PS-MPU-6052C-00 v1.0

InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A

+1(408) 9887339
www.invensense.com
Document Number: PS-MPU-6052C-00

Revision: 1.0
Release Date: 11/11/2014
MPU-6052C
Product Specification
Revision 1.0
1 of 40
MPU-6052C Product Specification

Revision: 1.0
TABLE OF CONTENTS
TABLE OF TABLES ..........................................................................................................................................5
1
DOCUMENT INFORMATION ......................................................................................................................6

1.1
REVISION HISTORY ..............................................................................................................................6
1.2
PURPOSE AND SCOPE ..........................................................................................................................7
1.3
PRODUCT OVERVIEW ...........................................................................................................................7
1.4
APPLICATIONS .....................................................................................................................................7
FEATURES ..................................................................................................................................................8
2.1
GYROSCOPE FEATURES .......................................................................................................................8
2.2
ACCELEROMETER FEATURES ...............................................................................................................8
2.3
ADDITIONAL FEATURES ........................................................................................................................8
2.4
MOTIONPROCESSING...........................................................................................................................8
ELECTRICAL CHARACTERISTICS ...........................................................................................................9

3.1
GYROSCOPE SPECIFICATIONS ..............................................................................................................9
3.2
ACCELEROMETER SPECIFICATIONS.....................................................................................................10
3.3
ELECTRICAL SPECIFICATIONS .............................................................................................................11
3.4
I2C TIMING CHARACTERIZATION .........................................................................................................15
3.5
SPI TIMING CHARACTERIZATION.........................................................................................................16
3.6
ABSOLUTE MAXIMUM RATINGS ...........................................................................................................18
APPLICATIONS INFORMATION ..............................................................................................................19

4.1
PIN OUT DIAGRAM AND SIGNAL DESCRIPTION .....................................................................................19
4.2
TYPICAL OPERATING CIRCUIT.............................................................................................................20
4.3
BILL OF MATERIALS FOR EXTERNAL COMPONENTS ..............................................................................20
4.4
BLOCK DIAGRAM ...............................................................................................................................21
4.5
OVERVIEW ........................................................................................................................................21
4.6
THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING................................22
4.7
THREE-AXIS MEMS ACCELEROMETER WITH 16-BIT ADCS AND SIGNAL CONDITIONING ........................22
4.8
DIGITAL MOTION PROCESSOR ............................................................................................................22
4.9
PRIMARY I2C AND SPI SERIAL COMMUNICATIONS INTERFACES............................................................22
4.10
AUXILIARY I2C SERIAL INTERFACE......................................................................................................24
4.11
CLOCKING .........................................................................................................................................25
4.12
SENSOR DATA REGISTERS .................................................................................................................26
4.13
FIFO ................................................................................................................................................26
4.14
INTERRUPTS ......................................................................................................................................26
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Revision: 1.0
4.15
DIGITAL-OUTPUT TEMPERATURE SENSOR ..........................................................................................26
4.16
BIAS AND LDOS ................................................................................................................................26
4.17
CHARGE PUMP ..................................................................................................................................26
4.18
STANDARD POWER MODES ................................................................................................................26
PROGRAMMABLE INTERRUPTS............................................................................................................28
DIGITAL INTERFACE ...............................................................................................................................29
6.1
I2C AND SPI SERIAL INTERFACES ......................................................................................................29
6.2
I2C INTERFACE..................................................................................................................................29
6.3
I2C COMMUNICATIONS PROTOCOL .....................................................................................................29
6.4
I C TERMS ........................................................................................................................................32
6.5
SPI INTERFACE .................................................................................................................................33
SERIAL INTERFACE CONSIDERATIONS ...............................................................................................34

7.1
MPU-6052C SUPPORTED INTERFACES ..............................................................................................34
ASSEMBLY ...............................................................................................................................................35
8.1
ORIENTATION OF AXES ......................................................................................................................35
8.2
PACKAGE DIMENSIONS ......................................................................................................................36
PART NUMBER PACKAGE MARKING ...................................................................................................37
10 RELIABILITY .............................................................................................................................................38
10.1
QUALIFICATION TEST POLICY .............................................................................................................38
10.2
QUALIFICATION TEST PLAN ................................................................................................................38
11 REFERENCE .............................................................................................................................................39
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Revision: 1.0
Table of Figures
Figure 1: I2C Bus Timing Diagram ...................................................................................................................15
Figure 2: SPI Bus Timing Diagram ...................................................................................................................16
Figure 3: Pin out Diagram for MPU-6052C 4x4x0.9mm QFN ..........................................................................19
Figure 4: MPU-6052C QFN Application Schematic (I2C operation) ................................................................20
Figure 5: MPU-6052C Block Diagram ..............................................................................................................21
2
Figure 6: MPU-6052C Solution Using I C Interface .........................................................................................23
Figure 7: MPU-6052C Solution Using SPI Interface ........................................................................................24
Figure 8: START and STOP Conditions ...........................................................................................................30
2
Figure 9: Acknowledge on the I C Bus .............................................................................................................30
2
Figure 10: Complete I C Data Transfer ............................................................................................................31
Figure 11: Typical SPI Master/Slave Configuration ..........................................................................................33
Figure 12: I/O Levels and Connections ............................................................................................................34
Figure 13: Orientation of Axes of Sensitivity and Polarity of Rotation ..............................................................35
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Revision: 1.0
Table of Tables
Table 1: Gyroscope Specifications .....................................................................................................................9
Table 2: Accelerometer Specifications .............................................................................................................10
Table 3: D.C. Electrical Characteristics ............................................................................................................11
Table 4: A.C. Electrical Characteristics ............................................................................................................13
Table 5: Other Electrical Specifications ............................................................................................................14
2
Table 6: I C Timing Characteristics ..................................................................................................................15
Table 7: SPI Timing Characteristics .................................................................................................................16
Table 8: fCLK = 20MHz ....................................................................................................................................17
Table 9: Absolute Maximum Ratings ................................................................................................................18
Table 10: Signal Descriptions ...........................................................................................................................19
Table 11: Bill of Materials .................................................................................................................................20
Table 12: Standard Power Modes for MPU-6052C ..........................................................................................27
Table 13: Table of Interrupt Sources ................................................................................................................28
Table 14: Serial Interface..................................................................................................................................29
2
Table 15: I C Terms ..........................................................................................................................................32
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1
1.1
Document Information
Revision History
Revision
Date
Revision
Description
11/11/2014
1.0
Initial Release
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Revision: 1.0

Revision: 1.0
1.2 Purpose and Scope

This document is a product specification, providing a description, specifications, and design related
information on the MPU-6052C MotionTracking device. The device is housed in a small 4x4x0.90mm QFN
package.
Specifications are subject to change without notice. For references to register map and descriptions of
individual registers, please refer to the MPU-6052C Register Map and Register Descriptions document.
1.3 Product Overview

