L6.Slides Probability

CheckSum Analystmc
Visual MDA for Windows

Automated Test System
INSTRUCTION MANUAL
CheckSum, Inc.
P.O. Box 3279
Arlington, WA 98223
(360) 435-5510
Fax (360) 435-5535
Web Site: www.checksum.com
P/N 4400-045
Revision 7/2003
Copyright 1990-2003, CheckSum, Inc.
All rights reserved
Printed in U.S.A.
Specifications and operational characteristics of the System are subject to change without
notice. CheckSum, Inc. cannot take responsibility for any direct or consequential damages
arising from use of this manual or the related product.
Windows is a trademark of Microsoft Corporation. OrCad is a trademark of OrCad Systems
Corp. CadStar is a trademark of Racal-Redac. Visual MDA is a trademark of CheckSum, Inc.
TestJet Technology is protected under U.S. Patent Nos. 5,124,660 and 5,254,953.
ii
Table of Contents
Chapter 1: CheckSum Analyst mc Test System
Test System Introduction
Main Topics
Installation and Operation
Generating Test Programs
Other Documentation
Customer Support
System Overview
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1-2
Chapter 2: Getting Started

Overview
Safety and Operational Information
Installation
Analyst System Wiring Overview
Installing and Removing Fixtures
Fixture Probe Plate/Pan Installation
Installing the UUT in the Fixture
Connecting to the UUT
Creating a Test Program
Getting Started Testing
Operator Keypad
Keypad Mask
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Chapter 3: Opening Screen

Main System Window
Main System Window Choices
Toolbar Choices
Menu-Bar Choices
Main Screen File Menu
Learn Assembly Menu
Related Topics
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Chapter 4: System Installation

Overview
Jumper Settings
Installing a Module
System Module Information
Model T-120-2 Strip Printer Installation
Completing the Hardware Installation
Software Installation
Completing the Software Installation
Connection to the UUT
Connection Guidelines
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Chapter 5: System Configuration

Overview
Configure System Screen
Save Button
Print Button
Modules Configuration
Configuration Table
Adding/Deleting Modules
Reverting/Saving Configuration Information
Module Self-Test
System Module Self-test
Test Point (MPX) Module Self-test
Environment Configuration
Configure Reporting
SPC Logging tab:
Automatic Test Results Report tab:
Batch Report tab:
Test Program tab:
Test Results tab:
Configure Directories/Locations
Manage User Accounts
Add User
External Hardware
Fixture Configuration
Auto-starting a Test
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Chapter 6: System Operation

Testing an Assembly
Overview
Test Topics
Main Screen, Test Menu
Selecting the Test Program
File Selection Screen
Executing the Test
Component Test Failure Screen
Test Failure Function Buttons
Test Display
Main Test Functions
Menu Bar
Test File Menu
Test Menu
Report Menu
Environment Menu
Panel Menu
Fixture-Check Menu
Test Screen - Help Menu
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Chapter 7: Statistical Analysis of Test Results

Statistical Analysis
Overview
Report Types
Related Topics
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iv
Using Statistical Process Control

Activating Statistical Analysis
UUT Reported On
Change Starting/Ending Period
Statistics Data Path
Production Report
Pareto Failure Report
X-Bar/Sigma Report
Interpreting the Graphs
Examine SPC Data
Edit Run Failures
Reporting on Panelized PCBs
SPC Data Format
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Chapter 8: Test Programs

Writing Test Programs
Overview
Related Topics
Background
Manual Entry
Setting the Execution Order
Debugging Test Programs
Editing Tools & Testing Methods
Tolerances
Continuity and IC Tests
Special Features
Statistical Data (SPC) Logging
Save Program
Related Topics
Edit Test Program Screen
Menu Descriptions
Edit File Menu
Edit Menu
View Menu
Measure Menu
Setup Menu
Tools Menu
Help Menu
Loading a Program or Erasing Memory
Assigning Point Names
Probing
Entering Test Steps
Listing Test Program Data
Saving Test Programs
Saving/Loading Programs in Binary
Saving/Loading Test Programs in ASCII
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Chapter 9: Entering Test Steps

Overview
Topics
Using the Edit Screen
Test Step Descriptions
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9-2

Controlling the Test Fixture and Discharge System
Entering Resistor, Inductor and Capacitor Tests
Overview
Inserting the Test Step and Making the Measurement
Measurement Analysis
Overview
Choosing a Range/Function
Resistance
Capacitance
Power Supply Capacitors
Polarized Capacitors
Small Capacitors
Inductance
Measurement Polarity
Measurement Delays
External Sense
Parallel Components
Guarding
Using Measurement Offsets
Using Measurement Gain Factors
Dynamic Measurement Analysis
Calculation Model
Capacitor Measurement Bias
UUT Charging/Discharging Problems
Third-Terminal Biasing
Measuring One Point to Many Points
Diode, LED and Zener Testing
Overview
Diode/LED Testing
Zener Diode Testing
Transistor and FET Testing
Overview
Related Topics
Programming a Beta Test
Opto-isolator Testing
Switches
Potentiometers
Jumpers
Opens/Shorts Testing (Continuity)
Overview
Related Topics
Entering the Continuity Test Step
Setting the Continuity / No-Care Information
Setting Active Points
Learning the Continuity Map
Assigning Continuity No-Cares
Assigning Continuity Thresholds
ICs Testing
Overview
Related Topics
Entering the ICs Test Step
The Enter/Edit IC Test Data Screen
Learning the ICs Map
Transformer Testing
Overview
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Programming a Transformer Test

Operator Displays
Display Messages
Controlling Program Flow
Branching
Exiting the Program
Running Another Test Program
Extending Test Program Length
Encapsulating a Test
Executing a User-Written Program
Generating Reports from a Test Program
Normal Test Reports
Statistical Data Reports
Changing Report Paths
Cable Testing and Wiring
Panelized Testing
Overview
Related Topics
Panelization Programming by Wizard
Manual Panelization Programming
Use of Program Memory Locations
Overview
Related Topics
Special Notes about MEMS
Special Notes about MEMR
Special Notes about MEMI
Memory Variables and Program Storage
Using the Multi-Function Input (MFI)
Multi-Function Input
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Chapter 10: CAD Data Conversion

Overview
Files Types
Generating the Test Program
CAD Conversion Screen
Topics List
Net List File
Component Value File
Net Order File
CAD Files Directory
Exception Report File
Fixture Wiring Report File
Test Program File
Assign Default File Names
CAD Format
Manual CAD Conversion
Customizing CAD Conversion
Overview
Reference Designator Template
CAD Conversion Steps
Net Rename Strategy
Specific CAD Types
Notes on P-CAD Data Conversion
Notes on Mentor Data Conversion
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Notes on OrCAD Data Conversion

Notes on HP-BCF Data Conversion
Notes on Cadence Data Conversion
Notes on Racal-Redac Data Conversion
Notes on ViewLogic Data Conversion
Notes on ComputerVision Data Conversion
Notes on Tango Data Conversion
Notes on Pads2000 Data Conversion
Notes on Schema Data Conversion
Notes on Scicards Data Conversion
Notes on Veribest Data Conversion
Notes on Fabmaster Data Conversion
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Chapter 11: Sample Reports

Test Results Report Example
Test Program Report Example
Batch Report Example
Test Program in ASCII
Statistics Data File Example
Wire Run Report Example
Production Report Example
Pareto Failure Report Example
X-Bar/Sigma Report Example
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Chapter 12: Command Line Parameters

Chapter 13: Trouble Shooting
In Case of Problems
Display Problems
Printer Problems
Configuration Problems
Failed Components
Addresses and Jumpers
Interrupts
I/O Channel Conflicts
Test-Point Electronics
Analyst mc Test Point Modules
TR-8-1 Modules
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Chapter 14: Error Messages

Chapter 15: Test Program Examples
Example Test Program Segments
Related Topics
Jumper/Switch Checking
Potentiometer Adjustments I
Potentiometer Adjustments II
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viii
Screen and Display Attribute Manipulation
15-4
Chapter 16: Theory of Operation

Overview
Main Topics
Current Mode
Overview
Testing Resistors
Testing Capacitors
Testing Diodes/Semiconductors
Current Guarding
Voltage Mode
Overview
Testing Resistors
Testing Capacitors
Testing Inductors
Use of Offset
Frequency Selection
Voltage Guarding
Measurement Guidelines
Overview
General Guidelines
Testing Resistors
Testing Capacitors
Testing Inductors
Continuity Tests
Testing ICs/Transistors/Diodes
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Chapter 17: Specifications

Chapter 18: Test Descriptions
Test Type Descriptions
Analog Measurement Test Types
Test Step Range Values
Resistance Test
Capacitance Test
Diode Test
Zener Diode Test
IC Test
IC Test Range Limiting
Inductor Test
Voltage Test
Continuity Test
Discharge Point
Pause a Specified Time
Set Measurement Retry Parameters
Set Low-Level Measurement Parameters
Adjust Potentiometer
Install/Remove Jumpers
Set Switch
Make Cable Connection
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DMM Measurement Test

Universal Counter/Timer Measurement Test
UCT Trigger Setup
Dynamic Measurement Calibration
Test for SMT Opens
Test for Capacitor Polarity
Test for Transistor/FET Beta
Test for Transformer Polarity
HP-1 High-Voltage Tests
HP-1 Continuity Testing
HP-1 High-Voltage Testing
HP-1 Resistance Testing
HP-1 Breakdown Testing
HP-1 Checking Safety Interlock Status
Opto-isolator Test
Multi-Function Input Measurement
Analog Stimulus Test Types
Sine Wave Output
Square Wave Output
DC Voltage Output
DC Current Output
Monitor PWR-1 Output
External Signal Input/Output
Digital Test Types
DIG-1 Characteristics
TR-6 System Module Digital I/O
Model TR-8-1 Digital I/O
Other Digital Methods (TR-6)
General Digital I/O Programming
DIGx Test Types
Digital Input Test
Digital Output
Digital Active
DIGR (DIG-1 Digital Module Switching/Control)
Digital Hardware Testing with the LOGIC Test Type
PORTx Test Types
Port Input Test
Port Output
Boundary Scan Testing
In System Programming (ISP)
Transfer of Control Test Types
Specify Label
Jump Unconditionally
Jump Based on Resistance Measurement
Jump Based on Capacitance Measurement
Jump Based on Diode Measurement
Jump Based on Inductance Measurement
Jump Based on Voltage Measurement
Jump Based on PWR Measurement
Jump Based on DMM Measurement
Jump Based on UCT Measurement
Jump Based on Result of Digital Input
Jump Based on Result of Port Input
Jump Based on Result of Key Input
Set Error Counters, Control Error-Based TRY Blocks
Jump Based on Number of Errors
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Jump Based on Zener Measurement

Jump Based on Self-test
Jump Based on Fixture Identification
Call a Subroutine
Return from Subroutine
Load and Run a Test Program
Load and Run a Test Sub-Program
Return from Test Sub-Program
Message Test Types
Display a Short Message to the Operator
Display a Message to the Operator
Erase an Operator Message
Display Picture Image
Wait for a Key to Be Pressed
PCB Number Being Tested
Enhanced Display Attributes using SCRN Test Type
SCRN Test Type Table
SCRN Test Range Table
User-Defined Tests
Generate Test Result
Execute User-Written Routine
Memory Manipulation Test Types
Memory Manipulation (Integer)
Memory Manipulation (Real)
Memory Manipulation (String)
General Purpose Interface Bus I/O
General Purpose Interface Bus (GPIB) I/O
RS232 Serial Interface I/O
Miscellaneous Tests
Turn Fixture Vacuum On and Off
Fixture Control
Fixture Identification
Control Relays
Self-test Module
BreakPoint
Fixture-Check
Print Test Results
Sound the PC's Beeper
Set Test Conditions
Put a Remark in the Test Program
Conditional Test Report Output
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xii
Limited Warranty
CheckSum, Inc. products, exclusive of fixturing products, are covered by a one-year limited
parts and labor warranty for defects in materials and workmanship from time of original
product shipment. Fixturing products (Model GS-850, TR-3/TR-5/TR-7/TR-9/Analyst series)
include a 90-day limited warranty. This warranty extends only to the original purchaser and
excludes products or parts that have been subject to misuse, neglect, accident, or abnormal
conditions of operations.
CheckSum, Inc. reserves the right to replace the product in lieu of repair. If the failure has
been caused, as determined by CheckSum, by misuse, neglect, accident, or abnormal
conditions of operation, repairs will be invoiced at a nominal cost. In such case, an estimate
will be submitted before the work is started, if requested.
NOTE
THE FOREGOING WARRANTY IS IN LIEU OF ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, INCLUDING BUT NOT
LIMITED TO ANY IMPLIED WARRANTY OF
MERCHANTABILITY, FITNESS, OR ADEQUACY FOR ANY
PARTICULAR PURPOSE OR USE. CHECKSUM, INC. SHALL
NOT BE LIABLE FOR ANY SPECIAL, INCIDENTAL, OR
CONSEQUENTIAL DAMAGES, WHETHER IN CONTRACT,
TORT, OR OTHERWISE.
In the event of a failure of a product during the warranty period:

Contact CheckSum for a returned material authorization number (RMA).
Pack the product in its original packing material or suitable equivalent and return it postagepaid to CheckSum, Inc. Mark the package clearly with the RMA number.
CheckSum will repair the product and return it postage-paid. Repairs are typically completed
within two working days of receipt.
In the event that expedited repair is necessary, call CheckSum for information. In many cases
a replacement module can be provided immediately.
xiii
xiv
Chapter 1
CheckSum Analyst mc Test
System
Test System Introduction

This information is for use with the CheckSum Analyst mc Manufacturing Defects Analyzer
(MDA) System. To best serve your long-term needs, the Analyst mc Manufacturing Defects
Analyzer System contains a number of features and capabilities. Because of this, it may take
you some time before you want (or need) to use all the features of the System.
The Analyst mc may have optional accessories that are described in this manual. If these
options are not available with the Analyst mc, they are available in other MDA test systems.
Contact CheckSum for more information.
To help you get your System up and testing as quickly as possible, you might want to expedite
your initial reading of this information. The information has been organized to support you in
doing so.
1. First, read this Introduction.
2. Then read the Getting-Started section. By this time, you should have a general knowledge
of what the System can do and how to navigate through it.

3. Finally, using the remainder of the documentation as reference material, you can install
your hardware and software, and begin experimenting with the system as you become
familiar with its use.
Main Topics
Installation and Operation
Main System Window on page 3-1
System Installation on page 4-1
System Configuration on page 5-1
Testing an Assembly on page 6-1
Statistical Analysis on page 7-1
CheckSum Analyst mc Test System

System Overview
Instruction Manual
Generating Test Programs
Writing Test Programs on page 8-1
The Edit Test Screen on page 8-6
Entering Test Steps on page 9-1
CAD Data Conversion on page 10-1
Other Documentation
If you purchased a customized fixture with your System, you will receive documentation that
is specific to the fixture.
Check the software disk enclosed with your System. If it has a READ.ME file, print the
READ.ME file for any last-minute information about System updates.
Customer Support
If you run into problems or have questions, don't hesitate to call CheckSum (at 360 435 - 5510,
located in the U.S., in the Pacific Time Zone) for assistance. We are here to help you.
Our web site is at: www.CheckSum.com
System Overview
The CheckSum Analyst mc Manufacturing Defects Analyzer System allows a standard PC to
efficiently test electronic assemblies to find manufacturing defects such as opens, shorts, and
incorrect or misoriented components. The System makes high-speed measurements for opens
and shorts, resistances, capacitances, inductances, voltages and semiconductor junctions. For
each test it makes a measurement of a pair of test points in the unit-under-test (UUT) and
compares the outcome against individual, user-specified upper and lower test limits.
The CheckSum Analyst mc MDA System contains the System electronics for making
measurements, Visual MDA Software, and the Instruction Manual.
The optional PWR-1 Power Module extends the current-sourcing and measuring range of the
test system from 10mA to 100mA, and extends voltages up to 24V differential. This can be
used to provide additional guard current, measure components with high parallel impedance,
actuate UUT relays, or to measure zener diodes beyond the range of the standard system.
The optional Model TR-8-SMT adds Agilent TestJet technology to the test System. This
patented technology can be used to test for open connections to ICs and connectors and to test
for the polarity of capacitors. The TR-8-SMT open-detection capability is particularly
applicable to surface-mount-technology (SMT) since opens are a significant contributor to the
normal fault spectrum when using SMT.
The optional Model TR-8-BST Boundary Scan Capability can be used to test UUTs that have
incorporated boundary scan during the design process. This technology can be used to
perform power-up testing of nodes that may not be accessible for normal MDA testing.
The System software provides the ability to program ('learn') the test sequence for a UUT. The
System can self-learn some UUT attributes, such as opens and connections, diode mapping for
1-2
Instruction Manual
CheckSum Analyst mc Test System

System Overview
IC orientation and presence, and TestJet attributes for a UUT; it then allows you to easily add
the component tests. The initial component test data can also be entered via compatible CAD
data if available. Once the UUT is programmed, you may save the information (called the test
program) on your System disk. It can be recalled later to test UUTs. Once a UUT is tested
you may generate various types of test reports or gather statistics to help control the
manufacturing process.
1-3
Chapter 2
Getting Started
Overview
The Getting Started section guides you through the typical, complete sequences for each major
use of the System. These include:
Installation on page 2-4
Analyst System Wiring Overview on page 2-6
Installing and Removing Fixtures on page 2-7
Connecting to the UUT on page 2-9 (fixturing)
Creating a Test Program on page 2-9
Testing an Assembly on page 2-11
Using the Operator Keypad on page 2-11
First, read the Safety and Operational Information. Then read the remaining Getting
Started sections to get an overview of each activity. Complete detail is not given in this
section, so you will probably want to refer to the individual sections of the manual that
describe each action in detail as you perform the task.
Safety and Operational Information

The international symbols used on this product or in the manual are described in the following:
Warning or Caution
1. The power cord must have an integrated ground wire and be connected to an earth-ground
outlet. The system back panel has a protective ground jack.

2. If the unit does not appear to operate properly, do not use.
3. No user serviceable parts inside.
4. Pinch zones exist on the sides of the unit around the linkage and where the struts attach at
the top. Keep fingers away from these areas.

5. The system is an installation category II device. The unit is heavy - pick up and move with
two or more people.
Getting Started
System Overview
Instruction Manual
6. If the equipment is used in a manner not specified by the manufacturer, the protection
provided by the equipment may be impaired.

7. To avoid damaging the display or the case, do not use solvents or abrasive cleaners. Clean
with a soft cloth dampened with mild soap and water.

Espaol
Atencin
1. El cable de red debe llevar integrada una conexin de tierra y el equipo debe conectarse a
un enchufe con toma de tierra. El panel trasero del sistema dispone de una toma para
realizar la puesta a tierra.
2. Si la unidad no parece funcionar adecuadamente, no la utilice.
3. No hay piezas que requieran sustitucin por parte del usuario en el interior.
4. Hay zonas en los laterales de la unidad alrededor de estructura y donde los salientes se
fijan en la parte superior donde los dedos pueden ser atrapados. Mantenga los dedos
alejados de esas zonas.
5. El sistema es un dispositivo de categoria II para la instalacin. Para moverlo y debido a su
peso lo deben hacer al menos dos personas.

6. Si el equipo se usa de un modo no especificado por el fabricante, la eficacia de los
sistemas de proteccin puede verse reducida.

7. Para evitar daar la carcasa no utilice disolventes o limpiadores agresivos. Usar un pao
hmedo en agua con jabn neutro para limpiar la carcasa.

Deutsch
WARNUNG
1. Beachten Sie bitte, im Netzkabel ist ein Erdungsdraht integriert, der mit einem
Erdungsanschluss verbunden sein muss. Das Gerat hat an der Ruckseite einen
Erdungsanschluss.
2. Falls das Gerat nicht einwandfrei funktioniert, benutzen Sie es bitte nicht!
3. Es sind keine Teile im Gerat enthalten, die anderweitig verwendbar sind.
4. Bei den Verbindungen am Gerat sowie auch bei den Streben, die nach oben fuhren, sind
Gefahrenbereiche vorhanden. Halten Sie bitte die Finger von diesen Gefahrenbereichen
fern.
5. Das Gerat gehort zur Installationskategorie II. Da dieses Gerat sehr schwer ist, heben oder
bewegen Sie es bitte nur mit zwei oder mehreren Personen.

6. Wenn das Gerat auf eine, vom Hersteller nicht spezifizierte Weise, betrieben wird, kann
der, von dem Gerat bereitgestellte Schutz, vielleicht beeintrachtigt werden.
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Instruction Manual
Getting Started
System Overview
7. Bitte vermeiden Sie eine Beschadigung der Anzeige. Reinigen Sie die Anzeige nur mit
einem weichen Stoff, der mit etwas milder Seife und Wasser befeuchtet wird. Bitte keine
Losungsmittel oder scharfe Reiniger verwenden.
Franais
Avertissement ou prcaution demploi

1. Le cordon dalimentation doit tre muni dun fil de terre et doit tre
avec une broche de terre. Le systme possde

terre sous forme de prise "JACK".
raccord une prise

larrire une prise de protection lie la
2. Si lunit semble ne pas fonctionner correctement, ne pas lutiliser.

3. Aucune pice lintrieur nest rgler ou ajuster par lutilisateur.
4. Ne pas mettre les doigts dans les ouvertures sur les cts, l o passent les bras de liaison
de la plaque porte-doigts.
5. Le systme appartient la catgorie dinstrument numro II. Lunit est lourde lever et
dplacer laide de 2 personnes ou plus.

6. Si lquipement est utilis dune manire non spcifie par le fabriquant, la protection peut
tre dfayante.
7. Pour viter des domages lcran de visualisation ou la baie, nutiliser ni solvants ni
ntoyant abrasif. Nttoyer avec un chiffon doux tremp dans de leau savoneuse.
Nederlands
Waarschuwingen en voorzorgsmaatregelen
1. Het netaansluitsnoer moet voorzien zijn van een geintegreerde aarding en moet
aangesloten worden aan een netaansluiting met aardpen. Het achterpaneel van dit systeem
is voorzien van een aardingsaansluiting.
2. Het systeem niet gebruiken indien er aanwijzingen zijn dat het niet correct functioneert.
3. Dit systeem bevat geen onderdelen die door de gebruiker zelf onderhouden en/of hersteld
mogen worden.
4. Aan beide zijden van het toestel, en in de buurt van de bewegende onderdelen zijn er
gevarenzones. Houdt vingers uit deze zones.

5. Dit systeem behoort tot installatieclasse II. De eenheid is zwaar Minimaal twee
personen zijn nodig om het te tillen of te verplaatsen.

6. Indien het toestel niet gebruikt wordt zoals voorgeschreven door de producent, dan kan dit
afbreuk doen aan de beveiligingen voorzien in het systeem.

7. Om beschadiging te voorkomen aan het scherm en de behuizing mogen geen solventen of
aantastende schoonmaakproducten worden gebruikt. Schoonmaken moet gebeuren met

een zachte doek bevochtigd met water en een milde zeep.
2-3
Getting Started
Installation
Instruction Manual
Italiano
Avvisi e precauzioni
1. Il cavo di alimentazione deve essere provvisto di massa e collegato ad una presa dotata di
massa a terra. Il pannello posteriore del sistema ha una connessione di protezione a massa.
2. Se il sistema appare non funzionare correttamente, evitate di usarlo.
3. Il sistema pu essere riparato solo dal personale qualificato preventivamente autorizzato
dal produttore.
4. Evitate di porre le mani in prossimit del sistema di movimentazione del piano pressore:
pericolo di schiacciamento.
5. Il sistema deve essere movimentato da due persone dotate di adeguata attrezzatura
(Categoria II).
6. L'uso improprio del sistema pu comprometterne la sicurezza.
7. Onde evitare il danneggiamento del monitor o della carcassa del sistema, non usare
solventi o detergenti abrasivi. Pulite con panni soffici, acqua e sapone medio.
Svenska
VARNING
Notera fljande punkter fre igng krning av anlggningen.
1. 230 volt anslutnings kabel samt vgguttag mste vara jordad. Anlggningen har ett jordat
uttag i bakre panel.

2. Om ngot onormalt intrffar? Stng av anlggning och kontakta nrmaste terfrsljare.
3. Anvnd endast original reservdelar.
4. Klm zoner existerar p sidorna av anlggningen runt lnksystemet. Samt dr press nr
top. Hll fingrar borta frn dessa omrden.

5. Anlggningen r av installations kategori II. Anlggningen r tung. Vid installation eller
flytt av anlggningen anvnds minst 2 personer.

6. Om anlggningen anvnds till annat n speciferat av tillvrkare. Kan detta ven ha effekt
p skerhets utrustning p anlggningen.

7. Fr att undvika skador p chassi eller display. Anvnd endast tvl samt ltt fuktad trasa.
Installation
The Analyst mc is shipped complete. Please perform the following final steps:
1. Remove the unit from the box.
2-4
Instruction Manual
Getting Started
Installation
2. With the back panel power switched off, connect the power cord to a grounded power
outlet. Ensure that the system power supply setting matches the power outlet voltage.
Also connect a power cord from the monitor to a grounded power outlet. Generally,
monitors will automatically switch from 110v to 220v, but check the monitor to be sure.
3. Connect the keyboard and mouse to the System connectors (top right of unit). Connect the
monitor to the system video port. A Y-style cable is provided to plug in the keyboard and
mouse.
4. The handle can be placed on the right or left side of the System. If the lid is in the down
position, the handle should be rotated towards the front. If the lid is in the up position, the
handle should be rotated towards the back. Once the handle is pushed on the shaft, install
the one-inch, 10-24 screw with the included hex wrench. Rotate the handle to the front,
push it down firmly to lock it in position and close the lid. Rotate the handle up and back
to open the fixture lid.
5. Turn power on to the Analyst mc and the monitor. The power on/off switch is located on
the back of the System. The monitor power on/off switch is located on the front of the
monitor.
The monitor can be placed on the top of the System. The optional printer, if used, can be
plugged into the System connector. Although the PC keyboard and mouse can be used during
testing, the front panel keypad provides all the functionality needed to run and test assemblies.
As shipped from CheckSum, the Visual MDA Test System Software is already installed.
Test System Input / Output Connector Description
The Analyst mc has a number of input and output connectors described below.
Front panel connectors
Test Input Jacks: These banana-jack inputs can be used with probes to make measurements
with the test system, or to probe test points for locating purposes. To make a measurement,
install probes into the High and Low BNC jacks. To probe a test point, use a probe connected
to the Low jack. The ground jack can be used as a measurement shield, or for other purposes,
such as to ground an ESD strap for the operator. There should not be more than 10 volts
present between any of the test input jacks.
Back panel connectors
Protective Ground Jack: This banana jack input can be used as a protective ground input to the
system in the event that a ground is not available in the power-supply input cord. It is
connected to chassis ground of the Analyst mc.
Power-cord input: This three-terminal connector is used for AC power input and ground using
industry-standard power cords. Before installing the power cord, ensure that the nearby
power-supply switch is set to the voltage that you will be providing.
Computer connectors
The computer connectors are at the top of the right hand side of the unit (when viewed from
the front). These include:
VGA: This high-density DB-15 connector is used to connect the video signals to the CRT.
2-5
Getting Started
Instruction Manual
KBD: This connector is used to connect the mouse and keyboard to the test system. These
connections are made via a Y-cable that is provided. The center of the Y-cable connects to the
input, one leg of the Y-cable connects to the keyboard, and the other to the mouse.
COM1: This DB-9 connector can be used to connect RS-232 devices such as a serial printer to
the system. In some cases, this port may be able to be reconfigured to be an RS-485 port. See
the computer manual for details.
Unlabeled DB-25: This connector is used to connect the system to a parallel-interface printer.
Unlabeled DB-9: This connector can be used to connect RS-232 devices such as a serial
printer to the system. It is configured as "COM2:". In some cases, this port may be able to be
reconfigured to be an RS-485 port. See the computer manual for details.

In order to use the Analyst mc for testing, a custom test fixture must be built, and a test
program must be written. This section of the manual gives you overview information about
connecting to the UUT.
The Analyst front panel has High and Low Input (two BNC jacks) connectors used for the
multi-function input measurement system (see Multi-Function Input on page 9-51).
The Analyst uses CheckSum Model KIT600-QC fixture kits. The KIT600-QC fixture kits are
capable of connecting up to 600 test points however the Analyst mc is configured for only 400
test points maximum. For each 200 test points that you will be using, you will also need a
CheckSum Model FIX-200-WB wiring block for the fixture kit. You will be wiring to the
fixture interface at the back of the fixture kit. There can be two interface blocks, each with 200
points. The fixture kit blocks are labeled A, B, and C as shown in the following figure.
Analyst Wiring Block Naming Convention

(shown from top front)
2-6
Instruction Manual
Getting Started
The pin out for a typical connector interface block is shown in the following figure:
Analyst Fixture Interface Block Pin Numbering Convention

(shown from top front)
The following table shows the block and pin wiring for the various measurement and stimulus
resources:
Test points 1-200
Test points 201-400
Not used
A1-A200
B1-B200
C1-C200

Fixture Probe Plate/Pan Installation
Carefully follow these instructions to push the fixture down until it latches in the press.
Note
In order to protect the unit-under-test (UUT) and test system from ESD
(electrostatic discharge), it is advisable to wear a wrist strap. The wrist strap
can be connected to the front panel ground plug.
1. If the clear top pressure plate is attached to the bottom fixture probe/pan assembly, remove
it from the handles, and set the handles and top aside. The handles should be stored so they
can be used to attach the top pressure plate to the probe/pan for storage when this fixture is
not in use. Pick up the bottom fixture probe/pan without the handles.
2. Insert the fixture probe/pan with the black pivot pins and spring probe target pins towards
the back of the system. Tilt the fixture to about 45 to allow the back of the fixture to slip
under the bar in the back of the system.
3. With the unit pushed back in the system and the two pivot pins resting in the matching
slots, lower the fixture until it stops.

4. Press down on the front of the fixture. This will cause the fixture probe/pan to latch into
the system base.

5. The top pressure plate is installed with the lid in the open position. If the lid is down,
rotate the handle to raise and open the lid.
2-7
Getting Started
Instruction Manual
6. The top pressure plate must be installed in the correct orientation. The CHECKSUM name
is on the back left corner of the pressure plate. The detent notches on the edges of the
plate are oriented towards the back of the fixture lid. Lift the top pressure plate up under
the fixture lid and align the slots in the pressure plate with the four retaining clips on the
underside of the lid. The retaining clips fit in the slots in the top pressure plate. With the
top plate held up against the underside of the lid, slide it towards the back of the lid. It will
snap into place when engaged by the detents on each side of the lid. The retaining clips
will position and hold the top plate.
Installing the UUT in the Fixture

To install the UUT into the completed test fixture, first open the top lid. To do so, grasp the
lever handle and rotate it to the back position. The top lid opens with assist from the struts.
The UUT is then installed over the guide pins.
Performing the Test
Once the UUT is in place, the top cover is pressed down by rotating the lever handle to the
front position. The handle will snap and lock into place in the fully-engaged front position.
Note
Before lowering the pressure plate to the UUT, check to ensure that the
pressure rods are not going to make contact with the UUT in the wrong
places. If this is the case, the press has adequate force to seriously damage
the fixture and/or the UUT.
The lever arm is moved to the forward position to apply pressure to the spring probes. The test
is then started via the system keypad or computer keyboard. The system can be setup to start
the test simply by engaging the lever handle, see Auto-starting a Test on page 5-21.
After the test, move the lever arm to the back position to open the lid and remove the UUT.
Removing the Fixture from the Test System
Once you are done testing a type of assembly and ready to change to a new type, it is necessary
to remove the fixture kit from the system.
Note
The installed fixture may pop-up quickly when the front probe plate latch is
released. To prevent this and protect your fingers, hold down the probe plate
firmly as you release the latch.
1. First, the clear top pressure plate is removed with the lid in the open position. If the lid is
down, rotate the handle to raise and open the lid.

2. To remove the clear top plate, slide the top plate towards you until the detents release.
Then remove the plate by letting it move down to clear the retaining clips.
3. Pull the latch lever on the front bottom towards you. The front of the fixture base pivots
up. Lift the front up to about 45 and then lift it away from the system.
4. Install the storage handles into the probe plate.
5. Place the pressure plate on top of the handles and attach it to the bottom probe/pan base.
2-8
Instruction Manual
Getting Started
The fixture is now ready for storage and installation of a new customized fixture.

The System's measurements are made via test points available at the fixture system interface
blocks. Each pin is called a point or test point. Each test point is completely universal in
nature and can be connected to any UUT test point.
For MDA testing, all of the System test points are electrically equivalent and can be wired
randomly. If you are not concerned with detailed pin and connection names for operator
interaction and reports, it is not even necessary to know how the UUT is connected to the
System for doing MDA opens and shorts testing. The System can self-learn a UUT without
concern for user-assigned pin and connection names.
Test points 1 - 400 are on the System board shown in the 'Hardware' display of the Configure
System screen. If you need to identify a test point pin, you can use the system to tell you which
one it is. From the 'System' Screen, select 'Edit Test' (F3), then from the 'Setup' pull-down,
select 'Connection Information', and finally select 'Probe a Pin' from the 'Probe' pull-down.
Connect a probe to the banana jack on the front panel of the System, and then touch the pin to
be identified - the system will then display the number of the probed test point.

The test program tells the System how to test an assembly (also called the unit-under-test or
UUT). The test program is generated once, saved on the disk, then used each time one or more
of the same UUTs are tested.
The test program consists of a number of test steps, most of which can generate test results.
Typical test types include CONT for continuity, RES for resistance tests, CAP for capacitance
tests, INDUC for inductance tests and DIODE for semiconductor junction tests. For most of
these test types, the test step contains upper and lower test limits, the two test point numbers
and names, the measurement range, and a test title describing the component being tested. In
addition, the test program contains point names (optionally assigned), the measurement
characteristics (e.g., samples averaged for each reading), active pins, the assembly name
(optional) and operator comments (optional instructions to the operator).
Generating a test program can be performed in several ways. All are available from the 'Edit
Test' ([F2]) selection of the System screen. You may use the System in random sequences of
configuration, learning, testing, and other operations. When you are satisfied with your test
program, save it to disk.
Following is a typical programming sequence:
2-9
Getting Started
Instruction Manual
The first step is to assign test point names. To get to this screen, select 'Edit Test', then
from the 'Setup' pull-down, select 'Connection Information'. This screen allows you to
enter names specific to your UUT into the System. When you do this, the System displays
and reports will contain the names that you enter. Each pin name can be up to twelve
displayed characters. The System can automatically assign sequential pin names as you
probe the fixture, making this process quick and easy. The 'Connection Information'
screen also allows you to specify which test points are active and inactive (ignored) when
learning CONTinuity for an assembly.
Once you have assigned pin names, you can use the 'Print' selection of the 'File' pull-down
to output a wiring list for the UUT.
Use the Edit screen to enter a test type of CONT (continuity). Then select 'Step Analysis'
from the 'Measure' pull-down to get the Continuity/No Care Information screen. Finally,
select 'Learn All' from the 'Connection' pull-down to automatically learn the UUT's
known-good opens and connections.
Once the connections are learned, exit back to the Edit screen. For each component in the
UUT, press the Insert key, enter the two test point numbers ('From' and 'To' point numbers)
or pin names, the test type (e.g., RES, CAP, INDUC or DIODE), the component name in
the test title (e.g., R101) and the expected value in the Nom(inal) column. Then select 'Set
Initial Limits and Range' from the 'Measure' pull-down for the System to assign a range
and test tolerances. Finally, you can select 'Step Analysis' from the 'Measure' pull-down to
measure the component. In this screen you will see the measurement performed using
multiple measurement methods. The highlighted measurement is the default selected by
the system. Press [F3] a few times to make measurements. In most cases, the reading will
be relatively stable and approximately the expected nominal value. In some cases you may
obtain better measurements by moving to another technique or range. Once you have
chosen the best range, exit and the measurement technique and range will be logged for
that step. Entering Test Steps on page 9-1 discusses measurement optimization in detail.
Note that at times, even after optimization, the measurement values will be different from
the nominal values of the components that you are measuring. This is a normal case
caused by interference from associated circuitry on the UUT. Even though the test limits
may not represent the nominal value of the component, the System will still efficiently find
most manufacturing faults because differences from the programmed value are detected.
These measurement differences can be minimized by careful selection of ranges and

polarities used in the measurements, guarding, and the use of zero/scale values. The uses
of these advanced features are described in Entering Test Steps on page 9-1. Theory of
Operation on page 16-1 describes how the System makes measurements to allow you to
make the best measurements if you run across problem components.
The Operator set-up screen, accessed from 'Operator Instructions Setup' from the 'Setup'
pull-down, can be used to create a screen of text that the operator sees prior to beginning a
test for each UUT. This text can be used for precautions, connection information, or other
things that you would like to convey to the operator. This screen can also contain simple
character-graphic drawings that you create.
Once you have entered the test program, you will want to run a batch of UUTs through the
System to verify that the tolerances are appropriate to meet the UUT-to-UUT and
measurement variances. You can use data logging in conjunction with the X-Bar/Sigma
Control Report to help determine appropriate tolerances by analyzing the readings from
the first few batches of UUTs tested.
2-10
Instruction Manual
Getting Started
When you are done with the test program, you can save it from the file menu and, from the
same menu obtain a print out. As with any other software application, you should
frequently save your work as you develop a test program.

Once you have generated a test program for a UUT, the UUT may be tested. To test a UUT,
select `Run Test' ([F1]) from the System screen. If the test program has not been already
opened, you are then presented with the Open File screen. Select the test program name, then
OK to load it. Execution will then begin.
If the test fails any points (and the System is set for halt on fail), you are presented with a
display describing the failure. You may continue, stop, or retry the test.
Auto-start the Test
The standard setup for the System uses the handle to automatically start a test. When the
operator rotates the handle to the fully-closed position (front position and pushed firmly
down), the System automatically starts the next Test (F1). You can also configure the System
to perform a ReTest (F2) if the handle is opened and quickly closed after the end of a test.
This action reseats the spring probes on the board. This setup is configured in the "Fixture
Configuration" section of the "Configure System" setup window.
Once the test is completed, you see the Test Complete screen. This screen allows you to either
continue on to the next assembly in this run or to retest the present assembly.
At the end of any test, you may also generate a report. The test report ([F3]) contains the
actual measurements for the UUT. The selection for the report output device (for example
CRT or LPT1) is configured in the Test screen menu Environment > Report Device. The
contents of the report (failures-only or all step results) is setup in Test screen menu
Environment > Test Reports Contents. The Report pull-down also allows you to select a batch
report that gives a summary of all of the UUT's tested in this run. Use of the configuration
screens is described in System Configuration on page 5-1.
Operator Keypad
The operator keypad is located on the front panel of the System. The keypad allows the
operator to control the execution of the system software without a standard keyboard. It limits
the test operator to only specific test actions such as selecting and executing tests.
The 8 keys on the keypad are labeled F1 to F7 and ESC. These keys can be used to select a
test from the main screen. For example, the F2 key selects Run Test and F6 selects File Open
to allow the operator to select the test program. The keypad can be setup to ignore any of
keys, see the following keypad mask section for more information.
The keypad can be used on several screens.
2-11
Getting Started
Operator Keypad
Keypad use in Open File dialog box:

F4 - Same as the keyboard Enter key
F6 - Next item (Scroll down)
F3 - Previous item (Scroll up)
F7 - Next selection (Tab)
F5 - Previous selection (Shift Tab)
ESC - Cancel
Keypad use in Test Screen:
F1 - Test next assembly
F2 - ReTest assembly
F3 - Test Report
F4 - Skipped PCB selection (if panelized)
F5 - Batch Report
F6 - Open File dialog box
ESC - Stop
Keypad use in Halt on Fail /Single Step Screen:
F1 - Next test step
F2 - ReTest
F3 - Continuous Test
ESC - Stop
Keypad use in Skipped PCB Selection Screen:
F1 - Toggle Skip Selection On/Off
F2 - Move left
F3 - Move up
F4 - OK
F5 - Move right
F6 - Move down
F7 - Retain Skip Selections
ESC - Cancel
Keypad use in Enter UUT/Batch ID Screens:
F4 - OK
ESC - Cancel
Keypad use in Comments/Instructions Screen:
F4 - OK
ESC - OK
Keypad use in Test Results Screen:
F3 - Page Up
F4 - OK
F6 - Page Down
Keypad use in Confirmation, Warning, and Error dialog
boxes when test programs are started:
2-12
Instruction Manual
Instruction Manual
Getting Started
Operator Keypad
F4 - OK
F5 - Yes
F7 - No
Keypad Mask
The following keypad switches can be enabled/disabled via the keypad mask using the test step
MEMI range 33. The command line parameter (/km) can also be used to set the keypad mask
when the system software is started. Setting the keypad mask bit to 1 enables that key on the
keypad. A mask value of 255 enables all of the keys and a mask value of 0 disables all of the
keys. The mask is the sum of the keys you want to enable:
Key
[ESC]
[F1]
[F2]
[F3]
[F4]
[F5]
[F6]
[F7]
Mask Bit
1
2
4
8
16
32
64
128
2-13
Getting Started
Operator Keypad
2-14
Instruction Manual
Chapter 3
Opening Screen
Main System Window
Main System Window
Note
The Analyst mc environment can be modified to meet a variety of testing
needs unique to each facility. For example, the system may have logins
enabled that provide different levels of access and selection visibility to
each user. If this is enabled on your system, the screens shown in this
manual may not exactly match those of your system. See the menu control
on page 5-17 section for information on menu selection visibility.
Opening Screen
Main System Window
Instruction Manual
In general terms, this is what each major option will do for you:
Main System Window Choices

There are four main selections in the center of the main system window, each is discussed
below:
Run Test [F1] is used to test an assembly. The assembly must have been previously
programmed (or 'learned') by use of 'Edit Test'. The selection of 'Run Test' also allows you
to choose a test program describing the tests to be performed on the UUT, and to display
or print test results. See Selecting the Test Program on page 6-2.
Edit Test [F2] is used if you want to program ('learn') the test sequence and test tolerances
for a particular UUT. You can use 'Edit Test' to assign pin names, assign operator
instructions, assign an assembly name, assign test tolerances, generate a test program from
CAD data, manually generate or edit a test program, save the test program on the disk, or
get a test program report for the assembly. See The Edit Test Screen on page 8-6.
Generate SPC Report [F3] is used to generate statistics reports to describe testing that
has occurred on the System. These reports include Production Reports to list the number
of UUTs tested over a period of time, how many passed or failed, the yield and how many
defects. The Pareto Failure Report allows you to find out what type of errors have
occurred and their frequency. The X-Bar/Sigma Control Report allows you to analyze
analog measurements to observe trends or for setting test limits. See Statistical Analysis
on page 7-1.
Configure System [F4] is used to change the configuration of your testing environment.
With this option you can:
Configure the test system modules and options. Self-test (which verifies proper
operation) is available.
Specify the test system directory structure
Configure password access
Configure the reports generated by the System
See System Configuration on page 5-1.
Toolbar Choices
There are several tools (toolbar icons) available in the main system window:
Folder (Open) allows you to open a test file. This option allows you to select a test
program to be executed and load it from the system disk.
Disk (Save) saves the test program now in memory to a disk file.
People (Login) allows you to log into the system. If logins are enabled, each user has a
name, and optionally a password. Different users may be assigned different levels of
access to system operations. If you try to access an operation for which you do not have
permission, the system will not allow you to continue. This tool bar item allows you to
login to the system with your user-name and password.
Multi-Function Meter allows you to make quick measurements using the front panel test
inputs or the test points in a fixture (see Multi-Function Input on page 9-51).
Green Door (Exit) allows you to terminate operation of the System software. Once this
option is selected, you return to the normal Windows environment.
3-2
Instruction Manual
Opening Screen
Menu-Bar Choices
There are a number of menu choices available to the user. These include:
File Menu below
Test Menu on page 6-2
Learn Assembly Menu on page 3-4
Statistical Analysis on page 7-1
Main File Menu
Open loads a new test program from disk into memory so that it is available for execution.
See Selecting the Test Program on page 6-2 .
Save saves the test program now in memory to a disk file.
Save As opens a dialog box to allow the test program to be saved to another file. It is
saved in standard binary format (Test Program). See Saving Test Programs on page 8-34
for additional information.
Exit stops execution of the Visual MDA software package and returns you to the normal
Windows operating environment. You are prompted to save the test program if necessary.
3-3
Opening Screen
Learn Assembly Menu
Instruction Manual
Learn Assembly Menu
Learn Assembly Menu
Edit Test moves you to the program editor. This is used to create and modify test
programs. See The Edit Test Screen on page 8-6.
Related Topics
Writing test programs is described in more detail in the following topics:
The Edit Test Screen on page 8-6.
CAD Data Conversion on page 10-1
3-4
Chapter 4
System Installation
Overview
The System is fully configured with hardware and software already installed. The previous
section, Getting Started, has all the normal information to setup and use the System.
Normally, the System does not have any options. Under special arrangement with CheckSum,
an additional module may be installed in the System. This section describes the process of
adding an additional module.
The items of interest in the installation process are:
1. Information about the Analyst mc System electronics.
2. Installation of Visual MDA Software.
3. Connections are made to the UUT via a fixturing system.
Jumper Settings
The System, as shipped, is configured so that the software and hardware jumper configurations
match your particular order. Because of this, you normally will not need to change any of the
jumpers.
If changes are necessary, the corresponding changes need to be made both on the hardware and
in the software. You may wish to change the software configuration first since it will show
you the new jumper positions necessary and show the range of addresses used by the module
to help prevent conflicts.
Installing a Module
Note
This installation procedure requires that you remove the cover from your
System for internal installation of the electronics modules. If you are not
experienced with such procedures, you should obtain the help of a qualified
person to do the installation.
System Installation
Instruction Manual
Caution
Ensure that you have removed the power from your PC. The power cable
should be completely disconnected from its receptacle and the power switch
should be turned off. Use an anti-static wrist strap when doing the following
to minimize potential electrostatic discharge (ESD) damage to your
computer or to the Analyst mc electronics. If you do not have an ESD
device, place your hand on the chassis of the PC to discharge any
electrostatic potential your body may contain
Before doing any module installation, it is necessary to open the System cover. To do so,
perform the following steps:
1. Turn off the power and remove the power cord from your System to minimize safety
hazards and to ensure that no damage is done to circuitry in the System.

2. Remove the three screws on each side of the System.
3. Rotate the cover back and support the cover lid so the cables are not strained.
4. Discharge static electricity.
Topics:
Analyst mc System Module below
Model T-120-2 Strip Printer Installation on page 4-3
Completing the Hardware Installation on page 4-4
Software Installation on page 4-4
Completing the Software Installation on page 4-5
Connection to the UUT on page 4-5
Connection Guidelines on page 4-6

Insure that your System Module is jumpered correctly. The default configuration has jumpers
on JP5 (shown in the following figure) BASE ADDRESS positions 9 and 7, setting Base
Address 640 decimal (280 hex). The System Module uses 16 consecutive I/O addresses
beginning at its base address. Details about the specifics of setting the jumpers are shown in In
Case of Problems on page 13-1. See the Specifications section, for detailed technical
specifications.
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Instruction Manual
Keyboard
JP1
L.S.
JP2
System Installation
Analog Bus
JP3
JTAG
Base Address Board Select

98765
210
JP5
JP4
JP6
Serial / Parallel Connectors

16-wire Analog Bus
JP1
Optional Module
J1
Single Board Controller Module

J2
JP7
JP8
Cable Test Points

151 - 200
JP9
JP10
351 - 400
101 - 150
JP11
JP12
301 - 350
51 - 100
JP13
JP14
251 - 300
1 - 50
JP15
JP16
201 - 250
Analyst mc System Board & Base Address Jumpers

The Model T-120-2 Strip Printer can be used to print test results in a compact form. The
Model T-120-2 is available in either parallel (-2P, standard) or serial (-2S, no-cost option)
configurations. Both include the appropriate cable. Normally, the parallel printer connects to
the LPT1 connector, and the serial version connects to the COM1 connector on the back of the
controller.
In order to configure the printer to work properly, the internal DIP switch should be set to all
"ON or one's" (the factory default).
For the serial printer, you will need to specify to the System the baud rate and other
communication parameters. The values are entered into the `External Hardware' page of the
Configure System screen. The default values are baud rate 9600, data bits 8, retry action
polling, parity none, and stop bits 1. Also, set the report width to 40, and blank lines at end to
6.
Finally, for the parallel printer specify "LPT1" as the output device in the Configure System >
External Hardware > Test Report Device menu. Set it to "COM1" if you have the serial
printer. Once changed, saving the station configuration data on disk will save the setting for
future use. Prior to use, check that the printer ribbon and paper are installed and that the printer
is switched to the on-line position before printing results.
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System Installation
Instruction Manual
If you encounter any problems, see In Case of Problems on page 13-1 in the Trouble Shooting
section.

As a final step in the hardware installation process, it may be necessary to install the internal
bus cabling inside the Analyst mc.
A 16-pin analog bus carries the signals from the System Module (JP3) to the other module.
Step 1. If you are installing a Model TR-8-1 Module, connect a short 16-pin ribbon cable
between the Analyst mc System Module JP3 and Model TR-8-1 MPX Module JP1.
Step 2. Reinstall the cover.
Step 3. Reconnect and turn on power.
Software Installation
If you need to re-install the MDA test system software, read this section.
The test controller should be pre-loaded with Windows 95/98 software.
The System uses the main executable file VISMDAMC.EXE that is accessed during some
operations. It also uses the configuration file $MC$.DAT that contains information specific to
your installation (calibration constants, hardware setup, data paths,...). It also contains the files
GPIB.EXE, GPIB.PIF, and the Help files.
As a default, the installation procedure installs Visual MDA into a new subdirectory called
C:\CHECKSUM. Normally, the directory below CHECKSUM, named SPECFILE is used for
test programs. You can change the selection of the test program subdirectory in the Configure
System > Environment > Directories / Locations menu screen.
Insert the Visual MDA software distribution disk in your computer.
To install the software, use the Windows RUN command to invoke setup.exe on the
installation disk. Follow the instructions of the installation procedure.
When you are done with installation, remove the Visual MDA software and store it in a safe
place.
Start the Visual MDA software by using the mouse to double-click on the MDA icon, or use
the run menu-item to invoke VISMDAMC.EXE in the CHECKSUM directory. If you
encounter any display problems, see the section In Case of Problems on page 13-1.
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Instruction Manual
System Installation

At this point, you should see the system screen, which is called the Main System window. This
is the starting window for all System operations.
Main System Window
Software installation is complete at this time.

Refer to Modules Configuration on page 5-3 to learn how to run self-test on the modules and
alter the system configuration to meet your specific needs. This needs to be done as part of the
installation process.
Connection to the UUT

Once you have installed the System hardware and software, you are ready to connect your
unit-under-test (UUT) to the System. The UUT is connected via the 200-pin fixture interface
blocks in the System. These 200-pin interface blocks connect to the 200-pin target blocks on
the fixture.
You may choose to obtain a customized fixture and MDA test program from CheckSum or
design your own.
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System Installation
Instruction Manual
Following are some guidelines for use when wiring for MDA testing.
You should consider the use of external sense points when designing the fixture. In many
cases, when measuring or guarding low-impedance components (below about 100 ), better
measurement results can be obtained by making a 4-wire connection all the way to the UUT,
allowing the voltages to be sensed as close to the component being measured as possible. A
recommended practice is to always wire an extra connection to the UUT's ground and to each
of its power supplies.
There are three ways to wire an external sense point, all of which work well:
1. Install two probes on the desired network.
2. Connect two wires going to the same probe.
3. Connect two test points together at the end of the cables coming from the MPX Module. If
you would like to have groups of 50 test points all wired with external sense points, a
special loop-back Kelvin cable can be used. Each end of the Kelvin cable connects to a
header on the MPX Module, then it has a 50-pin receptacle mounted in the middle of the
cable that you connect to your fixture.
Caution
It is very important that the MDA System test points are not exposed to
voltages greater than +12V or less than -12V referenced to the controller
chassis. Doing so will damage the test system.
4-6
Chapter 5
System Configuration
Overview
The Configure System screen is used to either temporarily or permanently change the
configuration of the System. This applies to characteristics such as printer configuration,
report configuration, automatic reporting, hardware setup, and so on.
Almost all of the attributes configured into the System can be saved on the System disk with
the 'Save' button of the Configure System screen.
If you use password protection, users cannot access the Configure System screen without
permission. This provides System integrity against accidental configuration changes.
Configure System Menu
Modules allows you to enter the hardware configuration of CheckSum Modules in the
System, and to perform self-test on them. See Modules Configuration on page 5-3.
Instruction Manual
Environment allows you to enter information about the configuration of system reports,
the directory structure for the system, and password protection. See Environment
Configuration on page 5-8.
External Hardware allows you to enter information about the configuration of printer
devices, beeper, and footswitch. See External Hardware on page 5-20.
Fixture allows you to specify what action the System will perform when the lever handle
is engaged (fully counter-clockwise). See Auto-starting a test program in Fixture on page
5-21.
Login User allows you to enter a user (operator) name into the System. If the system is
configured with login names turned on, a user must be logged in at all times. Optionally, a
password may be required for each user. The system can be configured so that different
users have different access privileges and may see different menu options. Login
privileges are defined in the 'Configure System' section of the software that can be
accessed from the main screen.

Picking one of the first four entries causes the Configure System Window to appear with the
appropriate tab selected as shown in the following figure for Modules Configuration.
Save Button
The Save button is used to save your configuration selections to the disk drive. When you
save the configuration, each time you restart Visual MDA Software you will not need to
reconfigure your System. The configuration file is transparent to you. It is named
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Instruction Manual
"$MC$.DAT" and is stored in the same directory as the Visual MDA Software. Selection of
'Save' saves the report configuration, automatic reporting configuration, the I/O module
configuration, the active points, the measurement characteristics, the printout configuration
parameters, the passwords, the default CAD format, and the System calibration constants.
With a command line parameter, you can also specify an alternate path for the configuration
file. This is useful in networking environments so that test systems on the network can share
the same MDA executable file but have their own unique calibration and configuration data.
The System can be tested against external standards if desired. This can be used to meet
standards of traceability for the System, as may be required for ISO 9000 reporting.
The optional CM-3-KIT600 Calibration Verification Module provides software and hardware
to test the System operation against values external to the System. You can
confirm/characterize the values of the components on the Calibration Module in your
calibration facility if desired.
Print Button
You can use the Print button to print out the contents of the displayed page for internal
documentation purposes.
The Modules page is used to specify the hardware configuration of CheckSum Modules in
your controller. With its use, you can specify how many modules you have, their address
jumpers, and their connection to the fixture system. With this screen you also run self-test on
the modules to ensure that they are operating properly and to self-calibrate them. The Modules
page is shown in the following figure.
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Instruction Manual
Modules Page
Configuration Table
At the top of the Modules page, you will find a table that describes the CheckSum modules in
the System. Each line represents one slot in the computer. Note that the module order does
not necessarily have to match the order in your controller, although as you insert modules, a
logical order is used by the System as a default.
The Module column shows the name of each module.
The Points column shows the test points used by the module.
The Base Address column shows the base I/O address used by the module. Except for
modules that have board select addressing (see the discussion of board select addressing in
the next paragraph), the I/O addresses cannot overlap, or conflict with other hardware that
is installed in the System, such as ISA network cards, modems, or sound cards. The
addresses can be shown in decimal or hexadecimal, the 'Address Mode' button is used to
select the preferred mode.
5-4
The Jumpers column shows the jumper positions on the module that will achieve the
specified address.
The Addresses column shows the I/O address range currently specified for the
module. You can change either the jumper or addresses by clicking on the 'Modify'
button. If you change either the address or the jumpers, the System will change the
other accordingly. If you numerically enter the base address, the System will not
accept numbers that cannot be set by the jumpers for that module.
Instruction Manual
Board Select column: Some CheckSum Modules can also accommodate board select
addressing. Board select addressing can allow multiple modules to share the same I/O
address space. Modules that have board select addressing have an additional jumper that
specifies the module address within the I/O space. For example you may have two
modules at base address 768. One has a board select address of 1 and the second of 2.
Modification of the board select address columns (jumpers and addresses) works just like
those of the corresponding base address columns.
The Interface column specifies which fixture receiver interface connectors that the
module will be connected. For example, if A1-B200 is specified, the System expects that
the module will be connected to A1 through B200 on the fixture receiver. The entries in
this field are used for the Wire Run Report (I/F Block column) to document your interface
block (I/F Block) connections.
Module Specific allows entry and control of settings unique to a module.
Other Configure topics:
Adding/Deleting Modules below
Reverting/Saving Configuration Information below
Module Self-Test on page 5-6
System Module on page 5-7
Multiplexer (MPX) Modules on page 5-7
In the standard configuration, the Analyst mc cannot add optional modules.
If you have a special version of the System and you want to add a new module to the System
configuration, use the 'Add Module' button. With this button, you obtain a list of the module
types that can be added. When you choose one, it is added to the configuration table. It is
assigned a default base address, and location in the table. The location, while not required, is
one that should work well with the internal cabling. You can select a module in the
configuration with the mouse, then use the 'Delete' button to eliminate it from the list.
Reverting/Saving Configuration Information

If you modify your configuration unsuccessfully, you can recover with the 'Revert' button.
Once you have selected this function, you can elect to either reset the screen to the factory
default settings, or to reset it to the values when you started Visual MDA.
The 'Save' feature can be used to save the settings and self-test calibration data on the disk.
You should always save the configuration settings after running self-test or changing the
configuration of your system so that the changes will be available next time you start up the
System software. When you save the settings, everything in all the Configure System pages
are saved on the disk.
5-5
Module Self-Test
Instruction Manual
Module Self-Test
You can use the 'Self-Test' button to invoke a self-test on the currently selected module.
Normally, you should start at the top of the configuration table, and work down module-bymodule.
Self-test provides several basic functions. It calibrates the system speed so that the System
will operate correctly in a wide variety of processor environments. It then checks the modules
in your system to ensure that they are functional. Finally, it calibrates the modules, as
appropriate, to on-board calibration standards.
You should select the System Module first before any optional modules. The order is
important since the System Module is used to self-test and characterize the other modules.
After installation, to ensure proper operation, you should run self-test/calibration on every
Module in your System. Thereafter, you should run self-test twice a year or if you suspect any
problems with the System's operation.
When self-test has started, follow the prompts until it is completed. It will report any errors
that it finds.
Beside each module that has been self-tested, you will see a green check to show that it has
passed, or a red X that shows it has failed. A smaller check mark indicates the self-test was
canceled before it finished and no failures were found. The "?" indicates that the system was
not able to locate the module as defined. Check the addressing specification in this case.
If external confirmation of Analyst mc operation is necessary in your installation, you can
order the optional Model CM-3-KIT600 Calibration Verification Module as an external
reference to provide traceability. The Model CM-3-KIT600 includes reference components
and a test program that tests the system against the value of the components in the CM-3. You
can send the CM-3 to a traceable laboratory if you wish for the component values to be
characterized (measured). You then can enter the characterized values, and have the System
measure against these to ensure that it is measuring within specifications.
In the event that a failure occurs, you are presented with an error message describing the nature
of the failure.
When the test is complete, it is important that you save the System configuration data on the
disk with use of the 'Save' button of the Configure System screen. When you save the
configuration data, it saves the newly determined calibration constants on the disk drive so that
they will not be lost when you power down the computer or complete your use of the Visual
MDA Software.
If you see one (or a few) repeatable failures, you can suspect a module hardware failure. In
this case return the System to CheckSum for checkout or call CheckSum for help.
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Instruction Manual

The System module self-test confirms proper operation of the system module, calibrates
system speed, and measures gains and offsets for a variety of measurement methods and
ranges against on-board standards.
The second part of the system module performs a self-test of the multiplexer modules
functionally. This tests each test point to verify correct functioning, then it measures and
stores the zero offsets for each MPX test point, see Test Point (MPX) Module Self-test below.
The System Module screen also allows you to use a 'Probe Setup' button to provide additional
control over how the system performs probing. This screen is shown in the figure below.
With this screen you can alter the threshold at which the system will report a probed point.
The default, 10, works well in most applications. The scan delay tells the System how long
to wait between probed points. If your System is reporting a few false probed points, it may be
due to capacitance in the probed assembly. Changing the scan delay can help eliminate these
problems. Finally, you can alter whether the System scans all the test points in the System, or
just those that are set as active in the Enter/Edit Continuity Data screen. If you have a large
point-count System and are only using a subset of the points, you can speed up probing by
only probing the active points.
Configure Probe Screen
Test Point (MPX) Module Self-test

As part of the System Module self-test, the self-test of the system multiplexer modules
functionally tests each test point to verify correct functioning, then it measures and stores the
zero offsets for each MPX test point path to compensate for resistance internal to the MPX
Module and in the cabling from the System.
As part of the zero-offset calibration, the System asks you to short each group of 200 pins in
the System. To do so, install the two 200-pin shorting fixture plates (included with System) to
the top of a fixture on the 200-pin interface target blocks. The fixture target blocks are located
on the back of any test fixture. The shorting fixture plates should be positioned such that the
conductive side is up. The non-conductive side with the four concave areas in placed over a
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Instruction Manual
fixture target pin blocks. Position the plates so the target pins are up inside the concave areas
of each shorting fixture plate.
200-Pin Shorting Fixture Plate Note
The 200-pin shorting fixture plate is about 3 inches by 1.25 inches by 0.06
inches thick. The topside has a conductive metal layer and the bottom has
four concave areas that fit over the target pins on the fixture target blocks.
The optional Model CM- 3- KIT600 is a complete fixture system with builtin shorting fixture blocks and a calibration verification unit.
The Environment page is used to specify the configuration of reporting, directory structure,
and user accounts. The Environment Configuration screen is shown in the following figure.
Environment Configuration Screen
Topic details:
Configure Reporting on page 5-9
Configure Directories/Locations on page 5-16
Manage User Accounts on page 5-17
5-8
Instruction Manual
Configure Reporting
Configure Reporting
With the 'Configure Reporting' button of the Environment page, you can obtain the Configure
Reporting screen shown in the following figure. This screen is used to specify report formats,
SPC logging and automatic reporting for the System.
The Configure Reporting screen works like a standard Windows tab-oriented selection page.
Clicking the tab at the top of the screen, shows the setup items for the selection:
General below
SPC Logging on page 5-10
Automatic Test Results Report on page 5-11
Batch Report on page 5-12
Test Program on page 5-13
Test Results on page 5-14
Configure Reporting Screen - General
The following is a description of the items on each tab:

