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Micrel, Inc.
MIC4423/4424/4425
Dual 3A-Peak Low-Side MOSFET Driver
Bipolar/CMOS/DMOS Process
General Description
Features
Functional Diagram
VS
0.1mA
0.6mA
IN V E R T I N G
OUTA
INA
2k
NONINVERTING
0.1mA
0.6mA
IN V E R T I N G
OUTB
INB
2k
NONINVERTING
GND
July 2005
MIC4423/4424/4425
MIC4423/4424/4425
Micrel, Inc.
Ordering Information
Part Number
Temperatre
Range
Package
Conguration
Standard
Pb-Free
MIC4423CWM
MIC4423ZWM
0C to +70C
Dual Inverting
MIC4423BWM
MIC4423YWM
40C to +85C
Dual Inverting
MIC4423BM
MIC4423YM
40C to +85C
8-pin SOIC
Dual Inverting
MIC4423CN
MIC4423ZN
0C to +70C
Dual Inverting
MIC4423BN
MIC4423YN
40C to +85C
Dual Inverting
MIC4424CWM
MIC4424ZWM
0C to +70C
Dual Non-Inverting
MIC4424BWM
MIC4424YWM
40C to +85C
Dual Non-Inverting
MIC4424BM
MIC4424YM
40C to +85C
8-pin SOIC
Dual Non-Inverting
MIC4424CN
MIC4424ZN
0C to +70C
Dual Non-Inverting
MIC4424BN
MIC4424YN
40C to +85C
Dual Non-Inverting
MIC4425CWM
MIC4425ZWM
0C to +70C
Inverting + Non-Inverting
MIC4425BWM
MIC4425YWM
40C to +85C
Inverting + Non-Inverting
MIC4425BM
MIC4425YM
40C to +85C
8-pin SOIC
Inverting + Non-Inverting
MIC4425CN
Contact Factory
0C to +70C
Inverting + Non-Inverting
MIC4425BN
MIC4425YN
40C to +85C
Inverting + Non-Inverting
Pin Conguration
Driver Conguration
MIC4423xN/M
NC 1
MIC4423xWM
8 NC
INA 2
7 OUTA
GND 3
6 VS
INB 4
5 OUTB
INA 2
WM Package Note:
Duplicate GND, VS, OUTA,
INB 4
and OUTB pins must be
externally connected together.
7 OUTA
INA 2
5 OUTB
INB 7
MIC4424xN/M
NC 1
16 N C
INA
15 OUTA
NC 3
14 OUTA
GND 4
13 V S
GND 5
12 V S
NC 6
11 O U T B
INB 7
10 O U T B
7 OUTA
INA 2
INB 4
5 OUTB
INB 7
10 OUTB
11 OUTB
14 OUTA
15 OUTA
10 OUTB
11 OUTB
MIC4423xWM
INA 2
7 OUTA
INA 2
INB 4
5 OUTB
INB 7
9 NC
NC 8
15 OUTA
MIC4423xWM
INA 2
MIC4425xN/M
14 OUTA
14 OUTA
15 OUTA
10 OUTB
11 OUTB
Pin Description
Pin Number
DIP, SOIC
Pin Number
Wide SOIC
Pin Name
Pin Function
2/4
2/7
INA/B
Control Input
4, 5
GND
12, 13
VS
7/5
14, 15 / 10, 11
OUTA/B
1, 8
1, 3, 6, 8, 9, 16
NC
MIC4423/4424/4425
July 2005
MIC4423/4424/4425
Micrel, Inc.
Parameter
Conditions
Min
Typ
Max
Units
Input
VIH
VIL
IIN
Input Current
2.4
0V VIN VS
1
10
0.8
1
10
A
A
Output
VOH
VOL
RO
IPK
Latch-Up Protection
Withstand Reverse Current
VS0.025
V
0.025
2.8
3.7
3.5
4.3
>500
mA
Rise Time
23
28
35
60
ns
ns
tF
Fall Time
25
32
35
60
ns
ns
tD1
Delay Tlme
33
32
75
100
ns
ns
tD2
Delay Time
38
38
75
100
ns
ns
tPW
Pulse Width
test Figure 1
IS
1.5
2
2.5
3.5
mA
mA
IS
0.15
0.2
0.25
0.3
mA
mA
400
ns
Power Supply
Note 1.
Note 2.
Note 3.
Note 4.
Note 5.
July 2005
MIC4423/4424/4425
MIC4423/4424/4425
Micrel, Inc.