The MPU-6052C is a 6-axis MotionTracking device that combines a 3-axis gyroscope, 3-axis accelerometer,
and a Digital Motion Processor (DMP) all in a small 4x4x0.9mm package. It also features a 512 byte FIFO
that can lower the traffic on the serial bus interface, and reduce power consumption by allowing the system
2
processor to burst read sensor data and then go into a low-power mode. With its dedicated I C sensor bus,
2
the MPU-6052C directly accepts inputs from external I C devices. MPU-6052C, with its 6-axis integration,
on-chip DMP, and run-time calibration firmware, enables manufacturers to eliminate the costly and complex
selection, qualification, and system level integration of discrete devices, guaranteeing optimal motion
performance for consumers. MPU-6052C is also designed to interface with multiple non-inertial digital
2
sensors, such as pressure sensors, on its auxiliary I C port.
The gyroscope has a programmable full-scale range of 250, 500, 1000, and 2000 degrees/sec and very
low rate noise at 0.01 dps/Hz. The accelerometer has a user-programmable accelerometer full-scale range
of 2g, 4g, 8g, and 16g. Factory-calibrated initial sensitivity of both sensors reduces production-line
calibration requirements.
Other industry-leading features include on-chip 16-bit ADCs, programmable digital filters, a precision clock
with 1% drift from -40C to 85C, an embedded temperature sensor, and programmable interrupts. The
2
device features I C and SPI serial interfaces, a VDD operating range of 1.71 to 3.6V, and a separate digital
IO supply, VDDIO from 1.71V to 3.6V.
2
Communication with all registers of the device is performed using either I C at 400kHz or SPI at 1MHz. For
applications requiring faster communications, the sensor and interrupt registers may be read using SPI at
20MHz.
By leveraging its patented and volume-proven CMOS-MEMS Fabrication platform, which integrates MEMS
wafers with companion CMOS electronics through wafer-level bonding, InvenSense has driven the package
size down to a footprint and thickness of 4x4x0.9mm (24-pin QFN), to provide a very small yet high
performance low cost package. The device provides high robustness by supporting 10,000g shock reliability.
1.4
Applications
TouchAnywhere technology (for no touch UI Application Control/Navigation)
MotionCommand technology (for Gesture Short-cuts)
Motion-enabled game and application framework
Location based services, points of interest, and dead reckoning
Handset and portable gaming
Motion-based game controllers
3D remote controls for Internet connected DTVs and set top boxes, 3D mice
Wearable sensors for health, fitness and sports
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Features
2.1 Gyroscope Features

The triple-axis MEMS gyroscope in the MPU-6052C includes a wide range of features:
Digital-output X-, Y-, and Z-axis angular rate sensors (gyroscopes) with a user-programmable fullscale range of 250, 500, 1000, and 2000/sec and integrated 16-bit ADCs
Digitally-programmable low-pass filter
Factory calibrated sensitivity scale factor
2.2 Accelerometer Features

The triple-axis MEMS accelerometer in MPU-6052C includes a wide range of features:
Digital-output X-, Y-, and Z-axis accelerometer with a programmable full scale range of 2g, 4g,
8g and 16g and integrated 16-bit ADCs
User-programmable interrupts
2.3 Additional Features

The MPU-6052C includes the following additional features:
2.4
Auxiliary master I C bus for reading data from external sensors (e.g. magnetometer)
VDD supply voltage range of 1.8 3.3V 5%
2
VDDIO reference voltage of 1.8 3.3V 5% for auxiliary I C devices
Minimal cross-axis sensitivity between the accelerometer and gyroscope axes
512 byte FIFO buffer enables the applications processor to read the data in bursts
Digital-output temperature sensor
User-programmable digital filters for gyroscope, accelerometer, and temp sensor
10,000 g shock tolerant
2
400kHz Fast Mode I C for communicating with all registers
1MHz SPI serial interface for communicating with all registers
20MHz SPI serial interface for reading sensor and interrupt registers
MEMS structure hermetically sealed and bonded at wafer level
RoHS and Green compliant
MotionProcessing
Internal Digital Motion Processing (DMP) engine supports advanced MotionProcessing and low
power functions such as gesture recognition using programmable interrupts
In addition to the angular rate, this device optionally outputs the angular position (angle).
Low-power pedometer functionality allows the host processor to sleep while the DMP maintains the
step count.
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Revision: 1.0
Electrical Characteristics
3.1 Gyroscope Specifications

Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, TA=25C, unless otherwise noted.
PARAMETER
GYROSCOPE SENSITIVITY
Full-Scale Range
CONDITIONS
FS_SEL=0
FS_SEL=1
FS_SEL=2
FS_SEL=3
Gyroscope ADC Word Length

Sensitivity Scale Factor
Sensitivity Scale Factor Tolerance

Sensitivity Scale Factor Variation Over
Temperature
Nonlinearity
Cross-Axis Sensitivity
GYROSCOPE ZERO-RATE OUTPUT (ZRO)
Initial ZRO Tolerance
ZRO Variation Over Temperature
Power-Supply Sensitivity (1-10Hz)
Power-Supply Sensitivity (10 - 250Hz)
Power-Supply Sensitivity (250Hz - 100kHz)
Linear Acceleration Sensitivity
GYROSCOPE NOISE PERFORMANCE
Total RMS Noise
GYROSCOPE MECHANICAL
FREQUENCIES
LOW PASS FILTER RESPONSE
MIN
FS_SEL=0
FS_SEL=1
FS_SEL=2
FS_SEL=3
25C
0C to +55C
-6
TYP
250
500
1000
2000
16
131
65.5
32.8
16.4
2
10
MAX
+6
UNITS
/s
/s
/s
/s
bits
LSB/(/s)
LSB/(/s)
LSB/(/s)
LSB/(/s)
%
%
Best fit straight line; 25C
0.2
2
%
%
25C
0C to +55C
Sine wave, 100mVpp; VDD=2.5V
Static
FS_SEL=0
DLPFCFG=2 (100Hz)
60
40
0.2
0.2
4
0.1
/s
/s
/s
/s
/s
/s/g
25
0.7
27
29
/s-rms
kHz
Programmable Range
250
Hz
Programmable
DLPFCFG=0
to 1/s of Final
8,000
Hz
OUTPUT DATA RATE

GYROSCOPE START-UP TIME
ZRO Settling
50
Table 1: Gyroscope Specifications
9 of 40
ms
NOTES

Revision: 1.0
3.2 Accelerometer Specifications

PARAMETER
ACCELEROMETER SENSITIVITY
Full-Scale Range
ADC Word Length

Sensitivity Scale Factor
Initial Calibration Tolerance

Sensitivity Change vs. Temperature
Nonlinearity
Cross-Axis Sensitivity
ZERO-G OUTPUT
Initial Calibration Tolerance1
Zero-G Level Change vs. Temperature
NOISE PERFORMANCE
Power Spectral Density
LOW PASS FILTER RESPONSE
CONDITIONS
MIN
AFS_SEL=0
AFS_SEL=1
AFS_SEL=2
AFS_SEL=3
Output in twos complement format
AFS_SEL=0
AFS_SEL=1
AFS_SEL=2
AFS_SEL=3
TYP
MAX
2
4
8
16
16
16,384
8,192
4,096
2,048
3
0.02
0.5
2
AFS_SEL=0, -40C to +85C

Best Fit Straight Line
UNITS
g
g
g
g
bits
LSB/g
LSB/g
LSB/g
LSB/g
%
%/C
%
%
X and Y axes
Z axis
X and Y axes, 0C to +70C
Z axis, 0C to +70C
80
200
60
150
mg
mg
@10Hz, AFS_SEL=0 & ODR=1kHz
400
g/Hz
mg
Programmable Range
5.05
218.1
Hz
Programmable Range
1,000
Hz
OUTPUT DATA RATE
Table 2: Accelerometer Specifications
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NOTES
3.3