General tab:
Facility Name allows entry of a string of characters that is included in the test result
reports. For example, you can use this to list items such as your company name or testing
department.
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Configure Reporting
Instruction Manual
System ID allows entry of a string of characters that can be used to specify the name of
the tester that is used. This is typically used in companies that you have multiple test
stations. The contents of this string are included in the test result reports.
Page Headers/Footers allows you to turn on and off data that is included in the header of
each page in the System reports. The items that you can turn on and off include the report
type, the System ID, the date/time, and the page number. As default, these items are all
turned on.
Viewer allows you to specify what application is used to view reports. The default is
'WordPad', part of the Windows standard operating software.
Date Format allows you to specify the format used for reports.
SPC Logging tab:
Configure Reporting Screen - SPC Logging
Statistics Data Logged is used to turn on or off SPC logging and specify how much data
is saved from testing for SPC analysis. If the box is not checked, no test results data is
saved. If it is turned on (box is checked) 'Summary' information about the test such as
pass/fail status, test time, operator, serial number and so on is saved. No detailed test step
results are saved unless either the Pass or Fail Results box is checked.
Pass Results saves detailed information about the test steps that pass.
Fail Results saves detailed information about the test steps that fail.
Most installations that use SPC logging save Fail Results information. This allows you to
obtain Production Reports and Pareto Charts. When you are debugging test programs, it is
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Instruction Manual
Configure Reporting
normal to save Pass Results. This allows you to obtain X-Bar/Sigma reports for finetuning the test program.
Operator Name specifies whether the SPC data contains the operator name. The operator
name is taken from the login name.
Path allows you to specify which directory your statistics data files will be saved in. The
statistics data is saved in comma-delimited ASCII files. Each day, a new file is generated that
is named YYYYMMDD.DAT. For example, the SPC data file name generated on May 9,
2001 is named ' 20010509.DAT'.
Automatic Test Results Report tab:
Configure Reporting Screen - Automatic Test Results Report
Automatic Test Results Report can be turned on or off. This allows you to specify
reporting that happens automatically after testing. Report On allows you to specify 'all
assemblies' (always print a test report), or 'failed assemblies' (print a report if the assembly
fails). Most installations that use automatic reporting specify failure-only reports (see
Type). Send to allows you to direct the test report to one of several destinations. You can
choose a printer connected to one of the printer or COM ports, or to a file. If a file name is
specified, the file is appended with each new report. Type allows you to specify what the
test report contains. You can choose between failure data only or all test results. Most
installations choose to use reports that contain failure data only. Filename and Path
specify a file that will contain the test reports if the box is checked (enabled).
Automatic Batch Report can be turned on or off. If turned on, the System automatically
generates a batch report each time a new test program is loaded, or the operator returns to
the Main System screen.
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Configure Reporting
Instruction Manual
Send Automatic Batch Report to allows you to direct the batch report to one of several
destinations. You can choose a printer connected to one of the printer or COM ports, or to
a file. If a file name is specified, the file is appended with each new report.
Automatic Batch Report Data Path specifies a directory name that will contain the test
reports if you have specified 'Send Automatic Batch Report to a file.
Batch Report tab:
Configure Reporting Screen - Batch Report
Batch Report Header Special Line allows you to include a special string of text in the
batch report header. You may enter a line of up to 32 characters. If nothing is entered,
'None' is displayed and the reports do not contain this special line. If something is entered,
it is placed in the header of the report, left justified. If the line contains a colon, the
information before the colon (including the colon) is placed in the left column, and the
information after the colon is placed in the second column aligned with the other header
items. Special lines of text can be used for any special information that you would like
included in the batch report.
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Instruction Manual
Configure Reporting
Test Program tab:
Configure Reporting Screen - Test Program
Show Details on Test Program allows you to specify some of the attributes of the data
included in the body of the test program. With this selection, you can specify whether the
test program printout shows all of the individual details of the CONTinuity test, the ICs
test, and the Fixture Check tests. This detailed information is necessary if you want to
know all of the measurements that the system is making, but for listing brevity, you can
exclude this information.
Special Line allows you to include a special string of text in the test program report
header. You may enter a line of up to 32 characters. If nothing is entered, 'None' is
displayed and the reports do not contain this special line. If something is entered, it is
placed in the header of the report, left justified. If the line contains a colon, the
included in the reports.
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Configure Reporting
Instruction Manual
Test Results tab:
Configure Reporting Screen - Test Results
Report Format Width, Column Formats, and Max Lines allow you to customize the
reports to meet your requirements. Max Lines (per UUT) allow you to limit the total
report length. By limiting the maximum number of lines, you can prevent excessively
long reports that result from catastrophic failures, such as when the test is started without a
UUT present. For panelized assemblies, the MAX Lines limit is applied separately to each
PCB tested. A length of 0 allows for unlimited lines. If you are using a CheckSum Model
T-120-2, select the 40-column width setting. If you are using a standard 80-column
printer, select the 80-column width setting.
Column Format Modify selection displays a window to control the test and batch reports.
With this selection, you obtain the Configure 80/40 Column Formats Screen shown in the
following figure. In this screen, you can chose which items that you want to include in the
report, and the order in which they occur. To eliminate an item from the list, click on the
line, then press the 'Delete' button. To add a new field to the list, click on a field in the list
and press the 'Insert' key. You can then select the field to add. To change the order, click
on the item that you wish to reorder, then use the up and down arrow buttons to move it to
the desired position. The 'Default' button returns the screen to the factory defaults.
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Instruction Manual
Configure Reporting
Configure 80/40 Column Formats
Test Report Headers allows you to turn on and off data that is included in the header of
the test report. The items that you can turn on and off include dashed lines, test title, test
facility, assembly name, total failures, date/time, model ID, column headers, UUT serial
number, batch ID, system ID, and operator name (login name).
Test Report Headers Special Line allows you to include a special string of text in the test
report header. You may enter a line of up to 32 characters. If nothing is entered, 'None' is
displayed and the reports do not contain this special line. If something is entered, it is
placed in the header of the report, left justified. If the line contains a colon, the
included in the reports. For example, if you would like to have the operator initial each
test report, you could use the entry 'Operator Initials:__________'.
Get UUT Serial Number allows you to configure the system for serial number tracking of
UUTs. With this option, you can specify that the operator enters the serial number 'After
testing', 'Before testing', 'When Reported', or 'No' for no entry. At the point of execution
that you specify, the System displays a dialog box for entry of the serial number. It can be
typed in, or if you have a wedge-style bar-code scanner on your System, it can be barcoded in. Wedge-style bar-code scanners make the bar-coded data look just like operator
entry.
Get Batch ID allows you to configure the system for tracking batch numbers or
identifiers. With this option, you can specify that the operator enters the batch (or lot) ID
'After testing', 'Before testing', 'When Reported', or 'No' for no entry. At the point of
execution that you specify, the System displays a dialog box for entry of the Batch ID. It
can be typed in, or if you have a wedge-style bar-code scanner on your System, it can be
bar-coded in.
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Instruction Manual
With the 'Directories/Locations' button of the Environment page, you can obtain the screen
shown in the following figure.
Directories/Locations Configuration
The Directories/Locations Configuration screen allows you to set up the directory structure for
your System software. Some of these directory locations can be set up in other locations of the
software. Options include:
Test Programs specifies the test program directory.
Test Results Report specifies the location of test results reports that are written to a file.
Statistics Data specifies the location of saved SPC data.
Automatic Batch Report specifies the location of batch reports that are directed to a file
name.
CAD Data specifies the default directory used for CAD conversion.
RunT Programs specifies the directory for sub-programs (RunT test programs). The test
executive looks in the RunT test program directory first and if the test program is not
found, it then looks in the Test Program directory.
Temporary Files specifies the location where temporary files from the System are written.
These include files such as interim test results while a final test report is being collated.
Boundary Scan Driver specifies the location of the module specific driver software.
Boundary Scan Report Filter specifies the location of the module specific filter software.
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Instruction Manual

With the 'Manage User Accounts' button of the Environment page, you can enable user log-ins,
passwords, and permission of activities by user. This activity is managed with the Manage
User Accounts screen shown in the following figure.
Manage User Accounts Screen
From the Manage User Accounts Screen, you can add, delete, or edit user profiles. Each user
can be assigned a name, optional password, privileges, test program path, and ability to view
menu-items in the various System screens.
In the Manage User Accounts Screen, you can use the following buttons:
Add allows you to add a new user to the System. See Add User below.
Delete allows you to delete the selected user from the System.
Edit Profile allows you to modify the privileges, password, and menu-control of the
selected user.
Turn On Login allows you to enable or disable the log-in capabilities of the System. If,
for example, you have users set up in the System, but you choose to temporarily ignore the
log-in capabilities, you can do so with this button without deleting all the users.
Add User
Once you have elected to add a user, or modify a user profile, you are presented with the
Add/Edit User Screen shown in the following figure.
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Add User
Instruction Manual
Add/Edit User Screen
In the Add/Edit User screen, you can select from a number of options:
User Name is the name used for log-in.
Change User Password can be used to assign a secret password for each user. It is not
required that you enter a password, but most installations that limit privileges do. If you
assign a password, the user can not log in unless he enters the proper password. The
password can be up to twelve characters long and can contain any normal keyboard
characters. The System does not discriminate between upper and lower-case characters in
the password.
Run Privilege allows you to specify whether the user can run test programs.
Load Privilege allows you to specify whether the user can load a new test program.
Modify Privilege allows you to specify whether the user can edit (change) a test program.
Save Privilege allows you to specify whether the user can save a test program.
SPC Privilege allows you to specify whether the user can generate SPC reports.
Modify Configuration Privilege allows you to specify whether the user can access the
Configure System screen system.
Save Configuration Privilege allows you to specify whether the user can save the station
configuration data on the system disk.
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Instruction Manual
Add User
Save Configuration Privilege allows you to specify whether the user can save the station
configuration data on the system disk. Run Self-Test Configuration Privilege allows
you to specify whether the user can execute module self-tests.
User Administration Configuration Privilege allows you to specify whether the user can
access the 'Manage User Accounts' screens.
Test Program File Path allows you to specify a unique directory for each user's test
programs.
Pre Defined allows you to select user profiles for typical users. For example you can
specify typical operator and programmer templates. Once the template is loaded, you can
modify the capabilities as desired to meet your specific needs.
User Control Change Password allows you to specify whether the user can change his
own password from the log-in screen.
User Control Modify Menu Control allows you to specify whether the user can change
his own menu visibility from the log-in screen.
User Control Rename User allows you to specify whether the user can change his own
log-in name from the log-in screen.
Menu Control allows you to specify what menus and menu-items that the user can see.
The 'Menu Control' button allows you to obtain the Menu Control screen shown in the
following figure.
Menu Control Screen
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External Hardware
Instruction Manual
In the Menu Control screen, you can scroll through the various System menus and menu-items.
Some of the items can be expanded to show lower level menu items. When you have selected
an item, the status column shows the status of that item. If it is Fixed, the item cannot be
changed. If it is Visible, the item can be toggled to be Invisible. Once an item is invisible, not
only can the user not see it, he cannot select it. You can use the four pointing fingers to move
around in the display, or you can click on the items directly. Items that can be expanded are
shown as closed folders, end-items are shown as text documents.
The file menu on the menu control screen allows you to export and import your personal user
account settings. By transferring the exported file to another test system, you can import the
file there and configure another test system with the same user setup.
External Hardware
The External Hardware page is used to specify the configuration of the test results printer, the
footswitch, and the beeper. The External Hardware screen is shown in the following figure.
External Hardware Screen
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Instruction Manual
Test Screen Report Device allows you to select the printer that will be used for test and
batch reports. You can select from the console (your CRT), COM ports, parallel printer
ports, a file on the disk, or a specified viewer. Once you have selected the device, the area
below solicits additional information about the device. For example, in all cases the
System needs to know the report width (40 or 80 columns). If you are using a COM port,
the system needs to know the communication parameters. If you are using a CheckSum
Model T-120-2 serial printer, the correct settings are 40-columns, 9600 baud, 8 bits,
polling, no parity, and 1 stop bit. If you are reporting to a file, the System needs to know
the file name, and an optional path. When reporting to a file, the System appends the data
each time a new report is generated.
Footswitch Attached to allows you to configure a footswitch into your system. The
footswitch takes the place of most operations that would normally require an 'F1' input.
For testing assemblies, most of the time this is the normal response to continue. You can
elect to connect the footswitch to any of the LPT ports in the System, or 'None' if you do
not have a footswitch. If you would like to use a footswitch, order the CheckSum Model
T-120-3, or contact CheckSum to obtain a wiring diagram to wire your own footswitch.
Beeper on or off allows you to enable the System beeper which uses the speaker in the
controller. If enabled, the beeper alerts the operator in most cases when a key has been
pressed, a key press is necessary, or when a failure or error occurs. There are two normal
tones. One is for routine notification to the operator, and another when an error condition
occurs.
You can use the 'Print' button to printout the contents of this page for internal documentation
purposes.
You can use the 'Save' button on this screen to save the station configuration data for use the
next time the System software is started.
Auto-starting a Test
The Fixture page is used to specify what action the System will perform when the lever handle
is engaged (fully counter-clockwise). You can select the option such that when the lever
handle is engaged, the System will automatically start a Test (F1). It can also be setup to
perform a ReTest (F2). The ReTest option allows you to quickly open and close the lid to reseat the test probes and start a ReTest of the assembly. The ReTest will discard the previous
results and the test is started over. The Fixture screen is shown in the following figure.
You can use the 'Print' button to printout the contents of this page for internal documentation
purposes.
You can use the 'Save' button on this screen to save the station configuration data for use the
next time the System software is started.
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Fixture Screen
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Instruction Manual
Chapter 6
System Operation
Testing an Assembly
Overview
This topic describes how to use the Analyst mc System to test assemblies (called UUTs or
units-under-test).
Caution
The CheckSum Analyst mc System provides adequate protection against
normal input voltages at the test points. However, the System can be
subject to damage in environments of high electrostatic discharge (ESD). If
this is the case in your testing application, ensure that you wear a grounding
strap connected to the System earth ground, and that the UUT is adequately
discharged before connection. If it is not possible to take these precautions,
contact CheckSum to discuss alternative forms of ESD or overvoltage
protection.
Auto-start the Test
The standard setup for the System uses the handle to automatically start a test. When the
operator rotates the handle to the fully-closed position (front position and pushed firmly
down), the System automatically starts the next Test (F1). You can also configure the System
to perform a ReTest (F2) if the handle is opened and quickly closed after the end of a test.
This action reseats the spring probes on the board. This setup is configured in the "Fixture
Configuration" section of the "Configure System" setup window.
Test Topics
Main Screen, Test Menu on page 6-2
Selecting the Test Program on page 6-2
Executing the Test on page 6-3
Test Display on page 6-5
System Operation
Instruction Manual

To start the System, click on the Visual MDA shortcut on your desk-top, use Windows
Explorer, or use the run command to execute the System software (vismdamc.exe).
You will then see the System screen shown in the following figure.
Run Test (F1) begins execution of a test program to test a UUT. You are first asked if
you would like to load a new test program or execute the one currently loaded. Once this
is completed, test execution will start.
Test Screen transfers control to the Test Window. From this window you can start a test
of your assemblies. See Test Display on page 6-5.
Enter UUT Serial Number (F7) allows the serial number for an assembly to be entered
prior to starting a test. This can be used to verify the serial number to insure it is valid.
Multi-Function Input Measurement (F5) allows you to make quick measurements using
the front panel test inputs or the test points in a fixture.
Selecting the Test Program

File Selection Screen
To test an assembly, select 'Test' from the System screen. See Main Screen, Test Menu above.
This displays the Open File screen shown in the following figure.
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Instruction Manual
System Operation
Executing the Test
Open File
The file selection menu allows you to select and load (open) a test program. If you press OK,
it will load the test program shown in the box in the upper left corner, then begin execution.
You may either type a name in this box, or select the path and file name from the other boxes
shown on the screen.
Below the file name box is a list of the file names present in the current working directory.
You can double-click on one of these file names to load it and begin execution. If you wish to
change the directory, click on the selected directories in the box on the right part of the screen.
If you wish to change the drive, select it from the Drive selection in the lower right corner. At
the bottom of the dialog box, the function keys and their actions are shown.
Note that the names shown in the list of files may not be test programs. The system uses the
convention that it lists names less than eight characters without an extension, or names eight
characters long with any extension.
If an assembly has been learned but not saved on disk, it is valid to continue with the test even
though no file name is present, i.e., '(none).' If an assembly has not been learned, or a test
program has not been loaded into memory, the System will not allow you to continue.
Executing the Test

Once the test program is loaded, execution begins. In the default configuration, the system
halts after each failure. You can configure the system to continue to the end of the test without
halting if you wish by disabling 'Halt on Fail' in the 'Test' menu. The 'Halt on Fail' setup is
saved with the test program.
If 'Halt on Fail' is enabled, you are presented with the 'Component Test Failure' screen shown
in the following figure. The same window pops up for each test step when 'Single Step' is
enabled or when testing is halted.
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System Operation
Executing the Test
Instruction Manual
If an MFI test step fails, an MFI window appears and the operator is given time to position test
leads to make a measurement. If the measurement continues to fail, the operator can press the
F4 or Enter key to continue the test.

The 'Component Test Failure' Screen is displayed when a tests step halts due to a failure. It
can also be displayed after each test step if the system is in 'single step' mode. It is shown in
the following figure.
In the Component Test Failure Screen, there are several different items describing the failure:
The name of the component that has failed is shown in yellow. This is taken from the title
field of the test program.
The From Pin and To Pin are shown on each side of the component name. These are the
UUT points that are being measured at the time of the failure.
On the right side of the display, the system displays the high limit and the low limit. A
passing test is between these two values.
The Measured value is positioned in different locations, depending on the measured

value. If the test has passed, it is between the high and low limits. If the test failed with a
value that is too high, the measured value is above the high limit. If the test failed with a
value that is too low, the measured value is shown below the low limit.
Test Failure Function Buttons

In the Component Test Failure Screen, there are several different options that the operator can
choose by pressing the buttons at the bottom of the display:
Stop terminates execution of the test program. It takes you directly to the 'Test Screen'
window, see the Test Display on page 6-5.
Next logs the test result presently being displayed, and moves to the next test step for
execution. It is the way for continuing normal execution of the test program.
ReTest takes the measurement over again. The new result is then displayed. This can be
used, for example, if you suspect a fixture contact problem. You can cycle the fixture
switch up/down, then perform a retest to see if the problem is corrected.
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Instruction Manual
System Operation
Test Display
Continuous Test is used to make measurements continuously and display the results. In
this mode, the system works much like a bench-top meter, in that the readings are
continually refreshed. The Continuous Test button works like a toggle. Press it once to
start continuous measurements, then press it again to stop them.
ReTest All takes the entire measurement again for test types such as CONT and ICs. This
takes more time than ReTest since ReTest tests only the failed measurements.
Help is used to find information about the test system and its use.
Other: While the failure window is displayed, Ctrl-H allows the Halt on Fail setting for
this test run to be toggled. Ctrl-S allows the Single Step setting for this test run to be
toggled.
Test Display
After each test, you are presented with the 'Test' display shown in the following figure. From
this display, the most common operations are to invoke a retest of the present assembly, test
the next assembly, or print a test report for the assembly that has just been tested.
Test Display
At the top of the window, there is information about the test that has just been completed. The
screen format can be modified with the environment pull-down, but the default values are in
the Environment Menu on page 6-10.
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System Operation
Test Display
Instruction Manual
At the top of the display, the test time (in seconds) is shown, along with the total number of
step failures. Towards the top right of the display, a test status box tells whether the test was
completed or terminated. In the middle of the display, a large box (with buttons) is displayed
in red or green, depending on whether the test passed or failed. The display shows 'PASS' or
'FAIL' in the middle.
A status graph, just below the test time, shows a linear status of the test program. Portions of
the test program that passed are shown in green, and portions that pass are shown in red. This
can be used at test time so the operator can watch the status of program execution. Note that
test programs can be written that do not proceed through the test steps linearly. In this case,
the bar will not be filled out from left to right in a smooth manner (portions that are not green
or red were skipped).
Main Test Functions

There are several major buttons for the operator to press:
Test (F1) begins execution of the program for the next UUT. Prior to pressing this button,
load the next UUT on the fixture. After the test button has been pressed, the System logs
and/or prints results (depending on how the system has been configured) for the assembly
that has just been tested, then begins a test of the assembly.
ReTest (F2) runs the test again on the assembly that has just been tested. This is similar to
the 'Test' button, but results are not logged or printed for the UUT that has just been tested.
Report (F3) is used to print a test report for the UUT that has just been tested. It is printed
in the format and to the device specified in the configuration section (Configure System >
Environment > Configure Reporting) of the Visual MDA software.
Exit (ESC) is used to terminate testing. After selecting EXIT, you will return to the 'Main
System' or Edit screen. Exit is normally used when you are changing from one type of
UUT to another UUT (although you can do so from this screen with the 'File' pull-down),
or if you have completed a batch of UUTs, and wish to start another.
Stop Test, the STOP sign button in the upper right corner of the test screen window can be
used to stop the test program.
Menu Bar
At the top of the 'Test' display, there are several pull-down menus for performing various
functions. These are:
File Menu on page 6-7
Test Menu on page 6-8
Report Menu on page 6-9
Environment Menu on page 6-10
Panel Menu on page 6-13
Fixture-Check Menu on page 6-14
Help Menu on page 6-15
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Instruction Manual
System Operation
Test File Menu
Test File Menu
Test Screen - File Menu
Open loads a new test program from disk into memory so that it is available for execution.
Save saves the test program now in memory to a disk file.
Save As allows the program file name and location to be changed before the save
operation.
Edit returns to the test program editor.
Examine SPC Data by UUT Serial Number is used to review and edit the test results of
a particular UUT that has been tested with the System. SPC logging and serial number
logging must both be enabled in order for this option to be usable.
Exit exits to the 'Main System' window.
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System Operation
Test Menu
Instruction Manual
Test Menu
Test Screen - Test Menu
Test Assembly begins execution of the test program to test a UUT. Prior to selecting this,
put the next UUT to be tested onto the test fixture.
ReTest Assembly begins execution of the test program to test a UUT. This is used to retest the UUT that you have just completed. This selection is similar to 'Test Assembly',
but does not log any data for the test that has just been completed.
Stop Test will stop the test program. The STOP sign button in the upper right corner of
the test screen window can also be used to stop the test program.
Failures Only ReTest is similar to ReTest Assembly, but it only executes test steps that
have previously failed and it re-runs these test steps until either there were no failures on a
run or the number of runs specified by the Environment > Max Failure Only ReTests is
met. This selection can be used to quickly detect whether you have repaired a UUT. Note,
however, that if the repair has caused a fault to a step that previously passed, you may not
detect it.
Single Step can place the System into the mode in which it halts after each test step
(whether passing or failing) and presenting the 'Component Test Failure' screen. This
mode can be used for debugging a test program.
Halt on Fail will place the System into the mode in which it halts after each failed test
step and displays the 'Component Test Failure' window. If 'Halt on Fail' is not selected,
the test will completely execute before stopping at the 'Test' window. The 'Halt on Fail'
mode is often used to allow the operator the opportunity to repeat a test or make simple
repairs during the test.
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Instruction Manual
System Operation
Report Menu
Report Menu
Test Screen - Report Menu
Test Report prints a test report on the UUT test that has just been completed to the device
selected in the 'Environment' pull-down. The contents of the test report (whether it shows
just failures or passes and failures) can be changed in the 'Environment' pull-down. Most
facilities elect to print reports on failed UUTs, with the report only containing the failures.
The System can be configured to automatically output reports in the configuration section
of the Software.
Batch Report prints a report that describes the batch of UUTs that have been tested. This
report contains the total number of assemblies tested, how many have failed, and the
resultant yield. Each time you exit the Test Display, or load a new test program, the batch
counters are reset.
Enter UUT Serial Number allows you to enter the serial number of the UUT that you
have just completed, or are about to test. This information is included in the SPC logging
file (if enabled) and in the UUT test report. You may type in the UUT serial number, or if
you have a wedge-style bar-code reader, you may read it from a bar-code label on the
UUT. With the configuration section of the Visual MDA software, you can enable the
System to automatically solicit the UUT Serial Number from the operator.
Enter Batch ID allows you to enter a name describing the batch of UUTs that you are
currently testing. This is used in the batch report and the SPC log (if enabled). With the
configuration section of the Visual MDA software, you can enable the System to
automatically solicit the Batch ID from the operator.
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System Operation
Environment Menu
Instruction Manual
Environment Menu
Test Screen - Environment Menu
The environment menu is used to alter the configuration of the testing environment. Following
is a description of each of the options available to you from this menu:
Show Pass/Fail changes the appearance of the testing screen at the end of the each test. In
the default mode (Show Pass/Fail enabled), the system presents a large bar in the middle of
the screen. The color of this bar changes to green if the test has passed, or red if the test
has failed. In the middle, large text says pass or fail, which is surrounded by buttons for
test, retest, report, and exit. If Show Pass/Fail is turned off, this display does not appear,
and a tool bar is present at the top of the screen. This tool bar offers the same functions as
the larger buttons, but in a more compact format. Also, if Show Pass/Fail is turned off, the
operator can see the last messages of test program execution in the user display. This may
be confusing to the operator if they are messages that are inadvertently left over, but the
test program can be written to leave messages that are useful to the operator at the end of
the test, such as repair information about the UUT.
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Instruction Manual
System Operation
Environment Menu
Show Pareto of Batch Errors allows you to enable display of a Pareto chart at the bottom
of the screen after each test. The Pareto chart shows the errors during testing, sorted in
order of frequency. The errors refer to the batch of UUTs that are being tested rather than
the last UUT tested. To reset the statistics, you can either exit from this screen and reenter, or reload another test program. The Pareto chart is useful because it alerts you about
potential systematic errors that you would like to detect as soon as possible. For example,
if a pick-and-place machine has an incorrect reel loaded for one of the parts, you will see
that the error frequency for that part will be high. In the chart, the top shows how many
defects have occurred during the batch. Each line, then shows the failed part (taken from
the title of the test step), then a percentage that shows what percentage of all failures in the
batch can be attributed to this particular failure. At the bottom of the display the number
of assemblies tested and the percentage of failed assemblies is shown.
Show Pareto for execution times shows the amount of time taken for the slowest test steps
of the program. This can be used if you would like to optimize overall test speed of the
program by fine-tuning or deleting some of the test steps.
Show Test Progress allows you to enable or disable displays to the operator that show
program execution progress. There are two ways to monitor progress, either of which can
be enabled individually. 'Show Test Progress Step Number' enables display of the step
number that is presently being executed, or at which you have paused. The step number is
the line in the program, which matches the step number displayed in the upper left corner
of the edit screen. 'Show Test Progress Progress Gauge' enables a bar graph in the upper
left corner of the display. The bar graph fills up as the test executes. Portions of the test
program that pass are shown as a green bar, and those that fail as a red bar. In most cases
the bar will fill up from left to right, however if the test program has control conditionals
such as jumps and calls, the bar may fill in a random order, and some areas may be void.
The progress gauge is a convenient way for the operator to observe test execution progress
and easily observe the approximate proportion of failed steps in the program thus far.
Test Report Contents allows you to specify which test steps are included in the test
report. You can select between reporting on all steps that have been executed or just
reporting on steps that have failed. In most installations, reporting only the failed steps is
the most practical since reports are shorter and only contain information that is needed for
repair purposes.
Report Device allows you to select the device that test reports will be sent. In the default
mode, they are sent to the display (CRT). With this selection you can select to send the
reports to printer devices, or to a file on the system disk. Note that this only specifies the
device, but does not output the report. In order to output the report, you must select
'Report' separately. This option applies to batch reports and test reports, but not other
reports, such as test program listings that can be output with the system. If CRT is
selected, when the Report is selected (F3 or F5), a window is displayed that you can page
down, page up, and go to the top of the report. If 'Viewer' is selected, the reports are
displayed in Windows WordPad (or a viewer you have specified in the configuration
setup). With WordPad you can scroll, and even print the report.
SPC Logging allows you to enable logging of testing outcome to a file on the system disk.
This is used if you want to use the SPC features of the test system. There are different
levels of logging available:
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System Operation
Environment Menu
Instruction Manual
Summary only records information about the overall test, for example pass or fail,
number of errors, operator, UUT serial number, batch name, elapsed time, and start
time. This logging is compact and records all of the information that is used for
production reports.
Summary+Fails also records the details of steps in the test that have failed. If you
record this data, it is used for SPC Pareto reporting.
Summary+Passes+Fails also records the details of steps in the test that have passed.
If you record this data, it is used for SPC X-Bar/Sigma reporting.
Max Errors sets how many failures can occur on a UUT before the test is terminated. In
the default mode, 10000, the test always completes regardless of the number of errors,
unless the operator manually terminates the test. If a lower number is set, and the test
exceeds that number of failures, the system stops the test and exits to the Test Display.
Note that the actual number of errors may exceed the limit in some cases. For example,
the error count may be exceeded in the middle of a CONTinuity test which may have
additional errors occur before the check is completed. Use of limited Max errors can
speed test flow.
Max Failure Only ReTests is used when retesting an assembly. When 'Failures Only
ReTest' is selected (in the Test menu), the system, as default, will continually loop through
the test program, but only test those test steps that have failed on the last complete test.
Also executed are steps that do not produce a pass/fail result such as conditional jump and
display test types. If you would like to limit the amount of times that each step is retested,
you can enter a number in this menu-item that specifies the maximum count. Note that
there is an inherent risk in using failure-only retest. If you make a repair that fixes an
earlier failure, but causes a new failure, the new failure may not be detected. An entry of 0
allows unlimited retries.
Measurement Messages allows you control how warning and error messages affect test
execution. If enabled (checked) then the system will display and wait for the operator to
acknowledge the warning or error message before proceeding. If disabled (not checked)
then the system will only beep when these conditions occur and the system will
automatically continue to the next test step.
Check UUT Serial Number allows you to either warn the operator or prevent testing if
the UUT Serial Number is not appropriate. The UUT Serial Number can be tested for the
correct length, and for panelized assemblies, a duplicate entry.
Login User allows you to enter a user (operator) name into the System. If the system is
configured with login names turned on, a user must be logged in at all times. Optionally, a
password may be required for each user. The system can be configured so that different
users have different access privileges and may see different menu options. Login
privileges are defined in the 'Configure System' section of the software that can be
accessed from the main screen.
Return to Viewer F6 allows you to transfer control (window focus) to the CheckSum
Board Viewer. The Board Viewer software displays a photographic image of the
assembly, the schematic and the test fixture probe map for the assembly. A major benefit
of using the Board Viewer is locating components that failed board test. In addition, using
stored failure data, failed components can be located at a repair station long after the board
was tested (post test failure analysis). If you need to find a faulty spring probe, the probe
map shows the location. For additional information about the Board Viewer software
contact CheckSum on page 1-2.
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Instruction Manual
System Operation
Panel Menu
Viewer Settings is used to control the interaction of the CheckSum Visual MDA and
CheckSum Board Viewer software. From additional information about the Board Viewer
software contact CheckSum. See Edit > Setup menu on page 8-18.
Panel Menu
Test Screen - Panel Menu
The Panel menu is active and available when you are testing a panelized assembly. It provides
you with several functions that can ease testing of UUTs that are not separated prior to test.
Select Skips allows you to skip over some of the PCBs in the panel. You may wish to do
so because some may not be populated or some of the PCBs may have already been
rejected. To eliminate a PCB in the panel, move to it with the four arrow keys, then press
the SKIP button. An S will then appear in the selected PCB location. By pressing SKIP
again, it will be deselected. You can press OK to continue on to the test, or select other
PCBs for skipping in the same manner.
Retain Skip Selections provides the capability for the system to remember the last settings
for 'Select Skips'. This can be used, for example, to eliminate re-entry of the skipped
selection if you have a run of boards with the same configuration.
Status Map instructs the System to display a graphic of the panelized assembly. Each of
the PCBs in the panel are displayed, along with the last test status of passed, failed, or
skipped.
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System Operation
Fixture-Check Menu
Instruction Manual
Reports sorted by PCB can be used to change the order of the test results listing. In the
default mode, the system sorts the test report so that each PCB is reported on in order by
PCB. If reports sorted by PCB is turned off, the system reports in the order of the test
program steps. In most cases, test programs are written in a linear fashion so either
selection will work the same.
Max Errors per PCB selection causes the Environment > Max Errors limit to be applied
to individual PCBs rather than to the total errors of the UUT.
Fixture-Check Menu
Test Screen - Fixture-Check Menu
The Fixture-Check menu is active and available when you are testing an assembly that has
been programmed with fixture-check on page 8-18. Fixture check can be used to help
determine if you are having contact problems with the test fixture. For each probe in the
fixture, a single measurement is made to all other probes in the fixture, which are electrically
connected together. In most cases, there is some impedance to all probes. Fixture-check
compares the measurement for each pin to that of the test program. If the value is higher than
the test threshold, an error is generated so that you can inspect the pins that may be at fault. In
some cases, fixture-check test results can help identify faulty nodes on a UUT.
Test invokes the fixture-check function and tells you if there are any suspected connection
faults by point number.
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Instruction Manual
System Operation
Help Menu
The Help menu can be used to obtain on-line help about the Analyst mc System.
Contents... allows you to search the table of contents for the help sections.
Topic Search... allows you to search the help data based on a topic that you enter.
Getting Started... helps you learn how to use the test system hardware and software.
About... shows information about the software that you are using. It provides the revision
number, a number to call at CheckSum if you would like to talk to an engineer, and the
most recent date that the System self-test has been run.
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System Operation
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Instruction Manual
Chapter 7
Statistical Analysis of Test
Results
Overview
The following figure shows how to display the Statistical Analysis functions from the main
window.
Statistical Analysis Menu
Statistical Analysis of Test Results

Instruction Manual
Generate SPC Report allows you to generate reports based on the assemblies you have
tested. These reports include X-Bar/Sigma Reports (statistics about individual analog
measurements), yield Production Reports (statistics about how many assemblies have
passed and failed), and Pareto Failure Reports (information about the frequency of failures
by failure type).
Examine SPC Data by UUT Serial Number allows you to enter the serial number of
assemblies that have been tested, and recover the history of testing that UUT.
The Generate SPC Report window, shown in the following figure, is used to obtain reports
from the System that can be used to analyze productivity, find process problems and determine
which are the most significant, and to analyze testing tolerances. Sample Reports on page 111 shows examples of the various reports that you can generate using this capability.
Generate SPC Report
Report Types
There are three basic types of reports.
The Production Report displays how many assemblies are tested during the reporting
period, and the results of the testing, for example, how many passed and how many failed.
The Pareto Failure Report displays information about the defects that are occurring,
sorted by frequency so that you can easily find out the relative occurrence of faults so that
you can address the most significant ones first.
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Instruction Manual

The X-Bar/Sigma Report displays information about specific analog readings, such as
measurement averages, closeness to limits, and dispersion. The primary use for this report
is to help assign tolerances and limits within the test program, although it can also be used
to analyze process trends.
Related Topics
Using Statistical Process Control below
Examine SPC Data on page 7-12
Edit Run Failures on page 7-14
Reporting on Panelized PCBs on page 7-15
SPC Data Format on page 7-15

Activating Statistical Analysis
To activate statistical analysis, you must enable logging for the dates of the reporting period.
Logging is enabled from the Configure System screen, 'Environment' page, 'Configure
Reporting', tab marked 'SPC Logging', check the Statistics Data Logged box as shown in the
following figure.
Production Reports only require that logging of summary information is enabled.
Pareto Reports require that logging of failure information is enabled.
X-Bar/Sigma Reports require that logging of pass information is enabled.
Logging of more data than is minimally required for each report does not create any problems,
other than the use of more disk space and the time to write the data between tests.
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Instruction Manual
Configure SPC Reporting
SPC reporting is performed by selecting from the following options in the Generate SPC
Report screen:
UUT Reported On below
Change Starting/Ending Period below
Statistics Data Path on page 7-5
Production Report on page 7-6
Pareto Failure Report on page 7-7
X-Bar/Sigma Report on page 7-9
UUT Reported On
This selects which UUT to report on. The default, All, reports on all UUTs that have been
tested in the selected time frame. If a 'Selected UUT' is specified, only UUTs tested with that
test program are analyzed. It is necessary to select a single UUT with X-Bar/Sigma Reports,
but either option is applicable to Production Reports and Pareto Failure Reports.
After selection of selected UUTs, you can use the entry box to select the particular UUTs (by
test program name) to analyze.

The 'Change Starting Period' and 'Change Ending Period' selections of the Generate SPC
Report screen allow you to specify the time frame which the report encompasses. The default
when you first enter the Generate SPC Report screen is for the entire present day. You can
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Instruction Manual

enter any range of dates and times to allow analysis of a single shift or analysis over a long
period of time.
To change a date/time:
1. Select the button for Starting Period or Ending Period.
2. Use the Change Starting/Ending Period screen shown in the following figure to set the
date and time.

Other methods:
select entries in the date box or type in new values
click on a date on the calendar
use the arrow buttons to change the month
use the AM/PM buttons, or click on the hands of the clock and drag them to a new position
Statistics Data Path

Allows you to specify the directory that contains the log files for the System. For your
interest, the log files are named YYYYMMDD.DAT. For example, SPC data stored on May 9,
2001 is saved in the file named '20010509.DAT'. When you elect to change the statistics data
path, you use the Directories Configuration screen shown in the following figure. In this
screen, use the middle entry to specify where to store the raw SPC data files.
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Instruction Manual
Directories Configuration
Production Report
Allows you to review and print a Production Report as shown in Sample Reports on page 11-1
and shown in the figures below. The Production Report lists
how many UUTs have been tested
how many passed
how many failed
the yield
the total number of defects encountered.
If you are reporting on all UUTs and more than one has been tested, the Production Report also
shows the production information (total, passed, failed, yield, defects) listed by UUT type.
The list includes the PCB number of any panelized test failures when PCBs are counted as
separate UUTs.
Once you are displaying the Production Report, you can print it with the 'Print' button. As an
option prior to printing, you can also elect to save the report to a file on the disk. The format
of this ASCII file is shown in Sample Reports on page 11-1.
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Instruction Manual

Production Report Details
Production Report Header
Pareto Failure Report

Selection of the Generate SPC Reports window allows you to review and print a Pareto Failure
Report as shown in the following figures and Sample Reports on page 11-1. The Pareto
Failure Report is used to analyze the failures that have occurred over the testing period. This
allows you to find which failures have occurred most frequently so that you can best spend
your time correcting the necessary aspects of the process. Logging of failure data must be
enabled during the reporting period to obtain Pareto Reports.
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Instruction Manual
The Pareto Failure Report lists the total number of defects, then each defect in descending
order by frequency. The defect descriptions include:
the test program name
the calling test program if the test program is called from another test program
which step number has failed
what test type (e.g., CONT or RES)
the test title (e.g., R203), how many failures have occurred
the percentage of the total number of defects that have occurred over the reporting period.
Note that CONTinuity tests are sorted into two general groups, Shorts and Opens. For a more
explicit description of the individual continuity failures, you can access the log data directly.
Pareto Failure Report Details
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Pareto Failure Report Header
X-Bar/Sigma Report
Selection of the Generate SPC Reports window allows you to review and print an XBar/Sigma Report. The X-Bar/Sigma Report button displays an X-Bar/Sigma Report as shown
in the following figures and Sample Reports on page 11-1. The X-Bar/Sigma Report is used to
identify trends of analog measurements to tell if a process (or component value) is tending to
be near one of the test limits. It can also be useful when determining test tolerances to use for
a UUT.
If you print the detail report directly to a printer, the graphic images for each step are printed.
If you print the detail report to a file, the report is converted to a character-oriented version of
the information.
The X-Bar/Sigma Report contains an entry for each analog test (e.g., RESistors, CAPacitors)
that has been logged during the reporting period for the UUT selected. Each step is described
as a bar with a pointer and a bell-shaped curve.
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X-Bar/Sigma Report Details
X-Bar/Sigma Report Header
Interpreting the Graphs

The length of the horizontal bar approximates the distance from the low test limit to the high
test limit. Below the ends of the bar, the test's low limit (LL) and high limit (HL) are shown.
Red tick marks near the end of the bar locate the precise high and low limit positions.
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The bell-shaped graphic above the bar is the statistically predicted range and frequency of test
measurements as based on the logged data. The peak (center) of the curve is the average (Xbar) reading, which is also listed in the title. The area contained under the bell-curve for a
certain range of readings, as a percentage of the total area under the bell curve, tells you what
percentage of readings will fall into that range. Above the bar, in the center, the System lists
the step number, the step type, and the X-Bar (average) computed value. Areas under the bell
curve that are within the test limits are shaded in green. Areas outside the test limit are shaded
red. Note that in cases such as "less than" or "greater than" tests, you may see a red area under
the curve that is of no consequence.
Below the bar, the System lists the Standard Deviation (Sigma) of the readings recorded during
the logging period. This tells how randomly or widely spread the individual readings are. This
data is used to generate the bell-shaped curve.
The end of each bell curve represents approximately the 3-Sigma limit. The 3-Sigma limit
(computed by multiplying the Standard Deviation by 3 and adding/subtracting from the X-Bar
reading) shows how far readings can be expected to vary based on the sample set of readings.
If the number of UUTs logged is fairly large, the 3-Sigma limits show the test limits that
virtually all typical UUTs would pass.
The computed values for Cp and CpK are also shown above the bar. The Cp value is on the
upper left and the CpK value is on the upper right. Cp is an indication of how widely spread
the readings are with respect to the high and low test limits. Cp should normally be well above
one. If it becomes less than one, normal deviations in the readings will cause out-of-tolerance
conditions. This is an indication that the limits are too close for this measurement.
CpK indicates whether the average readings are getting too close to one of the test limits.
Where Cp shows the range of variations with respect to the size of the tolerance window, CpK
shows if the variations are not centered in the tolerance window. If the high and low limits are
symmetrical with regards to X-Bar, Cp and CpK will be equal. CpK becoming less than one is
an indication that the average readings value are becoming so close to the high or low test limit
that some good readings will start to fail.
The X-Bar/Sigma Report can be useful for adjusting tolerance values when first programming
a new UUT. You can initially set the test limits fairly widely, then test a batch or two of
UUTs. From the X-Bar/Sigma Report you can then determine the typical measured values (XBar) and the typical range of readings (the 3-Sigma value or edges of the bell curve). The 3Sigma limits can be useful guides for setting the limits. For consistent testing results, bell
curve should be well within the high and low test limits for the test step.
Note
Limits set by using the 3-Sigma indication can be tighter than the accuracy
of the System. Before tightening measurement tolerances from the entry
defaults, ensure that you are not exceeding System specifications.
Note that the X-Bar/Sigma Report bases its calculations on passed UUT measurements and
ignores failed measurements. This is because ATE failures are typically catastrophic in nature
(for example, if a component is missing or shorted) and hence would skew the outcome
excessively. As a result, when you are using the X-Bar/Sigma Report for assigning test
tolerances, you should first assign quite wide tolerances to ensure that virtually all good UUTs
pass.
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Examine SPC Data
Instruction Manual
System logging for passed data must have been enabled for the UUT during the period which
the data is generated.
A UUT must be selected for X-Bar/Sigma Reporting ('All' UUTs is not valid). The XBar/Sigma Report will try to find the test program for the selected UUT in the Test Program
directory. If the test program for the selected UUT is found, the low and high limits specified
in the test program will be used for the analysis. If the test program for the selected UUT is
not found, the low and high limits in the logged data file will be used for the analysis.
At the bottom of the X-Bar/Sigma Report screen you can choose to display all test step entries
or just those beyond a specified CpK. The CpK default, three, displays readings that are more
than 1/3 of the expected measurement range from the average reading to the test limit. By
displaying only entries with low CpKs, you can quickly determine which test steps are likely
to need attention. You can modify this limit value with the Modify button.
Set Limits Button allow you to change the limits of the corresponding step and view how this
changes the graph. Note that there is no change in the set of sampled data. To get a new set of
sampled data that reflects the new limits, we need to analyze the logged data again using the
new limits. To do this, use the ReAnalyze button in the X-Bar/Sigma Report Screen. (it may
take a while depending on the size of the logged data). Fit All Limits Button automatically
fits all entries that have CpK less than 3.0 to fit into CpK = 3.0.
Note
For some test types (e.g. Res), we do not allow a limit value less than 0.
Hence, Fit All Limits does not guarantee that all entries will have CpK
value at least 3.0.
Examine SPC Data

This screen and its submenus allow you to view summaries of a UUT test by UUT serial
number. You can also modify SPC file contents by deleting an entire test on a UUT, by
deleting single test steps, by assigning failure codes to test steps or by adding failure codes to a
test run. The failure codes can contain diagnostic information about the cause of run failures.
After a UUT is repaired, these can be used to enter the actual failure that occurred. Access to
these screens requires password privileges both to modify SPC files and to run SPC analysis
when password protection is in use.
To obtain the Examine SPC Data Screen, select 'Examine SPC Data by UUT Serial Number'
from the 'Statistical Analysis' pull-down menu in the System screen.
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Examine SPC Data
Examine SPC Data
UUT Serial Number allows you to specify the UUT serial number used for searching the
SPC database. For data recorded without a serial number the string recorded in the log is
<No_UUT_ID>.
Change Starting Period specifies the beginning date and time of the search. The
resultant entry screen is exactly like that in , with its associated description of use.
Change Ending Period specifies the beginning date and time of the search. The resultant
entry screen is exactly like that in Change Starting/Ending Period on page 7-4, with it
associated description of use.
Search executes a search for tests done on the specified UUT in the interval specified by
the starting period and ending period. The search results are summarized by the total test
runs, total failed runs and total failures counts. A summary for the first run, if found, is
displayed in the right side of the 'Test Runs' box.
Choosing the Run By typing in a 'Run Number', or using the adjacent up and down
arrows, you can select a specific test of a UUT. This is only applicable if the UUT has
been tested more than once during the selected reporting period. If a run is displayed, its
summary includes its pass/fail status, test date and time, its failure count, the test system
ID, the operator ID, and the name of the test program used to test it.
Edit allows you to examine and modify failing test steps by bringing up the Edit Run
Failures screen shown in Edit Run Failures on page 7-14.
Save allows you to save any changes made to the current search results.
Exit allows you to leave the Examine SPC Data screen.
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Edit Run Failures
Instruction Manual
Edit Run Failures

This screen displays up to 10 existing failed test steps and allows you to delete or modify these
steps. It shows the measured value, step number and component description for displayed
steps. You can also add additional failure codes to the failed run.
Edit Run Failures
Clicking on a Step allows you to select one of any of the failed test steps displayed. For
summary-only recording of failed runs, no failing steps are found in the SPC log.
[F1]-[F7] allows you to replace the measured value of the selected step failure with a
failure type. This allows you to replace existing failure steps with a failure type. A failure
type is selected by pressing one of the [F1] through [F7] buttons. You can select 'Undo' to
clear the step entry from being replaced by a failure type. A step component description is
modified when the edit results are saved only if the step is also replaced with a fail code.
[F1] assigns a "Missing" failure code to the test step.
[F2] assigns a "Wrong" failure code to the test step.
[F3] assigns a "Backwards" failure code to the test step.
[F4] assigns a "Short" failure code to the test step.
[F5] assigns an "Open" failure code to the test step.
[F6] assigns a "Faulty" failure code to the test step.
[F7] assigns an "Other" failure code to the test step.
Undo restores the current step to its initial value.
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Delete allows you to delete a step failure or undelete a failure selected for deletion.
Deletions are not final until the edit changes are saved, but are marked on the screen so
you know what will be deleted after you exit. Pressing delete again toggles the step to not
be deleted.
Add Failures allows you to add an additional SPC step to the log. This step allows the
same [F1] through [F7] choices to enter the failure reason.
Exit allows you to return to the Examine SPC Data screen.
If you modify a step (Change Failure Code or Delete), you will see an indication that the data
has been modified.

Panelization adds additional information to the test results log file. The Panel number and
method of counting PCBs for statistical analysis are recorded in test log for each test
execution. Test Steps for PCB 0 are not recorded in the test log for panelized tests and thus
aren't available in X-Bar/Sigma Reporting.
Individual PCBs on a panel may either be counted as duplicates of a single UUT, as parts of
one-panel UUT, or each as a separate unique UUT. Test steps with the same test title and test
limits on a panelized board with PCBs counted as duplicates are grouped together for XBar/Sigma analysis. If all panels analyzed have the same number of PCBs per panel or the
same method for counting results from each PCB, then the corresponding value is displayed in
the report header.
For Pareto reports, the PCB number is included in the description if the PCBs are not counted
as duplicates of one UUT and summary record information is in the results log. When PCBs
are counted as duplicates on a panel then neither the step number or PCB number of the test
are displayed. Failing steps with the same test title are lumped together for error counting if
they are not part of a panelized test counting PCBs separately or if they are in the same PCB
block number.
SPC Data Format

In the case of passed or failed logged data, the outcomes of analog tests (e.g., RES, CAP,...)
are logged. Since the amount of data being generated can get large, it is recommended that
passed data only be logged if you are planning to obtain an X-Bar/Sigma Report or are testing
a relatively small number of UUTs.
The results are stored in a format that can be read and processed by a spreadsheet such as
Lotus 1-2-3 or Microsoft Excel. The data is ready to be read in as numeric data for failure
analysis. For example, in Lotus, the sequence '/fin' can be used to import the data. Since the
data is stored in ASCII, you can also edit it with most standard editors and word processors.
A new file is created each calendar day. The name of the file is `YYYYMMDD.DAT' where
YYYY is the year, MM is the month, and DD is the day of the month. For example, on May
9, 2001 the file is named '20010509.DAT'.
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Instruction Manual
Each entry contains the following information:

1. The test program name.
2. The time of day that the test was completed. Military time is used. For example, if the test
was completed at 1:10 P.M., the entry might be "13:10:46". All entries for a single test
have the same time logged.
3. The number of failures. If this number is zero, the test passed.
4. The step number (as listed in the Edit screen). If the step number is zero, this is a
summary record only and only describes a test as passed or failed. The test has failed if
item 3 is not zero.
5. Test execution time in seconds.
6. UUT Serial Number enclosed in double parenthesis.
7. Test Program revision number.
8. PCB counting method, enclosed in double parenthesis if program uses panelization, ""
otherwise.
9. Name of main program if this is a subprogram called via RunT, "" otherwise.
10. Batch string enclosed in double parenthesis.
11. Operator name enclosed in double parenthesis.
12. System ID string enclosed in double parenthesis.
The following fields will only be present if the record is used to report a passed or failed test
step result. This only occurs if the logging for detailed data (e.g., `summary + passes + fails').
For these steps, the test step number will also be non-zero so that you can differentiate between
summary records and step-result records.
1. The test type (e.g., RES)
2. The measured value (e.g., 12.45K)
3. The test title (e.g., R101)
In the event of a CONTinuity test failure, the measured value is `Pins xx/yy' where xx is
the `From (- )' test point and yy is the `To (+)' test point. The test title is either `Short' or
`Open.'
4. The low test limit (e.g., 11.00K)
5. The high test limit (e.g., 14.00K)
An example statistics file is shown in Sample Reports on page 11-1.
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Chapter 8
Test Programs

Overview
The system must be programmed for each type of assembly (UUT) that you will be testing.
The system provides a program editor that is easy to use for generating new test programs or
modifying existing ones.
A system such as the CheckSum Analyst mc is sophisticated enough to handle a wide variety
of testing needs. As such, it has many advanced features and tools available to the user - many
of which may never be used in most installations.
This topic covers most of the common operations and concepts used for programming.
Background on page 8-2
Manual Entry on page 8-3
Setting the Execution Order on page 8-4
Debugging Test Programs on page 8-4
Editing Tools Testing Methods on page 8-4
Measurement Tolerances on page 8-5
Continuity and IC Tests on page 8-5
Special Features on page 8-5
Statistical Data (SPC) Logging on page 8-5
Save Program on page 8-6
For information about how to program specific steps for testing components on your UUT,
see Entering Test Steps on page 9-1.
For complete details of what each test step in the programming language can do, refer to
Test Type Descriptions on page 18-1.
If you will be generating your programs from CAD data, you should also refer to CAD
Data Conversion on page 10-1. Even if you are generating test programs from CAD data,
you will need to learn these concepts and processes.
Test Programs
Instruction Manual
If you need a test program quickly, the Autoprogram on page 8-25 tool can be used. The
autoprogram will create a test program that does not contain as good diagnostic
information as a conventionally written test program. However, the autoprogram function
allows you to start testing very quickly and still provides fairly high test coverage.
To help you use the system, the description of test programming is broken into sections:
The Background below section gives an overview of how to enter and program tests for a
UUT. It describes the capabilities and tools used for most programming.
The Edit Test Screen on page 8-6 describes the various top-level screens available in the
system. This description includes some, more esoteric capabilities of the system, and can
be used as reference material.
Loading a Program or Erasing Memory on page 8-32 describes how to get started writing
a program.
Assigning Point Names on page 8-32 describes how to assign names to the test points for
your test program.
Related Topics
Entering Test Steps on page 9-1 describes how to enter test steps into your test program.
Listing Test Program Data on page 8-34 describes how to get a print-out of your test
program.
Saving Test Programs on page 8-34 describes how to save your completed program on
disk.
Toolbar Buttons and Shortcut Keys
In the pull-down menus, shortcut key sequences are often available. These
shortcut key sequences are shown in the menus next to the command. Also,
in many screens, toolbar buttons are available at the top of the screen. The
toolbar buttons can be used as substitutes for frequently used menu items.
By moving the mouse pointer over the toolbar button, then pausing, a 'hint'
will appear that describes what the toolbar button does.
Background
Programming an assembly is the process of entering testing instruction information about the
assembly into the system so that it can be tested. The system provides the capability for this
information to be entered in several ways. You may want to use a combination of these
methods:
Information can be entered via a text file generated on your PC or automatic translation of
CAD data.
Test data can be typed directly into the system.
Some information, such as opens/shorts, IC orientation and Agilent TestJet technology

values for the assembly is automatically programmed (self-learned) by the system. To do
this, you connect a known-good assembly, then tell the system to self-learn this
information for the assembly.
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Test Programs
You will use either method (1) or method (2) for MDA test of the components installed in the
assembly, depending on whether you have CAD data available or not. Then, you will use
method (3) to add tests for ICs, TestJet technology and continuity.
If you are testing a panelized PCB, you will enter and debug the MDA test program for the
first PCBs on the panel, then use the automated tools included with the system to step-andrepeat the program for the other PCBs on the panel.
If you are going to be doing functional test, these steps are manually entered, either as part of
the completed MDA test program, or in a separate test program. Refer to the Model TR-6
Instruction Manual for information about this process.
Manual Entry
For MDA testing, you can manually generate the test data as shown in the following steps.
These steps are performed automatically for you if you have CAD data available for the UUT:
First annotate the UUT schematic with the node (test point) numbers. This done by
placing sequential numbers on the schematic, one for each electrical network (e.g.,
Ground, VCC, DATA0).
Next, enter the node names into the system. Using the Edit Test Program Setup >
Connection Information screen, you can assign names up to 255 characters in length.
Different conventions can be used. Some facilities use physical locations (e.g., J1-1, U2-4,
C1-2) and others use signal names (e.g., GND, VCC, DATA0), and others use a
combination of these names (e.g., use signal names when available, and physical locations
otherwise). In most displays, you are able to directly see up to about 32 characters of each
point name. Beyond that, you may need to scroll to see more characters.
Once the node names are entered, you can generate a wiring report to give to the fixturing
facility to use when wiring the fixture. This report gives the test point numbers, the
connector/interface block to wire to, and the name of the signal or pin. An example of this
report is shown in Sample Reports on page 11-1. With use of the configuration screens
you can tell the software which type of fixture system that you are using so that the reports
will generate the proper interface pin-out in the wiring report.
Next, enter the test program using The Edit Test Screen on page 8-6. You first insert the
tests for each individual component on the UUT. For each component:
Insert a new line in the test program using the Insert key,
Enter the type of test (e.g., CAP, RES, INDUC or DIODE) in the 'Test Type' column,
Enter the two test point numbers or names connected to the component in the 'From
Point' and 'To Point' columns,
Enter the component designator (e.g., R232, C-23 or Q101) in the 'Test Title' column,
Enter the nominal value in the 'nominal' column.
It can be helpful to use a highlighter to mark each component on the schematic as it is

entered. If you enter the test program before you release the fixture for wiring, it can save
errors since you might discover probe locations missed in the first pass.
When the components for the UUT are entered, use the sort function to sort them in order
by test title. This will put all of the like components together in sequential order (e.g., C1,
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Test Programs
Instruction Manual
C2, ... C211, R1, R2, R3,...R121). This is available in the tools menu by selecting sort,
then by test title.
Next, use the Set Initial Limits and Range (in the Measure menu pull-down) to assign
tolerances and default measurement ranges for all of the entries.
The above steps will prepare your test program for debugging. The outcome of these steps is
roughly equivalent to what the CAD Conversion utilities perform automatically. For
information about CAD Conversion, see CAD Data Conversion on page 10-1.
Setting the Execution Order

When the program is entered or generated for all of the component values, you will probably
want to put it into the execution order that you want. Typically, the first steps in the program
are jumper and switch settings, followed by potentiometer adjustments, followed by continuity
tests, then the components tests, and finally the ICs test. You can use the block copy
commands of The Edit Test Screen on page 8-6 to reorder the program as necessary. It saves
some test development time to insert the ICs test and continuity test after debugging the rest of
the test program (see the text below for a description of how to generate the ICs and continuity
tests).
Debugging Test Programs

When the program has been entered (or generated from CAD data), it is necessary to debug it.
Debugging involves finding fixture wiring errors and choosing the appropriate measurement
ranges, polarities, guarding, and other factors to get the best test coverage. Once you have
entered the program and used the Measure > Set Initial Limits and Range command to assign
tolerances and default measurement ranges, you will typically find that somewhere between
50% and 90% of the test steps will pass. It is necessary to find ways to make the failing or
marginal steps pass. If you are interested in optimizing speed or accuracy, you may also want
to fine-tune the steps that are passing.
Editing Tools & Testing Methods

There are a number of tools available from The Edit Test Screen on page 8-6 to help you
debug the program. Once you are familiar with the system, you will probably find it the most
efficient to go through the following steps for each component test:
Select Step Analysis from the Measure pull-down (or use the toolbar button equivalent) to
obtain the Measurement Analysis screen. In this screen, you can move the cursor to different
measurement ranges and methods to choose the most efficient method. You can also use:
guard points
external sensing
measurement delays
scaling
offsets
or choose other tools to increase test coverage.
You can even display measurement statistics for each method that show average measured
value, measurement speed, and reading stability (standard deviation). When you have chosen
the best method, you can exit to The Edit Test Screen on page 8-6 and the system will
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Instruction Manual
Test Programs
automatically calculate and insert the appropriate range value based on the measurement
method selected while in this display.
There may be components that cannot be measured. Due to interactions between the
component being measured and the parallel circuitry, some component will not be measurable.
For example, small capacitors (in the low pF range) are typically not measurable when in
parallel with relay coils or inductors. Small capacitors can also be difficult to measure when
connected in parallel with an IC input since often times the IC input has high capacitance of its
own.
Tolerances
The system assigns default measurement tolerances (e.g., resistors 10%, capacitors 20%).
While you can often assign tighter tolerances, it is generally not suggested that you do so.
Remember that the purpose of the system is to find incorrect or incorrectly installed
components, not components that are out of tolerance. MDA testing assumes that components
are good and endeavors to find problems that occur during the assembly process. However,
many times the system will find bad components, even though that is not its main intent.
Continuity and IC Tests

When the component tests are debugged, you can enter the continuity and ICs tests:
To enter an opens/shorts test, insert a test type of CONT (for continuity) and use the 'From' and
'To' test point columns to indicate the range of points to test for continuity. Select Step
Analysis from the Measure pull-down, then select Learn All from the Connection pull-down to
automatically learn the connection map for the selected range of points on the UUT.
To test for the presence and orientation of ICs, insert an ICs test, specify the power supply test
points (e.g., +5V and Gnd) in the Point From (-) and Point To (+) columns. Select Step
Analysis from the Measure pull-down, then select Learn All from the Measure pull-down to
automatically learn the connection map for the selected range of points on the UUT.
Special Features
You can program special features into the test program. For example, you can provide for
operator adjustments and displays in the program. The available test step types provide the
necessary flexibility in writing test programs to perform almost any task.
For functional testing (using the Model TR-6) you will power up the UUT and manually
generate a sequence of steps providing stimulus and measurement on the UUT to ensure that it
is working properly. This process is described in the TR-6 Instruction Manual.
To instruct the operator how to installing the UUT, you can generate an operator screen of
instructions using the Operator Setup Entry Screen. This is displayed on the first execution of
the test program after it is loaded, but not between subsequent UUTs.
Statistical Data (SPC) Logging

At this point you should turn on statistical process control logging, and run a sampling of
UUTs through the system. Then, you can generate an X-Bar/Sigma Report. This report shows
how well centered the measurements are between the high and low test limits and how much
variation there is from reading to reading. From analyzing the X-Bar/Sigma Report, you will
probably want to go back and fine-tune some of the measurement methods to reduce the
reading variations, and if you can't do so, change some of the test tolerances so that test steps
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Instruction Manual
won't fail for good UUTs. Statistical Analysis on page 7-1 discusses how to use the SPC
facilities of the system.
Save Program
When an assembly is programmed (or 'learned'), the system provides the capability of saving
this information on the system's disk for future use. Virtually all of the information established
with the 'Edit Test' selection from the system menu is saved with the test program.
At this point, the program is ready to use as described in Executing the Test on page 6-3.
Related Topics
The Edit Test Screen below
Loading a Program or Erasing Memory on page 8-32
Assigning Point Names on page 8-32
Listing Test Program Data on page 8-34
Saving Test Programs on page 8-34

The Edit Test Program Screen is the center of test program generation facilities. It is accessed
by pressing [F2] or selecting the 'Edit Test' button in the center of the screen of the Main
System window. The Edit Test screen is shown in the following figure.
The overview section in Writing Test Programs on page 8-1 describes the general procedure
for writing a test program. This section, a general reference section, describes what each of the
menus and menu-items in the Edit Test screen is used. The next section, Entering Test Steps,
describes the details of entering individual test steps.
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Instruction Manual
Test Programs
Note
The system provides the capability to use a password to prevent
unauthorized modification of test programs. If password protection is
enabled (via the Configure System > Environment > Manage User
Accounts menu), you may be required to log-in prior to having access to the
Edit screen.
Menu Descriptions
File Menu on page 8-8
Edit Menu on page 8-9
View Menu on page 8-11
Measure Menu on page 8-12
Setup Menu on page 8-18
Tools Menu on page 8-25
Help Menu on page 8-31
8-7
Test Programs
Edit File Menu
Instruction Manual
Edit File Menu
Edit Test Program, File Menu
New deletes the present test program in memory in preparation for generating a new test
program. A dialog box allows you to select a test program template. These templates
provide a general structure to begin writing your test program.
Open solicits a test program file name, then reads the test program data from the specified
file into memory. After it is open, it can be edited and/or executed. If the test program
was saved in ASCII format, use the Open dialog box and select the 'Type: ASCII' to
select and open the file. The test system will be reset (initialized to a known state) when
the test program is opened (Reset check box is selected). If you which to override this
system reset, you can deselect the check box.
Append solicits a test program file name (saved as file type ASCII, .asc), then reads it into
memory, appending to the end of the existing test program. Append can be used to merge
two test programs together. Test point names are also merged together. The test point
names of the test program that is appended are used if the two test programs both specify
the same test point. See the "Note (Copying Test Steps from one program to another)" in
the following section for another method of appending just the test steps.
Save writes the test program data in memory to the specified file.
Save As opens a dialog box to allow the file destination and file name to be changed
before it is written. The dialog box has a 'Save File as Type:' field to allow the program to
be saved in standard binary format (Test Program) or in ASCII format. The ASCII format
is useful for appending two programs or editing the test program with another application.
For use with the CheckSum software, save the program as 'Type: Test Program'.
Print allows you to obtain a printout of the test program that you have entered or edited.
You can either send it to a printer, or to a file on the disk in ASCII format (it will look just
like the printer output, but instead sent to a file).
Run allows you to run the test program in memory. This selection invokes the 'Test
Screen'. This is a handy way to test your program during editing.
Exit leaves the editor and returns to the Main System window.
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Instruction Manual
Test Programs
Edit Menu
Edit Menu
Edit Test Program, Edit Menu
Note (Fields and Lines)