Test Circuit
VS = 18V
VS = 18V
0.1F
INA
MIC4423
B
INB
INPUT
5V
90%
0.1F
OUTA
1800pF
INA
OUTB
1800pF
INB
tD1
tP W
tF
tD2
INPUT
tR
4.7F
OUTA
1800pF
OUTB
1800pF
5V
90%
2.5V
tP W 0.5s
10%
0V
VS
90%
tD1
tP W
tR
tD2
tF
O U TPU T
O U TPU T
10%
0V
10%
0V
MIC4423/4424/4425
MIC4424
2.5V
tP W 0.5s
10%
0V
VS
90%
4.7F
July 2005
MIC4423/4424/4425
Micrel, Inc.
100
3300pF
60
80
1800pF
2200pF
40
20
10 12 14
VSUPPLY (V)
1000
CLOAD (pF)
500kHz
20kHz
100kHz
Supply Current
vs. Frequency
10000
ISUPPLY (mA)
100
VSUPPLY = 12V
90
80
10000pF
70
60
50
1000pF
40
100pF
3300pF
30
20
10
0
10
100
1000
FREQUENCY (kHz)
July 2005
1000
CLOAD (pF)
10000
50
VS = 18V
CLOAD = 1800pF
40
TF
TD2
30
TD1
20
10
Supply Current
vs. Frequency
VSUPPLY = 18V
1000
CLOAD (pF)
0
100
18
0
-75
-30
15
60
105 150
JUNCTION TEMPERATURE (C)
10000
40
30
20
10
0
100
16
10
18V
50
10 12 14
VSUPPLY (V)
100
VSUPPLY = 18V
90
80
10000pF
70
60
50
1000pF
3300pF
40
100pF
30
20
10
0
10
100
1000
FREQUENCY (kHz)
ISUPPLY (mA)
90
80
70
60
20
40
0
100
TIME (ns)
30
12V
20
40
5V
60
100
18
100
V
= 5V
90 SUPPLY
80
70
60
2MHz
50
40
30
100kHz
500kHz
20
10
0
100
1000
10000
CLOAD (pF)
ISUPPLY (mA)
TFALL (ns)
80
ISUPPLY (mA)
16
T (ns)
100
18V
470pF
100
ISUPPLY (mA)
12V
40
90
80
70
60
4
6
8
INPUT (V)
10
12
2MHz
500kHz
50
40
30
20
10
0
100
20kHz
100kHz
1000
CLOAD (pF)
10000
Supply Current
vs. Frequency
100
VSUPPLY = 5V
90
80
70
60
ISUPPLY (mA)
5V
60
20
470pF
0
1000pF
2200pF
40
20
80
1800pF
3300pF
60
1000pF
Rise Time
vs. Capacitive Load
100
4700pF
TFALL (ns)
TRISE (ns)
100
4700pF
80
TRISE (ns)
50
40
30
20
10
0
10
10000pF
4700pF
2200pF
1000pF
100pF
100
FREQUENCY (kHz)
1000
MIC4423/4424/4425
MIC4423/4424/4425
Micrel, Inc.
60
60
CLOAD = 2200 pF
50
30
TD1
20
BOTH INPUTS = 1
BOTH INPUTS = 0
0.1
10
4
10 12 14
VSUPPLY (V)
16
0
-55
18
Quiescent Current
vs. Temperature
VS = 10V
1.0
INPUTS = 1
0.8
0.6
0.4
INPUTS = 0
0.2
0
-55
-25 5
35 65 95
TEMPERATURE (C)
MIC4423/4424/4425
125
-25 5
35 65 95
TEMPERATURE (C)
125
0.01
125C
25C
2
1
0
10 12 14
VSUPPLY (V)
16
18
RDS(ON) ()
IQUIESCENT (mA)
1.2
TD1
20
10
1.4
TD2
T (ns)
TD2
RDS(ON) ()
T (ns)
40
30
10
CLOAD = 2200 pF
50
40
Delay Time
vs. Temperature
IQUIESCENT (mA)
125C
25C
3
2
1
10 12 14
VSUPPLY (V)
16
18
10 12 14
VSUPPLY (V)
16
18
July 2005
MIC4423/4424/4425
Micrel, Inc.
Application Information
Supply Bypassing
Charging and discharging large capacitive loads quickly
requires large currents. For example, charging 2000pF from
0 to 15 volts in 20ns requires a constant current of 1.5A. In
practice, the charging current is not constant, and will usually
peak at around 3A. In order to charge the capacitor, the driver
must be capable of drawing this much current, this quickly,
from the system power supply. In turn, this means that as far
as the driver is concerned, the system power supply, as seen
by the driver, must have a VERY low impedance.
