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BGX50A
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Type
BGX50A
Package
SOT143
Configuration
bridge
Marking
U1s
Symbol
VR
50
VRM
70
Forward current
IF
140
IFSM
Ptot
210
mW
Junction temperature
Tj
150
Storage temperature
Tstg
Thermal Resistance
Parameter
Symbol
RthJS
Value
Unit
V
mA
TS 74C
-65 ... 150
Value
Unit
360
K/W
BGX50A
1Pb-containing
2For
2007-03-27
BGX50A...
Electrical Characteristics at TA = 25C, unless otherwise specified
Parameter
Symbol
Values
min.
typ. max.
DC Characteristics
Breakdown voltage
V(BR)
Reverse current
IR
Unit
VR = 50 V
0.2
VR = 50 V, TA = 150 C
100
VF
1.3
CT
1.5
pF
trr
ns
Forward voltage
IF = 100 mA
AC Characteristics
Diode capacitance
VR = 0 V, f = 1 MHz
Reverse recovery time
IF = 10 mA, IR = 10 mA, measured at IR = 1mA ,
RL = 100
Test circuit for reverse recovery time
D.U.T.
EHN00019
2007-03-27
BGX50A...
Reverse current IR = (TA)
VR = Parameter
10 5
nA
BGX 50A
EHB00146
BGX 50A
1.0
V
F = 100 mA
VF
V R = 70 V
10 4
EHB00149
max.
10 mA
25V
70V
10 3
1 mA
0.5
0.1 mA
typ.
10 2
5
10 1
50
100
150
50
100
TA
TA
TA = 25C
TA = 25C
150
BGX 50A
EHB00147
10 2
FM
mA
BGX 50A
EHB00148
A
D=
tp
T
10 1
100
tp
T
D=
0.005
0.01
0.02
0.05
0.1
0.2
5
typ
150
max
10 0
50
0.5
1.0
10 -1 -6
10
1.5
VF
10 -5
10 -4
10 -3
10 -2
10 0
2007-03-27
BGX50A...
Forward current IF = (T S)
BGX50A
160
mA
IF
120
100
80
60
40
20
0
0
15
30
45
60
75
90 105 120 C
150
TS
2007-03-27
Package SOT143
BGX50A...
0.1 MAX.
10 MAX.
1 0.1
0.2
0.8 +0.1
-0.05
0.4 +0.1
-0.05
0...8
0.2 M A
0.25 M B
1.7
0.08...0.1
1.3 0.1
2.4 0.15
10 MAX.
2.9 0.1
1.9
0.15 MIN.
Package Outline
Foot Print
1.2
0.8
0.9
1.1
0.9
0.8
RF s
56
Manufacturer
Pin 1
2005, June
Date code (YM)
BFP181
Type code
Standard Packing
Reel 180 mm = 3.000 Pieces/Reel
Reel 330 mm = 10.000 Pieces/Reel
0.2
2.6
8
Pin 1
3.15
1.15
2007-03-27
BGX50A...
Edition 2006-02-01
Published by
Infineon Technologies AG
81726 Mnchen, Germany
Infineon Technologies AG 2007.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (Beschaffenheitsgarantie). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons
may be endangered.
2007-03-27