Cut and paste functions operate on the selected data in your test program.
Depending on whether you have selected a field (entry on a line) or line
(test step), the options in the Edit Menu will change to reflect what is
currently selected. To select a field, click on it and it turns to a dark
background. To select an entire test step, click on the box on the left of the
edit screen and the entire line turns yellow. You can select multiple lines in
the program by clicking on the left box of the first and last lines, or by
dragging over the boxes on the left. To deselect lines, click again on any
field.
The contents of a field (individual cell) can be edited. If you need to edit a
field (the Test Title, for example), position the mouse pointer on the field
and double-click the mouse or press the Enter key. The edit cursor will
appear at the end of the entry in the field. Use the arrow keys or the mouse
to move the edit cursor. If you right-arrow at the far-right side of the field
or left-arrow at the far-left side of the field, the next cell is selected. To
replace the contents, single click the mouse to select the field (blue
highlight appears) and type in the new entry. If you start to replace the
contents of a field and change your mind, press the Escape key once. The
original contents will return.
Many of the frequently used commands are available as toolbar buttons on the Toolbar as well
as in the different menus.
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Edit Menu
Instruction Manual
Insert (Insert key) allows you to enter a new test step just below the test step currently
selected.
Insert Before (Ctrl+Insert) allows you to enter a new test step just above the test step
currently selected.
Delete (Ctrl+D) allows you to delete the test step that is currently selected. To delete test
steps, highlight the steps and use the Edit > Delete. A dialog box will prompt you for
confirmation. If a field is selected, you will not be prompted for confirmation and the test
step will be immediately deleted.
Clear All (Alt+D) deletes all of the present test program steps.
Cut Field/Test Step allows you to copy the selected data so that it can be placed
elsewhere. If a field is selected, cut (Ctrl+X) simply copies it into a buffer (the cut field
remains unchanged). If a test step is selected, cut copies the test step into a buffer, then
deletes the selected test step.
Select (yellow highlight) the test steps you wish to move and use the Edit > Cut Test Step
feature. To insert the cut test steps below a test step, highlight any field on that test step
and use the Edit > Paste Test Step. The toolbar has buttons for these features also.
Copy Field/Test Step allows you to copy the selected data so that it can be pasted
elsewhere. If a field is selected, copy simply copies it into a buffer. If a test step is
selected, copy copies the test step into a buffer.
Fields (individual cells) can be copied and pasted to single or multiple fields. Position the
mouse on a field and click to select the field (the selected field is highlighted in blue). Use
Edit > Copy Field menu feature to copy the field (or press Ctrl+C). If you select another
field, you can paste the copy contents into this field. If you select multiple fields (click
and drag the mouse), you can paste the copy contents to all the selected fields (Edit >
Paste Field or Ctrl+V).
Entire lines (test steps) of a program can be copied and pasted into the program. Position
the mouse on the far left gray box and click to select the test step. The test step will be
highlighted in yellow. If you click and drag the mouse, you will select multiple test steps.
If you hold the keyboard Alt-key down, each press of the up-arrow or down-arrow will
select a test step. Use Edit > Copy Test Step or the toolbar button to copy the test steps. If
you select another test step, you can paste the copied test steps in place of this test step. If
you select multiple test steps (click and drag the mouse), you will replace all of the
selected test steps with the copied test steps (Edit > Paste Test Step). Note: If you select a
single field (blue highlighted field) on a test step, the Edit > Paste Test Step feature will
insert the copied test steps below the test step with the blue highlight. The selected test
step will be unaltered and located above the inserted steps.
Note (Copying Test Steps from one program to another)
The test step lines that are copied are saved when opening test programs. You can use
this feature to copy test steps from one test program, open and then paste to another.
Paste Field (Ctrl+V) allows you to copy the data from the buffer (stored with a cut or
copy operation), into the selected field.
Paste Test Steps allows you to insert the test steps saved in the buffer (stored with a cut or
copy operation) to the lines just after the selected lines.
Mark Begin Block (Ctrl+B) selects the beginning step for a block command such as
measure selected steps, sort by test title, or copy/cut selected steps.
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Instruction Manual
Test Programs
View Menu
Mark End Block (Ctrl+E) selects the last step for a block command such as measure
selected steps, sort by test title, or copy/cut selected steps.
Re-Mark Block (Ctrl+Q) selects the steps previously selected by the Mark Begin and
Mark End Block commands. The steps are highlighted.
Goto Step (Ctrl+G) allows you to enter a step number. The system then adjusts the screen
for you to see it then selects the test-type field on the selected line.
Goto Next Error Ctrl+N) allows you to jump to the next step that failed (the test program
must be run first). The system then adjusts the screen for you to see it then selects the testtype field on the selected line.
Find (Shift+Ctrl+F) allows you to enter a string of information, then search through the
test titles in the test program to find a matching string. You can either specify that the
search is case sensitive (upper and lower cases must match), or not case sensitive. This
can be used, for example, if you want to find the test step for a particular component, such
as R101. Find starts at the beginning of the test program.
Find Next (Ctrl+N) allows you to search for the next occurrence in the test program of the
string last entered in the Find menu.
Point Name Entry allows you to specify how the point name columns are used in The
Edit Test Screen on page 8-6. If Point Name Search is turned on (checked), when you
enter a name in the point name column, the system searches the existing test file for the
point name that has been entered, then substitutes the appropriate point number. If Point
Name Overwrite (Ctrl+O) is turned on (checked), when you enter a name in the point
name column, the system assigns the entered name for the point number that is entered for
this point. In this mode, you can enter the point names directly from the edit screen.
View Menu
Edit Test Program, View Menu
Expand provides detailed information about the selected test type. Available for many of
the analog test types, the expanded view tells you more information about how the
measurement is made. For example, it includes the measurement type, amplitude range,
guard points, external sensing points, and so on. Much of this information can also be seen
in the Measurement Analysis screen.
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Measure Menu
Instruction Manual
Show Unedited Field Values allows you to specify how the fields are shown in The Edit
Test Screen on page 8-6. In the default mode, Unedited Field Values > All disabled (not
checked), the system displays a bullet in each field of the test program that you have not
entered or assigned, other than the Test Type column which is always displayed. In this
mode, you can easily see which fields need to be filled in to complete the test program. If
Unedited Field Values has All checked, the system shows a value in every applicable field,
whether you have entered it or not. This will show default values that are entered when
you insert a test step. You can use the Unedited Field Values > Selected menu to toggle
the selected fields between bullets (if unedited) or the display of the default values.
Default Grid allows you to return the 'Edit' screen to its default column width and
spacing. The width of a column can be changed by clicking on the right-side edge of the
title column and dragging the column edge.
Font Size allows you to select the font that is used in The Edit Test Screen on page 8-6
for the test program entries. The default (10-point) works well with most displays.
Measure Menu
Edit Test Program, Measure Menu
Make Measurement executes the selected test step and displays the result in the
Measured column. If you have selected more than one test step, all selected steps are
executed. Steps in the selected range that are executed are all normal measurement steps,
exclusive of transfer of control, display, and operator I/O.
The Run Test toolbar button can be used to run all of the test steps. It will close the
edit window, open the test screen window and let you run the test in the normal test screen.
When running a test starting from the edit screen, you (as a 'programmer') will have full
access to all of the test screen menus and selections. For example, you will be able to
set/clear the Test menu 'Single Step' and 'Halt on Fail' flags. These flags are saved with
the test program. Several test operation control features, such as the Environment menu,
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Instruction Manual
Test Programs
Measure Menu
are not available to an operator or when you run the test from the main system screen.
When you exit the test screen, it returns to the edit screen.
Step Analysis is available for most measurement types. It allows you to fine-tune the
measurement by selecting ranges and measurement types, add guarding, offsets, and
measurement delays. When you select Step Analysis, the screen displayed will vary with
the test type. Each type is discussed in more detail under Test Type Descriptions on page
18-1.
Skip Test Step allows you to toggle the selected test step (or test steps if you have selected
a range) between skipped and unskipped. If a test step is skipped, it is not executed nor
reported on. The skipped test steps are marked with a character. If the test program is
saved with any skipped steps, the steps are skipped when the program is run. Select the
first and last steps to select all steps, then use the "Skip/UnSkip Test Step" to remove all of
the skip test steps. One use of skipped tests is to speed up test debug by temporarily
skipping tests that have already been debugged.
Assign Measured to Nominal copies the measured value to the nominal value. This can
be used in the cases where you can't make the system read the nominal value, causing
confusion to the operator.
Set Initial Limits and Range assigns the high and low limits based on the nominal value.
The assignments are based on the 'Default Limit Setup' . This selection also assigns the
initial measurement type and range to be appropriate for the anticipated measurement.
Set Limits from Nominal Value assigns the high and low limits based on the nominal
value. The assignments are based on the 'Default Limit Setup'.
Set Limits from Measured Value assigns the high and low limits based on the last
measured value. The assignments are based on the 'Default Limit Setup'.
Learn Step can be used to have the system determine, by measuring the assembly
presently loaded in the fixture, the measurement polarity, type, range, and high/low test
limits for the test step presently selected. Note that while the computer can try many ways
of making the measurement quickly, you can usually make a better choice manually once
you have learned to use the analysis screen. You should learn to use the analysis screen
and check any suspect measurements with its use. See the Learn Setup section.
Default Limit Setup (Test Tolerances) assigns how the limits are set in the "Set Limits"
and the Learn Step selections. From this setup you can specify how the Learn and
tolerance assignments are made for the various test types.
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Test Programs
Measure Menu
Instruction Manual
Default Limit Setup (Test Tolerances) Menu
Tolerance selection in percentage specifies the tolerance, in percent, from the nominal
value that will be used to assign the low and high test limits. For example, if the value
entered is 10%, and the measured value is 100 ohms, the system automatically assigns
values of 90 and 110 ohms as the low and high limits. These percentages can typically
be assigned as different values at different nominal values. This feature helps assign
tolerances that will be effective, yet not lead to a high rate of false failures.
The Closest Limit sets the minimum value that the Low Limit will be set below the
nominal value and the High Limit will be set above the nominal value. For example, for
resistance the default percentage tolerance below 100K ohms is 10%, and the closest
limit is 5 ohms. This means that even though 10% may be less than 5 ohms, the closest
allowed tolerance is 5 ohms.
Maximum Scale Factor Adjustment specifies the maximum scale factor adjustment
that can be made to a reading in an attempt to match the nominal value. This number is
assigned as a percentage. If the nominal value cannot be achieved with the scale factor,
no scale factor is applied. In most cases, the system will not accept values above 30%
for this parameter. If this value is zero (the default), the system will not adjust the scale
factor. Before attempting to use the scale factor, the system first attempts to correct the
reading with the offset adjustment (see below).
Reset to Defaults will set the parameters back to the initial value when the system was
shipped from CheckSum. These values are effective for most testing installations.
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Instruction Manual
Test Programs
Measure Menu
Learn Setup is used to specify how the 'Learn Step' works. There are several things that
you can specify about how learn step works. When using RESistance, CAPacitance,
INDUCtance, DIODE and ZENER test types, the system can automatically help determine
the best range, guarding, polarity, and assign upper and lower test limits for you. The
system allows you to specify how these factors are automatically assigned.
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Test Programs
Measure Menu
Instruction Manual
Learn Setup
Adjust Limits to match measured will set the test limits to make the test pass. During
the Learn of a test step, the system tries to make the reading match the nominal value
that you have entered. If the system cannot achieve a comfortably passing result, and
this selection is specified as a `yes', the system will then change the test limits to make
the step pass. It uses the tolerance methods specified in Default Limit Setup to make the
limits adjustment based on the final measured value, rather than the nominal value. The
system default for this parameter is `no'.
The selected Autoguard Method is used to specify how autoguarding is performed.
When you set the system to perform autoguarding, it first attempts to achieve a good
reading without guarding. If this cannot be achieved, it then tries to find good guard
points. It can automatically assign up to two guard points in an attempt to make a good
reading. There are four levels of autoguarding, the normal default being Extensive:
Off disables autoguarding so that it is not used.
QuickGuard allows specification of a few guard points that are likely to be effective
guards, such as ground and power supplies on the UUT. When QuickGuard (or a higher
level of guarding) is specified, when the first guard assignment is necessary, the system
displays the Select QuickGuard Points window.
Component-Away specifies that the system first attempt to find suitable guarding with
the QuickGuard points, then if not successful, try points that are one component away
from the component that is being tested. These points are determined by looking at the
other test steps in the test program that is presently entered.
Extensive specifies that the system first attempt to find suitable guarding with the
QuickGuard points, then if not successful, try points that are one component away, then
if still not successful, look at all the test points used for the UUT. While this is very
thorough, it is slower than the other methods. If you have previously learned a
CONTinuity map for the UUT, the system will use it to speed up the guarding process.
It does this by only using the first point on each network as a potential guard point.
The QuickGuard Points button will open the Select QuickGuard Points window. This
window is used to help speed autoguarding and automatically appears when it is needed.
This window allows you to enter data to optimize and speed up automatic guarding with
the system. This window automatically is displayed when necessary during an autoguard
operation.
QuickGuards are test points that are most likely to be effective when guarding. For
example, power supplies and grounds are effective guards for most measurements. By
specifying these points so that the system can try them first, you can greatly speed up the
guarding process, and in some cases obtain better guarding.
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Instruction Manual
Test Programs
Measure Menu
QuickGuard Setup Menu
In this screen, a list of all the test points are shown. Press the Select button to make the
point a QuickGuard Point. The Auto Select button will automatically select test points
based on the test point names. The system looks through the names that you have
assigned, and selects points that have names that are likely to be power supply and
ground points.
Reset All allows you to reset all of the QuickGuard points presently selected.
Last Used Test Point allow you to specify the last test point to consider when
autoguarding in the Extensive mode. By entering the last test point used on the UUT
being programmed, you can drastically speed up system operation. If you have named
your test points, the system will look for the last named test point and use it as the initial
value. Otherwise it uses the last test point in your system configuration.
The Select QuickGuard Points window appears when necessary for autoguarding. Once
you have assigned any QuickGuard points, or changed the last test point, this window
will not appear again until a new test program is loaded, or you explicitly call it up in the
Learn Setup window.
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Test Programs
Setup Menu
Instruction Manual
Multi-Function Input Measurement provides a quick and easy method to make

measurements and add test steps with a simple to use multi-meter. All of the standard
measurement functions such as resistance, capacitance, inductance, etc can be made and
stored in the test using this capability. The Measure/Stop button starts the measurements
in a continuous mode. The Expand/Collapse button shows additional details about the
measurement for more control of the measurement. For example, Pass and Fail based on
limits can be setup. Once the test step is setup the way you want you can save the setup as
a new test step.
Setup Menu
Edit Test Program, Setup Menu
Connection Information allows you to enter point names into the test program. Point
names are used for reporting purposes and can be used to make the test reports more
meaningful to the user. In the normal case, you can type in the name of each point, or
assign names by using the probe in the system. The Connection Information Screen
provides several functions for assigning point names. If you elect to probe a point, when
you touch the probe (plugged into the front panel Test Input Low, black connector) to a
point, the unknown point is moved into view in the point menu, and selected, so that you
can type in its name. If you select Auto Increment, the system will take the last name that
is selected, increment it, then use it as the new name for the next probed point. The system
is intelligent about incrementing. It will use numbers or letters and increment correctly for
most conventions. This feature is handy, for example, if you are assigning pin names for a
connector. Move to pin 1 of the connector, and enter the name, for example, J1-1. Then
turn on Probing and Auto Increment, then sequentially probe points in the connector. New
sequential pin names will be assigned, such as J1-1, J1-2, J1-3,... The Connection
Information Screen also allows you to go to a point (type in the point number and it is
selected in the screen), find duplicate names that have been assigned, and display naming
statistics. Statistics include first and last named point name and number, and the number
of points that have been named.
The File menu selection 'Print' is used to print the Wire Run Report directly to a printer
or a file. To make it easy to review system wiring, the report lists the test system
connections in two columns. One column shows the connections sorted by test point
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Instruction Manual
Test Programs
Setup Menu
numbers. The other column shows the connections sorted by the name assigned to the
connection (for example, +5V). See Wire Run Report on page 11-7 for an example.
Connection Information Screen
Display Messages allows you to enter text strings that are presented to the operator during
the test program with the display test types (see DISP, DISPL, DISPE and SCRN test
types). Operator messages can also be used to provide information for the RS232, GPIB,
and Logic test types. The first column lists the message number. The next two columns
are used to enter the column and row of the message area on the screen that the message
will be displayed on. Finally, the message (Display Line) is entered. You can have up to
36 messages in each test program. For more details see Display Messages on page 9-33.
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Setup Menu
Instruction Manual
Display Messages Screen
Fixture-Check Data allows you to enter information used for 'Fixture Check'. Fixturecheck is used to find improper probe contact with the UUT. This can find faulty probes
and can also be helpful information for isolating UUT faults.
Fixture-check works by taking advantage of the fact that almost every probe on the UUT is
connected by an impedance path to another probe on the UUT. Fixture-check electrically
connects all the probes together, except one, then measures from the isolated point to the
group of all others. At run-time, if the impedance is higher than a specified threshold, and
a connection normally exists, fixture-check generates an error.
Setup Fixture-Check Data Window
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Instruction Manual
Test Programs
Setup Menu
You can use the 'Fixture-Check Data' window to self-learn a known good UUT to create a
map of the expected connections. Then if fixture problems are suspected after a test is
completed, the operator can manually elect to run a fixture-check from the FixCheck menu
of the 'Test' screen.
Fixture-check can also be automatically invoked from within the test program by use of
the FixCh test-type on page 18-89. You might find fixture-check information useful for
UUT repair since it can isolate a node on the UUT that would normally be connected but is
not connected. In this case a fixture-check error may indicate a test point where a
component is missing or not connected.
Fixture-check information is automatically learned for the fixture as a whole (all active
points) by selecting 'Learn All' from the Task menu. The fixture-check screen then shows
a diamond beside each point that is connected to at least one other point on the fixture. If
you wish to learn a single point, select it and use the 'Learn' menu item. To execute the
entire fixture-check test, use the 'Measure All' menu item.
With the 'Enter Threshold' selection of the 'Edit' menu, you can enter a new resistance
threshold to use for the fixture-check test. The default threshold, 100 , generally works
well. With the 'Toggle Connection', 'Clear Connection' menu items, you can force the test
on a particular point to be connected or a no-care. You can click on a point to select it, or
use the 'Select Page' or 'Select All' menu-items to select multiple points simultaneously.
'Goto Point' allows you to directly move to a point that may not be directly displayed.
'Exit' causes you to move back to the 'Edit' screen.
Operator Instructions Setup allows you to enter a screen of information that is displayed
to the operator prior to starting each batch of UUTs. This screen is typically used to
provide one-time information such as how to install the test head, UUT orientation, and
location of parts to be adjusted.
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Test Programs
Setup Menu
Instruction Manual
Operator Instructions Setup Screen
Generally, you use the mouse to move the cursor to where you would like to type in
information, then start typing. If you wish to have line drawings, you can use the toolbar
buttons to select single-line or double-line drawings. Once in a drawing mode, when you
move the cursor around with the arrow-keys, a line will follow. Press the toolbar button
again to come out of the drawing mode. If you wish to enter special characters, use the
'Insert Symbol' menu-item in the 'Edit' menu to select the special characters. With these
tools, you can make descriptive screens for the operator.
The operator setup screen is saved with the test program. You can also save it in a
separate file with the 'File' menu's 'Save' selection. The default file extension is .CMT.
Once it has been saved, you can merge it into another test program with the merge
command. Since 'Merge' only adds the characters that are used, you can overlay several
files. With these tools, you can build your own library of operator setup screens to help
speed future test program development. If you use the unmerge command, every character
that is in the .CMT file is erased in the displayed setup screen.
Assembly Name is used to enter a name describing the UUT. It is included in the header
of test reports from the system. Since it can be longer than the program name (it can be up
to 32 characters), it can be used to describe the UUT more fully, including information
such as revision information.
Measure Setup > Res Characteristics is used to enter information about how
measurements are made with the system for this particular test program. In almost all
cases, the default values are a very good compromise for speed and measurement
repeatability. However, you can modify these items for special requirements if necessary.
These characteristics apply to the DC current measurement ranges (apply constant
current/measure voltage). The first column (settle time) specifies how many milliseconds
the system waits after applying the constant current before making the measurement. The
second column (samples) specifies how many samples are averaged for each reading.
You can also specify other parameters. In the default case (Max Discharge Time = 0), the
system immediately applies stimulus to take a measurement. You can specify that the
system first measure the voltage across the component, then if necessary, discharge it. The
'Max Discharge Time' specifies the maximum time (in seconds) to wait for it to discharge.
If it has not discharged in this amount of the time, the system will beep at you and continue
regardless. Note that you should never place a UUT on the system that has any
components charged in excess of +/-12 VDC or the system will be damaged.
The characteristics that are entered in the Resistance Measurement Characteristics screen
apply to the test program as whole. In most cases, you may only need to modify the
characteristics for one (or a few) measurements in the test program. In this case it is more
efficient to use the ResRG test-type to modify and reset these characteristics during
program execution.
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Setup Menu
Resistance Measurement Characteristics Screen
Measure Setup > Other Meas Characteristics allows you to specify the amount of time
to allow for DC CAPacitance tests and DIODE test to discharge prior to making a
measurement. The defaults, 5 seconds and 500 mSec respectively, work well in most
testing applications. Two entries are available that allow you to specify how many
samples (readings) are averaged for each VOLT and INDUCtance test. The default for
these two tests are 10 and 1 respectively. Sometimes, readings can be made more stable
by significantly increasing the number of readings averaged.
Measurement Retries allows you to specify how many re-measurements to make before
failing a step. On occasion, a step may initially fail because a parallel capacitor is in an
unexpected state of charge. If retries are turned on, subsequent measurements may allow a
good circuit to pass. You can specify how many retries are allowed with RESistance tests,
CAPacitance tests, INDUCtance tests, DMM tests and UCT tests. The default is 5 retries
for RES, CAP and INDUC; and zero retries for the other steps.
The characteristics that are entered in the 'Other Meas Characteristics' screen apply to the
test program as whole. In most cases, you may only need to modify the characteristics for
one (or a few) measurements in the test program. In this case it is more efficient to use the
ResRG test-type to modify and reset these characteristics during program execution.
Measurement Messages allows you control how warning and error messages affect test
execution. If enabled (checked) then the system will display and wait for the operator to
acknowledge the warning or error message before proceeding. If disabled (not checked)
then the system will only beep when these conditions occur and the system will
automatically continue to the next test step.
Viewer Settings opens the Board Viewer Setup dialog window:
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Setup Menu
Instruction Manual
This setup is used to control the interaction of the CheckSum Visual MDA and CheckSum
Board Viewer software. The Board Viewer software displays a photographic image of the
assembly, the schematic and the test fixture probe map for the assembly. A major benefit
of using the Board Viewer is locating components that failed board test. In addition, using
stored failure data, failed components can be located at a repair station long after the board
was tested (post test failure analysis). If you need to find a faulty spring probe, the probe
map shows the location. For additional information about the Board Viewer software
contact CheckSum on page 1-2.
Components Highlighted
When Failed is checked, during a board test, whenever a component fails, Visual MDA
will tell the Board Viewer to highlight the component (default color is red) as failed
component.
When Passed is checked, during a board test, whenever a component passes, Visual MDA
will tell the Board Viewer to highlight the component (green) as passed component.
When Adjustment is checked, during a board test, whenever a component test step needs
adjustment (e.g. POTR, JMPER, and SWCHR) Visual MDA will tell the Board Viewer to
highlight the component (yellow) as the adjustment component. The adjustment selection
is normally used for components such as potentiometers that may need to be adjusted
during a test.
Passed/Failed Highlights
Select Immediately to highlight a Passed/Failed component as the Visual MDA test runs.
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Tools Menu
Select End of Test to wait until the end of the test to highlight a Passed/Failed component.
This selection produces faster execution and less monitor flicker on the Board Viewer
screen (since highlighting is done only once for every test).
Note that use of these options has no impact on the adjustment component. If you select
Components Highlighted > Adjustment option, the adjustment component will always be
highlighted immediately.
Also note that in the following two cases, if the highlighted component is not on the
current image (when there are more than one image of the same type), the Board Viewer
will change the current image so that the highlighted component is displayed:
Case 1. Highlight Passed/Failed component when the Immediately option is selected
Case 2. Highlight Adjustment component
Board Viewer Use
Display Board Viewer and Visual MDA Together means that during a board test, Visual
MDA and Board Viewer will both be visible.
If you check off this option it means that during aboard test Visual MDA will be displayed
and the Board Viewer will be minimized. When Visual MDA tells the Board Viewer to
display something (e.g. failed component, adjustment component, user defined image), the
Board Viewer will be displayed and the Visual MDA will be minimized. Only after the
operator acknowledges the Board Viewer by pressing its Return to Visual MDA button
(located under the Image Display), will the Visual MDA will be displayed again and the
Board Viewer will be minimized.
The Image Storage specifies if there is Image Information for the Board Viewer to
display. The Image Information can be embedded with the test program or linked. If the
Image Information is linked, the Linked Image File (directory and file name) is displayed.
Tools Menu
Edit Test Program, Tools Menu
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Tools Menu
Instruction Manual
Perform Cross Checks can be used to find problems in the test program that may not be
obvious. For example, it looks through the test program to find potential problems, such
as possible attempts to use mutually exclusive sources simultaneously, use of DMM input
for the UCT when the specified frequency is too high, possible fail on measurement
overrange, and other similar sort of errors. For the overrange problem, it checks the
measurement range against the high limit to insure that the system will not go into
overrange before it can achieve the high limit. You may wish to do this in some cases, but
may have accidentally ended up in this situation in other cases.
This option also checks for illegal operations when using the Model TR-6. For example, it
checks for measurements above 12 volts routed through the solid-state test points.
If it finds any potential problems, it will show them using the Viewer. Make sure you
close the Viewer window before you run another Cross Check, otherwise the Viewer will
not show the new report.
Sort allows you to sort your test program based on two possible keys.
In the first case, 'Sort by Test Title,' it will put the program in alphabetic order by test title
field. This is generally used right after you randomly enter (or generate with CAD data)
all of your component tests, but before entering miscellaneous test steps such as display
messages. This sort will generally sort your test steps into a logical order. For example it
will put all capacitors together in ascending order (e.g., C1, C2, C3,...), all resistors
together, and so on. Most users prefer to have tests in order by component, as created by
this sort. After you enter a program, it is also a quick way to see if you have missed any
sequential components.
In the second case, 'Sort for Best Speed,' it will put the program in an order that can help it
operate more quickly. This is generally used right after you enter (or generate with CAD
data) all of your component tests and have optimized them for measurement ranges, but
before entering miscellaneous test steps such as display messages. This sort will generally
sort your test steps so that particular measurement modes are grouped together. For
example, all of the 100Hz tests are executed in sequence so that the measurement
electronics do not need to resettle to a new frequency before making the measurement.
Most users prefer to have tests in order by component name rather than for best speed,
although if obtaining the optimum test speed is important to you, this function can provide
a little additional speed.
Measure Offsets provides the capability to measure the resistance and capacitance offsets
for a particular test program and test fixture. This feature is an automated way of
performing the offset function that you can also individually perform on each test step
from the 'Measurement Analysis' screen. The same storage value is modified in the test
program. In each case, you can elect to perform the offset for the selected test step(s), or
the entire program.
If you are off-setting resistance tests, the system will ask you to install a shorting fixture on
the system that connects all of the probes together. This can sometimes be created from
having your PCB manufacturer provide a PCB that has not been etched, or by machining a
conductive plate (such as a piece of PCB material) to the shape of your UUT. Once you
have installed the shorting fixture, the system will make a measurement between the test
points used on resistance-type tests, then assign this as an offset for the test step. At runtime the measured resistance for each test step is subtracted from the measured value.
Resistance off-setting can increase the accuracy of low value resistance measurements
because it subtracts the resistance of the wiring between the end of the cable from the
system to the top of the test probes. However, if high accuracy is required for low
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Tools Menu
resistance measurements, use of Kelvin measurement techniques (4-wire) are superior to

offsets. This is because Kelvin techniques automatically accommodate changes in
resistance (such as probe contact resistance) that occur over time.
If you are off-setting capacitance tests, the system will ask you to remove the UUT from
the fixture. Once you have done that, it will make a measurement between the test points
used on capacitance-type tests, then assign this as an offset for the test step. At run-time
the measured capacitance for each test step is subtracted from the measured value.
Capacitance off-setting can increase the accuracy of low value capacitance measurements
by subtracts the capacitance of the wiring between the end of the cable from the system to
the top of the test probes.
Merge Parallel Components finds parallel components and merges them (e.g., if C1 and
C7 are connected to the same test points, the system adds the values of them and puts them
together into one test step.
CAD Conversion allows you to use CAD (computer-aided-design) data to help generate
your test program. Data such as net-lists and component lists from various CAD Systems
can be used to generate a preliminary test program for you. Entering Test Steps on page
9-1 describes use of this function in more detail.
PCB Panelization is used with UUTs that consist of several UUTs that are combined on a
single larger PCB. Once you have written and debugged the test program for the first
UUT, you can have the system automatically step and repeat the program for the other
identical PCBs on the panel (or pallet). Panelization also provides testing functions such
as the ability to separate results by UUT in the panel, the ability to skip over some UUTs
in the panel, and descriptive methods by which the operator can see which UUT is being
tested, and relating the test results to a physical location on the panel
For details, see Panelized Testing on page 9-41 and Panelization Programming by
Wizard on page 9-43.
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Test Programs
Tools Menu
Instruction Manual
Autoprogram allows the system to be used without conventional test programming. This
is handy if you would like to do testing on assemblies, but you don't have the time or staff
to write a "real" test program yet. To do this, the system provides an "autoprogramming"
facility. This allows you to put a known-good assembly on your test fixture, then have the
system autoprogram the attributes of the assembly.
When autoprogramming, the system electrically examines your assembly, generating:

1. A continuity map that is used to find opens and shorts,
2. A list of resistances from each point to each other point,
3. A list of capacitances from each point to each other point, and
4. A list of diode junctions from each point to each other point.
Once the system has autolearned these attributes of your assembly, you can use the
generated test program(s) to test assemblies. Autoprogramming has the advantage of
quick and easy program generation, but it does not contain as good diagnostic information
as a conventionally written test program. For example, if it detects a failure, it will simply
list the error in terms of the measurement type (e.g., RESistance), the two test points being
measured (by number), the high and low test limits, and the measured value. A normal test
program would contain the name of the component being measured, and would contain
less measurements since the automatically generated program can't tell the difference
between impedances caused by series and parallel combinations and those not caused by
normal component measurements. However, even with these disadvantages, the
autoprogramming function allows you to get up and operating very quickly and still
provides fairly high test coverage.
To autoprogram an assembly, do the following steps:
1. Place a known-good assembly on the test fixture and actuate the fixture. Fixtures
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Instruction Manual
Test Programs
Tools Menu
obtained from CheckSum can be mechanically locked into place or actuated with a switch
available on the fixture system.
2. Enter the file name for this assembly. This ASSEMBLY name will be used as the name
of the test program that is generated. It can be any sequence of up to eleven characters that
do not contain spaces, colons, semi-colons, periods, or commas.
3. Enter the Number of Test Point (last one used) for the assembly. The number entered
here has a big impact on autoprogramming speed, so use the smallest number you can that
still encompasses all the assembly test points.
4. Press the Perform Autoprogram button to start the process. If an existing file is present,
you will be asked if it is OK to overwrite it, then if so, the autoprogram will commence.
Small assemblys of 100 points or less autoprogram in a matter of a few minutes, but large
assemblies may take several hours.
That's it! Once autoprogramming is complete, you have a program with the name you
provided that is ready to run. It contains a CONT test, RESistance tests, CAPacitance
tests, DIODE tests, and some operator displays just as used with conventional
programming. You can refer to other sections of this manual to see how these test-types
function. You can run and edit the program to fine-tune it to your needs. You should run
it a few times at first to make sure that every step reliably passes. If not, you can go to the
Edit window to delete or modify test steps that are a problem.
The Autoprogram window allows you to alter the autoprogram process. For each type of
measurement function, you can have the system autoprogram (combo box: Yes), or not
autoprogram (combo box: No). If you have already autoprogrammed the assembly, you
can use the previously determined data (combo box: Use Last) for a function when you do
a new autoprogram. For example, if you have autoprogrammed an assembly, but would
like autoprogram just the CAPacitors, you can re-use the previous parameters (CONT,
DIODE, RESistors) to save time.
Autoprogram Parameters can be used to fine-tune autoprogramming. The
autoprogramming function for Resistance, Capacitance and Diodes can be specified. You
can specify the lowest and highest values programmed for each function. You can set the
test limits in percent (or in volts for diodes). You can specify the closest allowable
tolerance. For example, for resistance the default percentage tolerance is 20%, and the
closest absolute limit is 5. This means that even though 20% may be less than 5 ohms, the
closest allowed tolerance is 5 ohms. You can choose the current used for diode testing.
Reset to Defaults will restore the system to the factory default settings for the currently
selected parameter.
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Tools Menu
Instruction Manual
The changes that you make in the Autoprogram Parameters window can be saved in the
Station Configuration file for your next use of the system.
If you are interested in more details of autoprogramming, here is a little more information.
For each parameter that is auto-programmed, an ASCII file is generated. They are called
$TMPCO$.1 for continuity, $TMPRE$.1 for resistance, $TMPCA$.1 for capacitance, and
$TMPDI$.1 for diodes. These are normal CheckSum-ASCII files that can be read in by
the standard Open File (file type ASCII). If not all of the data fits into one program file,
more files with extensions of .2, .3, ... are used. The first line of each file contains the
name of the main test program file that was used when generating this file. These ASCII
files are overwritten each time you do a new autoprogram. If not all of the test steps will
fit into a single test program, the autoprogram function generates a series of programs
linked together with RUNT commands. The main test program is called the name which
you entered, and the RUNT programs use the same name, but with a last digit of A, B,...
and so on. Each of these files can be called up and executed individually if desired.
Show BreakPoint Information opens the BreakPoint Information dialog window:
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Test Programs
Help Menu
This window allows you to view and change the settings on the page shown. By clicking
on a specific page tab, you can view and change the items on the various pages.
Help Menu
Edit Test Program, Help Menu
The Help menu can be used to obtain on-line help about the Analyst mc System.
Contents... allows you to search the table of contents for the help sections.
Topic Search... allows you to search the help data based on a topic that you enter.
Getting Started... helps you learn how to use the test system hardware and software.
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Instruction Manual
About... shows information about the software that you are using. It provides the revision
number, a number to call at CheckSum if you would like to talk to an engineer, and the
most recent date that the system self-test has been run.

The programming facilities of the CheckSum System are similar for editing an existing test
program or generating a new one. If you are editing an existing program, you first load it by
selecting 'Open' from the 'File' menu in The Edit Test Screen on page 8-6, then selecting the
proper test program file. If you want to erase the existing data and start with new data, select
'New' (or press Alt-D) from the 'File' menu of the Edit screen. A dialog box will confirm if
you want to erase the test program.
The program that you are editing will stay in memory as you enter and debug it. Once you are
satisfied, you can save it on disk. As in normal computer practice, you should also frequently
save the file to prevent loss of your time in case the computer should halt or lose power, in
which case all the information in RAM is lost. To save the program, use the 'Save' option in
the 'File' menu or press the save toolbar button (disk icon).
Assigning Point Names

You will probably want to assign meaningful point names so that the reports from the system
will be more useful. Points are sometimes referred to as pin names, test point names, or nails.
The Analyst mc System allows you to enter a point name of up to 255 characters for each test
point. In most screens, up to about 32 characters can be directly viewed. To assign point
names, use the Connection Information screen (see the following figure). This screen is
accessed by selecting 'Connection Information' from the 'Setup' menu in the Edit Test Program
window.
Connection Information Screen
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Entering Test Steps
The Connection Information screen works much like a spreadsheet. Use the page up, page
down, arrow keys, or the Goto Point menu-item, to move the highlighted, active area to the
row to add or edit a point name.
After you have entered a name and pressed Enter, the system automatically moves to the next
position to make entry of a list faster.
Probing
You can use probing to locate a test point number. With this feature you do not need to know
the specifics of how the UUT is connected to your test system. Probing is available for all
standard TR-8-1 test points.
You may either use the probe that comes with CheckSum fixturing or your own probe. The
probe needs to be connected to the banana jack on the back of the TR-8 System Module.
The system can be configured to probe all points or just active points. In addition the probe
threshold can be changed. This setup is done by selecting TR-8 System Module, the Probe
Setup with the Modules menu available from the Configure System menu.
Probe a Point sets the system into probing mode. When in probing mode, each time the
grounded probe touches a test point, the test point moves to the middle of the screen.
Probing stays active until Probe a Point is selected again to toggle it off. Probing can also
be turned on and off with the toolbar item that looks like a probe touching a point.
If more than one point is detected when the probe is touching the UUT or fixture, the
systems lists the additional probed points in the upper right hand portion of the Connection
Information screen. In order to see all of the points, you may need to hold the probe to the
UUT for a few moments to allow the system to make an entire scan to find all of the
additional points.
Auto-Increment enables automatic incrementing of point names during the probe

process. The system uses the point name in the center of the screen as the base. When the
next point is probed, it is assigned the same name, but incremented by one. If the last digit
of the pin name is alphabetic, it becomes the next alphabetic character, moving from lower
case to upper case. Note that no alphabetic characters are skipped, so it may to necessary
to probe a point twice to skip over unused pin names (such as an 'i' in some cases). If the
last characters of the pin name are numeric, they are incremented to the next numeric
character. Selecting Auto-Increment a second time disables auto-increment.
Exiting When you have completed entry of connection information, select the Green
Door to move back to The Edit Test Screen on page 8-6.
Entering Test Steps

For details about what test types to use, and how to enter them, refer to Entering Test Steps on
page 9-1.
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Instruction Manual

You can obtain a printout of your completed test program for documentation purposes. To do
so, from the 'File' menu of the 'Edit' Screen, select 'Print'. An example test program listing is
shown in Sample Reports on page 11-1.
If you would like to print a report showing the fixture wiring, go the 'Connection Information'
screen by selecting 'Connection Information' from the 'Setup' menu of the 'Edit' screen. Then
from the 'File' menu, select 'Print'. An example wiring report is shown in Sample Reports on
page 11-1.

Saving/Loading Programs in Binary
To save your test program to disk, select 'Save' from the 'File' menu of the 'Edit' Screen or
press the save toolbar button (disk icon). You should get in the habit of frequently saving your
test program during the editing process. This prevents loss in the event of power-failure or if
the system should malfunction.
Saving/Loading Test Programs in ASCII

The system is designed to normally save test programs in binary format. Binary files are
compact, fast to load and execute. They also cannot be easily modified without use of the test
system, which helps enhance test integrity.
As an alternate, the system allows you to write and read files in ASCII format. An example
test program in ASCII format is shown in Sample Reports on page 11-1.
To save a test program in ASCII, use the 'File' menu of the 'Edit' Screen and select Save As.
This opens a dialog box to allow the file name and destination to be changed before it is
written. The dialog box also has a 'Save file as type:' field to allow the program to be saved in
standard binary format (Test Program) or in ASCII format. Use of the .ASC file extension is a
good choice since it will show in the menu when you want to read it back in (Open File).
This allows you to generate an ASCII file, modify it off-line with an editor, then read it back
in. Note that special attributes (such as failure delay and active test points) are not translated to
and from ASCII. Also, using ASCII input, you can read from a file that has been created
elsewhere. For example, you may wish to use a word processor or spreadsheet to describe an
assembly.
For normal use with the CheckSum software, save the program as 'Type: Test Program',
which is the binary format.
The text file can contain the assembly name, connections, point names, operator instructions,
comments, and test step information for an assembly.
In general, each of the sections is optional and may be placed in any order. However, the point
names must be assigned prior to their use in the 'Test Steps' section of the file.
The file typically has several sections, each of which is optional. Each section is prefaced by a
keyword followed by a colon (:). Valid keywords are NAME:, PIN NAMES:, TEST STEPS:,
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DISPLAYS:, COM:, OPENS: and CONNECTIONS:. Keywords may be entered in either

upper or lower case and must be the only thing on the line.
After each keyword are one or more lines of data applying to the keyword. Valid data includes
the following:
Name: Followed by an assembly name with up to 32 characters.
Pin Names: Followed by one or more lines each of which contains the module (TR-8-1,
TR-6, etc) test point number, a comma, then a point name with up to 255 characters.
Test Steps: Followed by one or more lines, each of which contains 'From' and 'To', type,
range, title, low limit, high limit and nominal value, each separated by a comma delimiter.
The 'From' and 'To' fields can either be a test point number or a point name preceded by a
tilde (~). If a point name is used, it must have been previously defined in the 'Pin Names:'
section. Low and high limits are real numbers in volts, ohms or farads and can not include
alphabetic modifiers such as 'u' or 'k.'
Connections: A list of connections to be verified with the CONT test type. Each line
contains a 'From' test point number, the word 'To', and a 'To' test point number. Optionally
each destination can be followed by a hyphen (-) and another test point number to denote a
range of test point numbers. The second test point number must be larger than the first.
More than one range can be included. For example:
121 to 134-234 270-400
Opens: Same as connections, but used to specify non-connections (opens) to the CONT
test type.
Displays: Followed by one or more lines describing the displays used by the DISP and
DISPE test types. Each line includes the display number, a comma, the row number, a
comma, the column number, a comma, the display itself.
Com: Followed on the same line by an operator instruction (comment). These are read in
order and appended, line by line. As an alternate to 'Com:' you may use an asterisk ('*') at
the beginning of each line.
! An exclamation point is used to start a comment in the ASCII file. Everything after it on
the line is ignored.
Blank lines These lines are ignored. Blanks at the beginning or end of a line are ignored
also.
Note
When reading ASCII files, the system uses commas to separate the input
fields. Therefore, you should not use commas in test titles for the test steps
since this will confuse the system during ASCII input. During ASCII
output, the system converts any commas that it finds in the test titles to
semi-colons.
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Instruction Manual
Chapter 9
Entering Test Steps
Overview
The MDA System is customized for each UUT by writing a unique test program describing the
steps performed on the UUT. The test program can be initially generated with CAD data (see
CAD Data Conversion on page 10-1 for details about this process), or manually entered. The
Edit screen is used for entry and debugging of test programs. The Edit screen is described in
The Edit Test Screen on page 8-6.
This discussion covers the specifics of testing each component on the UUT. The Test Display
on page 6-5 is used to enter and debug a wide variety of test-types that describe each
measurement. This topic describes what test types to use and how to optimize test steps for
most common types of parts. Additional reference information about each test type is included
in Test Type Descriptions on page 18-1.
Toolbar Buttons and Shortcut Keys
In the pull-down menus, shortcut key sequences are often available. These
shortcut key sequences are shown in the menus next to the command. Also,
in many screens, toolbar buttons are available at the top of the screen. The
toolbar buttons can be used as substitutes for frequently used menu items.
By moving the mouse pointer over the toolbar button, then pausing, a 'hint'
will appear that describes what the toolbar button does.
Topics
Using the Edit Screen on page 9-2
Controlling the Test Fixture and Discharge System on page 9-4
Entering Resistor, Inductor and Capacitor Tests on page 9-4
Diode, LED and Zener Testing on page 9-16
Transistor and FET Testing on page 9-17
Switches on page 9-22
Potentiometers on page 9-23
Jumpers on page 9-23
Opens/Shorts Testing on page 9-23
ICs Testing on page 9-29
Entering Test Steps

Transformer Testing on page 9-32
Operator Displays on page 9-33
Controlling Program Flow on page 9-35
Generating Reports from a Test Program on page 9-39
Cable Testing and Wiring on page 9-40
Panelized Testing on page 9-41
Panelization Programming by Wizard on page 9-43
Manual Panelization Programming on page 9-45
Use of Program Memory Locations on page 9-49
Using the Multi-Function Input (MFI) on page 9-51
Instruction Manual

The Edit screen (shown in the following figure) allows you to enter or edit the test steps that
are performed when testing the UUT. Each line describes one test step.
Edit Screen
Test Step Descriptions

Each line in the Edit screen shows a test step type (e.g., CAP for capacitance or RES for
resistance) and a test title that describes the component being tested. The test title can be used
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Instruction Manual
Entering Test Steps

for the component designator (e.g., R201, C3402) and can contain other information (e.g., the
part number). Any text up to twelve characters in length can be entered.
The other fields are dependent upon the test type. For most tests, the high and low limits are
used to describe the analog limits for the test (e.g., 9k and 11 k for resistance tests). The
'To (+)' and 'From (-)' test points describe the test points that are accessed for the measurement.
The range shows the measurement range (e.g., 0 for autorange, 1 for 190 range, etc). The
last two columns show the nominal (expected) measured value for the component, and the last
column shows the measurement that was taken for the test step during the last test execution or
when measure was selected.
Refer to Test Type Descriptions on page 18-1 for the specifics of each test type and its
corresponding information. The range values for normal resistance, capacitance, diode and
inductance tests are computed automatically for you, but for your own interest, these range
values are listed in Test Step Range Values on page 18-5.
You may individually alter each test step field by moving the brackets to the desired area, then
typing the new value that you would like. The System works much like a spreadsheet. You
can move to new lines by using the scroll bar, and from field to field with the four arrow keys
or clicking on the selected field with the mouse.
You can also use the mouse on the left column of boxes on the screen. Clicking on a line
selects it. It turns yellow when selected. Some operations can also be used with a range of test
lines. For example, you can make measurements on a block of lines, or a single line. To select
a block of lines, click on the left blocks of the first and last line, or grab the block on the first
line and drag to the last line.
You can also change the appearance of the Edit screen if you wish. Refer to View Menu on
page 8-11.
Most numeric entries can be entered in scientific notation if desired. For example, 10 M can
be entered as 10000000 or 10000e3 or 10e6 or 1e7. Alternatively, you may enter most
numbers with a p, n, u, m, k or M for pico, nano, micro, milli, kilo and mega.
When you enter a point name, the System searches the point names that have already been
assigned. When it finds a match, the System inserts the point number and point name that
have been found. If a match is not found, the System gives an error message and returns the
original point name. To be found, the entered point name must exactly match the assigned
point name, including upper and lower case.
An alternate way of entering programs is to assign the point names as you go. First, go into
the point-naming (rather than search) mode. To do so, either select the 'Point Name Search'
item from the 'Edit' menu to turn the check off, or enter [Ctrl+O]. In this mode, when you type
in a point name, it assigns the point name that you enter for the test point number that is
already present on the adjacent column. To use this mode, type in the test point number. If
there is no name present for the new number (the name column is blank), move to the name
column and type in the name.
There are a number of advanced features available for manipulating the data in the Edit Screen.
These include cutting, pasting, and moving lines and fields of data. If you want to use these,
refer to the description of the Edit Test Program Screen on page 8-6, paying particular
attention to the 'Edit' menu description.
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If you have one of CheckSum's purely mechanical test fixtures, such as the Model TR-5, and
do not have a Model DM-1 Discharge System, you can skip to the next section. Otherwise you
should read this.
Automated fixture systems require a digital input from the System to actuate the fixture at the
beginning of the test and to release it at the end of the test. The digital input of the test fixture
is connected to the RCA-jack at the backpanel of the TR-8 System Module.
If you have a Model DM-1 Discharge System, it is connected from the D-Sub-25 connector at
the backpanel of the TR-8 System Module. If you have a keypad, it is then connected to the
output D-Sub-25 connector at the back of the Model DM-1. Both DM-1 D-Sub-25 back-panel
connectors are in parallel so you can connect randomly if you wish. The Model DM-1
discharges the UUT prior to connecting it to the test System. This helps prevent damage to the
System test point electronics.
The FIXCT test type is used to control the DM-1 and test fixture. For this command to be
effective, both the fixture system and the DM-1 switches need to be in the 'Remote' position.
During test programming you can engage the fixture and DM-1 manually if you wish by using
this same switch.
At the beginning of the program, enter a FIXCT test-type with a range value of 1. This will
cause the fixture to be actuated. If you have a Model DM-1, use a range value of 9. The 'LowLimit' column specifies how long the system waits for the fixture to engage before continuing
the test. A value of 1000 (mSec) works well for most fixtures but you can adjust it if
necessary.
You can also wire a fixture-down switch into the test fixture. Use of a fixture-down switch is
not necessary for most testing installations, but can be used to ensure the UUT is engaged or to
slightly enhance loading speeds. If you specify the two test points that are connected to the
fixture-down switch in the 'From (-) Point' and 'To (+) Point' columns, and the maximum
resistance in the 'High Limit' column, the system will wait for the switch to close (have less
resistance than the high-limit column), then delay the specified number of mSec, then continue
with the test.
At the end of the program, enter a FIXCT test-type with a range value of 0. This will cause the
fixture to be released and the Model DM-1 (if present) to go back to the protected mode. If
you do not use a FIXCT at the end of the program, the fixture will be released regardless.

Overview
Most of the component tests on a UUT are performed using RESistance, CAPacitance and
INDUctance test steps. All of these test steps are programmed in a similar fashion.
First, the test step is entered using the Edit screen. This screen is accessed by selecting 'Edit
Test' from the System screen. Entry of the test step can also be performed with use of the CAD
conversion on page 10-1.
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Inserting the Test Step and Making the Measurement below
Measurement Analysis on page 9-6
Choosing a Range/Function on page 9-7
Measurement Polarity on page 9-10
Measurement Delays on page 9-10
External Sense on page 9-10
Parallel Components on page 9-11
Guarding on page 9-11
Using Measurement Offsets on page 9-12
Using Measurement Gain Factors on page 9-12
Dynamic Measurement Analysis on page 9-13
Calculation Model on page 9-14
Capacitor Measurement Bias on page 9-14
UUT Charging/Discharging Problems on page 9-14
Third-Terminal Biasing on page 9-15
Measuring One Point to Many Points on page 9-15
Inserting the Test Step and Making the Measurement

To insert a new test line, move the cursor to the line just above the insertion point and press the
Insert key. On the new line:
1. Move to the 'Test Type' column, then type in RES for a resistance test, CAP for a
capacitance test, or INDUC for an inductance test.

2. Next, enter the test points that you wish to measure between. You can either move to the
'Point' columns and enter the test point numbers, or you can move to the 'Name' columns
and enter the test point names.
3. Move to the 'Title' column and enter the name of the component that you are measuring
(e.g., R101 or C12).

4. Next, move to the nominal value column, and type in the nominal value for the
component.
Once you have typed in the nominal value, you can select 'Set Initial Limits/Range' from the
'Measure' menu, then the System will assign default upper and lower test limits and an initial
measurement range for you. If you are not satisfied with the values that have been entered,
you can type in different ones or change the defaults for automatic tolerance assignment.
Select 'Make Measurement' from the 'Measure' menu to have the System take a measurement.
If the measurement shown in the 'Meas' column is well within the test limits and seems
repeatable as you make measurements, you are done with this test and can move to the next
component.
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Measurement Analysis
Overview
Use the Edit Test Program window Measure > Step Analysis [F6] menu selection to fine-tune
measurements that are not as expected. The Measurement Analysis window is shown in the
following figure.
Measurement Analysis Display
The center portion of the Measurement Analysis display shows the result of measurements
using each of the ranges and functions that are available from the System. You can use the
arrow keys to move from range to range, then select 'Single Measurement' [F3] from the
'Measure' menu to make a measurement, 'Group Measurement' [Shift+F3] from the 'Measure'
menu to refresh all measurements, or 'Continuous Measurement' [Alt+C] to loop on the
measurement. The first three toolbar buttons can also be used.
Most often, there will be more than one function/range that will take a measurement close to
the proper value. If only one range takes a close reading, the System may be taking the right
reading, but for the wrong reason.
You will often need to choose between different measurement techniques that give similar
readings in the Measurement Analysis display. By carefully choosing methods, you can
optimize speed or accuracy or choose a balance of the two that you are comfortable with. To
help make this choice, the System offers the ability to display speed and variation statistics for
each measurement type. To display these statistics, select 'Statistics' [F7] from the 'Measure'
menu. The System will display the average reading (mean value), the average measurement
time (in mSec), and the standard deviation of the measurement. The 3-sigma value displayed
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(it is 3 times the standard deviation) shows the measurement variation using this technique that
would contain 99.7% of the measurements on this UUT.
The Measurement Analysis screen allows a host of capabilities. Those most-often used to
solve measurement problems are discussed in this section. The tab on the lower portion of the
window allows the Nominal Fit values to be setup. For more information on setting up the
nominal fit values, see Using Measurement Offsets on page 9-12 and Using Measurement
Gain Factors on page 9-12.
If you performed CAD conversion on page 10-4 and created a Fixture Wiring Report File,
then you can use the Setting > Point Information menu item in the Measurement Analysis
screen to find the test point number, net name, and the test system interface block where a
component is connected. The first step is to specify the Fixture Wiring Report File name
(created during CAD conversion), then enter the Point Name of interest and press the Search
button.
Once you have used the Measurement Analysis window to determine the best way to take the
measurement, select the measurement method that you choose to use, then press the [ESC]ape
key, Measure > Exit on the menu bar, or the Green Door toolbar button to return to the Edit
screen. When you do so, the System will automatically generate the proper range value and
save the settings that you have determined while in the Measurement Analysis window. Use
the Measure > Revert and Exit [F10] on the menu bar or the Red Door toolbar button to return
to the Edit window without making any changes to the measurement method.
Choosing a Range/Function
Following are some guidelines for choosing range/functions that are likely to be successful in
taking good measurements.
Resistance on page 9-8
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Capacitance below
Power Supply Capacitors below
Polarized Capacitors on page 9-9
Small Capacitors on page 9-9
Inductance on page 9-9
Resistance
For measurements up to 1.9k, select DC constant-current function:
0-10
DC constant-current function, 10mA/0.2V range
10-100
DC constant-current function, 10mA/2V range
100-190
DC constant-current function, 1mA/0.2V range
190-1.9 k
DC constant-current function, 1mA/2V range
Above 1.9k select Voltage mode, (DCV, 2V or 0.2V range) or DC constant-current function
(ranges shown are the highest reading for range before overrange occurs):
1.9 k ranges:
1mA/2V or 0.1mA/0.2V
19 k ranges:
0.1mA/2V or 10A/0.2V
190 k ranges:
10A/2V or 1A/0.2V
1.9 M range:
1A/2V or 0.1A/0.2V
19 M range:
0.1A/2V
If there are diodes in parallel with the device being measured, you will probably need to use a
.2V measurement range to prevent the parallel diode from clamping the stimulus and creating
an incorrect result.
Capacitance
Range
Recommended Measurement
0-.01F
Voltage mode, 10kHz, 0.2 or 2V range
.01-10F
Voltage mode, 1kHz, 0.2 or 2V range
10F or more
Voltage mode, 100Hz, 0.2 or 2V range
(see section about dynamic analysis for proper range selection).

Power Supply Capacitors
UUTs normally have a several capacitors in parallel across the power supplies. Usually it is in
the configuration of one large cap (10-15F) with a number of small decoupling caps (.05F-
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2F each). This is an unguardable configuration since they are all directly in parallel. As
such, the System must measure them all at once and cannot detect a missing decoupling cap
since the tolerance of the large capacitor is usually much greater than the values of the small
capacitors. The System will, however, detect if any of these parallel caps are shorted or the
large capacitor is the wrong value or missing.
Polarized Capacitors
Polarized capacitors can be measured for value using the basic MDA Systems.
Under certain circumstances the polarity of capacitors larger than 200F may be measurable.
The typical technique used is to apply a voltage across the capacitor for a predetermined time
and then measure the leakage current flow. Because polarized capacitors typically exhibit
higher leakage when charged near their rated voltage, but with incorrect polarity, this
technique may offer good discrimination.
However, in many circuits the variation in current draw of surrounding circuitry may mask the
effects of a reversed capacitor.
Small Capacitors
While most capacitors can be readily measured in-circuit, smaller capacitors (less than about
200 pF) can be a problem. The only viable measurement method for these capacitors is use of
1 kHz and above voltage-method. Readings taken using other frequencies or methods are very
unlikely to be valid (even though it is possible that they may give the correct reading while you
are programming).
In many cases, the capacitors are in parallel with components (such as an IC leg) that have
much higher capacitance. In this case, providing an offset for the larger value is likely to cause
a problem. In most cases, if it is necessary to offset a small capacitance reading by more than
about 150pF, you are likely to have unreliable testing once you have placed the program in
production.
In other cases, parallel signal paths can cause the reading to be unstable. By examining the 3sigma results of the reading, you can determine whether testing of the capacitor in the
particular UUT is viable. While the CheckSum system does an exemplary job of testing
isolated capacitors, you need to determine the testability of each small capacitor in a circuit
individually. In many cases, values less than about 200pF cannot be reliably tested.
Inductance
Range
Recommended Measurement
0-1mH
Voltage mode, 100kHz, .2 or 2V range
1-10mH
10-100mH
100mH or more
Voltage mode, 100Hz, .2 or 2V range
Note
Use 4-terminal connections for less than 100H.
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Measurement Polarity
By selecting the 'Reverse Polarity' [F4] selection of the 'Measure' menu, you can reverse the
polarity of the measurement and try measurements in the opposite polarity. In some cases,
changing polarity can help make more effective measurements by eliminating parallel diode
paths or reducing guarding ratios. Once you have changed polarity, make some new
measurements to see whether the new polarity works better.
Measurement Delays
Sometimes DC-voltage and DC-current measurements can be improved by adding a delay to
the measurement. By selecting 'Delay' [F8] from the 'Setting' menu or clicking on the delay
box in the lower right corner of the Measurement Analysis screen. You can then enter a delay
time number (in mSec) that requests that the System apply stimulus then wait the specified
time before making the measurement. This allows time for parallel capacitances to charge. If
you are having trouble with a measurement, try adding 500mSec delay to see if the readings
improve. If they improve, adjust the delay time up or down until you get an appropriate
reading with the minimum amount of delay time. If you apply a negative delay number, the
System will discharge the test points for the specified number of mSec.
External Sense
For components that are low impedance, measurements can be improved by using external
sense (Kelvin, 4-terminal) wiring. This technique significantly improves reading for
capacitors that are greater than 1000F, inductors that are smaller than 0.1mH, and resistors
that are less than 15. External sensing is optional for most measurements, but it is necessary
in order to take good inductance readings in the H region.
External sensing works by using two test points to carry the stimulus current to and from the
component being measured. Two other test points are used to sense the voltage at the
component being measured. By sensing the voltage with these additional high-inputimpedance test points, the effects of voltage drops in the cabling and connections are
eliminated. See Theory of Operation on page 16-1 for more details about external sensing.
If you do not specify external sense, the System automatically externally senses on the UUTside of the System's solid-state switching, but internal to the tester. Because of this, the
System compensates for the impedance of the switching, but not for the series resistance of the
cabling, fixturing, and test electronics module wiring. During System self-test/calibration, the
resistive offset to the end of the ribbon-cables is measured and the value automatically
subtracted from measurements if external sensing is not specified.
External sense points can be wired to the same probes as the measurement points, or better yet
to additional probes on the same networks. In some cases, you can use other existing probes
on the UUT as external sense or source points, even if they are not directly at the desired point.
To tell the software that you are using external sensing, move to the locations just below the
measurement point description in the upper left corner of the Measurement Analysis screen.
Type in the external sense test point number just below the point that you are external sensing.
You can externally sense either or both of the measurement test points.
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Parallel Components
Many times in-circuit testing requires measurement while parallel components are present.
In some cases the effect of parallel components can be reduced or eliminated with the use of
guarding. For more details, see the section below about guarding.
Sometimes the components can be measured separately because they are of different types.
For example, using DC-V or DC-constant-current can measure a resistor or diode in parallel
with a capacitor if time is given for the capacitor to charge.
Complex-impedance measurements (measurements using AC stimulus with the CheckSum
System) can differentiate different impedance types if the impedances are similar. For
example, in some cases the System can individually measure a cap and a resistor that in
parallel and differentiate them because of the impedance phase difference.
Guarding
Often times, in-circuit measurements involve parallel impedances that cause the reading to be
incorrect. To correct for this, the System provides the ability to guard out these parallel
impedances. The theory of guarding is discussed in Current Guarding on page 16-4 and
Voltage Guarding on page 16-8.
Guarding can be used when there is parallel impedance across the measurement path, and there
is a test point in the middle of this impedance. The System sources or sinks current from each
guard point so that the current from parallel paths into the measurement points is eliminated.
The value of current into each guard point is automatically determined by the System so as to
optimize individual guard point performances.
You can add or delete guard points in the Measurement Analysis screen with the Insert and
Delete keys. Below each guard point is an entry area for specification of an external sense
point for the guard point. Use of this sense point can provide improved measurement accuracy
on guarded measurements, using the same theory as discussed in External Sense on page 9-10.
In few cases, however, is it necessary to externally sense guard points.
Guard points are generally inserted one component away from the component being measured.
For the constant-voltage technique, choose points that are one component from the From (-)
test point. For the constant-current technique, choose points are one component from the To
(+) test point. You should also try guarding the ground and/or power supply test points since
they are often effective to improve measurements.
You can guard impedances that are up to about 1/100 of the impedance of the measured
component. Changing the polarity or method (constant-voltage vs. constant-current) of
measurement can often improve the guard effectiveness by minimizing the necessary guard
ratio. In most cases where guarding is necessary, only one or two guard points are sufficient to
achieve the proper measurement.
One easy guarding technique that often helps is to initially try ground and power supply points
as potential guard points. If one of the leads of the component that you are measuring is
connected to ground or one of the power supplies, do not use it as a guard point.
Guarding is normally specified by entering one (or a few) guard points. However, in some
cases you may want to guard all of the points, with the exception of a few. Specifying a first
guard channel value of 1624 specifies this function. When 1624 is specified, the System will
guard all test points except:
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Instruction Manual
a. Those directly used in the measurement,

b. The main measurement external sense points, and
c. Any other specified guard points or guard sense points.
Bias voltages or currents within this step, or previously requested via DCV, SINE, SQRV and
EXTIO test steps are not active when guard-all measurements are used. Guard sensing using
the channel 1 guard sense and external sensing of the measurement points are still available.
The System includes an automatic guard algorithm, but most experienced users find it quicker
and most effective to interactively determine the guard points.
Using Measurement Offsets

Because of the residual resistance, capacitance and inductance of the fixturing, sometimes it is
necessary to offset the measurements. The System provides the ability to specify a value that
is added to each measurement for this purpose. This is most often used when measuring small
capacitors under about 500 pF. Typical offset values are 30-100pF depending on the fixture
and UUT. It can also be useful for small resistance values, but remember that for resistance it
is not as good as using external sensing. To enter the offset, select 'Enter Offset' (press
[Alt+F2]) in the Measurement Analysis screen, then type in the value that you would like to
subtract from the reading. Note that you can observe the value by selecting the 'Nominal Fit'
tab in the 'Measurement Analysis' screen.
For example, if you are measuring a 100pF capacitor and the readings are 160pF, type in 60pF
to correct the reading. Alternatively, you can select 'Fit Zero (press [Alt+F5]) to have the
System automatically determine and assign the offset value necessary to obtain the nominal
value from the reading range that is presently selected. With use of the 'Measure Offset' item
in the 'Tools' menu of the editor, you can have the System measure all of the offsets for the test
program, but most often you are also offsetting some residual impedance of the UUT as well,
so it is most effective to do offsetting on a step by step basis.
If excessive offset is required, you might suspect fixture wiring errors or parallel circuit paths
of the UUT. To confirm that the System is correctly measuring the proper component, you can
try clip-leading in a parallel component and see if the measured value changes by the
appropriate amount. For example, if you are measuring a 10 k resistor, try clip-leading
another 10 k resistor and see if the value changes to approximately 5 k.
Using Measurement Gain Factors

In some cases, you may wish to multiply the measured value by a factor to determine the
displayed measured value. For example, you may have an unguardable component that you
want to correct or you want to display in m in place of by multiplying the measurement by
1000. The System provides the ability to specify a value that is multiplied by the measurement
for this purpose. The default gain factor is, of course, one.
To enter the gain, select 'Enter Gain' (press [Alt+F3]) in the Measurement Analysis screen,
then type in the value that you would like to multiply to the reading. Note that you can
observe the value by selecting the 'Nominal Fit' tab in the 'Measurement Analysis' screen.
The gain factor is applied after applying the offset. The formula is:
Final Value = (Measured Value minus Zero Offset) Gain Factor
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For example, if you are measuring two 10K resistors in parallel, you can enter a gain factor of
two, and the reading will be displayed as 10K even though it is reading at the hardware-level
5K. Alternatively, you can select 'Fit Gain (press [Alt+F11]) to have the System automatically
determine and assign the gain value necessary to achieve the nominal value from the reading
range that is presently selected.
Dynamic Measurement Analysis

As a tool to aid test generation, the Dynamic Point Analysis screen allows you to view the test
signal that is being used to make the measurement. To obtain the Dynamic Point Analysis
Screen, shown in the following figure, select 'Dynamic Analysis' from the 'Measure' menu.
Dynamic Point Analysis Screen
This screen helps determine the optimum range to use and allows you to see if the
measurement point has unique characteristics. The dynamic point analysis screen is like an
oscilloscope that measures voltage versus time during the measurement.
The Dynamic Point Analysis screen shows information about measurements taken on each
measurement range. The top row and lower left show plots of measurements using the
constant-current measurement method. The lower right corner shows two plots when using the
voltage mode at 100 Hz.
Under normal measurements of resistance and capacitance, each constant-current graph will be
a straight line. If the line is horizontal, the measurement is purely resistive. If the line is
vertical, it is an indication that the point has little or no capacitance or is overrange for
resistance on that range.
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If the line is angled, there is a capacitive component of the measurement. The more capacitive
the measurement, the more horizontal the line will be. If the graph is curved, it is an indication
of a point with capacitance and resistance combined.
Each plot has two lines, one for the 200 mV output range, and the other for the 2 V output
range. The reading that would be obtained by each output voltage is shown below the graph.
If you have a color monitor, the System plots the graph in the same color as the writing as
appropriate for the output voltage range.
The vertical scale is 2 V for the 2 V output range yellow traces and 200mV for the 200mV
output range green traces. The horizontal scale is 100 mSec. When measuring capacitance
when using the DC-I method, the System calculates capacitance values based on the rise time
of the graph.
For capacitance measurements, choose the range where the graph shows a line that is nearest to
a 45-degree angle. The System computes the capacitance from the slope of the line.
Therefore, if the line is almost vertical or almost horizontal, the measurement is near the
extreme of the range and may not be accurate.
The two graphs in the lower right-hand corner show the AC-stimulus signal measured across
the UUT when using the AC-voltage measurement. One is shown using the 2 V output range
and the other on the 200mV output range.
Under normal circumstances these plots should be sine waves. If they are distorted, it is an
indication that the circuitry surrounding the connected component is causing the circuit to be
polarity-sensitive. This can occur with diodes in surrounding circuitry, particularly when using
the 2 V output range. If the wave is distorted, the measurement is likely to be in error.
Calculation Model
When using the ac-voltage measurement System for capacitance measurements, the MDA
automatically makes certain assumptions about the circuit being measured. Based on the value
of the component being measured, it assumes that the circuit is either a series or parallel RC
configuration. By selecting clicking on the 'Swap Model/Norm Model' button on the 'Nominal
Fit' screen, you can change this calculation assumption. In some UUT circuit configurations
this can significantly improve the readings.
Capacitor Measurement Bias

When using the ac-voltage measurement system, the source signal is bipolar. In some cases,
such as when measuring a large capacitor in parallel with diodes, the reading can be improved
by applying a bias to the stimulus signal. If the reading is biased, the stimulus can be forced to
be all positive or all negative. Biasing is selected with the 'Neg Offset/Pos Offset/No Offset'
key in the 'Nominal Fit' screen.
UUT Charging/Discharging Problems

Sometimes, particularly with UUTs that have large capacitors, you may determine
measurement methods that work well individually, but when you run the test, fail. This can be
the result of the UUT being charged up from the measurement stimulus of previous tests.
These types of problems can often be solved by changing the polarity of measurements,
changing the type of measurements from DC to AC, or by inserting discharge steps in the test
program. If you have a problem step, try inserting a DISCH 100 7 test step just prior to it.
This will connect all of the test points together for 100mSec to allow them to discharge. If this
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solves the problem, you can change the delay time up or down to optimize speed/performance.
You can also insert a negative delay time to the individual test step. This will cause the two
test points used in the measurement to be discharged for the specified number of mSec prior to
the measurement.
Third-Terminal Biasing
The System allows you to apply an independent stimulus to a third point during a resistance
test. This can be used, for example, to drive the gate of a FET while measuring resistance
between the source and the drain. The stimulus can be either a constant-current or constantvoltage, both referenced to chassis ground of the test System.
To specify this function, select 'Bias Point' from the 'Setting' menu, then type in the test point
number. Then, select 'Bias Amplitude' from the 'Setting' menu and enter the amplitude. If you
enter a number from -10 to +10, it specifies a dc voltage stimulus. If you specify 'm' as the
units, the entry is taken as a constant-current. Valid entries are from -1m to +1m, which
specify from -1 (sinking) to +1 (sourcing) mA of current in the third-terminal test-point.
Measuring One Point to Many Points

The System allows you to measure from one point to a number of other points with a single
measurement. This can be used, for example, if you want to see if a point is isolated from a
group of other points with a single measurement. This type of measurement can be specified
to be RESistance, CAPacitance, INDUCtance or equivalent JMP test types.
There are two ways to specify this type of measurement. In the first case, you specify from
one point to all other points minus a few. In the second case, you specify from one point to a
range of test points, or to two ranges of test points. In both cases, you program the step just as
you would a normal step, including use of external sense, then use the guard points to specify
the additional points to be included or excluded.
For measuring from one to many others connected to source high side (with a few
excluded), assign the first guard to be number 1623. Then, list the points that you want
excluded as the other guard and guard-sense points. When you have programmed the step
this way, the System measures from the 'From (-)' point to the 'To (+) Point' that is
connected to all other points except those listed as guard points, external sense points, and
the 'From (-)' point.
For measuring from one to a range of points, assign the first guard to be number 1622.
Then, list the range of points to be measured to as guard 2 (first point) and guard 3 (last
point). If you want to specify another range of points, use guard 4 (first point) and guard 5
(last point). When you have programmed the step this way, the System measures from the
'From (-)' point to the 'To (+) Point' that is connected to the range(s) of points specified
with the guard points.
For measuring from one to many others connected to the source low side, assign the first
guard to be number 1621. Then, list the points you want excluded as the other guard and
guard-sense points. When you have programmed the step this way, the System measures
from the 'To (+)' point to the 'From (-)' point that is connected to all other points except
those listed as guard points, external sense points, and the 'To (+)' point.
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Overview
Diodes, LEDs and zener diodes are tested by applying a constant current, then measuring the
voltage across the component being tested. Using this technique ensures that the device is
present, is installed in the proper polarity, and is not shorted.
Diode/LED Testing
For normal diodes and LEDs, the anode of the diode/LED is connected to the 'To (+)' test point
and the cathode of the device is connected to the 'From (-)' test point. As a default range (2),
the System applies 1 mA to the diode. Most diodes measure about .6V junction voltage in this
case. LEDs measure approximately 1V typically.
Zener diodes are measured with the cathode connected to the 'To (+)' test point and the anode
connected to the 'From (-)' test point. The TR-8 System can measure up to 9.9V when using
stimulus up to 10mA with the DIODE test-type, and up to 18V at 10mA with the ZENER testtype.
In some circuits, 10 mA (or even 100 mA) may not be sufficient current to bring a zener diode
to its zener voltage. In this case the best alternative is to reverse the polarity and test the zener
as normal diodes.
Both 2V and 10V ranges are available for standard diode/LED testing. You can use the
Measurement Analysis and Dynamic Analysis screens to determine the proper measurement
range.
In some cases, a delay is necessary to allow parallel capacitors to charge prior to making the
measurement. The delay is inserted via the 'Delay' item in the 'Setting' menu in the
Measurement Analysis screen.
After inserting a DIODE test type, select 'Reverse Polarity' from the 'Measure' menu than make
another measurement to ensure that the reading changes to a fail condition as a result of the
incorrect polarity. Then return the reading back to the proper polarity.
Zener Diode Testing
Zener diode testing is similar to testing normal diodes, except the test polarity is reversed, and
the breakdown voltage is measured rather than the forward junction voltage.
When testing zener diodes up to approximately 9 volts that can be stimulated with 10mA or
less, use the DIODE test type as specified in the previous section. The DIODE test will
measure up to 9.9 volts, but you need to allow a little extra measurable voltage range above the
high test limit so that the test will fail on the high side before it goes into overrange.
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Entering Test Steps

For zeners that are up to 18 volts (including the measurement safety zone discussed in the
previous paragraph), you can use the ZENER test-type. With this test type, you simply enter
the two test points (observing stimulus polarity as shown at the top of the 'To (+)' and 'From ()' columns), the nominal, and the high and low test limits. The range column can be used to
specify a delay, in mSec, to allow the stimulus to charge up parallel circuitry before the
measurement is made. The System knows from the test point numbers that you have specified
whether you are connecting to the PWR-1. Based on this, it either applies 10 mA or 100 mA
as appropriate for the stimulus hardware.
After inserting a ZENER test type, select 'Reverse Polarity' from the 'Measure' menu than
make another measurement to ensure that the reading changes to a fail condition as a result of
the incorrect polarity. Then return the reading back to the proper polarity.