Revision: 1.0
Electrical Specifications
3.3.1
D.C. Electrical Characteristics
PARAMETER
CONDITIONS
MIN
TYP
MAX
Units
Notes
VDD
1.71
1.8
3.45
VDDIO
1.71
1.8
3.45
SUPPLY VOLTAGES
SUPPLY CURRENTS
Normal Mode
Accelerometer Low Power Mode
6-axis
3.4
mA
3-axis Gyroscope
3.2
mA
3-Axis Accelerometer, 4kHz ODR
450
0.98 Hz update rate
7.27
1,2
31.25 Hz update rate
18.65
1,2
1.6
6
mA
A
1
1
Standby Mode
Full-Chip Sleep Mode
TEMPERATURE RANGE
Specified Temperature Range
Performance parameters are not applicable

beyond Specified Temperature Range
-40
+85
Table 3: D.C. Electrical Characteristics

Notes:
1. Derived from validation or characterization of parts, not guaranteed in production.
2. Accelerometer Low Power Mode supports the following output data rates (ODRs): 0.24, 0.49, 0.98,
1.95, 3.91, 7.81, 15.63, 31.25, 62.50, 125, 250, 500Hz. Supply current for any update rate can be
calculated as:
a. Supply Current in A = 6.9 + Update Rate * 0.376
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Revision: 1.0
3.3.2
A.C. Electrical Characteristics
Parameter
Conditions
MIN
TYP
MAX
Units
100
ms
85
NOTES
SUPPLIES
Supply Ramp Time
Monotonic ramp. Ramp rate

is 10% to 90% of the final
value
Operating Range
Ambient
Sensitivity
Untrimmed
Room Temp Offset
21C
0.1
TEMPERATURE SENSOR
-40
333.87
LSB/C
LSB
Power-On RESET
Supply Ramp Time (TRAMP)
Valid power-on RESET
Start-up time for register read/write
From power-up
I2C ADDRESS
AD0 = 0
AD0 = 1
0.01
20
100
ms
11
100
ms
0.3*VDDIO
V
V
pF
1101000
1101001
DIGITAL INPUTS (FSYNC, AD0, SCLK, SDI, CS)

VIH, High Level Input Voltage
VIL, Low Level Input Voltage
CI, Input Capacitance
0.7*VDDIO
< 10
DIGITAL OUTPUT (SDO, INT)
VOH, High Level Output Voltage

VOL1, LOW-Level Output Voltage
VOL.INT1, INT Low-Level Output Voltage
Output Leakage Current
tINT, INT Pulse Width
RLOAD=1M;
RLOAD=1M;
0.9*VDDIO
0.1*VDDIO
0.1
OPEN=1, 0.3mA sink

Current
OPEN=1
LATCH_INT_EN=0
100
50
V
V
V
nA
s
I2C I/O (SCL, SDA)

VIL, LOW Level Input Voltage
VIH, HIGH-Level Input Voltage
Vhys, Hysteresis
VOL, LOW-Level Output Voltage
IOL, LOW-Level Output Current
tof, Output Fall Time from VIHmax to VILmax
-0.5V
0.7*VDDIO
0.3*VDDIO
VDDIO +
0.5V
0.1*VDDIO
3mA sink current

VOL=0.4V
VOL=0.6V
Cb bus capacitance in pf
0.4
3
6
100
20+0.1Cb
250
V
V
V
V
mA
mA
nA
ns
AUXILLIARY I/O (AUX_CL, AUX_DA)

VIL, LOW-Level Input Voltage
VIH, HIGH-Level Input Voltage
Vhys, Hysteresis
-0.5V
0.7* VDDIO
0.3*VDDIO
VDDIO +
0.5V
0.1* VDDIO
VDDIO > 2V; 1mA sink

current
12 of 40
0.4
V
V
V
V

Revision: 1.0
Parameter
IOL, LOW-Level Output Current
tof, Output Fall Time from VIHmax to VILmax
Conditions
VDDIO < 2V; 1mA sink
current
VOL
=
0.4V
VOL = 0.6V
Cb bus capacitance in pF
MIN
0
TYP
MAX
0.2* VDDIO
Units
V
250
mA
mA
nA
ns
3
6
100
20+0.1Cb
NOTES
INTERNAL CLOCK SOURCE
Sample Rate
Clock Frequency Initial Tolerance

Frequency Variation over Temperature
Fchoice=0,1,2
SMPLRT_DIV=0
Fchoice=3;
DLPFCFG=0 or 7
SMPLRT_DIV=0
Fchoice=3;
DLPFCFG=1,2,3,4,5,6;
SMPLRT_DIV=0
CLK_SEL=0, 6; 25C
CLK_SEL=1,2,3,4,5; 25C
CLK_SEL=0,6
CLK_SEL=1,2,3,4,5
32
kHz
kHz
kHz
%
%
%
%
1
1
1
1
-2
-1
-10
+2
+1
+10
1
Table 4: A.C. Electrical Characteristics

Notes:
2. Guaranteed by design.
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Revision: 1.0
3.3.3
Other Electrical Specifications
PARAMETER
CONDITIONS
MIN
TYP
MAX
Units
Notes
SERIAL INTERFACE
SPI Operating Frequency, All
Registers Read/Write
Low Speed Characterization

High Speed Characterization
SPI Operating Frequency, Sensor

and Interrupt Registers Read Only
I2C Operating Frequency
100
10%
1 10%
kHz
MHz
20 10%
MHz
kHz
kHz
1
1
All registers, Fast-mode

All registers, Standard-mode
400
100
Table 5: Other Electrical Specifications

Notes:
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Revision: 1.0
3.4
I2C Timing Characterization
Parameters
I2C TIMING
fSCL, SCL Clock Frequency
tHD.STA, (Repeated) START Condition Hold
Time
tLOW, SCL Low Period
tHIGH, SCL High Period
tSU.STA, Repeated START Condition Setup
Time
tHD.DAT, SDA Data Hold Time
tSU.DAT, SDA Data Setup Time
tr, SDA and SCL Rise Time
tf, SDA and SCL Fall Time
tSU.STO, STOP Condition Setup Time
Conditions
I2C FAST-MODE
Min
Cb bus cap. from 10 to 400pF

Cb bus cap. from 10 to 400pF
tBUF, Bus Free Time Between STOP and

START Condition
Cb, Capacitive Load for each Bus Line
tVD.DAT, Data Valid Time
tVD.ACK, Data Valid Acknowledge Time
Typical
Max
Units
400
0.6
kHz
s
Notes
1
2
2
1.3
0.6
0.6
s
s
s
2
2
2
0
100
20+0.1Cb
20+0.1Cb
0.6
s
ns
ns
ns
s
2
2
2
2
2
pF
s
s
2
2
2
300
300
1.3
< 400
0.9
0.9
2
Table 6: I C Timing Characteristics

Notes:
1.
2.
Timing Characteristics apply to both Primary and Auxiliary I2C Bus

Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in sockets
Figure 1: I2C Bus Timing Diagram
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3.5

Revision: 1.0
SPI Timing Characterization
Parameters
Conditions
Min
Typical
Max
Units
Notes
MHz
SPI TIMING
fSCLK, SCLK Clock Frequency
tLOW, SCLK Low Period
400
ns
tHIGH, SCLK High Period
400
ns
tSU.CS, CS Setup Time
ns
tHD.CS, CS Hold Time
500
ns
tSU.SDI, SDI Setup Time
11
ns
ns
ns
ns
ns
tHD.SDI, SDI Hold Time
tVD.SDO, SDO Valid Time
Cload = 20pF
tHD.SDO, SDO Hold Time
Cload = 20pF
100
4
tDIS.SDO, SDO Output Disable Time
50
Table 7: SPI Timing Characteristics