As a practical matter, this means that the power supply bus
must be capacitively bypassed at the driver with at least
100X the load capacitance in order to achieve optimum
driving speed. It also implies that the bypassing capacitor
must have very low internal inductance and resistance at
all frequencies of interest. Generally, this means using two
capacitors, one a high-performance low ESR lm, the other
a low internal resistance ceramic, as together the valleys in
their two impedance curves allow adequate performance over
a broad enough band to get the job done. PLEASE NOTE
that many lm capacitors can be sufciently inductive as to
be useless for this service. Likewise, many multilayer ceramic
capacitors have unacceptably high internal resistance. Use
capacitors intended for high pulse current service (in-house
we use WIMA lm capacitors and AVX Ramguard ceramics; several other manufacturers of equivalent devices also
exist). The high pulse current demands of capacitive drivers
also mean that the bypass capacitors must be mounted
very close to the driver in order to prevent the effects of lead
inductance or PCB land inductance from nullifying what you
are trying to accomplish. For optimum results the sum of the
lengths of the leads and the lands from the capacitor body to
the driver body should total 2.5cm or less.
Grounding
Both proper bypassing and proper grounding are necessary
for optimum driver operation. Bypassing capacitance only
allows a driver to turn the load ON. Eventually (except in rare
circumstances) it is also necessary to turn the load OFF. This
July 2005
MIC4423/4424/4425
MIC4423/4424/4425
Micrel, Inc.
ible with TTL signals, or with CMOS powered from any supply
voltage between 3V and 15V.
The input protection circuitry of the MIC4423/24/25, in addition to providing 2kV or more of ESD protection, also works to
prevent latchup or logic upset due to ringing or voltage spiking
on the logic input terminal. In most CMOS devices when the
logic input rises above the power supply terminal, or descends
below the ground terminal, the device can be destroyed or
rendered inoperable until the power supply is cycled OFF
and ON. The MIC4423/24/25 drivers have been designed to
prevent this. Input voltages excursions as great as 5V below
ground will not alter the operation of the device. Input excursions above the power supply voltage will result in the excess
voltage being conducted to the power supply terminal of the
IC. Because the excess voltage is simply conducted to the
power terminal, if the input to the driver is left in a high state
when the power supply to the driver is turned off, currents as
high as 30mA can be conducted through the driver from the
input terminal to its power supply terminal. This may overload
the output of whatever is driving the driver, and may cause
other devices that share the drivers power supply, as well as
the driver, to operate when they are assumed to be off, but
it will not harm the driver itself. Excessive input voltage will
also slow the driver down, and result in much longer internal
propagation delays within the drivers. TD2, for example, may
increase to several hundred nanoseconds. In general, while
the driver will accept this sort of misuse without damage,
proper termination of the line feeding the driver so that line
spiking and ringing are minimized, will always result in faster
and more reliable operation of the device, leave less EMI to
be ltered elsewhere, be less stressful to other components
in the circuit, and leave less chance of unintended modes of
operation.
Power Dissipation
CMOS circuits usually permit the user to ignore power dissipation. Logic families such as 4000 series and 74Cxxx have
outputs which can only source or sink a few milliamps of current, and even shorting the output of the device to ground or
VCC may not damage the device. CMOS drivers, on the other
hand, are intended to source or sink several Amps of current.
This is necessary in order to drive large capacitive loads at
frequencies into the megahertz range. Package power dissipation of driver ICs can easily be exceeded when driving
large loads at high frequencies. Care must therefore be paid
to device dissipation when operating in this domain.
Input Stage
The input stage of the MIC4423/24/25 consists of a singleMOSFET class A stage with an input capacitance of 38pF.
This capacitance represents the maximum load from the
driver that will be seen by its controlling logic. The drain load
on the input MOSFET is a 2mA current source. Thus, the
quiescent current drawn by the driver varies, depending on
the logic state of the input.
Following the input stage is a buffer stage which provides
~400mV of hysteresis for the input, to prevent oscillations
when slowly-changing input signals are used or when noise
is present on the input. Input voltage switching threshold is
approximately 1.5V which makes the driver directly compatMIC4423/4424/4425
July 2005
MIC4423/4424/4425
Micrel, Inc.