Overview
Your System can check for transistor presence by testing the B/E and B/C junctions as diodes.
When using this technique, you can use the DIODE test type to test the junction between the
base and the collector (for NPN transistors, connect the base to the 'To (+)' test point and the
collector to the 'From (-)' test point.
Next, use the DIODE test type to test the junction between the base and the emitter (for NPN
transistors, connect the base to the 'To (+)' test point and the emitter to the 'From (-)' test point.
For PNP transistors, reverse the connection polarity. Typical test tolerances are .4V for the
Low-Limit and .8V for the High-Limit.
Often transistors have pin-outs have the base in the center position. In this case, with the
DIODE testing method, the System will not normally detect reversed parts. To determine if
the transistor is reversed requires use of the following techniques.
A more comprehensive test for three-terminal devices, such as FETs and transistors, is done
with an active test of these components. This testing can help detect incorrect or incorrectly
installed parts. Beta testing is performed with the UUT powered down, except for the
measurement signals applied to the part being tested.
Note
The effectiveness of the Beta test can be limited if low-impedance parallel
circuitry is present in the UUT.
In the case of transistors, the System performs the test by applying a voltage-limited constantcurrent (10mA) between the collector and emitter. The base is then swept (in 4A steps) with
a constant-current signal that can range from -1mA to +1mA. When a self-learn occurs, the
System monitors the collector voltage and determines the voltage threshold point at which the
transistor turns on. The high and low test limits reflect the acceptable limits of base bias
current to obtain this collector output voltage. At test time, the System ensures that the base
current at this switch-over threshold point is within the test limits.
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In the case of FETs, the System performs the test by applying a voltage-limited constantcurrent (1mA) between the source and drain. The gate is then swept (in 80mV steps) with a
voltage signal that can range from -10V to +10V. When a self-learn occurs, the System
monitors the source voltage and determines the voltage threshold point at which the FET turns
on. The high and low test limits reflect the acceptable limits of gate bias voltage to obtain this
source output voltage. At test time, the System ensures that the gate voltage at this switch-over
threshold point is within the test limits.
Note
For user clarity in test results, this test-type is named Beta to indicate
performance testing of transistors and FETs. However, the measured value
is shown as bias rather than beta. For transistors, the beta is actually 10mA
divided by the bias current. In-circuit beta values of transistors are usually
different than isolated transistor beta measurements.
Related Topics
Programming a Beta Test below
Programming a Beta Test

FET/transistor testing is performed with the Beta test-type. The Beta test type is entered using
the Edit screen, like any other standard test, with additional information entered in a lowerlevel screen. The parameters entered from the Edit screen are shown below:
Parameter
Description
Test Type
BETA
From (-) Point
The more-negative current terminal of the device:

PNP Transistor = Collector
NPN Transistor = Emitter
P-FET = Drain
N-FET = Source
To (+) Point
The more-positive current terminal of the device:

PNP Transistor = Emitter
NPN Transistor = Collector
P-FET = Source
N-FET = Drain
Range
The type of component being tested:

1 = NPN Transistor (add 8 to this to do a fast mode sweep)
2 = PNP Transistor (add 8 to this to do a fast mode sweep)
3 = N-FET
4 = P -FET
Title
Used to describe the component being tested, such as Q203 or Q1003.
Low Limit
Most negative acceptable current bias (or for FETs, gate voltage). For transistors, the
lowest measurable bias value is -1 mA. For FETs, the minimum measurable value is 10 V. PNP transistors will typically have negative values. NPN transistors will typically
be positive values.
High Limit
Most positive acceptable current bias value (or for FETs, gate switch-on voltage). For
transistors, the highest measurable bias value is +1mA. For FETs, the highest
measured value is +10V. To enter a value higher than the System can measure, type
in 20M or O_Rng. This value, displayed as O_Rng, is greater than any normally
measured value, and will never cause a failure on the high side.
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Entering Test Steps

The following figure shows the test point connections for each typical type of device tested
with the Beta test-type.
To (+) TP
Bias TP
Bias TP
NPN
To (+) TP
Bias TP
PNP
From (-) TP
From (-) TP
To (+) TP
To (+) TP
N-FET
From (-) TP
Bias TP
P-FET
From (-) TP
Device Test Point Connections for Beta Test
When the Beta test type is entered, select 'Step Analysis' from the 'Measure' menu to obtain the
Beta Analysis screen shown in the following figure.
Beta Analysis Screen
The plot shown on the Beta Analysis Screen reflects the collector/source signal on the vertical
axis, and the bias signal on the horizontal axis. This plot is generated when a self-learn of the
device is selected with use of the 'Self-Learn' choice in the 'Measure' menu, or a measurement
is taken with the 'Measure Points' selection of the 'Measure' menu. The flashing cursor is
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shown at the point on the vertical plot that the System is using as the threshold voltage for
determination of switch-on.
The left of the display shows the connection points for the UUT, the last measured value, and
the high and low test limits. The measured value shows the bias value (in V or mA) at the
point that the device being tested turns on.
To program the device (from the Beta Analysis Screen), perform the following steps:
1. Click on the 'Base/Gate' entry box to enter the test point used for the third terminal (base or
gate).
2. If you haven't already entered a range from the Edit screen, use the 'Device Type' box to
select the appropriate type of device being tested. You can choose from NPN transistor,
PNP transistor, N-FET and P-FET.
3. Select 'Self-Learn' from the 'Measure' menu to have the System self-learn the device.
4. Repeatedly select 'Measure Points' from the 'Measure' menu to make individual
measurements. While doing so, observe the measured value to ensure that the readings are
consistent.
5. Select 'Set Limits' from the 'Measure' menu to assign default low and high test limits. This
sets limits at +/-20% of the full range for the device-type. These limits work well in most
applications, however you can type in new values if you wish.
6. Select the green door to return to the Edit screen.
In most cases, this process will cause the System to properly program the device being testing.
You can also specify a delay time that occurs between sweep samples while measuring Beta.
The delay time is specified in mSec. A small delay may help make more effective
measurements if significant parallel capacitance is present between any of the device leads. If
you specify a negative delay time, only the first measurement is delayed by the specified time.
In order to optimize testing speed for transistors, you are allowed to enter a 'Sweep Group',
which can consist of sweep-linear or sweep-fast. The fast mode does a binary search to find
the transistor switching point and generally finds this point faster than a linear search.
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Entering Test Steps

Opto-isolator testing is performed with the Opto test type. The Opto test type is entered using
the Edit screen, like any other standard test, with additional information entered in a lowerlevel screen. The parameters entered from the Edit screen are shown below:
Parameters
Description
Test Title
OPTO
Title
Description of measured component (e.g. U11)
Range
Not used.
From (-) Point
Opto-isolator output transistor emitter
To (+) Point
Opto-isolator output transistor collector
Low Limit
Low test limit in Amps
High Limit
High test limit in Amps
When the Opto test type is entered, select 'Step Analysis' from the 'Measure' menu to obtain
the Opto-isolator Analysis screen shown in the following figure.
Opto-isolator Analysis Screen
The plot shown on the Opto-isolator Analysis Screen reflects the collector signal on the
vertical axis, and the diode current on the horizontal axis. This plot is generated when a selflearn of the device is selected with use of the 'Self-Learn' choice in the 'Measure' menu, or a
measurement is taken with the 'Measure Points' selection of the 'Measure' menu. The flashing
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Switches
Instruction Manual
cursor is shown at the point on the vertical plot that the System is using as the threshold
voltage for determination of switch-on.
The left of the display shows the connection points for the UUT, the last measured value, and
the high and low test limits. The measured value shows the current (in mA or A) at the point
that the device being tested turns on.
To program the device (from the Opto-isolator Analysis Screen), perform the following steps:
1. Click on the diode input (anode), top entry box, to enter the test point used for the input
current.
2. Click on the diode input (cathode), bottom entry box, to enter the test point used for the
return current.
3. If you haven't already entered the From (-) and To (+) Points in the Edit screen, click on
the top entry output box, to enter the test point used for the opto-isolator transistor
collector. Click on the bottom entry output box, to enter the test point used for the
transistor emitter.
4. Select 'Self-Learn (F5)' from the 'Measure' menu to have the System self-learn the device.
5. Repeatedly select 'Measure Points' from the 'Measure' menu to make individual
measurements. While doing so, observe the measured value to ensure that the readings are
consistent.
6. Select 'Set Limits (F9)' from the 'Measure' menu to assign default low and high test limits.
These limits work well in most applications, however you can type in new values if you
wish.
7. Select the green door to return to the Edit screen.
In most cases, this process will cause the System to properly program the device being testing.
You can also specify a delay time that occurs between sweep samples. The delay time is
specified in mSec. A small delay may help make more effective measurements if significant
parallel capacitance is present between any of the device leads. If you specify a negative delay
time, only the first measurement is delayed by the specified time.
Switches
Switches are tested using the SWCHR test type. You can choose to measure the normallyopen or normally-closed contacts of the switch. If the switch test fails, the System prompts the
operator to change the position of the switch. Once the operator does so, the test automatically
continues. The range used for SWCHR test types is exactly the same as for the RESistance
test type.
To test normally-open (NO) switch contacts, you would typically use a range of 1, a low-limit
of 25, and a high-limit of 20M or O_Rng. This high-limit value, displayed as > 19 M, is
greater than any normally measured value, and will never cause a failure on the high side. An
over-range measurement is shown as O_Rng in the measured value.
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Potentiometers
To test normally-closed (NC) switch contacts, you would typically use a range of 1, a lowlimit of 0, and a high-limit of 25.
Potentiometers
Potentiometers are tested using the POTR on page 18-17 test type. This test type makes
measurements exactly like the RESistance test type, but also has some special capabilities. If
the test fails, the operator is presented with a message and graphical display (a metermovement) that allows him to interactively make the measurement.
Once the adjustment is complete, the operator presses a key to continue with the test.
The POTR test has a number of options available. For example, you can force the operator to
adjust the potentiometer in all cases (not just when it fails) by including an '@' in the test title.
If you would like to have just a digital read-out on the screen without the analog meter display,
put a '^' in the test title. If you put an '&' in the test title, the System will reverse the polarity of
the meter movement. With this tool you can change the polarity of the meter-movement on the
screen so that the needle always moves in the direction of adjustment so it is more intuitive and
consistent to the operator.
Jumpers
Jumpers are tested using the JMPER on page 18-17 test type. You can choose to measure
normally-open or normally-closed jumpers. If the jumper test fails, the System prompts the
user to change the position of the jumper. Once the operator does so, the test automatically
continues.
The range used for JMPER test type is exactly the same as for the RESistance test type.
To test normally-open jumpers, you would typically use a range of 1, a low-limit of 100, and a
high-limit of 20M or O_Rng. This high-limit value, displayed as > 19 M, is greater than any
normally measured value, and will never cause a failure on the high side. An over-range
measurement is shown as O_Rng in the measured value.
To test normally-closed jumpers, you would typically use a range of 12, a low-limit of 0, and a
high-limit of 100.

Overview
The test System allows you to test the entire UUT for opens and shorts with use of a single
CONTinuity test step. Although opens and shorts data can be manually entered, this data is
usually self-learned by the System from a known-good UUT.
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During the programming process, most people generate the continuity and ICs tests as the last
step of the programming process. That way, you don't need to execute them repetitively
during debug of the other programming steps.
Sequence-wise, continuity tests should be inserted into the test program after the
potentiometers, switches, and jumper tests are performed. Testing these other components first
gives that best diagnostic errors and prevents false continuity testing errors.
In most cases, fixtures are wired with one probe per electrical network, so most of the faults
found will be shorts. This is acceptable since circuit board opens are generally not created as
part of the assembly process, and most bare boards are separately tested prior to assembly. If it
is important for you to find circuit board opens, you need to install probes at each end of the
traces on the circuit board. If probes are located at edge-connector points, opens can be
detected as components are tested from these test points.
Related Topics
Entering the Continuity Test Step below
Setting the Continuity / No-Care Information on page 9-26
Setting Active Points on page 9-27
Learning the Continuity Map on page 9-27
Assigning Continuity No-Cares on page 9-28
Assigning Continuity Thresholds on page 9-29
Entering the Continuity Test Step

To enter a continuity test, insert a CONTinuity test type using the Edit screen. The Test
System allows you to test the UUT for opens and shorts with use of a CONTinuity test step.
Although opens and shorts data can be manually entered, typically this data is self-learned by
the System from a known-good UUT, then saved with the spec data on disk for future use.
The Continuity / No Care Information window can also be used to activate or inactivate MDA
test points. If a point is inactive, continuity connections to it are not self-learned or tested.
Inactivating contiguous blocks of unused points can cause the System to operate more quickly.
Using a Range value of 1 with a continuity measurement causes continuity to run slightly
slower but guarantees that any voltage sources on inactivated points, such as batteries, will not
effect the continuity measurement. Two filled triangles left of the left column point number
show a point to be active.
In addition to specifying a connection list between points, you can also specify no-care
connections between point pairs. In the Continuity / No Care Information window, the tab at
the bottom of the window toggles the table between continuity and no-care connection lists
(the tab color is gray when selected). A no-care connection ignores an open or short between
two specific points. Other connections involving the points are still tested for correctness.
This contrasts to making a point inactive, which removes testing of all connections involving
the point. The use of a no-care connection allows the continuity test to disregard a point to
point connection, such as a jumper connection, that may vary from one UUT to another and
which is not a concern. Using self-learn to learn a single board then adding no-cares to
disregard accepted variations to other boards can be a quick way of specifying a general
continuity test for a run of boards. Self-learn logs as connections readings between pin pairs
that are below the Learn Threshold resistance.
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Entering Test Steps

When executing a test program (or selecting Measure > Measure All F3 in the Continuity /
No Care Information window), continuity is tested using the following method:
1. For each network of connected points, measurements are made from the first point (lowest
numbered) to each successive node on the network. If any measurement is greater than the
Opens Threshold resistance (default is 12 ohms) and the point pair is not marked as nocare, an open is reported.
2. The first point of each network (and each unconnected active point) is measured to all
other test points collectively, one at a time. If a Range of 1 is specified, then inactive
points are excluded from the point collection and connections to the inactive points are not
measured. If the measurement is less than a threshold, the System measures from the
network to each test point. This threshold is at minimum one third of the measurement
range, or twice the opens resistance threshold, if that is greater. If a measurement less than
the Shorts Threshold resistance (default is 8 ohms) is found and the point pair is not
marked as no-care, a short is reported between the measured points.
The default threshold values for shorts, learned connections and opens are 8, 10, and 12 ohms,
respectively. For most applications these levels never need modification and provide
consistent and reliable results. For applications involving boards with trace or component
resistances in this range, experienced users may improve results by adjusting thresholds. The
allowed range of thresholds is from .5% to 25% of the measurement range.
The measurement range is determined by the opens threshold. The lowest resistance range
which will measure this largest threshold is used. Continuity uses the 0.2 Volt, at 200, 2K,
20K, or 200K ohm measurement ranges. The lower the range, the faster the continuity
measurement.
The active test points and continuity thresholds information is saved with spec data files for a
UUT. Consequently, you can set the active test points and continuity test thresholds for a
particular UUT, then save the spec data. When the spec data is subsequently retrieved from
the disk, the active test points and thresholds are reset to the previous settings and remain so
until the System is restarted or a new spec data file is loaded. A separate set of thresholds is
used for each measurement range.
The active test points information is also saved with the System configuration data. If you
select save in the Configure System window, the active test points information is saved. When
the System is restarted in the future, it will reflect the active test points present when the
configuration information is saved.
The 'From (-)' and 'To (+)' test point columns indicate the lowest and highest test points that
you want to test for continuity. For example, if your UUT is connected to the test points in the
range of 1 to 136, set the 'From (-)' test point number to 1 and the 'To (+)' test point number to
136. You can test a wider range of test points, but best speed is obtained by limiting the range
of test points to the minimum amount.
The CONTinuity test is normally entered into the test program after tests that confirm jumper
installation, switch settings and pot adjustments. This order prevents false continuity failures
and allows you to provide proper messages to the operator to make these settings as
appropriate for the UUT.
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Setting the Continuity / No-Care Information

In the Edit window, highlight the CONTinuity test step and select 'Step Analysis F6' from the
'Measure' menu to open the Continuity / No-Care Information window. In this window
(shown in the following figure), you can display learned information, self-learn new
information, edit the existing information, activate and inactivate test points for continuity
tests, measure resistance between displayed test points, convert displayed continuity failures
into no-care connections, and execute the CONTinuity test interactively.
Setting Active Points on page 9-27
Learning the Continuity Map on page 9-27
Assigning Continuity No-Cares on page 9-28
Assigning Continuity Thresholds on page 9-29
Continuity (shown selected) / No-Care Information
Note
The Continuity Information screen and the No-Care Information screen
look almost identical, so make sure to click on the tab (Continuity or NoCare) at the bottom of the screen to ensure that you working on the correct
one.
The System shows one test point number and pin name in the left side on each line of the
display. In the right side another point number and name appears if any connection to the left
side point has been specified.
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Entering Test Steps

The default connection on a highlighted line shows the next higher test point number
connection, or if there is none higher, the next lower test point number. The left and right
arrow keys permit displaying the lower and higher numbered connections on the highlighted
line. If there is another higher numbered connection beyond the right column point then a
right arrow is displayed. Likewise, if there is a lower numbered connection then a left arrow is
displayed.
When the test point number is shown in the Continuity View, a dot appears in the box to the
left of the test point number to indicate that this test point has a No Care connection.
When you are done in this screen, select Measure > Exit (green door) to return to the Edit
screen.
Setting Active Points

The first step for programming continuity is to set Active test points. Test points that are
inactive are ignored during the continuity test. Active points are indicated by a diamond on the
left hand margin of the screen. All of the test points in the System can be manipulated with the
'Active Points' menu. The 'Active Points' menu allows you to toggle all points or the selected
points between active and inactive, to toggle all displayed points, to activate the points that are
named, or to activate all configured points. The configured points are setup in the system
configuration screen, see the Modules Configuration on page 5-3.
The more points that are active, the better the CONT test coverage. In most cases, you will
want all named points active (toggle all points to be inactive first, then activate all named
points). If you have not named your points, you should set all points active. The test points
should be named to make it easier to identify the nets used for each test.
When the UUT has a battery (or batteries) or points with large capacitance set at least one
point connected to the voltage as inactive and set (in the Edit screen) the Range to be 1.
Otherwise, the range should be zero. Remember to relearn the CONT map (Measure > SelfLearn All) after setting the range to 1 and making the points inactive. Note that inactivation is
only used by Range 1, and the CONT test generally runs slower.
Learning the Continuity Map

To have the System automatically learn the continuity map for the UUT, engage the UUT on
the fixture, then select 'Self-Learn All F5' from the 'Measure' menu. The System then
determines what is connected and what is not.
Once the UUT is learned, the System will tell you how many networks is has learned and how
many points are connected to these networks. For most UUTs, there will only be a few that go
through components such as low-value resistors, transformers, inductors, jumpers and
switches.
You can use the menu item Measure > Measure Selected F2 to measure the resistance of the
displayed test points in a network.
Each line in the Continuity / No-Care Information screen shows one test point. If the test point
is connected to another point, there will be a bar or arrow in the 'To (+)' column of the display
and the columns on the right of the display show the point that it is connected to. If the 'To (+)'
column is an arrow, there are more then two connections in the displayed network. By
pressing the left/right arrow keys on the keyboard, you can scroll through all the connections
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Instruction Manual
of the displayed network. A list box appears in the lower left side when you select a point in a
network (2 or more points connected).
You can execute the continuity test from within the Continuity / No-Care Information screen
by selecting 'Measure All Points' from the 'Measure' menu. If you execute the test a few times
and get any errors, you may need to set some points as no-cares below as discussed in the next
section. If not, you are done with the continuity test and can move back to the Edit screen by
pressing [ESC] or clicking on the green door.
Assigning Continuity No-Cares

When self-learning continuity test, the System uses thresholds in the 10 range to
discriminate between an open and a short. If there are any paths in the UUT that are close to
this value (for example, an 10 resistor or a transformer winding), it may cause the System to
give occasional errors because changes in probe contact resistance or in the component value
may change to the other side of this threshold.
If this is the case, you may assign these marginal measurements points as No-cares, in which
case the System does not make pass/fail judgments. Generally, these same paths are tested
separately as components, so test integrity is not jeopardized by this process.
Also, you may wish to assign no-cares where there are component tests across the same points
and you wish to have the System report on errors with the component names rather than an
opens or shorts error.
Auto No-Care
The easiest way to assign no-cares is to work from the Continuity / No-Care Information
screen. As you execute the test from this screen, any errors will show up on the right hand
margin of the screen. If you then select 'Auto No-Care' from the 'Tools' menu, the System will
automatically take any displayed failures and assign them as no-cares. By doing a few
repetitions, you can eliminate any marginal continuity measurements.
If you would like to manually insert (or delete) no-cares, you can do so from the Continuity /
No-Care Information screen. To toggle between the No-Care Information (No-Care tab) and
the Continuity (Continuity tab) Information screen, click on the tabs at the bottom of the
screen.
Note
The Continuity Information screen and the No-Care Information screen
look almost identical, so make sure to click on the tab (Continuity or NoCare) at the bottom of the screen to ensure that you working on the correct
one.
From the No-Care Information screen you can insert a no-care point by highlighting the first
point (click on the point number), pressing the Insert key, then typing in the second point. You
can delete a no-care point by moving to the lower number test point of the pair, then pressing
the Delete key. This editing process is just the same as the Continuity Information screen.
Note that the System automatically keeps track of continuity or no-care networks in sequential
order, so when you insert a link, the display may reorder the connection for you.
When the test point number is shown in the No Care View, a dot appears in the box to the left
of the test point number to indicate that this test point is part of a network.
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ICs Testing
When the test point number is shown in the Continuity View, a dot appears in the box to the
left of the test point number to indicate that this test point has a No Care connection.
Once you have completed the no-care assignment, select the 'Continuity' tab at the screen
bottom to move back to the Continuity Information screen.
Assigning Continuity Thresholds

In the default case, the test System uses a threshold of 10 for the continuity test. There are
+/-2 of hysteresis to prevent false failures from subtle changes in the contact resistance to the
UUT.
For most testing applications the default thresholds are very effective in finding opens and
shorts very quickly, however, you can alter the thresholds if desired. The 'Set Thresholds'
selection of the 'Setup' menu (in the Step Analysis screen for the CONTinuity test type) allows
you to specify different thresholds.
The 'Learn Threshold' is the threshold at which the System makes measurements during the
self-learn process. The 'Shorts Threshold', slightly lower, is the measured value, below which
shorts are reported if a connection is not indicated in the database. The 'Opens Threshold',
slightly higher, is the measured value, above which opens are reported if a connection is
indicated in the database. You can also indicate a test range if you want to drastically change
the thresholds. The default range, 200, can be changed in decade steps up to 200k. Note
that when using higher thresholds, testing will be slower, and more connections will be learned
that are actually normal component impedances.
ICs Testing
Overview
The test System allows you to test the entire UUT for IC presence and orientation with use of a
single ICs test step. This data is usually self-learned by the System from a known-good UUT.
During the programming process, most users generate the continuity and ICs tests as the last
step of the programming process. That way, you don't need to execute them repetitively
during debug of the other programming steps.
The System tests for IC presence and orientation by checking for diodes that are present at the
input pins of the ICs. These diodes are present to protect the input and output pins from
electrostatic discharge by clamping the input voltage between the more positive supply voltage
(e.g., VCC) and the more negative supply voltage (e.g., ground).
The System makes measurements to determine where these diodes are present by using a
proprietary method of applying different currents and measuring the resultant circuit changes.
With this technique it can differentiate between diode junctions and impedances that may look
like a diode junction voltage drop were a single current applied. ICs testing will find many
assembly problems, but it is not infallible. There are two general cases where assembly errors
may not be detected: (1) if a signal path has several ICs connected in parallel, the System may
not detect one of them being missing since diodes present in other parallel paths will cause the
measurement to appear normal, and (2) different ICs may have the same protection diode
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ICs Testing
Instruction Manual
mapping. For example, a 74LS00 and a 74LS02 may look identical to the ICs test and the
System cannot detect an incorrect part.
One other problem that can occur is when IC vendors are changed, sometimes the protection
diode maps for the same type of IC may be different. In this case, it may be necessary for you
to modify the test program to accommodate the new ICs.
Related Topics
Entering the ICs Test Step below
The Enter/Edit IC Test Data Screen below
Learning the ICs Map on page 9-31
Entering the ICs Test Step

To enter an ICs test, insert an ICS test type using the Edit screen.
The 'From (-)' and 'To (+)' test point columns indicate the power supplies that you will
measuring from each point for diode presence. For the 'From (-)' test point, enter the test point
number of the more negative supply for the ICs (e.g., GND). For the 'To (+)' test point, enter
the test point number for the more positive test point (e.g., VCC).
Enter a range value of 1. The learn high and low limits are set 1% or 0.1 volt (whichever is
higher) above the test low limit and below the test high limits. Typical high and low test limits
are 0.4 and 0.9 volts which works well for most logic families.
The System can maintain two maps of IC data. The range value specifies which one is being
used. In most test programs, there will be a single ICs test with a range of 1. If your UUT has
two supplies, for example VCC/ground for the digital circuits and VSS/VDD for the analog
circuits, you can insert a second ICs test for the analog circuits. In this case, use a range of 2 in
the test step to tell the System that you are using the second ICs data map and use from/to
points of the second power supplies (e.g. VSS/VDD).
The Enter/Edit IC Test Data Screen

Once you have entered the ICs test step in the Edit screen, select 'Step Analysis' from the
'Measure' menu to move to the Enter/Edit IC Test Data screen. From this screen (shown in the
following figure) all ICs test programming is performed. When you are done in this screen,
click on the green door to move back to the Edit screen.
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ICs Testing
Enter/Edit IC Test Data Screen
Learning the ICs Map

To have the System automatically learn the ICs map for the UUT, engage the known-good
UUT on the fixture, then select 'Self-Learn All' from the 'Measure' menu. The System then
determines where diodes are present.
Once the UUT has been self-learned, the System displays a diode beside each pin where a
diode was measured. There are two columns in the center of the screen: the left contains a
diode if there is a diode present to the more negative power supply and the right column
contains a diode if there is a diode present from the pin to the more positive supply.
You can edit the data manually if you wish. To make a particular measurement a no-care (no
test is performed), move to that point and select 'Toggle Diode Test' or 'Clear Diode Test' from
the 'Edit' menu.
Once you have self-learned the ICs map, click on the green door to return to the Edit screen.
From the Edit screen, select 'Make Measurement' from the 'Measure' menu to execute the test a
few times. If it fails, the measured value will be non-zero, indicating the number of errors that
occurred. If errors occur, return to the Enter/Edit IC Test Data screen to re-learn or edit the
data. Alternatively, you can execute the entire test within the Enter/Edit IC Test Data screen
with the 'Measure All Points' selection of the 'Measure' menu.
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Transformer Testing
Instruction Manual
Transformer Testing
Overview
Your System can check for proper transformer installation in UUTs. In addition to the more
basic checks that can be performed, coil resistance and inductance, the System can check for
proper transformer polarity. This check is particularly valuable when transformers are
installed lead-by-lead, which can be and error-prone process
This check is performed by providing a stimulus at one winding, and checking for proper
phase on other windings. To perform this test, the XFMR test-type is used.
Programming a Transformer Test
Transformer testing is performed with the XFMR test-type. The XFMR test type is entered
using The Edit Test Screen on page 8-6 like any other standard test.
The parameters entered from the Edit screen are:
Parameter
Description
Test Type
XFMR
From (-) Point
Primary Winding Low Test Point
To (+) Point
Primary Winding High Test Point
Range
The frequency used for the measurement (default is 1 kHz):

32 = 100 Hz
48 = 1 kHz
20 = 10 kHz
24 = 100 kHz
Title
Used to describe the component being tested, such as L103 or T345.
Low Limit
Secondary Winding Low Test Point.
High Limit
Secondary Winding High Test Point.
The following figure shows the test point connections for a typical device tested with the
XFMR test-type.
To (+) - TP23
Hi Lim - TP 35
From (-) - TP25
Low Lim - TP 31
T1
Device Connections for XFMR Test
Using the connections shown in the figure above, a corresponding line in the test program
would be:
From ()
Point Name
9-32
To (+)
Point Name
Type
Test
Range
Title
Limits
Low
High
Instruction Manual
25
T1-1
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Operator Displays
T1-2
XFMR
48
T1
31
35
The System generates a pass or fail depending on the outcome of the test. The default
measurement frequency, 1 kHz, can be used in most applications, however, transformers that
are designed for high frequency applications may work better at higher test frequencies.
Operator Displays
Display Messages
In some cases, may wish to display messages to the operator to advise of System status or to
prompt the operator to perform some action. The CheckSum test system allows this capability
through use of the DISP and DISPL and WAITK test types.
The DISPLay test type is the easiest to use. To enter a message for the operator, specify a test
type of DISPL, a 'From (-)' test point value that shows the column number (1-78) to start the
message on, a 'To (+)' test point value that shows the line number to write the message on (18), and the text of the message in the test title column.
For example, if you would like to make a display that would show test progress, structure your
test program with the following DISPL statements:
Display Messages
For messages longer than the twelve characters allowed in the test title column, you can use
the DISP test type. Rather than displaying the message from the test title (like the DISPL test
type), the DISP test has a message number in the range column. In addition to allowing longer
messages, the DISP test type is useful if you would like to display the same message from
several places in your test program.
When a DISP test type is selected in the Edit screen, either select 'Step Analysis' from the
'Measure' menu or select Display Messages...' from the 'Setup' menu to obtain the operator
Display Messages window shown in the following figure:
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Operator Displays
Instruction Manual
Display Messages Window
The Display Messages window allows you to type in a row and column number and the text
for each message. You can also edit a selected message (press Enter or double-click the on the
line in the top part of the window). In the lower part of the window, the selected message is
shown in the specified row and column location. The Center button can be used to quickly
center the text in the row. If you click and hold the mouse pointer on a message in the lower
window, you can drag the text to the desired row and column. A lined-box shows the message
while moving. The small bullet located between the message number and the column entry
can be selected (bullet color changes when selected) to show multiple lines in the lower
window. The selected line in the top window is shown with blue characters in the lower
window.
Once you have entered or edited your messages, you can return to the Edit window by clicking
on the OK button. You can have up to 36 different messages in a single program.
If you want to erase the display area of the testing display, use a test type of DISPE with a
range of 0. If you wish to erase a single message, insert a range value corresponding to the
DISP range of the message that you want to erase. Sometimes you might want to prompt the
operator to perform an action, then wait until he presses a key before continuing. In this case,
use the DISP or DISPL test types to display the message, then a WAITK (wait for key) test
type with a range of 0. The WAITK test step will wait until any key on the controller is
pressed, then continues on to the next test step.
You can also use other ways to get an operator's response:
1. With the WAITK test type you can wait until a particular key has been pressed before
proceeding. See the detailed description of the WAITK test type in Wait for a Key to Be
Pressed on page 18-63 for more details about how to do this.
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2. Use two test points connected to a switch as an operator input. Use the SWCHR or
JMPR/JMP/LABEL test types to wait for the switch change.

3. Use a bar-code reader connected to a keyboard wedge and have the operator scan in the
desired entry. Bar-code readers typically emulate the keyboard and any input that can be
typed in can be scanned in.
4. Use one of the digital I/O points available from the TR-8 System Module connector in
conjunction with the DIGI/JMP/LABEL test types to wait for the digital bit to change
states.
5. Use the MEMS/MEMI/MEMR test types with a range of 3 to wait for operator input, then
save it in the corresponding memory location. You can then use it later for other purposes
if desired.
If you would like to have the System include the measured value from the last analog
measurement step, you can include the text {MEAS} in the display string. This applies to both
DISP and DISPL statements. At execution time, the System replaces the text {MEAS} with
the most previous measured value. This can be used if you want to display information to the
operator, such as in a custom measurement and adjustment loop.
If you want more sophisticated messages that include colors and flashing information, you can
use the SCRN test type on page 18-65. In addition to these functions, you can use the screen
test type to save the present contents of the operator display area (as filled with DISP, DISPL
and SCRN test steps) to the disk. The SCRN test type can then be used to restore the display
later from the disk file. If you have standard screens, you can generate them, save them to a
file, then use the files as a library for future test programs.
If you want to use operator-input for controlling program flow, see the following section.

Under most circumstances, CheckSum test programs are executed linearly from top to bottom.
However, you can alter or extend this flow with use of some special test types.
Branching below
Exiting the Program on page 9-37
Running Another Test Program on page 9-37
Extending Test Program Length on page 9-38
Encapsulating a Test on page 9-38
Executing a User-Written Program on page 9-38
Branching
The Analyst mc supports program labels and branching. A branch is a tool programmers use
to change the order of the program by transferring execution to begin at another part of the
program.
This allows execution to move from one point in the program (i.e., the branch or jump
statement) to another (a label statement) rather than the next step in the program. You can
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specify that a program branch occur unconditionally (always) or based on the outcome of an
analog or digital measurement or an operator entry.
Labels are names assigned to a step in the test program with use of the LABEL test type. To
put a label in the test program, insert the LABEL test type, then the name of the label in the
test title column. The label can be up to 12 characters long (including spaces). The System
ignores whether characters in labels are upper or lower case.
There are a series of jump commands that transfer to a label. In all cases the destination of the
jump is typed into the test title column. The jump destination must match a LABEL
destination or you will get an error when exiting the Edit window.
You can use jumps and labels to form small loops to wait for digital or analog changes to
occur, or to wait until the operator provides an appropriate input. You can also use jumps to
abort the program when a specified number of errors have occurred.
There are a number of jumps based on most types of measurements. These measurements are
exactly like the corresponding measurement test types but rather than generate test results, they
generate program flow changes if the test step passes.
For example, the corresponding jump test type for a RES test type is JMPR. When the JMPR
test type is executed, it generates an internal pass or fail based on the high and low limits. If it
fails, it continues on to the next test step in the program. If it passes, it begins program
execution at the LABEL test step where the two test titles match.
An unconditional jump (the JMP test type) always generates a change in control flow.
You can also branch on the numbers of error in the test program. You can use this, for
example, to stop the test earlier (for faster System throughput) if there are a significant number
of error during a test.
Following are the JMP test types that can be used:
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JMP
unconditional jump to label
JMPE
jump based on error count of program
JMPR
jump based on resistance measurement
JMPC
jump based on capacitance measurement
JMPD
jump based on diode measurement
JMPI
jump based on inductance measurement
JMPV
jump based on voltage measurement
JMPDI
jump based on digital input
JMPPI
jump based on port input
JMPK
jump based on keyboard input
Entering Test Steps

JMPE
jump based on how many errors have occurred in test program
JMPZ
jump based on zener measurement
JSTST
jump based on self-test
JFXID
jump based on fixture ID
MEMS
jump based on contents of MEMS variable (MEMS range of 20-22)
MEMI
jump based on contents of MEMI variable (MEMI range of 20-23)
MEMR
jump based on contents of MEMR variable (MEMR range of 20-23)
Exiting the Program

In most cases, the system is run so that it halts at the end of an entire test. However, the test
can be terminated (Escape key or Exit button) by the operator in the middle of a test.
If your test program has special actions that you want to occur at the end of each test
execution, even if the operator aborts the test prematurely, you can insert a special LABEL test
step into the program. If you have a LABEL test type with the name (test title) of SHUT
DOWN in your test program, the System will execute the test steps after it if the operator
aborts the test.
For example, perhaps you want to log test results after each test with a RPRTS test step. If you
make the last two lines of the program as a LABEL SHUT DOWN followed by the RPRTS
test step, the report will always be generated.
Running Another Test Program

In some cases, you might want to leave the program file that you are executing and load and
run another test program. For example, you may write a supervisory program that asks the
operator to type in the name of the UUT. Based on what the operator types in, you can load
and run another test program for that UUT, then return back to the supervisory program. You
could, for example, also base the program that is to be run upon a bar-code input from the
UUT.
The statement that allows you to do this is the RUN test type. Enter the name of the test
program that you want to load and run as the test title for the test step. This name is the same
as you would type in for loading a test program from other System menus.
When you call a test program with a RUN command, the called program is loaded over the top
of the calling program, and execution begins at the first step of the loaded program. All of the
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test results of the calling program are lost and can only be logged with use of the REPRTS test
type.
At the end of the called program, the System comes to the Test menu which allows for next
test, retest, show/print report or Exit. However, you can use the RUN command again to
reload the initial program again prior to the end if you wish.
Remember to use the REPRTS test type to save results prior to using a RUN test step if you
want to log data for the UUT.
Extending Test Program Length

For most UUTs, 1000 test steps are adequate for performing all necessary tests on the UUT.
However, you can make the test program longer by using the RUNT test type. When you use a
RUNT test type with a range of 2, and a test title with the called test program's name, the
following actions occur:
1. The results of the present test program are temporarily saved,
2. The called program is loaded and executed,
3. At the end of the called program, its results are saved,
4. The calling program is reloaded and execution begins at the test step following the RUNT
test step.
5. At the end of the main program's execution, the results of all of the main and called
programs are collated to form one test result.

In the System operator's eyes, only one test program has been loaded and executed. You can
have several RUNTs in a single program so as to provide an almost unlimited program length
from a practical perspective.
Encapsulating a Test
You can use the RUNT test type to encapsulate several actions into a single test result. You
might want to have a group of test steps that cause the System to perform a number of actions
(for example an interactive adjustment on the UUT), but only generate one (or no) test result
for the entire group. To do so, use a RUNT test type with a range of 0 for a pass/fail result, 1
for no result, and a test title of the called test program's name.
If the called program passes, the RUNT test step passes. If the called program has one of more
errors, the RUNT test step fails.
Executing a User-Written Program

In the event that you have special program needs, CheckSum systems allow you to write a
program in any programming language that will generate a DOS .EXE or .COM file (such as
C, Pascal, or Basic), execute it, then return to the main program.
This feature allows you to perform tasks such as interfaces to factory data logging systems or
special register-level IO for non-CheckSum hardware control.
These programs are executed using the EXEC test type. Enter the name of the program to load
and execute into the test title. You can cause a pass/fail result if you wish by setting the 'To
(+)' point column to 0 and returning a DOS error-level in the called program. If the error level
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is zero upon return, the step passes, otherwise it fails. If the 'To (+)' point is 1, the step always
passes.
You can pass parameters to the program by inserting a ^ just before the command line
parameter in the test title. You can pass the value of memory locations as command-line
parameters by special codes in the test title column. See Execute User-Written Routine on
page 18-67 for details. You can send information back to the test program by writing it to
ASCII disk files from the EXECed program, then reading them back in with the MEMI,
MEMS, MEMR commands using a range of 7.

There are several way to generate reports from the CheckSum test system:
After each test, from the Test window, the operator can manually select a full test report or
a test report that contains data for failed steps only.
The System can be configured, using the Configuration screens described in System
Configuration on page 5-1 , to automatically output a test report that contains full or
failed-only test results. The report can be generated after each UUT, or only after UUTs
that fail. The amount of data reported can also be adjusted from within the test program
with use of the RSLTS test type.
The test programmer, using the RPRTS test type on page 18-90, can output test reports
from within the test program.
The RPRTS test type allows you to control test results output directly from within the test
program. The RPRTS test type can be useful in cases such as when you never leave a test
program (i.e., you jump back to the top of the test program after each UUT so that you can
more carefully control the test environment) or you are using the RUN test type.
Normal Test Reports
To output normal test reports, put the name of the report destination in the test title (e.g.,
COM1, LPT1, a disk file name), and add the range numbers for your selection from the
following list:
1
Include a sequence number in the test report header. The sequence number starts at one
with each assembly tested in a batch. To reset the sequence number, either reload the test
program, or move back to the 'Main System' window then start testing again.
Send the test results report, which includes the header and the failed steps, to the name in
the test title (otherwise it goes to the report destination as specified in the Test window).
Only print the report if there were one or more failures during the test.
16
After the report, clear out results in memory to start a fresh UUT run.
64
Also include detailed information about test steps that passed.
Statistical Data Reports

The System can also generate statistical process control (SPC) reports as described in
Statistical Analysis on page 7-1. SPC reporting includes yield reports, X-Bar/Sigma reports,
and pareto charts. SPC reporting deals with information about all of the testing done on a test
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station rather than individual UUT reporting. You can also process this ASCII log information
yourself using tools such as spreadsheets or custom analysis software.
You can also use the RSLTS test type to output data to the SPC log. Even though this table is
shown separately for clarity, you can add together the values between this table and the
previous one if you wish. If you want to use two test step, one for normal results, and another
for SPC data, make sure that you do not clear out the results by including a range value of 16
on the first RSLTS test step.
To send data to the SPC log, add the range numbers for your selection from the following list:
4
Print results to the SPC log.
Only write to the SPC log if there were one or more failures during the test.
16
After the report, clear out results in memory to start a fresh UUT run.
32
Report summary information in the SPC log.
64
Include detailed information about passed test steps in the SPC log.
128
Include detailed information about failed test steps in the SPC log.
Changing Report Paths

You can also use a RSLTS test step to specify the path to the report or SPC data. Normally,
this information is specified for the System in the Configuration windows (see Configure
Directories/Locations on page 5-16). If the RSLTS test type is used for this purpose, it
changes the path during program execution. The path is automatically added to the front of the
file name specified in the title of the RSLTS test step.
The new path is specified in the MEMS string variable. Load it with the desired new path
string. Then, to change the path for the SPC data use a range value of 256, and set the 'From
Point' to 0. To change the path for the normal results data, use a range value of 246 and set the
'From Point' to 1.

While CheckSum test systems are sophisticated enough to handle populated circuit assemblies,
they are also efficient for cable testing and wiring.
Cable fixturing can be performed with any the CheckSum test fixtures. The Model GS-850 is
specially designed for this purpose. The mechanical/pneumatic fixture systems can be built
with connectors installed on the probe plate. Special TR-3 style vacuum fixture kits are
available with just a single top G-10 plate for non-vacuum applications such as this.
To test a cable, you can use the CONTinuity test type.
To build a cable, use a series of WIRE test types, each of which allows specification of a
connection to be made when building the cable or harness. The System measures between the
two test points, compares the reading to the high and low test limits, and generates a pass or
fail based on the result.
If the "From Point" is probed (using a grounded probe), the System displays a message to the
operator:
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Panelized Testing
Connect from <From-point name> to <To-point name>

Press [ESC] to fail test...
If the test title is not blank, it can be used to provide a customized message to the operator. In
this case, the System replaces the text after "Connect from" with the contents of the test title.
The first up-arrow (^) found in the test title is replaced with the From-point name. The second
up-arrow found in the test title is replaced with the To-point name. When used in this mode,
the test title that would be the equivalent of the standard message would be "^ to ^".
After presenting the message, the System waits for the connection to be completed, another
point to be probed, or the [ESC] key to be pressed. When any of these events occur, the
System beeps and then erases the above message from the CRT.
An example test program to build a simple cable with four connections is shown below. When
this test program is executed, the System waits until all the connections are made before
ending execution. The number of connections not made is shown in the upper right corner of
the display as the number of errors. The operator can either make each connection without
instructions, or probe a point shown as a "From Point", then receive the message about how to
make the connection.
Example Test Program for Building a Cable
Panelized Testing
Overview
UUTs that consist of several individual PCBs (usually identical) in a single panel can be
accommodated using the multi-PCB capability of the MDA System.
The multi-PCB panel capability provides several features:
You can program the first PCB in the panel, then have the System replicate the point
names and/or program data for the other PCBs. The System automatically updates the test
point numbers as it copies the data. This automatic function is provided for MDA, but
may not fully automate replication of functional test programs.
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Instruction Manual
When testing a panel, the System displays the location of the PCB currently under test in
the lower right of the testing window. This way the operator always is aware of which
PCB is being tested. As each PCB test is completed, it turns green if it passes, and red if
there are any failures. An example is shown in the following figure.
Test Screen with Multi-PCB Panels
At the end of each test (and prior to the first test) an additional selection, 'Select Skips' is
available from the 'PCB' menu. This selection only appears if the assembly that you are
testing is configured as a multiple-PCB panel. When you have selected to select skips, you
are presented with Skip PCBs in Panel display shown in the figure below.
By moving the cursor to the PCB(s) that are to be skipped, then pressing the SKIP button, the
test on the selected PCBs will not be performed. This selection is helpful when one or more of
the PCBs in the panel are rejected and a test is not desired. Note that with the 'Retain Skip
Selections' item in the 'PCB' menu, you can instruct the System to remember and reuse the
skipped information. This can be handy if you have built a batch of UUTs with a missing or
known-faulty position.
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Panelized Testing
Select Skipped PCBs in Panel
Related Topics
Panelization Programming by Wizard below
Manual Panelization Programming on page 9-45
Panelization Programming by Wizard

For most common panelized UUTs, the System includes a Panelization Wizard that makes
panelization quick and easy. To use the System for panelized PCBs with the wizard, use the
following sequence:
1. Wire the fixture with each PCB in the panel wired identically, but begin at a new range of
test point numbers. For example, wire the first PCB to points 1-25, the second to 26-50,
and so on. It is good practice to leave a few points in-between PCBs so that if you need to
add probes the programs steps can be modified easier. For example, CONTinuity tests
prefer continuous groups of tests points.
2. Write and fully debug the test program for the first PCB in the panel (the one with the
lowest numbered test points).

3. From the 'PCB' menu, select 'Panelization'. Then, from the 'PCB Panelization' screen
shown in the following figure, select 'Use Panelization Wizard'.'
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Instruction Manual
PCB Panelization Screen
4. From the 'PCB Replication Wizard' screen (shown in the following figure), first select
where you have chosen to wire the first test points in your fixture. The default is the upper
left corner, but you can choose other corners if you wish. Next, indicate whether you have
wired your test points so that they increment as you go across (which is by row) or as you
go up or down (which is by column). Next enter the size of your PCB matrix by the
number of PCBs in each row (the first number) and by the number of PCBs in each
column (the second number). Then enter how many test points there are per PCB. As a
default, the System will offer the exact range of test points that you have used in your test
program. If you have left extra points between PCBs, you will have to enter a larger
number. Finally, you press OK, and the System goes to work for you. It will confirm that
you want to perform the individual steps, then generate the test program. Once it is done,
the test program is ready to save and run.
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PCB Replication Wizard Screen
The System will have assigned a PCB test-step at the beginning of each new PCB in the panel,
and replicated (step and repeated) the point names and point numbers as appropriate. If you
have to make a global change to your test program, you can make it on PCB 1, then run the
sequence again. It will overwrite all of the PCBs greater than one with the new data.
Manual Panelization Programming

In the event that you have a more complicated panel, you can individually perform steps that
the wizard does for you. This allows you to do unique operations, such as ordering the PCBs
differently, specifying layouts that are not rectangles, or accommodating wiring that is not in
even increments.
The first step in panelizing is to specify the physical layout of the panel. This is done with the
'PCB Locations/Numbers' screen shown in the following figure. To obtain this screen, select
'Panel Map' from the 'PCB Panelization' screen. In the upper left corner, you can specify the
overall size of your array. In each PCB position, you see a PCB number associated with the
PCB. The System replicates and tests starting at the lowest PCB number, then sequentially
tests each following one. If you want to change the order, move to the desired position, then
delete the old number and enter the new number. You may not have duplicate PCB numbers
for replication and testing, but temporarily you may during the assignment process in this
screen.
If your panel is not a rectangular matrix of PCBs, you will want to specify a PCB in the panel
as not being used. To do so, select the PCB that is not in the panel, delete the PCB number,
then press the BACKSPACE key. When you move off the PCB, you will see that it does not
have a number anymore, and will not be displayed or used for replication or testing purposes.
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Instruction Manual
PCB Panel Map Screen
Once you have assigned the PCB Locations and Numbers, you can assign the test point
numbers that are associated with each PCB in the panel. To do so, select the 'Point
Assignments' selection from the 'PCB Panelization' screen. You will then see the 'PCB Wiring
Assignments' screen shown in the figure below.
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Panelized Testing
PCB Wiring Assignments Screen
The PCB Wiring Assignments Screen allows you to specify different ranges of test points that
get replicated for each PCB. You can use the 'View' menu to fill in the columns with the
hardware that you have in your System (the 'Configured Boards' option) or by all types of
available modules (the 'All Boards' option).
Then, fill in the table, showing in each cell the first test point for the applicable module in each
column.
The 'Edit' menu allows you to move around by page or cell without using the mouse.
When you have completed entry of this table, select 'OK'.
Once you have filled in the PCB orientation and wiring information, you are ready to perform
the replication. To do so, select 'Replicate' from the 'PCB Panelization' screen. You are then
presented with the 'Replicate Options' screen shown in the figure below.
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Instruction Manual
Replicate Options Screen
In the defaults setup (all items checked), the System will do a full replication for you. You
have the option of turning off one or more of the automatic generations if you wish. 'Replicate
Test Steps' is the action of generating the new test steps for the other PCBs in the panel. You
can turn this off if you are only interested in other functions such as duplicating point names.
The next two options have to do with point naming for the PCBs past the first. 'Replicate Point
Names' requests that the System duplicates the point names from the first PCB to the other
PCBs. If you select 'Auto-increment Point Names', the System chooses unique names for the
points after the first PCB. This prevents having multiple test points in the test program and
test fixture that have the same name. The points are made unique by adding an extension to
the name such as #2 for the points on the second PCB, #3 for the third, and so on. Leave two
or three characters extra on your point names to allow this feature. If any point name contains
#1 then only the names with #1 are auto-incremented.
Once you have checked the functions that you want the System to perform, press 'OK' to
actually perform the task, or 'Cancel' if you chose not to.
There are some other options available from the 'Advanced Options' selection of the 'PCB
Panelization' screen. When you make this selection, you are presented with the 'PCB Runtime
Options' screen shown in the following figure.
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PCB Runtime Options Screen
The 'Panelization Enabled' feature is normally turned on. If you turn it off, even if the test
program is panelized, the System will not display the panel map during testing or after the test
program is completed.
'Multiple UUT Serial Numbers Per Panel' can be enabled if you are tracking UUT serial
numbers for the panel, and you have different serial numbers for each PCB on the panel. If
this is enabled, and you have enabled (in the Configuration/Environment screens) the feature
of asking for serial numbers, you will be asked for the serial number for each PCB in the panel,
as opposed to one serial number for the complete panel.
'PCB SPC Reporting' allows you to enter how SPC data is logged for panelized PCBs. The
differences allow you to track your panels in the way that is most efficient for your facility. In
the default case, 'Panel consists of identical PCBs,' the System tracks each PCB in the panel as
a different UUT. If you select 'Treat Entire Panel as one UUT,' the System reports on the
complete panel (including all PCBs) as a single UUT. If you select 'Panel consists of different
PCBs,' the System tracks each PCB on the panel as a unique PCB. This case is normally used
if your panels contain different UUTs. For example, you might build on one panel, both a
PreAmp circuit PCB and a Power Amp circuit PCB. Both are different, but on the same panel.

Overview
The Analyst mc can test most assemblies with the basic test steps that have been discussed in
this topic. In some cases, however, you may need to do special things, such as mathematics
based on readings, special operator input processing, and reading/writing data from files on the
disk.
The memory manipulation test types (MEMI, MEMR, MEMS on page 18-69) allow use of the
System's memory to assign, keep track of, manipulate, and use variables within a test program.
There are three types of memory variables: integer, real (floating point), and string:
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1. Integers are whole numbers ranging from plus to minus 32,767. The test-type that works
with the memory-integer variable is MEMI.

2. Real variables can include a fractional part and can range from plus to minus 10E37. The
test-type that works with the memory-real variable is MEMR.

3. String variables can be up to 32 characters long and can include any normal ASCII
characters. The test-type that works with the memory-string variable is MEMS.
These steps allow entry or assignment of the memory contents, pass/fail test generation based
on the value of the memory contents, fundamental math and manipulation of the memory
contents, transfer of control based on the contents of memory, or display of the variable.
These test steps can be used to form a counter, to control program execution based on operator
entry, or as an alternate way to generate test results based on operator entry.
Refer to the test-type descriptions (Memory Manipulation Test Types) in Test Type
Descriptions on page 18-1 for information about the specific range values that can be used
with this test-types.
Related Topics
Special Notes about MEMS below
Special Notes about MEMR below
Special Notes about MEMI below
Memory Variables and Program Storage on page 9-51
Special Notes about MEMS

Note that there are several string variables (see MEMS on page 18-69):
The first memory string variable is called the "Memory String".
The memory string variable, referred to as the "Compare String", can be used to make
pass/fail comparisons against the memory string variable. For example, you can load the
compare string with data, then compare it to the main memory string and make decisions
based on the result.
The memory string variable, called the "Batch Memory String", is only cleared between
batches. As such, you can use it to solicit input about the batch as a whole (e.g., batch
number, UUT configuration), then not ask the operator again until a new batch has started.
You can do this by checking to see if the batch memory string is empty, and if so,
assigning it as appropriate.
Special Notes about MEMR

In addition to the normal memory operations, there is a related time storage location (called
Memory-Time) in the MEMR on page 18-74 command set. You can use this to compute the
time from an event to another event, or to set a beginning time, then delay until specified time.
This can be useful, for example, to time events or to check how long the present program has
been executing.
Special Notes about MEMI

In addition to the normal memory operations, you can obtain the base addresses of the
CheckSum modules in the System. This can be helpful if you would like to do some direct
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addressing of the hardware in the program. You can also use some of the MEMI on page 1871 commands to control input and output from the operator keypad.
Memory Variables and Program Storage

While most of the variable operations are fairly straightforward, one type of operation can be a
little confusing to understand at first. Since there are only three variables available to store
data, at times you might need to have more. To accomplish this, you can use parts of the test
program as storage space. With some of the range values, you can specify a step number and
column in the test program, then move data between the specified location and the memory
variables. Since the storage space for a program is 1000 steps, and most programs are much
shorter, you can specify step numbers above the last program step, but less than 1000 and they
will not conflict with the program being executed (however, they can be overwritten if you do
a RUNT or RUN).
If you take advantage of moving data back and forth between memory variables and test
program fields in the test program (rather than the space beyond the program), you can do
many special things in your test program. For example, you can read the measured value from
an earlier measurement step, do math with it, then write it into a later test step as a low or high
test limit. In programming, this is called impure code since you can modify the test program
as it executes.
When doing this type of programming, you can specify a test step number directly (it's the
number shown in the upper left corner of the 'Edit' screen). This works fine if you are
transferring data to the area above the test program area. If you are transferring data within the
test program, however, directly using the step number is not recommended since if you add or
delete a line with a lower number, the program will not work properly anymore. In this case,
you should use a relative address in the MEM command. If you want to refer to a step number
X steps beyond the MEM command, use a step value of 1000+X. If you want to refer to a step
number Y steps previous to the MEM commend, use a step value or 2000+Y. If you use this
relative programming convention, your program will not be affected by adding or deleting
steps unless they are in the relative range specified.

The Multi-Function Input (MFI) measurement can be used to:
Test components using a set of test leads connected to the front panel jacks.
Enter the test steps in the test program editor with a DMM (Digital Multi-Meter) style of
control panel. The test steps (e.g. Res, Cap, etc) can be setup and inserted from the MFI
control panel.
Enter an MFI test step. The MFI test step is useful when an operator needs to position test
leads to make a measurement during execution of a test program. The MFI test step is also
useful when the front panel inputs are connected to the UUT.
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In the Main System and the Edit Test Program windows, the MFI toolbar icon can be used to
open the MFI window. When the window opens, the MFI meter will be making
measurements. You can touch the knob to change the function from resistance to any other
function. When the measurements are being made, a series of small dots appear (one dot then
two and then three) at the right edge of the display to indicate the meter is running. You can
press the Stop/Measure button to stop the measurement readings.
The Zero Meter button can be used to offset the present reading to make the display show zero.
When the meter is applying an offset to the measured value (Zero Meter), the meter indicates a
customized setup. Since the front panel is a 2-wire measurement, the Zero Meter function can
be used to subtract the resistance (or capacitance, etc) in your test leads. This makes the
displayed reading more accurate for low value measurements.
The Expand/Collapse button can be used to further customize the MFI test limits and
measurement behavior. The High and Low Limits are set using the check and numeric entry
boxes. When the High and/or Low limits are set, the display will show green for Pass and red
for Fail. The Set Limits button will set the limits for you using the measured value. See the
Measure menu selection for the Default Limit Setup for the values used for the Set Limits
button. The Logic function only allows Pass/Fail indication. The thresholds are set to 2V and
0.8V.
The Test Input High/Low can be individually set to either the front panel jacks or the system
test points. If a test point is selected, the name of the test point is shown next to the number.
The Title is used to identify the component for the operator and in the test results.
The Measurement Behavior for "Beep on Pass/Fail" controls the audible computer Beeper.
When the measurement Passes, the beeper will sound if the "Beep on Pass" box is checked.
While a measurement Fails, the beeper will sound if the "Beep on Fail" box is checked. The
Measurement Interval can be used to make sure the measured value is good (Pass) before
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continuing. If the time interval is set to 500 mSec, for example, the measurement must Pass
for all readings in a second time period.
The Customize button opens the Measurement Analysis window (see Measurement Analysis
on page 9-6) for all functions except Volt and Logic. This window is used to setup the
measurement range, time delay, offset and scale settings. No guard points can be used in the
MFI setup.
In the Edit Test Program window, the Step buttons are shown. Both the Edit and the MFI
Interactive windows are open at the same time. This allows you to position the selected test
step for use with the Step buttons. You can use the Load button to use the setup from the
current test step. Once you have setup the measurement in the MFI window, you can use the
Save button to save the setup back into the current test step. The test type will be set according
to the function selected (Res, Cap, Diode, etc). The Insert button adds a test step after the step
you currently have selected. Only an MFI test step can use the front panel connections for
measurements. If you try to save a Resistance test step with the Test Input connections set to
the front panel, default test points will be set in the test program.
When an MFI test step is selected, the MFI Setup window is shown for the measurement
analysis. This window only allows the setup of the MFI to be changed; no test steps can be
loaded, saved or inserted.
Executing an MFI Test Step
If the MFI test step is executed and the test passes, the measured value is recorded. If the MFI
test step fails, an MFI Measurement window opens automatically. The failing value is
displayed in this window and the operator can then make the proper connections as needed.
The MFI Measurement window only displays the reading; no setup changes can be made in
this window.
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Chapter 10
CAD Data Conversion
Overview
The CAD data conversion feature of the CheckSum Test System is used to help generate test
programs from CAD data available from PCB layout and schematic entry software.
The conversion process generates a fixture wiring list to help lay out and wire the fixture, then
generates a test program for MDA testing most of the components on the UUT. Depending on
the CAD data used, the System may also be able to input nominal values for the test steps and
assign preliminary tolerances.
The process of generating test files is performed with use of the CAD Conversion Screen on
page 10-4.
To use the System to automatically generate test programs and fixturing information, you must
have ASCII input files in the proper format for the CAD system from which you are
converting.
Files Types
Although the particular files necessary vary from CAD system to system, typically the net list
file and parts list file (materials list) are used for the generation process. The former is used to
determine what components are present in the assembly and how they are connected and the
latter is used to determine the part values for purposes of assigning tolerances and other
automated program generation purposes.
The System can read ASCII CAD data files from P-Cad, Mentor, OrCAD, Cadence, Tango,
Pads2000, ComputerVision, Schema, ViewLogic, Racal-Redac, Scicards, Veribest, and
Fabmaster systems. The System can also convert ASCII test programs using the .BCF format
written for (Agilent) HP-3065 and HP-3070 test systems. If you do not have one of these
formats, your CAD system may be capable of generating a compatible file. For example, most
schematic entry software can generate a number of different CAD output formats from a
schematic entered in its own proprietary format. Using the schematic entry package, you can
generate the net list and component file in one of the formats supported by CheckSum, then
read them into the MDA System.
Alternatively, if you have CAD data available from an unsupported CAD system, it may be
practical for you to manually edit it or to write a simple translator to convert it to match one of
the supported formats.
CAD Data Conversion

Instruction Manual
If you will also be doing functional test of the UUT, you may want to alter the default wiring
that the System assigns for you. The System sequentially chooses test points as necessary
without regard to their analog characteristics. For example, to support functional test you will
want to specially assign test points with special voltage and current requirements to the Model
TR-6 relay test points. An easy way to make this change is to initially generate the test
program automatically, then save it to disk in ASCII format. You can then edit the ASCII file
in the point names section to assign new point numbers as appropriate to the special needs for
the particular nodes. When you read back the modified ASCII file, the rest of the test file will
be adjusted accordingly to use these new points.
In general, if you want to off-line generate or change point name assignments, the ASCII
format is convenient. You can either write out the existing data in ASCII then edit it with a
text editor, or you can generate a new ASCII file with just the "Point Names:" title followed by
the test point numbers, a comma, and the test point name. When you read this into the system,
the names will be assigned.
An alternate way to change or assign point names is with the 'Net Order File.' This ASCII file
has a point number followed by a point or net name on each line. If this file is specified, the
System uses the point assignments from the file.

Using CAD data to generate a test program uses the following steps in the test program editor:
1. Select the menu item Tools > CAD Conversion...
2. In the 'CAD Format' entry field, specify the CAD data format (i.e., which CAD package
that you are converting from).

3. Set the CAD Files Directory to where your CAD files are stored.
4. Using 'Net List File', specify the CAD file name without an extension. The System
assumes specific file extensions depending on which CAD system you use.
5. Use the 'Assign Default File Names' button to have the System automatically assign file
names for the various input and output files.

6. Use the 'Manual CAD Conversion' button to perform the conversion process. This step:
a. Reads the net list, assigning net names for those not already listed as point names (as
either a node or net name).
b. Using the reference designator template, generates a test step for each component
found.
c. Assigns nominal values based on the information found in the materials list.
d. Finds parallel components and merges them (e.g., if C1 and C7 are connected to the
same test points, the system adds the values of them and puts them together into one
test step).
e. If enabled, renames the networks with component names.
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CAD Data Conversion

Assigns preliminary upper and lower test limits for each component.
At this point, the Test Program can be debugged, edited and saved just as if you had manually
entered it. Typically, the only things that need to be added are a CONTinuity test, an ICs test,
and any special components that are not listed in the reference designator template. By listing
the exception report you can obtain valuable information about what needs be added to the test
program. The generated test program is in volatile RAM memory and must be saved manually
if you have not entered a 'Test Program File' name in the CAD Conversion screen.
If the System can't find one of the files (e.g., the materials list), it will display an error to you,
but continue nevertheless after you press OK.
7. Use the 'View...Exception Report File' selection of the 'File' pull-down menu to look at the
exception report. The exception report shows details about the conversion process.
Depending on the outcome of this conversion process, you may proceed, or wish to alter
some of the conversion parameters.
8. Print out the fixture wiring report file. This can be done with the 'View...Fixture Wiring
Report File' selection of the 'File' pull-down menu, or use other Windows tools to print the
file named in the 'Fixture Wiring Report File' entry area of the CAD Conversion screen.
When generating this report, the System assigns a test point to each network on the UUT,
shows the test point, the network name, the fixture receiver interface connection, and a list
of connections on the UUT connected to the network. From this list, you can wire the
fixture.
In this list (an example is shown in Fixture Wiring Report File on page 10-8), the System
shows a network name for each point. In many cases, this name is valuable to the person
running the program (e.g., "GND", "DATA2" or "+12V"). In some cases, however, the CAD
system will assign names that have no meaning to you (e.g., "UN000006" or "N0000002"). In
this latter case, you may choose a physical name (e.g., "U21-3" or "R1-2") to replace the
cryptic network name generated by the CAD system. You can also have the System
automatically assign different names by use of the "Rename networks" feature. You can
enable and tailor the operation of this feature by use of the screen obtained from the 'Convert'
page of the CAD Conversion screen by selecting 'Net Rename Strategy'.
When wiring the Fixture, choose one node on each network and wire it to the test point shown.
As you do the wiring, you should record the physical point that you have wired each network
to. Alternatively, you can choose other schemes of wiring. For example, you might want to
choose test points to be in order from left to right and top to bottom on either the schematic or
fixture to make them easier to find.
Once the fixture is wired, if you wish, you can go back and enter the physical names for the net
names automatically assigned by the System. To do so, enter the net name or node name as
the point name for the point. Once you have done this, the System will use the names you
have assigned rather than choose its own names. If you have a number of renames to do and
the information is available in ASCII format, you can redo the conversion with the revised 'Net
Order File' selection of the CAD Conversions screen. To do so, create a file with a line for
each test point containing a test point number, a space or comma, then the test point name.
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Translation Notes
For your interest, here are some notes about other internal files generated
during the translation process. These are only of interest if you wish to
perform specialized operations with the intermediate CAD data: Translation
of CAD formats produces intermediate output files resembling the Mentor
format. The Mentor.NET and Mentor.CMP files produced can later be
translated as Mentor CAD format files if desired. Mentor.LNL and
Mentor.RNL files may also be generated. Mentor.LNL contains net names
from the input file before they have been truncated. Mentor.RNL contains a
list of any net renames. The Mentor.NET file contains net names truncated
to eight characters and should be used for any additional selective net
remaining of the test program. If the translation of the original CAD files
produces more than 1000 test steps, additional steps are written into a test
program in the test program directory named as the user-specified CAD file
prefix plus the letters "TWO".