Notes:
1.
Figure 2: SPI Bus Timing Diagram
3.5.1
fSCLK = 20MHz
Parameters
Conditions
Min
Typical
Max
Units
Notes
0.9
20
MHz
tLOW, SCLK Low Period
ns
tHIGH, SCLK High Period
ns
tSU.CS, CS Setup Time
ns
tHD.CS, CS Hold Time
ns
SPI TIMING
fSCLK, SCLK Clock Frequency
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Revision: 1.0
tSU.SDI, SDI Setup Time
ns
tHD.SDI, SDI Hold Time
ns
ns
ns
tVD.SDO, SDO Valid Time
Cload = 20pF
25
tDIS.SDO, SDO Output Disable Time
25
Table 8: fCLK = 20MHz

Notes:
1.
17 of 40
3.6

Revision: 1.0
Absolute Maximum Ratings
Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device.
These are stress ratings only and functional operation of the device at these conditions is not implied.
Exposure to the absolute maximum ratings conditions for extended periods may affect device reliability.
Parameter
Rating
Supply Voltage, VDD
-0.5V to +4V
Supply Voltage, VDDIO
-0.5V to +4V
REGOUT
-0.5V to 2V
Input Voltage Level (AUX_DA, AD0, FSYNC, INT, SCL, SDA)
-0.5V to VDD + 0.5V
Acceleration (Any Axis, unpowered)
10,000g for 0.2ms
Operating Temperature Range
-40C to +105C
Storage Temperature Range
-40C to +125C
2kV (HBM);
Electrostatic Discharge (ESD) Protection
250V (MM)
Latch-up
JEDEC Class II (2),125C, 100mA
Table 9: Absolute Maximum Ratings
18 of 40
Pin Out Diagram and Signal Description

Pin Number
Pin Name
AUX_DA
I2C master serial data, for connecting to external sensors
Pin Description
AUX_CL
I2C Master serial clock, for connecting to external sensors
VDDIO
AD0 / SDO
10
REGOUT
11
FSYNC
12
INT
Interrupt digital output (totem pole or open-drain)
13
VDD
Power supply voltage
18
GND
Power supply ground
19, 20, 21
RESV
Reserved. Do not connect.
22
RESV / nCS
Reserved in I2C mode. Blue Wire to VDDIO; Chip select (SPI mode only)
23
SCL / SCLK
I2C serial clock (SCL); SPI serial clock (SCLK)
24
SDA / SDI
1, 2, 3, 4, 5,
14, 15, 16, 17
NC
Digital I/O supply voltage

I2C Slave Address LSB (AD0); SPI serial data output (SDO)
Regulator filter capacitor connection
Frame synchronization digital input. Connect to GND if unused.
I2C serial data (SDA); SPI serial data input (SDI)

No Connect pins. Do not connect.
SDA / SDI
SCL / SCLK
RESV / nCS
RESV
RESV
RESV
24
23
22
21
20
19
Table 10: Signal Descriptions
NC
18 GND
NC
17 NC
NC
NC
15 NC
NC
14 NC
AUX_DA
13 VDD
16 NC
10
11
12
FSYNC
INT
9
SDO / AD0
REGOUT
8
VDDIO
MPU-6052C
4.1
Applications Information
AUX_CL

Revision: 1.0
Figure 3: Pin out Diagram for MPU-6052C 4x4x0.9mm QFN
19 of 40

Revision: 1.0
4.2
Typical Operating Circuit
RESV
RESV
19
20
21 RESV
22
SCL / SCLK
23
SDA / SDI
24
RESV/nCS
VDDIO
SCL
SDA
GND
NC
18
NC
17 NC
16 NC
NC
NC
15 NC
NC
14 NC
13 VDD
MPU-6052C
12
1.8 3.3VDC
C2, 0.1 F
INT
11
FSYNC
REGOUT 10
8
VDDIO
C3, 10 nF
SDO / AD0
1.8 3.3VDC
AUX_CL
AUX_DA
C1, 0.1 F
AD0
Figure 4: MPU-6052C QFN Application Schematic (I2C operation)
4.3
Bill of Materials for External Components

Component
Label
Specification
Quantity
Regulator Filter Capacitor
C1
Ceramic, X7R, 0.1F 10%, 2V
VDD Bypass Capacitor
C2
Ceramic, X7R, 0.1F 10%, 4V
VDDIO Bypass Capacitor
C3
Ceramic, X7R, 10nF 10%, 4V
Table 11: Bill of Materials
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Revision: 1.0
4.4
Block Diagram
MPU-6052C
X Accel
ADC
Y Accel
ADC
INT
Interrupt
Status
Register
nCS
Slave I2C and
SPI Serial
Interface
FIFO
AD0 / SDO
SCL / SCLK
SDA / SDI
ADC
X Gyro
ADC
Y Gyro
Z Gyro
Temp Sensor
Signal Conditioning
Z Accel
User & Config

Registers
Serial
Interface
Bypass
Mux
Master I2C
Serial
Interface
Sensor
Registers
Digital Motion
Processor
(DMP)
ADC
ADC
Bias & LDOs
VDD
GND
REGOUT
Figure 5: MPU-6052C Block Diagram
Overview
The MPU-6052C is comprised of the following key blocks and functions:
AUX_DA
FSYNC
ADC
Charge
Pump
4.5
AUX_CL
Three-axis MEMS rate gyroscope sensor with 16-bit ADCs and signal conditioning
Three-axis MEMS accelerometer sensor with 16-bit ADCs and signal conditioning
Digital Motion Processor (DMP) engine
2
Primary I C and SPI serial communications interfaces
2
Auxiliary I C serial interface
Clocking
Sensor Data Registers
FIFO
Interrupts
Digital-Output Temperature Sensor
Bias and LDOs
Charge Pump
Standard Power Modes
21 of 40
4.6

Revision: 1.0
Three-Axis MEMS Gyroscope with 16-bit ADCs and Signal Conditioning
The MPU-6052C consists of three independent vibratory MEMS rate gyroscopes, which detect rotation about
the X-, Y-, and Z- Axes. When the gyros are rotated about any of the sense axes, the Coriolis Effect causes
a vibration that is detected by a capacitive pickoff. The resulting signal is amplified, demodulated, and filtered
to produce a voltage that is proportional to the angular rate. This voltage is digitized using individual on-chip
16-bit Analog-to-Digital Converters (ADCs) to sample each axis. The full-scale range of the gyro sensors
may be digitally programmed to 250, 500, 1000, or 2000 degrees per second (dps). The ADC sample
rate is programmable from 8,000 samples per second, down to 3.9 samples per second, and user-selectable
low-pass filters enable a wide range of cut-off frequencies.
4.7
Three-Axis MEMS Accelerometer with 16-bit ADCs and Signal Conditioning
The MPU-6052Cs 3-Axis accelerometer uses separate proof masses for each axis. Acceleration along a
particular axis induces displacement on the corresponding proof mass, and capacitive sensors detect the
displacement differentially. The MPU-6052Cs architecture reduces the accelerometers susceptibility to
fabrication variations as well as to thermal drift. When the device is placed on a flat surface, it will measure
0g on the X- and Y-axes and +1g on the Z-axis. The accelerometers scale factor is calibrated at the factory
and is nominally independent of supply voltage. Each sensor has a dedicated sigma-delta ADC for providing
digital outputs. The full scale range of the digital output can be adjusted to 2g, 4g, 8g, or 16g.
4.8
Digital Motion Processor
The embedded Digital Motion Processor (DMP) within the MPU-6052C offloads computation of motion
processing algorithms from the host processor. The DMP acquires data from accelerometers, gyroscopes,
rd
and additional 3 party sensors such as magnetometers, and processes the data. The resulting data can be
read from the FIFO. The DMP has access to one of the MPUs external pins, which can be used for
generating interrupts.
The purpose of the DMP is to offload both timing requirements and processing power from the host
processor. Typically, motion processing algorithms should be run at a high rate, often around 200Hz, in order
to provide accurate results with low latency. This is required even if the application updates at a much lower
rate; for example, a low power user interface may update as slowly as 5Hz, but the motion processing should
still run at 200Hz. The DMP can be used to minimize power, simplify timing, simplify the software
architecture, and save valuable MIPS on the host processor for use in applications.
The DMP supports the following functionality:
4.9
Low Power Quaternion (3-Axis Gyroscope)