However, in this instance the RO required may be either the on
resistance of the driver when its output is in the high state, or
its on resistance when the driver is in the low state, depending
on how the inductor is connected, and this is still only half the
story. For the part of the cycle when the inductor is forcing
current through the driver, dissipation is best described as
PL2 = I VD (1 D)
where VD is the forward drop of the clamp diode in the driver
(generally around 0.7V). The two parts of the load dissipation
must be summed in to produce PL
Accurate power dissipation numbers can be obtained by summing the three sources of power dissipation in the device:
PL = PL1 + PL2
PQ = VS [D IH + (1 D) IL]
PL = I2 RO D
where:
where:
IH =
IL =
D=
VS =
PT = f VS (As)
E = 1/2 C V2
As this energy is lost in the driver each time the load is charged
or discharged, for power dissipation calculations the 1/2 is
removed. This equation also shows that it is good practice
not to place more voltage in the capacitor than is necessary,
as dissipation increases as the square of the voltage applied
to the capacitor. For a driver with a capacitive load:
PL = f C (VS)2
where:
f = Operating Frequency
C = Load Capacitance
VS = Driver Supply Voltage
PL = f x C x (VS)2
PL = 250,000 x (3 x 109 + 3 x 109) x 122
= 0.2160W
PL1 = I2 RO D
July 2005
MIC4423/4424/4425
MIC4423/4424/4425
Micrel, Inc.
then:
PQ = VS x [D x IH + (1 D) x IL]
= 12 x [(0.5 x 0.0035) + (0.5 x 0.0003)]
= 0.0228W
Denitions
CL = Load Capacitance in Farads.
D = Duty Cycle expressed as the fraction of time the input
to the driver is high.
PL = I2 x RO x D
First, IO must be determined.
IO = VS / (RO + RLOAD)
IO = 15 / (3.3 + 50)
IO = 0.281A
and:
(this assumes that the unused side of the driver has its input
grounded, which is more efcient)
= 0.015W
MIC4423/4424/4425
10
July 2005
MIC4423/4424/4425
Micrel, Inc.
Crossover
Energy Loss
As (Ampere-seconds)
10-8
10-9
10-10
0
8 10 12 14 16 18
VIN
NOTE: THE VALUES ON THIS GRAPH REPRESENT THE LOSS SEEN BY BOTH
DRIVERS IN A PACKAGE DURING ONE COMPLETE CYCLE. FOR A SINGLE
DRIVER DIVIDE THE STATED VALUES BY 2. FOR A SINGLE TRANSITION OF A
SINGLE DRIVER, DIVIDE THE STATED VALUE BY 4.
Figure 2.
MAXIMUM PACKAGE
POWER DISSIPATION (mW)
1250
1000
SOIC
750
PDIP
500
250
0
25
50
75
100
125
150
July 2005
11
MIC4423/4424/4425
MIC4423/4424/4425
Micrel, Inc.
Package Information
PIN 1
DIMENSIONS:
INCH (MM)
0.380 (9.65)
0.370 (9.40)
0.255 (6.48)
0.245 (6.22)
0.135 (3.43)
0.125 (3.18)
0.300 (7.62)
0.013 (0.330)
0.010 (0.254)
0.018 (0.57)
0.100 (2.54)
0.130 (3.30)
0.0375 (0.952)
0.380 (9.65)
0.320 (8.13)
MIC4423/4424/4425
12
July 2005
MIC4423/4424/4425
Micrel, Inc.
PIN 1
DIMENSIONS:
INCHES (MM)
0.301 (7.645)
0.297 (7.544)
0.027 (0.686)
0.031 (0.787)
0.297 (7.544)
0.293 (7.442)
0.103 (2.616)
0.050 (1.270) 0.016 (0.046) 0.099 (2.515)
TYP
TYP
0.094 (2.388)
0.090 (2.286)
0.409 (10.389)
0.405 (10.287)
7
TYP
0.015
R
(0.381)
0.015
(0.381)
SEATING MIN
PLANE
0.330 (8.382)
0.326 (8.280)
0.032 (0.813) TYP
0.408 (10.363)
0.404 (10.262)
0.022 (0.559)
0.018 (0.457)
5
TYP
10 TYP
MICREL INC.
TEL
+ 1 (408) 944-0800
FAX
+ 1 (408) 474-1000
WEB
USA
http://www.micrel.com
This information furnished by Micrel in this data sheet is believed to be accurate and reliable. However no responsibility is assumed by Micrel for its use.
Micrel reserves the right to change circuitry and specications at any time without notication to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a signicant injury to the user. A Purchasers
use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchasers own risk and Purchaser agrees to fully indemnify
Micrel for any damages resulting from such use or sale.
1999 Micrel, Inc.
July 2005
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MIC4423/4424/4425