The CAD Conversion screen shown in the following figure is available from the 'Tools' menu
in the Edit screen. The selections are described below.
CAD Conversion Screen Convert
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CAD Data Conversion

Topics List
Net List File below
Component Value File below
Net Order File below
CAD Files Directory below
Exception Report File on page 10-6
Fixture Wiring Report File on page 10-8
Test Program File on page 10-8
Assign Default File Names on page 10-8
CAD Format on page 10-9
Manual CAD Conversion on page 10-9
Customizing CAD Conversion on page 10-9
Net List File

Allows you to select the name of the CAD data input net-list file that you are going to convert.
Depending on the CAD data that you have selected, the System will use default extensions for
each type of data to be read. For example, if you are using P-Cad and enter a file name of
"W345", the System will look for "W345.WRL" for the net list, and "W345.MAT" for the
material list. Unless a different path is selected with the 'CAD Files Directory' selection, the
System looks for these files in the same directory as the System software (C:\checksum).
Component Value File

Allows you to select the name of the CAD data input file that contains the component values,
such as the resistance value of the resistors in the UUT. The file name is automatically entered
for you once you have entered the net list file name and selected 'Assign Default File Names',
but you can explicitly enter another name if your CAD data does not followed the default name
assumptions.
Net Order File

Allows you to specify a list of point numbers and point names to assign prior to the
conversion. During the conversion, the System assigns any remaining point numbers in the
order new networks are encountered. The format of the net order file is ASCII, with each line
containing a point number (e.g. 6), followed by a space or a comma and space, followed by a
net name (e.g. +12V, MC-7, or R1-1). If this file is not assigned, the System will
automatically assign point numbers in net-list order.
CAD Files Directory

Allows you to specify the directory that the System searches for the CAD Data input files.
Temporary conversion files, the exception report file, and the fixture wiring report file are also
written to this directory. If this file path is not specified, the System uses the same directory as
the System software (C:\checksum).
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Exception Report File

The exception report file (example shown in the following figure) entry tells the System the
file name to use for the exception file. Each time you generate a test program, the System
automatically overwrites any existing exception file. To examine the Exception Report, you
can use 'View' selection in the 'File' menu. From there you can display or print the report.
The first section of the Exception Report (if present) warns you of network names in the net
list that are two long to uniquely translate (over eight or twelve characters in length as
applicable to the CAD data you are translating). If errors are shown, you should edit your net
list to reduce the length of the listed names, otherwise tests of components connected to these
network names may not be properly generated. The next section of the Exception Report
describes components that have been programmed, but have more than two leads. Since the
System generates tests based on points one and two of each component, you may want to
generate additional tests for the other points or check to ensure that the generated tests use the
proper points.
The next section of the Exception Report shows the names of the components found in the net
list that did not generate a test. These typically will be components such as ICs (e.g., U201)
and connectors (e.g., JP1), but may include names of components that you wish to test, but are
not listed in the Reference Designator Template.
The final section of the exception report shows test steps that have been consolidated because
the components were wired in parallel. This section shows a full listing of the combined
components. The test program may not list all of these components due to a limited amount of
space in the test title area.
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Example Exception Report
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Fixture Wiring Report File

The Fixture Wiring Report File (example shown in the figure below) entry tells the System the
file name to use for the fixture wiring report file. Each time you generate a test program, the
System automatically overwrites any existing fixture wiring report file. To examine the fixture
wiring report file, you can use 'View' selection in the 'File' menu. From there you can display
or print the report.
The fixture wiring report shows, for each point, the point number, point name, the interface
block or connector and point that it is connected to at the fixture interface, and a list of all of
the other nodes on that network.
Example Fixture Wiring Report
Test Program File

This file specifies the test program that the CAD conversion will be saved as. If this name is
not specified, it is necessary for you to manually save the program from 'File' menu of the Edit
screen.
Assign Default File Names

Using the 'Net List File' name as a root, assign default names to the Component Value File, the
Exception Report File, the Fixture Wiring Report, and the 'Test Program File.' You can
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CAD Data Conversion

manually go back and change any of these automatically assigned names if you wish. In some
cases, the names generated depend on the CAD Format that you are using, so the CAD format
should be specified prior to Assigning Default File Names.
CAD Format
Specify which style of CAD data is being used as the input files. If you are not sure of the
format that you are dealing with, you can refer to the example listings under Specific CAD
Types on page 10-15.
Manual CAD Conversion

Using the specified CAD format and assigned file names, convert the CAD data to a test
program. The steps that are performed are listed in Generating the Test Program on page 10-2.

Overview
The CAD Conversion screen shown in the following figure is available from the 'Tools' menu
in the Edit screen, then selecting the 'Customize' tab in the lower right corner.
Customized Conversion allow you to specify special functions during CAD conversion that
will allow you to more directly target the specifics of your particular CAD data. Since layout
and schematic entry personnel may use different conventions for parts and net naming, or
specify parts not usually encountered during conversion, this section can help you obtain a
better conversion by accommodating these unique requirements.
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CAD Conversion Screen - Customize
The selections unique to this screen are described in the following topics:
Reference Designator Template below
CAD Conversion Steps on page 10-12
Net Rename Strategy on page 10-14
Reference Designator Template

The Reference Designator Template, shown in the following figure, is used to specify how
translations are made from reference designators (e.g., "R1" or "C901") to test steps types
(e.g., RES or CAP) when the test program is generated. A component reference designator
identifies an individual component. A component reference designator consists of a
component type such as 'R' or 'C' followed by a component number. The reference designator
table defines what components have test steps generated during CAD conversion. Most CAD
libraries use just a component type and number to identify individual components. Sometimes
libraries will add optional characters to a component type or after the component number to
differentiate between individual components. When generating the test program, the System
generates test steps based on the entries in this table. In this screen, you can use the mouse to
select any position, then type in a new entry.
Reference Designator Template Screen
For example, if the first line specifies a reference designator of "R", and a generated test type
of "RES", the System searches the CAD data for occurrences of R1, R2, R3,.. and generates a
RESistance test for each one found. In general, the system attempts to generate a test step
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CAD Data Conversion

between points one and two of each reference designator. If point one or two is not found then
another point is used to generate a component test.
Automatic generation occurs in sequential order (e.g., R1, R2, R3, ...) for each translation. The
System starts at the translation shown on the top line of the screen, then does the second line,
and so on to the bottom in the table.
The Reference Designator Template allows specification of suffixes to component reference
designators. The optional suffix follows the reference designator number of an individual
component. Suffix specifiers are either the !, ? or * characters. An exclamation present in a
specifier represents any single character. An asterisk represents zero or more characters. A
question mark represents zero or one characters. For example, to convert components such as
R123-a and R123a, an asterisk as the suffix character to the R reference designator could be
used. The default Reference Designator Template has no suffixes for component types.
Some CAD libraries allow optional characters to precede the reference designator type
character(s). Use a prefix specifier of !, ? or * to allow for these optional characters. For
example, to convert only capacitors with two character prefixes such as 3aC10 and 2bC11, a
prefix string consisting of two exclamations '!!" could be used with the C reference designator.
You can use the top to bottom order to generate the test program so that it will work the best.
For example, you will probably want to have the switches and pots set properly before doing a
continuity test or testing parallel paths.
The information in this table is saved in the station configuration data so that it can be tailored
to meet the your specific needs and CAD standards, then saved for future use.
The 'File' pull-down of the Reference Designator Template screen allows several functions:
Import allows you load a file that contains the values in the Reference Designator Template
screen. This must have been previously saved with the Export Function. You may wish to use
this function to load the unique characteristics for one of your UUT families, or one type of
CAD system that you use.
Export allows you save a file that contains the values in the Reference Designator Template
screen. You may wish to use this function to save the unique characteristics for one of your
UUT families, or one type of CAD system that you use.
Multi-Test Template allows you specify particular parts that have more than one test step
generated per part. The screen that is used to generate this function is the Component MultiTest Template shown in the following figure.
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Component Multi-Test Template Screen
Use the Component Multiple Test Template to enter multiple tests, or tests with specified point
numbers for the component selected at the time Component Multiple Test Template is selected.
In the left column, enter the reference designators desired. For example, if the Reference
Designator is SW, and the first column contains 1-3 and 7, the system will generate test steps
for SW1, SW2, SW3 and SW7. The second column contains the point numbers that generate
test steps. In the figure above, the system generates a SwchR test step for points SWx-COM to
SWx-NC, another for points SWx-7 and SWx-5, and another for SWx-COM1 to SWx-NC1.
Print Screen allows you to print out the screen that you are observing. This can be used to
document a setup that you have entered.
Exit returns to the CAD Conversion menu.
CAD Conversion Steps

The CAD Conversion Steps screen is used to individually select the steps that occur when
automatically generating a test program. This allows you to use these automatic capabilities
with test programs not generated by a CAD file (e.g., you might want to have the System
automatically merge parallel components and assign high/low test limits and preliminary
measurement range for a test program that you have manually generated), or to skip parts of
the conversion process. The CAD Conversion Steps screen, which is accessed by this
selection, is shown in the following figure.
The detailed descriptions for each of the steps of this process also apply to the fully automatic
generation of the test program when selected from the CAD Conversion screen.
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Note
Not all of the steps may work without first selecting others. For example,
you cannot generate test steps unless you have first performed test point
assignment.
CAD Conversion Steps Screen
In this screen you can enable (with a check) or disable each step of the conversion process:
Test Point Assignment reads the net-order-file and/or the net-list file to assign node numbers
and node names.
Test Step Generation generates the test steps as defined by the Reference Designator
Template. In order for this to be effective, 'Test Point Assignment' must also be enabled.
Assign Nominal Values reads the component values file and assigns the values to the test
steps that are generated, or are already in memory.
Merge Parallel Components finds parallel components and merges them (e.g., if C1 and C7
are connected to the same test points, the System sums their values and puts them together into
one test step). The test title of the consolidated test step lists the name of both components
separated by a vertical line. If more parallel component names are consolidated than will fit in
the test title on one line, the System stops adding the new component names into the title, but
instead adds one or more periods (e.g., "...") indicating that more components than those listed
are tested in parallel by that step. If nominal values are assigned when this step is executed,
the System adds capacitance values, leaves diode values the same, and computes parallel
resistance values.
Assign Test Limits assigns high and low test limits, and a preliminary measurement range for
each test step in memory, based on the test type and nominal value.
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Net Rename Strategy

The Net Rename Strategy screen allows you to enable and tailor the rename of point names as
assigned from the CAD data. When you select 'Net Rename Strategy' from the CAD
Conversion screen, you obtain the Net Rename Strategy screen shown in the following figure.
Net Rename Strategy Screen
The top box allows you to specify which test points are renamed. You can select "No Net
Renaming" (the default), "Rename All Networks", or "Rename Selected Networks". If
"Selected" is chosen, the System only renames point names that begin with a specified prefix.
This is handy for only renaming networks that are automatically named by the CAD system
and have no specific meaning to test engineers. If "Selected" is chosen, you can enter the
name prefix to replace. The default rename prefix chooses different prefixes based on the type
of CAD data. For example, for OrCAD, it chooses "N" since OrCAD systems name
unspecified networks as "N00001", "N00002", and so on.
You can specify what to rename the networks to. The 'Rename networks as' selection allows
you to specify what the test point is renamed as. You can chose between "First Component"
and "Prioritized Names". If "First Component" is selected, the System chooses the first
component listed on each network as the new network name. If "Prioritized Names" are
chosen, the System uses a priority to choose the most meaningful new name. It looks through
all components on the network and first for a test point (TP), then for a connector (J and P),
then for an IC (U), and finally, if it can't find any of these, it uses the first component of the net
list.
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Note
If you plan on sharing test programs between DOS MDA and Visual MDA,
select the 'Limit Net Names to 8 Characters' option. This option insures
unique 8 character names are created during CAD conversion. The DOS
MDA software only uses the first 8 characters of a net name.
Choosing 'OK' returns you to the CAD Conversion screen.
Specific CAD Types

The following are pointers to discussion of various CAD types:
P-CAD Data Conversion on page 10-16
Mentor Data Conversion on page 10-17
OrCAD Data Conversion on page 10-19
HP-BCF Data Conversion on page 10-20
Cadence Data Conversion on page 10-22
Racal-Redac Data Conversion on page 10-23
ViewLogic Data Conversion on page 10-24
Tango Data Conversion on page 10-28
ComputerVision Data Conversion on page 10-26
Pads2000 Data Conversion on page 10-30
Schema Data Conversion on page 10-32
Scicards Data Conversion on page 10-32
Veribest Data Conversion on page 10-33
Fabmaster Data Conversion on page 10-34
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Notes on P-CAD Data Conversion

The P-CAD conversion format expects two ASCII files - the netlist with a .WRL extension,
and a materials list with a .MAT extension.
If you use the "Rename Networks" feature of the System, the default selected rename prefix
for P-CAD translation is "UN".
The expected netlist format is shown below in the following figure.
P-CAD Net List Format
The expected materials list format is shown below. Note that this file is only used to determine
the nominal values of the components in the test program and the consequent upper and lower
test limits. If you do not have this file, the System will issue a warning but will continue with
test program generation after you have pressed a key.
Since there is not a standard P-CAD format for assigning component values, the .MAT file
will not be of use to you during file generation unless you have used the following convention.
For each item in the materials list, generate a description field with the component value:
DEVICE=<value>
Value should be the value of the component followed by a space, end of line, underscore (_), F
for capacitance value, or Z for resistance value. The field may contain modifiers such as k for
kilo or u for micro. In the case of capacitors, an "M" is converted to a "u" for micro.
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P-CAD Materials List Format
Notes on Mentor Data Conversion

The Mentor conversion format expects two ASCII files - the netlist with a .NET extension, and
a component (materials) list with a .CMP extension.
for Mentor translation is "N".
The expected netlist format is shown below in the following figure.
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Instruction Manual
Mentor Net List Format
The expected component list format is shown below in the following figure. Note that this file
is only used to determine the nominal values of the components in the test program and the
consequent upper and lower test limits. If you do not have this file, the System will issue a
warning but will continue with test program generation after you have pressed a key.
The .CMP file expects the component values to be listed just past the PART annotation in the
value field.
The component format should be the value of the component followed by a space, end of line,
underscore (_), F for capacitance value, or Z for resistance value. The field may contain
modifiers such as k for kilo or u for micro. In the case of capacitors, an "M" is converted to a
"u" for micro.
Mentor Component List Format
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Notes on OrCAD Data Conversion

The OrCAD conversion format expects two ASCII files - the netlist with a .NET extension,
and a cross reference list with a .CRF extension.
for OrCAD translation is "N".
To generate the netlist, output the data in Mentor format. For example:
NETLIST <schematic name> <output file name> /F /S Mentor
The expected netlist format is described in Mentor Data Conversion on page 10-17.
The component values are taken from the cross reference file generated by the OrCAD system.
The System expects this file to be available with a .CRF file extension. An example of this file
format is shown in the following figure.
OrCAD Cross Reference File Format
This cross reference file can be generated (for example) by:

CROSSREF <schematic name> <output file> /F /S /P
The cross reference is only used to determine the nominal values of the components in the test
program and the consequent upper and lower test limits. If you do not have this file, the
System will issue a warning but will continue with test program generation after you have
pressed a key.
The component format should be the value of the component followed by a space, end of line,
underscore (_), F for capacitance value, or Z for resistance value. The field may contain
modifiers such as k for kilo or u for micro. In the case of capacitors, an "M" is converted to a
"u" for micro.
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Instruction Manual
Notes on HP-BCF Data Conversion

The HP-BCF conversion format expects an ASCII BCF file as used with the (Agilent) HP3065 and HP-3070. This single file, containing both netlist and component information, is
read with a file extension of .BCF. When reading these files, the CheckSum MDA System
uses its own tolerance defaults rather than those out of the .BCF files.
The expected file format is shown below in the following figure. Typical .BCF files have
other sections (e.g., *SUMMARY), but the ones shown in the example (as well as other
component types) are the only ones used during the conversion process.
The "Rename Networks" feature of the System is not available with HP-BCF conversion since
the connection names are only available in one form.
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HP-BCF File Format
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Instruction Manual
Notes on Cadence Data Conversion

The Cadence conversion utility expects one ASCII file with an extension of .NET. The
System uses this file to extract both parts value and connection information.
for Cadence translation is "net".
The expected ASCII file format is shown below in the following figure. Note that the ASCII
file should have CR/LF line terminators. When transferred from the workstation, the file may
contain only LF line termination. To add CRs to the file, it may be necessary to read it into an
ASCII editor and write it back out again.
Net list information is obtained from the .ROUTE section of the file.
Component information is obtained from the .PLACED section of the file. The data will not
be of use to you during file generation unless you have used the described format for assigning
part values. Within this section, the translator looks for titles in the first column with an
underscore. The information from the underscore to the next space is translated to a
component value. The value of the component should be followed by a space, underscore (_),
end of line, F for capacitance value, or Z for resistance value. The field may contain modifiers
such as k for kilo or u for micro. In the case of capacitors, an "M" is converted to a "u" for
micro.
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Cadence Net List Format
Notes on Racal-Redac Data Conversion

The Racal-Redac conversion format expects two ASCII files - the netlist with a .CDI
extension, and a materials list with a .LST extension.
for Racal-Redac translation is "TREE".
The expected netlist format is shown below in the following figure. The data is in RacalRedac's initial data format. The System uses the .CON section of the file to obtain the
connection information. Network names are generated from the .REM data before each
network. The generated network name is the two parts of the .REM description connected
with a hyphen (-). Point names as used in the wiring report are also hyphenated between the
reference designator and the point number.
Racal-Redac Net List Format
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Instruction Manual
The expected materials list format is shown below. Note that this file is only used to determine
the nominal values of the components in the test program and the consequent upper and lower
test limits. If you do not have this file, the System will issue a warning but will continue with
test program generation after you have pressed a key. The materials list expects a .LST
convention. It is generated from the schematic entry package (e.g., CadStar) as a parts list
output.
Since there is not a standard format for assigning component values, the .LST file will not be
of use to you during file generation unless you have applicable conventions in the parts
description. The System expects the first part of the description (up to the first space) to be the
type of component (not used for translation). The next part of the description (up to the next
space) is expected to be the component value. Value should be the value of the component
followed by a space, end of line, underscore (_), F for capacitance value, or Z for resistance
value. The field may contain modifiers such as k for kilo or u for micro. In the case of
capacitors, an "M" is converted to a "u" for micro.
Racal-Redac Materials List Format
Notes on ViewLogic Data Conversion

The ViewLogic conversion utility expects one ASCII file with an extension of .FWD. The
System uses this file to extract both parts value and connection information. When reading
these files, the CheckSum MDA System uses its own tolerance defaults rather than those out of
the .FWD file.
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The expected ASCII format is shown in the following figure. Typical .FWD files have other
sections but only the $PACKAGES and $NETS sections shown in the example are used during
the conversion process. They provide parts value and connection information, respectively.
Component values in the $PACKAGES section are declared on lines beginning with an
apostrophe or a letter. The value is found in the fifth field in from the line beginning; fields are
separated by single spaces. The part value string may or may not be enclosed in apostrophes.
The value is expressed by a real number followed by an optional suffix such as k, UF, or PF.
The component name list follows an optional component tolerance which takes up two fields.
The component tolerance value is enclosed in apostrophes. Thus the component name list
begins in either the seventh or ninth fields. The name list continues to the next line if the line
ends with a space followed by a comma. The component names on the next line must be
preceded by eight spaces. Individual component names are separated by spaces within the
component list.
The $NETS section declares component interconnections. Net names are declared starting in
the first character of a line. A net name may optionally be enclosed in apostrophes. The node
name list of components follows the net name declaration. A node name is composed of the
reference designator followed by an optional function field (:Fxxx where xxx is an integer),
followed by the point number field (.nn where nn is the point number). Node names are
separated by spaces with the net list. The node name list can be continued to a following line
by adding a comma to the last node name on a line and continuing eight spaces in on the next
line.
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Instruction Manual
ViewLogic Net List Format
Notes on ComputerVision Data Conversion

The ComputerVision conversion facility expects an ASCII file with an extension of .NET to
generate network information. An example of this file is shown in the following figure.
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ComputerVision Net List Format
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Instruction Manual
Modified Mentor Component List Format
Notes on Tango Data Conversion

The Tango conversion facility expects one ASCII file with an extension of .NET. The format
of the Tango file is shown in the following figure. It consists of a component declaration
section followed by a net declaration section. Component declarations are enclosed in square
braces. Network declarations are enclosed in parentheses. Any input lines not within matched
braces or parentheses are treated as comments and ignored.
Component declarations have the following format:
[
refdes
package
type
value (for some components)
(blank line)
(blank line)
]
The refdes is the reference designator consisting of up to 16 uppercase alphanumeric
characters. The package is a component package name and consists of up to 16 uppercase
alphanumeric characters. The type is the component type, up to 16 alphanumeric characters in
length.
Net declarations have the following format:
(
net_name
node
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Specific CAD Types
node
...
)
A net consists of an arbitrary number of nodes that are connected together. A node consists of
a component reference designator followed by a delimiter and a point designator. The
delimiter may be a hyphen, comma or a space. The point designator may be up to 16
alphanumeric characters in length. A net is contained within enclosing parentheses. Each
parenthesis is the first and only character on a line. The net_name consists of up to 16
alphanumeric characters.
Any text outside of component or net declarations is treated as comments and ignored. Net
names with point designators A through F are automatically converted to point numbers 1
through 6.
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Instruction Manual
Tango Net List Format
Notes on Pads2000 Data Conversion

To generate test programs from schematics generated with the Pads2000 CAD system, the test
System expects a net list file with the extension .NET. An example of this file is shown in the
next figure below. The component information at the beginning of this file is ignored.
Component information from the Pads2000 system is extracted from the parts list file with a
.LST extension. An example of this file format is shown in the last figure below.
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Pads2000 Net List Format
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Instruction Manual
Pads2000 Component List Format
Notes on Schema Data Conversion

To generate test programs from schematics generated with the Schema schematic CAD system
(by Omation Inc. of Richardson TX), the Tango intermediate file format can be used. (See
Notes on Tango Data Conversion on page 10-28).
Schema for Windows supports net list generation to Tango format. To generate this format,
use the net list output screen within Schema. In this screen, select Tango net list output.
Once net list generation is completed, you will have a net list file on your disk with a .TNL
extension (e.g., xxx.TNL). To read it into the CheckSum system, rename it to have a .NET
extension (e.g., RENAME xxx.TNL xxx.NET). Then select Tango input format and read it
into the System for conversion.
Early versions of Schema do not support component values in the Tango net list output, so if
you are using an early version, component values need to be edited into the net list (see Tango
Data Conversion on page 10-28) or manually entered after translation. Contact Omation if you
have questions about revisions supporting this translation.
Unnamed networks from Schema begin with $$ (e.g., $$040). Therefore, specify the $$ prefix
if you would like to use the net-rename facilities of the CheckSum CAD translator.
Notes on Scicards Data Conversion

To generate test programs from CAD data generated by Scicards the test System expects a
single ASCII file with the .DOC extension. An example of this file is shown in the following
figure. This file contains both component information in the PARTS LIST section and net
information in the NET LIST section. Both sections are used during test program generation.
Scicards CAD Data Format
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Notes on Veribest Data Conversion

The Veribest format conversion uses two ASCII files, a net list and a Bill Of Materials. The
default extensions that CAD Conversion recognizes are .NET and .BOM, respectively.
If you use the "Rename Networks" feature then the default selected rename prefix for Veribest
is "XSIG".
The format of the file section containing the net list is shown in the following example:
$NETS$
NET ALE
IC34
IC33
MD158
NET BSPM[0]
U103
IC34
MD183
NET CS_FPGA~
IC34
IC33
MD201
R405
NET CS_ISDN~
IC19
IC34
MD202
NET CS_RAM~
IC20
IC23
IC33
MD204
$END NETS$
66
34
1
12
86
1
16
83
1
1
3
26
1
20
22
82
1
The expected format of the Bill Of Material file is shown in the following example:
Bill of Material
Item
Qty
Reference
Vendor Part #
Description
R473
215S2100
RES SMD 10R 1% 0.1W 0603
R1054
R1055
215S2130
RES SMD 13R 1% 0.1W 0603
R1053
215S4910
RES SMD 9K1 1% 0.1W 0603
RN8
RN7
449S0011
RES SMD NET 10K COMMON
1
1
2
2
3
1
4
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Instruction Manual
5
C443
421S1002
CAP SMD 10uF 20% 25V TANT/D
C447
423-4024
CAP 6n8 5% 63V P5mm PESTER
D51
434-0004
DIODE ZENER 2V4 5% W5
1
6
1
7
1
Notes on Fabmaster Data Conversion

To generate test programs from CAD data generated by Fabmaster, the test System expects
two ASCII files. In addition a third ASCII file, NAILS.ASC, is used if present. The net list
file has a .NET suffix. The component file has the same prefix but with a .MTL extension.
Examples of the Fabmaster net list and material list files are shown, respectively in the next
two figures below. The optional NAILS.ASC file specifies the order in which the net names
are assigned to test points. An example excerpt from NAILS.ASC is shown in the last figure
below.
Fabmaster Net List Format
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Fabmaster Materials List Format
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Fabmaster Nails File Format
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Chapter 11
Sample Reports
This section is composed of report examples.
Test Results Report Example on page 11-2
Test Program Report Example on page 11-3
Batch Report Example on page 11-4
Test Program in ASCII on page 11-5
Statistics Data File Example on page 11-6
Wire Run Report Example on page 11-7
Production Report Example on page 11-8
Pareto Failure Report Example on page 11-9
X-Bar/Sigma Report Example on page 11-10
Sample Reports
Example Test Results Report
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Instruction Manual
Sample Reports
Example Test Program Report
11-3
Sample Reports
Example Batch Report
11-4
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Instruction Manual
Sample Reports
Example Test Program in ASCII Format
11-5
Sample Reports
Example Statistics Data File
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Instruction Manual
Sample Reports
Example Wire Run Report
11-7
Sample Reports
Example Production Report
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Instruction Manual
Sample Reports
Example Pareto Failure Report
11-9
Sample Reports
Example X-Bar/Sigma Control Report (Printer Version)
11-10
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Instruction Manual
Sample Reports
Example X-Bar/Sigma Control Report (Print to File Version)
11-11
Sample Reports
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Chapter 12
Command Line Parameters
The Test System allows you to specially tailor operation with command line parameters.
Command line parameters are used when you first invoke the Software. The parameters are
entered on the line after System software (VISMDAMC.EXE). Each parameter is separated
by one or more spaces and can be in upper or lower case.

Instruction Manual

Parameter
Action
/r
Open, load and run a test program. When /r is followed by a test program
name, the System automatically loads the requested test program, then
begins execution.
/rq
Open, load, run a test program, then quit the System software when test
completes. When /rq is followed by a test program name, the System
automatically loads the requested test program, executes the program and
terminates.
/l
Open and load the test program specified after the command (for example, '/l
MY_TEST'). The main system screen is displayed.
/lt
Open and load the test program specified after the command (for example, '/lt
GO_TEST'). The test screen is displayed.
/nc
No calibration. Normally, the System measures internal reference values

each time the System software is invoked. If the System is started with this
parameter, the internal references are not measured during power up.
Instead, the reference values determined during the last self-test are used.
Use of this parameter can provide more consistent operation if the controller
is powered up and the software started at a greatly different ambient
temperature than normal operating temperature.
/cf
Configuration File. Specify the file name (optionally preceded by a path) for
the station configuration file. If not specified, the file name is $MC$.DAT in
the same directory as the System software file. The /cf parameter can be
used in network configurations so that the System software file can be
shared, but each station can use its own configuration file which includes the
station's unique calibration and setup information.
/sf
Show Failures. When executing a test program, display the failed test
outcomes on the CRT, even if the System does not halt on the test step. This
can be used to allow the operator to keep better track of System test activity,
but at the expense of a little test speed.
/sfp
Show Failures and Passes. Same as /sf, but also shows passed test steps.
/net
Set network retry time. Allows you to specify how long, in seconds, to wait for
the system to wait for a network file to become available for use. This time is
necessary when more than one System is sharing a file and it is necessary
for one System to close the file before the other can use it. The default is 10
seconds. To set a maximum delay of 30 seconds for example, specify /net
30.
/pw
Password for exit. If the System is started with this command line parameter,
the operator must enter the System password before exiting from the System
Menu).
/spc
Additional SPC Log File output. If /spc . <ext > is specified, the System,
whenever writing SPC data to the disk, will also write to the log file having the
.<ext> suffix specified. If the <File > is not present, it will be created. The
log file name prefix matches that of the default SPC Log File.
/tl
Time logging. If /tl is specified, the System keeps track of execution time of
each test step. This capability can be used to fine-tune test program
execution speed by identifying test steps which take excessive time. When /tl
is specified, you can press [Control-M] while in the Edit screen, and the
System will display the execution time (in mSec) of each test step in the
range column. Resolution of the times is about 50mSec. Pressing [ControlM] again returns to the regular display.
/t
Specify temporary file directory. If /t is specified, the string that follows it

specifies the location of the directory used to hold temporary files. These files
are used e.g. to create test result reports sorted by PCB number. If no
location is specified, then the current directory at the time the System
software is executed is used. The temporary file location should generally not
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be a server location shared by more than one test station.
/log
Specify output file for LOGIC test details.
/km
Load the lower eight bits of the specified value into the operator keypad mask
register (see Operator Keypad on page 2-11 for keypad mask bit
information).
/ppath
Specifies the test program directory location in the string following this option.
This overrides the spec data path stored in the system configuration.
/spath
Specifies the SPC Log File directory location in the string following this
option. This overrides the statistics data path stored in the system
configuration.
/mpxlimit
Specifies the maximum allowed multiplex offset value.
/nocapdcisweep
Disables DCI cap measurements during measurement sweeps (e.g. from

SHIFT F3) of the measurement analysis screen for capacitors. This is
intended to speed analysis of non-DCI capacitor measurements.
/multiple
This allows a second session of vismdamc to run. This must be the last
parameter in the command line parameter list. It is only used on the
command line of the second vismdamc session.
/oldspcfilename
Specifies SPC data to be saved in files named 'YYYMMDD.DAT' rather than

'YYYYMMDD.DAT'. The year 2001 will use '101MMDD.DAT' files rather than
'2001MMDD.DAT' files.
Note that if you have configured automatic reporting, the System will save the results data for
you during testing. Following are examples of using command line parameters:
1. Automatically load and begin execution of the test program 'PN324':
VISMDAMC /r pn324
2. Start the System with the keypad keys F3 through ESC disabled (only F1 & F2 can be
used):
VISMDAMC /km 6
3. Run two test programs (named 'SPEC1' and 'SPEC2') in succession, transparently, from a
batch file and print a message to the operator telling whether each passed or failed:
echo off
VISMDAMC /r spec1
if ERRORLEVEL 1 echo "part 1 fail"
if NOT ERRORLEVEL 1 echo "part 1 pass"
VISMDAMC /r spec2
if ERRORLEVEL 1 echo "part 2 fail"
if NOT ERRORLEVEL 1 echo "part 2 pass"
4. Start the System using station configuration data stored in the file 'STATION9.DAT' in
the directory 'CONFIG' on device 'E:' VISMDAMC /cf E:\config\station9.dat

5. Start the System enabling time logging: VISMDAMC /tl
12-3

12-4
Instruction Manual
Chapter 13
Trouble Shooting
In Case of Problems
If you suspect problems in the operation of your Test System, you should run the self-test that
is available from the Configure screen on the Modules page. Directions for running the selftest are included in the Operating Instructions section of this manual.
Display Problems
If the Visual MDA windows do not display fully (they look cut off), you will need to adjust the
Windows display properties settings. The Display Properties settings are controlled in the
Windows Control Panel. The Display Properties Font Size is controlled under the Advanced
button option. Select the Control Panel > Display > Settings tab > Advanced button >
Display Font Size and set this selection to Small Fonts. If the Font Size selection is set to
Large Fonts, several Visual MDA windows may not display properly.
Printer Problems
In general, first review the manual provided with the printer. If you are using a serial printer
and it appears to be working normally but stops printing at times, you can try the following
suggestion. The default baud rate is 9600. This is set with switches inside the printer and in
the Configure System > External Hardware tab > Test Screen Report Device COM1 (or
COM2) > Baud Rate. Some serial printer problems can be fixed if you set the baud rate to
1200 for both the printer and in the system configuration. In the serial printer, the DIP array
switch 6 and switch 7 when set to OFF will configure the printer for 1200 baud. Be sure to
turn-off the power before changing the switch settings. The DIP switch is located under a
cover on the bottom of the printer (see the printer manual). All the other switch settings are
normally in the ON position.
Configuration Problems
If the self-test reports a number of errors, it is likely to be caused by an installation problem
such as address jumpers improperly installed or an address conflict with another module in the
PC.
Trouble Shooting
In Case of Problems
Instruction Manual
Failed Components
If a single test-point or group of points give errors that are the same each time you run the test,
there may be a failed component on one of the test point modules. If this is the case, you may
want to inspect the MPX Module for damage or return it for analysis. Run self-test and refer
to the Test Point Electronics on page 13-3 section for more information.
Addresses and Jumpers

Ensure that you do not have any overlapping addresses in the way that you have jumpered the
Modules. The address ranges for each Module are shown in the Modules screen.
Interrupts
The CheckSum Modules (other than the Model-GPIB) do not use interrupts or DMA channels
so there can be no conflicts in these areas.
I/O Channel Conflicts

If you still have problems, there may be a conflict on the controller I/O channel. The standard
default address range (beginning at 768/300 hex) is reserved by IBM for use with the prototype
card so there should be no conflicts with standard PC hardware.
Note
Network interface cards are often set to the address range beginning at 768
(300 hex) creating a conflict.
To determine if there are address conflicts, you may wish to remove suspected cards from your
computer and try the CheckSum Modules again. Don't forget to remove power and observe
static-sensitive rules when you do this!
In the event another card in the System is using this I/O space, you may rejumper that card to
another spot. Otherwise, you may wish to rejumper the CheckSum Modules to another base
address.
Note
In some cases, other PC cards may use smaller address spaces than the
CheckSum Modules, so it may be easier to find an open area by
rejumpering another card.
Base Address
Decimal (Hex)
512 (200 H)
256 (100 H)
128 (80 H)
64 (40 H)
32 (20 H)
16 (10 H)
8 (8 H)
4 (4 H)
Base Address Settings
13-2
Instruction Manual
Trouble Shooting
The base address is the sum of the values shown above for all of the positions that have
jumpers installed. The Modules screen shows the base address range and corresponding
jumper setting for each module. The addresses of each module installed in the System must
not overlap or conflict with other hardware installed in the computer.
The default addresses when shipped are 640 (jumpers on positions 9 and 7) for the Analyst mc
System Module and 776 (jumpers on positions 9, 8 and 3) for the Model TR-8-1 MPX
Module.
The default base address and jumper settings for all of the modules as shipped from CheckSum
are discussed in the following topics:
Modules Configuration on page 5-3
Environment Configuration on page 5-8
When you change a module's base address, you must also go to the Module screen and change
the corresponding base address entries to match the jumpers of the modules.
The configuration screens allow you to enter the base address for each module. After you have
entered the address, the System displays the jumper positions that correspond to that module.
If the address that you enter is different once it is displayed, it is because the address that you
entered cannot be jumpered. For example, it is an odd base address when only even base
addresses can be jumpered. Alternatively, you can use the modules page of the configuration
screen to alter the jumper settings, than read out the resultant base address.
Analyst mc Test Point Modules
The Analyst mc uses high-performance solid-state multiplexers to switch the test signals.
These are very reliable parts, but can be damaged from extreme electrostatic discharge or
abuse. The Analyst mc uses replaceable modules.
On the Analyst mc system board, the replaceable modules are arranged as follows:
13-3
Trouble Shooting
Instruction Manual
Note: Each MC-1 module controls 48 test points, the module in JP8 controls points:
49,50 99,100 149,150 199,200 249,250 299,300 349,350 399,400
JP7
JP8
Test Points
151 - 198
JP9
JP10
351 - 398
101 - 148
JP11
JP12
301 - 348
51 - 98
JP13
JP14
251 - 298
1 - 48
JP15
JP16
201 - 248
Note: Each cable to the fixture interface block has 50 test points
For example, the cable from JP15 has test points 1 - 50
Analyst mc System Board MC-1 Module Locations (component side shown)
When the multiplexer module experiences an input voltage at a test-point that is greater than
12V from the computer chassis, the protection networks and multiplexer IC protection circuits
attempt to prevent permanent damage to the module.
However, sustained over-voltages can damage the multiplexer ICs or protection networks. If
one of the test-points fails self-test, you can find its module on the following chart, then
replace it. In most cases, this can be detected by measuring the voltage at the test-points with a
hand-held DMM while the system is powered up and reset (like when observing the main
menu). The voltage should be less than one volt referenced to the chassis. If you observe
higher voltages, the problem is likely to be caused by a faulty module.
Each replaceable module has 48 test points. The module in location JP8 provides the last 2 test
points for each of the other modules (49,50 99,100 etc) to make 50 test points for each cable
that connects to the fixture interface blocks.
Note
If you replace a test point module, the alignment of the module pins
and the system board connector must be correct. The system board
has a printed outline to help insure the module is correctly installed. If
you plug-in the module incorrectly and turn on the power switch, you
will almost certainly damage the electronics on the module and need to
replace it.
The following table shows the correlation between the test points and the modules on the
Analyst mc:
13-4
Instruction Manual
Trouble Shooting
Test Point No.
Module Location
1 - 48
JP15
49 & 50
JP8
51 - 98
JP13
99 & 100
JP8
101 - 148
JP11
149 & 150
JP8
151 - 198
JP9
199 & 200
JP8
201 - 248
JP16
249 & 250
JP8
251 - 298
JP14
299 & 300
JP8
301 - 348
JP12
349 & 350
JP8
351 - 398
JP10
399 & 400
JP8
Analyst mc Field-Replaceable Modules
TR-8-1 Modules
The TR-8-1 MPX Modules use high-performance solid-state multiplexers to switch the test
signals. These are very reliable parts, but can be damaged from extreme electrostatic discharge
or abuse. The TR-8-1 multiplexer ICs are socketed on the circuit boards for ease of
replacement without damage to the module.
On the TR-8-1 Modules, the multiplexer ICs are arranged as follows:
U10 U11 U12 U13 U14

U20
U21
U32
U33
U44
U45
U23
U35
U47
MPX Module IC Locations (component side shown)
The table below shows the correlation between the test-points and the solid-state switches on
the MPX modules.
13-5
Trouble Shooting
Instruction Manual
When the multiplexer module experiences an input voltage at a test-point that is greater than
12V from the computer chassis, the protection networks and multiplexer IC protection circuits
attempt to prevent permanent damage to the module.
However, sustained over-voltages can damage the multiplexer ICs or protection networks. If
one of the test-points fails self-test, you can find its multiplexer IC on the following chart, then
replace it. In some cases, the protection network can also be damaged from over-voltage input.
In most cases, this can be detected by measuring the voltage at the test-points with a hand-held
DMM while the system is powered up and reset (like when observing the main menu). The
voltage should be less than one volt referenced to the PC chassis. If you observe higher
voltages, the problem is likely to be caused by a faulty MPX IC and/or protection network.
The protection networks are located physically adjacent to the MPX ICs that correspond to the
same test-point numbers.
TR-8-1 TEST-POINT MULTIPLEXER ICs
Multiplexer IC: CheckSum PN 011553
Protection Network: CheckSum PN REMSIM
Model TR-8-1 Pin No.
Protection Network
1-8
DN 25
U47
9 - 16
DN 24
U47
17 - 24
DN 17
U35
25 - 32
DN 16
U35
33 - 40
DN 9
U23
41 - 48
DN 8
U23
49 - 56
DN 23
U45
57 - 64
DN 22
U45
65 - 72
DN 15
U33
73 - 80
DN 14
U33
81 - 88
DN 7
U21
89 - 96
DN 6
U21
97 - 104
DN 21
U44
105 - 112
DN 20
U44
113 - 120
DN 13
U32
121 - 128
DN 12
U32
129 - 136
DN 5
U20
137 - 144
DN 4
U20
145 - 152
DN 19
U13
153 - 160
DN 18
U13
161 - 168
DN 11
U11
169 - 176
DN 10
U11
177 - 184
DN 3
U12
185 - 192
DN 1
U12
193 - 200
DN 2
U10
TR-8-1 Module Field-Replaceable ICs
13-6
Multiplexer IC
Chapter 14
Error Messages
Errors that could occur while reading or writing to and from the computer's disk or during
other operations include:
Error
Message
Error 1
Invalid DOS function number
Error 2
File not found
Error 3
Path not found
Error 4
Too many files open
Error 5
File access denied
Error 12
Invalid file access code
Error 15
Invalid drive number
Error 97
Incorrect test program revision
Error 99
Not a valid spec data file
Error 100
Disk Read error
Error 101
Disk out of space
Error 103
File Open error
Error 150
Disk is write-protected
Error 152
Drive is not ready
Error 156
Disk seek error
Error 160
Device Write-Fault (normally printer)
Error 162
Hardware failure
Error 200
Division by zero
Error 201
Range check error
Error 202
Stack overflow error
Error 203
Heap overflow error
Error 205
Floating point overflow
Error 206
Floating point underflow
Error 207
Invalid floating point operation
Error 209
Overlay file read error
Error 216
General protection fault
System Error Messages
Error Messages
14-2
Instruction Manual
Chapter 15
Test Program Examples
Example Test Program Segments

The CheckSum Analyst mc Test System provides a flexible software environment to solve
unique testing problems. This section of the manual shows example test program segments for
special testing situations that you might come across.
The first example shows how to check for the position of a switch or jumper on the assembly
that you are testing.
The next two other examples show ways to provide operator adjustment routines (using a
potentiometer as an example). These operations are also available with simple pre-written test
types (i.e. SWCHR, JMPER, POTR), but are shown here as a series of other test types to
demonstrate how the System can be used to solve complicated and unique testing problems.
The last example shows how to control the screen text and background colors during program
execution.
Related Topics
Jumper/Switch Checking below
Potentiometer Adjustments I on page 15-3
Potentiometer Adjustments II on page 15-3
Screen and Display Attribute Manipulation on page 15-4
The following example shows how the System can check for the presence of a closed switch
(or installed jumper) on the assembly. The System presents a message to the operator to close
the switch, then loops until the switch is closed. The operator can press the [F1] key to exit
and record a failure in the event the desired closure can not be achieved.

Instruction Manual
The first two lines in the test program segment display DISP messages one and two that
instruct the operator to set the switch on.
The next test step, RETRY, turns off failure retries and discharging for the subsequent JMPR
test. This allows the loop to execute much faster when the test step is not passing.
Following the RETRY test step is a label (START) defining the beginning of the loop.
A JMPR test step measures the switch to see if it is less than 100.
If the measurement is less than 100, the test passes and control goes to the DONE label. If
not, a JMPK test step checks to see if the operator has pressed the [F1] key. If the [F1] key has
been pressed, control passes to the DONE label. If [F1] has not been pressed, the System
JMPs back to the START label to test the switch again.
When the loop is terminated (by a measurement less than 100 or the operator pressing the
[F1] key), the System executes a RETRY 'Reset' test step to restore the RETRY parameters to
those when the test program was started. It then erases the displays with a DISPE test step.
Finally, the System makes an RES measurement to log the results of the test and generate a
pass/fail.
The same technique can be used for testing for open switches (or removed jumpers). Just
substitute low and high limits of the JMPR and RES test steps to be something like 100 and
20M or O_Rng. This high limit value, displayed as > 19 M, is greater than any normally
measured value, and will never cause a failure on the high side. An over-range measurement is
shown as O_Rng in the measured value. When testing for open conditions (no connection)
you can increase the speed by fixing a low range (like Range = 1, the 100 range, 190
maximum). This will prevent the System from autoranging and consequently increase test
speed.
15-2
Instruction Manual

The following example shows how the System can prompt the operator to adjust a
potentiometer to a desired value. The System presents a message to the operator to adjust
within certain test limits, then loops, making a measurement each time and displaying it to the
operator. When the desired resistance value is obtained, or the operator presses the [F1] key,
the System measures the final adjusted value and generates a pass or fail result based on the
value measured.
This test program segment works almost exactly like the previous example that shows how
jumpers and switches are tested and set.
The main difference in this example is that the System displays a measurement each time
through the loop. This is done by putting {Meas} into the DISPlay refreshed in the loop.
When the System sees {Meas} in a DISPlay line, it substitutes the last measured value from an
analog test step.
Potentiometer Adjustments II
The following example shows how the System can prompt the operator to adjust a
potentiometer to a desired value. This is similar to the last example. However, in this case, the
System stays in the loop until the operator presses the [F1] key. This allows the operator to
use his discretion about when the best adjustment is achieved. When the desired adjustment is
obtained and the operator has pressed the [F1] key, the System measures the final adjusted
value and generates a pass or fail result based on the outcome.
15-3

Instruction Manual
This test program segment works almost exactly like the previous two examples so you can
refer to the description of those for the general idea of how the program flow works.
In this case, however, the System takes a measurement, and in all cases continues on through
the loop. The tolerances of the JMPR are set loose enough such that the test always passes
(e.g., 0 and 20 M). This prevents the System from performing any failure retries and
hence speeds operation. In fact, on fast computers you may want to put a PAUSE, as shown in
the example, to slow down the refresh rate in the loop.

The following examples show how to use the SCRN test type for manipulating display
attributes (i.e. text color and background color).
First we make the area from row 2 to 7, column 10 to 40 to have yellow text color (0) and
black background color (16). Use the Set Display Attribute operation (512) to turn-on this set
of attributes. The resulting total range value is 656 (0+16+512 = 528). Then we write
something in this region.
Next we make the adjacent area from column 41 to 70 to have white text color (15) and red
background color (64). Use the Set Display Attribute operation (512) to turn-on this set of
attributes. The resulting total range value is 591. Then we write something else in this second
region.
The operator is told to press any key. After a key is pressed, the text is erased on the entire
display (rows 1-8 and columns 1-80). The background is not affected.
15-4
Instruction Manual

Then, we save the area, text and background, in rows 2 to 7 and columns 10 to 70 in a file
named screen.txt. (We will load in this file the next example). Finally, we ask the operator to
press any key to finish. A final message is displayed across both regions.
Example Program for Display Attribute Manipulation
15-5

Instruction Manual
Test Program Display Messages
The following is the result if we run the test program.
Example Screen Result for SCRN Test Type
The following examples show how to use the SCRN test type for loading an existing message
and attribute file. We will use the screen.txt file created in the previous example. However,
instead of putting the message and attribute in row 2 to 7 and column 10 to 70, this time we put
them in row 1 to 6 and column 7 to 67.
15-6
Instruction Manual

Example Program for SCRN Load Operation
The following is the result if we run the test program.
Example Screen Result for SCRN Load
15-7

15-8
Instruction Manual
Chapter 16
Theory of Operation
Overview
The CheckSum Analyst mc Manufacturing Defects Analyzer has been designed to effectively
measure a variety of components, both out-of-circuit and in-circuit. To deal with the variety of
in-circuit conditions that can occur, the System offers several measurement methods and
techniques.
This section describes these techniques and gives you an idea about how to best use them to
solve testing problems. For most measurements, you can use the System interactively to
choose the best technique and it is not necessary for you to know the details of the
measurements. However, if you want to obtain optimum results on problem measurements or
guarding, or simply to better understand the system, you should read this section.
The System contains two separate measurement modes:
Current Mode - Uses a DC constant-current stimulus for taking measurements.
Voltage Mode - Uses either AC or DC voltage stimulus for taking measurements.
Each of these measurement modes is described separately. Finally, some guidelines about how
to test in general are included. This section also gives tips on how to test various specific
components.
Main Topics
Current Mode below
Voltage Mode on page 16-5
Measurement Guidelines on page 16-9
Current Mode
Overview
The Current Mode uses a precision constant-current source in conjunction with a voltage
measurement capability to effectively test resistors, semiconductor junctions, and capacitors.
Each is discussed below.
Theory of Operation
Current Mode
Instruction Manual
The System can provide DC constant-current in six-decade steps from .1 A to 10 mA and has
three voltage measurement ranges of 20 mV, 200 mV and 2 V full range. Between
combinations of source currents and measurement ranges, the System can provide a number of
unique measurement ranges. Typically, 2 V full-range values provide better accuracy.
However, when measuring in-circuit, it may be necessary to use 200 mV ranges to prevent
diode junctions from turning on and adversely affecting the readings.
Current
Source
Rx
Cx
Qx
Voltage
Measure
Current Mode Block Diagram
As shown in the figure above, the System is connected in a four-wire Kelvin configuration so
that the voltage is sensed on the component side of the solid-state relays that provide the
constant-current to the unknown resistance. The Kelvin technique takes advantage of the fact
that you can make an accurate voltage measurement through a resistance (such as switches in
the measurement side) as long as the input impedance of the measurement circuit is very high.
Since the current through the sense leads is very small, there is essentially no voltage drop
across the switches. Consequently, the resistance of the switches are not significant, allowing
accurate voltage measurements to be made.
The paths from the internal sense point to the end of the cables can add up to approximately 15
to the resistance on each test point. This resistance, shown as Rp in the following figure, is
measured during System self-test/calibration and is automatically subtracted from readings that
you take.
If you need to take precise readings of low impedances, you can instruct the System to
remotely sense at the assembly that you are testing. To use this technique, wire two additional
test points to the fixture measurement point. This will effectively eliminate the effect of all of
the resistance in the switching and lead paths. The following figure shows how external
sensing can be used to eliminate virtually all of the extraneous impedances in the measurement
path.
16-2
Instruction Manual
Theory of Operation
Current Mode
Internal Sense (+)
Rp
Current
Source
External Sense (+)
Rx
Cx
Qx
Voltage
Measure
External Sense (-)
Rp
Internal Sense (+)
Rp = Lead/Path resistance 2-15

External Sensing Diagram
Testing Resistors
The Current Mode measures resistors by applying a constant-current source to the unknown
resistance and then measuring the voltage drop across the unknown resistance. From the
known current and measured voltage, resistance is calculated with Ohm's law.
Using the various current and voltage combinations available, the System provides resistance
measuring ranges with mid-scale readings from 10 to 10 M. Depending on the range, fullrange voltage is either 2 V, 200 mV or 20 mV.
The System can be configured to provide variable delays between the time when the current
source is applied and when the measurement is taken. You may also specify how many
samples are averaged in each measurement range. If the assembly that you are testing has
capacitors that can become charged during testing, you can specify that the System check for a
voltage across the resistor prior to making the measurement, and if so, discharge the point.
Testing Capacitors
The Current Mode tests capacitors by applying a constant current, then measuring at small
precise time intervals to determine the rise time of the voltage as the capacitor charges. From
the voltage change, the time, and the amount of constant-current applied, the capacitance can
be computed.
For capacitance measurements the Analyst mc uses the same constant-current source and
voltage measurement circuitry used for measuring resistance. However, when measuring
capacitance, the System measures a number of samples at precise intervals for 100 mSecs.
From the gathered information, the System computes the capacitance. Prior to each
measurement, the System discharges the point as necessary.
Both 2V and 200mV full-range voltages and 1 mA to .1 A constant-current source ranges can
be selected to measure capacitance.
Testing Diodes/Semiconductors
The Current Mode measures diodes in a fashion similar to that of testing resistors. A
selectable constant-current source (10 mA to .1 A) is connected to the semiconductor
16-3
Theory of Operation
Current Mode
Instruction Manual
junction, then the voltage drop across the junction is measured. You can also measure zener
diodes up to about 10 volts with diode measurements.
Current Guarding
The Analyst mc allows you to apply guard points to help eliminate the effect that parallel
components have on the measurement. Consider the circuit shown in the following figure. If
you measure Rx, you are also measuring the parallel combination of Ry + Rz. Using guarding,
you can eliminate (or reduce) the effects of Ry and Rz from the measurement.
(+) test point
Ry
Rx
Rz
(-) test point
Circuit with Parallel Components
The following figure shows the same circuit with current guarding applied. The guard point,
applied to the junction of Ry and Rz, applies current to bring the guard point to the same
voltage potential as the (+) test point. Once this is achieved, there is little or no current flow
through Ry. Consequently, all of the source current flows through Rx, and as a result, the
effects of Ry and Rz are eliminated from the measurement.
You can apply up to six simultaneous guard points with a current mode measurement. Each of
the guard points can be externally sensed to more accurately cancel the currents of the parallel
resistances. The System can apply up to 15 mA of guard current for a DC current
measurement. The system can also be instructed to use all of the test points as guard points,
with selected points eliminated.
(+) test point
Ry
Guard point
Rx
+
-
Rz
(-) test point
Circuit with Current Guarding
16-4
Instruction Manual
Theory of Operation
Voltage Mode
Voltage Mode
Overview
The Voltage Mode provides the capability to measure resistors, capacitors and inductors. It
can measure using DC voltage or AC frequencies of 100 Hz, 1 kHz, 10 kHz and 100 kHz as
stimulus. The following figure shows a block diagram of the voltage System.
Voltage
Source
Rx
Cx
Ix
Voltage
Measure
Current
Measure
Voltage Mode Block Diagram
Compared to the Current Mode, the Voltage Mode provides advantages for many in-circuit
measurements:
1. Since complex measurements are taken, the System can provide better measurements
when connected to circuits that contain both resistive and inductive or capacitive
components.
2. Capacitance readings taken at 1 kHz and above are much faster than capacitance
measurements taken with the Current Mode.

3. Measurements of smaller capacitances are possible.
4. Ability to measure inductance is available.
The voltage source can provide 2 V, 200 mV or 20 mV full-range stimulus of DC, 100 Hz, 1
kHz, 10 kHz or 100 kHz. The AC signals are low-distortion sine waves. Internal output
impedance of the stimulus system is about 600 , limiting the current and voltage at the
component to be tested. Maximum current through the tested component will not exceed
about 3 mA.
Once the stimulus signal is applied, the System measures the voltage drop across the unknown
component. The System then measures the current to ground (which is the (-) measurement
test point) through the unknown component. From this information, the impedance of the
component being measured can be calculated via Ohm's law.
In AC-voltage measurements, the System also measures the 90-degree quadrature voltage and
current components through the unknown. Knowing the voltage and current both in-phase and
16-5
Theory of Operation
Voltage Mode
Instruction Manual
in 90-degree phase, the System can calculate the capacitive, inductive, and resistive
components of the unknown impedance.
Testing Resistors
When taking resistance measurements with AC, measurements that have an inductive
component are calculated using a series LR calculation model as shown in the Series LR
Model figure. For other AC-resistance measurements the System uses the parallel RC model
as shown in the Parallel RC Model figure.
Series LR Model
The System can also measure resistors using DC voltage. When measuring resistors with this
mode, only two in-phase readings (voltage and current) are made and the resistance is
computed using Ohm's law.
The System can measure resistance values from 0 to 19 M.
Parallel RC Model
Testing Capacitors
Small capacitance values (less than 1 F) use the parallel RC model shown in the Parallel RC
Model figure. Large capacitance values use the series RC model shown in the Series RC
Model figure. The active measurement range is 1 pF - 2,000 F at 1 kHz (and above) and 10
pF - 20,000 F at 100 Hz.
Series RC Model
Testing Inductors
Inductors use the series LR model shown in the Series LR Model figure. The effective
measurement range of inductors is 6 H to 1000 H.
Use of Offset
The AC stimulus from the System can be offset. If the System is not offset, the source signal
(+ test point) is symmetrical above and below the potential of the (-) test point. If positively
offset, the signal is entirely above potential of the (-) test point, and if negatively offset,
entirely below the potential of the (-) test point. The effects of offsetting on the output signal
are shown in the following figure.
16-6
Instruction Manual
Theory of Operation
Voltage Mode
No Bias
Positive Bias
Negative Bias
0V
Offset
Offsetting can be valuable when measuring across diodes and sometimes can provide better
readings when measuring polarized capacitors. Offset operation is slower than normal
operation. Since offsetting can effectively leave a charge on the component being tested, it
may be necessary to discharge it before other measurements are taken.
Frequency Selection
You may choose between DC, 100 Hz, 1 kHz, 10 kHz and 100 kHz when using Voltage Mode
measurements. This section discusses the theoretical reasons for choosing the frequency.
For purposes of speed, whenever practical, 1 kHz and above should be used in place of 100 Hz
since measurements at the higher frequencies are about 10 times faster than 100 Hz
measurements. In most cases, the speed of capacitor measurements taken in Current Mode are
slower than 1 kHz measurements and faster than 100 Hz measurements.
From a measurement standpoint, selection of frequency is a choice based primarily on the
value of the component being measured and its surrounding circuitry.
For small inductors and small capacitors, use higher frequencies. For large inductors and large
capacitors, use lower frequencies.
When measuring components that have other components in parallel, you should use the
frequency that makes the impedance of the unknown component small compared to the
surrounding components.
For example, consider that you are measuring a 10 k resistor in parallel with a .1 F
capacitor. The impedance of the capacitor depends on the frequency. As you probably recall:
For capacitors XC =1/(2 pi F C )

For inductors: XL =2 pi F L
In our hypothetical measurement of the 10 k resistor in parallel with a .1 F cap, the
capacitor's impedance is:
Frequency
Impedance
100 Hz 15.9 k
1000 Hz 1.59 k
You want to minimize the effect of the parallel capacitance upon the resistor, therefore 100 Hz
is better since it will decrease the parallel load. If you were measuring the capacitor, you
would want to use 1 kHz or higher since it makes the capacitor more dominant with respect to
the resistor.
16-7
Theory of Operation
Voltage Mode
Instruction Manual
Voltage Guarding
The Analyst mc allows the use of voltage guarding. Guarding is a technique by which you can
reduce the effect of parallel components upon the measurement.
Consider the circuit shown in the following figure. If we measure Rx, we will actually
measure the combination of Ry + Rz in parallel with Rx.
If we add a guard point, as shown in the following figure, we can minimize the effects of the
parallel resistance of Ry and Rz.
(+) test point
Ry
Guard point
Rx
Rz
(-) test point
Circuit with Voltage Guarding
In the Analyst mc Voltage Mode, guard points drive the guarded circuit point to ground
potential. When the guard is active, it forces the top of Rz and the (-) Test Point to be at the
same voltage potential. As a result, no current can flow through Rz and consequently all of the
current that we measure at the (-) Test Point flows through Rx. Since we have accurately
measured the current through Rx and we can accurately measure the voltage across Rx, we can
determine its value with the effects of Ry and Rz guarded out.
The Analyst mc allows you to have up to six simultaneous guard points. This allows you to
eliminate the current paths from several surrounding circuits. Each of the six guard points can
be externally sensed at the UUT to provide the most effective guarding. You can also specify
all test points to be guards, with selected non-guarded points.
You can guard out resistors, capacitors or inductors with the System. The effectiveness of
guarding increases as does the impedance of the component between the (+) test point and the
guard point (Ry in the previous example). If the impedance of this component is small (less
than 1/100 the value of Rx, for example), guarding is not likely to be highly effective. In the
example shown in the previous figure, if Rz is a larger resistance than Ry, you could improve
the effectiveness of guarding by reversing the polarity of the measurement.
Note that as you add guard points to the Analyst mc Voltage Mode, the amplitude of the
stimulus signal becomes smaller and smaller. If the guarded impedances are small, you may
eventually get to the point where the stimulus is so small that repeatability of the readings
decreases.
The TR-8-PWR module can be used to increase the guard current up to 100 mA. As a
practical matter, additional guard current seldom helps the measurement. The reason is that at
higher currents, the resultant additional voltage drops at the fixture contact points can induce
measurement errors.
16-8
Instruction Manual
Theory of Operation
This section discusses guidelines that you can use to obtain the best test results in your testing
application.
Overview
For most readings, the System will automatically choose the best method and ranges. If that
fails, you can easily get a display showing a variety of measurements taken on the points in
question. From the displayed alternatives you can simply choose the best one and use it.
However, in some cases you may want to make a detailed analysis to determine the best
measurement method. This section gives some guidelines to help.
Note that no matter what test equipment you use, CheckSum's or an alternative, you are likely
to run across occasional components that you can't effectively test with standard automated
techniques. For these points you'll have to rely on the continuity test or other inspection
methods.
General Guidelines
The following general guidelines apply to all component measurements:
1. All other things being equal, choose the 2 V output voltage rather than 200 mV or lower.
This will result in more accurate, repeatable measurements. The exception to this is the 10
and 100 DC constant-current resistance measurement ranges (200 mV output at 1 mA
and 10 mA), which are the most accurate way to measure resistances less than 160 .
2. For DC readings (current or voltage), try reversing the polarity and measuring again. This
can provide a solution if there are diodes in the measurement circuit.

3. For AC readings where unguardable parallel circuitry exists, choose the frequency that
makes the impedance of the measured component low compared to parallel impedances.
In general, the System will take good measurements if the parallel impedance is greater
than 10% of the impedance of the component that you are measuring.
4. For DC current measurements, look at the Dynamic Point Analysis screen for clues. You
might find that there is a slowly charging cap across the resistor or an inductor causing a
negative slope on the display. You might also see a diode junction turning on at about .6
V, indicating that you need to use a low-voltage range.
5. On AC measurements, try positive and negative offset to see if the readings improve. Try
the 200 mV output range before experimenting with offset changes.