Screen Orientation (A low-power implementation of Androids screen rotation algorithm)
Pedometer (InvenSense implementation)
Primary I2C and SPI Serial Communications Interfaces
2
The MPU-6052C communicates to a system processor using either a SPI or an I C serial interface. The
2
MPU-6052C always acts as a slave when communicating to the system processor. The LSB of the of the I C
slave address is set by pin 9 (AD0).
4.9.1
MPU-6052C Solution Using I2C Interface

2
In the figure below, the system processor is an I C master to the MPU-6052C. In addition, the MPU-6052C is
2
2
an I C master to the optional external compass sensor. The MPU-6052C has limited capabilities as an I C
Master, and depends on the system processor to manage the initial configuration of any auxiliary sensors.
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Revision: 1.0
The MPU-6052C has an interface bypass multiplexer, which connects the system processor I C bus pins 23
2
and 24 (SDA and SCL) directly to the auxiliary sensor I C bus pins 6 and 7 (AUX_DA and AUX_CL).
Once the auxiliary sensors have been configured by the system processor, the interface bypass multiplexer
2
2
should be disabled so that the MPU-6052C auxiliary I C master can take control of the sensor I C bus and
gather data from the auxiliary sensors.
2
For further information regarding I C master control, please refer to section 6.
Interrupt
Status
Register
I2C Processor Bus: for reading all

sensor data from MPU and for
configuring external sensors (i.e.
compass in this example)
INT
MPU-6052C
AD0
Slave I2C
or SPI
Serial
Interface
VDD or GND
SCL
SCL
SDA/SDI
SDA
FIFO
Sensor I2C Bus: for
configuring and reading
from external sensors
User & Config

Registers
Optional
Sensor
Master I2C
Serial
Interface
Sensor
Register
Interface
Bypass
Mux
AUX_CL
SCL
AUX_DA
SDA
Compass
Factory
Calibration
Digital
Motion
Processor
(DMP)
Interface bypass mux allows
direct configuration of
compass by system processor
Bias & LDOs
VDD
GND
REGOUT
Figure 6: MPU-6052C Solution Using I C Interface
23 of 40
System
Processor
4.9.2

Revision: 1.0
MPU-6052C Solution Using SPI Interface
In the figure below, the system processor is an SPI master to the MPU-6052C. Pins 8, 9, 23, and 24 are
used to support the CS, SDO, SCLK, and SDI signals for SPI communications. Because these SPI pins are
2
2
shared with the I C slave pins (9, 23 and 24), the system processor cannot access the auxiliary I C bus
2
2
through the interface bypass multiplexer, which connects the processor I C interface pins to the sensor I C
2
interface pins. Since the MPU-6052C has limited capabilities as an I C Master, and depends on the system
processor to manage the initial configuration of any auxiliary sensors, another method must be used for
2
programming the sensors on the auxiliary sensor I C bus pins 6 and 7 (AUX_DA and AUX_CL).
When using SPI communications between the MPU-6052C and the system processor, configuration of
2
2
devices on the auxiliary I C sensor bus can be achieved by using I C Slaves 0-4 to perform read and write
2
2
transactions on any device and register on the auxiliary I C bus. The I C Slave 4 interface can be used to
perform only single byte read and write transactions. Once the external sensors have been configured, the
2
MPU-6052C can perform single or multi-byte reads using the sensor I C bus. The read results from the Slave
0-3 controllers can be written to the FIFO buffer as well as to the external sensor registers.
2
For further information regarding the control of the MPU-6052Cs auxiliary I C interface, please refer to the
MPU-6052C Register Map and Register Descriptions document.
Processor SPI Bus: for reading all
data from MPU and for configuring
MPU and external sensors
Interrupt
Status
Register
INT
nCS
nCS
MPU-6052C
SDO
Slave I2C
or SPI
Serial
Interface
SDI
SCLK
SCLK
SDI
System
Processor
SDO
FIFO
2
Sensor I C Bus: for

configuring and
reading data from
external sensors
Config
Register
Optional
Sensor
Master I2C
Serial
Interface
Sensor
Register
Interface
Bypass
Mux
AUX_CL
SCL
AUX_DA
SDA
Compass
Factory
Calibration
Digital
Motion
Processor
(DMP)
I2C Master performs

read and write
transactions on
Sensor I2C bus.
Bias & LDOs
VDD
GND
REGOUT
Figure 7: MPU-6052C Solution Using SPI Interface
4.10 Auxiliary I2C Serial Interface

2
The MPU-6052C has an auxiliary I C bus for communicating to an off-chip 3-Axis digital output
magnetometer or other sensors. This bus has two operating modes:
I C Master Mode: The MPU-6052C acts as a master to any external sensors connected to the
2
auxiliary I C bus
2
Pass-Through Mode: The MPU-6052C directly connects the primary and auxiliary I C buses
together, allowing the system processor to directly communicate with any external sensors.
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Revision: 1.0
Auxiliary I C Bus Modes of Operation:
I C Master Mode: Allows the MPU-6052C to directly access the data registers of external digital
sensors, such as a magnetometer. In this mode, the MPU-6052C directly obtains data from auxiliary
sensors without intervention from the system applications processor.
2
For example, In I C Master mode, the MPU-6052C can be configured to perform burst reads,
returning the following data from a magnetometer:
X magnetometer data (2 bytes)
Y magnetometer data (2 bytes)
Z magnetometer data (2 bytes)
2
The I C Master can be configured to read up to 24 bytes from up to 4 auxiliary sensors. A fifth sensor
can be configured to work single byte read/write mode.
Pass-Through Mode: Allows an external system processor to act as master and directly
2
communicate to the external sensors connected to the auxiliary I C bus pins (AUX_DA and
2
rd
AUX_CL). In this mode, the auxiliary I C bus control logic (3 party sensor interface block) of the
2
MPU-6052C is disabled, and the auxiliary I C pins AUX_DA and AUX_CL (Pins 6 and 7) are
2
connected to the main I C bus (Pins 23 and 24) through analog switches internally.
Pass-Through mode is useful for configuring the external sensors, or for keeping the MPU-6052C in
a low-power mode when only the external sensors are used. In this mode the system processor can
2
still access MPU-6052C data through the I C interface.
4.11 Clocking
The MPU-6052C has a flexible clocking scheme, allowing a variety of internal clock sources to be used for
the internal synchronous circuitry. This synchronous circuitry includes the signal conditioning and ADCs, the
DMP, and various control circuits and registers. An on-chip PLL provides flexibility in the allowable inputs for
generating this clock.
Allowable internal sources for generating the internal clock are:
An internal relaxation oscillator

