Xiaosen Liu

Research Scientist
Email: xiaosen.liu@intel.com

Power Delivery Circuit & System Group, Intel Labs

Aug./2016-present
Tel: (979)571-1943
Address: JF2, 2111 Northeast 25th Street, Hillsboro, OR 97124

OBJECTIVE
Interested in integrated circuits, power electronics, energy harvesting, and biomedical instruments

EDUCATION
20112016
20082011
20042008

Ph.D., Electrical Engineering, Texas A&M University, College Station, TX

Advisor: Prof. Edgar Sanchez-Sinencio
M.S., Electronic & Computer Engineering, Hong Kong University of Science and Technology, Hong Kong
Advisor: Prof. Kevin J. Chen
B.S., Electronic Science & Technology, Southeast University, Nanjing, China

RESEARCH EXPERIENCE
Power Management Research
20142016
A Unified Energy Harvesting Power Management System with Embedded Power Extraction Optimization
and Voltage Regulation, TAMU/Intel
20122014
Full Digitally Controlled Efficient Energy Harvester for IoT Smart Nodes, TAMU
20112012
Adaptive Power Management for Solar Energy Harvesting, TAMU
Electrosurgical System Research
2014present RF Vessel Sealing and Ultrasonic Dissecting Systems, TAMU/Covidien (now Medtronic)
20132013
Electrosurgical Ultrasonic Dissecting Systems, TAMU/Covidien
GaN Research
20082011
Gallium Nitride Power Device & Mixed Signal ICs, HKUST

SKILLS & EXPERTISE

IC design using MATLAB, C/C++, VHDL/Verilog/-A/-AMS, Cadence Virtuoso/Allegro, L-Edit, H-/P-/LT-Spice. Digital
system design using Xilinx ISE/Chipscope, Altera Quartus. PCB & antenna design using AutoCAD, Solidworks, CST,
HFSS, Altium/Protel. Device simulation using Medici, Sentaurus/ISE-TCAD, ADS.
Complex mixed signal IC testing system on probe station; dicing, bonding and package system. III-V device & IC full
fabrication process including handling PECVD, ion-implanter, E-beam evaporation system, E-beam lithography, RIE/ICP,
SEM/AFM, temperature chamber, etc. PCB fabrication, SMD soldering/desoldering, FPGA/DSP board prototyping, DSO,
VNA, spectrum analyzer

SELECTED PUBLICATIONS

US Patent Electrosurgical Ultrasonic Vessel Sealing and Dissecting System, No. 20,160, 023, 021, 2016.
X. Liu and E. Sanchez-Sinencio, A Single-cycle MPPT Charge Pump Energy Harvester Using a Thyristor-based VCO
without Storage Capacitor, IEEE International Solid-State Circuits Conference (ISSCC), pp. 364-365, Feb. 2016.
X. Liu and E. Sanchez-Sinencio, A 0.45-to-3V Reconfigurable Charge-Pump Energy Harvester with TwoDimensional MPPT for Internet of Things, IEEE International Solid-State Circuits Conference (ISSCC), pp. 370371, Feb. 2015.
X. Liu, L. Huang, K. Ravichandran, and E. Sanchez-Sinencio, A highly efficient reconfigurable charge pump energy
harvester with wide harvesting range and two-dimensional MPPT for Internet of Things, IEEE Journal of Solid-State
Circuits (JSSC), vol. 51, no. 5, pp. 1302-1312, May 2016.
X. Liu and E. Sanchez-Sinencio, An 86% Efficiency 12 W Self-sustaining PV Energy Harvesting System with
Hysteresis Regulation and Time-domain MPPT for IOT Smart Nodes, IEEE Journal of Solid-State Circuits (JSSC),
vol. 50, no. 6, pp. 1424-1437, Mar. 2015.
X. Liu, A. Colli-Menchi, J. Gilbert, D. Friedrichs, K. Malang, and E. Sanchez-Sinencio An Automatic Resonance
Tracking Scheme With Maximum Power Transfer for Piezoelectric Transducers, IEEE Transactions on Industrial
Electronics (TIE), in press, Oct. 2014.
A.M.H. Kwan, G. Yue, X. Liu, K.J. Chen, A Highly Linear Integrated Temperature Sensor on a GaN Smart Power IC
Platform, IEEE Transactions on Electron Devices (TED), vol.61, no.8, pp.2970,2976, Aug. 2014.
A. M. H. Kwan, X. Liu, and K. J. Chen, Integrated Gate-protected HEMTs and Mixed-signal Functional Blocks for
GaN Smart Power ICs, IEEE International Electron Devices Meeting (IEDM), pp.7.3.1-4, Dec. 2012.
X. Liu, K. J. Chen, GaN Single-Polarity Power Supply Bootstrapped Comparator for High Temperature Electronics,
IEEE Electron Device Letters (EDL), vol. 32, No. 1, pp. 27-29, Jan. 2011.