6. The relative measurement speed of the System is approximately as listed in order from
fastest to slowest:
Continuity measurements
DC-current resistance/diode measurements
DC-voltage resistance measurements
AC-voltage 1 kHz and above cap/inductor/res measurements
DC-current capacitance measurements
AC-voltage 100 Hz cap/inductor/res measurements
16-9
Theory of Operation
Instruction Manual
7. To optimize testing speed, you can organize your program so that readings are grouped
together by frequency. This allows testing to proceed with minimal settling time. The
system function of sort for speed performs this sort for you.
8. If the readings that you are getting are too high, it may be a case of significant series
resistance in the measurement path. If you have wired other test points to the component,
use external sensing to eliminate the effects of path resistance beyond the local sense
points on the MPX modules.
9. If the readings are too low and there are parallel paths with a test point in the middle of the
components in the parallel path, it is likely that guarding will have a positive influence.
10. For Voltage Mode guarding, choose guard points that have some resistance (impedance)
between both the (+) test point and the (-) test point. It is best if the guard points have the
highest value of resistance in the path between the (+) test point and the guard points. You
can rearrange the polarity of the measurement if need be to obtain this effect. It is only
necessary to consider guarding of the points that are ultimately connected to the (-) test
point. See the following figure "Choosing Voltage Mode Guards" for an idea of where to
guard when using the Voltage Mode.
11. For Current Mode guarding, choose guard points in a similar fashion to Voltage Mode
guarding, but arrange the guard points so that the highest resistance is between the (-) test
point and the guard point. Remember that the Current Mode guard is limited to about 15
mA of guard current, so if the resistance between the guard point and the (-) test point is
less than about 13 (130 on the 2V ranges), you will have better luck using the Voltage
Mode for guarding. With the Current Mode, it is only necessary to consider guarding of
impedances that connect to the (+) test point. See the following figure "Choosing Current
Mode Guards" for an idea of where to guard when using the Current Mode.
The preceding general guidelines apply to all measurements. The remaining sections deal with
specific component types that are to be tested.
(+) test point
Don't Guard
Don't Guard
Rx
(-) test point
Choosing Voltage Mode Guards
16-10
Guard!
Guard!
Instruction Manual
Theory of Operation
(+) test point
Guard!
Guard!
Rx
(-) test point
Don't Guard
Don't Guard
Choosing Current Mode Guards
Testing Resistors
As a first choice for testing resistors, select a measurement with the Current Mode since it will
generally be the fastest and most accurate. For high values (e.g., 2 M and above), DC-V or 1
kHz and above readings may be faster. The DC-voltage measurement mode works similar to
most hand-held meters and works in a variety of circuits, but is not as fast as current-based
measurements.
In general, with the Current Mode, use the highest output voltage in conjunction with the
highest current that gives good results. For values below about 160 , the .2 V / 1 mA range
is the most accurate. For values below about 15 , the .2 V / 10 mA range is the most
accurate.
If no readings (AC or DC) seem to work, look at the Dynamic Point Analysis screen. You
might find that a cap in parallel is charging and that you can either discharge it previously with
a DISCH test step, use the remeasurement delay, RES discharge parameter, or set the RESRG
delay time to help.
Testing Capacitors
Although not always the case, in general, the Voltage Mode is preferable for small capacitors
(about 10 F or less) and the Current Mode is best for larger capacitors.
In addition to the general guidelines, try the 'swap model' parameter to see if you get better
results. This changes the calculation model used (see Theory of Operation). The System
automatically tries to choose the best method. However, it can not correctly make this choice
in all cases. Consequently, you may find your results change dramatically by swapping the
calculation model.
For large capacitors, better measurement results are obtained if the fixture is wired for external
sense. Since impedance of large capacitors is small, the characteristic resistance (up to about
15 ) in each test point can cause significant errors without external sensings.
Testing Inductors
Inductance measurements are subject to the same guidelines as capacitors, with only the
calculations changed. Inductance measurements are available only with the Voltage Mode.
On low value inductors (less than about 50 H), use of external sense wiring greatly increases
the measurement effectiveness.
16-11
Theory of Operation
Instruction Manual
Continuity Tests
Continuity tests are optimized for speed. As a result, you might find that the automatically
generated continuity tests contain some erroneous connections or opens that are caused by
charged or discharged capacitors. If this is the case, and it causes some testing problems, you
can turn these into don't-cares and use RESistance tests for the problem points.
Testing ICs/Transistors/Diodes
For testing ICs, the ICs Test is typically used. Diode tests can be used for transistors, ICs and
diodes. Most semiconductor junctions measure about 600 mV when forward-biased.
Transistors and FETs can usually be tested with the Beta test type.
With a single diode test you can ensure that the diode or semiconductor is installed, that it is in
the proper polarity, and that it is not open or shorted.
With ICs, the diode test is typically used to measure the protection diodes present between the
input and output pins and power/ground. You can typically find an asymmetrical set of diode
junctions on the pins of the IC to confirm that the IC is clocked properly. You may also find a
combination that has a different number of diode junctions in series in one IC orientation.
16-12
Chapter 17
Specifications
Analyst mc Specifications
System Specifications
Resistance Measurement
Resistors are measured with a choice of DC-constantcurrent, DC-constant-voltage, or AC-complex-impedance
measurements. Low impedance measurements can be
externally sensed.
Measurement using DC Current Stimulus
Range F.S.
Current
Voltage at F.S. Accuracy
19
10mA
0.2V
3% F.S.
190 *
10mA
2V
2% F.S.
1.9K *
1mA
2V
2% F.S.
19K *
0.1mA
2V
2% F.S.
190K *
10A
2V
2% F.S.
1.9M *
1A
2V
3% F.S.
19M
0.1A
2V
6% F.S.
*0.2V ranges are available. For 0.2V ranges, multiply typical accuracy by 3.
For internally sensed measurements, add 2 to accuracy. Maximum
voltage may exceed full-scale value during over-range.
Measurement
Range
0 to 10K
10K to 100K
100K to 1M
1M to 10M
using AC/DC Voltage Stimulus

Source Voltage, Typical
Accuracy
3.8VDC or 2VAC RMS 2% Value+0.5
3.8VDC or 2VAC RMS
3% Value
3.8VDC or 2VAC RMS
5% Value
10% Value
3.8VDC or 2VAC RMS
(20% @ 1KHz)
0.2V & .02V sources are also available. For 0.2V, multiply accuracy by
3. For .02V, multiply accuracy by 10 (not specified above 1M). For
internally sensed measurements, add 2 to accuracy. Available AC
stimulus frequencies 100Hz and 1KHz. Technique is fully auto-ranging.
Source current is less than 10mA.
Inductance Measurement
Inductors are measured with AC-complex-impedance
measurements. Effective measurement range is 1H 1000H.
Range
Accuracy
100KHz
10KHz
1KHz 100Hz
1H - 10H
5%+0.5H 5%+0.5H 15%+2H
10H - 100H 5%+2H 5%+2H 15%+4H
100H - 1mH
5%
5%
5%
11%
1mH - 10mH
11%
5%
5%
5%
10mH - 100mH
15%
5%
5%
100mH - 1H
15%
5%
1H - 10H
15%
10H - 100H
15%
100H - 1000H
25%
Specifications assume residual inductance is offset. Specifications apply
to 2V source. 0.2 and .02V sources are also available. For 0.2V,
multiply accuracy by 3. For .02V, multiply accuracy by 10. Technique is
fully auto-ranging. Source current is less than 10mA. Measurements
less than 100H should be externally sensed for full accuracy.
17-2
Instruction Manual
Capacitance Measurement
Capacitors are measured with a choice of DC-constantcurrent or AC-complex-impedance measurements.
Measurements can be effectively made from 2pF 20,000F 3.
Range
Accuracy
100KHz 10KHz 1KHz

1pF - 100pF
5%1
5%1 5%1
100pF - 1000pF 5%2
5%2 5%2
1000pF - 0.01F 15%
5% 5%
0.01F - 0.1F
5% 5%
0.1F - 1F
15% 5%
1F - 10F
5%
10F - 100F
15%
100F - 1000F
1000F - 20000F
100Hz
15%2
5%
5%
5%
5%
5%
15%
15%
1mA 10mA
5%
15% 5%
25% 15%
Notes:
1. 5pF
2. 10pF
3. While small isolated capacitances (pF region) can effectively be
tested by the system, often times in-circuit influences such as parallel
impedances in ICs degrade measurements. Values under 100pF can
be difficult to measure in many circuits.
Specifications assume residual capacitance is offset and apply to 2V
source. 0.2V and .02V sources are also available. For 0.2V, multiply
accuracy by 3. For .02V, multiply accuracy by 10. Technique is fully
auto-ranging. Source current is less than 10mA.
Guarding Capability
The test system provides guarding to minimize the
effects of parallel impedances. Without special wiring,
any test point can be used as a measurement point, a
guard point, or an external sense point. All points can be
guarded (with selected deletions), or up to six individual
guard-points can be simultaneously used. Each measurement or guard point can be externally sensed.
Guarding uses a separate guard amplifier for each guard
point to provide extremely precise guarding. Even
without guarding, the system can often directly measure
components of different types connected in parallel,
such as a capacitor and a resistor, using compleximpedance measurements.
Guarding
Maximum Current per Test Point

Maximum Number of
Simultaneous Guard Points
Maximum Total Guard Current
10mA
6 (or guard-all less
selected points)
20mA
Instruction Manual
Typical Resistance Measurement Accuracy Degradation

when using Guarding:
Guard Ratio
1:1
10 : 1
100 : 1
Multiply Accuracy
x1
x2
x3
Opens/Shorts Measurement
The system self-learns a known-good UUT, then tests
against this map. The continuity map can be edited and
no-care conditions can be specified for measurements
where components exist, and either condition is
acceptable.
Any test point can be designated as a guard or external guard sense

point without special wiring.
Connection/Open Thresholds
Voltage Measurement
Typical Test Time for 400 Test Points
(Test time depends on UUT circuit topology)
The System can measure DC voltages, such as on-board

batteries.
DC Voltage Measurement
Measurement Range
0.2V
2V
10V
Accuracy
6mV
60mV
250mV
Ranges are bipolar. Stimulus may float up to 8V from ground.
Diode and Zener Diode Measurement

Standard diodes, LEDs and zener diodes are tested by
applying a constant current to the anode and cathode,
then measuring the resultant voltage (forward voltage
drop). Measurements of up to 20V can be performed
using up to 10mA of applied current.
Diode Test Type
Accuracy
Range
2V
10V*
10mA
60mV
250mV
Source Current
1mA
60mV
250mV
0.1mA
60mV
250mV
* Typical constant current to 7V compliance
Zener Test Type

Range
Source Current
20V
10mA
Separately programmable from 2 - 50K

2 seconds
Accuracy
350mV
IC-Orientation/Presence Measurement
IC presence and orientation is verified by checking the
semiconductor junctions of the protection diodes
typically present between IC pins and the UUT power
supplies. Using a proprietary algorithm, the system selflearns a mapping of these ICs and tests against this
map. The map can be manually edited for specification
of specific tests and no-cares.
Constant Current
Ranges
0.1mA/1mA
1mA/10mA
Threshold
0 to 2V
0 to 2V
Transistor Testing
Three terminal devices can be measured between the
power terminals (e.g., collector and emitter) while
biasing the control terminal with another test point
using voltage or current. This can effectively measure the
operation, and in most cases the polarity of devices such
as FETs, SCRs and transistors.
Third Terminal
Drive
0mA to +1mA
10V to +10V
0mA to 1mA
+10V to 10V
Measurement
Stimulus
1mA
1mA
1mA
1mA
Measurement
Threshold
0 to +2V
0 to +2V
0 to 2V
0 to 2V
Diode
Drive
0mA to 10mA
Measurement
Stimulus
1mA
Measurement
Threshold
0 to 2V
17-3
Test System
Base Size
Overall Size
Mechanical
Fixture Press
Actuation Arm
Movement
Actuation Arm
Force
Top Linearity
Test System Configuration

16"W x 21"D x 13"H
20"W x 24"D x 26"H (with monitor)
Single-action up, single-action down
Fixture-engaged switch for auto-start
180 degrees
15 lbs. max downward pressure with

400 probe loading
Within .004" after probe contact (top
or top and bottom probing)
AC Power
115/230VAC, 50/60Hz, 8A maximum
Outlets Required 2 for the test system and monitor,
3 with the printer option
Operating
0 C to +35 C
Environment
0 to 80% RH (without condensation)
Fixture Travel
4.8" (top pressure plate moves down)
Top Height
Moves up 4.8"
(disengaged)
Top Depth
Moves back 2.2"
(disengaged)
Fixture Interface Two 200-Point Receiver Wiring Blocks
Front Panel
Power, Pass, Fail, and Busy LED
Indicators
Front Panel
Test (F1), ReTest (F2), F3-F7, and
Keypad
Escape
Weight
Approximately 90 lbs. total;
65 lbs. without monitor and fixture kit
(shipping wt. approximately 100 lbs.)
KIT600-QC Fixture Kit

Probe Area
UUT Height
Closed Height
Inside Depth
Probe Plate
Top Plate
Probe Count
Weight (Kit)
Instruction Manual
8.5"D x 11.75"W
1.15" (UUT PCB to top pressure plate)
1.525" (probe plate to top pressure plate)
2.94" (inside the bottom of fixture kit)
0.375" G-10 (FR-4) fiberglass material
0.50" clear polycarbonate
Up to 600 (400 maximum on Analyst mc)
Approximately 10 lbs. (shipping wt.
approximately 15 lbs.)
The Analyst mc is complete and ready to use once you

have a custom test fixture and test program created for
your UUT. The test system includes:
Chassis with 400 test points

CD-ROM, hard-disk drive, 1.44MB floppy-disk drive
Keyboard, Mouse
MS-Windows Software
Visual MDA Test System Software
Integrated Fixture Press
SVGA Monitor (15", 13.8 viewable)
Power cord
Probe set
Shorting Fixture
Instruction Manual
Test System Accessories

KIT600-QC
SPKIT-1
TRAIN-1
Fixture Kit
Analyst mc System Spares Kit
Factory training on use and maintenance
of Analyst mc (1 1/2 days)
CM-3-KIT600 Calibration Fixture Kit with Shorting Fixtures
T-120-2P
40 Column Dot Matrix Industrial Parallel
Strip Printer with Cable
T-120-2-R
Replacement Ribbon for T-120-2P
T-120-2-50P Case of 50 rolls of paper for T-120-2P
SPKIT-1 Analyst mc System Spares Kit

The SPKIT-1 spares kit includes:
Bushing set for the system mechanical mechanism
Two Struts
One Test-Point Electronics Module
One Fixture-Down Switch
Ten Spare Interface Probes
KIT600-QC Fixture Kit

The KIT600-QC fixture kit includes:
Probe-plate with bottom pan
2 shipping/storage handles
Clear polycarbonate top plate
10 MA-ROD pressure rods
Fixture Kit Accessories

FIX-200P-WB
MA-ROD
MA-ROD-T
200 Point Wiring Block Fixture Kit

Pressure Rod (1.150")
Tapered Pressure Rod (1.150")
Contact the CheckSum fixture group for more information and competitive custom fixturing and test programming quotes.
17-4
Chapter 18
Test Descriptions

Overview
The descriptions in this chapter provide detailed information about each of the test types that
can be used in a test program. These test types are entered with the Edit screen described in
Entering Test Steps. Writing Test Programs also gives general information about how many of
these test types are used in a program. This table includes test step descriptions that apply to
the Analyst mc system, and also for options that may be added to some test systems, such as
the Model TR-8-1, PWR-1, TR-8-SMT and the Model TR-6 Functional test modules. In most
cases, notes are included that show which steps apply to optional modules that you may or may
not have in your System.
Get HELP Fast: To access the test type help page quickly, type in the test type, press the
Enter key, and press the F1 function key.
The following list shows all of the test step types that are available and where to find them:
Analog Measurement Test Types on page 18-4
Resistance Test
RES on page 18-7
Capacitance Test
CAP on page 18-8
Diode Junction Test
DIODE on page 18-9
Zener Diode Test
ZENER on page 18-10
IC Test
ICS on page 18-10
Set IC Test Range Limits
ICRNG on page 18-11
Inductance Test
INDUC on page 18-11
Voltage Test
VOLT on page 18-12
Continuity (Opens/Shorts) Test
CONT on page 18-12
Discharge Point
DISCH on page 18-13
PAUSE on page 18-14
RETRY on page 18-14
RESRG on page 18-15
POTR / POTU / POTD on page 18-17
Install/Remove UUT Jumpers
JMPER on page 18-17
UUT Switch Test
SWCHR / SWCHD on page 18-18
WIRE on page 18-19
Test Descriptions
Instruction Manual

UCT Trigger Setup
TestJet - SMT Opens Test
Capacitor Polarity Test
Transistor/FET Beta
Transformer Polarity Test
High-Voltage Test
Opto-isolator Test
Multi-Function Input Test
DMM on page 18-20

UCT on page 18-21
UCTTR on page 18-24
ZERO / GAIN on page 18-25
TESTJ on page 18-25
TJETC on page 18-26
BETA on page 18-27
XFMR on page 18-28
HIPOT / HP1 on page 18-28
OPTO on page 18-33
MFI on page 18-33
Analog Stimulus Test Types on page 18-34

Source Sine Wave
Source Square Wave
Source DC Voltage
Source DC Current
SINEV on page 18-35

SQRV on page 18-36
DCV on page 18-36
DCI on page 18-37
PWRMN on page 18-38
EXTIO on page 18-38
Digital Test Types on page 18-39

Digital Input Test
Digital Output
Digital I/O Configuration
DIG-1 Control
Digital Hardware Test
Controller Port Input Test
Controller Port Output
Boundary-Scan Test
In System Programming
DIGI on page 18-41

DIGO on page 18-42
DIGA on page 18-42
DIGR on page 18-43
LOGIC on page 18-45
PORTI on page 18-46
PORTO on page 18-46
BSCAN on page 18-46
ISP on page 18-47
Transfer of Control Test Types on page 18-48

Specify Label
LABEL on page 18-49
JMP on page 18-49
JMPR on page 18-49
JMPC on page 18-50
JMPD on page 18-50
JMPI on page 18-51
JMPV on page 18-51
JMPWR on page 18-51
JMPDM on page 18-52
JMPU on page 18-52
JMPDI on page 18-53
JMPPI on page 18-53
JMPK on page 18-54
Set Error Counter Used for JMPE
ERROR on page 18-54
JMPE on page 18-55
JMPZ on page 18-56
JSTST on page 18-56
Jump Based on Fixture ID
JFXID on page 18-56
18-2
Instruction Manual
Call a Subroutine
Return from a Subroutine
Return from a Test Sub-Program
Test Descriptions
CALL on page 18-57

RET on page 18-57
RUN on page 18-58
RUNT on page 18-58
RETT on page 18-59
Operator Message Test Types on page 18-60

DISPL on page 18-60
DISP on page 18-61
DISPE on page 18-61
Display a Picture Image
PICT on page 18-61
Wait for a Key to be Pressed
WAITK on page 18-63
PCB on page 18-63
Screen Test Type Table
SCRN on page 18-65
User-Defined Tests on page 18-67
EVAL on page 18-67

EXEC on page 18-67
Memory Manipulation Test Types on page 18-69

MEMI on page 18-71
MEMR on page 18-74
MEMS on page 18-76
General Purpose Interface Bus (GPIB) I/O on page 18-78
GPIB (IEEE-488) Control
GPIB on page 18-78
RS232 Serial Interface I/O on page 18-81
RS232 Control
RS232 on page 18-81
Miscellaneous Tests on page 18-83

Fixture Control
Control Relays
Self-test Module
BreakPoint
Fixture-Check
Print Test Results
Sound Beeper
Set Test Conditions
VACUM on page 18-84

FIXCT on page 18-84
FIXID on page 18-85
RELAY on page 18-86
STST on page 18-87
BRKPT on page 18-88
FIXCH on page 18-89
RPRTS on page 18-90
BEEP on page 18-92
FLAGS on page 18-92
REM on page 18-93
RSLTS on page 18-93
The following list shows the general test types that are available and where to find them in this
section:
Analog Measurement Test Types on page 18-4
Analog Stimulus Test Types on page 18-34
18-3
Test Descriptions
Digital Test Types on page 18-39
Transfer of Control Test Types on page 18-48
Message Test Types on page 18-60
User-Defined Tests on page 18-67
Memory Manipulation Test Types on page 18-69
General Purpose Interface Bus (GPIB) I/O on page 18-78
RS232 Serial Interface I/O on page 18-81
Miscellaneous Tests on page 18-83
Test Step Range Values on page 18-5
Resistance Test on page 18-7
Capacitance Test on page 18-8
Diode Test on page 18-9
Zener Diode Test on page 18-10
IC Test on page 18-10
IC Test Range Limiting on page 18-11
Inductor Test on page 18-11
Voltage Test on page 18-12
Continuity Test on page 18-12
Discharge Point on page 18-13
Pause a Specified Time on page 18-14
Set Measurement Retry Parameters on page 18-14
Set Low-Level Measurement Parameters on page 18-15
Adjust Potentiometer on page 18-17
Install/Remove Jumpers on page 18-17
Set Switch on page 18-18
Make Cable Connection on page 18-19
DMM Measurement Test on page 18-20
Universal Counter/Timer Measurement Test on page 18-21
UCT Trigger Setup on page 18-24
Dynamic Measurement Calibration on page 18-25
Test for SMT Opens on page 18-25
Test for Capacitor Polarity on page 18-26
Test for Transistor/FET Beta on page 18-27
18-4
Instruction Manual
Instruction Manual
Test for Transformer Polarity on page 18-28
High-Voltage Test on page 18-28
Opto-isolator Test on page 18-33
Multi-Function Input Test on page 18-33
Test Descriptions
Test Step Range Values

For most analog measurements (resistance, capacitance and inductance) the range column in
the test program specifies the measurement range, whether guarding is used, and so on. In
most cases, the System automatically generates the range value used for each analog test step
in the test program for you. As a result, you normally don't have any reason to be concerned
about specifics of the range value.
However, you may be interested in how the actual range value is derived or create your own
range and then type it in. The table on the following page shows the specifics of the range as it
applies for most of the analog measurement test types. The System chooses the appropriate
value from each section of the table and adds them all together to form the final range value.
For example, the test step range for a CAPacitance test using 200mV output stimulus at 1kHz
would be 49.
18-5
Test Descriptions
Instruction Manual
Test Step Range for CAP/RES/INDUCT

Parameter
Value
Description
Voltage/Current Range
0-12
For Current Mode measurements, see the range

value in the test type description
2V output range for Voltage Mode
200mV output range for Voltage Mode
20mV output range for Voltage Mode
DCI
16
DCV
32
100Hz
Frequency/Function
48
1kHz
20
10kHz
24
100kHz
Bias
No Bias
(AC Voltage Mode Only)
64
Positive Bias
128
Negative Bias
No Guarding
Guarding
256
Guarding Active
External Sense
No External Sense
512
External Sense Active
Initial Current Meas Range
12mA
(Voltage Mode Only)
1024
1.2mA
2048
120A
3072
12A
4096
1.2A
Initial Voltage Meas Range
4.8V
(Voltage Mode Only)
8192
0.48V
16384
48mV
24576
4.8mV
Swap Calculation Model
Normal Calculation Model
(Voltage Mode Only)
32768
Swap Calculation Model
18-6
Instruction Manual
Test Descriptions
Resistance Test
Measures the resistance value between two test points and generates a result.
Range Note
The ranges shown in the table below apply to the DC-Current measurement
method. If the voltage measurement mode is used, see the test step range
value table on page 18-5 at the beginning of this section. The nominal
ranges shown below are usable to 90% over-range (minus about 15 when
not externally sensed). For example, the 1k range can be used for
readings up to 1.9k.
Also see the RETRY and RESRG test types for further specification of how the measurements
are taken.
O_Rng Note
To enter a value higher than the system can measure, type in 20M or
O_Rng. This value, displayed as > 19 M, is greater than any normally
measured value, and will never cause a failure on the high side. An overrange measurement is shown as O_Rng in the measured value.
Parameters
Description
Test Type
RES
Title
Description of measured component (e.g., R234)
Range
1 = 100 (0.2V/1mA)
2 = 1k (2V/1mA)
3 = 10k (2V/0.1mA)
4 = 100k (2V/10A)
5 = 1M (2V/1A)
6 = 10M (2V/0.1A)
7 = 1k (0.2V/0.1mA)
8 = 10k (0.2V/10A)
9 = 100k (0.2V/1A)
10 = 1M (0.2V/0.1A)
11 = 100 (2V/10mA)
12 = 10 (0.2V/10mA)
17 = Default entry (see Range Note above)
From (-) Point
Negative polarity test point
To (+) Point
Positive polarity test point
Low Limit
Low test limit in ohms
High Limit
High test limit in ohms
18-7
Test Descriptions
Instruction Manual
Capacitance Test
Measures capacitance between two test points and generates a test result.
The ranges shown in the following table apply to the DC-Current measurement method. If the
AC voltage measurement mode is used, see the test step range table on page 18-5 at the
beginning of this section.
Also see the RETRY test type for further specification of how the measurements are taken.
O_Rng Note
O_Rng. This value, displayed as > 50 m, is greater than any normally
Parameter
Description
Test Type
CAP
Title
Description of measured component (e.g., C31)
Range
1 = 5,000F (0.2V/1mA)
2 = 500F (2V/1mA)
3 = 50F (2V/0.1mA)
4 = 5F (2V/10A)
5 = 0.5F (2V/1A)
6 = .05F (2V/0.1A)
8 = 500F (0.2V/0.1mA)
9 = 50F (0.2V/10A)
10 = 5F (0.2/1A)
11 = 0.5F (0.2V/0.1A)
13 = 5,000F (2V/10mA)
14 = 50,000F (0.2V/10mA)
49 = Default entry (see Test Step Range Values on page 18-5)
From (-) Point
To (+) Point
Low Limit
Low test limit in farads
High Limit
High test limit in farads
18-8
Instruction Manual
Test Descriptions
Diode Test
Applies a constant current across the semiconductor junction, measures the voltage drop and
generates a test result.
For typical diode measurements, the 'From(-)' test point is connected to the cathode of the
diode and the 'To(+)' test point is connected to the anode of the diode. The voltage drop of
typical diodes is approximately .6 V. The measured voltage is expected to be between the Low
and High Limits. The voltage range is 0 through 9.9 volts. Measurements taken on the 2V
range can be guarded. Guarding can also be used on adjacent circuit points to apply more
current across the diode being measured.
Also see the RETRY test type for further specification of how the measurements are taken.
Also, see the ZENER test type for diode measurements that need additional current or higher
voltages.
O_Rng Note
O_Rng. This value, displayed as O_Rng, is greater than any normally
Parameter
Description
Test Type
DIODE
Title
Description of measured component (e.g., D101)
Range
1, 2 = Source 1mA, measure up to 2V

3 = Source 0.1mA, measure up to 2V
4 = Source .01mA, measure up to 2V
5 = Source 1A, measure up to 2V
6 = Source 0.1A, measure up to 2V
7 = Source 1mA, measure up to 10V
8 = Source 0.1mA, measure up to 10V
9 = Source .01mA, measure up to 10V
10 = Source 1A, measure up to 10V
11 = Source 0.1A, measure up to 10V
From (-) Point
Cathode (-) test point for diode
To (+) Point
Anode (+) test point for diode
Low Limit
Low test limit in volts (typically 0.4 V)
High Limit
High test limit in volts (typically 0.9 V)
18-9
Test Descriptions
Instruction Manual
Zener Diode Test

Applies approximately 10mA of DC constant-current through the diode and measures a
voltage of up to 20 VDC.
The ZENER test can be used in place of the DIODE test type when current greater than 1mA is
necessary or when voltages greater than 10 volts need to be measured.
O_Rng Note
O_Rng. This value, displayed as > 20, is greater than any normally
measured value, and will never cause a failure on the high side. An overrange measurement is shown as > 20 in the measured value.
Parameters
Description
Test Type
ZENER
Title
Description of measurement (e.g., CR3)
Range
Time, in mSec, to wait after applying the current and before

beginning the voltage measurement. This can be used to allow
time for parallel capacitances to charge.
From (-) Point
To (+) Point
Low Limit
Low test limit in volts
High Limit
High test limit in volts
IC Test
Allow for measurement of diode junctions at the pins of ICs. These diodes are typically
present at the inputs and outputs of ICs to protect the IC from damage by clamping the input
voltage between the power supply rails (e.g., VCC and GND for typical logic ICs).
This test type can measure from two power supply rails (e.g., VCC and GND) to all other pins
on the assembly. The system measures by applying a constant current, then measuring the
voltage drop and ensuring that it falls between the high and low test limits.
To automatically learn or specify the expected outcome of the ICs test step, select the ICs test
step in the Edit Test Program window, and then select 'Step Analysis'. The menu selection
Measure > Step Analysis F6 in the edit test program window opens the Edit/Enter IC Test
Data window.
By using two different ICs test steps in a program (each with its own range value of 1 or 2),
UUTs with up to four power supply rails can be verified to each point. Under normal
circumstances, the System uses 1mA as the measurement current, but this can be reduced in
decade values by specifying special range values. Also see the ICRNG test type for
information on bounding the point ranges to accommodate multi-PCB panels.
18-10
Instruction Manual
Test Descriptions
Parameter
Description
Test Type
ICS
Title
Description of measured component (e.g., IC Tests)
Range
Sum of the following:

1 = Use first set of test data
2 = Use second set of test data
0 = Use 1mA measurement current
16 = Use 0.1mA measurement current
32 = Use 10A measurement current
64 = Use 1A measurement current
From (-) Point
More negative (-) power supply rail to test from

(e.g., GND)
To (+) Point
More positive (+) power supply rail to test from

(e.g., VCC)
Low Limit
Low test limit in volts (typically 0.4V)
High Limit
High test limit in volts (typically 0.9V)
IC Test Range Limiting

Allow for limiting the range of test points that are used when executing the next ICS test step.
This test type can be used to separate a single range of IC test data (range = 1 or 2) into several
distinct sections, such as when testing multiple PCB panels. When non-overlapping ICRngs
are used, the to and from pins of ICS test steps using the same range of data can be different.
Parameter
Description
Test Type
ICRNG
Title
Description (typically not used)
Range
Not used
From (-) Point
Point to begin testing from
To (+) Point
Point to end testing to
Low Limit
Not used
High Limit
Not used
Inductor Test
Measures inductance between two test points and generates a test result.
Parameter
Description
Test Type
INDUC
Title
Description of measured component (e.g., L302)
Range
See the test step range table on page 18-5 at the beginning of
this section. Measurements use either 100Hz or 1kHz stimulus.
From (-) Point
To (+) Point
Low Limit
Low test limit in henrys
High Limit
High test limit in henrys
18-11
Test Descriptions
Instruction Manual
Voltage Test
Measures a DC voltage and generates a test result. This test can be used to test on-board
batteries or to test for charged capacitors. The usable voltage range is 0 through +9.9 volts
referenced to ground potential. See the DMM test type (available with optional Model TR-6)
for more general voltage measurements.
Parameter
Description
Test Type
VOLT
Title
Description of measured component (e.g., BT101)
Range
1 = Measure up to 200mV
2 = Measure up to 2V
0, 3 = Measure up to 10V
Range
Not used
From (-) Point
Most negative test point for voltage
To (+) Point
Most positive test point for voltage
Low Limit
High Limit
Continuity Test
Measures all combinations of solid-state test points between the `From (-) Point' and `To (+)
Point', and TR-6/TR-6-1 relay test points between the Low Limit and High Limit for opens and
shorts. There can be multiple CONT tests in a single test program, but the range of tested
points cannot overlap between any of the individual CONT tests since the database is shared.
To use the Model HP-1, High Voltage Testing on page 18-28 with the CONTinuity test type,
the range of points specified in the `From (-) Point' and `To (+) Point' columns will be from
1951 to 1998. The `From (-) Point' must be 1951 or higher and the `To (+) Point' must be
1998 or lower.
To automatically learn or specify the expected outcome of individual CONT tests, select the
CONT test step in the Edit Test Program window, and then select 'Step Analysis'. The menu
selection Measure > Step Analysis F6 in the edit test program window opens the Continuity
Information window. Also see Assigning Continuity Thresholds on page 9-29 setup.
18-12
Instruction Manual
Test Descriptions
Parameter
Description
Test Type
CONT
Title
Description (typically not used, or 'Opens/Shorts')
Range
0 = Normal
1 = The test will ignore inactive points during continuity testing optimizations. Any
point that is inactive is not included in any continuity measurements and is not
connected to any other points during a continuity test. This slows test execution,
but can be used to help prevent continuity errors on points connected to batteries
on the UUT. For reliable test results on assemblies with batteries or large
capacitors, set at least one point connected to the voltage as inactive and set the
CONT test step Range to 1. Remember to relearn the CONT map (Measure >
Self-Learn All) after making the points inactive and setting the Range to 1.
From (-) Point
Lowest test point number of continuity test for solid-state test points (1-1600 or
2001-8400). Specify 1951-1998 for the HP-1.
To (+) Point
Highest test point number of continuity test for solid-state test points (1-1600 or
2001-8400). Specify 1951-1998 for the HP-1.
Low Limit
If non-zero, lowest test point number for continuity test of relay test points (16011950).
High Limit
If non-zero, highest test point number for continuity test of relay test points (16011950).
Discharge Point
The specified test points are both connected to ground potential for a specified time. The
ground path (with range = 0) is approximately 400 resistance (or about 600 between the
two points through ground).
If the Low Limit is 1 through 6, the System uses the System's current source to charge the two
test points in the specified polarity. The Low Limit indicates the current range to use. This
function can be used to discharge caps or reverse the charge between two points. The System's
current source can source, but not sink, current.
If the Low Limit is 7, the System connects all of the test points in the System together,
effectively discharging everything.
Note
If Low Limit = 7 is used, the discharge impedance is low (about 50 ), so
caution must be taken that the current through the discharge path does not
exceed 15mA. Doing so can damage the MDA System. Consequently
there should not be more than about .75V present between any two points.
18-13
Test Descriptions
Parameter
Instruction Manual
Description
Test Type
DISCH
Title
Not used
Range
Time to pause in milliseconds
From (-) Point
Point to discharge or charge (-)
To (+) Point
Point to discharge or charge (+)
Low Limit
0 = Discharge Points
1, 2 = Charge points at 1mA
3 = Charge points at 0.1mA
4 = Charge points at .01mA
5 = Charge points at 1A
6 = Charge points at 0.1A
11 = Charge points at 10mA
7 = Discharge all test points (see note above)
High Limit
Not used

Parameter
Description
Test Type
PAUSE
Title
Not used
Range
Time to pause in milliseconds (0-32000 mSec)
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Not used
High Limit
Not used

Specifies remeasurement actions the System takes if a test step failure occurs for RES, CAP
and DIODE test types.
Also affected by these settings are the associated JMP for each analog test, i.e., JMPR, JMPC,
JMPI, and JMPD.
This test type allows modification, at program execution-time, of the measurement parameters
set in the 'Setup' menu in the Edit screen. This test type can be used to increase the values for
problem points, or to increase the speed of failures when executing JMP-type analog
measurements.
18-14
Instruction Manual
Test Descriptions
Parameter
Description
Test Type
RETRY
Title
Normally not used, but if the title is RESET, the other fields are ignored and the
default retry characteristics (as present when beginning the test) are restored.
Range
The maximum time, in mSec, to retry a DIODE test before reporting a failure. Can
be used when capacitors in parallel with the diode need to charge.
From (-) Point
The maximum number of retries before reporting a RES failure.
To (+) Point
The maximum number of retries before reporting a CAP failure.
Low Limit
The maximum time, in mSec, to wait for the test points used in a RES test to
discharge before beginning a measurement (when using Current Mode). If this
parameter is set to 0, no checking for charged test points is made prior to RES
measurements.
High Limit
Maximum time, in mSec, to wait between repeating a RES measurement. During

this time, the System endeavors to charge or discharge the measurement to the
correct value. Used for Current Mode measurements only.

Specifies measurement parameters such as delay time and number of samples averaged on
analog measurements such as RES, JMPR, VOLT, CAP and INDUC. This test-type can be
used to modify some of the analog measurement parameters during a test sequence to optimize
measurements. Many of these values are the same as those set in the Resistance Measurement
Characteristics screen and replace those values for the remainder of the test.
When range values of 1-10 are specified, current-mode measurements are modified. When
range values of 11-14 are specified, voltage mode measurements are modified. Range values
of 17-22 modify VOLT test-type measurements.
This test type can be used to increase the values for problem measurements or to increase
accuracy.
18-15
Test Descriptions
Instruction Manual
Parameter
Description
Test Type
RESRG
Title
Normally not used, but if the title is RESET, the other fields are ignored and
the default measurement characteristics (as present when beginning the
test) are restored.
Range
1 = 100 (0.2V/1mA)
2 = 1k (2V/1mA)
3 = 10k (2V/0.1mA)
4 = 100k (2V/10A)
5 = 1M (2V/1A)
6 = 10M (2V/0.1A)
7 = 1k (0.2V/0.1mA)
8 = 10k (0.2V/10A)
9 = 100k (0.2V/1A)
10 = 1M (0.2V/0.1A)
11 = Samples averaged for voltage-mode RES readings
12 = Samples averaged for voltage-mode CAP readings
13 = Samples averaged for voltage-mode INDUC readings
14 = Re-measures reference voltages to which voltage
measurements are calibrated.
15 = 100 (2V/10mA)
16 = 10 (.2V/10mA)
17 = Samples averaged for each VOLT reading group
19 = High Limit contains number of groups averaged for
VOLT readings (default = 1, maximum = 1000)
20 = High Limit contains discard value for VOLT readings if groups
averaged is greater than zero. Any group readings above specified
percentage greater than reading average are discarded (default = 0).
For example, if High Limit is 50, group samples greater than 50%
above the average are discarded. Low Limit is similar, but discards
readings specified percentage below the average. For example, if
Low Limit is 50 (default = 0), group samples less than 50% of the
average are discarded.
21 = High Limit contains time, in mSec, after switching, but before taking
a VOLT reading (default = 0).
22 = High Limit contains scale factor for VOLT readings (default = 1).
24 = Sets the logic low and high thresholds to the Low Limit and High
Limit values respectively. See the command line parameters for
\loglo (logic low) and /loghi (logic high).
99 = Samples averaged and delay for TESTJ readings.
From (-) Point
Not used
To (+) Point
Not used
Low Limit
For range values 10 or less (and 15, 16), the delay, in mSec, after applying
the constant-current source and before beginning the measurement. For
range value 20, specifies low discard range for VOLT readings.
High Limit
For range values 17 or less, the number of samples averaged for the
measurement. For other range values, see specific range description for
assignment.
18-16
Instruction Manual
Test Descriptions
Allow operator adjustment of a potentiometer on the UUT using resistance, voltage or
counter/timer measurements. The System first measures the two test points. If the
measurement falls between the test limits, a result is logged (just as with a RES, UCT or DMM
test), and the next test step is executed (uses System for POTR).
If the initial reading is not within limits, the System displays the name of the component (taken
from the test title), the upper and lower limits (taken from the test limits), an analog meter
representation, and a request to the operator to make an adjustment. The System then displays
an updated measurement value, both graphically and numerically, to allow the operator to
make the adjustment. When the operator is done with the adjustment, any key can be pressed
to continue, after which the System makes a pass/fail evaluation based on the last reading
taken.
If a different adjustment criteria is required, you can create alternatives to this routine by using
several discrete test types as shown in the Test Program Examples section.
If the test title contains an up-arrow (^), the System will not display the analog meter on the
screen. If the test title contains an at-sign (@), the System requests that the operator adjust the
pot regardless of whether the initial reading is in-limits or not. If the test title contains an
ampersand (&), the analog meter movement polarity is reversed. This can be used to give the
operator a better sense for the direction to turn the pot during the adjustment.
O_Rng Note
O_Rng. This value, displayed as > 19 M (for POTR) or > 250 (for POTD),
is greater than any normally measured value, and will never cause a failure
on the high side. An over-range measurement is shown as O_Rng in the
measured value.
Parameter
Description
Test Type
POTR (measuring resistance)
Title
Description of measured component (e.g., R234). Also see the

description above for more detailed information about modifying
operation of the POTR test with the test title.
Range
From (-) Point
To (+) Point
Low Limit
High Limit
All of these fields are

the same as RES:
Install/Remove Jumpers
Allow operator installation or removal of missing or additional jumpers on the UUT. The
System first measures the resistance of the two test points. If the measurement falls between
the test limits, a result is logged (just as with a RES test) and the next test step is executed.
If the initial reading is not within limits, the System displays the name of the jumper (taken
from the test title) to remove or install. If the Low Limit is zero, the operator is instructed to
18-17
Test Descriptions
Instruction Manual
install the jumper. If the Low Limit is not zero, the operator is instructed to remove the
jumper. Once the test passes (such as when the operator corrects the jumpers), the next test is
executed. The operator can abort the test step (causing a failure) by pressing the F1 key.
If different operator interaction criteria is required, you can create alternatives to this routine
by using several discrete test types as shown in the Test Program Examples section. The
System generates two lines on the monitor when using this test type, then erases them when
completed.
Typical Low and High Limits for an installed jumper are 0 and 100. Typical limits for an
open jumper are 100 and 20M (which is displayed as > 19M).
O_Rng Note
O_Rng. This value, displayed as > 19 M, is greater than any normally
Parameter
Description
Test Type
JMPER
Title
Description of measured component (e.g., JP3-4)
Range
same as RES test type
From (-) Point
To (+) Point
Low Limit
High Limit
Set Switch
Allows testing for correct switch settings on the UUT. The System first measures the between
the two test points (resistance for SWCHR or a TR-6 DMM measurement with SWCHD). If
the measurement falls between the test limits, a result is logged (just as with a RES or DMM
test) and the next test step is executed.
If the initial reading is not within limits, the System asks the operator to toggle the switch (the
name of which is taken from the test title).
Once the test passes (such as when the operator corrects the switch setting), the next test is
executed. The operator can abort the test step (causing a failure) by pressing the [F1] key.
If different operator interaction criteria is required, you can create alternatives to this routine
by using several discrete test types as shown in the Test Program Examples section. The
System generates two lines on the monitor when using this test type, then erases them when
completed.
When using SWCHR, typical Low and High Limits for a switch to be closed are 0 and 100.
Typical limits for a switch that is to be open are 100 and 20M (which is displayed as >
19M).
18-18
Instruction Manual
Test Descriptions
O_Rng Note
To enter a value higher than the system can measure, type in 20M or O_Rng. This value,
displayed as > 19 M, is greater than any normally measured value, and will never cause a
failure on the high side. An over-range measurement is shown as O_Rng in the measured
value
Parameter
Description
Test Type
SWCHR (for resistance measurement)

SWCHD (for DMM measurement)
Title
Description of measured component (e.g., SW3-c)
Range
From (-) Point
To (+) Point
Low Limit
High Limit
All of these fields are the same as:

RES for SWCHR, or
DMM for SWCHD

Allows specification of a connection to be made when building a cable or harness. The
System measures between the two test points, compares the reading to the high and low test
limits, and generates a pass or fail based on the result.
If the "From (-) Point" is probed, the system displays a message to the operator:
Connect from <From-point name> to <To-point name>
Press [F1] to fail test...
If the test title is not blank, it can be used to provide a customized message to the operator. In
this case, the System replaces the text after "Connect from" with the contents of the test title.
The first up-arrow (^) found in the test title is replaced with the From (-) Point name. The
second up-arrow found in the test title is replaced with the To (+) Point name. When used in
this mode, the test title that would be the equivalent of the standard message would be "^ to ^".
After presenting the message, the System waits for the connection to be completed, another
point to be probed, or the [F1] key to be pressed. When any of these events occur, the System
beeps and then erases the above message from the CRT. In order to optimize speed, when
performing this test the System always uses the 100 current mode range to perform the
measurements. As such, expected measurements should be less than 160 .
An example test program to build a simple cable with four connections is shown below. When
this test program is executed, the System will wait until all the connections are made before
ending execution. The number of connections not made is shown in the upper right corner of
the display as the number of errors. The operator can either make each connection without
instructions, or probe a point shown as a "From (-) Point", then receive the message about how
to make the connection.
18-19
Test Descriptions
Instruction Manual
Parameter
Description
Test Type
WIRE
Title
If used, contains a custom description of connection to be made if

the "From (-) Point" is probed (e.g., Red to J2-2)
Range
not used (System always uses 100 DC Current range)
From (-) Point
To (+) Point
Low Limit
High Limit
Example Test Program for Building a Cable

Measures the AC or DC voltage or resistance value between two test points and generates a
result. The measurement is made and compared against the high and low test limits. Requires
that you have the optional Model TR-6 for use of this test type.
DMM AC and DC voltage measurements can be made from either the System test points or
TR-6(-1) relay test points. DMM Resistance measurements can only be made through the
back panel or TR-6 relay test points since the Analyst mc solid state test points cannot
accommodate the 100mA source current. If resistance measurements are to be made to
Analyst mc test points, use the Analyst mc RESistance test type.
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Instruction Manual
Parameters
Description
Test Type
DMM
Title
Description of measurement (e.g., VCC)
Range
Test Descriptions
0 = DCV function
64 = ACV function
128 = Resistance function
0 = autorange
1 = 200mV, 2
2 = 600mV, 6
3 = 2V, 20
4 = 6V
5 = 20V
6 = 60V
7 = 200V
8 = 600V (usable to 250V)
256 = AC Coupling for ACV, DC Filter for DCV/RES
512 = Measurement delay divided by 2
1024 = Measurement delay times 2
2048 = Measurement delay times 10
4096 = Samples averaged times 10
8192 = Samples averaged times 100
From (-) Point
Negative polarity test point (1625 if back panel only)
To (+) Point
Low Limit
Low test limit in volts or ohms
High Limit
High test limit in volts or ohms

Measures frequency, period, or counts between two test points and generates a result. In the
case of Period measurements a separate channel can be used to determine the pulse end
condition. The measurement is made, compared against the high and low test limits, and a
pass or fail result generated. This test step requires that you have an optional Model TR-6
installed in your system.
The input can be measured from the TR-6 back panel, a MPX point, or a TR-6 relay test point.
The source is typically taken with Chan 1, but can be routed through Chan 2 (back panel only)
or taken through the DMM input divider. Inputs of up to 5 volts can be accommodated
through Chan 1 and Chan 2 inputs. The DMM input is usable up to 50kHz and offers
differential input in conjunction with amplification or attenuation of the input signal,
depending on the range. When the DMM input is used, you should use the full-range DMM
value that is closest to the amplitude of the signal that you are measuring.
The trigger level is zero volts unless otherwise specified. The trigger levels are usable with
Chan 1 and Chan 2 inputs and can range from -2.2V to +2.2V in approximately 100mV steps.
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Instruction Manual
The input is normally AC coupled, but can be DC coupled when used with low frequency
signals (e.g., < 30Hz). The time constant of AC coupled Chan 1 and Chan 2 inputs is
approximately 63 mSec., while that of the DMM is 1.6 sec.
The Model TR-6-2 Fixture Interface can be used to buffer and frequency-divide signals in the
proximity of the UUT. This allows measurement of high frequency signals (up to about
50MHz) or at circuit locations that are sensitive to capacitance or loading.
See also the UCTTr test type for triggering during measurements.
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Test Descriptions
Parameters
Description
Test Type
UCT
Title
Description of measurement (e.g., Osc X2)
Range
Function:
0 = Frequency function
1 = Period function
2 = Count function
Range:
Period
4 = 12.8 uSec (1000 period avg)
8 = 128 uSec (100 period avg)
12 = 1.28 mSec (10 period avg)
16 = 12.8 mSec (1 period)
20 = 128 mSec (1 period)
24 = 1.28 Sec (1 period)
28 = 12.8 Sec (1 period)
32 = 128 Sec (1 period)
Frequency
5kHz
50kHz
500kHz
5MHz
10MHz
Count
12.8 Sec
1.28 Sec
128 mSec
12.8 mSec
Coupling:
00 = AC Coupling
64 = DC Coupling
Input Selection:
000 = Chan 1
128 = Chan 2
256 = DMM Input
384 = Chan 1 to Chan 2
512 = Chan 2 to Chan 1
Trigger Slope (period/count only):
0000 = Start Slope +
1024 = Start Slope 0000 = Stop Slope +
2048 = Stop Slope Settled measurement:
0000 = Use first reading
4096 = Ignore first reading
Input Range (DMM Only):
0000 = 600V
8192 = 200V
16384= 60V
24576= 20V
32768= 6V
40960= 2V
49152= 600mV
57344= 200mV
From (-) Point
Negative polarity test point (1625 if back panel)
To (+) Point
Low Limit
Low test limit in Hertz/Sec/Counts
High Limit
High test limit in Hertz/Sec/Counts
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Instruction Manual
UCT Trigger Setup

Allows change of a source signal from the optional Model TR-6 during a UCT measurement.
This can be used to initiate a non-repetitive signal from the UUT after the UCT is armed for
period or count measurements.
With this capability, you can specify the following sequence of events:
1. Set up an initial source value from the TR-6 with use of the DCV, SINEV, SQRV,
RELAY or DIGO test steps,

2. Use the UCTTR test step to save a pointer to the source test step and specify a new
stimulus value,
3. During execution of the next UCT test step, once the UCT is armed for a measurement, the
specified source is reprogrammed to the new high limit value (contained in the UCTTR
High Limit), then the UCT measurement taken, and
4. The UCTTR setup is automatically disabled until the next UCTTR is executed. The
stimulus is left at the value programmed by the UCTTR step.

Parameters
Description
Test Type
UCTTR
Title
Typically not used.
Range
If non-zero, indicates which subsequent step number (relative to

present step) that is used as type of stimulus. For example, a
range of 1 points to the next test step.
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Not used
High Limit
Stimulus value that the specified source is reprogrammed to during

the UCT measurement. This value is used as the High-Limit
program value for the test step specified in the range.
As an example, the following three test steps will program 0.5 volts to test point 5, arm the
UCT for a period measurement, reprogram the stimulus at test point 5 to 4.5 volts, then take a
period measurement at test point 10:
UCTTr
4.5
GND
R3-3
DCV
0.5
GND
10
P2-2
UCT
21
10u
20u
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Instruction Manual
Test Descriptions

Allows test-time measurement of an external value, after which the System adjusts the gain
and/or the zero offset of similar test steps to reflect the error of the measured value.
These test step types allow you to measure a known-good component value, then calibrate
similar measurements so that they are corrected to match. For example, if you are going to
measure some resistors that are more accurate than the System specification, you can measure
a known-good value resistor in the fixture, then correct the subsequent measurements to match.
This technique allows you to use the short-term stability of the System rather than the longterm accuracy.
When a ZERO or GAIN test type is executed, the System uses the measured value of the most
recent analog measurement (e.g., a RES or DMM test) as the reference. This test step is found
by searching back from the present test step until the first analog measurement is found. Next,
the system searches the range of test steps specified by the Low Limit and High Limit, and for
each test step that matches the reference test type (e.g. if the last analog measurement was a
CAP test type, it processes all of the CAP test types in the range), it replaces the existing
GAIN or ZERO value with that determined by the reference measurement.
Parameters
Description
Test Type
ZERO, GAIN
Title
Typically not used.
Range
Not used
From (-) Point
Not used
To (+) Point
Not used
Low Limit
The first step number in the range of test step to modify if the test
types match. If 1000 is added to the step number, the value is
forward-relative to the present step (e.g., 1002 refers to the
second step ahead of the present step). If 2000 is added to the
step number, the value is backwards-relative to the step number
(e.g., 2002 refers to 2 steps before the present step).
High Limit
The last step number to consider for modification. Uses the same
conventions as the 'Low Limit'.
Nominal Val
For GAIN, this value specifies the numerator when determining

the new gain factor. Typically, it will be the actual (nominal) value
of the component measured in the last step. For ZERO, this value
is typically 0, but it can be a non-zero value if you are offsetting for
a non-zero measurement.
Test for SMT Opens

Allows testing for open connections to ICs and connectors using the optional TR-8-SMT
module. This test is normally used on surface mount technology (SMT) parts since they have
more of a tendency to have open connections than through-hole technology.
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Test Descriptions
Parameters
Description
Test Type
TESTJ
Title
Name of part being testing (e.g., U101).
Range
Not used
From (-) Point
Test point number that is UUT ground.
To (+) Point
TestJet probe number.
Low Limit
Not used
High Limit
Not used
Nominal Val
Not used
Instruction Manual
Test for Capacitor Polarity

Allows testing for capacitor polarity using the optional TR-8-SMT-CAP module. This test is
used on aluminum and tantalum polarized capacitors in axial and SMT packages up to about
200 F.
The test step shown here has underlying data that is entered in the TestJet Capacitance
measurement analysis screen.
Parameter
Description
Test Type
TJETC
Title
Name of Capacitor Being Tested for Polarity (e.g. C101)
Range
Measurement Range:
0 = 300 fF range
2 = 3000 fF range
4 = 300 fF range
8 = 50 fF range
10 = 1600 fF range
16 = 1000 fF range
From (-) Point
Test-Point on Negative Polarity of Capacitor
To (+) Point
Test-Point on Positive Polarity of Capacitor
Low Limit
Front-to-Back Minimum Ratio for Proper Polarity
High Limit
Not used
Nominal
Typical Front-to-Back Ratio
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Test Descriptions
Test for Transistor/FET Beta

FET/transistor testing is performed with the Beta test-type. The Beta test type is entered using
the Edit screen like any other standard test, with additional information entered in a lowerlevel screen. See the section Entering Test Steps, Transistor and FET Testing on page 9-17
for more details about entering Beta tests.
The parameters entered from the Edit screen are shown below:
Parameter
Description
Test Type
BETA
From (-) Point
The more-negative current terminal of the device:

PNP Transistor = Collector
NPN Transistor = Emitter
P-FET = Drain
N-FET = Source
To (+) Point
The more-positive current terminal of the device:

PNP Transistor = Emitter
NPN Transistor = Collector
P-FET = Source
N-FET = Drain
Range
The type of component being tested:

1 = NPN Transistor (add 8 to this to do a fast mode sweep)
2 = PNP Transistor (add 8 to this to do a fast mode sweep)
3 = N-FET
4 = P-FET
Title
Used to describe the component being tested, such as Q203 or

Q1003.
Low Limit
Most negative acceptable bias current (or for FETs, gate voltage).
For transistors, the lowest measurable bias current is -1mA. For
FETs, the minimum measurable gate voltage is -10V. PNP
transistors will typically have negative values. NPN transistors will
typically be positive values.
High Limit
Most positive acceptable bias current (or for FETs, gate switch-on
voltage). For transistors, the highest measurable bias current is
+1mA. For FETs, the highest measured gate voltage is +10V. To
enter a value higher than the system can measure, type in 20M or
0_Rng. This value, displayed as O_Rng, is greater than any
normally measured value, and will never cause a failure on the
high side.
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Instruction Manual
Test for Transformer Polarity

Transformer polarity is performed with the XFMR test-type. The XFMR test type is entered
using the Edit screen like any other standard test. See the section in Entering Test Steps,
Transformer Testing on page 9-32, for more information about entering XFMR test steps.
The menu selection Measure > Step Analysis F6 in the edit window provides an easy to
use, fill-in the form method, to select the test setup. The parameters entered from the Edit
screen are shown below:
Parameter
Description
Test Type
XFMR
From (-) Point
Primary Winding Low Test Point
To (+) Point
Primary Winding High Test Point
Range
The frequency used for the measurement (default is 1kHz):

32 = 100Hz
48 = 1kHz
20 = 10kHz
24 = 100kHz
Title
Used to describe the component being tested, such as L103 or T345.
Low Limit
Secondary Winding Low Test Point
High Limit
Secondary Winding High Test Point
HP-1 High-Voltage Tests

The CheckSum Model HP-1 is used to test cables, harnesses and circuit assemblies for
continuity and high-voltage leakage and breakdown. The Model HP-1 can make
measurements for continuity using as low as a 1k threshold, and measurements for leakage
and breakdown for values as high as 500M using stimulus of 500 volts dc.
Note
The Model HP-1 can be controlled by the same software as CheckSum
MDA test systems. If you have both MDA and HP-1 modules installed in
the same System, take extreme care that high-voltages from the HP-1
cannot feed back into the MDA modules. Doing so will damage the MDA
modules.
CAUTION
The safety shield must be interlocked with the high-voltage electronics to provide
double protection to the operator. Ensure that the operator cannot touch any
points with high -voltage with the safety shield in place.
Programming tests using the Model HP-1 can be done with several different types of test steps
in the test program: Continuity Testing, High-voltage Testing, Resistance Testing, Breakdown
Testing, and Checking Status.
After the test type, HP1, is entered, the Measure > Step Analysis (F6) screen can be used to
setup the measurement:
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Instruction Manual
Test Descriptions
The "Select Measurement Module" selects the HP-1 module that is connected to the "From (-)
Point" as the module which both sources and senses the measurement result. For high-voltage
measurements, the interlock is checked on the measurement module as well as the module
connected to the "From (-) Point" and the "To (+) Point". Measurement module selection
allows the option of connecting separate fixtures to separate HP-1 modules within the same
test controller.
HP-1 Continuity Testing
A continuity test is used to ensure that the cable is wired correctly. This test is performed
using the CONTinuity test type. To use the Model HP-1 with the CONTinuity test type, the
range of points specified in the `From (-) Point' and `To (+) Point' columns will be from 1951
to 1998. The ` From (-) Point' must be 1951 or higher and the ` To (+) Point' must be 1998 or
lower. The system measures continuity using a 12VDC maximum stimulus, with maximum
current of 6mA.
Normally you should specify a measurement range of 10mA, which is the default. With the
10mA measurement range, the System tests for opens and shorts using a default threshold of
approximately 1k. There is some hysteresis (about 10%) in the measurement to prevent false
failures. In the editor menu, Measure > Step Analysis (F6) > Setup > Set Thresholds, you can
select from measurement ranges of:
Default Test Threshold
Measurement Range
1k
10mA
20k
1mA
200k
100A
2M
10A
Low-Voltage CONT Ranges
HP-1 High-Voltage Testing

High-voltage testing ensures that the assembly does not have any high resistance shorts, or
specifically shorts caused by the application of 500VDC to each circuit.
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Test Descriptions
Instruction Manual
Programming for a high-voltage test is just like programming a CONTinuity test, except the
test type is HIPOT. The other screens appear the same. The ` From (-) Point' must be 1951 or
higher and the ` To (+) Point' must be 1998 or lower. The default measurement range is 1mA,
which provides a threshold of approximately 1M. In the editor menu, Measure > Step
Analysis (F6) > Setup > Set Thresholds, you can select from measurement ranges of:
Default Test Threshold
Measurement Range
100k
10mA
1M
1mA
10M
100A
100M
10A
High-Voltage CONT Ranges
Following are the parameters for the HIPOT test-type:

Parameter
Description
Test Type
HIPOT
Title
Description (typically not used, or 'HiPot Shorts')
Range
Normally 0. If 1, instructs the System to ignore inactive pins during continuity

testing optimizations.
From (-) Point
Lowest test point number of test, must be 1951 or higher
To (+) Point
Highest test point number of test, must be 1998 or lower
Low Limit
Not used
High Limit
Not used
HP-1 Resistance Testing

In some cases, you may wish to make an individual measurement between two points. To do
so, use the HP1 test-type. You have the choice of measuring resistance using low-voltage or
high-voltage.
Low-voltage measurements are made at approximately 12 volts (with 2 k source impedance)
into an open circuit. High-voltage measurements are made at approximately 500 volts (with
64 k source impedance).
Remember that the safety switch must be closed (pin 50 connected to pin 49) in order to make
high-voltage measurements.
Following are the parameters for the HP1 test-type for resistance:
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Instruction Manual
Parameters
Test Descriptions
Description
Test Title
HP1
Title
Description of measurement (for example, Lo/Hi Ohms)
Range
Value
Maximum
Source
Current
Voltage
(Vdc)
Minimum
R
Maximum
Usable R
1
2
3
4
6mA
1mA
100A
10A
12
12
12
12
0
10k
118k
1.2M
10k
118k
1.2M
12M
9
10
11
12
8mA
1mA
100A
10A
500
500
500
500
0k
436k
4.936M
50M
436k
4.936M
50M
500M
From (-) Point
Negative polarity test point (ranges from 1951-1998)
To (+) Point
Positive polarity test point (ranges from 1951-1998)
Low Limit
Low test limit in (k for high-voltage, for low-voltage)
High Limit
High test limit in (k for high-voltage, for low-voltage)
HP-1 Breakdown Testing

In some cases, you may wish to make a breakdown measurement between two points. To do
so, use the HP1 test-type. Breakdown measurements use up to 500VDC. In the Step Analysis,
Details screen, you can specify a delay time that occurs between sweep samples while
measuring breakdown. The delay time is specified in mSec. A small delay may help make
more effective measurements if significant parallel capacitance is present between any of the
device leads. If you specify a negative delay time, only the first measurement is delayed by
the specified time.
Remember that the safety switch must be closed (pin 50 connected to pin 49) in order to make
these measurements.
Following are the parameters for the HP1 test-type for breakdown:
18-31
Test Descriptions
Parameters
Instruction Manual
Description
Test Title
HP1
Title
Description of measurement (for example, Breakdown)
Range
Value
Maximum
Source
Current
25
8mA
Maximum
Voltage
(Vdc)
500
From (-) Point
Negative polarity test point (ranges from 1951-1998)
To (+) Point
Positive polarity test point (ranges from 1951-1998)
Low Limit
High Limit
HP-1 Checking Safety Interlock Status

In some cases, you may wish to see if the switch connected to the safety interlock is open or
closed. With this capability, for example, you can see if the fixture safety door is closed before
you start the test, or ensure that it is open to see if the UUT is removed.
Following are the parameters for the HP1 test-type when checking the interlock status:
Parameters
Description
Test Title
HP1
Title
Description (for example, Door Open?)
Range
32 = normal execution, set Pass/Fail

33 = do not generate or report results, does not set Pass/Fail
From (-) Point
Indicates which HP-1 card to check. For example, the first HP-1 is a
point between 1951-1974, the second HP-1 1975-1998.
To (+) Point
Not used
Low Limit
0 = passes if switch open (disengaged)

1 = passes if switch closed (engaged)
High Limit
Not used
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Test Descriptions
Opto-isolator Test
The OPTO test type checks the switching characteristics of an opto-isolator. It measures the
input current where the output resistance is at or below a threshold resistance then it compares
the input current against the Low and High Limits. Refer to the Opto-isolator Testing on page
9-21 for setting up this test step.
Parameters
Description
Test Title
OPTO
Title
Description of measured component (e.g. U11)
Range
Not used.
From (-) Point
Opto-isolator output transistor emitter
To (+) Point
Opto-isolator output transistor collector
Low Limit
Low test limit in Amps
High Limit
High test limit in Amps
Multi-Function Input Measurement

Measures the resistance (Res), capacitance (Cap), inductance (Induc), diode (Diode), zener
(Zener), voltage (Volt) or logic level. See the other test types for additional information. Also
see Multi-Function Input on page 9-51.
The test low and high inputs can be separately set to the front panel test inputs or test points.
The menu selection Measure > Step Analysis F6 in the edit window provides an easy to use,
multi-meter style setup to select the settings for the type of measurement you need to make.
Parameters
Description
Test Title
MFI
Title
Description of measured component (e.g. R45)
Range
Automatically setup.
From (-) Point
Not used.
To (+) Point
Not used.
Low Limit
Low test limit
High Limit
High test limit
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Test Descriptions
Instruction Manual

The optional Model TR-6 provides the capability to source AC and DC voltages to the UUT.
All test types in this section apply only if you have a Model TR-6 installed in your test system.
The Model TR-6 has internal sources for generating sine waves (SINEV), square waves
(SQRV) and dc voltages (DCV). In addition, there are provisions for switching an external
signal (EXTIO) for sourcing or measuring with an external device. These sources are
available at the TR-6 back panel, or they can be switched into the Analyst mc solid state
switching. They are not available at the Model TR-6(-1) relay switching. If it is necessary to
apply one of these sources to a test point that cannot be wired into the System test points, you
can provide wiring for the source to the UUT point through one of the Model TR-6's
undedicated relays.
The Model TR-6 sources are ground referenced. The ground is ultimately connected to the
chassis of the System. The "From (-)" test point used for supplying sources are connected
back to this ground.
System sources are disconnected when the source test title is specified as RESET (in either
upper or lower case). The sources are all reset when the system is powered up, when a CONT
or ICS test is performed, and before and after each test program is executed.
The Analyst mc allows up to six guard points at one time, each of which can be remotely
sensed. When one or more sources are programmed (and not reset), only three guard points
can be active simultaneously. The software automatically ignores the last three guard points if
present.
The Model TR-6 has the ability to provide simultaneous stimulus channels, however, there are
some interdependencies. In the case of interdependencies, the last programmed value has
priority. These include:
1. If a square wave (SQRV) is specified with a non-zero Low Limit, the DC voltage (DCV)
output is used. Therefore, the stimulus value for the first voltage of the square wave and
the DCV output will be the same. If the alternate DCV output (range = 2) is used, it
disables the square wave output entirely and replaces it with the specified DC voltage
signal.
2. The sine and square wave generation (SINEV/SQRV) use the same frequency generation
circuitry, therefore the frequency must be the same for both if they are used
simultaneously.
The following frequencies are available when generating sine and square waves:
40kHz, 20kHz, 13.3kHz, 10kHz, 8kHz, 6.67kHz, 5.71kHz, 5kHz, 4.44kHz, 4kHz, 3.64kHz,
3.33kHz, 3.08kHz, 2.85kHz, 2.67kHz, 2.5kHz, 2kHz, 1.33kHz, 1kHz, 800Hz, 667Hz, 571Hz,
500Hz, 444Hz, 400Hz, 364Hz, 333Hz, 308Hz, 285Hz, 267Hz, 250Hz, 200Hz, 133Hz, 100Hz,
80Hz, 67Hz, 57Hz, 50Hz, 44Hz, 40Hz, 36Hz, 33Hz, 31Hz, 29Hz, 27Hz, 25Hz, 20Hz, 13Hz,
10Hz, 8Hz, 7Hz, 6Hz 5Hz, 4Hz, 3Hz.
In most cases the stimulus is used from the Analyst mc test points. It also comes
simultaneously from the hardwired TR-6 back panel connector. If stimulus from the TR-6
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Instruction Manual
Test Descriptions
back panel only is to be used, the Analyst mc test point stimulus can be eliminated by using a
'From (-) Point' of 1625.
The analog stimulus test types are:
Sine Wave Output below
Square Wave Output on page 18-36
DC Voltage Output on page 18-36
DC Current Output on page 18-37
Monitor PWR-1 Output on page 18-38
External Signal Input/Output on page 18-38
Sine Wave Output

Provides sine wave stimulus from the Model TR-6 module. This stimulus is available at the
Model TR-6 back panel or via the Analyst mc test points. The sine wave stimulus is
referenced to a non-floating analog ground which is switched to the UUT with the "From (-)"
test point.
Parameters
Description
Test Type
SINEV
Title
If 'RESET' is entered, the sine wave source is disconnected from

the matrix and set to high impedance output.
Range
Frequency in Hertz.
Discrete values from 3Hz to 40kHz are available. A list of these
values is included at the beginning of this section. When a
frequency is entered into the test program, it is replaced by the
nearest achievable value.
From (-) Point
Negative polarity source point (1625 if back panel only)
To (+) Point
Positive polarity source point.
Low Limit
Not used
High Limit
Sine wave amplitude in volts peak to peak.

The range is 100mV to 20V peak (in .1 dB steps). When the
amplitude value is entered into the test program it is replaced by
the nearest achievable value.
18-35
Test Descriptions
Instruction Manual
Square Wave Output

Provides square wave stimulus from the Model TR-6 module. This stimulus is available at the
Model TR-6 back panel or via the Analyst mc test points. The square wave stimulus is
referenced to a non-floating analog ground which is switched to the UUT with the "From (-)"
test point.
Parameters
Description
Test Type
SQRV
Title
If 'RESET' is entered, the square wave source is disconnected

from the matrix.
Range
Frequency in Hertz.
Discrete values from 3Hz to 40kHz are available. A list of these
values is included at the beginning of this section. When a
frequency is entered into the test program, it is replaced by the
nearest achievable value.
From (-) Point
Negative polarity source point (1625 if back panel only)
To (+) Point
Low Limit
One of the amplitude levels of the square wave. Normally this

value is zero, but it can range from -10 to +10 volts in 5mV steps.
High Limit
One of the amplitude levels of the square wave. This value can
range from -10 to +10 volts in 5mV steps.
DC Voltage Output
Provides DC voltage stimulus from the Model TR-6 module and the Model PWR-1 Module.
The TR-6 DCV D/A converters (DAC) provides stimulus in the range of -10V to +10V in
5mV steps. The output can provide up to 10mA current. The output is available at the back
panel or through the Analyst mc switching. The DC stimulus is referenced to a non-floating
analog ground which is switched to the UUT with the "From (-)" test point. An alternate
Model TR-6 DCV output is available by specifying a range of 2. In this case, the SQRV
source is used to generate a DC voltage.
If a non-zero Low Limit on the SQRV output is specified, the DCV source is used for this
purpose and the amplitude specified for the SQRV output will reprogram the DCV output.
If the PWR-1 is used to provide the stimulus, the stimulus is available at the PWR-1 back
panel via test points 1631-1646. The available stimulus is from -12V to +12V in 5mV steps.
If the Range is 1, 2, 5, or 6, the "From (-) Point" is connected to ground and the "To (+) Point"
is connected to the source at the high limit voltage.
Multiple source connections are available by setting the multiple stimulus flag using the
FLAGS command.
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Instruction Manual
Test Descriptions
Parameters
Description
Test Type
DCV
Title
If 'RESET' is entered, the specified DCV output is set to 0 volts and

disconnected from the matrix.
Range
DC source being programmed:

1 = Normal DCV output (source impedance less than 1k)
2 = SQRV output (source impedance less than 1k)
3 = PWR-1 output 1 (source impedance less than 4)
4 = PWR-1 output 2 (source impedance less than 4)
5 = DCV output (source impedance less than 1k)
6 = MPX-2 DCV output (source impedance less than 8)
From (-) Point
Negative polarity source point. If the range is 1 or 2, this point must

be in the range of 1-1600. If the range is 3 or 4, this point must be in
the range of 1631-1646. In all cases, test point 1625 specifies no
matrix connection.
To (+) Point
Positive polarity source point. If the range is 1 or 2, this point must be

in the range of 1-1600. If the range is 3 or 4, this point must be in the
range of 1631-1646. In all cases, test point 1625 specifies no matrix
connection.
Low Limit
Not used
High Limit
Amplitude in volts:
If Range = 1 or 2 (TR-6)
-10V to +10V in 5mV steps
If Range = 3 or 4 (-PWR)
If Range = 5
If Range = 6 (MPX-2)
0, 5 or 12
DC Current Output
The DCI test type applies a stimulus current to the specified To (+) Point. The From (-) Point
is connected to ground. There are two stimulus source ranges available, 1mA to 10mA in
40A steps and 0 to 1mA in 4A steps from the Analyst mc (range 1) and 100mA from the
TR-6 (range 2). This command is controlled by multiple sourcing (via FLAGS ranges 4 & 8)
command same as DCV. The Analyst mc stimulus is available only to test points through solid
state switching. The TR-6 stimulus is available only to the 2-wire bus connected test points.
Note that DCI range 1 and DCV range 5 are mutually exclusive, application of one cancels out
the other.
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Test Descriptions
Instruction Manual
Parameters
Description
Test Type
DCI
Title
If 'RESET' is entered, all connections for the specified source are

removed and the amplitude is set to 0 for the source.
Range
DC source being programmed:

1 = Analyst mc
2 = TR-6
From (-) Point
Current return point or no connection made if the value is 1625
To (+) Point
Current source point
Low Limit
Stimulus current (Amps):

If Range = 1 (Analyst mc)
0mA to 1mA in 4A steps
1mA to 10mA in 40A steps
If Range = 2 (TR-6)
100mA
High Limit
Not used

Allows measurement of PWR-1 Module Voltage and Current output.
Parameters
Description
Test Type
PWRMN
Title
Normally not used.
Range
DC source being monitored, and type of monitor. Sum of:

3 = Monitor PWR-1 power output 1, or
4 = Monitor PWR-1 power output 2, and
16 = Measure Voltage, or
32 = Measure Current
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Low limit for pass in volts if range bit 16 is set, or current in Amps
if range bit 32 is set.
High Limit
High limit for pass in volts if range bit 16 is set, or current in Amps
if range bit 32 is set.