Any of the X, Y, or Z gyros (MEMS oscillators with a variation of 1% over temperature)
Selection of the source for generating the internal synchronous clock depends on the requirements for power
consumption and clock accuracy. These requirements will most likely vary by mode of operation. For
example, in one mode, where the biggest concern is power consumption, the user may wish to operate the
Digital Motion Processor of the MPU-6052C to process accelerometer data, while keeping the gyros off. In
this case, the internal relaxation oscillator is a good clock choice. However, in another mode, where the
gyros are active, selecting the gyros as the clock source provides for a more accurate clock source.
Clock accuracy is important, since timing errors directly affect the distance and angle calculations performed
by the Digital Motion Processor (and by extension, by any processor).
There are also start-up conditions to consider. When the MPU-6052C first starts up, the device uses its
internal clock until programmed to operate from another source. This allows the user, for example, to wait
for the MEMS oscillators to stabilize before they are selected as the clock source.
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Revision: 1.0
4.12 Sensor Data Registers

The sensor data registers contain the latest gyro, accelerometer, auxiliary sensor, and temperature
measurement data. They are read-only registers, and are accessed via the serial interface. Data from these
registers may be read anytime.
4.13 FIFO
The MPU-6052C contains a 512 byte FIFO register that is accessible via the Serial Interface. The FIFO
configuration register determines which data is written into the FIFO. Possible choices include gyro data,
accelerometer data, temperature readings, auxiliary sensor readings, and FSYNC input. A FIFO counter
keeps track of how many bytes of valid data are contained in the FIFO. The FIFO register supports burst
reads. The interrupt function may be used to determine when new data is available.
For further information regarding the FIFO, please refer to the MPU-6052C Register Map and Register
Descriptions document.
4.14 Interrupts
Interrupt functionality is configured via the Interrupt Configuration register. Items that are configurable include
the INT pin configuration, the interrupt latching and clearing method, and triggers for the interrupt. Items that
can trigger an interrupt are (1) Clock generator locked to new reference oscillator (used when switching clock
sources); (2) new data is available to be read (from the FIFO and Data registers); (3) accelerometer event
interrupts; and (4) the MPU-6052C did not receive an acknowledge from an auxiliary sensor on the
2
secondary I C bus. The interrupt status can be read from the Interrupt Status register.
For further information regarding interrupts, please refer to the MPU-6052C Register Map and Register
Descriptions document.
4.15 Digital-Output Temperature Sensor

An on-chip temperature sensor and ADC are used to measure the MPU-6052C die temperature.
readings from the ADC can be read from the FIFO or the Sensor Data registers.
The
4.16 Bias and LDOs

The bias and LDO section generates the internal supply and the reference voltages and currents required by
the MPU-6052C. Its two inputs are an unregulated VDD and a VDDIO logic reference supply voltage. The
LDO output is bypassed by a capacitor at REGOUT. For further details on the capacitor, please refer to the
Bill of Materials for External Components.
4.17 Charge Pump

An on-chip charge pump generates the high voltage required for the MEMS oscillators.
4.18 Standard Power Modes

The following table lists the user-accessible power modes for MPU-6052C.
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Revision: 1.0
Mode
Name
Gyro
Accel
DMP
Sleep Mode
Off
Off
Off
Standby Mode
Drive On
Off
Off
Low-Power Accelerometer Mode
Off
Duty-Cycled
Off
Low-Noise Accelerometer Mode
Off
On
Off
Gyroscope Mode
On
Off
On or Off
6-Axis Mode
On
On
On or Off
Table 12: Standard Power Modes for MPU-6052C

Notes:
1. Power consumption for individual modes can be found in section 3.3.1.
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Revision: 1.0
Programmable Interrupts
The MPU-6052C has a programmable interrupt system which can generate an interrupt signal on the INT
pin. Status flags indicate the source of an interrupt. Interrupt sources may be enabled and disabled
individually.
Interrupt Name
Module
Motion Detection
Motion
FIFO Overflow
FIFO
Data Ready
Sensor Registers
I2C Master errors: Lost Arbitration, NACKs
I2C Master
I2C Slave 4
I2C Master
Table 13: Table of Interrupt Sources
For information regarding the interrupt enable/disable registers and flag registers, please refer to the MPU6052C Register Map and Register Descriptions document. Some interrupt sources are explained below.
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Revision: 1.0
Digital Interface
6.1
I2C and SPI Serial Interfaces

2
The internal registers and memory of the MPU-6052C can be accessed using either I C at 400 kHz or SPI at
1MHz. SPI operates in four-wire mode.
Pin Number
Pin Name
VDDIO
Pin Description
AD0 / SDO
I2C Slave Address LSB (AD0); SPI serial data output (SDO)
23
SCL / SCLK
I2C serial clock (SCL); SPI serial clock (SCLK)
24
SDA / SDI
Digital I/O supply voltage.
I2C serial data (SDA); SPI serial data input (SDI)
Table 14: Serial Interface
Note:
2
To prevent switching into I C mode when using SPI, the I C interface should be disabled by setting the
I2C_IF_DIS configuration bit. Setting this bit should be performed immediately after waiting for the time
specified by the Start-Up Time for Register Read/Write in Section 6.3.
For further information regarding the I2C_IF_DIS bit, please refer to the MPU-6052C Register Map and
Register Descriptions document.
6.2
I2C Interface
I C is a two-wire interface comprised of the signals serial data (SDA) and serial clock (SCL). In general, the
2
lines are open-drain and bi-directional. In a generalized I C interface implementation, attached devices can
be a master or a slave. The master device puts the slave address on the bus, and the slave device with the
matching address acknowledges the master.
The MPU-6052C always operates as a slave device when communicating to the system processor, which
thus acts as the master. SDA and SCL lines typically need pull-up resistors to VDD. The maximum bus
speed is 400 kHz.
The slave address of the MPU-6052C is b110100X which is 7 bits long. The LSB bit of the 7 bit address is
2
determined by the logic level on pin AD0. This allows two MPU-6052Cs to be connected to the same I C bus.
When used in this configuration, the address of the one of the devices should be b1101000 (pin AD0 is logic
low) and the address of the other should be b1101001 (pin AD0 is logic high).
6.3
I2C Communications Protocol
START (S) and STOP (P) Conditions

2
Communication on the I C bus starts when the master puts the START condition (S) on the bus, which is
defined as a HIGH-to-LOW transition of the SDA line while SCL line is HIGH (see figure below). The bus is
considered to be busy until the master puts a STOP condition (P) on the bus, which is defined as a LOW to
HIGH transition on the SDA line while SCL is HIGH (see figure below).
Additionally, the bus remains busy if a repeated START (Sr) is generated instead of a STOP condition.
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Revision: 1.0
SDA
SCL
S
START condition
STOP condition
Figure 8: START and STOP Conditions
Data Format / Acknowledge

