STA518 Block Diagram Full-Bridge DDX or Binary Modes


INL[1:2]
INR[1:2]
VL
PWRDN

OUTPL

Logic I/F
and Decode

Left
H-Bridge
OUTNL

TRI-STATE

Protection
Circuitry

FAULT
TWARN

OUTPR

Right
H-Bridge

Regulators

Figure 7.

STA518 Block Diagram Binary Half-Bridge Mode


LeftA
-Bridge

OUTPL

LeftB
-Bridge

OUTNL

Protection
Circuitry

RightA
-Bridge

OUTPR

Regulators

RightB
-Bridge

OUTNR

INL[1:2]
INR[1:2]
VL

Logic I/F
and Decode

PWRDN
TRI-STATE

FAULT
TWARN

4.1

OUTNR

Logic interface and decode:


The STA518 power outputs are controlled using one or two logic level timing signals. In
order to provide a proper logic interface, the Vbias input must operate at the dame voltage
as the DDX control logic supply.
Protection circuitry:

12/19

STA518

Technical information
The STA518 includes protection circuitry for over-current and thermal overload conditions. A
thermal warning pin (pin.28) is activated low (open drain MOSFET) when the IC
temperature exceeds 130C, in advance of the thermal shutdown protection. When a fault
condition is detected , an internal fault signal acts to immediately disable the output power
MOSFETs, placing both H-Bridges in high impedance state. At the same time an open-drain
MOSFET connected to the fault pin (pin.27) is switched on.
There are two possible modes subsequent to activating a fault:

4.2

1.

SHUTDOWN mode: with FAULT (pull-up resistor) and TRI-STATE pins independent,
an activated fault will disable the device, signaling low at the FAULT output.
The device may subsequently be reset to normal operation by toggling the TRI-STATE
pin from High to Low to High using an external logic signal.

2.

AUTOMATIC recovery mode: This is shown in the Audio Application Circuit of Quad
single Ended). The FAULT and TRI-STATE pins are shorted together and connected to
a time constant circuit comprising R59 and C58.
An activated FAULT will force a reset on the TRI-STATE pin causing normal operation to
resume following a delay determined by the time constant of the circuit.
If the fault condition is still present , the circuit operation will continue repeating until the
fault condition is removed .
An increase in the time constant of the circuit will produce a longer recovery interval.
Care must be taken in the overall system design as not to exceed the protection
thesholds under normal operation.

Power outputs:
The STA518 power and output pins are duplicated to provide a low impedance path for the
device's bridged outputs. All duplicate power, ground and output pins must be connected for
proper operation.
The PWRDN or TRI-STATE pins should be used to set all MOSFETS to the Hi-Z state
during power-up until the logic power supply, VL , is settled.

4.3

Parallel output / high current operation:


When using DDX Mode output , the STA518 outputs can be connected in parallel in order to
increase the output current capability to a load. In this configuration the STA518 can provide
70W into 8 ohm.
This mode of operation is enabled with the CONFIG pin (pin.24) connected to VREG1 and
the inputs combined INLA=INLB, INRA=INRB and the outputs combined OUTLA=OTLB,
OUTRA=OUTRB.

4.4

Additional informations:
Output Filter: A passive 2nd-order passive filter is used on the STA518 power outputs to
reconstruct an analog Audio Signal . System performance can be significantly affected by
the output filter design and choice of passive components. A filter design for 6ohm/8ohm
loads is shown in the Typical Application circuit of Figure 9.
Quad Single ended circuit (Figure 1) shows a filter for bridge mode, 4 ohm loads.

13/19

Technical information

STA518

Figure 8.

Typical Stereo Full Bridge Configuration to Obtain 50+50W @ THD = 10%,


RL = 8, VCC =29V
+VCC

VCC1A
IN1A

29

VL

23

CONFIG

24

M3

IN1A
+3.3V

PWRDN
R57
10K

PWRDN

25

FAULT

27

R59
10K

26

16
M2
PROTECTIONS
&
LOGIC

TH_WAR

M5

TH_WAR

28

IN1B

30

VDD

21

VDD

22

VSS

33

VSS

34

OUT1A

14

GND1A

12

VCC1B
C31
1F

11

REGULATORS

VCCSIGN

13

GND1B

VCC2A

C60
100nF

VCCSIGN
IN2A

IN2A
GND-Reg
GND-Clean

IN2B

IN2B
GNDSUB

9
36

M15

31
20
19

M16

VCC2B
C33
1F

3
2

32

OUT2B
OUT2B

M14

C21
100nF

C110
100nF
C109
330pF R103
6

OUT2A
GND2A

R100
6

L113 22H

OUT2A

C99
100nF
C23
470nF
C101
100nF

R98
6

L19 22H

C32
1F

35

R63
20

OUT1B

M17

C53
100nF

C20
100nF
C52
330pF

OUT1B
M4

C55
1000F

L18 22H

OUT1A

10

IN1B

C58
100nF

C30
1F

17

TRI-STATE

C58
100nF

15

R104
20

C107
100nF
C108
470nF
C106
100nF

R102
6

C111
100nF
L112 22H

GND2B
D00AU1148B

Figure 9.

Typical Single BTL Configuration to Obtain 70W @ THD 10%, RL = 8,


VCC = 34V (note 1))
VL

+3.3V

GND-Clean
GND-Reg

10K

23

18

N.C.
22H

100nF

100nF
X7R

VDD
VDD
CONFIG
TH_WAR

TH_WAR

PWRDN

nPWRDN
10K

FAULT

IN1A
IN1B

IN1A

IN2A
IN2B

IN1B

VSS
VSS
100nF
X7R

20

21
22
24
28
25
27

TRI-STATE
100nF

19

VCCSIGN

100nF
X7R

VCCSIGN

Add.