Allows connection of external instrumentation to the Analyst mc solid-state switching. The
switched signal is connected to the "To (+)" test point. Ground (connected to the controller
chassis) is switched to the UUT "From (-)" point. Signals of up to plus and minus 12 volts
(with respect to the controller chassis) and up to 15mA can be accommodated. The signal is
applied until a RESET is issued (via the title of this test type). The external signal is connected
to the back panel connector on the TR-6 System Module.
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Instruction Manual
Test Descriptions
Digital Test Types
Parameters
Description
Test Type
EXTIO
Title
If 'RESET' is entered, the external signal is disconnected from the matrix.
Range
Not used
From (-) Point
Negative polarity source point (connected to chassis ground)
To (+) Point
Low Limit
Not used
High Limit
Not used
Digital Test Types

Overview
The Analyst mc does not have digital I/O capability without an optional module. The
following information is provided for your understanding of other CheckSum test systems.
The digital test types allow you to input and output digital data from within a test program.
DIG-1 Characteristics below
TR-6 System Module Digital I/O on page 18-40
TR-8-1 Digital I/O on page 18-40
Other Digital Methods (TR-6) on page 18-40
General Digital I/O Programming on page 18-41
DIGx Test Types on page 18-41
Digital Input Test on page 18-41
Digital Output on page 18-42
Digital Active on page 18-42
DIG-1 Control) on page 18-43
Digital Hardware Testing with the LOGIC Test Type on page 18-45
PORTx Test Types on page 18-45
Port Input Test on page 18-46
Port Output on page 18-46
Boundary Scan Testing on page 18-46
In System Programming (ISP) on page 18-47
DIG-1 Characteristics
On the DIG-1 Digital I/O Module, each bit is an individually bi-directional digital TTL I/O
line that can source 2.5mA or sink up to 24mA. Since a pull-up resistor is in place (10k), the
bits are also compatible with most CMOS logic families. The DIG-1 has relays to disconnect
18-39
Test Descriptions
Digital Test Types
Instruction Manual
the logic output during MDA testing. The DIG-1 can be programmed to use 3.3V for digital
input/output. When set to use 3.3V I/O, the pull-up resistor is tied to 3.3V.
Note
Reset Conditions: Between test program executions, the bits are all set to
high impedance (tri-state). Since each line has a 10k pull-up resistor, this
results in a TTL one. Each line that you would like to use for output from
the System needs to be set active using the DIGA test type. In the reset
mode, the outputs are set to tri-stated zeros, so that when you activate an
output it will immediately go to a zero. You can first perform a DIGO to
set the bits to ones prior to the activating the output bit if you so desire.
TR-6 System Module Digital I/O

The Model TR-6 directly accommodates eight bits of digital I/O via its System Module. The
eight bits consist of open-collector drivers that can be used to control external relays requiring
currents of up to 100mA. The module supports the installation of on-board pull-up resistors
that make the digital byte appear as 5V or 12V digital logic. Input signals of up to 12 volts can
also be read back (at TTL logic thresholds).
The TR-6 System is shipped with a 10k pullup resistor network connected to +5V. This
resistor network can also be jumpered on the Model TR-6 Module to +12V. The resistor
network (socketed) can be removed to eliminate inter-bit impedance or to allow connection to
external pull-up sources such as when you are directly driving external relays with the System.
The digital input always uses TTL-level inputs, although it can be used with inputs of up to
+12 volts without damage.
Model TR-8-1 Digital I/O

With the Model TR-8-1 MPX modules, you can multiplex 16 test points per module between
standard analog I/O and digital I/O under software control. These points can be wired into
digital nodes on the UUT to supply digital testing.
On each Model TR-8-1, the first 16 test points can be changed to digital I/O points. The points
can be set as input or output on a byte-by-byte basis. When these points are used, they should
be specially wired to the test points on the UUT requiring digital control. As a general rule,
use test points 1-8 as output or input/output points and test points 9-16 as inputs (although
these points can also be configured as outputs, but only when points 1-8 are also configured as
outputs.)
To use the digital capabilities on the Model TR-8-1 modules, after completion of MDA testing
and application of power to the UUT, first connect the digital bytes to the test points and
configure them as inputs or outputs as necessary with the DIGA command. Then use DIGO to
do output or DIGI to do input. These digital bytes are accessed by test range values that apply
to a byte on each module.
Other Digital Methods (TR-6)

The Model TR-6 DCV command can be used to provide logic levels to several test points
simultaneously. The (-) test point serves as a digital low and the (+) test point, when
programmed to +5V, serves as a digital high level. Up to 16 simultaneous source points can be
used.
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Instruction Manual
Test Descriptions
Digital Test Types
The System does interrupt these analog voltages during reset operations so DCV sourcing
should only be used on level-sensitive digital bits.
Under normal circumstances, the System disconnects previous test points connected to the
same source (e.g., DCV) when a new stimulus is applied. However, with use of the FLAGS
test step, you can have the System allow multiple stimulus points from the same source
(FLAGS range = 8). The source can be disconnected with a RESET of the desired source.
General Digital I/O Programming

The numbers used with the digital test types (DIGI, DIGO, DIGA, PORTI, PORTO, LOGIC)
are all decimal. As such, if you would like to send a byte of all ones, you would specify 255.
A byte of all zeros is 0. Individual bits (which can be added) are 128 (MSB), 64, 32, 16, 8, 4,
2, and 1 (LSB).
Masks are used to specify inactive bits during input. Any one in the mask is used to mask out
the specified bits. For example, if you want to mask out the two least significant bits, specify a
3. Test results are presented after the masking operation.
The System programs the bits in byte increments. Byte numbers 1-6 refer to the DIG-1 bits,
byte 13 refers to the Model TR-6 System Module bits, bytes 14-15 refer to the Model TR-8-1
bits, and byte 30 refers to the PWR-1.
DIGx Test Types

The DIGx (DIGI, DIGO, DIGA, DIGR) test types control input and output via the PWR-1 (8
bits), DIG-1 (each DIG-1 module controls 6 bytes with 8 bits/byte), and FUNC-1 System
Module (8 bits). If a DIG-1 Module is selected (range 1-12) for DIGI or DIGA, the relays to
the bytes are automatically connected, see the DIGR test type on page 18-43.
Digital Input Test

Reads a byte of digital data from a TR-8-1 module and generates a test result. The menu
selection Measure > Step Analysis F6 in the edit window provides an easy to use, fill-in the
form method, to select these settings.
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Test Descriptions
Digital Test Types
Instruction Manual
Parameter
Description
Test Type
DIGI
Title
Name of test step (e.g., U234 Out)
Range
Input byte number:

1 = DIG-1 bits 1-8
2 = DIG-1 bits 9-16
...
6 = DIG-1 bits 41-48
13 = TR-6 bits 1-8
14 = TR-8-1 points 1-8
15 = TR-8-1 points 9-16
30 = PWR-1 bits 1-8
From (-) Point
Not used
To (+) Point
0 = normal execution, set Pass/Fail

1 = do not report results, do not set Pass/Fail
Low Limit
Input mask: Data read is ignored for any bit set as one in this
field (e.g., if input mask is 5, the LSB and 2nd bit from the LSB
are ignored).
High Limit
Expected data
Digital Output
Write a byte of digital data from the TR-8-1 to the UUT. The menu selection Measure >
Step Analysis F6 in the edit window provides an easy to use, fill-in the form method, to
select these settings.
Parameter
Description
Test Type
DIGO
Title
Not used
Range
Output byte number:

1 = DIG-1 bits 1-8
2 = DIG-1bits 9-16
...
6 = DIG-1bits 41-48
13 = TR-6 bits 1-8
14 = TR-8-1 points 1-8
15 = TR-8-1 points 9-16
30 = PWR-1 bits 1-8
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Not used
High Limit
Data byte to output
Digital Active
Set selected bits on a DIG-1 Digital I/O Module to active. Sets specified one-bits as active and
zero-bits as tri-state in the selected byte. All bits are tri-stated as default. If a DIG-1 Module
is selected (range 1-6), the relays to the bytes are automatically connected, see the DIGR test
type on page 18-43. The DIGA (digital active) test type does not apply with open-collector
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Instruction Manual
Test Descriptions
Digital Test Types
circuits. The menu selection Measure > Step Analysis F6 in the edit window provides an
easy to use, fill-in the form method, to select these settings.
Parameter
Description
Test Type
DIGA
Title
Not used
Range
Output byte number:

1 = DIG-1 bits 1-8
2 = DIG-1 bits 9-16
...
12 = DIG-1 bit 41-48
14 = TR-8-1 points 1-8
15 = TR-8-1 points 9-16
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Not used
High Limit
Tri-state data information. Each bit set as one is activated.

For Model TR-8-1 programming, the High Limit is assigned as:
0 = disconnect all digital test points on module
1 = connect all digital test points on module
configure points 1-8 on module as inputs
configure points 1-8 on module as outputs
DIGR (DIG-1 Digital Module Switching/Control)

The DIGR test step controls the DIG-1 module relays, I/O voltage levels, switched power
outputs, Boundary-Scan pass through, and Boundary-Scan switching to the UUT. The digital
I/O bytes on the DIG-1 module use relay connections to isolate the digital signals from the
UUT. Use the DIGR range 1 and 2, to close (connect) or open (disconnect) these bytes. Refer
the DIG-1 section of the Wiring Diagram additional connection information.
use, fill-in the form method, to select these settings.
18-43
Test Descriptions
Digital Test Types
Parameter
Instruction Manual
Description
Test Type
DIGR
Title
Normally not used
Range
Range = 1
To close the relays for bytes 1 to 6, sum of the following:
1 = byte 1 (bits 1-8)
2 = byte 2
4 = byte 3
8 = byte 4
16 = byte 5
32 = byte 6 (bits 41-48)
See the High Limit to leave relays in the previous position (open
or closed).
Range = 2
To close the relays for bytes 7 to 12, sum of the following:
1 = byte 7 (bits 49-56)
2 = byte 8
4 = byte 9
8 = byte 10
16 = byte 11
32 = byte 12 (bits 89-96)
See the High Limit to leave relays in the previous position (open
or closed).
Range = 3
Set the I/O voltage for the DIG-1 bytes. A Low Limit value of 0
sets the I/O voltage for 3.3V, a value of 1 sets the I/O voltage for
5.0V. The default is 5.0V. The High Limit value identifies the
DIG-1 module controlled.
Range = 4
Open or close the relay switched +5VDC power on pin 50 (and
GND on pin 49) on the DIG-1 rear panel connector. A Low Limit
value of 0 disconnects power, and a value of 1 connects power.
The High Limit value identifies the DIG-1 module controlled.
Range = 5
Control the pass through of Boundary Scan signals on the DIG-1
module in the scan path. A Low Limit value of 0 will exclude the
DIG-1 bytes, a value of 1 will include all of the DIG-1 bytes. The
default is exclude. Including a module in the scan path allows
the DIG-1 bits to be part of the boundary scan path. The High
Limit value identifies the DIG-1 module controlled.
Range = 6
Controls the Boundary Scan connector signals of the DIG-1
module to the UUT. Set the Low Limit as follows:
0 = disconnect TMS, TCK, TDI, TDO and Ground (Switched
GND)
1 = connect TMS, TCK, TDI, TDO and Ground (Switched GND)
The default is disconnect all. The High Limit value identifies the
DIG-1 module controlled.
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Refer to the Range selection
High Limit
If Range = 1, sum of the following to leave relays in the previous
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Instruction Manual
Test Descriptions
Digital Test Types
position (open or closed):

1 = byte 1
2 = byte 2
4 = byte 3
8 = byte 4
16 = byte 5
32 = byte 6
If Range = 2, sum of the following to leave relays in the previous
position (open or closed):
1 = byte 7
2 = byte 8
4 = byte 9
8 = byte 10
16 = byte 11
32 = byte 12
If Range = 3, 4, 5, or 6
1 = controls the module for DIG-1 bytes 1-6
2 = controls the module for DIG-1 bytes 7-12
Digital Hardware Testing with the LOGIC Test Type

For digital I/O, the LOGIC test type can use one or more types of CheckSum modules,
including the Model TR-8-1 MPX modules, Model TR-6 Functional Test Module, or DIG-1
Digital I/O Module. This combined software/hardware can be used to do in-circuit testing of
digital hardware combinational logic and transceivers. Refer to the TR-6 manual for more
details and examples of LOGIC test use.
Test digital hardware power-on behavior according to functional behavior defined in a test file.
Parameter
Description
Test Type
LOGIC (not available on the Analyst mc)
Title
Name of test file (assuming .TST extension) optionally followed

by name of a sub-test within the file to execute.
Range
Normally 0, but additional test coverage can by obtained by

using a range value of 32 which causes all test steps in each
sub-test to be performed regardless of any previous failures.
Adding an offset of 64 causes test execution from the Edit
screen to single step through the lines of the sub-test. A
keyboard key must be pressed for the executive to proceed to
the next sub-test line. The offset of 64 has no effect on
execution outside the Edit screen.
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Not used
High Limit
Not used
PORTx Test Types

The PORTx (PORTI, PORTO) test types do I/O to the controller's input and output ports
allowing you to communicate with peripherals and other I/O-mapped devices.
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Test Descriptions
Digital Test Types
Instruction Manual
Port Input Test

Read a byte of digital data from the controller's I/O bus and then generate a test result.
Parameter
Description
Test Type
PORTI
Title
Name of test step (e.g., Data In)
Range
Input port address
From (-) Point
Not used
To (+) Point
0 = normal execution
1 = do not generate or report results
Low Limit
Input mask: Data read from port is ignored for any bit set as
one in this field (e.g., if the input mask is 5, the 1-bit (LSB) and
4-bit are ignored).
High Limit
Expected data
Port Output
Write a byte of digital data to the controller's I/O bus.
Parameter
Description
Test Type
PORTO
Title
Not used
Range
Output port address
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Not used
High Limit
Data byte to write
Boundary Scan Testing

Boundary scan testing can be performed with the CheckSum Analyst mc if it is ordered with
the optional Model TR-8-BST module and software. The BSCAN test-type supports lowerlevel data that is described in the manufacturer's instruction manual.
The parameters entered from the Edit screen are shown below:
Parameter
Description
Test Type
BSCAN
From (-) Point
Not used
To (+) Point
Not used
Range
Test step in BSCAN lower-level data to execute.
Title
Used to describe the component being tested, such as U103.
Low Limit
Not used
High Limit
Not used
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Instruction Manual
Test Descriptions
Digital Test Types
In System Programming (ISP)

The ISP test step is used to control and test programmable parts. The step has multiple uses
and can control numerous programmable parts. For example, this test step can be used to
erase, program and verify a programmable component. The type of protocol (e.g. JTAG, IIC,
SPI) and the actual hardware used to communicate with the component is defined in the test
step setup window. The menu selection Measure > Step Analysis F6 in the edit window
opens the easy to use, fill-in the form setup window to select these settings.
The ISP Setup window will expand to allow you to enter attributes depending on the ISP type
selected. For example, if you select the ISP type "JTAG", the window will expand to allow
you to enter attributes about the JTAG scan path. Use the Add button to insert components in
the order of the scan path. Select the manufacturer, device part number, type of operation
(Bypass, Program, etc) and, if needed, the input file (SVF format). Check the CF (Chained
file) box if appropriate. The ISP Setup # allows you to use setups created in one ISP test step
to another ISP test step. You can also export the step in one program and import the step in
another test program. The Do not Set Pass/Fail check box allows you to control the results of
the test. You can use the Execute button to see if the step will Pass or Fail. The View button
lets you review the input and output files while you work on the test step. The Find button is
used to locate other ISP test steps that include the manufacturer or device part number for both
standard devices and user supplied devices (in this test program).
In the ISP Device setup window, if you check the box labeled Check Device ID, this window
will expand to allow you to specify other data. For example, Identification Opcode,
Manufacturer ID, Part Number, and Version may be entered, if they are not already known to
the system.
The ISP test type is available for Windows 95/98 only. On TR-8 systems, the ISP test step
uses the G-80 module. On Analyst mc and TR-10 systems, the ISP test step uses the DIG-1
module. For fixtures used for both MDA and ISP, a switch-over module is generally used to
isolate the ISP interface from the UUT during MDA testing. This is provided automatically on
the DIG-1 module. The ISP step assumes that the UUT has been powered-up and is ready to
receive ISP programming commands.
Parameter
Description
Test Type
ISP
From (-) Point
Not used
To (+) Point
Not used
Range
Test step in ISP lower-level data to execute.
Title
Used to describe the component being programmed, such as

U103.
Low Limit
Not used
High Limit
Not used
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Test Descriptions
Instruction Manual

Overview
The following test types are used for transfer of control within the test program. A label is first
specified that can be used as the destination of JMPs and CALLs. Labels can be up to twelve
characters long and are not case-sensitive (differences in upper and lower case are ignored).
Note
The measurement parameters set in the Special Features menu, such as
failure retries and discharge times, also affect the speed and accuracy of the
analog JMP test types, i.e., JMPR, JMPC, JMPZ and JMPD. To enhance
testing speed, you can use the RETRY and RESRG test types to modify
these measurement parameters during a test.
Specify Label on page 18-49
Jump Unconditionally on page 18-49
Jump Based on Resistance Measurement on page 18-49
Jump Based on Capacitance Measurement on page 18-50
Jump Based on Diode Measurement on page 18-50
Jump Based on Inductance Measurement on page 18-51
Jump Based on Voltage Measurement on page 18-51
Jump Based on PWR Measurement on page 18-51
Jump Based on DMM Measurement on page 18-52
Jump Based on UCT Measurement on page 18-52
Jump Based on Result of Digital Input on page 18-53
Jump Based on Result of Port Input on page 18-53
Jump Based on Result of Key Input on page 18-54
Set Error Counter Used for JMPE on page 18-54
Jump Based on Number of Errors on page 18-55
Jump Based on Zener Measurement on page 18-56
Jump Based on Self-test on page 18-56
Jump Based on Fixture Identification on page 18-56
Call a Subroutine on page 18-57
Return from Subroutine on page 18-57
Load and Run a Test Program on page 18-58
Load and Run a Test Sub-Program on page 18-58
Return from Test Sub-Program on page 18-59
18-48
Instruction Manual
Test Descriptions
Specify Label
Specify a label to be used as the destination of transfer of control commands. If the label is
'SHUT DOWN', the test steps following it are executed, even if the test is aborted (see Exiting
the Program on page 9-37). This can serve as a power-down sequence at the end of the
program. If the label is 'REPEAT', next time the [F2] Repeat key is pressed when the System
is paused between steps, the repeat will occur to this point. This repeat action can be canceled
and returned to normal with a label of 'CLEAR REPEAT.'
If the title begins with TRY, this step specifies the start of a TRY block. The TRY block ends
at the matching ERROR TRY test step. The enclosed block is executed up to the number of
times specified by the matching ERROR TRY as long as the block generates at least one jump
error. You can have up to five nested TRY blocks at a time. Each TRY block needs to have a
unique title (e.g. TRY1, TRY2, TRY3).
Parameter
Description
Test Type
LABEL
Title
Label Name: The labels SHUT DOWN, REPEAT,

CLEAR REPEAT, and TRY (case insensitive) are
special, see above.
Range
Not used
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Not used
High Limit
Not used
Unconditionally transfer control to a specified label.
Parameter
Description
Test Type
JMP
Title
Destination label
Range
Not used
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Not used
High Limit
Not used

The System measures the resistance, and if test passes, a jump to the specified destination
occurs. No results are logged. Excluding test type and title, all fields are the same as for RES
test type.
18-49
Test Descriptions
Parameter
Instruction Manual
Description
Test Type
JMPR
Title
Destination label
Range
Same as RES test type
From (-) Point
To (+) Point
Low Limit
Low test limit in ohms
High Limit
High test limit in ohms

The System measures the capacitance, and if the test passes, a jump to the specified destination
occurs. No results are logged. With the exception of the test type and title, all the fields are
the same as the CAP test type.
Parameter
Description
Test Type
JMPC
Title
Destination label
Range
Same as CAP test type
From (-) Point
To (+) Point
Low Limit
Low test limit in farads
High Limit
High test limit in farads

The System measures the diode junction, and if the test passes, a jump to the specified
destination occurs. No results are logged. With the exception of the test type and title, all the
fields are the same as the DIODE test type.
Parameter
Description
Test Type
JMPD
Title
Destination label
Range
Same as DIODE test type
From (-) Point
Cathode (-) test point for diode
To (+) Point
Anode (+) test point for diode
Low Limit
Low test limit (typically 0.4V)
High Limit
High test limit (typically 0.8V)
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Instruction Manual
Test Descriptions

The System measures the inductance, and if the test passes, a jump to the specified destination
the same as the INDUC test type.
Parameter
Description
Test Type
JMPI
Title
Destination label
Range
Same as INDUC test type
From (-) Point
To (+) Point
Low Limit
Low test limit in henrys
High Limit
High test limit in henrys

The System measures the DC voltage, and if the test passes, a jump to the specified destination
the same as the VOLT test type.
Parameter
Description
Test Type
JMPV
Title
Destination label
Range
Same as VOLT test type
From (-) Point
Most negative polarity test point for measurement
To (+) Point
Most positive test point for measurement
Low Limit
High Limit

The System measures the current or voltage output of the PWR-1 module, then jumps to the
specified label if the test passes. No results are logged. With the exception of the test type and
title, all the fields are the same as the PWRMN test type. This test step requires use of the
Model PWR-1 module in your system.
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Test Descriptions
Instruction Manual
Parameters
Description
Test Type
JMPWR
Title
Destination of jump if monitored voltage/current is between

the low and high test limits. Must match the title of a
LABEL test type in the test program.
Range
DC source being monitored, and type of monitor. Sum of:

3 = Monitor PWR-1 power output 1, or
4 = Monitor PWR-1 power output 2, and
16 = Measure Voltage, or
32 = Measure Current
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Low limit for pass (and jump) in volts if range bit 16 is set,
or current in Amps if range bit 32 is set.
High Limit
High limit for pass (and jump) in volts if range bit 16 is set,
or current in Amps if range bit 32 is set.

The System makes the specified DMM measurement, and if the test passes, a jump to the
specified destination occurs. No results are logged. With the exception of the test type and
title, all the fields are the same as the DMM test type. This test step requires use of the Model
TR-6 module in your system.
Parameter
Description
Test Type
JMPDM
Title
Destination label
Range
Same as DMM test type
From (-) Point
To (+) Point
Low Limit
Low test limit in volts/
High Limit
High test limit in volts/

The System makes the specified Counter/Timer measurement, and if the test passes, a jump to
the specified destination occurs. No results are logged. With the exception of the test type and
title, all the fields are the same as the UCT test type. This test step requires use of the Model
TR-6 module in your system.
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Instruction Manual
Parameter
Test Descriptions
Description
Test Type
JMPU
Title
Destination label
Range
Same as UCT test type
From (-) Point
To (+) Point
Low Limit
Low test limit in Hz, Sec, Counts
High Limit
High test limit in Hz, Sec, Counts

The System inputs the digital data, and if the test passes, a jump to the specified destination
the same as the DIGI test type.
Parameter
Description
Test Type
JMPDI
Title
Destination label
Range
Same as DIGI test type
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Input mask: Data read from DIG-1 digital input is

ignored for any bit set as one in this field (e.g., if input
mask is 5, the LSB and 2nd bit from the LSB are
ignored).
High Limit
Expected data

The System inputs digital data from the controller's I/O port, and if the test passes, a jump to
the specified destination occurs. No results are logged. With the exception of the test type and
title, all the fields are the same as the PORTI test type.
Parameter
Description
Test Type
JMPPI
Title
Destination label
Range
Input port address
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Input mask: Data read from port is ignored for any bit
set as one in this field (e.g., if the input mask is 5, the 1bit (LSB) and 4-bit are ignored).
High Limit
Expected data
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Test Descriptions
Instruction Manual

The System checks to see if the operator has pressed a key on the controller's keyboard. If so,
and if the key matches the specified key, the System performs the jump. Otherwise, if no key
or the wrong key is pressed, the System performs the next test step.
Parameter
Description
Test Type
JMPK
Title
Destination label
Range
Decimal ASCII value of key. For example, 65 is A and

48 is 0. F1-F10 are 131-140. If 0 is specified, the
System accepts any key as true. If a lower-case key is
pressed on the keyboard, it is converted to upper case
before making the comparison. If the comparison is
true, the key stroke is removed from the key buffer. If
the comparison is not true, the key remains in the buffer
for use by other JMPK test steps. The key buffer can
be cleared by entering a JMPK range of 255.
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Not used
High Limit
Not used
Set Error Counters, Control Error-Based TRY Blocks

This test type allows you to:
Set the jump error counter that is used with JMPE test type. This can be used to reset the
value to 0 or to set a defined higher value for subsequent JMPE decisions. The title cannot
be any of the special cases listed in the title description of the test parameters.
Clear the system error count. This is displayed on the Test Screen and in the test results
report.
Clear the jump error count, clear the system error count, and set all steps to skipped (using
the CLEAR ALL title).
Specify the end and number of attempts in a TRY block.
This test type can be used when testing for errors in repetitive tests using the same test
program or to reset the counter between PCBs on multi-PCB panels.
Note that unlike the error count displayed in the upper section of the test display, the jump
error counter counts all failures that occur, even if the test step is subsequently repeated and
passes. If a test title of RESET is used, the jump error counter is set to the value of the system
error counter. This can be helpful if you have been resetting the counter, then need to find out
how many total errors have occurred since the test program began executing. If a test title of
SET is used, the system error counter is set to the value of the jump error counter. If a test title
of CLEAR ALL is used, then both the system error count and jump error count are set to zero
and all test results in the test program are set to skipped. This is useful at the start of main
program loops with a different UUT tested for each loop execution.
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Test Descriptions
If the title begins with TRY then this step specifies the end of a TRY block. This TRY block
is repeated up to the number of times specified in the range as long as one or more jump errors
have occurred since the matching "LABEL TRY" step was executed.
Parameter
Description
Test Type
ERROR
Title
Normally not used, but if the title is RESET, the JMPE

error count is set to the value of the system error count.
If the title is SET, the system error count is set to the
value of the jump error count (see JMPE). If the title is
CLEAR ALL both the system error count and the jump
error count are set to zero. If the title begins with TRY
then this step specifies the end of a TRY block.
Range
The error count used for JMPE or the maximum number

of TRY block attempts.
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Not used
High Limit
Not used

If the total number of errors encountered up until the time of execution exceeds the specified
number, the System performs the jump. Otherwise, the System performs the next test step.
Also, see the ERROR and MEMI test types for manipulation of the error count.
Parameter
Description
Test Type
JMPE
Title
Destination label
Range
Number of errors. If the total number of errors

encountered during execution of the test program
exceed the specified number, a jump occurs.
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Not used
High Limit
Not used
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Test Descriptions
Instruction Manual

The System measures the zener diode junction and if the test passes, a jump to the specified
destination occurs. No results are logged. With the exception of the test type and title, all the
fields are the same as the ZENER test type.
Parameter
Description
Test Type
JMPZ
Title
Destination label
Range
Same as ZENER test type
From (-) Point
To (+) Point
Most positive polarity test point for measurement
Low Limit
High Limit

The System performs a self-test (see STST test type on page 18-87), and if the test passes, a
jump to the specified destination occurs. No results are logged.
Parameter
Description
Test Type
JSTST
Title
Destination label
Range
Same as STST test type
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Not used
High Limit
Same as STST test type
Jump Based on Fixture Identification

The System performs a fixture ID test (see FIXID test type on page 18-85 ), and if the test
passes, a jump to the specified destination occurs. No results are logged.
Selecting F6 (Step Analysis) from the JFXID test type in the test program editor allows you to
easily and interactively determine the wiring patterns for the fixture ID.
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Instruction Manual
Test Descriptions
Parameter
Description
Test Type
JFXID
Title
Pass destination label
Range

0 - Normal
16 - Set pass if expected fixture ID is not equal to measured fixture ID
32 - Copy measured fixture ID into integer memory (MEMI)
From (-) Point
The first test point is used as the reference point against which
connections to the test point interval are measured. This interval begins
at the test point number immediately following the From (-) Point.
To (+) Point
The last test point in the test point interval.
Low Limit
Not used
High Limit
Expected Fixture ID
Call a Subroutine
Control transfers to another test step, then resumes to the next test step when a RETurn is
executed. CALLs can be nested up to 16 deep.
Parameter
Description
Test Type
CALL
Title
Destination Label
Range
Not used
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Not used
High Limit
Not used
Return from Subroutine

Control transfers to the test step immediately following the last CALL test type that was
executed.
Parameter
Description
Test Type
RET
Title
Not used
Range
Not used
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Not used
High Limit
Not used
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Test Descriptions
Instruction Manual

Causes the System to load a specified test program into memory and begin execution at the
first test step.
When a RUN test step is executed, the test program presently in memory is overwritten. Also,
any results information from the present test program is lost. If you want to save any test
results from the present test program execution before doing the RUN, you may use the
RPRTS test type.
The memory locations are not reset during the RUN execution and consequently can be used to
transfer information from one test program to the next.
Parameter
Description
Test Type
RUN
Title
Name of test program to load and run. If the title is @M, use
the contents of the memory string as the test program name.
Range
Not used
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Not used
High Limit
Not used

Causes the System to load a specified test program into memory and begin execution at the
first test step. When a RUNT test step is executed, the test program file presently in memory is
overwritten with the RUNT test program. The present test program and its accumulated
results information is saved. When a RETT test step in the RUNT test program is encountered,
the results from the RUNT test program are saved, and the original test program and its results
are restored. The pass/fail status and location of any PCB panels from the main test program
are available from the RUNT test program.
The memory locations are not reset during the RUNT execution and consequently can be used
to transfer information from one test program to the next. Up to 10,000 lines of additional
results and up to 16 test programs can connected together with use of RUNT commands from a
single test program. Nesting of RunT calls is not allowed.
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Test Descriptions
Parameter
Description
Test Type
RUNT
Title
Name Of Sub-Program To Execute. If the title is @M, use

the contents of the memory string as the test program name.
Range
Extent of Result Reporting For Called Program

0 = No individual test step results saved from called test
program, only its pass/fail status is returned
1 = Return only Pass (Fail Only if Called Program
Non-Existent)
2 = All results of called test program saved.
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Not used
High Limit
Not used
Return from Test Sub-Program

Control transfers to the test step immediately following the last RunT test type that was
executed.
Parameter
Description
Test Type
RETT
Title
Not used
Range
Not used
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Not used
High Limit
Not used
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Test Descriptions
Message Test Types
Instruction Manual
Message Test Types

Overview
The following test types allow you to display messages to the operator during test time.
Messages are shown in the message area of the test screen.
A short display message (up to twelve characters) can be displayed directly by the DISPL test
type. The message displayed is contained in the title field of the test step.
Longer messages are displayed with the DISP test type which references displays by a message
number. These displays are defined by selecting 'Step Analysis' after selecting the DISP test
type in the Edit screen. Up to 36 messages can be defined in a test program with each used
more than once if desired. When a message is defined, it is displayed beginning at the
specified column and row of the message area of the display. Allowable rows are 1 through 8
and allowable columns are 1 through 78.
Messages can contain a special code {MEAS}. When the System encounters the {MEAS}, it
inserts the measured value for the closest step above this step that generated a result. This
feature can be used for displaying a measured value as the operator makes an adjustment on
the UUT.
Display a Short Message to the Operator below
Display a Message to the Operator on page 18-61
Erase an Operator Message on page 18-61
Display a Picture Image on page 18-61
Wait for a Key to Be Pressed on page 18-63
PCB Number Being Tested on page 18-63
Enhanced Display Attributes using SCRN Test Type on page 18-64
SCRN Test Type Table on page 18-65

Display a message contained in the test step's test title to the operator.
Parameter
Description
Test Type
DISPL
Title
Text of message to display
Range
Not used
From (-) Point
Beginning column to display the message on. If this

is greater than 78, the message is not displayed.
To (+) Point
Line to display the message on. If this is greater than

8, the message is not displayed.
Low Limit
Not used
High Limit
Not used
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Instruction Manual
Test Descriptions
Message Test Types

Display a specified message number to the operator. See Display Messages on page 9-33 and
Display Attributes on page 18-64 for additional information.
Parameter
Description
Test Type
DISP
Title
Not used
Range
Message number to present
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Not used
High Limit
Not used

Erase the message area of the display from the beginning location of the specified message to
the end of the line.
Parameter
Description
Test Type
DISPE
Title
Not used
Range
Message number to erase. If zero is entered,

the System erases the entire display area.
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Not used
High Limit
Not used
Display Picture Image

The Picture test step is used to display an image to the operator. The range setting determines
the image and type of action performed. Several types of images are supported, for example,
the board image (photo of the assembly), board outline, schematic, or probe map.
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Test Descriptions
Message Test Types
Parameter
Description
Test Type
PICT
Title
See Range description for use
Range
1 = Display assembly view specified by the

image type and page number. The image type
is specified in the Low Limit and the page
number (begin with one) is specified in the High
Limit. Potential image types include:
board/PCB image (type=0), board outline (1),
schematic (2), probe map (3), setup screen (4),
external image (5), or user-defined (6). If the
test program uses sub-programs containing
different images of the same type then the Title
needs to specify the test program name. If the
Title is blank then the image type and page
number of the current test file are referenced.
2 = Zoom. Percent change is in the Low Limit.
3 = Scroll. Percent movement left/right and
up/down are in the Low and High Limits,
respectively.
4 = Scroll to component. Component is named
in the Title. Current PCB number also used if
panelized.
5 = Enable/disable highlighting (used e.g. for
adjustment loops) Low Limit = 0 to disable or =
1 to enable.
6 = Clear all highlights (e.g. during looping
programs and by ERROR CLEAR ALL).
7 = End of test or real time display of highlights.
Set Low Limit =0 to highlight only at end of the
test. Set Low Limit =1 to highlight during
testing.
8 = Display Board Viewer "always" or "mutually
exclusive" with the Test Screen. Set Low Limit
= 0 for mutually exclusive, or = 1 for
concurrently.
9 = Set the highlight strategy. If the Low Limit
bit 0 is 1 highlight Failed components. If the
Low Limit bit 1 is 1, highlight Passed
components. If the Low Limit bit 2 is 1,
highlight Adjustment components.
10= Mark the component specified in the Title
as Failed, Passed, Adjustment, or Default. Set
the Low Limit = 0 for default appearance, = 1 to
highlight as Failed, = 2 to highlight as Passed,
or = 4 to highlight as Adjustment.
11= Terminate Board Viewer
12= Release present image from memory
13= Display image found in a file specified in
the Title. The supported image file formats are
BMP, JPEG, PNG, PCX, TIFF, and WMF.
14= Display previous image
15= If the previous test Failed and bit 0 of the
Low Limit is 1, mark the component specified in
the Test Title to Failed. If the previous test
Passed and bit 1 of the Low Limit is 1, mark the
component specified in the Test Title to
Passed.
From (-) Point
Not used
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Instruction Manual
Instruction Manual
To (+) Point
Not used
Low Limit
See Range description
High Limit
See Range description
Test Descriptions
Message Test Types
Wait for a Key to Be Pressed

The System waits until the specified key is pressed, then continues to the next test step.
Parameter
Description
Test Type
WAITK
Title
Not used
Range
Decimal ASCII value of key. For example, 65 is A and 48 is 0. The F1-F10 key values
are 131-140. If 0 is specified, the System waits for any alpha-numeric or function key to
be pressed (Windows blocks some keys from the software). If a lower-case key is
pressed on the keyboard, it is converted to upper case before making the comparison.
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Not used
High Limit
Not used

Used with multi-PCB panels to specify to the operator which PCB is being tested. Test results
also contain the PCB number to show which PCB results are being listed. See the section of
this manual describing Multi-PCB Panels for complete detail.
Parameter
Description
Test Type
PCB
Title
Typically not used, but if it is specified as SKIP FAIL, the System will advance to the next
PCB statement in the test program if there have been any failures for this PCB during the
test. SKIP FAIL can be used, for example, to skip over functional tests of a PCB if the
MDA tests have failed.
Range
Which PCB is being tested. Valid values are 0-99. Normally PCB 1 is the first PCB,
followed by the others in sequential order. The value of 0 can be used for common test
steps used by all PCBs so that these test steps will be executed, even if the PCB
previously assigned has been skipped by the operator.
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Not used
High Limit
Not used
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Test Descriptions
Message Test Types
Instruction Manual
Enhanced Display Attributes using SCRN Test Type

The SCRN test step on page 18-65 allows manipulation of display attributes (i.e. text color
and background color), in the user display area (area controlled e.g. by DISP, DISPE, and
DISPL test types). It also writes and reads user display area screen to and from files. There are
six different operations that can be applied simultaneously with a single test step:
Get Display Attribute: Copy the display attribute value for a specified row/column
location (From Point / Low Limit, respectively) into the integer memory (see MEMI on
page 18-71).
Set Display Attribute: Set the display attribute of the specified area according to the
specified display attribute value.
Save Screen: Save the message and display attribute of the specified area to an ASCII file
whose name is specified in the test step Title. Note: This file can later be modified
separately.
Load Screen: Load the message and display attribute of the specified area from an ASCII
file whose name is specified in the test step Title.
Refresh User Display Area: Redraw the user display area.
Refresh Measurement Display Area: Redraw the measurement display area. This is the
area above and below the user display area.
The Refresh Measurement Display and Refresh User Display Area will be useful when
messages other than display messages have been printed on the screen and it is necessary to
restore the previous user messages.
The coordinates of a specified area are defined by the From/To Points and High/Low Limits.
The corresponding values of the operations are listed in the following SCRN Range table,
along with the list of display attribute values. After values for each display attribute and
operation are determined, those values are added to get the final range value. Examples on
how to specify the range are given at the end of the following section and in the Screen and
Display Attribute Manipulation on page 15-4 test program example.
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Instruction Manual
Test Descriptions
Message Test Types
SCRN Test Type Table

Parameter
Description
Test Type
SCRN
Title
filename, used when a save or load screen operation is specified
Range
color attribute and operation set up, see SCRN Test Range Table
From (-) Point
starting row
To (+) Point
ending row
Low Limit
starting column
High Limit
ending column
SCRN Test Range Table

Toolbar Note
In the edit test program window, after you have entered the SCRN test step,
use the F6 'Step Analysis' key to open a dialog box to setup all the attributes
of this command. Using the mouse, you can move and size the area in the
bottom section of this window.
18-65
Test Descriptions
Message Test Types
Parameter
Text Color
Text Background
Instruction Manual
Value
Description
Yellow (default)
Blue
Green
Cyan
Red
Purple
Brown
White
Gray
Light Blue
10
Light Green
11
Light Cyan
12
Light Red
13
Magenta
14
Black
15
Light White
Blue (default)
16
Black
32
Green
48
Cyan
64
Red
80
Magenta
96
Brown
112
White
Operation
256
Get Display Attribute
(can be masked
512
Set Display Attribute
together)
1024
Refresh Measurement Display Area
2048
Refresh User Display Area
4096
Save Screen
8192
Load Screen
(If load file is invalid, there will be no effect.)
Note
The operations are executed in the above order, from top to bottom
sequentially (if specified). This SCRN test step is related to all test steps
that show messages on the user display area e.g.: DISP, DISPL, DISPE,
MEMS, MEMI, MEMR (range = 5).
Examples:
Set Display Attribute with cyan text and black background.

Range = 512 (set attribute) + 3 (cyan text) + 16 (black background)
= 531
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Instruction Manual
Test Descriptions
User-Defined Tests
Refresh the Measurement and User Display Area

Range = 1024 (refresh measurement display) + 2048 (refresh user display area)
= 3072
See also SCRN example program on page 15-4.
User-Defined Tests
Overview
Generate Test Result below
Execute User-Written Routine below

Place a pass or fail into the test results. This can be used with conditional jumps to generate
and record a passed or failed result.
If the range is 2, the System searches upward through the test program and finds the last
measured value from an analog test type (or its equivalent JMP command). This becomes the
measured value for the step and it is compared against the high and Low Limits to generate a
pass or fail result. This can be used after an adjustment loop to generate a pass or fail result
based on the JMPx measurement the last time through the loop.
Parameter
Description
Test Type
EVAL
Title
Descriptive title (e.g., Gain)
Range
0 for Pass
1 for Fail
2 for compare against High/Low Limits
4 for same as 2, but use present memory-real value as
measured value
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Not used unless the range is 2 or 4
High Limit
Not used unless the range is 2 or 4

Execute routine written by user. The called routine can be written in any language that
generates a .EXE or .COM file. During test program execution, the specified routine is loaded
into memory with the MDA software, then executed. Once it has completed operation, control
is resumed with the MDA software. If the DOS error level is non-zero upon return, the test
fails. If it is zero, the test passes.
If the System reports a DOS error 8, the EXECed program is too large to fit into the available
RAM memory. Exec first looks in the current directory for the .EXE or .COM file. If it isn't
found here it searches through the directory locations in the DOS PATH environment variable.
Only if the file is not in any of these locations does the System report a DOS error 2.
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Instruction Manual
The test title describes the program name to EXEC. It can also specify command line
parameters to pass to the program. The up arrow (^) specifies to send whatever in the title
follows as a parameter. You can also include in the title: @i to pass the value of the memory
integer, @s to pass the value of the memory string, @b to pass the value of the batch string,
@c to pass the value of the compare string, @d# to pass the value of the #th display string, @r
to pass the value of the memory real, @n to pass the step number being executed at the time of
the call, and @u# to pass the value of the #th UUT ID string.
If the first test title field is a string variable parameter, instead of a file name, then EXEC uses
the first field of that string as the file name. A file name may include a path. Any fields that
follow the file name obtained from a string variable are prepended to any other title field
parameters and sent as command line parameters to the executable file.
Parameter
Description
Test Type
EXEC
Title
Name of routine to execute. If the name has an up-arrow (^), the data
following the up-arrow is passed to the exec'ed routine as a parameter string.
If no extension (e.g., .EXE or .COM) is specified, the System adds on, as a
default, .EXE. See text above for more detail about passable parameters.
Range
Not used
From (-) Point
Not used
To (+) Point
Valid entries are 0,1,8 plus optionally 2 or 4:

0 = normal execution
1 = do not generate or report results
2 = load DOS exit code from executed program into the integer
memory variable (see MEMI)
4 = load DOS error code from executed program the integer
memory variable (see MEMI)
8 = run executable routine and continue without waiting for it to terminate
Low Limit
Not used
High Limit
Not used
Note:
Most user written executables run via EXEC are console mode Windows programs. Windows
uses PIF files to control how such programs are executed. This includes whether a DOS
window is displayed during execution, the size of any such window and whether any window
will automatically close on exit.
Sequential EXECution of an executable causes Visual MDA to wait for closure of any window
displayed for program execution. You can set up a PIF file for a specific executable by setting
its program tab properties under Win 9X or by creating a PIF file using the PIF editor under
Win 3.1. Under Win 9X the "close on exit" check box and "Run" window size choice are the
most important properties. Under Win 3.1 the analogous settings are the "Close Window on
exit" check box and "Display usage".
Under Windows 9X you also can set the default behavior for any console mode executable
which lacks its own PIF file by setting up a _default.pif file in the Windows directory.
The following describes how to create a default program information file (PIF) for MS-DOSbased programs. A default PIF file for MS-DOS-based programs is used for those MS-DOSbased programs that are not shipped with their own PIF files, and are started by clicking Run
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Instruction Manual
Test Descriptions
on the Start menu. To create a default PIF file for MS-DOS-based programs, follow these
steps:
1. Open the Windows folder.
2. On the File menu, point to New, then click Shortcut.
3. In the Command Line box, type "command.com" (without quotation marks), then click
Next.
4. In the "Select a name for the shortcut" box, type "_DEFAULT" (without quotation marks),
then click Finish.

5. Use the right mouse button to click the new _DEFAULT.PIF file, then click Properties on
the menu that appears.

6. Set the properties you want for the _DEFAULT.PIF file, then click OK.
7. Restart Windows 9X.

Overview
The memory manipulation test types (MEMI on page 18-71, MEMR on page 18-74, MEMS
on page 18-76) allow use of the System's memory to assign, keep track of, manipulate, and use
variables within a test program.
There are three types of memory variables: integer, real (floating point), and string:
1. Integers are whole numbers ranging from plus to minus 32,767.
2. Real variables can include a fractional part and can range from plus to minus 10E37.
3. String variables can include any normal ASCII characters. There are several string
variables:
Main Memory String
Compare String
UUT Serial Number String
Assembly Name String
Batch ID String
Test Title String
Batch Report Special String
Test Report Special String
User Name String
Part ID String
System ID String (read only)
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Test Descriptions
Instruction Manual
The Main Memory String can be up to 128 characters long. The Compare String variable
(referred to as the "compare string" in the MEMS test type) can be used to make pass/fail
comparisons against the memory string variable. The UUT Serial Number String is an array
of 321 strings (accessible using MEMS 33). There is one Test Title String for each test step.
The User Name String and the Part ID String are not used by the System software (128
character swap location).
The "Batch ID String" is only cleared between batches. As such, you can use it to solicit input
about the batch as a whole (e.g., batch number, UUT configuration), then not ask the operator
again until a new batch has started. You can do this by checking to see if the batch memory
string is empty, and if so, asking the operator to enter it.
These steps allow entry or assignment of the memory contents, pass/fail test generation based
on the value of the memory contents, fundamental math and manipulation of the memory
contents, transfer of control based on the contents of memory, or display of the variable.
These test steps can be used to form a counter, to control program execution based on operator
entry, or as an alternate way to generate test results based on operator entry.
Memory Manipulation (Integer) on page 18-71
Memory Manipulation (Real) on page 18-74
Memory Manipulation (String) on page 18-76
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Instruction Manual
Test Descriptions

Allow manipulation of the number in the integer memory variable.
Parameter
Description
Test Type
MEMI
Title
Description of the test step, or label of the jump destination for jumps based on the
memory number (used when range is 20 - 23).
Range
Type of operation to perform on the integer memory:

1 = Copy the value of the Low Limit of this test step into the integer memory.
2 = Perform a pass/fail test based on the value of the integer memory as compared
to the test step High and Low Limits.
3 = Copy the keyboard entry into the integer memory. The entry cursor is positioned
in the column/row of the display as indicated by the Low/High Limits respectively.
4 = Same as 3, but accept one character only with no [Enter] key required.
5 = Display the value of the integer memory at the column/row of the display as
indicated by the Low/High Limits respectively.
6 = Write the value of the integer memory to a file named in the test title.
7 = Set the value of the integer memory from a file named in the test title.
8 = Perform a logical shift-left operation on the memory location by the number of bits
specified by the value in the Low Limit.
9 = Perform a logical shift-right operation on the integer memory by the number of
bits specified by the value in the Low Limit.
10 = Add the value in Low Limit to the integer memory.
11 = Multiply the integer memory by the value in the Low Limit.
12 = Perform a logical 'and' operation on the integer memory with the value in the Low
Limit.
13 = Perform a logical 'or' operation on the integer memory with the value in the Low
Limit.
14 = Perform a logical 'not' operation on the integer memory.
15 = Copy the contents of the integer memory into the sequence counter used by the
RPRTS test type.
16 = Copy the contents of the integer memory into the High Limit of the next test step.
This can be used, for example, to set the output for a DIGO command.
17 = Copy the contents of the memory integer location into the memory real location.
18 = Read the specified test program data into the integer memory. The Low Limit is
the step number of the test program. If the Low Limit is between 1001 and 2000
then the step number is the amount above 1000 forwards from the current step. If
the Low Limit is above 2000 then the step number is the amount above 2000
backwards from the current step. The High Limit indicates the data of that step
number to read:
1 = From point, 2 = To point, 3 = Test Range, 4 = Low Limit, 5 = High Limit,
6 = Measured, 7 = Nominal.
19 = Write the value in integer memory into the specified test program location. The
Low Limit is the step number of the test program to write to. If the Low Limit is
between 1001 and 2000 then the step number is the amount above 1000 forwards
from the current step. If the Low Limit is above 2000 then the step number is the
amount above 2000 backwards from the current step. The High Limit indicates the
data of that step number to write:
1 =From point, 2 =To point, 3 =Test Range, 4 = Low- Lim, 5 = High Limit,
20 = Jump to the label in the Test Title if the memory value is greater than or equal to
the Low Limit and less than or equal to the High Limit.
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21 = Jump to the label in the Test Title if the value of the integer memory is less than
or equal to the High Limit.
22 = Jump to the label in the Test Title if the value of the integer memory is greater
than or equal to the Low Limit.
23 = Jump to the label in the Test Title if the value of the integer memory is less than
the Low Limit or greater than the High Limit.
24 = Divide the integer memory by the integer part of the Low Limit.
25 = Set the memory value to the step number of the last failed step or to zero if no
failures.
26 = Set the integer memory to the current jump error count.
27 = Set the integer memory to the current system error count.
28 = Set the integer memory to the length of the memory string variable.
29 = Add the ASCII value of the character in the Low Limit location of the string
memory to the integer memory and subtract the ASCII value of the character in
the High Limit from the integer memory.
30 = Swap the integer memory and the total number of assemblies tested in this batch.
31 = Swap the integer memory and the total number of assemblies that have failed in
this batch.
32 = Load integer memory with the eight bit keypad mask value.
33 = Load the keypad mask value with the lower eight bits in integer memory,
(see Operator Keypad on page 2-11 for keypad mask bit information).
34 = Append the value of the integer memory as a line at the end of the file named in
the Test Title.
35 = Open the file named in the Test Title, read the data on the line that is specified by
the Low Limit, and set the integer memory to the value on that line. If there is a
read error or if the line doesn't contain a valid integer representation, then the
integer memory is unchanged and a fail beep is emitted.
36 = Set keypad LEDs according to the two least significant integer memory bits. A
value of 0 clears the LEDs, 1 turns on the TESTING LED, 2 turns on the PASS
LED, 3 turns on the FAIL LED.
37 = Set the integer memory to the starting IO address configured for the specified
module. The module type is specified by the Low Limit:
0 = System Module, 1 = Multiplexer Module, 2 = TR-6, 3 = TR-6-1, 4 = DIG-1,
5 = RM-1, 6 = GPIB, 7 = PWR-1, 8 = TR-8-SMT, 9 = TR-8-SMT-CAP
The High Limit specifies the board index, starting at 1, where multiple boards can
be configured, such as MPX Modules, TR-6-1, TR-8-SMT, or TR-8-SMT-CAP.
38 = Controls the Measurement 'Warnings' and 'Errors' messages setup based on the
high limit bits 0 and 1, respectively, using the low limit. If the low limit is 1, then the
current setup is saved before the selected setup is changed. If the low limit is 0,
then the current setup is not saved before the selected setup is changed. If the
low limit is 2, the previous saved setup is restored. For example, if the low limit is 0
and high limit is 2 then the 'Warnings' messages are disabled and the 'Errors'
messages are enabled (the setup prior to this step is not stored).
39 = Set the least significant bit of the integer memory based on the position of the
Analyst mc fixture lever handle. A bit value of 0 indicates the handle is in the fullyclosed position (lid is down) and a bit value of 1 indicates the handle is not fully
closed.
40 = Sets the integer memory to the current number of errors for the currently tested
PCB if the Low Limit is less than or equal to -1. Otherwise, it is set to the number
of errors for the PCB number (0 to 320) specified in the Low Limit.
41 = Sets the number of errors of the currently tested PCB to the High Limit value if the
Low Limit is less than or equal to -1. Otherwise, the number of errors for the PCB
number (0 to 320) specified in the Low Limit is set to the High Limit value.
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From (-) Point
Not used
To (+) Point
Not used
Low Limit
See range assignment for usage
High Limit
Test Descriptions
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Allow manipulation of the real memory (floating point) variable.
Parameter
Description
Test Type
MEMR
Title
Description of the test step, or label of the jump destination for jumps based on the
memory number (used when range is 20-23).
Range
Type of operation to perform on the real memory:

1 = Copy the value of the Low Limit of this test step into the real memory.
2 = Perform a pass/fail test based on value of the real memory as compared to the
test step High and Low Limits.
3 = Copy the keyboard entry into the real memory. The entry cursor is positioned in
the column/row of the display as indicated by the Low/High Limits respectively.
5 = Display the real memory value at the column/row of the display as indicated by the
Low/High Limits respectively.
6 = Write the value of the real memory to a file named in the Test Title.
7 = Set the value of the real memory from a file named in the Test Title.
10 = Add the value in the Low Limit to the real memory.
11 = Multiply the real memory by the value in Low Limit.
16 = Copy the contents of the measured value from the last test step into real memory.
This can be used, for example, to obtain a measured value, then make calculations
based on the outcome.
17 = Copy the contents of the real memory into the integer memory. If the value is
greater than 32,767, transfer the number -1 as an error indication.
18 = Read the specified test program data into the real memory. The Low Limit is the
step number of the test program. If the Low Limit is between 1001 and 2000 then
the step number is the amount above 1000 forwards from the current step. If the
Low Limit is above 2000 then the step number is the amount above 2000
backwards from the current step. The High Limit indicates the data of that step
number to read:
1 = From point, 2 = To point, 3 = Test Range, 4 = Low Limit, 5 = High Limit,
19 = Write the value in real memory into the specified test program location. The Low
Limit is the step number of the test program to write to. If the Low Limit is between
1001 and 2000 then the step number is the amount above 1000 forwards from the
current step. If the Low Limit is above 2000 then the step number is the amount
above 2000 backwards from the current step. The High Limit indicates the data of
that step number to write:
1 =From point, 2 =To point, 3 =Test Range, 4 = Low- Lim, 5 = High Limit,
20 = Jump to the label in the Test Title if the value of real memory is greater than or
equal to the Low Limit and less than or equal to the High Limit.
21 = Jump to the label in the Test Title if the value of real memory is less than or equal
to the High Limit.
22 = Jump to the label in the Test Title if the value of real memory is greater than or
equal to the Low Limit.
23 = Jump to the label in the Test Title if the value of real memory is less than the Low
Limit or greater than the High Limit.
24 = Divide the real memory by the Low Limit.
26 = Copy the current time (in Sec past midnight) into the time memory.
27 = Copy the current time (in Sec past midnight) into the real memory.
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28 = Wait until the number of seconds specified in the Low Limit has past since the time
memory has been saved (see range 26), then continue to the next test step.
29 = Compute the amount of time (in seconds) since the time memory has been saved
(see range 26) and place the result in the real memory.
30 = Swap the contents of the real memory and the time memory.
31 = Set the real memory to the measured value of the closest lower-numbered,
unskipped, test step with a measured value.
32 = Convert the real memory into a string having a maximum width specified by the
Low Limit value and having the number of digits to the right of the decimal point
specified by the High Limit. The High Limit must be less than or equal to the Low
Limit amount.
33 = Append the value of the real memory as a line at the end of the file named in the
Test Title.
35 = Open the file named in the Test Title, read the data on the line that is specified by
the Low Limit, and set the real memory to the value on that line.
From (-) Point
Not used
To (+) Point
Not used
Low Limit
High Limit
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Instruction Manual

Allow manipulation of the characters in the memory string and other strings.
Parameter
Description
Test Type
MEMS
Title
Description of the test step, or as described below.
Range
Type of operation to perform on the memory string variable:

1 = Copy the character string in the Title of this test step to the memory string.
2 = Perform a pass/fail test based on the memory string being equal to the compare
string (Pass) or not equal (Fail).
3 = Copy the keyboard entry into the memory string. The entry cursor is positioned in
the column/row of the display as indicated by the Low/High Limits respectively.
5 = Display the memory string at the column/row of the display as indicated by the
Low/High Limits respectively.
6 = Write the memory string to a file named in the Test Title.
7 = Set the memory string from a file named in the Test Title.
9 = Add the string in the Test Title to the beginning of the memory string.
10 = Add the string in the Test Title to the end of the memory string.
11 = Make the memory string upper case.
12 = Convert the memory string to a sub-string starting at the Low Limit character
number and being High Limit characters long.
13 = Transfer the memory string to the UUT Serial Number of the test results.
14 = Copy the Assembly Name into the memory string.
15 = Swap the contents of the memory string and the compare string.
16 = Convert the memory string to an integer variable and put the result into the
integer memory. If there is an error, convert it to -1.
17 = Convert the memory string to a real variable and put the result into the real
memory. If there is an error, convert it to -1.
18 = Swap the contents of the Batch ID string with the contents of the memory string.
19 = Copy the contents of the Batch ID string to the memory string.