2
I C data bytes are defined to be 8-bits long. There is no restriction to the number of bytes transmitted per
data transfer. Each byte transferred must be followed by an acknowledge (ACK) signal. The clock for the
acknowledge signal is generated by the master, while the receiver generates the actual acknowledge signal
by pulling down SDA and holding it low during the HIGH portion of the acknowledge clock pulse.
If a slave is busy and cannot transmit or receive another byte of data until some other task has been
performed, it can hold SCL LOW, thus forcing the master into a wait state. Normal data transfer resumes
when the slave is ready, and releases the clock line (refer to the following figure).
DATA OUTPUT BY
TRANSMITTER (SDA)
not acknowledge
DATA OUTPUT BY
RECEIVER (SDA)
acknowledge
SCL FROM
MASTER
clock pulse for

acknowledgement
START
condition
2
Figure 9: Acknowledge on the I C Bus
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Revision: 1.0
Communications
After beginning communications with the START condition (S), the master sends a 7-bit slave address
th
followed by an 8 bit, the read/write bit. The read/write bit indicates whether the master is receiving data from
or is writing to the slave device. Then, the master releases the SDA line and waits for the acknowledge
signal (ACK) from the slave device. Each byte transferred must be followed by an acknowledge bit. To
acknowledge, the slave device pulls the SDA line LOW and keeps it LOW for the high period of the SCL line.
Data transmission is always terminated by the master with a STOP condition (P), thus freeing the
communications line. However, the master can generate a repeated START condition (Sr), and address
another slave without first generating a STOP condition (P). A LOW to HIGH transition on the SDA line while
SCL is HIGH defines the stop condition. All SDA changes should take place when SCL is low, with the
exception of start and stop conditions.
SDA
SCL
17
17
17
START ADDRESS
condition
R/W
ACK
DATA
ACK
DATA
ACK
STOP
condition
Figure 10: Complete I C Data Transfer

2
To write the internal MPU-6052C registers, the master transmits the start condition (S), followed by the I C
th
address and the write bit (0). At the 9 clock cycle (when the clock is high), the MPU-6052C acknowledges
the transfer. Then the master puts the register address (RA) on the bus. After the MPU-6052C acknowledges
the reception of the register address, the master puts the register data onto the bus. This is followed by the
ACK signal, and data transfer may be concluded by the stop condition (P). To write multiple bytes after the
last ACK signal, the master can continue outputting data rather than transmitting a stop signal. In this case,
the MPU-6052C automatically increments the register address and loads the data to the appropriate register.
The following figures show single and two-byte write sequences.
Single-Byte Write Sequence

Master
AD+W
Slave
RA
ACK
DATA
ACK
P
ACK
Burst Write Sequence

Master
Slave
AD+W
RA
ACK
DATA
ACK
DATA
ACK
31 of 40
P
ACK

Revision: 1.0
To read the internal MPU-6052C registers, the master sends a start condition, followed by the I C address
and a write bit, and then the register address that is going to be read. Upon receiving the ACK signal from
the MPU-6052C, the master transmits a start signal followed by the slave address and read bit. As a result,
the MPU-6052C sends an ACK signal and the data. The communication ends with a not acknowledge
(NACK) signal and a stop bit from master. The NACK condition is defined such that the SDA line remains
th
high at the 9 clock cycle. The following figures show single and two-byte read sequences.
Single-Byte Read Sequence

Master
AD+W
Slave
RA
ACK
AD+R
NACK
ACK
ACK
DATA
Burst Read Sequence

Master
AD+W
Slave
6.4
RA
ACK
AD+R
ACK
ACK
ACK
DATA
NACK
DATA
I C Terms
Signal
S
AD
W
R
ACK
NACK
RA
DATA
P
Description
Start Condition: SDA goes from high to low while SCL is high
2
Slave I C address
Write bit (0)
Read bit (1)
Acknowledge: SDA line is low while the SCL line is high at the
th
9 clock cycle
th
Not-Acknowledge: SDA line stays high at the 9 clock cycle
MPU-6052C internal register address
Transmit or received data
Stop condition: SDA going from low to high while SCL is high
2
Table 15: I C Terms
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Revision: 1.0
6.5
SPI Interface
SPI is a 4-wire synchronous serial interface that uses two control lines and two data lines. The MPU-6052C
always operates as a Slave device during standard Master-Slave SPI operation.
With respect to the Master, the Serial Clock output (SCLK), the Serial Data Output (SDO) and the Serial
Data Input (SDI) are shared among the Slave devices. Each SPI slave device requires its own Chip Select
(CS) line from the master.
CS goes low (active) at the start of transmission and goes back high (inactive) at the end. Only one CS line
is active at a time, ensuring that only one slave is selected at any given time. The CS lines of the nonselected slave devices are held high, causing their SDO lines to remain in a high-impedance (high-z) state
so that they do not interfere with any active devices.
SPI Operational Features
1.
2.
3.
4.
5.
Data is delivered MSB first and LSB last

Data is latched on the rising edge of SCLK
Data should be transitioned on the falling edge of SCLK
The maximum frequency of SCLK is 1MHz
SPI read and write operations are completed in 16 or more clock cycles (two or more bytes). The
first byte contains the SPI Address, and the following byte(s) contain(s) the SPI data. The first
bit of the first byte contains the Read/Write bit and indicates the Read (1) or Write (0) operation.
The following 7 bits contain the Register Address. In cases of multiple-byte Read/Writes, data is
two or more bytes:
SPI Address format
MSB
R/W A6 A5 A4
SPI Data format
MSB
D7
D6 D5
D4
A3
D3
A2
D2
A1
LSB
A0
D1
LSB
D0
6. Supports Single or Burst Read/Writes.

Figure 11: Typical SPI Master/Slave Configuration
SCLK
SDI
SDO
SPI Master
/CS1
SPI Slave 1
/CS
/CS2
SCLK
SDI
SDO
/CS
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SPI Slave 2

Revision: 1.0
7
7.1
Serial Interface Considerations

MPU-6052C Supported Interfaces
2
The MPU-6052C supports I C communications on both its primary (microprocessor) serial interface and its
auxiliary interface..
The MPU-6052Cs I/O logic levels are set to be VDDIO.
The figure below depicts a sample circuit of MPU-6052C with a third party magnetometer attached to the
2
auxiliary I C bus. It shows the relevant logic levels and voltage connections.
Note: Actual configuration will depend on the auxiliary sensors used.
VDDIO
(0V - VDDIO)
SYSTEM BUS
System
Processor IO
VDD
VDDIO
VDD
INT
SDA
(0V - VDDIO)
VDDIO
SCL
(0V - VDDIO)
VDDIO
(0V - VDDIO)
(0V - VDDIO)
FSYNC
MPU-6052C
VDD_IO
VDDIO
AUX_DA
(0V, VDDIO)
AD0
AUX_CL
(0V - VDDIO)
(0V - VDDIO)
VDD_IO
3rd Party
Magnetometer
CS
SDA
INT 1
SCL
INT 2
SA0
(0V, VDDIO)
(0V - VDDIO)
(0V - VDDIO)
(0V, VDDIO)
Figure 12: I/O Levels and Connections
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Revision: 1.0
Assembly
This section provides general guidelines for assembling InvenSense Micro Electro-Mechanical Systems
(MEMS) gyros packaged in Quad Flat No leads package (QFN) surface mount integrated circuits.
8.1
Orientation of Axes
The diagram below shows the orientation of the axes of sensitivity and the polarity of rotation. Note the pin 1
identifier () in the figure.
+Z
+Y
+Z
MP
U60
+Y
52
+X
+X
Figure 13: Orientation of Axes of Sensitivity and Polarity of Rotation
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8.2
Package Dimensions
24 Lead QFN (4x4x0.9) mm NiPdAu Lead-frame finish
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Revision: 1.0