GNDSUB

26

29

17
16
11
10

OUT1B
OUT1B

OUT2A

34

22
1/2W

6.2
1/2W

330pF

6.2
1/2W

OUT2B
3
2

15

12

100nF
X7R
470nF
FILM
100nF
X7R
100nF
FILM

OUT2B
22H
VCC1A

VCC1B

32V
1F
X7R

VCC2A

32
33

100nF
FILM

OUT1A

OUT2A
9

30
31

OUT1A

VCC2B

2200F
63V

32V
1F
X7R

GND1A
14
GND1B

35

13

36

GND2A
GND2B
D04AU1549

Note:

14/19

"A PWM modulator as driver is needed . In particular, this result is performed using the
STA308+STA518+STA50X demo board". Peak Power for t 1sec

STA518

Characterization curves

Characterization curves

The following characterization are obtained using the quad single ended configuration (Figure 1) with
STA308A controller
Figure 10. Power Dissipation vs Output Power Figure 11. Power Derating Curve
Pd(W)

Pd (W)16

25
1

14

Vcc=30V
Rl=4ohm
F =1Kz

12
10

20

1)Infinite
2) 1.5 C/W

3) 3 C/W

15

4) 4.5 C/W

5) 6 C/W

10

2
0
0

12

16

20

24

20

40

60

80

100 120 140 160

Tambient(C)

4 x Pout (W)

Figure 12. THD+N vs Output Power

Figure 13. Output Power vs Supply Voltage


Pout(W)

THD(%) 10

30
27.5

Vcc = 26V

25

Rl = 4 ohm

22.5

F = 1KHz

Rl=4 ohm
F=1KHz
Single Ended

20

Single Ended

17.5

1
15
THD=10%
12.5

0.5

10

THD=1%

7.5

0.2

0.1
100m

200m

500m

2
Pout(W)

10

20 30

2.5
+10

+12

+14

+16

+18

+20

+22

+24

+26

+28

+30

Vdc

Figure 14. THD vs Frequency


THD(%)
1
0.5

0.2
Rl=4 ohm

0.1

Pout=1W
Single Ended

0.05

0.02

0.01
20

50

100

200

500
1k
Freq(Hz)

2k

5k

10k

20k

15/19

Characterization curves

STA518

The following characterizations are obtained using the stereo full bridge configuration (Figure 8) with
STA308A controller.
Figure 15. Output Power vs Supply Voltage
o(W)

Figure 16. THD+N vs Output Power


THD(%)
10

90

80
Rl=8ohm

70

F=1KHz

60
THD=10%

0.5

50
Stereo Full
BTL

Vcc=29V
Rl=8ohm
F=1KHz
Double BTL

0.2

40

0.1

30

Single
Parallel BTL

THD=1%

0.05

20

0.02

10
0
+10

+12

+14

+16

+18

+20

+22

+24

+26

+28

+30

+32

0.01
100m

+34 +36

200m

500m

Vsupply(V)

2
Pout(W)

10

20

60

Figure 17. Power Dissipation vs Output Power


Pd (W)
12
Vcc=29V

10

Rl=8ohm
8

F=1KHz

6
4
2
0
0

10

20
30
2 X Pout (W)

40

50

The following characterizations are obtained using the single BTL configuration (Figure 9) with STA308A
controller.
Figure 18. THD+N vs Output Power
THD(%)
10
5
2
1
0.5

Vcc=34V
Rl=8ohm
F=1KHz
Single BTL

0.2
0.1
0.05
0.02
0.01
100m

16/19

200m

500m

5
Pout(W)

10

20

50 80

STA518

Package information

Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 19. PSSO36 (Slug Up) Mechanical Data & Package Dimensions
DIM.
A
A2
a1
b
c
D (1)
E (1)
e
e3
F
G
G1
H
h
L
M
N
O
Q
S
T
U
X
Y

MIN.
2.15
2.15
0
0.18
0.23
10.10

mm
TYP.

7.4

MAX.
2.47
2.40
0.075
0.36
0.32
10.50

MIN.
0.084
0.084
0
0.007
0.009
0.398

7.6

0.291

0.50
8.50
2.3

0.55

MAX.
0.097
0.094
0.003
0.014
0.012
0.413

OUTLINE AND
MECHANICAL DATA

0.299
0.020
0.035
0.090

0.10
0.06
10.50
0.40
0.85

10.10

inch
TYP.

0.004
0.002
0.413
0.016
0.033

0.398
0.022

4.3

0.169
10 (max)

1.2
0.8
2.9
3.65
1.0
4.10
6.50

0.047
0.031
0.114
0.144
0.039
4.70
7.10

0.161
0.256

0.185
0.279

(1) D and E do not include mold flash or protusions.


Mold flash or protusions shall not exceed 0.15mm (0.006)
(2) No intrusion allowed inwards the leads.
(3) Flash or bleeds on exposed die pad shall not exceed 0.4 mm
per side

PowerSSO-36
(slug-up)

7618147 A

17/19

Revision history

STA518

Revision history
Table 9.

18/19

Document revision history

Date

Revision

Changes

19-Aug-2004

Initial release.

11-Nov-2004

Changed symbol in Electrical Characteristics.

18-May-2006

Changed operating temperature range value to -40 to 90C


(seeTable 3).

STA518

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19/19

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