20 = Jump to the label in the Test Title if the memory string is the same as the
compare string.
21 = Jump to the label in the Test Title if the memory string is not the same as the
compare string.
22 = Jump to the label in the Test Title if the memory string is less than the compare
string (when compared on an ASCII basis).
24 = Copy the Test Title of the specified test program step into the memory string. The
Low Limit specifies the step number of the test program.
25 = Copy the memory string into the specified test program Test Title. The Low Limit
specifies the step number of the test program. If the Low Limit is between 1001
and 2000 then the step number is the amount above 1000 forwards from the
current step. If the Low Limit is above 2000 then the step number is the amount
above 2000 backwards from the current step.
26 = Swap the memory string with the User Name string. It can be used as a spare
memory location.
27 = Swap the memory string with Part ID string. It can be used as a spare memory
location.
28 = Append to the end of the memory string the character whose ASCII value equals
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Test Descriptions
the integer memory value plus that in the test step High Limit.
29 = Copy the UUT Serial Number string into the memory string.
30 = Copy the memory string into the Batch Report Special string.
31 = Copy the memory string into the Test Report Special string.
32 = Write the contents of the memory string to the end of the file named in the Test
Title.
33 = Swap the memory string with the UUT Serial Number string identified by the
Low Limit index. A Low Limit value of 0 accesses the UUT Serial Number string
for one UUT Serial Number string per panel. For multiple UUT Serial Numbers
per panel, the Low Limit value equal to the PCB number accesses the UUT Serial
Number string for that PCB.
.
34 = Add the Test Title of the test step identified in the Low Limit to the beginning of the
memory string. If the Low Limit is between 1001 and 2000 then the step is the
amount above 1000 forwards from the current step. If the Low Limit is above 2000
then the step number is the amount above 2000 backwards from the current step.
35 = Open the file name specified in the Test Title, read the data from the line that is
specified by the Low Limit, and set the memory string to the data on that line.
36 = Append the Test Title of the test step identified in the Low Limit to the end of the
memory string. If the Low Limit is between 1001 and 2000 then the step is the
amount above 1000 forwards from the current step. If the Low Limit is above 2000
then the step number is the amount above 2000 backwards from the current step.
37 = Get a message line from User Display into memory string (row = Low Limit).
38 = Get a line of Display Attributes from User Display into memory string (row = Low
Limit).
39 = Write a line of Display Attributes from memory string to User Display Area (row =
Low Limit).
40 = Write the memory string into the specified test program Test Title in the same
manner as MEMS 25. In addition, any Test Title changes for JMP or LABEL
operations are recognized by the system software.
41 = Load the memory string with the current date in YYYYMMDD format.
42 = Copy the System ID string into the memory string.
43 = Set the memory string to the test system software type:
"Analyst mc", "TR-8", or "Analyst ft" (not including the quotes)
44 = Set the memory string to the name of the currently executing test program.
45 = Set the memory string to the name of the calling program if the currently
executing test program was called with a RUNT or to an empty string otherwise.
46 = Deletes the file specified in the memory string. The memory string may include
a path preceding the file name.
From (-) Point
Not used
To (+) Point
Not used
Low Limit
High Limit
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Instruction Manual

General Purpose Interface Bus (GPIB) I/O
Overview
Allows control of external instrumentation connected via the IEEE-488 interface. Use of this
capability requires installation of the optional Model-GPIB interface that is available from
CheckSum. This interface installs into the extra slot in your System.
The Model-GPIB can be used for most common IEEE-488 operations by use of the GPIB test
step. However, if you have special needs, such as processing waveform or binary data, you
can write a program in a common language, such as C or PASCAL, then call it with the EXEC
test type. Information can be passed back and forth with files written to hard-disk or a ramdisk. In addition, data can be passed to the EXECed program as a command line parameter.
Since the GPIB provided by CheckSum is provided with a toolkit, and since a device driver is
not necessary, it is not extremely difficult to do your own specialized routines.
In general, when using the GPIB test type, you will specify the address of the instrument on
the bus. This is uniquely set for each instrument on the bus (don't use 21 since that is the
system controller address). For reads and writes, the transferred data can be up to 255
characters long. For detailed information about what occurs during GPIB commands, refer to
the manual that comes with the Model-GPIB. The commands available from the CheckSum
software are almost one-for-one implementations of the commands described therein.
When writing information to the bus, you can choose from sending the information in the test
title (the To (+) Point is 0 in this case), sending the information in a display line (just like the
data used for the DISP test type - the To (+) Point is 1 in this case), sending information from a
disk file (the To (+) Point is 37 in this case and the test title contains the name of the file to
open and read), or you can directly send the contents of a memory variable (the To (+) Point is
38, 39, and 40 for the memory string (MEMS), real memory (MEMR), and integer memory
(MEMI) respectively).
When reading information from the bus, you can specify that the returned information goes
into a memory location (the To (+) Point is 0, 1, and 2 for the real memory (MEMR), memory
string (MEMS), and integer memory (MEMI) respectively), or to send the data to a disk file
(the To (+) Point is 3 in this case and the test title contains the name of the file to create and
write to).
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Test Descriptions
GPIB Test Type parameters:

Input from GPIB Device (i.e. enter)
Parameter
Description
Range
From (-) Point
device address
To (+) Point
0 = number in real memory (see MEMR)

1 = string in memory string (see MEMS)
2 = integer in integer memory (see MEMI)
3 = write to disk file named in title
Output to GPIB Device (i.e. output)

Parameter
Description
Range
From (-) Point
device address
To (+) Point
0 = data in test title

1-36 = data in DISP area
37 = data from file named in title
38 = data from memory string (see MEMS)
39 = data from real memory (see MEMR)
40 = data from integer memory (see MEMI)
Abort (i.e. abort)

Parameter
Description
Range
Device Clear (i.e. devclr)

Parameter
Description
Range
From (-) Point
>0 = device
0 = full bus
Set Bus Terminators (i.e. eol)

Parameter
Description
Range
From (-) Point
device address
Title
a,b,c,d, where:
a = out term
0 = oel/eoi
1 = eoi
2 = oel
b = eol string
c = in term (like a)
d = input term char
I/F Init (i.e. init)

Parameter
Description
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Test Descriptions
Range
From (-) Point
GPIB address [21]
To (+) Point
total of [0]:
32768 background DMA
16384 block DMA
4096 fast
32 non-system controller
16 IRQ 2
17 IRQ 3
19 IRQ 5
21 IRQ 7
1 DMA 1
2 DMA 2
3 DMA 3
Local Lockout (i.e. llo)

Parameter
Description
Range
From (-) Point
device address
Remote (i.e. remote)

Parameter
Description
Range
From (-) Point
device address
User Command (i.e. send)

Parameter
Description
Range
To (+) Point
0 = data in title
1-36 = data in DISP
37 = data in file named in title
Serial Poll (i.e. spoll)

Parameter
Description
Range
From (-) Point
device address
(puts into integer memory)
Status (i.e. status)

Parameter
Description
Range
10
To (+) Point
8 = error number
9 = byte count
(puts into integer memory)
Timeout (i.e. timeout)
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Test Descriptions
Parameter
Description
Range
11
To (+) Point
>0 = depends on microprocessor

0 = disable
Trigger (i.e. trig)

Parameter
Description
Range
12
From (-) Point
device address

Overview
Allows communication with serial port devices.
The RS232 test type allows flexible input and output of data to the controller's COM ports 1
through 4. Data strings of up to 255 characters can be transferred. When sending data, the
data transmission can have an optional preamble and/or postamble string of up to 32
characters.
As alternatives to use of the RS232 test type, you can write a .EXE or .COM file and call it
with the EXEC test type, or you can use the MEMS test type with a file name designating a
serial port (e.g., COM1). However, these alternatives are generally not as flexible as the
RS232 test type.
When writing information to the port, you can choose between sending the information from
the test title (the To (+) Point is 0 in this case), sending the information from a display line
(just like the data used for the DISP test type - the To (+) Point is between 1 and 36 in this
case), sending information from a disk file (the To (+) Point is 37 in this case and the test title
contains the name of the file to open and read), or you can directly send the contents of a
memory variable (the To (+) Point is 38, 39, and 40 for the memory string (MEMS), real
memory (MEMR), and integer memory (MEMI) respectively).
When reading information from the port, you can specify that the returned information goes
into a memory location (the To (+) Point is 0, 1, and 2 for the real memory, memory string,
and integer memory respectively), or to send the data to a disk file (the To (+) Point is 3 in this
case and the test title contains the name of the file to create and write to).
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RS232 Test Type parameters:

Input from RS232 Device
Parameter
Description
Range
From (-) Point
device address of desired COM port (e.g., 1 for COM1)
To (+) Point
0 = number in the real memory (see MEMR)
(destination of data read)
1 = string in the memory string (see MEMS)

2 = integer in the integer memory (see MEMI)
3 = write to disk file named in title
Output to RS232 Device

Parameter
Description
Range
From (-) Point
To (+) Point
0 = data in test title
(source of data sent)
1-36 = data in Operator DISPLAY area

37 = data from file named in title
38 = data from memory string (see MEMS)
39 = data from the real memory (see MEMR)
40 = data from the integer memory (see MEMI)
Device Clear
Parameter
Description
Range
From (-) Point
>0 = clear status for com port number (e.g.,1 for COM1)
0 = clear status for all com ports
Set Communication Parameters

Parameter
Description
Range
From (-) Point
To (+) Point
Parameter Initialized:
0 = UART communication parameters. The baud rate, data
length, parity, and stop bit length are respectively
defined by comma separated values. The parity is
specified by a single character and the other values by
numeric values. The allowed baud rate is from 50 to
115200. The data length is from 5 to 8. The stop bit
length can be 1 or 2 bits. Parity can be specified as N
for none, E for even, O for odd, M for mark, or S for
space.
1 = optional transmission preamble. The default is no
preamble. A non-null preamble is specified by a
sequence of decimal values for the ASCII characters
in the preamble. Each decimal value consists of the
pound sign (#) followed by a decimal number in the
range from 0 to 127. An empty string sets the preamble
to null.
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Miscellaneous Tests
2 = end of transmission postamble. The default is carriage
return, line feed (#13#10). A non-null postamble is
specified by a sequence of decimal values for the ASCII
characters in the postamble. Each decimal value
consists of the pound sign (#) followed by a decimal
number in the range from 0 to 127. An empty input
string sets the postamble to null.
Status
Parameter
Description
Range
10
From (-) Point
0 = show an error status bit if set for any com port

(puts value into the integer memory (see MEMI)
>0 = read status for this com port number (e.g., 1 for COM1)
Timeout
Parameter
Description
Range
11
From (-) Point
To (+) Point
0 = disable IO timeouts
>0 = number of .1 second increments to wait before timing
out when a transmission should be active, but is not. The
default timeout is 10 seconds.
Miscellaneous Tests
Overview
The topics in this category are as follows:
Turn Fixture Vacuum On and Off on page 18-84
Fixture Control on page 18-84
Fixture Identification on page 18-85
Control Relays on page 18-86
Self-test Module on page 18-87
BreakPoint on page 18-88
Fixture-Check on page 18-89
Print Test Results on page 18-90
Sound the Beeper on page 18-92
Set Test Conditions on page 18-92
Put a Remark in the Test Program on page 18-93
Conditional Test Report Output on page 18-93
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Test Descriptions
Miscellaneous Tests
Instruction Manual

Turns vacuum on and off to the test fixture. Note: This test type has been superseded by the
more general, FIXCT test type (see Fixture Control below).
The fixture can be built with a fixture-down switch, typically consisting of two spring probes
that touch a common target when the fixture is engaged. If this is the case, you can specify
that the System waits for this switch to become true (low resistance) before continuing.
Otherwise, you can specify a wait time before the system continues after applying vacuum.
This test-type controls one of two fixture control bits available from the Analyst mc System
Module. The main control (Fixture 1) is available via an RCA jack on the back panel. The
second control (Fixture 2) is available at the D-Sub-25 back panel connector. Vacuum-on is a
low output and vacuum-off is a high output.
Parameter
Description
Test Type
VACUM
Title
Not used except as an optional comment field.
Range
0 - Remove vacuum from fixture

1 - Apply vacuum to fixture via Fixture 1 control
2 - Apply vacuum to fixture via Fixture 2 control
3 - Apply vacuum to fixture by activating both Fixture 1
and Fixture 2 controls
From (-) Point
First test point connected to fixture-down switch.
To (+) Point
Second test point connected to fixture-down switch.
Low Limit
Time, in mSec, to wait after applying vacuum but before continuing with next
test step.
If a fixture-down switch is used, the delay time to wait after the fixture-down
switch is activated.
High Limit
Maximum resistance (in ohms) before considering the fixture-down switch to

be closed. If zero, do not measure the fixture-down switch.
Fixture Control
Engages and Disengages CheckSum Pneumatic and Vacuum Fixturing Systems.
The FIXCT command allows the test program to control the automated pneumatic or vacuum
fixturing systems. It can interact with the CheckSum DM-1 Discharge System for automatic
detection and discharge of voltages on the unit under test.
Note
When the DM-1 is used, always use range bit 8 for engage and disengage.
For example, set the FixCT range code to 9 to engage fixture 1 and set the
FixCt range code to 8 to disengage the fixture. If the range code is set to 0
to disengage the fixture, the DM-1 will not discharge the UUT placed on
the fixture.
Like the VACUM test type, the FIXCT test type controls the fixture using the two signals
called Fixture 1 and Fixture 2.
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Test Descriptions
Miscellaneous Tests
The FIXCT test type uses Digital I/O Bits 1, 2 and 3 for Fixture 1 and Digital I/O bits 4, 5 and
6 for Fixture 2 when used with a DM-1 Discharge System. You should be careful that this
does not conflict with other custom use of these bits. A custom cable is required when using
Fixture 2 control in conjunction with a DM-1.
Parameter
Description
Test Type
FIXCT
Title
Optional Comment Field
Range

0 - Disengage Fixture 1 and Fixture 2
1-
Engage Fixture 1
2-
Engage Fixture 2
8-
When combined with range 0, this entry controls the DM-1 to isolate the
MDA points and place it in discharge mode.
When combined with range 1, this entry controls the DM-1 Discharge System
to isolate the MDA test points from the unit under test, waits for the voltage to
be low, then connects the MDA test points to the UUT.
16 -
When combined with range 2, this entry controls the DM-1 Discharge System
for Fixture 2, similar to range 8 described above.
4 From (-) Point
When combined with ranges 1 or 2, and 8 or 16 this disables warning

messages regarding the DM-1 switch not being set to AUTO.
First test point connected to the fixture-down switch.
To (+) Point
Second test point connected to the fixture-down switch.
Low Limit
Time, in mSec, to wait after engaging the fixture, the fixture-down switch closing if
appropriate, and before continuing to the next step.
High Limit
Maximum resistance (in ohms) before considering the fixture-down switch to be closed. If
zero, do not measure the fixture-down switch.
This test type checks the identity (ID) of a fixture. With use of this capability, you can be
assured that you have the proper fixture installed on the tester at the beginning of the test. The
Fixture ID is encoded in the test fixture as a pattern of jumper wires on a specified range of test
points.
The first test point (specified in the From test point column) is the reference test point.
Jumpers from this point to the following test points (up to the To test point column) set a
series of 1s (jumper installed) or 0s (no jumper installed) that are put together to form a
fixture ID number. The least significant bit is the first one following the reference test point.
The test point range must be for normal solid-state test points.
The jumpers are measured (using the 200 DCI range), and if the measured number is
different than the nominal value, a message is presented to the operator to install the proper
fixture, after which the operator can continue or end the test. Note: if you are using a TR-72000 press, the FixCt command must come first to engage the fixture interface.
For example, you might specify the range of points from 1 to 7 for your fixture ID. This will
give you a range of up to 63 fixtures. If you connect a jumper wire from points one to two, the
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fixture will have an ID of 1. If you add a wire from points one to four, the Fixture ID will
become five.
Selecting F6 (Step Analysis) from the FIXID test type in the test program editor allows you to
easily and interactively select the wiring patterns for the fixture ID. Also see Jump Based on
Fixture ID (JFXID test step on page 18-56).
Parameter
Description
Test Type
FIXID
Title
Optional Comment Field
Range

0 - Normal
8 - Measure fixture ID, do not set Pass/Fail
16 - Set Pass if the expected fixture ID is not equal to the measured fixture ID
32 - Copy measured fixture ID into integer memory (MEMI)
64 - Display system warning message if this test step fails
From (-) Point
The first test point is used as the reference point against which connections
to the test point interval are measured. This interval begins at the test point
number immediately following the From (-) Point.
To (+) Point
The last test point in the test point interval.
Low Limit
Not used
High Limit
Expected Fixture ID
Control Relays
Control relays on the Model PWR-1, Model TR-6 and TR-6-1 Modules.
Controls the four undedicated form-C relays (Relay 1 - 4) available at the Model TR-6 and
PWR-1 back panels. These can be used to switch external signals, apply power directly (up to
1A) or to control other higher-power relays. Each time a test program is started, these relays
are reset which connects the relay common (Com) terminal to the relay normally-closed (NC)
terminal. Note that all four undedicated relays are programmed (either set or reset as
specified) each time that this command is executed. This command can also enable or disable
the power and ground outputs of the PWR-1 Module.
Each Model TR-6-1 MPX module contains four undedicated relays connected to a back panel
header on the MPX module. These can also be controlled with this test type.
This test type can also be used to override automated control of the Model TR-6 and TR-6-1
test point relays. If a range of 7-10 is specified, the High Limit controls one of the test point
relays on the TR-6 and TR-6-1 by either connecting or disconnecting it with the high or low
relay bus. When this occurs, it also puts the System into a mode that stops these relays from
being disconnected between tests, and as a consequence, allow you to do special switching
(such as bussing together several test points). There is both a high bus and low bus on the
relay channels that can separately be controlled and connected. When in relay override mode,
if you make a measurement to a test point on the relay bus, the relays from the measurement
are also not disconnected, and you must disconnected them explicitly with this command if
connected. The System disconnects all the relays and goes back into normal mode when a
range of 11 is executed, and at the end of the test program execution.
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Note
Use extreme caution when overriding the standard TR-6 relay test point
switching since in this mode you could damage the UUT or test system.
Parameters
Description
Test Type
RELAY
Title
Normally not used
Range
Close relays on specified module:

0 = TR-6 System Module
1 = First TR-6-1 MPX Module
2 = Next TR-6-1 MPX Module
3-6 =Next TR-6-1 MPX Module(s)
7 = Connect a relay test point to the high TR-6 bus
8 = Disconnect a relay test point from the high TR-6 bus
9 = Connect a relay test point to the low TR-6 bus
10 = Disconnect a relay test point from the low TR-6 bus
11 = Disconnect all high/low relays from the TR-6 buses and
go back to normal switching mode
12 = PWR-1 Module
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Not used
High Limit
If the range is 0-6, sum of the following:

1 = Relay 1 closed (relay COM connected to relay NO)
2 = Relay 2 closed
4 = Relay 3 closed
8 = Relay 4 closed
If the range is 7-10, the TR-6 test point number (1601-1616,
1651-1950)
If the range is 12 (PWR-1), sum of the following:
1 = Relay 1 closed (relay COM connected to relay NO)
2 = Relay 2 closed
4 = Relay 3 closed
8 = Relay 4 closed
16 = Ground Output Enabled
32 = +5V Output Enabled
64 = -12V Output Enabled
128 = +12V Output Enabled
Self-test Module
Performs system self-test of various modules. This test type can be used to measure the fuses
on the Model PWR-1 Module.
System self-test of the PWR-1 Module checks to see if the fuses on the Module have blown.
You can also insert a check in the program for this purpose. The STST (for Self-Test) test type
can also used for this purpose. This test type generates a pass or fail based on the status of the
+12V, +5V, or -12V fuses. In the default case, it will fail if any of these fuses are blown. If
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you wish to only test the status of one or two fuses, you can mask out the sub-tests not desired.
Also see the Jump Based on Self-test JSTST on page 18-56 test type.
use, fill-in the form method, to select these settings. Following is the syntax of the STST test
type:
Parameters
Description
Test Type
STST
Title
Normally not used
Range
Module to check self-test status of:

0 = System Board
1 = MPX Module
4 = DIG-1 Module
8 = PWR-1 Module
10 = HP-1 Module
Add 16384 to the range to obtain results without Pass/Fail indication
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Not used
High Limit
Mask bit. Sum of the following bits. For each bit set, ignore that self-test:
If Range = 0 (Analyst mc)
1 = test for module presence
2 = test digital I/O
If Range = 1 (MPX)
1 = specify module number
If Range = 4 (DIG-1)
2 = test fuse
4 = test digital I/O
8 = offset for second MPX module
If Range = 8 (PWR-1)
1 = +5V fuse
2 = -12V fuse
4 = +12V fuse
If Range = 10 (HP-1)
2 = test for fixture open
4 = test for fixture closed
8 = offset for second MPX module
BreakPoint
The breakpoint (BrkPt) test type opens a window with a snapshot of the current state of system
variables and hardware settings during test step execution from either the Edit or Test screens.
It is used as a debugging tool during test program development. The values and settings are
only displayed and can not be changed in this window. The system variables include variables
set via the MEM and FLAGS commands. The system hardware includes the DIG I/O
resources, RELAY connections, and sourcing via Analog Source types.
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The breakpoint window has several tabs to display the various pages of information. At the
right corner of each tab page is a selection button. Click on the button to make it become the
selected tab page. A black dot will indicate the selection. The selected tab page will be
displayed when the breakpoint test step is executed. Clicking on any tab shows the contents of
that page.
Note that the Test Point Sources screen (ranges 500 through 510) contains a Find Next button
which automatically displays the next source from the Source list that has any test point
connections.
Parameters
Description
Test Type
BRKPT
Title
Optional comment field
Range
100 Displays System Variables

200 Displays System Flags
300 Displays state of DIG I/O bytes
400 Displays state of TR-6 Relays
401 Displays Test Point connections to Two Wire bus
402 Displays state of PWR-1 Relays
404 Displays current strategy for connection MPX test points to
the Solid State Bus
405 Displays board connections to Relay Bus
500 Displays test points sourced by DCV 3 source
504 Displays test points connected by RELAY ranges 7 & 9
509 Displays test points sourced by SQRV source
510 Displays test points sourced by SINEV source
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Not used
High Limit
Not used
Fixture-Check
Tests connection of UUT to the fixture.
Fixture-check allows you to determine if fixture connections from the Test System to the UUT
(typically via spring probes) are making good contact. This is performed by measuring the
resistance of each point to all other points and ensuring that the result is below a specified
resistance threshold.
The name and point number of any pins not meeting the desired criteria are displayed to the
operator. The operator can take corrective action and then repeat the fixture-check to see if
problems are still present, or continue to the next step of the test program. If errors occur, the
System erases the message area of the testing display before and after presentation of the
errors.
Programming and use of fixture-check is described in more detail in the section Fixture-Check
Data on page 8-18.
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Parameter
Instruction Manual
Description
Test Type
FIXCH
Title
Not used except as an optional comment

field.
Range
If any test points fail the FIXCH test:

0=
Halt and display a list of failing test
points (Halt on Fail setting is ignored)
1=
If Halt on Fail is enabled, then halt
and
display a list of failing test points
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Not used
High Limit
Not used
Print Test Results

Allows the System to print a test results report from within a test program. The report is
printed in the same format as configured for test results report specified in the Configure
System > Environment > Configure Reporting > Test Results screen. This function can be
used, for example, if a number of similar assemblies are tested repetitively in a loop without
exiting the test execution between assemblies. (See also the ERROR test type CLEAR ALL
option for initializing the loop results before testing an assembly.) This test step also allows
the system to programatically change the SPC log data path or report data path and reconfigure
automatic test reporting. Early versions of the software used an alternate reporting test type
(REPRT) that was more limited in scope and is not recommended for new test programs.
For example, to print test result failures to a COM1 printer only when there are test failures use
RPRTS range 10 with a test title of COM1. If you want the report to also include results from
test steps which pass and output results to the default test report device (specified in the
Configure System > Environment > Configure Reporting > Automatic Reports screen) then use
a range of 74 and a blank title. To log to the SPC file "summary only" information, use a
range of 36. To log to the SPC file "summary and failure" information, use a range of 164. To
log to the SPC file "summary, failure and passing" information, use a range of 228.
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Parameter
Test Descriptions
Miscellaneous Tests
Description
Test Type
RPRTS
Title
Output device. For example, LPT1, COM1 or a file name.
Range

1 = Include a sequence number in the test report to
describe which assembly of the batch is being
reported on. The sequence number starts over each
time the test program is restarted.
2
Print results report to file named in test title or to

the default test report output device if the title is blank.
Print results to SPC log.
Print report only if the jump error count is greater than 0.
16 =
Clear out all test results after report(s).
32 = Report summary information. (For SPC only)

64 = Report on test steps which pass.
128 = Report on test steps which fail. (For SPC only)
256 = Set SPC data path or Report data path to the
memory string value, see From (-) Point note below.
512 = Set Automatic Reporting Configuration, see
To (+) Point note below.
1024 = Print Batch Report to the output device named in the
test title or to the default batch report device if
the test title is blank.
2048 = Update the Run Time failure statistics with the current
test results, see From (-) Point note below.
4096 = Print SPC Production Report to the output device
named in the test title or to the default batch report
device if the test title is blank.
8192 = Print SPC Pareto Report to the output device
named in the test title or to the default batch report
device if the test title is blank.
From (-) Point
Used By Range = 256

0 = update SPC data path from memory string value
1 = update Report data path from memory string value
Used By Range = 2048
0 = decrement the test results (allows retest results to be stored)
1 = increment the test results
To (+) Point
Used By Range = 512

1 = automatic report on failed assemblies
2 = automatic report on passed and failed assemblies
4 = automatic report of failed results data only (all results
otherwise)
Low Limit
Not used
High Limit
Not used
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Sound the PC's Beeper

Sounds the controller's beeper with either a single tone beep or the warble-like beep used
during failures.
Parameter
Description
Test Type
BEEP
Title
Not used
Range
0 is normal beep. 1 is warble-like beep.
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Not used
High Limit
Not used
Set Test Conditions

Turn testing conditions on or off during execution of test.
The internal calibration (FLAGS 16384) can be used to force a self-calibration cycle of the
System Module internal voltage references. Self-calibration also occurs automatically each
time the MDA software is started. When a test program is executing and a FLAGS 16384 is
encountered, and it has been over an hour since the last internal calibration, a new selfcalibration (requiring about two seconds) will occur. Internal calibration can lead to better
accuracy if the tester is operated for long periods of time (e.g., over a day) without restarting
the software (and hence forcing an internal calibration) or when the system is operated in
greatly fluctuating temperatures.
use, push button method, to setup this test step.
Parameter
Description
Test Type
FLAGS
Title
Not used
Range
1 = do not halt on fail

2 = halt on failure
4 = allow only a single connection to a TR-6 source
(disconnect source before making a new
connection to the same source)
8 = allow multiple TR-6 sources (opposite of 4)
16 = restore halt on fail to the default value
32 = do not single step
48 = single step
64 = restore single step to the default value
16384 = perform internal system calibration
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Not used
High Limit
Not used
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Allows a test program remark for the purpose of test program documentation. The test step is
ignored for all purposes other than being displayed or printed with the test program.
Parameter
Description
Test Type
REM
Title
Remarks for test program documentation
Range
Not used
From (-) Point
Not used
To (+) Point
Not used
Low Limit
Not used
High Limit
Not used

This test type allows you to put a string of characters in the test results report based on whether
the previous test passed or failed. For example, this can be used to provide hints, to the person
repairing the assembly, based on the failures that have occurred.
Use a range code of 0 if you would like to output the text in the test title of the test step into the
test results file. Use a range code of 1-36 if you want to output the text from one of the
operator display messages, or 1000 if you would like to output the contents of the memory
string.
You can output the string of data beginning at a specified column of the test report. The
column number is placed in the 'From (-) Point' field.
The Low Limit column specifies the condition that will cause the string to be included in the
results. If the Low Limit is 1,the string is output only if the last measurement-type test passed.
If the Low Limit is 2, the string is output on a failed last test. If the Low Limit is 3, it is output
in any case. The case of always can be used as a way to put a variable string in the results.
An alternate use of the RSLTS test-type is to turn on and off reporting of test steps during
program execution. For example, you may want to turn off detailed step reporting during part
of the program if you are encapsulating a test. For this use of the RSLT test-type, use a range
value of 2000, and place the reporting mode that you want to invoke in the Low Limit (1 =
report on passing tests, 2 = reporting on failing tests, 3 = reporting on all tests, 4 = reporting on
skipped tests). In this mode, you can use a range of 2001 to temporarily set a mode, then a
range of 2002 to return to the previous mode of results reporting.
For example, to output the text from the test title of this test step to column 5 of the test results,
only if the previous step failed, use a range of 0, From (-) Point of 5, and a Low Limit of 2.
For purposes of pass/fail status, the closest previous test step that generates test results is used.
Steps such as REMarks and LABELs are ignored.
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Parameter
Instruction Manual
Description
Test Type
RSLTS
Title
If the range is 0 and the reporting condition is true (see Low Limit), this step's
Title is printed in the test results report.
Range
Source of text string to place in the test report if the reporting condition is true:
0 = Use Comment from the Test Title
1-36 = Use Comment from the Display Messages string of the same index
1000 = Use Memory String for comment
Output reporting control of subsequent test steps:
2000 = Report on any of the subsequent steps if, and only if, they have
results matching outcomes specified in the Low Limit.
2001 = Same as 2000 but in addition remember the current reporting strategy.
2002 = Restore the results reporting strategy to what it was before the last
use of RSLTS 2001.
From (-) Point
Specifies the starting column location of the comment in the test report (applies if
the range is below 2000).
To (+) Point
Not used
Low Limit
Specifies the test result condition reported on. The sum of any of the following:
1 = test steps which have passed
2 = test steps which have failed
4 = test steps which have been skipped
High Limit
Not used
18-94
Index
4
40/80 Column Report Format ....................................................................................................... 5-8
4-Wire Measurement .................................................................................................................. 9-10
A
Abort Test ............................................................................................................................ 6-8, 9-37
Active Points ............................................................................................................................... 9-27
Add a Guard Point ...................................................................................................................... 9-11
Add a Test Step ............................................................................................................................ 8-9
Add User..................................................................................................................................... 5-17
Addresses and Jumpers...............................................................................................4-2, 5-3, 13-2
Adjust Potentiometer ................................................................................................................ 18-17
Analog Measurement Test Types............................................................................................... 18-4
Analog Stimulus Test Types..................................................................................................... 18-35
Analyst System Wiring Overview.................................................................................................. 2-6
Append ......................................................................................................................................... 8-8
ASCII Format ....................................................................................................................... 8-8, 8-34
ASCII Input Files.........................................................................................................8-8, 8-34, 10-1
Assembly Name.......................................................................................................................... 8-18
Assign / Change Point Names........................................................................................... 8-32, 10-1
Assign Connection Information................................................................................................... 8-18
Assign Default File Names ...................................................................................................... 10-8
Assign Fixture Check Data ......................................................................................................... 8-18
Assign Measured to Nominal...................................................................................................... 8-12
Assign Nominal Values............................................................................................................. 10-12
Assign Operator Display Messages ........................................................................................... 9-33
Assign Point/Pin Names ............................................................................................................. 10-1
Assign Test Limits .............................................................................................................9-2, 10-12
Assigning Continuity No-Cares................................................................................................... 9-28
Assigning Continuity Thresholds ................................................................................................ 9-29
Assigning Point Names .............................................................................................................. 8-32
Assigning Test Limits.................................................................................................................. 8-12
Attribute Manipulation ............................................................................................................. 15-5
Auto No-Care.............................................................................................................................. 9-28
Autoguarding Configuration........................................................................................................ 8-12
Auto-Increment ........................................................................................................................... 8-33
Automatic Batch Data Path ........................................................................................................ 5-16
Autoprogram .............................................................................................................8-28, 8-29, 8-30
Auto-starting a Test Program ............................................................................................ 2-10, 5-21
B
Base addresses ........................................................................................................4-2, 9-50, 18-71
Batch Errors................................................................................................................................ 6-11
Batch ID ............................................................................................................................... 5-15, 6-9
Batch Report........................................................................................................................ 6-9, 11-4
Batch Report Example................................................................................................................ 11-4
Battery / Batteries ............................................................................................................9-27, 18-12
BEEP Test Type ....................................................................................................................... 18-92
Beginning time ............................................................................................................................ 9-50
Beta Analysis ..................................................................................................................... 9-19, 9-20

Beta Test ................................................................................................................9-17, 9-19, 18-27
BETA Test Type ....................................................................................................................... 18-27
Bias point .................................................................................................................................... 9-15
Bias signal .................................................................................................................................. 9-19
Board Viewer ............................................................................................................8-23, 8-24, 8-25
Boundary Scan Testing ............................................................................................................ 18-46
Branching.................................................................................................................................... 9-36
Breakdown..................................................................................................................... 18-28, 18-31
BreakPoint ............................................................................................................8-30, 18-88, 18-89
BSCAN Test Type .................................................................................................................... 18-46
C
Cable Testing and Wiring ........................................................................................................... 9-40
CAD Conversion ......................................................................................................................... 8-25
CAD Conversion Screen .......................................................................................................... 10-4
CAD Conversion Steps............................................................................................................. 10-12
CAD Data Conversion ................................................................................................................ 10-1
CAD Files Directory ........................................................................................................... 5-16, 10-5
CAD Format.....................................................................................................................10-9, 10-15
CAD Formats Supported .......................................................................................................... 10-15
Cadence Data Conversion ....................................................................................................... 10-22
Calculation Model ....................................................................................................................... 9-14
Call a Subroutine ...................................................................................................................... 18-57
CAP Test Type ........................................................................................................................... 18-8
Capacitance Test........................................................................................................................ 18-8
Capacitor Measurement Bias ..................................................................................................... 9-14
Capacitor Testing......................................................................................................16-1, 16-9, 18-8
Change Ending Period ............................................................................................................... 7-13
Change Pin Names ........................................................................................................... 8-32, 10-1
Change Starting Period .............................................................................................................. 7-13
Changing Report Paths .............................................................................................................. 9-40
Charging/Discharging Problems................................................................................................. 9-14
Check Test Limits ....................................................................................................................... 8-25
Check UUT Serial Number .................................................................................................. 5-8, 6-10
CheckSum Support ...................................................................................................................... 1-1
Choosing the Run Number ......................................................................................................... 7-12
Collector/Source Signal .............................................................................................................. 9-19
Command Line Parameters............................................................................................... 12-1, 12-2
Comments (Remarks) .............................................................................................................. 18-93
Completing the Software Installation ............................................................................................ 4-5
Component Declarations .......................................................................................................... 10-28
Component Multi-Test Template Screen.............................................................................. 10-12
Component Test Failure Screen ............................................................................................... 6-4
Component Value File.....................................................................................................10-5, 10-8
ComputerVision Data Conversion ............................................................................................ 10-26
Conditional Test Report Output ................................................................................................ 18-93
Configuration Table.................................................................................................................... 5-4
Configure Directories/Locations ................................................................................................. 5-16
Configure Test Program Report ................................................................................................... 5-8
Connecting to the UUT ................................................................................................................. 2-8
Connection Guidelines ................................................................................................................. 4-6
Connection Information ..................................................................................................... 8-18, 8-19
Connection to the UUT ................................................................................................................. 4-5
CONT Test Type....................................................................................................................... 18-12
Contacting CheckSum.................................................................................................................. 1-1
Continuity / No-Care Information Screen .......................................................................... 9-26, 9-28

Continuity Information Screen .................................................................................................... 9-26
Continuity Map............................................................................................................................ 9-27
Continuity No-Cares .......................................................................................................... 9-23, 9-28
Continuity Test............................................................................................ 9-23, 9-24, 18-12, 18-13
Continuity Testing .................................................................................. 8-1, 9-24, 16-1, 16-9, 18-13
Continuity Thresholds................................................................................................................. 9-29
Control input and output ............................................................................................................. 9-51
Control Relays .......................................................................................................................... 18-86
Controlling Program Flow ........................................................................................................... 9-35
Conversion Steps ................................................................................................................... 10-13
Convert CAD data
Cadence..................................................................................................................... 10-22, 10-23
ComputerVision.......................................................................................................... 10-26, 10-27
Fabmaster .......................................................................................................10-34, 10-35, 10-36
HP-BCF...................................................................................................................... 10-20, 10-21
Mentor ........................................................................................................................ 10-17, 10-18
OrCAD................................................................................................................................... 10-19
Pads2000 .............................................................................................................................. 10-30
P-CAD ........................................................................................................................ 10-16, 10-17
Racal-Redac .............................................................................................................. 10-23, 10-24
Schema ................................................................................................................................. 10-32
Scicards ..................................................................................................................... 10-32, 10-33
Tango ......................................................................................................................... 10-28, 10-30
Veribest ................................................................................................................................. 10-33
ViewLogic................................................................................................................... 10-24, 10-26
Convert CAD data: ................................................................................................................... 10-16
Copy Field/Lines ........................................................................................................................... 8-9
Creating a Test Program .............................................................................................................. 2-9
Cross Checks ............................................................................................................................. 8-25
Current Mode.................................................................................................. 16-1, 16-2, 16-3, 16-4
Current Mode Block Diagram .................................................................................................. 16-2
Current Mode Guards............................................................................................................. 16-11
Customer Support ...................................................................................................................... 1-2
Customizing CAD Conversion .................................................................................................... 10-9
Customizing Reports .................................................................................................................... 5-8
Cut Field/Lines.............................................................................................................................. 8-9
D
Data conversion (CAD)
Cadence................................................................................................................................ 10-22
ComputerVision..................................................................................................................... 10-26
Fabmaster ............................................................................................................................. 10-34
HP-BCF................................................................................................................................. 10-20
Mentor ................................................................................................................................... 10-17
OrCAD................................................................................................................................... 10-19
Pads2000 ........................................................................................................10-30, 10-31, 10-32
P-CAD ................................................................................................................................... 10-16
Racal-Redac ......................................................................................................................... 10-23
Schema ................................................................................................................................. 10-32
Scicards ................................................................................................................................ 10-32
Tango .................................................................................................................................... 10-28
Veribest ................................................................................................................................. 10-33
ViewLogic.............................................................................................................................. 10-24
Data conversion (CAD):............................................................................................................ 10-16
Data Screen (ICs Test)............................................................................................................... 9-30
Date .............................................................................................................................................. 7-5

DC Current Output.................................................................................................................... 18-37
DC Voltage Output ................................................................................................................... 18-36
DCI Test Type........................................................................................................................... 18-37
DCV Test Type ......................................................................................................................... 18-36
Debugging Test Programs..............................................................................................8-4, 18-88
Default Grid................................................................................................................................. 8-11
Default Limit Setup ...................................................................................................8-13, 8-14, 8-16
Delete Test Program .................................................................................................................... 8-8
Delete Test Steps ......................................................................................................................... 8-9
Designing the fixture ..................................................................................... 4-6, 5-21, 18-84, 18-89
Device Write-Fault ...................................................................................................................... 14-1
Diagnostics - Board Viewer ........................................................................................................ 8-18
Diagnostics - Report ..................................................................................................................... 6-5
DIG-1 Characteristics ............................................................................................................... 18-39
DIGA Test Step......................................................................................................................... 18-42
DIGI Test Type ......................................................................................................................... 18-41
Digital Active ............................................................................................................................. 18-42
Digital Hardware Test ............................................................................................................... 18-45
Digital Input Test Type.............................................................................................................. 18-41
Digital Output Test Step ........................................................................................................... 18-42
Digital Test Types ..................................................................................................................... 18-39
DIGO Test Step ........................................................................................................................ 18-42
DIGR Test Step ........................................................................................................................ 18-43
DIGx Test Types....................................................................................................................... 18-41
DIODE Test Type ....................................................................................................................... 18-9
Diode Testing..................................................................................................................... 9-16, 16-9
Diodes - LED and Zener Testing ................................................................................................ 9-16
Diodes/Semiconductor Testing................................................................................................... 16-1
Direct addressing........................................................................................................................ 9-51
Directories Configuration ............................................................................................................ 5-16
DISCH Test Step ...................................................................................................................... 18-13
Discharge Point ........................................................................................................................ 18-13
Discharge System......................................................................................................................... 9-4
Discharging Problems ................................................................................................................ 9-14
Disk is write-protected ................................................................................................................ 14-1
Disk Out of Space....................................................................................................................... 14-1
Disk Read Error .......................................................................................................................... 14-1
Disk Seek Error........................................................................................................................... 14-1
DISP Test Step ......................................................................................................................... 18-61
DISPE Test Step....................................................................................................................... 18-61
DISPL Test Step ....................................................................................................................... 18-60
Display a Message to the Operator ................................................................................. 9-33, 18-61
Display a Short Message to the Operator .......................................................................9-33, 18-60
Display Attribute Manipulation ................................................................................15-1, 15-4, 18-65
Display Enhanced Screen ........................................................................................................ 18-64
Display List for SCRN Test Step ................................................................................................ 15-4
Display Picture Image............................................................................................................... 18-61
Display Problems ..................................................................................................................... 13-1
Division by Zero .......................................................................................................................... 14-1
DMM Test Type ........................................................................................................................ 18-20
Drive is Not Ready...................................................................................................................... 14-1
Dynamic Measurement Analysis ................................................................................................ 9-13
Dynamic Measurement Calibration .......................................................................................... 18-25
E
Edit................................................................................................................... 3-2, 8-6, 8-7, 9-2, 9-3
Measure Menu ....................................................................................................................... 8-12
Test Step Analysis .................................................................................................................... 9-6
View Menu.............................................................................................................................. 8-11
Edit Profile .................................................................................................................................. 5-17
Edit Screen .....................................................................................................................8-7, 9-2, 9-3
Encapsulating a Test .................................................................................................................. 9-38
Enter Batch ID .............................................................................................................................. 6-9
Enter UUT Serial Number............................................................................................................. 6-9
Enter/Edit IC Test Data Screen .................................................................................................. 9-30
Entering Test Steps ...................................................................................................................... 9-1
Entering the ICs Test Step ......................................................................................................... 9-30
Erase an Operator Message .................................................................................................... 18-61
Erasing Memory.......................................................................................................................... 8-32
Error Messages......................................................................................................................... 14-2
ERROR Test Type.........................................................................................................18-49, 18-54
EVAL Test Type........................................................................................................................ 18-67
Event timing ................................................................................................................................ 9-50
Example Test Program Segments.............................................................................................. 15-1
Exception Report File ...............................................................................................10-5, 10-6, 10-8
EXEC Test Type .............................................................................................................. 9-38, 18-67
Execute User-Written Routine .................................................................................................. 18-67
Executing a User-Written Program............................................................................................. 9-38
Executing the Test........................................................................................................................ 6-4
Execution time ............................................................................................................................ 9-50
Execution times .......................................................................................................................... 6-11
Exit program ................................................................................................................................. 3-3
Exiting the Program .................................................................................................................... 9-37
Expand........................................................................................................................................ 8-11
Export .............................................................................................................................. 5-20, 10-11
Extending Test Program Length................................................................................................. 9-38
External Hardware .................................................................................................................... 5-20
External Sense .................................................................................................................. 9-10, 9-11
External Sensing Diagram ....................................................................................................... 16-3
External Signal Input/Output..................................................................................................... 18-38
EXTIO Test Type ...................................................................................................................... 18-38
F
Fabmaster Data Conversion..................................................................................................... 10-34
Failed Components .................................................................................................................. 13-2
Failures Only ReTest.................................................................................................................... 6-8
Field Values ................................................................................................................................ 8-12
File access denied...................................................................................................................... 14-1
File Menu .......................................................................................................................3-3, 6-7, 8-8
File not found .............................................................................................................................. 14-1
File Open error............................................................................................................................ 14-1
File Selection............................................................................................................................... 6-3
File Viewer .................................................................................................................................... 5-8
Find............................................................................................................................................. 8-11
Find Next ...................................................................................................................................... 8-9
FIXCH Test Type ...................................................................................................................... 18-89
FIXCT Test Type ........................................................................................................... 18-84, 18-85
FIXID Test Type............................................................................................................. 18-56, 18-86
Fixture Check Data..................................................................................................................... 8-18
Fixture Control .......................................................................................................................... 18-84

Fixture Handle to Autostart a Test...................................................................................5-21, 18-71
Fixture Identification ................................................................................................................. 18-85
Fixture Wiring Report File.................................................................................................. 10-5, 10-8
Fixture-Check .........................................................................................................8-20, 8-21, 18-89
Fixtures ....................................................................................................... 5-21, 6-14, 18-84, 18-89
FLAGS Test Type ..................................................................................................................... 18-92
Floating point overflow................................................................................................................ 14-1
Floating point underflow ............................................................................................................. 14-1
Font Size..................................................................................................................................... 8-11
Frequency Selection .....................................................................................................16-7, 18-34
From Pin ................................................................................................................................ 6-4, 9-2
G
GAIN Test Type ........................................................................................................9-6, 9-12, 18-25
General Programming .............................................................................................................. 18-41
General protection fault .............................................................................................................. 14-1
General Purpose Interface Bus I/O .......................................................................................... 18-78
Generate Test Result ............................................................................................................... 18-67
Generating Reports from a Test Program .................................................................................. 9-39
Generating the Test Program ..................................................................................................... 10-2
Get Batch ID from operator .......................................................................................................... 5-8
Get UUT Serial Number from operator......................................................................................... 5-8
Getting Started.............................................................................................................................. 2-1
Goto Next Error........................................................................................................................... 8-11
Goto Step...................................................................................................................................... 8-9
GPIB Test Type ........................................................................................................................ 18-78
Guarding ......................................................................................................... 9-11, 9-12, 9-15, 16-4
H
Halt on Fail............................................................................................................................. 6-5, 6-8
Hardware failure ......................................................................................................................... 14-1
Hardware Installation.................................................................................................................... 4-4
Heap overflow error .................................................................................................................... 14-1
Help Menu.................................................................................................................................. 8-31
High Limit................................................................................................................ 6-4, 8-1, 9-5, 9-6
High-voltage............................................................................................ 18-28, 18-29, 18-30, 18-31
High-Voltage Test..................................................................................................................... 18-30
HiPot ......................................................................................................................................... 18-30
HP-1............................................................................................. 18-28, 18-29, 18-30, 18-31, 18-32
HP-BCF Data Conversion ........................................................................................................ 10-20
I
I/O addresses ............................................................................................................................... 4-2
I/O Channel Conflicts ............................................................................................................... 13-2
I/O Port Assignment ................................................................................................................... 13-1
IC Locations .....................................................................................................................13-4, 13-5
IC Test ...................................................................................................................................... 18-10
IC Test Data Screen .......................................................................................................... 9-30, 9-31
IC Test Range Limiting ............................................................................................................. 18-11
IC Testing .......................................................................................................................... 9-29, 16-9
IC tests......................................................................................................................................... 8-5
ICRng Test Step ....................................................................................................................... 18-11
ICs Map ...................................................................................................................................... 9-31
ICs Test Step .............................................................................................................................. 9-30
ICS Test Type................................................................................................................ 18-10, 18-11

Import............................................................................................................................... 5-20, 10-10
Impure code................................................................................................................................ 9-51
In System Programming (ISP).................................................................................................. 18-47
Incorrect spec file revision .......................................................................................................... 14-1
INDUC Test Type ..................................................................................................................... 18-11
Inductor Test.................................................................................................................... 16-1, 18-11
Input files (CAD) ......................................................................................................................... 10-1
Insert a Guard Point ................................................................................................................... 9-11
Insert a Test Step ......................................................................................................................... 8-9
Install/Remove Jumpers ........................................................................................................... 18-17
Installation of System Modules.............................................................................................. 2-4, 4-2
Installation Overview .................................................................................................................... 4-1
Installing and Removing Fixtures ................................................................................................. 2-7
Internal bus cabling ...................................................................................................................... 4-4
Internal files generated ............................................................................................................... 10-4
Interrupts ................................................................................................................................... 13-2
Introduction ................................................................................................................................... 1-1
Invalid DOS function number...................................................................................................... 14-1
Invalid drive number ................................................................................................................... 14-1
Invalid file access code............................................................................................................... 14-1
Invalid floating point operation.................................................................................................... 14-1
Isolation Testing........................................................................................................................ 18-28
ISP Test Type ........................................................................................................................... 18-47
J
JFXID Jump Based on Fixture Identification ................................................................. 18-56, 18-85
JMP Jump Unconditionally .............................................................................................. 9-36, 18-49
JMPC Jump Based on Capacitance Measurement.................................................................. 18-50
JMPD Jump Based on Diode Measurement ............................................................................ 18-50
JMPDI Jump Based on Result of Digital Input ......................................................................... 18-53
JMPDM Jump Based on DMM Measurement .......................................................................... 18-52
JMPE Jump Based on Number of Errors ...................................................................... 18-54, 18-55
JMPER Install/Remove Jumpers on UUT ................................................................................ 18-17
JMPI Jump Based on Inductance Measurement...................................................................... 18-51
JMPK Jump Based on Result of Key Input .............................................................................. 18-54
JMPPI Jump Based on Result of Port Input ............................................................................. 18-53
JMPR Jump Based on Resistance Measurement.................................................................... 18-49
JMPU Jump Based on UCT Measurement .............................................................................. 18-52
JMPV Jump Based on Voltage Measurement.......................................................................... 18-51
JMPWR Jump Based on PWR Measurement.......................................................................... 18-51
JMPZ Jump Based on Zener Measurement............................................................................. 18-56
JSTST Jump Based on Self-test .............................................................................................. 18-56
Jumper....................................................................................................................4-2, 18-17, 18-18
Jumper Settings.......................................................................................................................... 4-1
Jumper/Switch Checking ............................................................................................................ 15-1
Jumpers - Install/Remove................................................................................................ 9-23, 18-17
K
Kelvin .......................................................................................................................................... 9-10
Key............................................................................................................................................ 18-63
Keypad......................................................................................................................2-11, 2-12, 2-13
Keypad mask ................................................................................................ 2-11, 2-13, 12-3, 18-72
L
LABEL test.................................................................................................................................. 9-36
Label Test Step......................................................................................................................... 18-49
Learn Step and Setup................................................................................................................. 8-12
Learning the Continuity Map....................................................................................................... 9-27
Learning the ICs Map ................................................................................................................. 9-31
LED and Zener Testing .............................................................................................................. 9-16
Lever Handle ...................................................................................................................5-21, 18-72
Listing Test Program Data.......................................................................................................... 8-34
Load a test program ..................................................................................................................... 3-3
Load and Run a Test Program ................................................................................................. 18-58
Load and Run a Test Sub-Program.......................................................................................... 18-58
Loading a Program ..................................................................................................................... 8-32
Log into the system ...................................................................................................................... 5-1
LOGIC Test Type...................................................................................................................... 18-45
Login User ........................................................................................................................... 5-1, 6-10
Loop on Error......................................................................................................18-49, 18-54, 18-55
Low Limit................................................................................................................. 6-4, 8-1, 9-5, 9-6
M
Main screen ........................................................................................................................... 3-1, 4-5
Main System Window.......................................................................................................... 3-1, 3-2
Make Cable Connection ........................................................................................................... 18-19
Manage User Accounts .............................................................................................................. 5-17
Manual CAD Conversion.......................................................................................................... 10-9
Manual Panelization Programming............................................................................................. 9-45
Map (Continuity/ICs) ....................................................................................... 9-24, 9-27, 9-30, 9-31
Max 40 Column Report Lines per UUT ........................................................................................ 5-8
Max Errors .................................................................................................................................. 6-12
Max Failure Only Retest ............................................................................................................. 6-10
MDA Software............................................................................................................................... 4-4
MDA testing .................................................................................................................................. 4-6
Measure...................................................................................................................................... 8-26
Measure Menu............................................................................................................................ 8-12
Measured value ............................................................................................................................ 6-4
Measurement Analysis........................................................................................................ 9-6, 9-7
Measurement Analysis Display................................................................................................. 9-6
Measurement Delays.................................................................................................................. 9-10
Measurement Guidelines............................................................................................................ 16-9
Measurement Messages ................................................................................................... 6-12, 8-23
Measurement Offsets ................................................................................................................. 9-12
Measurement Polarity................................................................................................................. 9-10
Measurement Retries ................................................................................................................. 8-18
Measurement Statistics ................................................................................................................ 8-1
Measuring One Point to Many Points ......................................................................................... 9-15
MEMI Test Type .............................................................................................................. 9-50, 18-71
Memory Locations ...................................................................................................................... 9-49
Memory Manipulation (Integer)........................................................................................9-50, 18-71
Memory Manipulation (Real) ........................................................................................... 9-50, 18-74
Memory Manipulation (String) .........................................................................................9-50, 18-76
Memory Manipulation Test Types ............................................................................................ 18-69
Memory Variables.............................................................................................................. 9-50, 9-51
Memory-Time.............................................................................................................................. 9-50
MEMR Test Type.............................................................................................................9-50, 18-74
MEMS Test Type .............................................................................................................9-50, 18-76
Mentor Data Conversion........................................................................................................... 10-17

Menu Control....................................................................................................................5-19, 5-20
Merge (Copy/Append) Test Steps ......................................................................................... 8-8, 8-9
Merge Parallel Components ............................................................................................ 8-27, 10-12
Message Test Step................................................................................................................... 18-60
MFI
Setup and Use ........................................................................................................................ 9-51
MFI Test Type........................................................................................................................... 18-33
Miscellaneous Tests ................................................................................................................. 18-83
Module Installation........................................................................................................................ 2-4
Module Orientation ....................................................................................................................... 2-4
Monitor TR-8-PWR Output ....................................................................................................... 18-38
MPX Module IC Locations .......................................................................................................... 13-3
Setup and Use ........................................................................................................................ 9-51
Multi-Function Input Measurement Test Step ................................................................. 8-12, 18-33
Multi-PCB Panels ...................................................................................................................... 9-42
Multiplexer module (MPX) .......................................................................................................... 13-3
Multi-Test Template................................................................................................................ 10-12
N
Net declarations............................................................................................................. 10-28, 10-29
Net List File ............................................................................................................................... 10-5
Net Order File .................................................................................................................... 10-1, 10-5
Net Rename Strategy ............................................................................................................. 10-14
New Test Program File................................................................................................................. 8-8
No Care ....................................................................................................................9-27, 9-28, 9-29
Nominal Fit........................................................................................................................... 9-7, 9-12
Normal Test Reports .................................................................................................................. 9-39
Not a valid spec data file ............................................................................................................ 14-1
Notes about MEMI ...................................................................................................................... 9-50
Notes about MEMR .................................................................................................................... 9-50
Notes about MEMS .................................................................................................................... 9-50
Notes on Veribest Data Conversion ......................................................................................... 10-33
O
O_Rng .......................................................................................................... 18-7, 18-8, 18-9, 18-10
Offsets ................................................................................................................................. 9-6, 9-12
One Point to Many Points........................................................................................................... 9-15
Open File ..................................................................................................................................... 6-3
Opens Threshold ........................................................................................................................ 9-25
Opens/Shorts Testing................................................................................................................. 9-23
Operator adjustments ................................................................................................................... 8-5
Operator Instructions Setup Screen....................................................................................... 8-22
Operator KeyPad ........................................................................................................................ 2-11
Operator Message Displays ....................................................................................................... 9-33
Operator Messages .................................................................................................................... 8-19
Operator name (Login name) ..................................................................................................... 5-15
Operator screen............................................................................................................................ 8-5
OPTO Test Type....................................................................................................................... 18-33
Opto-isolator Testing .................................................................................................................. 9-21
OrCAD Data Conversion .......................................................................................................... 10-19
Other Digital Methods (TR-6) ................................................................................................... 18-40
Other Meas Characteristics ........................................................................................................ 8-18
Overlapping addresses............................................................................................................... 13-2
Overlay file read error................................................................................................................. 14-1

Over-Range (O_Rng) ................................................................................... 18-7, 18-8, 18-9, 18-10
Over-Voltages.................................................................................................................... 13-4, 13-6
P
Pads2000 Data Conversion...................................................................................................... 10-30
Panelization ................................................................................................................................ 8-27
Panelization Programming ......................................................................................................... 9-45
Panelization Programming by Wizard ........................................................................................ 9-43
Panelized assembly........................................................................................................... 6-13, 9-43
Panelized PCBs.......................................................................................................................... 7-15
Panelized Testing ....................................................................................................................... 9-41
Parallel Components .................................................................................................................. 9-11
Parallel Components Testing ..................................................................................................... 16-1
Pareto Failure Report ..........................................................................................................7-1, 11-9
Pareto Failure Report Example .................................................................................................. 11-9
Pareto of Batch Errors ................................................................................................................ 6-10
Password ..................................................................................................................5-17, 5-18, 5-19
Paste Field.................................................................................................................................... 8-9
Paste Test Steps .......................................................................................................................... 8-9
Path not found ............................................................................................................................ 14-1
Pause a Specified Time............................................................................................................ 18-14
PAUSE Test Step ..................................................................................................................... 18-14
P-CAD Data Conversion........................................................................................................... 10-16
PCB
Locations/Numbers Screen..................................................................................................... 9-45
Runtime Options ................................................................................................................... 9-49
Wiring Assignments ................................................................................................................ 9-45
PCB Number Being Tested ...................................................................................................... 18-63
PCB Panel Map Screen ............................................................................................................ 9-46
PCB Panelization Screen ......................................................................................................... 9-44
PCB Replication Wizard Screen................................................................................................. 9-43
PCB Test Step .......................................................................................................................... 18-63
PCB: ........................................................................................................................................... 9-45
PICT Test Step ......................................................................................................................... 18-61
Picture Test Step ...................................................................................................................... 18-61
PIF Note.................................................................................................................................... 18-67
Pin Names ......................................................................................................................... 8-32, 8-33
Pneumatic Fixture Systems.......................................................................................................... 1-2
Point Information........................................................................................................................... 9-6
Point Name Entry................................................................................................................. 8-9, 8-32
Point/Pin Names - Assign / Change .................................................................................. 8-32, 10-1
Polarity........................................................................................................................................ 9-10
Polarized Capacitors .................................................................................................................... 9-9
Port Input Test .......................................................................................................................... 18-46
Port Output ............................................................................................................................... 18-46
PORTI Test Type...................................................................................................................... 18-46
PORTO Test Step..................................................................................................................... 18-46
PORTx Test Types ................................................................................................................... 18-45
POTD Test Type....................................................................................................................... 18-17
Potentiometer Adjustments ............................................................................................. 15-3, 18-17
Potentiometers.................................................................................................................9-23, 18-17
POTR Test Type....................................................................................................................... 18-17
POTU Test Type....................................................................................................................... 18-17
Print ..................................................................................................................................... 8-8, 8-18
Print Test Results ............................................................................................. 4-3, 5-8, 5-20, 18-90
10
Printer ...................................................................................................... 4-3, 5-11, 5-14, 5-20, 5-21

Probe a Point .............................................................................................................................. 8-33
Probing ...................................................................................................................................... 8-33
Problems............................................................................................................................ 13-1, 13-2
Production Report................................................................................................................ 7-1, 11-8
Production Report Example........................................................................................................ 11-8
Program Flow ............................................................................................................................. 9-35
Program for SCRN Load Operation............................................................................................ 15-4
Program Memory Locations ....................................................................................................... 9-49
Program Segments..................................................................................................................... 15-1
Program Storage ........................................................................................................................ 9-51
Programming a Beta Test........................................................................................................... 9-18
Programming by Wizard ............................................................................................................. 9-43
Programs in ASCII .................................................................................................................... 8-34
Programs in Binary .................................................................................................................. 8-34
PWRMN Test Type................................................................................................................... 18-38
Q
QuickGuard Points ............................................................................................................ 8-16, 8-17
R
Racal-Redac Data Conversion ................................................................................................. 10-23
Range Check Error..................................................................................................................... 14-1
Range Values ............................................................................................................................. 18-5
Range/Function Selection ............................................................................................................ 9-7
Read ASCII File .......................................................................................................................... 8-34
Reference Designator Template............................................................................................... 10-10
Relative Address......................................................................................................................... 9-51
Relay Control ............................................................................................................................ 18-86
RELAY Test Type ..................................................................................................................... 18-86
REM Test Type......................................................................................................................... 18-93
Remark/Comment in the Test Program.................................................................................... 18-93
Replicate Options Screen ........................................................................................................ 9-48
Report Device .................................................................................................................... 5-20, 6-10
Reporting on Panelized PCBs .................................................................................................... 7-15
Reports ....................................................................................................................................... 11-1
Reports sorted by PCB............................................................................................................... 6-14
Res Characteristics ........................................................................................................... 8-18, 18-7
RES Test Type ........................................................................................................................... 18-7
Reset of Test System ................................................................................................................... 8-8
Resistance Measurement Characteristics......................................................................... 8-22, 8-23
Resistance Test .......................................................................................................................... 18-7
Resistor Testing........................................................................................................16-1, 16-9, 18-7
RESRG Test Type .................................................................................................................... 18-15
RET Return from Subroutine .................................................................................................... 18-57
Retain Skip Selections................................................................................................................ 6-13
ReTest ................................................................................................................................... 6-5, 6-8
RETRY Test Type .................................................................................................................... 18-14
RETT Test Type ....................................................................................................................... 18-59
Return from Test Sub-Program ................................................................................................ 18-59
RM-1 ......................................................................................................................................... 18-46
RPRTS Test Type .................................................................................................................... 18-90
RS232 Serial Interface I/O........................................................................................................ 18-81
RS232 Test Type...................................................................................................................... 18-81
RSLTS Test Type ..................................................................................................................... 18-93
11
Run Test Program from the Editor................................................................................................ 8-8

RUN Test Type ......................................................................................................................... 18-58
Running Another Test................................................................................................................. 9-37
RunT Files Directory................................................................................................................... 5-16
RUNT Test Type....................................................................................................................... 18-58
Runtime Options ......................................................................................................................... 9-45
S
Safety and Operational Information.............................................................................................. 2-1
Sample Reports .......................................................................................................................... 11-1
Save a Test Program....................................................................................................3-3, 8-8, 8-34
Save Configuration .............................................................................................................. 5-1, 5-16
Schema Data Conversion......................................................................................................... 10-32
Scicards Data Conversion ........................................................................................................ 10-32
Screen and Display Attribute Manipulation ................................................................................ 15-4
Screen Result for SCRN Test Type......................................................................................... 15-6
SCRN Load Operation.............................................................................................................. 15-7
SCRN Test Step ...................................................................................................15-4, 18-65, 18-66
Select Skipped PCBs in Panel ................................................................................................... 9-41
Select Skips ................................................................................................................................ 6-13
Selecting the Test Program .......................................................................................................... 6-3
Self-test.................................................................................................... 2-4, 5-6, 5-7, 18-87, 18-88
Self-test Module................................................................................................................. 5-7, 18-87
Semiconductor Testing............................................................................................................... 16-1
Serial Number..........................................................................5-10, 5-15, 6-2, 6-7, 6-12, 7-12, 7-13
Serial Number Checking...................................................................................................... 5-8, 6-10
Set Error Counter Used for JMPE ............................................................................................ 18-54
Set Limits from Measured Value ................................................................................................ 8-12
Set Low-Level Measurement Parameters ................................................................................ 18-15
Set Measurement Retry Parameters ........................................................................................ 18-14
Set Switch................................................................................................................................. 18-18
Set Test Conditions .................................................................................................................. 18-92
Setting Active Points................................................................................................................... 9-27
Shorting Fixture ............................................................................................................................ 5-7
Shorts Threshold ........................................................................................................................ 9-25
Show Pareto ............................................................................................................................... 6-10
Show Pass/Fail ........................................................................................................................... 6-10
Show Unedited Field Values ...................................................................................................... 8-11
SHUT DOWN.............................................................................................................................. 9-37
Sigma Report............................................................................................................................ 11-10
Sine Wave Output .................................................................................................................... 18-35
SINEV Test Type ...................................................................................................................... 18-35
Single Step ............................................................................................................................ 6-5, 6-8
Skipped PCBs in Panel ............................................................................................................ 9-43
Software Installation ..................................................................................................................... 4-4
Sort ............................................................................................................................................. 8-26
Sound the PC's Beeper ............................................................................................................ 18-92
SPC ....................................................................................................................................... 7-2, 7-3
SPC Data Format ....................................................................................................................... 7-15
SPC Logging............................................................................................................................... 6-10
Special Features ......................................................................................................................... 8-5
Special Line ..............................................................................................................5-12, 5-13, 5-15
Specific CAD Types.................................................................................................................. 10-15
Specifications................................................................................................................................ 1-1
Specify Label ............................................................................................................................ 18-49
SQRV Test Type....................................................................................................................... 18-36
12
Square Wave Output ................................................................................................................ 18-36

Stack overflow error.................................................................................................................... 14-1
Statistical Analysis ........................................................................................................................ 7-1
Statistical Data Reporting ........................................................................................................... 9-39
Statistics Data File Example....................................................................................................... 11-6
Statistics Data Path .................................................................................................................... 5-16
Status Map.................................................................................................................................. 6-13
Step Analysis ................................................................................................................................ 9-6
Storage space............................................................................................................................. 9-51
Strip Printer................................................................................................................................... 4-3
STST Test Type........................................................................................................................ 18-87
SWCHD Test Type ................................................................................................................... 18-18
SWCHR Test Type ................................................................................................................... 18-18
Switch Checking ......................................................................................................................... 15-1
Switch Contacts Tests ................................................................................................................ 9-22
System Configuration ................................................................................................................... 5-1
System Installation........................................................................................................................ 2-4
System Measurement Module............................................................................................. 4-2, 16-1
System Module .................................................................................................................... 4-2, 16-1
System Module Installation........................................................................................................... 4-2
System Module Self-test............................................................................................................... 5-6
System Overview.......................................................................................................................... 1-2
System requriements.................................................................................................................... 2-4
T
T-120-2 Strip Printer Installation................................................................................................... 4-3
Tango Data Conversion............................................................................................................ 10-28
Template for New Test Program .................................................................................................. 8-8
Template for Reference Designators ....................................................................................... 10-10
Test....................................................................................................... 6-1, 6-4, 6-5, 6-6, 9-38, 9-39
Test Display................................................................................................................................. 6-6
Test Failure Screen ...................................................................................................................... 6-4
Test Fixture and Discharge System ............................................................................................. 9-4
Test for Capacitor Polarity ........................................................................................................ 18-26
Test for SMT Opens ................................................................................................................. 18-25
Test for Transformer Polarity.................................................................................................... 18-28
Test for Transistor/FET Beta ........................................................................................... 9-17, 18-27
Test Menu ............................................................................................................................. 6-2, 6-8
Test Point Assignment.............................................................................................................. 10-13
Test Program
Opening.............................................................................................................................. 3-3, 8-8
Printing ...................................................................................................................................... 8-8
Saving .............................................................................................................................. 8-8, 8-34
Test Program File (CAD Conversion)......................................................................................... 10-4
Test Program in ASCII.............................................................................................................. 11-5
Test Program Report ......................................................................................................... 5-13, 11-3
Test Program Report Example ................................................................................................... 11-3
Test Program Segments............................................................................................................. 15-1
Test Program: ........................................................................................................................ 3-3, 6-3
Test Progress ............................................................................................................................. 6-11
Test Report ................................................................................................................................... 6-9
Test Report Contents ................................................................................................................. 6-10
Test Report Data Path................................................................................................................ 5-16
Test Results - Report Lines per UUT ........................................................................................... 5-8
Test Results Report............................................................................................................. 5-8, 11-2
Test Results Report Example..................................................................................................... 11-2
13
Test Screen with Multi-PCB Panels............................................................................................ 9-41

Test Step Generation ............................................................................................................... 10-12
Test Step Range Values............................................................................................................. 18-5
Test Steps.....................................................................................................................8-10, 9-1, 9-5
Test System Input/Output Connectors ......................................................................................... 2-4
Test Tolerances .......................................................................................................................... 8-12
Testing a panelized assembly .................................................................................................... 6-13
Testing an Assembly .................................................................................................................... 6-1
Testing Capacitors ................................................................................... 16-3, 16-6, 16-11, 18-26
Testing Diodes/Semiconductor Testing...................................................................................... 16-1
Testing ICs/Transistors/Diodes ..............................................9-16, 9-17, 9-29, 16-12, 18-10, 18-11
Testing Inductors ..................................................................................................................... 16-6
Testing Resistors .................................................................................................16-3, 16-6, 16-11
TESTJ Test Type...................................................................................................................... 18-25
TestJet Programming ............................................................................................................... 18-25
TestJet Technology ....................................................................................................... 18-25, 18-26
Test-Point Electronics................................................................................................................. 13-3
Tests
Continuity ................................................................... 8-1, 8-3, 8-4, 8-5, 9-24, 9-25, 18-12, 18-13
IC................................................................................................. 8-1, 8-2, 8-5, 9-30, 18-10, 18-11
Tests: ............................................................................................................................................ 8-1
Theory of Operation.................................................................................................................... 16-1
Third-Terminal Biasing ............................................................................................................... 9-15
Time storage location ................................................................................................................. 9-50
Timing events ............................................................................................................................. 9-50
TJetC Test Type ....................................................................................................................... 18-26
To Pin .................................................................................................................................... 6-4, 9-2
Tolerances ......................................................................................................................8-4, 8-5, 8-6
Too many files open ................................................................................................................... 14-1
Toolbar......................................................................................................................................... 9-1
Tools Menu................................................................................................................................ 8-25
TR-8-1 Digital I/O...................................................................................................................... 18-40
Transfer of Control Test Types................................................................................................. 18-48
Transformer Testing ........................................................................................................ 9-32, 18-28
Transistor and FET Testing ............................................................................................. 9-17, 18-27
Translation Notes ..................................................................................................................... 10-4
Try Blocks ...................................................................................................................... 18-49, 18-54
Turn Fixture Vacuum On and Off ............................................................................................. 18-84
U
UCT Test Type ......................................................................................................................... 18-21
UCT Trigger Setup ................................................................................................................... 18-24
UCTTR Test Type..................................................................................................................... 18-24
Unconditional jump ............................................................................................................ 9-36, 9-37
Unedited Field Values ................................................................................................................ 8-11
Universal Counter/Timer Measurement Test ........................................................................... 18-21
User Accounts .......................................................................................................................... 5-17
User Name.................................................................................................................................. 5-17
User Password ........................................................................................................................... 5-17
User-Defined Tests................................................................................................................... 18-67
User-Written Routines .............................................................................................................. 18-67
Using Measurement Gain Factors.............................................................................................. 9-12
Using Measurement Offsets ....................................................................................................... 9-12
UUT .............................................................................................................................................. 2-8
UUT Serial Number Checking ............................................................................................. 5-8, 6-10
14
V
VACUM Test Type.................................................................................................................... 18-84
Veribest Data Conversion......................................................................................................... 10-33
View Menu .................................................................................................................................. 8-11
ViewLogic Data Conversion ..................................................................................................... 10-24
Visual MDA Software.................................................................................................................... 4-4
VOLT Test Type ....................................................................................................................... 18-12
Voltage Guarding...................................................................................................................... 16-8
Voltage Mode............................................................................................................16-5, 16-7, 16-8
Voltage Mode Block Diagram .................................................................................................. 16-5
Voltage Mode Guards............................................................................................................. 16-10
Voltage Test.............................................................................................................................. 18-12
W
Wait for a Key to Be Pressed ................................................................................................... 18-63
Memory Manipulation Tests.................................................................................................. 18-69
WAITK Test Type.................................................................................................................. 18-63
Wire Run Report ................................................................................................................8-18, 11-7
Wire Run Report Example.......................................................................................................... 11-7
WIRE Test Type ....................................................................................................................... 18-19
Wiring Assignments........................................................................................ 8-18, 9-47, 10-4, 11-7
Wizard Screen ........................................................................................................................... 9-45
Write ASCII File .......................................................................................................................... 8-34
Writing a Test Program................................................................................................................. 8-1
X
X-Bar/Sigma Report ..................................................................................................................... 7-1
X-Bar/Sigma Report Example ......................................................................................... 11-1, 11-10
XFMR Test Type....................................................................................................................... 18-28
XFMR Testing............................................................................................................................. 9-32
Z
Zener Diode Test ...................................................................................................................... 18-10
Zener Diode Testing ................................................................................................................... 9-16
ZENER Test Type .................................................................................................................... 18-10
ZERO Test Type....................................................................................................................... 18-25
15
16

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CheckSum Analystmc

Visual MDA for Windows

Web Site: www.checksum.com

Chapter 2: Getting Started

Chapter 3: Opening Screen

Chapter 4: System Installation

Chapter 5: System Configuration

Chapter 6: System Operation

Chapter 7: Statistical Analysis of Test Results

Using Statistical Process Control

Chapter 8: Test Programs

Chapter 9: Entering Test Steps

Using the Edit Screen

Programming a Transformer Test

Chapter 10: CAD Data Conversion

Notes on OrCAD Data Conversion

Chapter 11: Sample Reports

Chapter 12: Command Line Parameters

Chapter 14: Error Messages

Screen and Display Attribute Manipulation

Chapter 16: Theory of Operation

Chapter 17: Specifications

DMM Measurement Test

Jump Based on Zener Measurement

In the event of a failure of a product during the warranty period:

Test System Introduction

of what the System can do and how to navigate through it.

Main System Window on page 3-1

System Installation on page 4-1

System Configuration on page 5-1

Testing an Assembly on page 6-1

Statistical Analysis on page 7-1

CheckSum Analyst mc Test System

Generating Test Programs

Writing Test Programs on page 8-1

The Edit Test Screen on page 8-6

Entering Test Steps on page 9-1

CAD Data Conversion on page 10-1

CheckSum Analyst mc Test System

Installation on page 2-4

Analyst System Wiring Overview on page 2-6

Installing and Removing Fixtures on page 2-7

Connecting to the UUT on page 2-9 (fixturing)

Creating a Test Program on page 2-9

Testing an Assembly on page 2-11

Using the Operator Keypad on page 2-11

Safety and Operational Information

outlet. The system back panel has a protective ground jack.

the top. Keep fingers away from these areas.

two or more people.

provided by the equipment may be impaired.

with a soft cloth dampened with mild soap and water.

peso lo deben hacer al menos dos personas.

sistemas de proteccin puede verse reducida.

hmedo en agua con jabn neutro para limpiar la carcasa.

bewegen Sie es bitte nur mit zwei oder mehreren Personen.

der, von dem Gerat bereitgestellte Schutz, vielleicht beeintrachtigt werden.

Avertissement ou prcaution demploi

avec une broche de terre. Le systme possde

raccord une prise

2. Si lunit semble ne pas fonctionner correctement, ne pas lutiliser.

dplacer laide de 2 personnes ou plus.

gevarenzones. Houdt vingers uit deze zones.

personen zijn nodig om het te tillen of te verplaatsen.