Revision: 1.0
Part Number Package Marking
The part number package marking for MPU-6052C devices is summarized below:
Part Number
Part Number Package Marking
MPU-6052C
MPU6052C
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Revision: 1.0
10 Reliability
10.1 Qualification Test Policy
InvenSenses products complete a Qualification Test Plan before being released to production. The
Qualification Test Plan for the MPU-6052C followed the JEDEC JESD 47I Standard, Stress-Test-Driven
Qualification of Integrated Circuits, with the individual tests described below.
10.2 Qualification Test Plan
Accelerated Life Tests
TEST
Method/Condition
Lot
Sample
Quantity
/ Lot
Acc /
Reject
Criteria
(HTOL/LFR)
High Temperature Operating Life
JEDEC JESD22-A108D
Dynamic, 3.63V biased, Tj>125C
[read-points: 168, 500, 1000 hours]
77
(0/1)
(HAST)
(1)
Highly Accelerated Stress Test
JEDEC JESD22-A118A
Condition A, 130C, 85%RH, 33.3 psia., unbiased
[read-point: 96 hours]
77
(0/1)
(HTS)
High Temperature Storage Life
JEDEC JESD22-A103D
Condition A, 125C Non-Bias Bake
[read-points: 168, 500, 1000 hours]
77
(0/1)
Device Component Level Tests

TEST
Method/Condition
Lot
Sample
Quantity
/ Lot
(ESD-HBM)
ESD-Human Body Model
JEDEC JS-001-2012
(2KV)
(0/1)
(ESD-MM)
ESD-Machine Model
JEDEC JESD22-A115C
(250V)
(0/1)
(ESD-CDM)
ESD-Charged Device Model
JEDEC JESD22-C101E
(500V)
(0/1)
(LU)
Latch Up
JEDEC JESD-78D
Class II (2), 125C; 100mA
1.5X Vdd Over-voltage
(0/1)
(MS)
Mechanical Shock
JEDEC JESD22-B104C, Mil-Std-883,

2002.5 Cond. E, 10,000gs, 0.2ms,
X, Y, Z 6 directions, 5 times/direction
(0/1)
(VIB)
Vibration
JEDEC JESD22-B103B
Variable Frequency (random), Cond. B, 5-500Hz,
X, Y, Z 4 times/direction
(0/1)
(TC)
(1)
Temperature Cycling
JEDEC JESD22-A104D
Condition G [-40C to +125C], Soak Mode 2 [5]
[read-Point: 1000 cycles]
77
(0/1)
Method
(1) Tests are preceded by MSL3 Preconditioning in accordance with JEDEC JESD22-A113F
38 of 40
Acc /
Reject
Criteria

Revision: 1.0
11 Reference
Please refer to InvenSense MEMS Handling Application Note (AN-IVS-0002A-00) for the following
information:
Manufacturing Recommendations
o Assembly Guidelines and Recommendations
o PCB Design Guidelines and Recommendations
o MEMS Handling Instructions
o ESD Considerations
o Reflow Specification
o Storage Specifications
o Package Marking Specification
o Tape & Reel Specification
o Reel & Pizza Box Label
o Packaging
o Representative Shipping Carton Label
Compliance
o Environmental Compliance
o DRC Compliance
o Compliance Declaration Disclaimer
39 of 40

Revision: 1.0
This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense
for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to
change without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to
improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding
the information and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising
from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited
to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by
implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information
previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors
should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for
any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime
prevention equipment.
2014 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion,
MotionApps, DMP, AAR, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be
trademarks of the respective companies with which they are associated.
2014 InvenSense, Inc. All rights reserved.
40 of 40

PS-MPU-6052C-00 v1.0

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InvenSense Inc.

1745 Technology Drive, San Jose, CA 95110 U.S.A

Document Number: PS-MPU-6052C-00

MPU-6052C Product Specification

Document Number: PS-MPU-6052C-00

DOCUMENT INFORMATION ......................................................................................................................6

REVISION HISTORY ..............................................................................................................................6

PURPOSE AND SCOPE ..........................................................................................................................7

PRODUCT OVERVIEW ...........................................................................................................................7

GYROSCOPE FEATURES .......................................................................................................................8

ACCELEROMETER FEATURES ...............................................................................................................8

ADDITIONAL FEATURES ........................................................................................................................8

ELECTRICAL CHARACTERISTICS ...........................................................................................................9

GYROSCOPE SPECIFICATIONS ..............................................................................................................9

ELECTRICAL SPECIFICATIONS .............................................................................................................11

I2C TIMING CHARACTERIZATION .........................................................................................................15

SPI TIMING CHARACTERIZATION.........................................................................................................16

ABSOLUTE MAXIMUM RATINGS ...........................................................................................................18

APPLICATIONS INFORMATION ..............................................................................................................19

PIN OUT DIAGRAM AND SIGNAL DESCRIPTION .....................................................................................19

TYPICAL OPERATING CIRCUIT.............................................................................................................20

BILL OF MATERIALS FOR EXTERNAL COMPONENTS ..............................................................................20

BLOCK DIAGRAM ...............................................................................................................................21

THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING................................22

DIGITAL MOTION PROCESSOR ............................................................................................................22

PRIMARY I2C AND SPI SERIAL COMMUNICATIONS INTERFACES............................................................22

AUXILIARY I2C SERIAL INTERFACE......................................................................................................24

SENSOR DATA REGISTERS .................................................................................................................26

MPU-6052C Product Specification

Document Number: PS-MPU-6052C-00

DIGITAL-OUTPUT TEMPERATURE SENSOR ..........................................................................................26

BIAS AND LDOS ................................................................................................................................26

CHARGE PUMP ..................................................................................................................................26

STANDARD POWER MODES ................................................................................................................26

DIGITAL INTERFACE ...............................................................................................................................29

I2C AND SPI SERIAL INTERFACES ......................................................................................................29

I2C COMMUNICATIONS PROTOCOL .....................................................................................................29

SPI INTERFACE .................................................................................................................................33

SERIAL INTERFACE CONSIDERATIONS ...............................................................................................34

MPU-6052C SUPPORTED INTERFACES ..............................................................................................34

ORIENTATION OF AXES ......................................................................................................................35

PACKAGE DIMENSIONS ......................................................................................................................36

PART NUMBER PACKAGE MARKING ...................................................................................................37

QUALIFICATION TEST POLICY .............................................................................................................38

QUALIFICATION TEST PLAN ................................................................................................................38

MPU-6052C Product Specification

Document Number: PS-MPU-6052C-00

MPU-6052C Product Specification

Document Number: PS-MPU-6052C-00

MPU-6052C Product Specification

Document Number: PS-MPU-6052C-00

Document Number: PS-MPU-6052C-00

MPU-6052C Product Specification

1.2 Purpose and Scope

1.3 Product Overview

MPU-6052C Product Specification

Document Number: PS-MPU-6052C-00

2.1 Gyroscope Features

2.2 Accelerometer Features

2.3 Additional Features

Document Number: PS-MPU-6052C-00

MPU-6052C Product Specification

3.1 Gyroscope Specifications